WO2018014554A1 - 掩膜板及其制作方法 - Google Patents

掩膜板及其制作方法 Download PDF

Info

Publication number
WO2018014554A1
WO2018014554A1 PCT/CN2017/074403 CN2017074403W WO2018014554A1 WO 2018014554 A1 WO2018014554 A1 WO 2018014554A1 CN 2017074403 W CN2017074403 W CN 2017074403W WO 2018014554 A1 WO2018014554 A1 WO 2018014554A1
Authority
WO
WIPO (PCT)
Prior art keywords
opening
graphic
frame
plate
strips
Prior art date
Application number
PCT/CN2017/074403
Other languages
English (en)
French (fr)
Inventor
吕守华
李宝军
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to EP17743236.6A priority Critical patent/EP3489755B1/en
Priority to US15/548,832 priority patent/US10663857B2/en
Publication of WO2018014554A1 publication Critical patent/WO2018014554A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • Embodiments of the present invention relate to a mask and a method of fabricating the same.
  • the mask is used to fabricate the desired pattern, which is widely used in the patterning process of various electronic products such as transistors, liquid crystal panels, and OLED (Organic Light Emitting Diode) panels.
  • the lithography process and the evaporation process are relatively common techniques in the patterning process. For example, in a photolithography process, the film may be exposed by a mask, followed by development and etching to obtain a desired pattern; for example, in an evaporation process, the material may be heated to a gaseous state and allowed to It is plated onto the substrate or workpiece through the mask to obtain the desired pattern.
  • At least one embodiment of the present invention provides a mask comprising: a frame including a hollow portion and a bezel surrounding the hollow portion; an opening plate disposed on the frame and including an opening and surrounding the opening a body corresponding to the hollow portion, the body connecting the frame; and a graphic board disposed on the opening plate and including a graphic portion and a non-graphic portion located at a periphery of the graphic portion,
  • the pattern portion corresponds to the opening
  • the non-pattern portion is connected to the body of the aperture plate
  • the non-pattern portion and the frame are spaced apart from each other at the frame.
  • the surface of the frame facing the graphic board is flat at a position where the surface overlaps the graphic board.
  • a portion of the graphic board that overlaps the bezel is located within a region of the body of the apertured plate.
  • the opening plate includes a plurality of opening strips each having the opening and extending along the first direction, the plurality of opening strips being sequentially arranged in a second direction, the second direction Intersecting with the first direction.
  • each of the opening strips includes a first thinned portion and a second thinned portion respectively located on opposite sides of the open strip, the first thinned portion and the second thinned portion being along the first Arranged in two directions and Both extend in the first direction, and adjacent thinned portions of adjacent open strips overlap each other.
  • the sum of the thicknesses of the thinned portions that overlap each other is equal to the thickness of the open strip.
  • each of the opening strips has a width of 50 to 130 mm.
  • the graphics board includes a plurality of graphics strips, each of the graphics strips including the graphics portion and extending along the first direction, the plurality of graphics strips being sequentially arranged along the second direction.
  • each graphic strip has a width that is less than or equal to the width of its corresponding opening strip.
  • the graphics board includes a plurality of graphics strips, each of the graphics strips extending in the first direction, the plurality of graphics strips being sequentially arranged in a second direction, the second direction intersecting the first direction.
  • the material of at least one of the aperture plate and the pattern plate is Invar.
  • an orthographic projection of the graphics portion of the graphics board on the aperture plate is located within a corresponding opening.
  • At least one embodiment of the present invention also provides a method of fabricating a mask, comprising: providing an opening plate on the frame, the frame including a hollow portion and a frame surrounding the hollow portion, the opening plate including an opening And a body surrounding the opening, the opening corresponding to the hollow portion, the body connecting the frame; and a graphic board disposed on the opening plate, the graphic board including a graphic portion and the graphic portion a peripheral non-pattern portion, the pattern portion corresponding to the opening, the non-pattern portion connecting the body of the aperture plate, and the non-pattern portion and the frame being spaced apart from each other at the frame.
  • the opening and body of the apertured plate are formed by a patterning process of the metal layer.
  • Figure 1a is a top plan view of a metal mask
  • Figure 1b is a top plan view of the frame included in the metal mask of Figure 1a;
  • FIG. 2a is a schematic top view of a mask according to an embodiment of the present invention.
  • Figure 2b is a partial cross-sectional view taken along line A-A of Figure 2a;
  • FIG. 3 is a top plan view of a frame included in a mask according to an embodiment of the present invention.
  • FIG. 4a is a top plan view of an opening strip in an opening plate included in a mask according to an embodiment of the present invention. intention;
  • 4b is a cross-sectional view showing an opening strip in an opening plate included in a mask according to an embodiment of the present invention
  • FIG. 5 is a schematic top plan view of a graphic strip in a graphic board included in a mask according to an embodiment of the present invention
  • FIG. 6 is a cross-sectional view of a metal layer for fabricating an apertured plate according to an embodiment of the present invention.
  • the metal mask usually includes a frame 1 and a shielding strip 2, a support strip 3 and an effective metal mask strip 4 disposed on the frame 1.
  • the effective metal mask strip 4 is provided with a pattern portion 4a which is, for example, an opening and is located in a region defined by the intersection of the barrier strip 2 and the support strip 3, and the material passes through the pattern portion of the effective metal mask strip 4 during the evaporation process.
  • the shielding strip 2 is located between adjacent effective metal mask strips 4 for shielding the material from material penetration between the effective metal mask strips 4; the support strips 3 It is used to support the effective metal mask strip 4 to prevent it from sagging and/or to reduce its amount of sagging.
  • the fabrication process of the metal mask shown in FIG. 1a generally includes: the shielding strip 2 and the support strip 3
  • the frame 1 is welded in sequence, after which the effective metal mask strip 4 is welded to the frame 1. Since the effective metal mask strip 4 is disposed on the side of the shielding strip 2 and the support strip 3 away from the frame 1, in order to avoid the thickness of the shielding strip 2 and the supporting strip 3 when the effective metal mask strip 4 is welded to the frame 1.
