WO2020124805A1 - 显示屏及显示装置 - Google Patents
显示屏及显示装置 Download PDFInfo
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- WO2020124805A1 WO2020124805A1 PCT/CN2019/077720 CN2019077720W WO2020124805A1 WO 2020124805 A1 WO2020124805 A1 WO 2020124805A1 CN 2019077720 W CN2019077720 W CN 2019077720W WO 2020124805 A1 WO2020124805 A1 WO 2020124805A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Definitions
- the invention relates to the field of display technology, in particular to a display screen and a display device.
- OLED Organic Light-emitting Diode
- OLED Organic Light-Emitting Diode
- the OLED display 2 may be composed of a back plate 21, a display panel 22, a touch panel 23, a polarizer 24 and a glass cover 25. These components are pasted together by providing a gel layer 26.
- the glass cover 25 needs to use the flexible substrate 251 as a carrier, and is made by coating a hard coating layer 252 on the substrate 251.
- the colloid layer 26 and the flexible substrate 251 can make the OLED display 2 have better bending performance, it also causes the hardness of the OLED display 2 to decrease.
- An object of the present invention is to provide a display screen and a display device, which can increase the hardness of the display screen and the display device.
- An embodiment of the present invention provides a display screen, which includes;
- the light emitting device layer is provided on the array substrate;
- a thin-film encapsulation layer provided on the light-emitting device layer
- a hard layer provided on the thin film encapsulation layer
- the hard layer is not fixed on the thin film encapsulation layer through the colloid layer.
- the display screen further includes a filter layer
- the filter layer is disposed between the thin film encapsulation layer and the hard layer, and the filter layer includes:
- each black matrix is disposed between two adjacent filter units.
- the display screen further includes a first flat layer, and the first flat layer is disposed between the filter layer and the hard layer.
- the material of the first flat layer includes acrolein, epoxy resin and silicone resin.
- the display screen further includes a touch layer disposed between the filter layer and the hard layer, or the touch layer is disposed on the thin film encapsulation layer And the filter layer.
- the display screen further includes a second flat layer.
- the second flat layer is disposed on the Between the touch layer and the hard layer; when the touch layer is provided between the thin film encapsulation layer and the filter layer, the second flat layer is provided between the touch layer and the Between the filter layers.
- the display screen includes a light-emitting area and a non-light-emitting area
- the filter unit is disposed opposite to the light-emitting area
- the black matrix is disposed opposite to the non-light-emitting area.
- the display screen further includes a third flat layer, and the third flat layer is disposed between the array substrate and the light emitting device layer.
- the material of the hard layer includes: acrolein group, polymethyl methacrylate, silica, urethane, epoxy resin and silane.
- the hard layer is disposed on the thin-film encapsulation layer through a deposition process or a transfer process.
- An embodiment of the present invention also provides a display device, which includes a display screen, and the display screen includes;
- the light emitting device layer is provided on the array substrate;
- a thin-film encapsulation layer provided on the light-emitting device layer
- a hard layer provided on the thin film encapsulation layer
- the hard layer is not fixed on the thin film encapsulation layer through the colloid layer.
- the display screen further includes a filter layer
- the filter layer is disposed between the thin film encapsulation layer and the hard layer, and the filter layer includes:
- each black matrix is disposed between two adjacent filter units.
- the display screen further includes a first flat layer, and the first flat layer is disposed between the filter layer and the hard layer.
- the material of the first flat layer includes acrolein, epoxy resin and silicone resin.
- the display screen further includes a touch layer disposed between the filter layer and the hard layer, or the touch layer is disposed on the thin film encapsulation layer And the filter layer.
- the display screen further includes a second flat layer.
- the second flat layer is disposed on the Between the touch layer and the hard layer; when the touch layer is provided between the thin film encapsulation layer and the filter layer, the second flat layer is provided between the touch layer and the Between the filter layers.
- the display screen includes a light-emitting area and a non-light-emitting area
- the filter unit is disposed opposite to the light-emitting area
- the black matrix is disposed opposite to the non-light-emitting area.
- the display screen further includes a third flat layer, and the third flat layer is disposed between the array substrate and the light emitting device layer.
- the material of the hard layer includes: acrolein group, polymethyl methacrylate, silica, urethane, epoxy resin and silane.
