WO2019019488A1 - 柔性oled显示器件及制作方法 - Google Patents

柔性oled显示器件及制作方法 Download PDF

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Publication number
WO2019019488A1
WO2019019488A1 PCT/CN2017/111254 CN2017111254W WO2019019488A1 WO 2019019488 A1 WO2019019488 A1 WO 2019019488A1 CN 2017111254 W CN2017111254 W CN 2017111254W WO 2019019488 A1 WO2019019488 A1 WO 2019019488A1
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Prior art keywords
photoresist
film layer
layer
separator
substrate
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PCT/CN2017/111254
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English (en)
French (fr)
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张明
王杲祯
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武汉华星光电半导体显示技术有限公司
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Priority to US15/580,093 priority Critical patent/US20190027709A1/en
Publication of WO2019019488A1 publication Critical patent/WO2019019488A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible OLED display device and a method of fabricating the same.
  • OLED Organic Light Emitting Diode
  • LCD Liquid Crystal Display, liquid crystal display
  • OLED display devices are still mainly used for evaporation, which is limited by the deformation problem of the reticle, which makes it difficult to match the panel of the vapor-deposited substrate with the size of the array substrate.
  • Cutting is generally used in the process from the array substrate process to the evaporation process, in order to avoid particles such as debris generated during the cutting process from being brought into the vapor deposition chamber, It is generally protected with a photoresist. Therefore, a layer of photoresist protection is applied on the pixel defining layer, and the stripping agent is used for stripping after cutting.
  • the thickness of the pixel defining layer is generally on the order of um (micrometer). If the thickness is completely prepared by using an inorganic layer, the flexibility of the product may be threatened, and the general pixel defines the layer and the light.
  • the engraving glue is organic material, and the stripping liquid is easy to be peeled off when peeling off the photoresist, which not only pollutes the vapor deposition chamber, but also affects the film formation continuity and stability of the film dispensing.
  • the pixel defining layer and the photoresist are both organic materials, and the stripping solution is stripped of the photoresist. It is easy to be accidentally peeled off, contaminating the vapor deposition chamber, and even affecting the film formation continuity and stability of the film dispensing.
  • the present invention provides a flexible OLED display device and a method of fabricating the same that can prevent a portion of a component in a flexible OLED display device from being erroneously peeled off when the photoresist is stripped using a stripper.
  • the invention provides a method for fabricating a flexible OLED display device, comprising the steps of fabricating an anode metal on a substrate, the method further comprising the steps of:
  • Step S101 preparing an organic film layer on the base substrate, the organic film layer is patterned to form a separation column;
  • Step S102 preparing an inorganic film layer on the substrate, the inorganic film layer is patterned to form a separator covering the isolation column;
  • Step S103 coating a base layer of a first photoresist on the substrate
  • the photomask used for preparing the organic film layer and the photomask used for preparing the inorganic film layer are the same photomask.
  • the step S101 includes: coating a layer of a second photoresist on the organic film layer, exposing and developing the second photoresist to form a second photoresist. a pattern, then etching the portion of the organic film layer that does not cover the second photoresist, and finally stripping the second photoresist on the surface of the organic film layer to form a spacer.
  • the step S102 includes: coating a layer of a third photoresist on the inorganic film layer, exposing and developing the third photoresist to form a third photoresist. And patterning, then etching the portion of the inorganic film layer that does not cover the third photoresist, and finally peeling off the third photoresist on the surface of the inorganic film layer to form a separator.
  • the release film is attached to the surface of the spacer.
  • the anode metal is formed with a plurality of anode plates distributed in an array, the spacer columns being located between the adjacent two anode plates and the corresponding separator.
  • the material of the inorganic film layer is one or a combination of one or more of Al2O3, SiNx, and SiOx.
  • the thickness of the separator is less than the thickness of the spacer.
  • the thickness of the separator is less than or equal to 0.5 um.