  • the effective metal mask strip 4 is affected by the bending.
  • the shield weld groove 2a for accommodating the shield strip 2 and the support weld groove 3a for accommodating the support strip 3 need to be etched in the frame 1.
  • the width and pitch of the effective metal mask strip 4 and the pitch between adjacent support strips 3 are also generally changed correspondingly, so that the original frame is discarded, thereby causing Increased production costs.
  • At least one embodiment of the present invention provides a mask 10 comprising a frame 11, an opening plate 12 disposed on the frame 11, and a graphic plate 13 disposed on the opening plate 12.
  • the frame 11 includes a hollow portion 111 and a bezel 112 surrounding the hollow portion 111.
  • the opening plate 12 includes an opening 121 and a body 122 surrounding the opening 121.
  • the opening 121 corresponds to the hollow portion 111 of the frame 11.
  • the body 122 connects the frame 112 of the frame 11 (for example, the body 122 is soldered to the frame 112).
  • the graphic board 13 is laminated with the opening board 12 and includes a graphic portion 131 and a non-graphic portion 132 located at the periphery of the graphic portion 131; the graphic portion 131 corresponds to the opening 121 of the opening plate 12 and an orthographic projection on the opening plate 12 is located at the corresponding opening 121, to prevent the graphic portion 131 from being blocked by the non-opening portion 122 of the opening plate 12; the non-graphic portion 132 is connected to the body 122 of the opening plate 12 (for example, the non-graphic portion 132 is soldered to the body 122), and the non-graphic portion 132 is The frames 11 are spaced apart from each other at the bezel 112.
  • a connection position (for example, a welding position) of the non-pattern portion 132 of the graphic board 13 and the body 122 of the opening plate 12 may be located at the bezel 112.
  • the connection position (for example, the welding position) of the non-pattern portion 132 of the pattern board 13 and the body 122 of the opening board 12 may be located in the frame 11 .
  • the hollow portion 111 is provided to improve the connection reliability between the opening plate 12 and the pattern plate 13.
  • the number of the openings 121 in the opening plate 12 and the graphic portion 131 in the graphic plate 13 may be at least one, and FIG. 2a is for illustrative purposes only.
  • the mask provided by the embodiment of the present invention may be a metal mask used in an evaporation process.
  • OLED Organic Light Emitting Diode
  • each of the pattern portions 131 included in the mask 13 can be used to form a pattern of an organic light emitting layer of an OLED display panel.
  • the graphic portion 131 of the graphic board 13 includes a plurality of occlusion regions (shown as black squares in Fig.
  • the occlusion regions are alternated with the non-occlusion regions.
  • the material can pass through the non-occluded area but not through the occlusion area, so that the material can form a desired pattern after passing through the pattern portion 131 and being evaporated onto the substrate.
  • the mask provided by the embodiment of the present invention can also be used to fabricate other types of display panels or other devices that involve a mask.
  • the apertured panel 12 can serve to support the graphics panel 13 and/or function to shield the material during vapor deposition of the material.
  • the opening plate 12 in order to support the graphic board 13 to reduce the amount of sag, can be adjusted by the tensile force during welding so that the amount of sag is less than or equal to the amount of sag of the pattern board 13.
  • the pattern plate 13 in order to occlude the material during the material evaporation process, as shown in FIG. 2a, in the second direction, the pattern plate 13 can be made not to extend beyond the area of the opening plate 12.
  • the thickness of the opening plate 12 may be greater than the thickness of the graphic plate 13 so that the opening plate 12 provides a better supporting effect on the graphic plate 13.
  • the thickness of the opening plate 12 may be 30 to 100 ⁇ m; and/or the thickness of the graphic plate 13 may be It is 15 to 40 microns.
  • the material of at least one of the opening plate 12 and the pattern plate 13 may be an Invar alloy because the properties of the Invar alloy are stable, and the effect on the film formed by vapor deposition is small.
  • the materials of the opening plate 12 and the graphic plate 13 include, but are not limited to, Invar.
  • FIG. 3 is a top plan view of a frame included in the mask of the embodiment of the present invention.
  • the frame 112 of the frame 11 is not provided with the shielding soldering groove 2a and the supporting welding groove 3a as shown in FIG. 1b.
  • the surface 112a of the frame 11 facing the graphic board 13 is flat at any position where the surface 112a overlaps the graphic board 13, as shown in Fig. 2b.
  • the mask provided by the embodiment of the invention does not include a soldering groove in the frame, the processing cost of the soldering groove can be saved; on the other hand, since it is not necessary to provide a soldering groove in the frame, it is not required when the product model changes.
  • the frame is redesigned so that all types of masks can be used, which further saves production costs.
  • the aperture plate 12 can be flat at the bezel of the frame 11 to facilitate connection of the graphic panel 13 with the aperture panel 12, in which case, for example, as shown in Figures 2a and 2b,
  • the portion of the graphic board 13 that overlaps the bezel 112 may be located within the area of the body 122 of the apertured panel 12.
  • the opening plate 12 may include a plurality of opening strips 120, each of which is provided with an opening 121 (the number of the openings 121 may be at least one) and Extending in the first direction, the plurality of opening strips 120 are sequentially arranged in the second direction, and the second direction intersects the first direction.
  • the graphic board 13 may also include a plurality of graphic strips 130, each of which is provided with a graphic portion 131 (the number of the graphic portions 131 may be at least one) and along the first Extending in one direction, the plurality of graphic strips 130 are sequentially arranged in the second direction.
  • a certain graphic strip 130 is damaged, it only needs to be replaced for repair without replacing the entire graphic board 13, so that the production cost can be further saved.
  • both the graphic board 13 and the opening board 12 include a plurality of strip structures, since the designs of the two are similar, they can be in the same netting machine (the netting machine can make the graphic strips and the opening strips A certain tension is tightened on the frame), saving the investment cost of the equipment.
  • the width W3 of each of the graphic strips 130 can be less than or equal to the width W2 of its corresponding opening strip 120.
  • the opening strip 120 can function to prevent material penetration between the graphic strips 130 during the evaporation process.
  • each of the opening strips 120 and each of the strips 130 may have a width of 50 to 130 mm.