- the hard layer is disposed on the thin-film encapsulation layer through a deposition process or a transfer process.
- the display screen and display device of the present invention reduce the use of the substrate and the colloid layer by directly setting the hard layer on the light-emitting device layer, and increase the hardness of the display screen.
- FIG. 1 is a schematic structural diagram of an existing display screen.
- FIG. 2 is a first schematic structural diagram of a display screen provided by an embodiment of the present invention.
- FIG. 3 is a second schematic structural diagram of a display screen provided by an embodiment of the present invention.
- FIG. 4 is a third schematic structural diagram of a display screen provided by an embodiment of the present invention.
- FIG. 2-4 is a schematic structural diagram of a display screen provided by an embodiment of the present invention.
- the display screen 1 includes an array substrate 11, a light emitting device layer 12, a thin film encapsulation layer 13 and a hard layer 14.
- the array substrate 11 includes a substrate 111 and a thin film transistor layer 112.
- the array substrate 11 further includes a buffer layer 113, which can be used to protect the substrate 111.
- the buffer layer 113 is provided between the substrate 111 and the thin film transistor layer 112.
- the buffer layer 113 may be silicon oxide SiO x, SiN x multilayer film structure composed of silicon nitride.
- the substrate 111 is used to carry the buffer layer 113, the thin film transistor layer 112 and other structures on it.
- the substrate 111 may be composed of flexible materials such as polyimide, polycarbonate, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, polyarylate, etc. To improve the bending performance of the display 1.
- the thin film transistor layer 112 is used to control the display of the screen of the display screen 1. As shown in FIG. 3 or 4, the thin film transistor layer 112 includes an active layer 1121, a first insulating layer 1122, a first metal layer 1123, a second insulating layer 1124, a second metal layer 1125, an inter-insulating layer 1126 that are sequentially stacked ⁇ 1127 ⁇ The source and drain layer 1127.
- the light emitting device layer 12 is provided on the array substrate 11. As shown in FIG. 3 or 4, the light-emitting device layer 12 includes an anode layer 121, an organic light-emitting layer 122, a pixel definition layer 123, and a cathode layer 124 that are sequentially stacked.
- the anode layer 121 is provided on the array substrate 11.
- the pixel definition layer 123 is used to define light-emitting pixels.
- the constituent material of the cathode layer 124 may include one or more of metals such as lithium, calcium, lithium, aluminum, and silver.
- the cathode layer 123 is used to provide electrons.
- the material of the anode layer 121 may be a metal oxide, such as indium tin oxide.
- the anode layer 121 serves to provide holes.
- the organic light emitting layer 122 may be composed of structures such as an electron transport layer (ETL), a light emitting layer (EL), and a hole transport layer (HTL).
- ETL electron transport layer
- EL light emitting layer
- HTL hole transport layer
- the light emitting device layer 12 further includes support pillars 125.
- the support pillar 125 is provided on the anode layer 121 and around the organic light-emitting layer 122.
- a third flat layer 15 is further provided between the array substrate 11 and the light emitting device layer 12.
- the third flat layer 15 is used to provide a flat surface and isolate the array substrate 11 and the light emitting device layer 12 to prevent electric field crosstalk between the two.
- the third flat layer 15 can be made of acrolein, epoxy resin and silicone resin. The above materials can not only improve the bending resistance of the display 1 but also ensure the hardness of the display 1 Above 5H (Hard, hardness).
- the thin film encapsulation layer 13 is provided on the light emitting device layer 12.
- the thin-film encapsulation layer 13 may be composed of a multilayer organic thin film and a multilayer inorganic thin film, and these organic thin films and inorganic thin films are sequentially stacked alternately.
- the thin-film encapsulation layer 13 may be composed of materials such as SiN x and silicon dioxide SiO 2 .
- the thin film encapsulation layer 13 is used to protect the light emitting device layer 12, the array substrate 31 and other structures from being corroded by water vapor and oxygen.
