WO2019085065A1 - 柔性 oled 显示面板及其制备方法 - Google Patents
柔性 oled 显示面板及其制备方法 Download PDFInfo
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- WO2019085065A1 WO2019085065A1 PCT/CN2017/112395 CN2017112395W WO2019085065A1 WO 2019085065 A1 WO2019085065 A1 WO 2019085065A1 CN 2017112395 W CN2017112395 W CN 2017112395W WO 2019085065 A1 WO2019085065 A1 WO 2019085065A1
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- Prior art keywords
- layer
- inorganic barrier
- barrier layer
- titanium metal
- polyimide
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- 238000002360 preparation method Methods 0.000 title claims 4
- 230000004888 barrier function Effects 0.000 claims abstract description 93
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910052751 metal Inorganic materials 0.000 claims abstract description 72
- 239000002184 metal Substances 0.000 claims abstract description 72
- 239000010936 titanium Substances 0.000 claims abstract description 72
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 72
- 239000004642 Polyimide Substances 0.000 claims abstract description 66
- 229920001721 polyimide Polymers 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 13
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 157
- 239000010408 film Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Definitions
- the present invention relates to the field of display technologies, and in particular, to a flexible OLED display panel and a method for fabricating the same.
- Organic light emitting diode It has the characteristics of self-illumination, fast response, wide viewing angle, etc., and has broad application prospects.
- TFT thin film transistor
- PI polyimide, polyimide
- the prior art flexible OLED display panel has a large thickness of the inorganic barrier layer in the flexible substrate, which affects the flexible OLED
- the flexibility of the display panel makes it difficult for flexible OLED display panels to achieve the desired bending effect.
- the invention provides a flexible OLED display panel, which can not reduce the safety of the TFT device in the process.
- the flexibility of the OLED display panel to solve the technical problem that the existing OLED display panel has a thicker inorganic barrier layer, resulting in a lower flexibility of the OLED display panel.
- the present invention provides a flexible OLED display panel including a flexible substrate and a TFT disposed on a surface of the flexible substrate Device; among them,
- the flexible substrate comprises:
- a titanium metal layer is prepared on the surface of the first inorganic barrier layer; the titanium metal layer is patterned to form a titanium metal pattern;
- the TFT device is prepared on a surface of the second inorganic barrier layer
- the TFT The device includes at least one active layer, the titanium metal pattern is projected on the surface of the second inorganic barrier layer, in conformity with the pattern of the active layer, and the titanium metal pattern is aligned with the active layer .
- the material of the first inorganic barrier layer and the second inorganic barrier layer is TiO 2 .
- the first polyimide layer and the second polyimide layer have the same film thickness, and the first inorganic barrier layer and the second inorganic barrier layer are coated.
- the layer thickness is the same, and the film thickness of the first inorganic barrier layer and the second inorganic barrier layer is the film thickness of the first polyimide layer and the second polyimide layer of 1/3.
- the titanium metal layer, the first inorganic barrier layer, and the second inorganic barrier layer have the same film thickness.
- the present invention also provides a flexible OLED display panel comprising a flexible substrate and a TFT disposed on a surface of the flexible substrate Device; among them,
- the flexible substrate comprises:
- the TFT device is prepared on a surface of the second inorganic barrier layer.
- the material of the first inorganic barrier layer and the second inorganic barrier layer is TiO 2 .
- the first polyimide layer and the second polyimide layer have the same film thickness, and the first inorganic barrier layer and the second inorganic barrier layer are coated.
- the layer thickness is the same, and the film thickness of the first inorganic barrier layer and the second inorganic barrier layer is the film thickness of the first polyimide layer and the second polyimide layer of 1/3.
- the titanium metal layer, the first inorganic barrier layer, and the second inorganic barrier layer have the same film thickness.
- a method for fabricating a flexible OLED display panel comprising:
- Step S10 providing a glass substrate
- Step S20 preparing a first polyimide layer on the surface of the glass substrate
- Step S30 preparing a first inorganic barrier layer on the surface of the first polyimide layer
- Step S40 preparing a titanium metal layer on the surface of the first inorganic barrier layer
- Step S50 preparing a second polyimide layer on the surface of the titanium metal layer
- Step S60 preparing a second inorganic barrier layer on the surface of the second polyimide layer
- Step S70 preparing a TFT device on the surface of the second inorganic barrier layer.