  • each of the opening strips 120 may include a first thinned portion 122a and a second thinned portion 122b respectively located on opposite sides of the open strip 120, and located at The portion 122c between the first and second thinned portions, the first thinned portion 122a and the second thinned portion 122b are arranged in the second direction and both extend in the first direction, and adjacent adjacent strips 120 are subtracted The thin portions overlap each other in a direction perpendicular to the plate faces of the opening plates 12.
  • the opening plate can both realize the function of the shielding material and support the graphic board, so that the shielding strip 2 and the supporting strip 3 in the metal mask shown in FIG. 1a can be omitted.
  • the support and the shielding function are realized by the opening plate, and the opening plate and the graphic plate adopt a similar strip design, compared with the manner in which the support and the shielding function in the metal mask shown in FIG. 1a are separately regulated.
  • the mask provided by the embodiment of the invention enables Support and occlusion can be adjusted synchronously.
  • the first and second thinned portions may be formed by etching a metal strip for forming the opening strip 120.
  • the first thinned portion 122a may be formed by etching the surface 120a of the opening strip 120 facing the frame 11, and the second thinned portion 122b may pass through the facing frame 11 of the open strip 120.
  • the surface 120b is formed by etching.
  • the first and second thinned portions 122a, 122b of the same opening strip 120 may also be formed by etching one surface of the surface 122a and the surface 122b of the opening strip (Fig. 4b
  • Each of the thinned portions is formed by etching the surface 122a as an example) as long as the adjacent thinned portions of the adjacent open strips can be overlapped with each other in the manner as shown in Fig. 2b.
  • the sum of the thicknesses of the mutually overlapping thinned portions of adjacent open strips 120 can be equal to the thickness of the open strips 120, as shown in Figure 2b.
  • the thickness of the first and second thinned portions may be half of the thickness of the opening strip 120.
  • embodiments of the invention include but are not limited thereto.
  • the width w of the first thinned portion 122a and the second thinned portion 122b may be 0.3. ⁇ 0.8 mm. In this way, it is possible to avoid the welding difficulty caused by the thinning portion being too narrow, and the opening strip 120 can be arranged more compactly to improve space utilization.
  • At least one embodiment of the present invention also provides a method of fabricating a mask that can be used to fabricate a mask such as that shown in Figures 2a and 2b.
  • the manufacturing method of the mask provided by the embodiment of the present invention includes: providing an opening plate 12 on the frame 11, the frame 11 including the hollow portion 111 and the frame 112 surrounding the hollow portion 111, and
  • the opening plate 12 includes an opening 121 and a body 122 surrounding the opening 121.
  • the opening 121 corresponds to the hollow portion 111 of the frame 11.
  • the body 122 connects the frame 112 of the frame 11; and a graphic plate 13 is disposed on the opening plate 12 to make the graphic plate 13 and the opening
  • the board 12 is laminated and includes a pattern portion 131 and a non-pattern portion 132 located at the periphery of the pattern portion 131.
  • the pattern portion 131 corresponds to the opening 121
  • the non-pattern portion 132 connects the body 122 of the aperture plate 12, and the non-pattern portion 132 and the frame 11 are in the frame. 112 are spaced apart from each other.
  • the opening plate is connected to the frame
  • the graphic board is connected to the opening plate
  • the non-graphic portion of the graphic board and the frame are at the frame. They are spaced apart from each other such that the non-pattern portion is not in direct contact with the frame, so that it is not necessary to etch a soldering groove in the frame, thereby saving processing cost of the soldering groove; on the other hand, since it is not necessary to provide a soldering groove in the frame, When the product model changes, there is no need to redesign the manufacturing frame, so the mask can be used for all types of masks, which further saves production costs.
  • the opening 121 and the body 122 of the apertured panel 12 can be formed by patterning the metal layer 12a (shown in Figure 6), in which case the body 122 of the apertured panel 12 is an integrally formed structure. See Figure 2b and Figure 4b.
  • the patterning process refers to a process of forming a desired pattern, which includes, for example, a photolithography process or a laser etching process or the like.
  • the photolithography process includes, for example, photoresist coating, photoresist exposure, photoresist development, etching a film using a photoresist pattern, and the like.
  • the opening plate 12 and the frame 11 and the graphic plate 13 can be soldered, that is, the masking plate provided by the embodiment of the present invention comprises: welding the opening plate 12 to the frame 11, and then drawing the graphic The plate 13 is welded to the opening plate 12.
  • the masking plate provided by the embodiment of the present invention comprises: welding the opening plate 12 to the frame 11, and then drawing the graphic The plate 13 is welded to the opening plate 12.
  • other connection methods commonly used in the art can also be employed.
  • the mask provided by the embodiment of the present invention and the manufacturing method thereof have the following advantages.
  • the mask Since it is not necessary to provide a welding groove in the frame, when the product model changes, the mask can be used for all types of masks, and only the opening plate and the graphic board need to be reset, which further saves production cost. .
  • the support and the shielding function can be realized by using one opening plate, thereby eliminating the steps of welding the shielding strip and the supporting strip.
  • the opening plate or the graphic plate all include a plurality of strip structures. When a strip structure is damaged, it is only necessary to replace the strip structure without replacing the entire plate.
  • the open plate and the graphic plate adopt a similar strip design, so that the opening strip and the graphic strip can be welded on the same netting machine to save equipment investment cost; on the other hand, the opening plate can be synchronously adjusted. Support and occlusion.
  • Embodiments of the above mask and the method of fabricating the same can be referred to each other. Further, the features of the embodiments and the embodiments of the present invention may be combined with each other without conflict.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种掩膜板(10)及其制作方法。掩膜板(10)包括：框架(11)，其包括镂空部(111)和围绕镂空部(111)的边框(112)；开口板(12)，其设置于框架(11)上且包括开口(121)和围绕开口(121)的本体(122)，开口(121)对应镂空部(111)，本体(122)连接边框(112)；以及图形板(13)，其设置于开口板(12)上并且包括图形部(131)和位于图形部(131)周边的非图形部(132)，图形部(131)对应开口(121)，非图形部(132)连接开口板(12)的本体(122)，并且非图形部(132)与框架(11)在边框(112)处彼此间隔开。掩膜板可以节省生产成本。