- the hard layer 14 is provided on the thin film encapsulation layer 13. It should be noted that, in this embodiment, the hard layer 14 is not fixed on the thin film encapsulation layer 13 through the colloid layer. As shown in FIG. 2, the hard layer 14 is formed by directly coating a hard material on the thin film encapsulation layer 13. In one embodiment, a deposition process may be used to transfer the hard material to the thin-film encapsulation layer 13 and form a greater bonding force between the hard material and the thin-film encapsulation layer 13. Specifically, a deposition process such as evaporation and sputtering may be selected to fix the hard material on the thin film encapsulation layer 13 to form the hard layer 14.
- a deposition process such as evaporation and sputtering may be selected to fix the hard material on the thin film encapsulation layer 13 to form the hard layer 14.
- a transfer process may also be used to transfer the patterned hard material to the thin film encapsulation layer 13 to form the hard layer 14 and form a larger bond between the hard layer 14 and the thin film encapsulation layer 13 force.
- OCA Optically Clear Adhesive
- the hard layer 14 may be composed of acrolein groups, polymethyl methacrylate, silica, urethane, epoxy resin, and silane.
- the above materials can improve the resistance of the display screen 1
- the bendability can also ensure that the hardness of the display 1 is above 5H.
- the display screen 1 further includes a filter layer 16.
- the filter layer 16 is disposed between the thin film encapsulation layer 13 and the hard layer 14.
- the filter layer 16 includes a plurality of filter units 161 and a plurality of black matrices 162, wherein each black matrix 162 is provided between two adjacent filter units 161.
- the filter layer 16 has a large light extraction rate.
- a thin film of metallic chromium may be deposited on the thin film encapsulation layer 13 by sputtering coating method first. Then, a photoresist is coated on the chromium film, and the black matrix 162 is obtained through the steps of exposure, development, etching, and stripping. Next, a red pigment film layer, a blue pigment film layer, and a green pigment film layer arranged in a certain pattern are sequentially formed on the thin-film encapsulation layer 13 in the order of red, blue, and green, to obtain the filter unit 161 described above.
- the display screen 1 includes a light-emitting area and a non-light-emitting area.
- the above-mentioned filter unit 161 is disposed opposite to the light emitting area
- the black matrix 162 is disposed opposite to the non-light emitting area.
- the red pigment film layer, the blue pigment film layer, and the green pigment film layer of the filter unit 161 correspond to the red light emitting region, the blue light emitting region, and the green light emitting region among the light emitting regions.
- a first flat layer 17 may be provided on the filter layer 16 and then the first flat layer 17 The upper hard layer 14 is formed.
- the first flat layer 17 may be made of organic materials or inorganic materials.
- the first flat layer 17 is made of an organic material to prevent the filter layer 16 from being corroded by oxygen.
- the first flat layer 17 can be made of acrolein, epoxy resin and silicone resin. The above materials can not only improve the bending resistance of the display 1 but also ensure the hardness of the display 1 5H or more.
- the display screen 1 further includes a touch layer 18.
- the touch control layer 18 can perform touch control on the display screen 1.
- the touch layer 18 may be disposed between the filter layer 16 and the hard layer 14. As shown in FIG. 4, the touch layer 18 can also be disposed between the thin film encapsulation layer 13 and the filter layer 16.
- the display screen 1 further includes a second flat layer 19.
- the second flat layer 19 is used to provide a flat surface.
- the second flat layer 19 is disposed between the touch layer 18 and the hard layer 14.
- the second flat layer 19 can also prevent the touch layer 18 from being corroded by oxygen.
- the touch layer 18 is disposed between the thin film encapsulation layer 13 and the filter layer 16
- the second flat layer 19 is disposed between the touch layer 18 and the filter layer 16.
- the second flat layer 19 may be made of organic materials or inorganic materials.
- the second flat layer 19 is made of an organic material to prevent the touch layer 18 from being corroded by oxygen.
- the second flat layer 19 can be made of acrolein, epoxy resin and silicone resin. The above materials can not only improve the bending resistance of the display 1 but also ensure the hardness of the display 1 5H or more.
- the display screen and the display device of the present invention reduce the use of the substrate and the colloid layer by directly setting the hard layer on the thin film encapsulation layer, and increase the hardness of the display screen.