- the step S40 further includes: S401
- the titanium metal layer is patterned to form a titanium metal pattern.
- the step S70 further includes: S701, the TFT The device is prepared directly above the corresponding titanium metal pattern.
- the method further comprises: in step S80, peeling the glass substrate using a laser.
- the beneficial effects of the present invention are: OLED provided by the present invention compared to the flexible OLED display panel of the prior art
- the display panel is provided with a titanium metal layer in the flexible substrate, which can effectively absorb the energy of the laser, thereby reducing the thickness of the inorganic barrier layer, further improving the bending performance of the flexible OLED display panel; and solving the flexibility of the prior art.
- the thickness of the inorganic barrier layer in the flexible substrate is large, which affects the flexibility of the flexible OLED display panel, and the flexible OLED display panel is difficult to achieve the desired bending effect.
- FIG. 1 is a structural diagram of a flexible OLED display panel film layer provided by the present invention.
- FIG. 2 is a flow chart of a method for preparing a flexible OLED display panel of the present invention.
- the present invention is directed to a flexible OLED display panel of the prior art, wherein the inorganic barrier layer in the flexible substrate has a large thickness, which affects the flexible OLED.
- the flexibility of the display panel makes it difficult for the flexible OLED display panel to achieve a desired bending effect, and this embodiment can solve the drawback.
- a flexible OLED display panel provided by the present invention includes a flexible substrate and a surface disposed on the surface of the flexible substrate a TFT device; wherein the flexible substrate comprises: a first polyimide layer 102; a first inorganic barrier layer 103, prepared on the first polyimide layer 102 a surface; a titanium metal layer prepared on the surface of the first inorganic barrier layer 103; a second polyimide layer 104 prepared on the surface of the titanium metal layer; and a second inorganic barrier layer 105 And preparing the surface of the titanium metal layer; the TFT device is prepared on the surface of the second inorganic barrier layer 105.
- Titanium metal has the characteristics of good toughness, low thermal conductivity and strong light absorption.
- the titanium metal layer prepared by titanium metal can absorb most of the laser energy used to peel off the glass substrate, thereby preventing the laser from penetrating close to the place.
- TFT The second polyimide layer 104 of the device functions to protect the electrical properties of the TFT device.
- the titanium metal layer has a certain conductivity, and the first polyimide layer 102 and the second polyimide layer can be reduced.
- the electrostatic adsorption of the conductive particles generated in the process improves the cleanliness of the first polyimide layer 102 and the second polyimide layer 104, thereby improving the yield of the product.
- the first polyimide layer 102 acts as a first substrate for the flexible substrate while serving as a first outer protective layer of the flexible substrate
- the second polyimide Imine layer 104 a second substrate serving as the flexible substrate while serving as a second outer protective layer of the flexible substrate
- the first inorganic barrier layer 103 Used as a first water blocking layer of the flexible substrate to prevent water vapor from immersing into the titanium metal layer, the first inorganic barrier layer 103
- a second water blocking layer serving as the flexible substrate is used for the secondary water blocking protective layer of the flexible substrate to protect the light emitting device disposed on the surface of the flexible substrate.
- the titanium metal layer is formed into a titanium metal pattern 106 by a photomask process, and the titanium metal pattern 106 is distributed; the TFT The device includes at least one active layer 107, and the shape of the titanium metal pattern 106 projected on the surface of the second inorganic barrier layer 105 coincides with the pattern of the active layer 107, the titanium metal pattern 106 Aligned with the active layer 107; that is, a projection of the titanium metal pattern 106 on the surface of the second inorganic barrier layer 105 corresponds to a pattern of the active layer 107; such that the titanium pattern The active layer 107 is protected one-to-one.
- the titanium metal pattern 106 is distributed in an array, and any two adjacent titanium metal patterns 106 There is a gap therebetween that is capable of absorbing a portion of the bending stress of the flexible substrate such that the flexible substrate has a better bending effect.
- a titanium metal is present in a gap between two adjacent titanium metal patterns 106, and a titanium metal thickness in the gap is the titanium metal pattern.