  • the present invention also provides a method of fabricating another flexible OLED display device, comprising the steps of fabricating an anode metal on a substrate, the method further comprising the steps of:
  • Step S101 preparing an organic film layer on the base substrate, the organic film layer is patterned to form a separation column;
  • Step S102 preparing an inorganic film layer on the substrate, the inorganic film layer is patterned to form a separator covering the isolation column;
  • Step S103 coating a first photoresist on the substrate.
  • the step S101 includes: coating a layer of a second photoresist on the organic film layer, exposing and developing the second photoresist to form a second photoresist. a pattern, then etching the portion of the organic film layer that does not cover the second photoresist, and finally stripping the second photoresist on the surface of the organic film layer to form a spacer.
  • the step S102 includes: coating a layer of a third photoresist on the inorganic film layer, exposing and developing the third photoresist to form a third photoresist. And patterning, then etching the portion of the inorganic film layer that does not cover the third photoresist, and finally peeling off the third photoresist on the surface of the inorganic film layer to form a separator.
  • the release film is attached to the surface of the spacer.
  • the anode metal is formed with a plurality of anode plates distributed in an array, the spacer columns being located between the adjacent two anode plates and the corresponding separator.
  • the material of the inorganic film layer is one or a combination of one or more of Al2O3, SiNx, and SiOx.
  • the thickness of the separator is less than the thickness of the spacer.
  • the thickness of the separator is less than or equal to 0.5 um.
  • a flexible OLED display device fabricated by any of the above methods, comprising: a substrate substrate, an anode layer, a pixel defining layer, a transport layer, a light emitting layer, and a cathode layer, wherein the pixel
  • the defining layer includes a spacer and a separator.
  • the manufacturing method of the flexible OLED display device of the present invention is formed by forming a spacer column and preparing on the substrate prepared with the anode metal. Separating different sub-pixels from a separator on the surface of the spacer, and isolating the photoresist from the two organic materials of the spacer through a thin isolation film. After the cutting operation is completed, the stripping liner is stripped.
  • the isolation column can be protected to prevent the separation column from being peeled off by the stripping liquid, thereby avoiding generation of particles such as debris and avoiding
  • the generated particles such as debris are mixed into the vapor deposition chamber to ensure the cleaning of the vapor deposition chamber and the film formation continuity and stability of the film dispensing, and also make the OLED display device flexible.
  • FIG. 1 is a schematic flow chart of a method for fabricating a flexible OLED display device according to an embodiment of the present invention
  • FIGS. 2a-2f are schematic diagrams showing a preparation process of a flexible OLED display device according to an embodiment of the present invention.
  • the present invention is directed to a flexible OLED display device of the prior art and a manufacturing method thereof.
  • a photoresist is stripped by a stripping agent after a dicing operation, since the pixel defining layer and the photoresist are both organic materials, the stripping liquid is easy to peel off the photoresist.
  • This embodiment can solve the drawbacks of the problem of erroneous peeling, contamination of the vapor deposition chamber, and even film formation continuity and stability of the film dispensing.
  • a specific embodiment of the present invention provides a method for fabricating a flexible OLED display device, the method comprising the steps of preparing an anode metal on a substrate, wherein the method further comprises the following steps:
  • Step S101 preparing an organic film layer on the base substrate, the organic film layer is patterned to form a separation column;
  • Step S102 preparing an inorganic film layer on the substrate, the inorganic film layer is patterned to form a separator covering the isolation column;
  • Step S103 coating a first photoresist on the substrate.
  • a layer of anode metal is first formed on the base substrate 201, and the patterned anode metal forms a plurality of arrayed anode plates 202.
  • the adjacent anode plates 202 have insulation gaps.
  • the anode metal may also be formed on the base substrate 201 by other forms, which is not limited herein.
  • an organic film layer 212 is then coated on the base substrate 210.
  • the organic film layer 212 may also be formed by other forms in the specific embodiment of the present invention.
  • the material from which the organic film layer 212 is formed is an organic material such as an acrylic material or a silicon material.