Description

掩膜板及其制作方法 技术领域
本发明的实施例涉及一种掩膜板及其制作方法。
背景技术
掩膜板用于制作需要的图案，其在晶体管、液晶面板、OLED(有机发光二极管)面板等各类电子产品中的图案制作过程中被广泛应用。光刻工艺和蒸镀工艺是图案制作过程中比较常用的技术。例如，在光刻工艺中，可以利用掩膜板对薄膜进行曝光操作，之后进行显影和刻蚀等步骤得到需要的图案；例如，在蒸镀工艺中，可以将材料加热至气态并使其在透过掩膜板后镀到基板或工件上，从而得到需要的图案。
发明内容
本发明的至少一个实施例提供一种掩膜板，其包括：框架，其包括镂空部和围绕所述镂空部的边框；开口板，其设置于所述框架上且包括开口和围绕所述开口的本体，所述开口对应所述镂空部，所述本体连接所述边框；以及图形板，其设置于所述开口板上并且包括图形部和位于所述图形部周边的非图形部，所述图形部对应所述开口，所述非图形部连接所述开口板的本体，并且所述非图形部与所述框架在所述边框处彼此间隔开。
例如，所述框架的面向所述图形板的表面在所述表面与所述图形板重叠的位置处是平坦的。
例如，所述图形板的与所述边框重叠的部分位于所述开口板的本体所在区域之内。
例如，所述开口板包括多个开口条，每个开口条中都设置有所述开口并且沿所述第一方向延伸，所述多个开口条沿第二方向依次排列，所述第二方向与所述第一方向相交。
例如，每个开口条包括分别位于所述开口条的相对的两侧的第一减薄部和第二减薄部，所述第一减薄部和所述第二减薄部沿所述第二方向排列并且 都沿所述第一方向延伸，相邻的开口条的相邻的减薄部彼此重叠。
例如，所述彼此重叠的减薄部的厚度之和等于所述开口条的厚度。
例如，每个开口条的宽度为50～130毫米。
例如，所述图形板包括多个图形条，每个图形条都包括所述图形部并且沿所述第一方向延伸，所述多个图形条沿所述第二方向依次排列。
例如，每个图形条的宽度都小于或等于其对应的开口条的宽度。
例如，所述图形板包括多个图形条，每个图形条沿所述第一方向延伸，所述多个图形条沿第二方向依次排列，所述第二方向与所述第一方向相交。
例如，所述开口板和所述图形板中的至少一个的材料为因瓦合金。
例如，所述图形板的图形部在所述开口板上的正投影位于对应的开口之内。
本发明的至少一个实施例还提供一种掩膜板的制作方法，其包括：在框架上设置开口板，使所述框架包括镂空部和围绕所述镂空部的边框，所述开口板包括开口和围绕所述开口的本体，所述开口对应所述镂空部，所述本体连接所述边框；以及在所述开口板上设置图形板，使所述图形板包括图形部和位于所述图形部周边的非图形部，所述图形部对应所述开口，所述非图形部连接所述开口板的本体，并且所述非图形部与所述框架在所述边框处彼此间隔开。
例如，所述开口板的开口和本体通过对金属层进行构图工艺形成。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1a为一种金属掩膜板的俯视示意图；
图1b为图1a中金属掩膜板包括的框架的俯视示意图；
图2a为本发明实施例提供的掩膜板的俯视示意图；
图2b为沿图2a中A-A线的局部剖视示意图；
图3为本发明实施例提供的掩膜板包括的框架的俯视示意图；
图4a为本发明实施例提供的掩膜板包括的开口板中的开口条的俯视示 意图；
图4b为本发明实施例提供的掩膜板包括的开口板中的开口条的剖视示意图；
图5为本发明实施例提供的掩膜板包括的图形板中的图形条的俯视示意图；
图6为本发明实施例提供的用于制作开口板的金属层的剖视示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
以用于蒸镀工艺中的金属掩膜板为例，如图1a所示，金属掩膜板通常包括框架1以及设置在框架1上的遮挡条2、支撑条3和有效金属掩膜条4。有效金属掩膜条4设置有图形部4a，图形部4a例如为开口并位于遮挡条2和支撑条3交叉限定的区域内，材料在蒸镀过程中透过有效金属掩膜条4的图形部4a之后可在基板上形成需要的图形；遮挡条2位于相邻的有效金属掩膜条4之间，用于对材料进行遮挡以防止有效金属掩膜条4之间发生材料渗透；支撑条3用于支撑有效金属掩膜条4以防止其下垂和/或减小其下垂量。
图1a所示的金属掩膜板的制作过程通常包括：将遮挡条2和支撑条3 依次焊接在框架1上，之后将有效金属掩膜条4焊接在框架1上。由于有效金属掩膜条4设置在遮挡条2和支撑条3的远离框架1的一侧，为了避免在将有效金属掩膜条4焊接在框架1上时因遮挡条2和支撑条3的厚度影响而造成的有效金属掩膜条4弯曲，如图1b所示，需要在框架1中刻蚀出用于容纳遮挡条2的遮挡焊接槽2a和用于容纳支撑条3的支撑焊接槽3a。但是，当产品型号发生变化时，有效金属掩膜条4的宽度和节距(Pitch)以及相邻支撑条3之间的节距等也通常相应地变化，使得原本的框架被弃置，进而导致生产成本的提高。
如图2a和图2b所示，本发明的至少一个实施例提供一种掩膜板10，其包括框架11、设置于框架11上的开口板12以及设置于开口板12上的图形板13。框架11包括镂空部111和围绕镂空部111的边框112。开口板12包括开口121和围绕开口121的本体122，开口121对应框架11的镂空部111，本体122连接框架11的边框112(例如本体122与边框112焊接连接)。图形板13与开口板12层叠设置并且包括图形部131和位于图形部131周边的非图形部132；图形部131对应开口板12的开口121并且在开口板12上的正投影位于该对应的开口121之内，以避免图形部131被开口板12的非开口部122遮挡；非图形部132连接开口板12的本体122(例如非图形部132与本体122焊接连接)，并且非图形部132与框架11在边框112处彼此间隔开。
例如，图形板13的非图形部132与开口板12的本体122的连接位置(例如焊接位置)可以位于边框112处。例如，在此基础上，由于图形板13和开口板12都为面状结构，因此图形板13的非图形部132和开口板12的本体122的连接位置(例如焊接位置)还可以位于框架11的镂空部111处，以提高开口板12与图形板13之间的连接可靠性。
需要说明的是，开口板12中的开口121和图形板13中的图形部131的数量都可以为至少一个，图2a仅用于示例性说明。例如，本发明实施例提供的掩膜板可以为用于蒸镀工艺中的金属掩膜板。以OLED(有机发光二极管)的有机蒸镀镀膜技术为例，掩膜板包括的图形板13中的每个图形部131可以用于制作一个OLED显示面板的有机发光层的图案。图形板13的图形部131包括多个遮挡区(如图2a中的黑色方格所示)和多个非遮挡区(如图2a中的白色方格所示)，遮挡区与非遮挡区交替设置；在材料的蒸镀过程中，材 料可以透过非遮挡区但不能透过遮挡区，从而材料在透过该图形部131并且蒸镀到基板上之后可以形成需要的图案。当然，本发明实施例提供的掩膜板也可以用于制作其它类型的显示面板或者其它制作过程涉及掩模板的装置。
在本发明实施例中，开口板12可以起到支撑图形板13和/或起到在材料蒸镀过程中遮挡材料的作用。例如，为了对图形板13起到支撑作用以减小其下垂量，开口板12在焊接时可通过拉伸力的调整，使其下垂量小于或等于图形板13的下垂量。例如，为了实现在材料蒸镀过程中对材料进行遮挡，如图2a所示，在第二方向上，可以使图形板13不超出开口板12所在区域。
例如，开口板12的厚度可以大于图形板13的厚度，以使开口板12对图形板13起到较好的支撑作用。例如，考虑到开口板或图形板太薄可能增加焊接难度且太厚可能导致板体下垂量增大，因此，开口板12的厚度可以为30～100微米；和/或图形板13的厚度可以为15～40微米。
例如，开口板12和图形板13中的至少一个的材料可以为因瓦(Invar)合金，这是因为因瓦合金的性能稳定，对蒸镀形成的薄膜影响小。当然，开口板12和图形板13的材料包括但不限于因瓦合金。