- 1/2 of the film thickness of 106 that is, when the titanium metal layer is subjected to reticle etching, the etching depth of the titanium metal layer is 1/2 of the thickness of the titanium metal layer Therefore, the laser light is prevented from reaching the film layer where the TFT device is located through the gap between the two adjacent titanium metal patterns 106, thereby damaging the metal line on the surface of the film layer where the TFT device is located.
- the material of the first inorganic barrier layer 103 and the second inorganic barrier layer 105 may be Al 2 O 33 (Alumina), TiO 2 (titanium oxide), SiNx (silicon nitride), SiCNx (nitrogen silicon carbide), SiOx (silicon oxide); preferably, the first inorganic barrier layer 103
- the material of the second inorganic barrier layer 105 is made of TiO 2 to enhance the flexibility of the flexible substrate.
- the first polyimide layer 102 and the second polyimide layer 104 have the same film thickness, and the first inorganic barrier layer 103
- the film thickness of the second inorganic barrier layer 105 is the same, and the film thickness of the first inorganic barrier layer 103 and the second inorganic barrier layer 105 is the first polyimide layer 102.
- the titanium metal layer, the first inorganic barrier layer 103, and the second inorganic barrier layer 105 have the same film thickness.
- the flexible OLED display panel further includes: an OLED display device, wherein the OLED display device is correspondingly disposed in the a TFT device surface; a flexible package cover disposed on the flexible substrate and covering the OLED display device.
- a method of preparing a display panel comprising:
- Step S10 providing a glass substrate.
- Step S20 A first polyimide layer is prepared on the surface of the glass substrate. Specifically, a liquid polyimide layer is coated on the surface of the glass substrate, and curing is completed to form the first polyimide layer.
- Step S30 preparing a first inorganic barrier layer on the surface of the first polyimide layer.
- Step S40 preparing a titanium metal layer on the surface of the first inorganic barrier layer.