  • the thickness of the coated organic film layer 212 is greater than the thickness of the anode plate 211.
  • the patterning process in the specific embodiment of the present invention includes: coating, exposure, development, etching, and stripping of the photoresist. Specifically, as shown in FIG. 2c, a second photoresist is coated on the coated organic film layer, and then the coated second photoresist is exposed and developed, and the isolation column 220 needs to be formed. The second photoresist at the position forms a second photoresist pattern, and then etches the portion of the organic film layer that does not cover the second photoresist, and finally removes the remaining surface of the organic film layer The second photoresist forms a spacer pillar 220.
  • the spacer pillar 220 has a cross-sectional shape of a positive trapezoid, and the insulating gap between two adjacent anode plates 221 has a thickness greater than a thickness of the anode plate 221.
  • the cross-sectional shape of the spacer column 220 may also be other shapes. The specific embodiment of the present invention does not limit the specific shape of the cross-section of the spacer column 220.
  • an inorganic film layer 232 is deposited on the substrate substrate 230 on which the spacers 231 are formed.
  • the thickness of the inorganic film layer 232 is smaller than the thickness of the organic film layer.
  • An inorganic material which can form a uniform inorganic film such as aluminum oxide (Al2O3), silicon nitride (SiNx) or silicon oxide (SiOx), is formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD) deposition. .
  • the photomask used in the preparation of the inorganic film layer 232 is the same mask as the photomask used to prepare the organic film layer, and a layer of third photoresist is coated on the inorganic film layer 232.
  • the third photoresist is exposed and developed, and the third photoresist at a position where the isolation film is required to be formed is left to form a third photoresist pattern, and then the inorganic film layer 232 is not covered with the third light.
  • the portion of the glue is etched, and finally the third photoresist remaining on the surface of the inorganic film layer 232 is peeled off to form a separator.
  • the isolation film 241 is deposited on the surface of the spacer 240 and has a thickness smaller than the thickness of the spacer 240.
  • the thickness of the isolation film 241 is preferably 0.5 um or less.
  • a first photoresist 253 is then coated on the base substrate 250 for protection to complete substrate fabrication.
  • the isolation film 252 covers the surface of the isolation pillar 251 to isolate the isolation pillar 251 from the first photoresist 253 on the surface of the isolation film 252.
  • the isolation pillar 251 and the isolation film 252 together form a pixel defining layer 254 for separating different sub-pixels.
  • a light-emitting layer is formed on the base substrate 250 on which the pixel defining layer 254 is formed.
  • the preparation of the light-emitting layer is still mainly performed by evaporation.
  • the specific manufacturing method of the light-emitting layer and the existing method are The technology is the same and will not be described here.
  • the evaporation process the deformation of the mask is limited, and the panel of the vapor-deposited substrate is difficult to match the size of the array substrate.
  • the cutting operation is performed during the process from the array substrate to the evaporation process, during which the operation is performed.
  • the first photoresist 253 on the surface of the base substrate 250 is peeled off with a stripping liquid, and the isolation pillar 251 and the first photoresist 253 are The organic materials are isolated, so that the peeling liquid stops peeling off when the peeling liquid is peeled off, no erroneous peeling occurs, and the pixel defining layer 254 maintains its integrity, and the vapor deposition chamber is ensured in the vapor deposition. Film formation continuity and stability for cleaning and subsequent film dispensing.
  • the pixel defining layer 254 is composed of a thicker of the isolation pillar 251 and a thinner of the isolation film 252 due to the isolation.
  • the thickness of the film 252 is very thin, and at the same time, the OLED display device is ensured flexibility while ensuring that the release agent is not peeled off by mistake.