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Abstract
一种显示屏(1)及显示装置,显示屏(1)包括:阵列基板(11);发光器件层(12),设置在阵列基板(11)上;薄膜封装层(13),设置在发光器件层(12)上;硬质层(14),设置在薄膜封装层(13)上;其中,硬质层(14)不通过胶体层固定在薄膜封装层(13)上。
Description
本发明涉及显示技术领域,特别是涉及一种显示屏及显示装置。
在显示技术领域中,由于OLED(Organic
Light-emitting Diode,有机发光二极管)显示器具有重量轻、自发光、广视角以及响应速度快等特点,得到广泛应用。
如图1所示,OLED显示器2可以由背板21、显示面板22、触控面板23、偏光片24以及玻璃盖板25等部件组成。这些部件之间通过设置胶体层26,粘贴在一起。其中,玻璃盖板25需要以柔性基板251作为载体,通过在基板251上涂布硬质涂层252制成。
上述胶体层26、柔性基板251虽然可以使OLED显示器2具有较好的弯折性能,但也造成OLED显示器2硬度降低。
本发明的目的在于提供一种显示屏及显示装置,可以提高显示屏及显示装置的硬度。
本发明实施例提供了一种显示屏,其包括;
阵列基板;
发光器件层,设置在所述阵列基板上;
薄膜封装层,设置在所述发光器件层上;
硬质层,设置在所述薄膜封装层上;
其中,所述硬质层不通过胶体层固定在所述薄膜封装层上。
在一实施例中,所述显示屏还包括滤光层;
所述滤光层设置在所述薄膜封装层和所述硬质层之间,所述滤光层包括:
多个滤光单元;
多个黑色矩阵,每一黑色矩阵设置在相邻两滤光单元之间。
在一实施例中,所述显示屏还包括第一平坦层,所述第一平坦层设置在所述滤光层和所述硬质层之间。
在一实施例中,所述第一平坦层的组成材料包括丙烯醛基、环氧基树脂和硅树脂。
在一实施例中,所述显示屏还包括触控层,所述触控层设置在所述滤光层和所述硬质层之间,或所述触控层设置在所述薄膜封装层和所述滤光层之间。
在一实施例中,所述显示屏还包括第二平坦层,当所述触控层设置在所述滤光层和所述硬质层之间时,所述第二平坦层设置在所述触控层和所述硬质层之间;当所述触控层设置在所述薄膜封装层和所述滤光层之间时,所述第二平坦层设置在所述触控层和所述滤光层之间。
在一实施例中,所述显示屏包括发光区和非发光区,所述滤光单元与所述发光区相对设置,所述黑色矩阵与所述非发光区相对设置。
在一实施例中,所述显示屏还包括第三平坦层,所述第三平坦层设置在所述阵列基板和所述发光器件层之间。
在一实施例中,所述硬质层的组成材料包括:丙烯醛基、聚甲基丙烯酸甲酯、二氧化硅、尿烷、环氧基树脂以及硅烷。
在一实施例中,硬质层通过沉积工艺或转印工艺设置在所述薄膜封装层上。
本发明实施例还提供了一种显示装置,其包括显示屏,显示屏包括;
阵列基板;
发光器件层,设置在所述阵列基板上;
薄膜封装层,设置在所述发光器件层上;
硬质层,设置在所述薄膜封装层上;
其中,所述硬质层不通过胶体层固定在所述薄膜封装层上。
在一实施例中,所述显示屏还包括滤光层;
所述滤光层设置在所述薄膜封装层和所述硬质层之间,所述滤光层包括:
多个滤光单元;
多个黑色矩阵,每一黑色矩阵设置在相邻两滤光单元之间。
在一实施例中,所述显示屏还包括第一平坦层,所述第一平坦层设置在所述滤光层和所述硬质层之间。
在一实施例中,所述第一平坦层的组成材料包括丙烯醛基、环氧基树脂和硅树脂。
在一实施例中,所述显示屏还包括触控层,所述触控层设置在所述滤光层和所述硬质层之间,或所述触控层设置在所述薄膜封装层和所述滤光层之间。
在一实施例中,所述显示屏还包括第二平坦层,当所述触控层设置在所述滤光层和所述硬质层之间时,所述第二平坦层设置在所述触控层和所述硬质层之间;当所述触控层设置在所述薄膜封装层和所述滤光层之间时,所述第二平坦层设置在所述触控层和所述滤光层之间。