- the step S40 further includes: S401, patterning the titanium metal layer to form a titanium metal pattern.
- Step S50 A second polyimide layer is prepared on the surface of the titanium metal layer. Specifically, a liquid polyimide layer is coated on the surface of the titanium metal layer, and curing is completed to form the second polyimide layer.
- Step S60 preparing a second inorganic barrier layer on the surface of the second polyimide layer.
- Step S70 preparing a TFT on the surface of the second inorganic barrier layer Specifically, an amorphous silicon layer is deposited on the surface of the second polyimide layer, and the amorphous silicon layer is formed into a polysilicon layer by a laser annealing process, and the polysilicon layer is patterned by an etching process.
- TFT The active layer of the device.
- the step S70 further includes: S701, the TFT The device is prepared directly above the corresponding titanium metal pattern.
- the beneficial effects of the present invention are: OLED provided by the present invention compared to the flexible OLED display panel of the prior art
- the display panel is provided with a titanium metal layer in the flexible substrate, which can effectively absorb the energy of the laser, thereby reducing the thickness of the inorganic barrier layer, further improving the bending performance of the flexible OLED display panel; and solving the flexibility of the prior art.
- the thickness of the inorganic barrier layer in the flexible substrate is large, which affects the flexibility of the flexible OLED display panel, and the flexible OLED display panel is difficult to achieve the desired bending effect.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明提供一种柔性 OLED 显示面板,包括柔性基底以及设置于柔性基底表面的 TFT 器件;其中,柔性基底包括:第一聚酰亚胺层;第一无机阻隔层,制备于第一聚酰亚胺层表面;钛金属层,制备于第一无机阻隔层表面;第二聚酰亚胺层,制备于钛金属层表面;以及,第二无机阻隔层,制备于钛金属层表面; TFT 器件制备于第二无机阻隔层表面。
Description
本发明涉及显示技术领域,尤其涉及一种柔性 OLED 显示面板及其制备方法 。
有机发光二极管( OLED
)具有自发光性、应答速度快、广视角等特点,应用前景广阔。如今,可弯折显示器成为主流。
为实现显示器件的弯折、卷曲等特性,目前最主要的技术是将薄膜晶体管( Thin-film
transistor ,简称 TFT )及显示器件制作于 PI ( polyimide ,聚酰亚胺)基板上,以弥补玻璃基板脆性大、不易弯曲的性质。而由于 PI