  • the pixel defining layer 254 is not erroneously peeled off by the stripping agent, thus maintaining its set thickness and integrity. During the evaporation of the luminescent layer, the effective isolation of the pixel defining layer 254 ensures the individual The luminescent layer of the pixel can be accurately evaporated to each sub-pixel unit, and the problem of color mixing or crosstalk does not occur between the sub-pixel units, and the cleaning of the evaporation chamber is ensured, thereby improving the display effect of the flexible OLED display device. Also because the pixel defining layer 254 ensures its integrity, the stability of the film dispensing layer conforming to the surface of the pixel defining layer 254 is improved in subsequent processes.
  • a method for fabricating a flexible OLED display device further includes: forming a cathode layer on a substrate prepared with a light-emitting layer, the cathode layer having a position corresponding to a position of the anode layer, wherein the light-emitting layer is located at the anode Between the layer and the cathode layer, the specific manufacturing method of the cathode layer is the same as the prior art, and details are not described herein again.
  • a hole injection layer and/or a hole transport layer, a hole injection layer and/or a hole transport layer may be formed between the anode layer and the light-emitting layer, and a specific method for fabricating the hole injection layer and/or the hole transport layer
  • the technology is the same and will not be described here.
  • the specific embodiment of the present invention can also form an electron injecting layer and/or an electron transporting layer between the light emitting layer and the cathode layer.