在本发明实施例提供的掩膜板中，通过将开口板与框架连接，之后将图形板与开口板连接，并且使图形板的非图形部与框架之间在边框处彼此间隔开，使得该非图形部与框架不直接接触，因此不需要在框架中刻蚀形成焊接槽。图3为本发明实施例的掩膜板包括的一种框架的俯视示意图，如图3所示，该框架11的边框112中未设置有如图1b所示的遮挡焊接槽2a和支撑焊接槽3a，从而框架11的面向图形板13的表面112a在该表面112a与图形板13重叠的任意位置处都是平坦的，如图2b所示。
由于本发明实施例提供的掩膜板包括的框架中未设置焊接槽，因而可节省焊接槽的加工成本；另一方面，由于不需要在框架中设置焊接槽，当产品型号发生变化时不需要重新设计制作框架，因而所有型号的掩膜板都可使用该框架，这进一步节约了生产成本。
在至少一个实施例中，开口板12在框架11的边框处可以是平坦的，以便于将图形板13与开口板12连接，在这种情况下，例如，如图2a和图2b所示，图形板13的与边框112重叠的部分可以位于开口板12的本体122所在区域之内。
在至少一个实施例中，如图2a和图4a所示，开口板12可以包括多个开口条120，每个开口条120中都设置有开口121(该开口121的数量可以为至少一个)并且沿第一方向延伸，该多个开口条120沿第二方向依次排列，第二方向与第一方向相交。通过设置多个开口条120，当某一开口条120损坏时，只需更换该开口条120，而不需更换整个开口板12，从而可以进一步节省生产成本。
类似地，如图2a和图5所示，图形板13也可以包括多个图形条130，每个图形条130都设置有图形部131(该图形部131的数量可以为至少一个)并且沿第一方向延伸，该多个图形条130沿第二方向依次排列。当某一图形条130发生损坏时，只需要将其更换进行修复，而不需要更换整个图形板13，从而可以进一步节省生产成本。另一方面，在图形板13和开口板12都包括多个条状结构的情况下，由于二者的设计相似，因而可以在同一台张网机(张网机可以使图形条和开口条以一定的张力绷紧在框架上)上完成，从而节省设备的投资成本。
在至少一个实施例中，如图2a所示，每个图形条130的宽度W3都可以小于或等于其对应的开口条120的宽度W2。这样，开口条120可以在蒸镀过程中起到防止图形条130之间材料渗透的作用。
例如，考虑到条的宽度太小可能导致焊接难度增加以及目前常用设备的规格，每个开口条120和每个图形条130的宽度都可以为50～130毫米。
例如，如图2a、图2b和图4a所示，每个开口条120可以包括分别位于该开口条120的相对的两侧的第一减薄部122a和第二减薄部122b、以及位于第一、二减薄部之间的部分122c，第一减薄部122a和第二减薄部122b沿第二方向排列并且都沿第一方向延伸，并且相邻的开口条120的相邻的减薄部在垂直于开口板12的板面的方向上彼此重叠。通过设置第一、二减薄部并且使相邻的开口条120的相邻的减薄部彼此重叠，可以防止图形板13的图形条130之间发生材料渗透。此外，通过设置减薄部，使开口板既可以实现遮挡材料的作用，又可以对图形板进行支撑，从而可以省去图1a所示的金属掩膜板中的遮挡条2和支撑条3的制作；再者，由于支撑和遮挡作用都通过开口板实现，并且开口板和图形板采用相似的条状设计，与图1a所示的金属掩膜板中支撑和遮挡作用分别调控的方式相比，本发明实施例提供的掩膜板使 得支撑和遮挡作用可以同步地调控。
例如，第一、二减薄部都可以通过对用于形成开口条120的金属条进行刻蚀形成。例如，如图2b所示，第一减薄部122a可以通过对开口条120的面向框架11的表面120a进行刻蚀处理形成，第二减薄部122b可以通过对开口条120的背向框架11的表面120b进行刻蚀处理形成。当然，如图4b所示，同一开口条120的第一、二减薄部122a、122b也可以通过对该开口条的表面122a和表面122b中的一个表面进行刻蚀处理形成(图4b以两个减薄部都通过对表面122a进行刻蚀处理形成为例)，只要使相邻开口条的相邻的减薄部可以按照如图2b所示的方式彼此重叠即可。
在至少一个实施例中，相邻开口条120的彼此重叠的减薄部的厚度之和可以等于开口条120的厚度，如图2b所示。例如，第一、二减薄部的厚度都可以为开口条120厚度的一半。当然，本发明实施例包括但不限于此。通过将相邻开口条的彼此重叠的减薄部的厚度之和设置为等于开口条的厚度，可以保证开口板的面向图形板的表面是平坦的，以避免图形板在与开口板连接后发生弯曲。
在至少一个实施例中，如图2b所示，第一减薄部122a和第二减薄部122b的宽度w(第一、二减薄部的宽度可以相等也可以不等)都可以为0.3～0.8毫米。这样既可以避免因减薄部太窄而造成的焊接难度，又可以使开口条120排列得较紧凑，以提高空间利用率。
本发明的至少一个实施例还提供一种掩膜板的制作方法，该方法可以用于制作例如图2a和图2b所示的掩膜板。如图2a和图2b所示，本发明实施例提供的掩膜板的制作方法包括：在框架11上设置开口板12，使框架11包括镂空部111和围绕镂空部111的边框112，并且使开口板12包括开口121和围绕开口121的本体122，开口121对应框架11的镂空部111，本体122连接框架11的边框112；以及在开口板12上设置图形板13，使图形板13与开口板12层叠设置并且包括图形部131和位于图形部131周边的非图形部132，图形部131对应开口121，非图形部132连接开口板12的本体122，并且非图形部132与框架11在边框112处彼此间隔开。
在本发明实施例提供的掩膜板的制作方法中，由于将开口板与框架连接，之后将图形板与开口板连接，并且使图形板的非图形部与框架之间在边框处 彼此间隔开，使得该非图形部与框架不直接接触，因此不需要在框架中刻蚀形成焊接槽，从而可以节省焊接槽的加工成本；另一方面，由于不需要在框架中设置焊接槽，当产品型号发生变化时不需要重新设计制作框架，因而所有型号的掩膜板都可使用该框架，这进一步节约了生产成本。
在至少一个实施例中，开口板12的开口121和本体122可以通过对金属层12a(如图6所示)进行构图工艺形成，在这种情况下，开口板12的本体122为一体成型结构，参见图2b和图4b。构图工艺是指形成需要的图案的工艺，其例如包括光刻工艺或激光刻蚀工艺等。光刻工艺例如包括光刻胶涂敷、光刻胶曝光、光刻胶显影、利用光刻胶图案刻蚀薄膜等步骤。
在至少一个实施例中，开口板12与框架11和图形板13都可以焊接连接，即本发明实施例提供的掩膜板的制作方法包括：将开口板12焊接在框架11上，之后将图形板13焊接在开口板12上。当然，也可以采用本领域常用的其它的连接方法。
综上所述，本发明实施例提供的掩膜板及其制作方法具有如下优点。
(1)由于掩膜板包括的框架中未设置焊接槽，因而可节省焊接槽的加工成本。
(2)由于不需要在框架中设置焊接槽，当产品型号发生变化时，所有型号的掩膜板都可使用该框架，只需要重新设置开口板和图形板即可，这进一步节约了生产成本。
(3)采用一张开口板即可实现支撑和遮挡作用，从而可省去焊接遮挡条和支撑条的步骤。
(4)开口板或图形板都包括多个条状结构，当某个条状结构发生损伤时，只需更换该条状结构而不需更换整个板。
(5)开口板和图形板采用相似的条状设计，因而可以在同一台张网机上完成开口条和图形条的焊接以节省设备投资成本；另一方面，也可以实现同步地调控开口板的支撑和遮挡作用。
上述掩膜板及其制作方法的实施例可以互相参照。此外，在不冲突的情况下，本发明的实施例及实施例中的特征可以相互组合。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2016年7月22日递交的第201610587156.3号中国专利申请的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (14)