具有易弯曲、韧性好的特点,在器件制作过程中无法作为承载基板使用,需要将 PI 涂覆在载体玻璃基板上,完成显示器件制作后,再用激光剥离技术将 PI
基板从玻璃基板上分离,获得柔性显示器。在进行激光剥离时,激光的高能量易影响 TFT 器件电性,降低产品良率。因此,出现了双层 PI 结构,在两层 PI
之间增加无机阻隔层,以减缓激光剥离时能量向 TFT 器件的传导,但这要求无机层厚度较厚,降低了基板柔韧性。
现有技术的柔性 OLED 显示面板,其柔性基板中的无机 阻隔层厚度较大,影响柔性 OLED
显示面板的柔韧性,导致柔性 OLED 显示面板难以达到理想的弯曲效果 。
本发明提供一 种柔性 OLED 显示面板,能够在保证制程中 TFT 器件安全的情况下,不降低
OLED 显示面板的柔韧性;以解决现有 OLED 显示面板,因无机 阻隔层膜层较厚,导致 OLED 显示面板柔性降低的技术问题。
为解决上述问题,本发明提供的技术方案如下:
本发明提供一种柔性 OLED 显示面板,包括柔性基底以及设置于所述柔性基底表面的 TFT
器件;其中,
所述柔性基底包括:
第一聚酰亚胺层;
第一无机阻隔层,制备于所述第一聚酰亚胺层表面;
钛金属层,制备于所述第一无机阻隔层表面;所述钛金属层经图形化处理,形成钛金属图案;
第二聚酰亚胺层,制备于所述钛金属层表面;以及,
第二无机阻隔层,制备于所述钛金属层表面;
所述 TFT 器件制备于所述第二无机阻隔层表面;
所述 TFT
器件至少包括一有源层,所述钛金属图案投射在所述第二无机阻隔层表面的形状,与所述有源层的图案一致,所述钛金属图案与所述有源层对位设置。
根据本发明一优选实施例,所述第一无机阻隔层、所述第二无机阻隔层的材料采用 TiO 2 。
根据本发明一优选实施例,所述第一聚酰亚胺层与所述第二聚酰亚胺层的膜层厚度相同,所述第一无机阻隔层与所述第二无机阻隔层的膜层厚度相同,并且,所述第一无机阻隔层和所述第二无机阻隔层的膜层厚度,为所述第一聚酰亚胺层和所述第二聚酰亚胺层的膜层厚度的
1/3 。
根据本发明一优选实施例,所述钛金属层、所述第一无机阻隔层、所述第二无机阻隔层的膜层厚度相同。
本发明还提供一种柔性 OLED 显示面板,包括柔性基底以及设置于所述柔性基底表面的 TFT
器件;其中,
所述柔性基底包括:
第一聚酰亚胺层;
第一无机阻隔层,制备于所述第一聚酰亚胺层表面;
钛金属层,制备于所述第一无机阻隔层表面;
第二聚酰亚胺层,制备于所述钛金属层表面;以及,
第二无机阻隔层,制备于所述钛金属层表面;
所述 TFT 器件制备于所述第二无机阻隔层表面。
根据本发明一优选实施例,所述第一无机阻隔层、所述第二无机阻隔层的材料采用 TiO 2 。
根据本发明一优选实施例,所述第一聚酰亚胺层与所述第二聚酰亚胺层的膜层厚度相同,所述第一无机阻隔层与所述第二无机阻隔层的膜层厚度相同,并且,所述第一无机阻隔层和所述第二无机阻隔层的膜层厚度,为所述第一聚酰亚胺层和所述第二聚酰亚胺层的膜层厚度的
1/3 。
根据本发明一优选实施例,所述钛金属层、所述第一无机阻隔层、所述第二无机阻隔层的膜层厚度相同。
依据本发明的上述目的,提出 一种柔性 OLED 显示面板的制备方法,所述方法包括:
步骤 S10 ,提供玻璃衬底;
步骤 S20 ,在所述玻璃衬底表面制备第一聚酰亚胺层;
步骤 S30 ,在所述第一聚酰亚胺层表面制备第一无机阻隔层;
步骤 S40 ,在所述第一无机阻隔层表面制备钛金属层;
步骤 S50 ,在所述钛金属层表面制备第二聚酰亚胺层;
步骤 S60 ,在所述第二聚酰亚胺层表面制备第二无机阻隔层;以及,
步骤 S70 ,在所述第二无机阻隔层表面制备 TFT 器件。
根据本发明一优选实施例,所述步骤 S40 还包括: S401
,将所述钛金属层进行图案化处理,形成钛金属图案。
根据本发明一优选实施例,所述步骤 S70 还包括: S701 ,将所述 TFT
器件制备于相对应的所述钛金属图案的正上方 。
根据本发明一优选实施例,所述方法还包括:步骤 S80 ,使用激光将所述玻璃衬底剥离。
本发明的有益效果为: 相较于现有技术的柔性 OLED 显示面板,本发明提供的 OLED
显示面板,在柔性基底中设置钛金属层,能够有效吸收激光的能量,进而降低无机阻隔层的膜层厚度,进一步提高柔性 OLED 显示面板的弯曲性能;解决了 现有技术的柔性
OLED 显示面板,其柔性基板中的无机 阻隔层厚度较大,影响柔性 OLED 显示面板的柔韧性,导致柔性 OLED 显示面板难以达到理想的弯曲效果 。
为了更清楚地说明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单介绍,显而易见地,下面描述中的附图仅仅是发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图 1 为本发明提供的柔性 OLED 显示面板膜层结构图;
图 2 为本发明柔性 OLED 显示面板的制备方法流程图 。