  • the specific manufacturing method of the electron injecting layer and/or the electron transporting layer is the same as that in the prior art, and details are not described herein again.
  • a flexible OLED display device is prepared by the above fabrication method, comprising a substrate substrate, an anode layer, a pixel defining layer, a light emitting layer and a cathode layer, the pixel defining layer comprising an isolation pillar and a separator.

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Abstract

一种柔性OLED显示器件及其制作方法，包括以下步骤：首先，在制备有阳极金属的衬底基板上制备一有机膜层，经图案化后形成隔离柱（S101）；然后，在衬底基板上制备一无机膜层，无机膜层经图案化后形成覆盖隔离柱的隔离膜（S102）；最后，在衬底基板上涂覆一层第一光刻胶（S103）。

Description

柔性OLED显示器件及制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性OLED显示器件及其制作方法。
 背景技术
OLED (Organic Light Emitting Diode，有机发光二极管)显示器件相对于LCD (Liquid Crystal Display，液晶显示屏)，具有自发光、反应快、视角广、亮度高、色彩艳、轻薄等优点。
随着柔性OLED受欢迎程度的增大，关于柔性OLED的开发也日益丰富。在目前OLED显示器件仍主流采用蒸镀，受限于光罩的形变问题导致蒸镀基板的面板难以与阵列基板尺寸相匹配。在从阵列基板制程到蒸镀制程时一般会用到裁切，为避免裁切过程中产生的碎屑等粒子带入到蒸镀腔, 一般会用光刻胶保护。因此先会在像素界定层上涂覆一层光刻胶保护，在切割后采用剥离剂剥离。
为减少电致发光层蒸镀混色/串扰的问题，像素界定层的厚度一般在um（微米）量级，此厚度若完全采用无机层制备则产品的柔性会受到威胁，一般像素界定层和光刻胶都为有机材料，剥离液剥离光刻胶时容易误剥离，这不仅会污染蒸镀腔，甚至会影响薄膜分装的成膜连续性和稳定性。
综上所述，现有技术的柔性OLED显示器件的制作方法，在切割操作后采用剥离剂剥离光刻胶时，因像素界定层和光刻胶都为有机材料，剥离液剥离光刻胶时容易误剥离，污染蒸镀腔，甚至影响薄膜分装的成膜连续性和稳定性。
 技术问题
本发明提供一种柔性OLED显示器件及其制作方法，能够在使用剥离液剥离光刻胶时避免柔性OLED显示器件中的部分部件被误剥离。
 技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种柔性OLED显示器件的制作方法，包括在衬底基板上制作阳极金属的步骤，所述方法还包括以下步骤：
步骤S101、在所述衬底基板上制备一有机膜层，所述有机膜层经图案化后形成隔离柱；
步骤S102、在所述衬底基板上制备一无机膜层，所述无机膜层经图案化后形成覆盖所述隔离柱的隔离膜；
步骤S103、在所述衬底基板上涂覆一层第一光刻胶；
其中，制备所述有机膜层所采用的光罩和制备所述无机膜层所采用的光罩为同一光罩。
根据本发明一优选实施例，所述步骤S101包括：在所述有机膜层上涂覆一层第二光刻胶，将所述第二光刻胶进行曝光、显影以形成第二光刻胶图案，然后将所述有机膜层未覆盖所述第二光刻胶的部分进行蚀刻，最后将所述有机膜层表面的所述第二光刻胶进行剥离，形成隔离柱。
根据本发明一优选实施例，所述步骤S102包括：在所述无机膜层上涂覆一层第三光刻胶，将所述第三光刻胶进行曝光、显影以形成第三光刻胶图案，然后将所述无机膜层未覆盖所述第三光刻胶的部分进行蚀刻，最后将所述无机膜层表面的所述第三光刻胶进行剥离，形成隔离膜。
根据本发明一优选实施例，所述隔离膜贴合于所述隔离柱表面。
