WO2016106797A1 - 一种柔性有机发光显示器及其制作方法 - Google Patents
一种柔性有机发光显示器及其制作方法 Download PDFInfo
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- WO2016106797A1 WO2016106797A1 PCT/CN2015/070267 CN2015070267W WO2016106797A1 WO 2016106797 A1 WO2016106797 A1 WO 2016106797A1 CN 2015070267 W CN2015070267 W CN 2015070267W WO 2016106797 A1 WO2016106797 A1 WO 2016106797A1
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- layer
- organic light
- light emitting
- emitting display
- buffer layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000005452 bending Methods 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000010409 thin film Substances 0.000 claims abstract description 30
- 239000011810 insulating material Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 31
- 238000005538 encapsulation Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000010408 film Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000012774 insulation material Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 172
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention constructs a manufacturing method of a flexible organic light emitting display, which includes:
- the invention constructs a manufacturing method of a flexible organic light emitting display, which comprises:
- the switch array layer Forming a switch array layer on the first buffer layer, the switch array layer comprising at least two switching elements
- the first bending deformation force is generated when the flexible organic light emitting display is bent along the flexible substrate substrate side, and the first buffer layer is configured to absorb the first bending deformation force, the first buffer layer
- the material is an organic insulating material.
- a pixel delimiting layer is further disposed between two adjacent pixel units, and the material of the pixel delimiting layer is an organic insulating material.
- the invention also provides a flexible organic light emitting display, comprising:
- the display unit layer disposed on the switch array layer, the display unit layer including at least two pixel units, the pixel unit including a first electrode layer, a second electrode layer, the first electrode layer, and the An organic light-emitting layer between the second electrode layers;
- the switching element is connected to the first electrode layer, and the switching element corresponds to a position of the pixel unit;
- the organic insulating material is composed of a sensitizer and a resin.
- FIG. 2 is a schematic structural view of a flexible organic light emitting display according to a second embodiment of the present invention.
- the flexible substrate substrate 11 is formed by coating a flexible substrate material on a flat rigid substrate (such as a glass substrate), and the flexible substrate material may be polyimide; the coating method may be a slit The flexible substrate material is dried to a thickness of 10-100 um; then an electronic component is fabricated on the flexible substrate.
- a flat rigid substrate such as a glass substrate
- the flexible substrate material may be polyimide
- the coating method may be a slit
- the flexible substrate material is dried to a thickness of 10-100 um; then an electronic component is fabricated on the flexible substrate.
- the display unit layer 14 includes at least two pixel units 171 including a first electrode layer 16 and a second electrode layer 18 between the first electrode layer 16 and the second electrode layer 18
- the polarity of the first electrode layer is an anode
- the polarity of the second electrode layer is a cathode.
- the manufacturing method of the above flexible organic light emitting display comprises the following steps:
- the first buffer layer for absorbing the first bending deformation force;
- the material of the buffer layer is an organic insulating material.
- the flexible organic light emitting display of the present invention and the manufacturing method thereof by adding an organic insulating buffer layer between the flexible substrate of the existing flexible organic light emitting display and the switch array layer, because the flexible organic light emitting display is in the bending process,
- the organic insulating buffer layer can well buffer and weaken the bending deformation force, which greatly reduces the damage of the bending deformation force, thereby avoiding damage to the metal electrode when the bending deformation force is large during the downward bending process.
- FIG. 2 is a schematic structural diagram of a flexible organic light emitting display according to a second embodiment of the present invention.
- a second buffer layer 20 is further disposed between the display unit layer 14 and the thin film encapsulation layer 15;
- the flexible organic light emitting display when bent along the side of the thin film encapsulation layer 20 (curved upward), a second bending deformation force is generated, and the second buffer layer is configured to absorb the second bending deformation force;
- the material of the two buffer layers is an organic insulating material.
- the organic insulating material is composed of a sensitizer and a resin, so that the formed organic insulating material has better heat resistance and is not easily damaged during the process.
- the first buffer layer or the second buffer layer has a thickness of 2-10 nm, and the thickness is too thin to function to absorb the bending deformation force well, and the thickness is too thick, which affects the display effect.
- the first electrode is, for example, a pixel electrode, and the material thereof is an indium tin oxide film having a thickness of, for example, 50-100 nm; and the material of the second electrode is a metal material, preferably silver.