  1. 一种掩膜板，包括：
    框架，其包括镂空部和围绕所述镂空部的边框；
    开口板，其设置于所述框架上且包括开口和围绕所述开口的本体，其中，所述开口对应所述镂空部，所述本体连接所述边框；以及
    图形板，其设置于所述开口板上并且包括图形部和位于所述图形部周边的非图形部，所述图形部对应所述开口，所述非图形部连接所述开口板的本体，并且所述非图形部与所述框架在所述边框处彼此间隔开。
  2. 根据权利要求1所述的掩膜板，其中，所述框架的面向所述图形板的表面在所述表面与所述图形板重叠的位置处是平坦的。
  3. 根据权利要求1所述的掩膜板，其中，所述图形板的与所述边框重叠的部分位于所述开口板的本体所在区域之内。
  4. 根据权利要求1至3中任一项所述的掩膜板，其中，所述开口板包括多个开口条，每个开口条中都设置有所述开口并且沿所述第一方向延伸，所述多个开口条沿第二方向依次排列，所述第二方向与所述第一方向相交。
  5. 根据权利要求4所述的掩膜板，其中，每个开口条包括分别位于所述开口条的相对的两侧的第一减薄部和第二减薄部，所述第一减薄部和所述第二减薄部沿所述第二方向排列并且都沿所述第一方向延伸，相邻的开口条的相邻的减薄部彼此重叠。
  6. 根据权利要求5所述的掩膜板，其中，所述彼此重叠的减薄部的厚度之和等于所述开口条的厚度。
  7. 根据权利要求4所述的掩膜板，其中，每个开口条的宽度为50～130毫米。
  8. 根据权利要求4所述的掩膜板，其中，所述图形板包括多个图形条，每个图形条都包括所述图形部并且沿所述第一方向延伸，所述多个图形条沿所述第二方向依次排列。
  9. 根据权利要求8所述的掩膜板，其中，每个图形条的宽度都小于或等于其对应的开口条的宽度。
  10. 根据权利要求1至3中任一项所述的掩膜板，其中，所述图形板包 括多个图形条，每个图形条沿所述第一方向延伸，所述多个图形条沿第二方向依次排列，所述第二方向与所述第一方向相交。
  11. 根据权利要求1至3中任一项所述的掩膜板，其中，所述开口板和所述图形板中的至少一个的材料为因瓦合金。
  12. 根据权利要求1至3中任一项所述的掩膜板，其中，所述图形板的图形部在所述开口板上的正投影位于对应的开口之内。
  13. 一种掩膜板的制作方法，包括：
    在框架上设置开口板，其中，所述框架包括镂空部和围绕所述镂空部的边框；所述开口板包括开口和围绕所述开口的本体，所述开口对应所述镂空部，所述本体连接所述边框；以及
    在所述开口板上设置图形板，其中，所述图形板包括图形部和位于所述图形部周边的非图形部，所述图形部对应所述开口，所述非图形部连接所述开口板的本体，并且所述非图形部与所述框架在所述边框处彼此间隔开。
  14. 根据权利要求13所述的制作方法，其中，所述开口板的开口和本体通过对金属层进行构图工艺形成。
PCT/CN2017/074403 2016-07-22 2017-02-22 掩膜板及其制作方法 WO2018014554A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP17743236.6A EP3489755B1 (en) 2016-07-22 2017-02-22 Mask plate and fabrication method therefor
US15/548,832 US10663857B2 (en) 2016-07-22 2017-02-22 Mask and fabrication method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610587156.3 2016-07-22
CN201610587156.3A CN106019819A (zh) 2016-07-22 2016-07-22 掩膜板及其制作方法