根据本发明一优选实施例，所述阳极金属形成有阵列分布的多个阳极板，所述隔离柱与对应的所述隔离膜位于相邻两个所述阳极板之间。
根据本发明一优选实施例，所述无机膜层的材料为Al2O3、SiNx、SiOx的一者或一者以上的组合。
根据本发明一优选实施例，所述隔离膜的厚度小于所述隔离柱的厚度。
根据本发明一优选实施例，所述隔离膜的厚度小于或等于0.5um。
本发明还提供另一种柔性OLED显示器件的制作方法，包括在衬底基板上制作阳极金属的步骤，所述方法还包括以下步骤：
步骤S101、在所述衬底基板上制备一有机膜层，所述有机膜层经图案化后形成隔离柱；
步骤S102、在所述衬底基板上制备一无机膜层，所述无机膜层经图案化后形成覆盖所述隔离柱的隔离膜；
步骤S103、在所述衬底基板上涂覆一层第一光刻胶。
根据本发明一优选实施例，所述步骤S101包括：在所述有机膜层上涂覆一层第二光刻胶，将所述第二光刻胶进行曝光、显影以形成第二光刻胶图案，然后将所述有机膜层未覆盖所述第二光刻胶的部分进行蚀刻，最后将所述有机膜层表面的所述第二光刻胶进行剥离，形成隔离柱。
根据本发明一优选实施例，所述步骤S102包括：在所述无机膜层上涂覆一层第三光刻胶，将所述第三光刻胶进行曝光、显影以形成第三光刻胶图案，然后将所述无机膜层未覆盖所述第三光刻胶的部分进行蚀刻，最后将所述无机膜层表面的所述第三光刻胶进行剥离，形成隔离膜。
根据本发明一优选实施例，所述隔离膜贴合于所述隔离柱表面。
根据本发明一优选实施例，所述阳极金属形成有阵列分布的多个阳极板，所述隔离柱与对应的所述隔离膜位于相邻两个所述阳极板之间。
根据本发明一优选实施例，所述无机膜层的材料为Al2O3、SiNx、SiOx的一者或一者以上的组合。
根据本发明一优选实施例，所述隔离膜的厚度小于所述隔离柱的厚度。
根据本发明一优选实施例，所述隔离膜的厚度小于或等于0.5um。
根据本发明的上述目的，还提供一种采用上述任一方法制成的柔性OLED显示器件，包括：衬底基板、阳极层、像素界定层、传输层、发光层以及阴极层，其中所述像素界定层包括隔离柱以及隔离膜。
 有益效果
本发明的有益效果为：相较于现有的柔性OLED显示器件的制作方法，本发明的柔性OLED显示器件的制作方法通过在制备有阳极金属的衬底基板上，形成一层隔离柱以及制备于所述隔离柱表面的一层隔离膜来隔离不同子像素，通过一层较薄的隔离膜将光刻胶与隔离柱两个有机材料进行隔离，在裁切操作完成后，剥离液剥离衬底基板表面的第一光刻胶时，因隔离膜将第一光刻胶与隔离柱相隔离，因此可以保护隔离柱，以免隔离柱被剥离液剥离，从而避免碎屑等粒子的产生以及避免所产生的碎屑等粒子混入至蒸镀腔中，保证蒸镀腔的清洁以及薄膜分装的成膜连续性和稳定性，同时还使OLED显示器件兼具柔性。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的柔性OLED显示器件的制作方法流程原理图；
图2a-图2f为本发明实施例提供的柔性OLED显示器件制备流程示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有技术的柔性OLED显示器件及其制作方法，在切割操作后采用剥离剂剥离光刻胶时，因像素界定层和光刻胶都为有机材料，剥离液剥离光刻胶时容易误剥离，污染蒸镀腔，甚至影响薄膜分装的成膜连续性和稳定性的技术问题，本实施例能够解决该缺陷。
下面结合附图详细介绍本发明具体实施例提供的柔性OLED显示器件的制作方法。
如图 1所示，本发明具体实施例提供了一种柔性OLED显示器件的制作方法，该方法包括在衬底基板上制备阳极金属的步骤，其中，所述方法还包括以下步骤：
步骤S101、在所述衬底基板上制备一有机膜层，所述有机膜层经图案化后形成隔离柱；
步骤S102、在所述衬底基板上制备一无机膜层，所述无机膜层经图案化后形成覆盖所述隔离柱的隔离膜；
步骤S103、在所述衬底基板上涂覆一层第一光刻胶。
下面结合附图详细介绍本发明具体实施例提供的柔性OLED显示器件的制作过程。
如图2a所示，首先在衬底基板201上制作一层阳极金属，经图案化后的所述阳极金属形成多个阵列分布的阳极板202，相邻两所述阳极板202存在绝缘间隙，所述阳极金属还可通过其他形式制作于所述衬底基板201上，在此不作限制。