在一实施例中,所述显示屏包括发光区和非发光区,所述滤光单元与所述发光区相对设置,所述黑色矩阵与所述非发光区相对设置。
在一实施例中,所述显示屏还包括第三平坦层,所述第三平坦层设置在所述阵列基板和所述发光器件层之间。
在一实施例中,所述硬质层的组成材料包括:丙烯醛基、聚甲基丙烯酸甲酯、二氧化硅、尿烷、环氧基树脂以及硅烷。
在一实施例中,硬质层通过沉积工艺或转印工艺设置在所述薄膜封装层上。
相较于现有的显示屏及显示装置,本发明的显示屏及显示装置通过将硬质层直接设置在发光器件层上,减少了基板、胶体层的使用,提高了显示屏的硬度。
为让本发明的上述内容能更明显易懂,下文特举优选实施例,并配合所附图式,作详细说明如下:
图1为现有的显示屏的结构示意图。
图2为本发明实施例提供的显示屏的第一结构示意图。
图3为本发明实施例提供的显示屏的第二结构示意图。
图4为本发明实施例提供的显示屏的第三结构示意图。
以下各实施例的说明是参考附加的图式,用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语,例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。
在图中,结构相似的单元是以相同标号表示。
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。
本发明实施例提供了一种显示装置,该显示装置包括显示屏。请参照图2-4,图2-4为本发明实施例提供的显示屏的结构示意图。如图2所示,显示屏1包括阵列基板11、发光器件层12、薄膜封装层13和硬质层14。
如图3所示,阵列基板11包括基板111和薄膜晶体管层112。在一实施例中,阵列基板11还包括缓冲层113,该缓冲层113可以用于保护基板111。该缓冲层113设置在基板111和薄膜晶体管层112之间。缓冲层113可以是氧化硅SiO
x,氮化硅SiN
x组成的多层膜结构。
基板111用于承载位于其上的缓冲层113、薄膜晶体管层112等结构。在一实施例中,基板111可以由聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物等柔性材料组成,以提高显示屏1的弯折性能。
薄膜晶体管层112用于控制显示屏1画面的显示。如图3或4所示,薄膜晶体管层112包括依次层叠设置的有源层1121、第一绝缘层1122、第一金属层1123、第二绝缘层1124、第二金属层1125、间绝缘层1126和源漏极层1127。
发光器件层12设置在阵列基板11上。如图3或4所示,发光器件层12包括依次层叠设置的阳极层121、有机发光层122、像素定义层123和阴极层124,其中阳极层121设置在阵列基板11上。
像素定义层123用于界定发光像素。阴极层124的组成材料可以包括锂、钙、锂、铝以及银等金属中的一种或多种。阴极层123用于提供电子。阳极层121的组成材料可以为金属氧化物,比如氧化铟锡。阳极层121用于提供空穴。有机发光层122可以由电子传输层(ETL)、发光层(EL)和空穴传输层(HTL)等结构组成。在外加电场的作用下,电子和空穴分别从阴极层123和阳极层121,向夹在二者之间的有机发光层122注入。电子和空穴复合产生激子,激子在电场的作用下迁移,将能量传递给有机发光层122中的发光层,使发光层中的发光材料发光。在一实施例中,发光器件层12还包括支撑柱125。支撑柱125设置在阳极层121上,并设置在有机发光层122周围。
在一实施例中,如图2或3所示,阵列基板11和发光器件层12之间还设有第三平坦层15。该第三平坦层15用于提供平坦表面,并且隔离阵列基板11和发光器件层12,防止二者之间发生电场串扰。在一实施例中,第三平坦层15可以采用丙烯醛基、环氧基树脂和硅树脂制成,上述材料既可以提高显示屏1的耐弯折性,也可以确保显示屏1的硬度在5H(Hard,硬度)以上。