- the thin film encapsulation layer is not directly formed, specifically:
- the second buffer layer is for absorbing the second bending deformation force; and the material of the second buffer layer It is an organic insulating material.
- a pixel delimiting layer is further disposed between two adjacent pixel units, and the material of the pixel delimiting layer is preferably an organic insulating material, wherein the organic insulating material is formed by a ratio of a sensitizer and a resin.
- the first buffer layer or the second buffer layer has a thickness of 2-10 nm. If the thickness is too thin, it does not absorb the bending deformation force well, and the thickness is too thick, which affects the display effect.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (16)
- 一种柔性有机发光显示器的制作方法,其包括:在柔性衬底基板上形成第一缓冲层;在所述第一缓冲层上形成开关阵列层,所述开关阵列层包括至少两个开关元件;在所述开关阵列层上形成显示单元层,所述显示单元层包括至少两个像素单元,所述像素单元包括第一电极层、第二电极层、位于所述第一电极层和所述第二电极层之间的有机发光层;所述开关元件连接所述第一电极层,所述开关元件和所述像素单元的位置相对应,在相邻两个所述像素单元之间还设置有像素定界层,所述像素定界层的材料为有机绝缘材料;以及在所述显示单元层上形成第二缓冲层;以及在所述第二缓冲层上形成所述薄膜封装层;其中在所述柔性有机发光显示器沿所述柔性衬底基板侧弯曲时,产生第一弯曲变形力,所述第一缓冲层用于吸收所述第一弯曲变形力,所述第一缓冲层的材料为有机绝缘材料;所述柔性有机发光显示器沿所述薄膜封装层向内弯曲时,产生第二弯曲变形力,所述第二缓冲层用于吸收所述第二弯曲变形力,所述第二缓冲层的材料为有机绝缘材料。
- 根据权利要求1所述的柔性有机发光显示器的制作方法,其中所述有机绝缘材料由感光剂和树脂组成。
- 根据权利要求1所述的柔性有机发光显示器的制作方法,其中所述第一缓冲层的厚度为2-10纳米。
- 根据权利要求1所述的柔性有机发光显示器的制作方法,其中所述第二缓冲层的厚度为2-10纳米。
- 一种柔性有机发光显示器的制作方法,其包括:在柔性衬底基板上形成第一缓冲层;在所述第一缓冲层上形成开关阵列层,所述开关阵列层包括至少两个开关元件;在所述开关阵列层上形成显示单元层,所述显示单元层包括至少两个像素单元,所述像素单元包括第一电极层、第二电极层、位于所述第一电极层和所述第二电极层之间的有机发光层;所述开关元件连接所述第一电极层,所述开关元件和所述像素单元的位置相对应;以及在所述显示单元层上形成薄膜封装层;其中在所述柔性有机发光显示器沿所述柔性衬底基板侧弯曲时,产生第一弯曲变形力,所述第一缓冲层用于吸收所述第一弯曲变形力,所述第一缓冲层的材料为有机绝缘材料。
- 根据权利要求5所述的柔性有机发光显示器的制作方法,其中所述在所述开关阵列层上形成显示单元层的步骤之后,所述方法还包括:在所述显示单元层上形成第二缓冲层;以及在所述第二缓冲层上形成所述薄膜封装层;其中在所述柔性有机发光显示器沿所述薄膜封装层向内弯曲时,产生第二弯曲变形力,所述第二缓冲层用于吸收所述第二弯曲变形力,所述第二缓冲层的材料为有机绝缘材料。
- 根据权利要求5所述的柔性有机发光显示器的制作方法,其中在相邻两个所述像素单元之间还设置有像素定界层,所述像素定界层的材料为有机绝缘材料。
- 根据权利要求5所述的柔性有机发光显示器的制作方法,其中所述有机绝缘材料由感光剂和树脂组成。
- 根据权利要求5所述的柔性有机发光显示器的制作方法,其中所述第一缓冲层的厚度为2-10纳米。
- 根据权利要求5所述的柔性有机发光显示器的制作方法,其中所述第二缓冲层的厚度为2-10纳米。
- 一种柔性有机发光显示器,其包括:柔性衬底基板;设置在所述柔性衬底基板上的第一缓冲层;设置在所述第一缓冲层上的开关阵列层,所述开关阵列层包括至少两个开关元件;设置在所述开关阵列层上的显示单元层,所述显示单元层包括至少两个像素单元,所述像素单元包括第一电极层、第二电极层、位于所述第一电极层和所述第二电极层之间的有机发光层;所述开关元件连接所述第一电极层,所述开关元件和所述像素单元的位置相对应;以及设置在所述显示单元层上的薄膜封装层;其中在所述柔性有机发光显示器沿所述柔性衬底基板侧弯曲时,产生第一弯曲变形力,所述第一缓冲层用于吸收所述第一弯曲变形力,所述第一缓冲层的材料为有机绝缘材料。
- 根据权利要求11所述的柔性有机发光显示器,其中在所述显示单元层和所述薄膜封装层之间还设置有第二缓冲层;其中在所述柔性有机发光显示器沿所述薄膜封装层侧弯曲时,产生第二弯曲变形力,所述第二缓冲层用于吸收所述第二弯曲变形力;所述第二缓冲层的材料为有机绝缘材料。
- 根据权利要求11所述的柔性有机发光显示器,其中在相邻两个所述像素单元之间还设置有像素定界层,所述像素定界层的材料为有机绝缘材料。