如图2b所示，接着在所述衬底基板210上涂覆有机膜层212，本发明具体实施例还可通过其他形式形成所述有机膜层212。制成所述有机膜层212的材料为丙烯酸材料或硅材料等有机材料。涂覆的所述有机膜层212的厚度大于所述阳极板211的厚度。
本发明具体实施例中的图案化工艺包括：光刻胶的涂覆、曝光、显影、刻蚀以及光刻胶的剥离的过程。具体地，如图2c所示，在涂覆的有机膜层上涂覆一层第二光刻胶，然后对涂覆的所述第二光刻胶进行曝光、显影，保留需要形成隔离柱220位置处的所述第二光刻胶，形成第二光刻胶图案，接着将所述有机膜层未覆盖所述第二光刻胶的部分进行蚀刻，最后去除所述有机膜层表面剩余的所述第二光刻胶，形成隔离柱220。所述隔离柱220截面形状为正梯形，位于相邻两个所述阳极板221之间的所述绝缘间隙，其厚度大于所述阳极板221的厚度。所述隔离柱220截面形状还可以为其它形状，本发明具体实施例并不对所述隔离柱220截面的具体形状做限定。
如图2d所示，在形成有隔离柱231的衬底基板230上沉积一层无机膜层232，所述无机膜层232的厚度小于所述有机膜层的厚度，所述无机膜层232可采用三氧化二铝（Al2O3），氮化硅（SiNx）或氧化硅（SiOx）等可形成均匀的无机膜的无机材料，通过化学气相沉积法（CVD）或物理气相沉积法（PVD）沉积形成。制备所述无机膜层232所采用的光罩与制备所述有机膜层所采用的光罩为同一光罩，在所述无机膜层232上涂覆一层第三光刻胶，将所述第三光刻胶进行曝光、显影，保留需要形成隔离膜位置处的所述第三光刻胶，以形成第三光刻胶图案，然后将所述无机膜层232未覆盖所述第三光刻胶的部分进行蚀刻，最后将所述无机膜层232表面剩余的所述第三光刻胶进行剥离，形成隔离膜。
如图2e所示，形成的所述隔离膜241沉积于所述隔离柱240表面，其厚度小于所述隔离柱240的厚度，其中，所述隔离膜241的厚度优选为小于等于0.5um。
如图2f所示，之后在所述衬底基板250上涂覆一层第一光刻胶253用以保护，完成基板制作。所述隔离膜252覆盖于所述隔离柱251的表面，使所述隔离柱251与所述隔离膜252表面的所述第一光刻胶253进行隔离。所述隔离柱251与所述隔离膜252共同组成像素界定层254，用以分隔不同子像素。
接着，在制作有所述像素界定层254的所述衬底基板250上制作发光层，所述发光层的制备仍主流采用蒸镀，本发明具体实施例中发光层的具体制作方法与现有技术相同，这里不再赘述。在蒸镀制程中，受限于光罩的形变问题导致蒸镀基板的面板难以与阵列基板尺寸相匹配，在从阵列基板制程到蒸镀制程时一般会进行裁切操作，在此操作过程中因为所述衬底基板250表面有所述第一光刻胶253进行保护，所以产生的碎屑等粒子不易混入到蒸镀腔。在完成裁切操作后，用剥离液剥离所述衬底基板250表面的所述第一光刻胶253，由于所述隔离膜252将所述隔离柱251与所述第一光刻胶253两个有机材料进行隔离，所以所述剥离液剥离到所述隔离膜252时停止剥离，不会发生误剥离，使所述像素界定层254保持了其完整性，保证在蒸镀中蒸镀腔的清洁以及后续薄膜分装的成膜连续性和稳定性。
另外，因所述隔离膜252的柔性较差，所以所述像素界定层254以一层较厚的所述隔离柱251以及一层较薄的所述隔离膜252的形式组成，因所述隔离膜252的厚度很薄，在保证剥离剂不会误剥离的情况下，同时使OLED显示器件保证了柔韧性。
所述像素界定层254不会被剥离剂误剥离，因此保持了其设定的厚度及完整性，在蒸镀发光层的过程中，因有所述像素界定层254的有效隔离，保证各子像素的发光层能精准蒸镀到各子像素单元，所述各子像素单元间不会出现混色或者串扰的问题，也保证蒸镀腔的清洁，提高了柔性OLED显示器件的显示效果。也因所述像素界定层254保证了其完整性，在后续的制程中，贴合于所述像素界定层254表面的薄膜分装层的稳定性得以提升。
一种柔性OLED显示器件的制备方法还包括：在制作有发光层的衬底基板上制作阴极层，所述阴极层的位置与所述阳极层的位置相对应，所述发光层位于所述阳极层与所述阴极层之间，所述阴极层的具体制作方法与现有技术相同，这里不再赘述。
另外，本发明具体实施例还可以在所述阳极层和发光层之间制作空穴注入层和/或空穴传输层，空穴注入层和/或空穴传输层的具体制作方法与现有技术相同，这里不再赘述。本发明具体实施例还可以在发光层和阴极层之间制作电子注入层和/或电子传输层，电子注入层和/或电子传输层的具体制作方法与现有技术相同，这里不再赘述。