薄膜封装层13设置在发光器件层12上。薄膜封装层13可以由多层有机薄膜和多层无机薄膜组成,这些有机薄膜、无机薄膜依次交替层叠排列。具体的,薄膜封装层13可以由SiN
x、二氧化硅SiO
2等材料组成。薄膜封装层13用于保护发光器件层12、阵列基板31等结构不被水汽和氧气侵蚀。
硬质层14设置在薄膜封装层13上。需要说明的是,在本实施例中,该硬质层14不通过胶体层固定在薄膜封装层13上。如图2所示,硬质层14通过在薄膜封装层13上直接涂布硬质材料形成。在一实施例中,可以采用沉积工艺,将硬质材料转移到薄膜封装层13上,并使硬质材料与薄膜封装层13形成较大的结合力。具体的,可以选取蒸镀、溅射等形式的沉积工艺,将硬质材料固定在薄膜封装层13上,形成硬质层14。
在一实施例中,还可以采用转印工艺,将图案化的硬质材料转移到薄膜封装层13上,形成硬质层14,并使硬质层14与薄膜封装层13形成较大的结合力。这样,硬质层14和薄膜封装层13之间无需采用OCA(Optically Clear Adhesive)光学胶等胶体进行粘贴固定,且无需柔性基板承载该硬质层14。这样可以使显示屏1的硬度达到5H以上。
在一实施例中,硬质层14可以由丙烯醛基、聚甲基丙烯酸甲酯、二氧化硅、尿烷、环氧基树脂以及硅烷等材料组成,上述材料既可以提高显示屏1的耐弯折性,也可以确保显示屏1的硬度在5H以上。
在一实施例中,显示屏1还包括滤光层16。如图3或4所示,滤光层16设置在薄膜封装层13和硬质层14之间,滤光层16包括多个滤光单元161和多个黑色矩阵162,其中,每一个黑色矩阵162设置在相邻两个滤光单元161之间。上述滤光层16具有较大的出光率。
可以先利用溅射镀膜法,在薄膜封装层13上沉积金属铬的薄膜。然后在铬薄膜上涂布光刻胶,经曝光、显影、刻蚀以及剥离等工序,得到上述黑色矩阵162。接着,按红、蓝、绿的顺序,依次在薄膜封装层13上形成按一定图案排列的红色颜料膜层、蓝色颜料膜层、绿色颜料膜层,得到上述滤光单元161。
在一实施例中,显示屏1包括发光区和非发光区。其中,上述滤光单元161与发光区相对设置,黑色矩阵162与非发光区相对设置。具体的,滤光单元161的红色颜料膜层、蓝色颜料膜层、绿色颜料膜层与发光区中的红色发光区、蓝色发光区、绿色发光区一一对应。
在一实施例中,由于滤光层16硬度较低,因此形成硬质层之前,可以如图4所示,在滤光层16上设置一第一平坦层17,再于第一平坦层17上形成硬质层14。
第一平坦层17可以采用有机材料制成,也可以采用无机材料制成。优选的,第一平坦层17采用有机材料制成,以防止滤光层16被氧气侵蚀。在一实施例中,第一平坦层17可以采用丙烯醛基、环氧基树脂和硅树脂制成,上述材料既可以提高显示屏1的耐弯折性,也可以确保显示屏1的硬度在5H以上。
在一实施例中,显示屏1还包括触控层18。触控层18可以对显示屏1进行触摸控制。
如图3所示,触控层18可以设置在滤光层16和硬质层14之间。如图4所示,触控层18还可以设置在薄膜封装层13和滤光层16之间。
在一实施例中,显示屏1还包括第二平坦层19。该第二平坦层19用于提供平坦表面。当触控层18设置在滤光层16和硬质层14之间时,第二平坦层19设置在触控层18和硬质层14之间。此时,第二平坦层19还可以防止触控层18被氧气侵蚀。当触控层18设置在薄膜封装层13和滤光层16之间时,第二平坦层19设置在触控层18和滤光层16之间。
第二平坦层19可以采用有机材料制成,也可以采用无机材料制成。优选的,第二平坦层19采用有机材料制成,以防止触控层18被氧气侵蚀。在一实施例中,第二平坦层19可以采用丙烯醛基、环氧基树脂和硅树脂制成,上述材料既可以提高显示屏1的耐弯折性,也可以确保显示屏1的硬度在5H以上。
本发明的显示屏及显示装置,通过将硬质层直接设置在薄膜封装层上,减少了基板、胶体层的使用,提高了显示屏的硬度。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本发明,本领域的普通技术人员,在不脱离本发明的精神和范围内,均可作各种更动与润饰,因此本发明的保护范围以权利要求界定的范围为准。