以下各实施例的说明是参考附加的图示,用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语,例如
[ 上 ] 、 [ 下 ] 、 [ 前 ] 、 [ 后 ] 、 [ 左 ] 、 [ 右 ] 、 [ 内 ] 、 [ 外 ] 、 [ 侧面 ]
等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。在图中,结构相似的单元是用以相同标号表示。
本发明针对 现有技术的柔性 OLED 显示面板,其柔性基板中的无机 阻隔层厚度较大,影响柔性 OLED
显示面板的柔韧性,导致柔性 OLED 显示面板难以达到理想的弯曲效果 ,本实施例能够解决该缺陷 。
如图 1 所示,本发明提供的 一种柔性 OLED 显示面板,包括柔性基底以及设置于所述柔性基底表面的
TFT 器件;其中,所述柔性基底包括:第一聚酰亚胺层 102 ;第一无机阻隔层 103 ,制备于所述第一聚酰亚胺层 102
表面;钛金属层,制备于所述第一无机阻隔层 103 表面;第二聚酰亚胺层 104 ,制备于所述钛金属层表面;以及,第二无机阻隔层 105
,制备于所述钛金属层表面;所述 TFT 器件制备于所述第二无机阻隔层 105 表面。
钛金属,具备韧性好、热导系数低、光吸收能力强的特点,钛金属制备的所述钛金属层,能够吸收大部分用于剥离玻璃衬底的激光能量,进而阻止激光穿透靠近所述 TFT
器件的所述第二聚酰亚胺层 104 ,起到保护所述 TFT 器件的电性的作用。所述钛金属层具有一定的导电性,可减少所述第一聚酰亚胺层 102 、第二聚酰亚胺层
104 对制程中产生的导电粒子的静电吸附,进而提高第一聚酰亚胺层 102 、第二聚酰亚胺层 104 的洁净度,提高产品良率。
所述柔性基底中,所述第一聚酰亚胺层 102 、第二聚酰亚胺层 104
具有较佳的弯折特性,所述第一聚酰亚胺层 102 用作所述柔性基底的第一衬底,同时用作所述柔性基底的第一外保护层,所述第二聚酰亚胺层 104
用作所述柔性基底的第二衬底,同时用作所述柔性基底的第二外保护层;所述第一无机阻隔层 103
用作所述柔性基底的第一阻水层,避免水汽浸入所述钛金属层,所述第一无机阻隔层 103
用作所述柔性基底的第二阻水层,用于所述柔性基底的二次阻水保护层,以保护设置于所述柔性基底表面的发光器件。
所述钛金属层通过光罩工艺,形成钛金属图案 106 ,所述钛金属图案 106 阵列分布;所述 TFT
器件至少包括一有源层 107 ,所述钛金属图案 106 投射在所述第二无机阻隔层 105 表面的形状,与所述有源层 107 的图案一致,所述钛金属图案 106
与所述有源层 107 对位设置;即所述钛金属图案 106 投射在所述第二无机阻隔层 105 表面的投影与所述有源层 107 的图案相对应;使得所述钛金属图案
106 一对一地对所述有源层 107 进行保护。
所述钛金属图案 106 阵列分布,任意两相邻的所述钛金属图案 106
之间具有间隙,所述间隙能够吸收所述柔性基底的部分弯曲应力,使得所述柔性基底具有更佳的弯折效果。
例如,两相邻的所述钛金属图案 106 之间的间隙内具有钛金属,所述间隙内的钛金属厚度为所述钛金属图案
106 的膜层厚度的 1/2 ;即所述钛金属层在进行光罩刻蚀时,所述钛金属层的刻蚀深度为所述钛金属层的膜层厚度的 1/2
;从而避免激光通过相邻两所述钛金属图案 106 之间的间隙到达 TFT 器件所在膜层,进而损伤到 TFT 器件所在膜层表面的金属线路。
所述第一无机阻隔层 103 、所述第二无机阻隔层 105 的材料可采用 Al 2 O 33
(氧化铝)、 TiO 2 (氧化钛)、 SiNx (氮化硅)、 SiCNx (氮碳化硅)、 SiOx (氧化硅);优选的,所述第一无机阻隔层 103
、所述第二无机阻隔层 105 的材料采用 TiO 2 ,以增强所述柔性基底的柔韧性。
所述第一聚酰亚胺层 102 与所述第二聚酰亚胺层 104 的膜层厚度相同,所述第一无机阻隔层 103
与所述第二无机阻隔层 105 的膜层厚度相同,并且,所述第一无机阻隔层 103 和所述第二无机阻隔层 105 的膜层厚度,为所述第一聚酰亚胺层 102
和所述第二聚酰亚胺层 104 的膜层厚度的 1/3 ;所述钛金属层的设置,使得现有技术较厚的无机阻隔层膜厚减小,进一步增强所述柔性基底的柔韧性。
所述钛金属层、所述第一无机阻隔层 103 、所述第二无机阻隔层 105 的膜层厚度相同。
所述柔性 OLED 显示面板还包括: OLED 显示器件,所述 OLED 显示器件对应设置于所述
TFT 器件表面;柔性封装盖板,设置于所述柔性基底上,且覆盖所述 OLED 显示器件。
如图 2 所示,依据本发明的上述目的,提出 一种柔性 OLED
显示面板的制备方法,所述方法包括:
步骤 S10 ,提供玻璃衬底。
步骤 S20
,在所述玻璃衬底表面制备第一聚酰亚胺层。具体的,在所述玻璃衬底表面涂覆液态聚酰亚胺层,并完成固化,形成所述第一聚酰亚胺层。