一种柔性OLED显示器件，采用上述的制作方法制备而成，其中包括衬底基板、阳极层、像素界定层、发光层以及阴极层，所述像素界定层包括隔离柱以及隔离膜。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (17)

  1. 一种柔性OLED显示器件的制作方法，包括在衬底基板上制作阳极金属的步骤，其中，所述方法还包括以下步骤：
    步骤S101、在所述衬底基板上制备一有机膜层，所述有机膜层经图案化后形成隔离柱；
    步骤S102、在所述衬底基板上制备一无机膜层，所述无机膜层经图案化后形成覆盖所述隔离柱的隔离膜；
    步骤S103、在所述衬底基板上涂覆一层第一光刻胶；
    其中，制备所述有机膜层所采用的光罩和制备所述无机膜层所采用的光罩为同一光罩。
  2. 根据权利要求1所述的制作方法，其中，所述步骤S101包括：
    在所述有机膜层上涂覆一层第二光刻胶，将所述第二光刻胶进行曝光、显影以形成第二光刻胶图案，然后将所述有机膜层未覆盖所述第二光刻胶的部分进行蚀刻，最后将所述有机膜层表面的所述第二光刻胶进行剥离，形成隔离柱。
  3. 根据权利要求2所述的制作方法，其中，所述步骤S102包括：
    在所述无机膜层上涂覆一层第三光刻胶，将所述第三光刻胶进行曝光、显影以形成第三光刻胶图案，然后将所述无机膜层未覆盖所述第三光刻胶的部分进行蚀刻，最后将所述无机膜层表面的所述第三光刻胶进行剥离，形成隔离膜。
  4. 根据权利要求1所述的制作方法，其中，所述隔离膜贴合于所述隔离柱表面。
  5. 根据权利要求4所述的制作方法，其中，所述阳极金属形成有阵列分布的多个阳极板，所述隔离柱与对应的所述隔离膜位于相邻两个所述阳极板之间。
  6. 根据权利要求1所述的制作方法，其中，所述无机膜层的材料为Al2O3、SiNx、SiOx的一者或一者以上的组合。
  7. 根据权利要求1所述的制作方法，其中，所述隔离膜的厚度小于所述隔离柱的厚度。
  8. 根据权利要求7所述的制作方法，其中，所述隔离膜的厚度小于或等于0.5um。
  9. 一种柔性OLED显示器件的制作方法，包括在衬底基板上制作阳极金属的步骤，其中，所述方法还包括以下步骤：
    步骤S101、在所述衬底基板上制备一有机膜层，所述有机膜层经图案化后形成隔离柱；
    步骤S102、在所述衬底基板上制备一无机膜层，所述无机膜层经图案化后形成覆盖所述隔离柱的隔离膜；
    步骤S103、在所述衬底基板上涂覆一层第一光刻胶。
  10. 根据权利要求9所述的制作方法，其中，所述步骤S101包括：
    在所述有机膜层上涂覆一层第二光刻胶，将所述第二光刻胶进行曝光、显影以形成第二光刻胶图案，然后将所述有机膜层未覆盖所述第二光刻胶的部分进行蚀刻，最后将所述有机膜层表面的所述第二光刻胶进行剥离，形成隔离柱。
  11. 根据权利要求10所述的制作方法，其中，所述步骤S102包括：
    在所述无机膜层上涂覆一层第三光刻胶，将所述第三光刻胶进行曝光、显影以形成第三光刻胶图案，然后将所述无机膜层未覆盖所述第三光刻胶的部分进行蚀刻，最后将所述无机膜层表面的所述第三光刻胶进行剥离，形成隔离膜。
  12. 根据权利要求9所述的制作方法，其中，所述隔离膜贴合于所述隔离柱表面。
  13. 根据权利要求12所述的制作方法，其中，所述阳极金属形成有阵列分布的多个阳极板，所述隔离柱与对应的所述隔离膜位于相邻两个所述阳极板之间。
  14. 根据权利要求9所述的制作方法，其中，所述无机膜层的材料为Al2O3、SiNx、SiOx的一者或一者以上的组合。
  15. 根据权利要求9所述的制作方法，其中，所述隔离膜的厚度小于所述隔离柱的厚度。
  16. 根据权利要求15所述的制作方法，其中，所述隔离膜的厚度小于或等于0.5um。
  17. 一种根据权利要求1所述的制作方法制成的柔性OLED显示器件，其中，所述柔性OLED显示器件包括衬底基板、阳极层、像素界定层、传输层、发光层以及阴极层，其中所述像素界定层包括隔离柱以及隔离膜。
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