Claims (20)
- 一种显示屏,其包括;阵列基板;发光器件层,设置在所述阵列基板上;薄膜封装层,设置在所述发光器件层上;硬质层,设置在所述薄膜封装层上;其中,所述硬质层不通过胶体层固定在所述薄膜封装层上。
- 根据权利要求1所述的显示屏,其中,所述显示屏还包括滤光层;所述滤光层设置在所述薄膜封装层和所述硬质层之间,所述滤光层包括:多个滤光单元;多个黑色矩阵,每一黑色矩阵设置在相邻两滤光单元之间。
- 根据权利要求2所述的显示屏,其中,所述显示屏还包括第一平坦层,所述第一平坦层设置在所述滤光层和所述硬质层之间。
- 根据权利要求3所述的显示屏,其中,所述第一平坦层的组成材料包括丙烯醛基、环氧基树脂和硅树脂。
- 根据权利要求2所述的显示屏,其中,所述显示屏还包括触控层,所述触控层设置在所述滤光层和所述硬质层之间,或所述触控层设置在所述薄膜封装层和所述滤光层之间。
- 根据权利要求5所述的显示屏,其中,所述显示屏还包括第二平坦层,当所述触控层设置在所述滤光层和所述硬质层之间时,所述第二平坦层设置在所述触控层和所述硬质层之间;当所述触控层设置在所述薄膜封装层和所述滤光层之间时,所述第二平坦层设置在所述触控层和所述滤光层之间。
- 根据权利要求2所述的显示屏,其中,所述显示屏包括发光区和非发光区,所述滤光单元与所述发光区相对设置,所述黑色矩阵与所述非发光区相对设置。
- 根据权利要求1所述的显示屏,其中,所述显示屏还包括第三平坦层,所述第三平坦层设置在所述阵列基板和所述发光器件层之间。
- 根据权利要求1所述的显示屏,其中,所述硬质层的组成材料包括:丙烯醛基、聚甲基丙烯酸甲酯、二氧化硅、尿烷、环氧基树脂以及硅烷。
- 根据权利要求1所述的显示屏,其中,硬质层通过沉积工艺或转印工艺设置在所述薄膜封装层上。
- 一种显示装置,其包括显示屏,所述显示屏包括;阵列基板;发光器件层,设置在所述阵列基板上;薄膜封装层,设置在所述发光器件层上;硬质层,设置在所述薄膜封装层上;其中,所述硬质层不通过胶体层固定在所述薄膜封装层上。
- 根据权利要求11所述的显示装置,其中,所述显示屏还包括滤光层;所述滤光层设置在所述薄膜封装层和所述硬质层之间,所述滤光层包括:多个滤光单元;多个黑色矩阵,每一黑色矩阵设置在相邻两滤光单元之间。
- 根据权利要求12所述的显示装置,其中,所述显示屏还包括第一平坦层,所述第一平坦层设置在所述滤光层和所述硬质层之间。
- 根据权利要求13所述的显示装置,其中,所述第一平坦层的组成材料包括丙烯醛基、环氧基树脂和硅树脂。
- 根据权利要求12所述的显示装置,其中,所述显示屏还包括触控层,所述触控层设置在所述滤光层和所述硬质层之间,或所述触控层设置在所述薄膜封装层和所述滤光层之间。
- 根据权利要求15所述的显示装置,其中,所述显示屏还包括第二平坦层,当所述触控层设置在所述滤光层和所述硬质层之间时,所述第二平坦层设置在所述触控层和所述硬质层之间;当所述触控层设置在所述薄膜封装层和所述滤光层之间时,所述第二平坦层设置在所述触控层和所述滤光层之间。
- 根据权利要求12所述的显示装置,其中,所述显示屏包括发光区和非发光区,所述滤光单元与所述发光区相对设置,所述黑色矩阵与所述非发光区相对设置。
- 根据权利要求11所述的显示装置,其中,所述显示屏还包括第三平坦层,所述第三平坦层设置在所述阵列基板和所述发光器件层之间。
- 根据权利要求11所述的显示装置,其中,所述硬质层的组成材料包括:丙烯醛基、聚甲基丙烯酸甲酯、二氧化硅、尿烷、环氧基树脂以及硅烷。
- 根据权利要求11所述的显示装置,其中,硬质层通过沉积工艺或转印工艺设置在所述薄膜封装层上。
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