- 根据权利要求11所述的柔性有机发光显示器,其中所述有机绝缘材料由感光剂和树脂组成。
- 根据权利要求11所述的柔性有机发光显示器,其中所述第一缓冲层的厚度为2-10纳米。
- 根据权利要求11所述的柔性有机发光显示器,其中所述第二缓冲层的厚度为2-10纳米。
Priority Applications (6)
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EA201791488A EA033953B1 (ru) | 2014-12-31 | 2015-01-07 | Гибкий дисплей на органических светодиодах и способ его изготовления |
US14/417,744 US9680114B2 (en) | 2014-12-31 | 2015-01-07 | Flexible organic light emitting display and method for manufacturing the same |
KR1020177018421A KR20170093196A (ko) | 2014-12-31 | 2015-01-07 | 플렉서블 유기 발광 디스플레이 및 이의 제조방법 |
GB1710745.9A GB2549030A (en) | 2014-12-31 | 2015-01-07 | Flexible organic light emitting display and manufacturing method therefor |
JP2017552198A JP2018506836A (ja) | 2014-12-31 | 2015-01-07 | フレキシブル有機発光ディスプレイ及びその製造方法 |
US15/473,153 US10096664B2 (en) | 2014-12-31 | 2017-03-29 | Flexible organic light emitting display manufacturing method |
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CN201410849194.2A CN104485351A (zh) | 2014-12-31 | 2014-12-31 | 一种柔性有机发光显示器及其制作方法 |
CN201410849194.2 | 2014-12-31 |
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US14/417,744 A-371-Of-International US9680114B2 (en) | 2014-12-31 | 2015-01-07 | Flexible organic light emitting display and method for manufacturing the same |
US15/473,153 Continuation US10096664B2 (en) | 2014-12-31 | 2017-03-29 | Flexible organic light emitting display manufacturing method |
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US (2) | US9680114B2 (zh) |
JP (1) | JP2018506836A (zh) |
KR (1) | KR20170093196A (zh) |
CN (1) | CN104485351A (zh) |
EA (1) | EA033953B1 (zh) |
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KR20170050729A (ko) * | 2015-10-30 | 2017-05-11 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
CN105975135A (zh) * | 2016-06-22 | 2016-09-28 | 联想(北京)有限公司 | 一种显示装置、电子设备及显示装置的制作方法 |
CN106023825B (zh) * | 2016-06-22 | 2021-02-19 | 联想(北京)有限公司 | 一种显示屏幕、显示屏幕的制作方法及电子设备 |
KR102604018B1 (ko) * | 2016-07-07 | 2023-11-22 | 삼성디스플레이 주식회사 | 표시 장치 |
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US20160190488A1 (en) | 2016-06-30 |
CN104485351A (zh) | 2015-04-01 |
KR20170093196A (ko) | 2017-08-14 |
US9680114B2 (en) | 2017-06-13 |
EA201791488A1 (ru) | 2017-11-30 |
EA033953B1 (ru) | 2019-12-13 |
GB2549030A (en) | 2017-10-04 |
US10096664B2 (en) | 2018-10-09 |
GB201710745D0 (en) | 2017-08-16 |
US20170207286A1 (en) | 2017-07-20 |
JP2018506836A (ja) | 2018-03-08 |
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