步骤 S30 ,在所述第一聚酰亚胺层表面制备第一无机阻隔层。
步骤 S40 ,在所述第一无机阻隔层表面制备钛金属层。
所述步骤 S40 还包括: S401 ,将所述钛金属层进行图案化处理,形成钛金属图案。
步骤 S50
,在所述钛金属层表面制备第二聚酰亚胺层。具体的,在所述钛金属层表面涂覆液态聚酰亚胺层,并完成固化,形成所述第二聚酰亚胺层。
步骤 S60 ,在所述第二聚酰亚胺层表面制备第二无机阻隔层。
步骤 S70 ,在所述第二无机阻隔层表面制备 TFT
器件;具体的,在所述第二聚酰亚胺层表面沉积非晶硅层,利用激光退火工艺,使所述非晶硅层形成多晶硅层,通过刻蚀工艺,使所述多晶硅层图形化为 TFT
器件的有源层。
所述步骤 S70 还包括: S701 ,将所述 TFT
器件制备于相对应的所述钛金属图案的正上方。
本发明的有益效果为: 相较于现有技术的柔性 OLED 显示面板,本发明提供的 OLED
显示面板,在柔性基底中设置钛金属层,能够有效吸收激光的能量,进而降低无机阻隔层的膜层厚度,进一步提高柔性 OLED 显示面板的弯曲性能;解决了 现有技术的柔性
OLED 显示面板,其柔性基板中的无机 阻隔层厚度较大,影响柔性 OLED 显示面板的柔韧性,导致柔性 OLED 显示面板难以达到理想的弯曲效果 。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本发明,本领域的普通技术人员,在不脱离本发明的精神和范围内,均可作各种更动与润饰,因此本发明的保护范围以权利要求界定的范围为准。
Claims (12)
- 一种柔性 OLED 显示面板,其包括柔性基底以及设置于所述柔性基底表面的 TFT 器件;其中,所述柔性基底包括:第一聚酰亚胺层;第一无机阻隔层,制备于所述第一聚酰亚胺层表面;钛金属层,制备于所述第一无机阻隔层表面;所述钛金属层经图形化处理,形成钛金属图案;第二聚酰亚胺层,制备于所述钛金属层表面;以及,第二无机阻隔层,制备于所述钛金属层表面;所述 TFT 器件制备于所述第二无机阻隔层表面;所述 TFT 器件至少包括一有源层,所述钛金属图案投射在所述第二无机阻隔层表面的形状,与所述有源层的图案一致,所述钛金属图案与所述有源层对位设置。
- 根据权利要求 1 所述的柔性 OLED 显示面板,其中,所述第一无机阻隔层、所述第二无机阻隔层的材料采用 TiO 2 。
- 根据权利要求 1 所述的柔性 OLED 显示面板,其中,所述第一聚酰亚胺层与所述第二聚酰亚胺层的膜层厚度相同,所述第一无机阻隔层与所述第二无机阻隔层的膜层厚度相同,并且,所述第一无机阻隔层和所述第二无机阻隔层的膜层厚度,为所述第一聚酰亚胺层和所述第二聚酰亚胺层的膜层厚度的 1/3 。
- 根据权利要求 3 所述的柔性 OLED 显示面板,其中,所述钛金属层、所述第一无机阻隔层、所述第二无机阻隔层的膜层厚度相同。
- 一种柔性 OLED 显示面板,其包括柔性基底以及设置于所述柔性基底表面的 TFT 器件;其中,所述柔性基底包括:第一聚酰亚胺层;第一无机阻隔层,制备于所述第一聚酰亚胺层表面;钛金属层,制备于所述第一无机阻隔层表面;第二聚酰亚胺层,制备于所述钛金属层表面;以及,第二无机阻隔层,制备于所述钛金属层表面;所述 TFT 器件制备于所述第二无机阻隔层表面。
- 根据权利要求 5 所述的柔性 OLED 显示面板,其中,所述第一无机阻隔层、所述第二无机阻隔层的材料采用 TiO 2 。
- 根据权利要求 5 所述的柔性 OLED 显示面板,其中,所述第一聚酰亚胺层与所述第二聚酰亚胺层的膜层厚度相同,所述第一无机阻隔层与所述第二无机阻隔层的膜层厚度相同,并且,所述第一无机阻隔层和所述第二无机阻隔层的膜层厚度,为所述第一聚酰亚胺层和所述第二聚酰亚胺层的膜层厚度的 1/3 。
- 根据权利要求 7 所述的柔性 OLED 显示面板,其中,所述钛金属层、所述第一无机阻隔层、所述第二无机阻隔层的膜层厚度相同。
- 一种柔性 OLED 显示面板的制备方法,其中,所述方法包括:步骤 S10 ,提供玻璃衬底;步骤 S20 ,在所述玻璃衬底表面制备第一聚酰亚胺层;步骤 S30 ,在所述第一聚酰亚胺层表面制备第一无机阻隔层;步骤 S40 ,在所述第一无机阻隔层表面制备钛金属层;步骤 S50 ,在所述钛金属层表面制备第二聚酰亚胺层;步骤 S60 ,在所述第二聚酰亚胺层表面制备第二无机阻隔层;以及,步骤 S70 ,在所述第二无机阻隔层表面制备 TFT 器件。
- 根据权利要求 9 所述的制备方法,其中,所述步骤 S40 还包括:S401 ,将所述钛金属层进行图案化处理,形成钛金属图案。
- 根据权利要求 10 所述的制备方法,其中,所述步骤 S70 还包括:S701 ,将所述 TFT 器件制备于相对应的所述钛金属图案的正上方。
- 根据权利要求 9 所述的制备方法,其中,所述方法还包括:步骤 S80 ,使用激光将所述玻璃衬底剥离 。
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