Publications (1)

Publication Number Publication Date
WO2018014554A1 true WO2018014554A1 (zh) 2018-01-25

Family

ID=57117390

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/074403 WO2018014554A1 (zh) 2016-07-22 2017-02-22 掩膜板及其制作方法

Country Status (4)

Country Link
US (1) US10663857B2 (zh)
EP (1) EP3489755B1 (zh)
CN (1) CN106019819A (zh)
WO (1) WO2018014554A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106019819A (zh) * 2016-07-22 2016-10-12 京东方科技集团股份有限公司 掩膜板及其制作方法
CN108796433B (zh) * 2017-04-27 2024-01-30 京东方科技集团股份有限公司 掩模片、掩模板及其组装方法
CN107523788B (zh) * 2017-08-31 2023-12-12 京东方科技集团股份有限公司 一种掩模板及其制作方法
CN108004504B (zh) * 2018-01-02 2019-06-14 京东方科技集团股份有限公司 一种掩膜板
CN108823527B (zh) * 2018-06-14 2020-05-08 京东方科技集团股份有限公司 掩膜板框架组件和掩膜板模组
JP7487481B2 (ja) * 2019-02-06 2024-05-21 大日本印刷株式会社 蒸着マスク装置、マスク支持機構及び蒸着マスク装置の製造方法
CN109778116B (zh) * 2019-03-28 2021-03-02 京东方科技集团股份有限公司 一种掩膜版及其制作方法、掩膜版组件
CN109913809B (zh) * 2019-04-30 2021-03-23 京东方科技集团股份有限公司 一种掩膜装置及一种蒸镀方法
CN110129724B (zh) * 2019-07-03 2021-09-10 京东方科技集团股份有限公司 掩膜板组件及其制备方法
CN112739845B (zh) * 2019-08-28 2023-01-10 京东方科技集团股份有限公司 掩模板及制备方法、精细金属掩模板、掩模装置及使用方法
KR20210032586A (ko) * 2019-09-16 2021-03-25 삼성디스플레이 주식회사 증착 마스크, 증착 마스크의 제조 방법
CN211036074U (zh) * 2019-10-30 2020-07-17 京东方科技集团股份有限公司 一种精细金属掩膜板、掩膜装置及张网设备
US11560616B2 (en) * 2019-11-05 2023-01-24 Boe Technology Group Co., Ltd. Mask device, mask plate, and frame
CN113272467B (zh) * 2019-11-12 2023-07-28 京东方科技集团股份有限公司 掩模板
KR20210107217A (ko) * 2020-02-21 2021-09-01 삼성디스플레이 주식회사 표시 장치의 제조장치, 마스크 어셈블리의 제조방법, 및 표시 장치의 제조방법
JP2021175824A (ja) * 2020-03-13 2021-11-04 大日本印刷株式会社 有機デバイスの製造装置の蒸着室の評価方法、評価方法で用いられる標準マスク装置及び標準基板、標準マスク装置の製造方法、評価方法で評価された蒸着室を備える有機デバイスの製造装置、評価方法で評価された蒸着室において形成された蒸着層を備える有機デバイス、並びに有機デバイスの製造装置の蒸着室のメンテナンス方法
US11613802B2 (en) * 2020-04-17 2023-03-28 Rockwell Collins, Inc. Additively manufactured shadow masks for material deposition control
CN111394692B (zh) * 2020-05-09 2022-05-13 京东方科技集团股份有限公司 掩膜版
CN112251715B (zh) * 2020-10-21 2022-06-24 云谷（固安）科技有限公司 掩膜板的修复方法
KR20220055538A (ko) * 2020-10-26 2022-05-04 삼성디스플레이 주식회사 마스크 어셈블리 및 마스크 어셈블리의 제작 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060011137A1 (en) * 2004-07-16 2006-01-19 Applied Materials, Inc. Shadow frame with mask panels
CN1776525A (zh) * 2004-11-18 2006-05-24 三星Sdi株式会社 掩模组件以及使用该掩模组件的掩模框组件
CN102023474A (zh) * 2009-09-22 2011-04-20 三星移动显示器株式会社 掩模组件、其制造方法及用于平板显示器的沉积装置
CN103207518A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 防止下垂的掩模框架及防止下垂的掩模组件
CN104536260A (zh) * 2014-12-31 2015-04-22 深圳市华星光电技术有限公司 组合式掩模板及其制作方法
CN204832764U (zh) * 2015-07-24 2015-12-02 上海和辉光电有限公司 一种掩膜装置
US20150368785A1 (en) * 2014-06-23 2015-12-24 Samsung Display Co., Ltd. Mask frame assembly and method of manufacturing the same
CN106019819A (zh) * 2016-07-22 2016-10-12 京东方科技集团股份有限公司 掩膜板及其制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100464440C (zh) * 2002-06-03 2009-02-25 三星移动显示器株式会社 用于有机电致发光装置的薄层真空蒸发的掩模框组件
US6926840B2 (en) * 2002-12-31 2005-08-09 Eastman Kodak Company Flexible frame for mounting a deposition mask
CN102047152B (zh) * 2008-05-28 2012-12-26 凸版印刷株式会社 滤色器的制造方法、带图案基板的制造方法及小型光掩模
US9391275B2 (en) * 2010-08-30 2016-07-12 Sharp Kabushiki Kaisha Vapor deposition method, vapor deposition device and organic EL display device
KR101759347B1 (ko) * 2010-12-14 2017-08-01 삼성디스플레이 주식회사 박막 증착용 마스크 프레임 조립체 및 그 제조방법
CN103429784B (zh) * 2011-03-11 2016-01-20 夏普株式会社 蒸镀颗粒射出装置和蒸镀装置
KR20120105292A (ko) 2011-03-15 2012-09-25 삼성디스플레이 주식회사 증착 마스크 및 증착 마스크 제조 방법
KR101958991B1 (ko) * 2012-05-24 2019-03-20 삼성디스플레이 주식회사 프레임 및 이를 포함하는 마스크 조립체
CN105324511B (zh) 2013-06-21 2017-09-05 夏普株式会社 有机电致发光元件的制造方法和有机电致发光显示装置
CN104419890B (zh) 2013-08-20 2018-04-27 昆山允升吉光电科技有限公司 一种掩模组件
CN105568217B (zh) 2016-01-06 2017-12-05 京东方科技集团股份有限公司 金属掩模板及其制作方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060011137A1 (en) * 2004-07-16 2006-01-19 Applied Materials, Inc. Shadow frame with mask panels
CN1776525A (zh) * 2004-11-18 2006-05-24 三星Sdi株式会社 掩模组件以及使用该掩模组件的掩模框组件
CN102023474A (zh) * 2009-09-22 2011-04-20 三星移动显示器株式会社 掩模组件、其制造方法及用于平板显示器的沉积装置
CN103207518A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 防止下垂的掩模框架及防止下垂的掩模组件
US20150368785A1 (en) * 2014-06-23 2015-12-24 Samsung Display Co., Ltd. Mask frame assembly and method of manufacturing the same
CN104536260A (zh) * 2014-12-31 2015-04-22 深圳市华星光电技术有限公司 组合式掩模板及其制作方法
CN204832764U (zh) * 2015-07-24 2015-12-02 上海和辉光电有限公司 一种掩膜装置
CN106019819A (zh) * 2016-07-22 2016-10-12 京东方科技集团股份有限公司 掩膜板及其制作方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3489755A4 *

Also Published As

Publication number Publication date
EP3489755B1 (en) 2022-08-17
EP3489755A1 (en) 2019-05-29
US20180239241A1 (en) 2018-08-23
CN106019819A (zh) 2016-10-12
EP3489755A4 (en) 2020-04-15
US10663857B2 (en) 2020-05-26

Similar Documents

Publication Publication Date Title
WO2018014554A1 (zh) 掩膜板及其制作方法
WO2018000949A1 (zh) 掩膜板及其制造方法
US10982314B2 (en) Mask plate assembly capable of preventing wrinkle and assembly method thereof
WO2018227958A1 (zh) 掩膜板模组、膜层的制作方法及有机电致发光显示面板的制作方法
WO2018024040A1 (zh) 掩模板、包含该掩模板的掩模板组件及其制造方法
US20180148823A1 (en) Mask for deposition and manufacturing method thereof
US7369208B2 (en) Liquid crystal display device
WO2019179239A1 (zh) 掩膜装置及其制作方法、蒸镀系统
CN106086781A (zh) 掩膜组件及其制造方法、显示装置
KR20150014744A (ko) 단위 마스크 및 마스크 조립체
KR20200054316A (ko) 어레이 기판, 어레이 기판의 제조 방법 및 액정 표시 패널
JP2010169704A (ja) 液晶表示装置
JP6963014B2 (ja) 蒸着マスク、表示パネルの製造方法、及び表示パネル
WO2022134818A1 (zh) 一种掩膜板和掩膜板制作方法
JP2005183153A (ja) 蒸着用マスクの製造方法
CN112909067B (zh) 显示面板及掩膜版组件
WO2019064419A1 (ja) 蒸着マスク及び蒸着マスクの製造方法
US20190301001A1 (en) Metal mask, metal mask plate and method of manufacturing the same
KR20120022908A (ko) 액정 표시 장치
TWI402918B (zh) 光罩及薄膜電晶體基板之製造方法
TWI390339B (zh) 用於製造薄膜電晶體的光罩及製造薄膜電晶體的源極／汲極的方法
WO2019064418A1 (ja) 蒸着マスク及び蒸着マスクの製造方法
JP2004225077A (ja) 蒸着用マスクの製造方法および蒸着用マスク
TWI749982B (zh) 遮罩對位組件
TWI822510B (zh) 金屬遮罩及金屬遮罩的製造方法

Legal Events

Date Code Title Description
REEP Request for entry into the european phase

Ref document number: 2017743236

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 15548832

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17743236

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE