WO2017081883A1 - Dispositif d'encapsulation par résine et procédé d'encapsulation par résine - Google Patents

Dispositif d'encapsulation par résine et procédé d'encapsulation par résine Download PDF

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Publication number
WO2017081883A1
WO2017081883A1 PCT/JP2016/069186 JP2016069186W WO2017081883A1 WO 2017081883 A1 WO2017081883 A1 WO 2017081883A1 JP 2016069186 W JP2016069186 W JP 2016069186W WO 2017081883 A1 WO2017081883 A1 WO 2017081883A1
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WO
WIPO (PCT)
Prior art keywords
resin
substrate
molding
mold
resin sealing
Prior art date
Application number
PCT/JP2016/069186
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English (en)
Japanese (ja)
Inventor
高瀬　慎二
田村　孝司
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020187016324A priority Critical patent/KR102192732B1/ko
Priority to CN202010234428.8A priority patent/CN111403303B/zh
Priority to CN202310498021.XA priority patent/CN116435200A/zh
Priority to KR1020207023465A priority patent/KR102228644B1/ko
Priority to CN201680053681.5A priority patent/CN108025466B/zh
Publication of WO2017081883A1 publication Critical patent/WO2017081883A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3607—Moulds for making articles of definite length, i.e. discrete articles with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Definitions

  • the present invention relates to a resin sealing device and a resin sealing method.
  • a hole (a hole for pouring resin from one surface side of the substrate to the other surface side, hereinafter referred to as “opening”) is formed in the substrate, and transfer molding is performed.
  • resin sealing method in which one surface of the substrate is resin-sealed, and resin is sealed from the opening to the other surface side by resin.
  • the resin is first put into one of the cavities (upper cavity or lower cavity) (upper cavity or lower cavity). May be filled.
  • the lower mold cavity (lower cavity) is filled with resin first
  • the resin may be filled in one of the cavities first due to gravity, flow resistance, or the like. In that case, the resin flows from the one surface side of the substrate to the other surface side of the substrate through the opening of the substrate.
  • substrate may swell toward the said other surface side by the flow resistance at the time of resin flowing from the opening of a board
  • the resin is filled in the other cavity with the substrate swelled.
  • Resin pressure is applied to the substrate by filling one or the other cavity with resin, but the resin pressure applied to one and the other surface of the substrate is the same pressure (one and the other cavity are connected by the opening of the substrate) Therefore, no force is generated to return the substrate from a swelled state to a flat state. Therefore, the curing of the resin proceeds with the other surface of the substrate swelled, and the molding is completed with the substrate swelled (deformed state). That is, if one surface and the other surface (both surfaces) of the substrate are simultaneously resin-sealed using the resin sealing method, the substrate may be deformed.
  • an object of the present invention is to provide a resin sealing device and a resin sealing method capable of both suppressing the warpage of the substrate and performing both-side molding of the substrate.
  • the resin sealing device of the present invention comprises: A resin sealing device for resin sealing both sides of a substrate, A first molding module; A second molding module;
  • the first molding module is a molding module for compression molding, After the one surface of the substrate is resin-sealed by compression molding with the first molding module, the other surface of the substrate can be resin-sealed with the second molding module.
  • the resin sealing method of the present invention comprises: A resin sealing method for resin sealing both sides of a substrate, A first resin sealing step of resin-sealing one surface of the substrate by compression molding; A second resin sealing step of sealing the other surface of the substrate after the first resin sealing step.
  • FIG. 1 shows sectional drawing of the resin sealing apparatus of Example 1, and the board
  • FIG.1 (b) shows sectional drawing of the modification of the board
  • FIG. 2 is a cross-sectional view illustrating an example of one step in the resin sealing method according to the first embodiment.
  • FIG. 3 is a cross-sectional view illustrating another step in the same resin sealing method as FIG.
  • FIG. 4 is a cross-sectional view illustrating still another process in the same resin sealing method as FIG.
  • FIG. 5 is a cross-sectional view illustrating yet another step in the same resin sealing method as FIG.
  • FIG. 6 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG. FIG.
  • FIG. 7 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG.
  • FIG. 8 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG. 9A to 9C are process cross-sectional views showing a modification of the resin sealing method of the first embodiment.
  • FIG. 10 is a cross-sectional view of the first molding module of the resin sealing device of Example 2 and the substrate that is resin-sealed thereby.
  • FIG. 11 shows sectional drawing of the 2nd shaping
  • FIG. 12 is a cross-sectional view illustrating an example of one step in the resin sealing method according to the second embodiment.
  • FIG. 12 is a cross-sectional view illustrating an example of one step in the resin sealing method according to the second embodiment.
  • FIG. 13 is a cross-sectional view illustrating another step in the same resin sealing method as FIG.
  • FIG. 14 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG.
  • FIG. 15 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG.
  • FIG. 16 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG.
  • FIG. 17 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG. 18 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG. FIG.
  • FIG. 19 shows a cross-sectional view of a compression molding mold module and a substrate reversing mechanism of the resin sealing device of Example 3, and a substrate that is resin-sealed thereby.
  • 20A to 20C are cross-sectional views illustrating an example of one process in the resin sealing method of the third embodiment.
  • FIGS. 21A and 21B are cross-sectional views illustrating substrates that are resin-sealed by the resin-sealing device of the present invention.
  • “resin sealing” means that the resin is in a cured (solidified) state, but is not limited to this when the molding is performed on both sides as described later. That is, in the present invention, when batch molding is performed on both surfaces described later, the “resin sealing” may be a state in which at least the resin is filled in the mold cavity at the time of mold clamping, and the resin is cured ( It is not solidified) and may be in a fluid state.
  • the resin sealing device of the present invention includes a first molding module and a second molding module, and the first molding module is a molding module for compression molding, After the one surface of the substrate is resin-sealed by compression molding using the molding module, the other surface of the substrate can be resin-sealed by the second molding module.
  • one surface of the substrate is first resin-sealed by compression molding with a molding module for compression molding (the one cavity is filled with resin first by compression molding).
  • the substrate used in the present invention does not need to be provided with an opening for allowing the resin to flow from one surface side of the substrate to the other surface side.
  • the resin does not flow from the one surface side of the substrate through the opening to the other surface side of the substrate. For this reason, deformation (warping) of the substrate due to flow resistance when the resin passes through the opening of the substrate does not occur.
  • the other surface is resin-sealed, by supporting one surface with a resin for compression molding, it is possible to suppress warping of the substrate even when resin pressure is applied to the substrate from the other surface side. it can. Thereby, in this invention, suppression of the curvature of a board
  • both sides of the substrate can be resin-sealed without opening an opening in the substrate, there is no cost due to the opening in the substrate.
  • the flow distance until resin sealing is short, and generation of voids (bubbles) and wire deformation can be suppressed.
  • the upper and lower mold modules may serve as both the first molding module and the second molding module.
  • the upper and lower mold modules are provided with an upper mold and a lower mold.
  • the resin sealing device is configured such that one surface of the substrate is resin-sealed by compression molding with one of the upper mold and the lower mold, and then the other surface of the substrate is resin-bonded with the other mold. It can be sealed.
  • a resin sealing device may be referred to as a “first resin sealing device”. Accordingly, both surfaces of the substrate can be collectively formed using a single forming module, so that the production efficiency is improved and the configuration is simplified, so that the cost can be reduced, which is preferable.
  • the upper mold of the upper and lower mold modules is used for compression molding.
  • the lower mold is a mold for transfer molding.
  • the first molding module is a molding module having a lower mold for compression molding
  • the second molding module is a molding module having an upper mold for transfer molding. May be.
  • the upper surface of the substrate is resin-molded by transfer molding with the upper mold of the second molding module. It can be sealed.
  • a resin sealing device may be referred to as a “second resin sealing device”. If the second molding module is a molding module having an upper mold for transfer molding, and the other surface of the substrate is resin-sealed by transfer molding, the terminals provided on the substrate (the other surface) are sealed. It is easy to mold in a state exposed from the resin. The purpose of exposing the terminals is as described above.
  • the compression molding mold module (one molding module) may serve as both the first molding module and the second molding module.
  • the compression molding mold module is provided with a compression molding mold.
  • the resin sealing device may include a substrate reversing mechanism that flips the substrate upside down.
  • one surface of the substrate is resin-sealed by compression molding, and the one surface is resin-sealed by the substrate reversing mechanism.
  • the other surface of the substrate may be resin-sealed by the compression molding mold after being turned upside down.
  • a resin sealing device may be referred to as a “third resin sealing device”.
  • the first molding module has an upper mold.
  • the resin sealing device may be capable of resin sealing one surface of the substrate by compression molding with the upper mold of the first molding module.
  • the second molding module is a molding module for transfer molding.
  • the resin sealing device may be capable of resin sealing the other surface of the substrate by transfer molding using the transfer molding molding module. If the second molding module is a molding module for transfer molding, and the other surface of the substrate is resin-sealed by transfer molding, the terminals provided on the substrate (the other surface) are exposed from the sealing resin. It is easy to mold in a state. The purpose of exposing the terminals is as described above.
  • the resin sealing device of the present invention may further include an ejector pin.
  • the ejector pin is provided so as to be able to be inserted and removed from a cavity surface of a molding die provided in at least one of the first molding module and the second molding module, and the ejector pin has a tip when the mold is opened. However, it may be raised or lowered so as to protrude from the cavity surface, and at the time of clamping, the tip may be raised or lowered so as not to protrude from the cavity surface. Thereby, since the resin-sealed substrate can be easily released from the mold, it is preferable.
  • the molding die provided with the ejector pins may be, for example, an upper die, a lower die, or both an upper die and a lower die.
  • the resin sealing device of the present invention may further include unnecessary resin separation means.
  • the unnecessary resin separating means may be capable of separating an unnecessary resin portion from the resin-sealed substrate after sealing one surface and the other surface of the substrate with resin.
  • the unnecessary resin separation means is not particularly limited, and examples thereof include a separation jig used in a known method such as gate cut and degate.
  • the resin sealing device of the present invention may further include a substrate pin.
  • the substrate pin is provided so as to protrude upward, for example, outside a lower mold cavity (lower cavity) provided in at least one of the first molding module and the second molding module.
  • the substrate may be mountable in a state of being separated from the upper surface of the lower mold. “Mounting” here includes “fixing”. As a result, the resin sealing device prevents the lower mold cavity (lower cavity) from covering the lower mold cavity (lower cavity) when the inside of the mold is depressurized during intermediate mold clamping. The inside of the lower cavity) can be depressurized.
  • substrate pins may be integrated with the lower mold or separated from the lower mold.
  • the substrate pin may include, for example, a protruding substrate positioning portion at the tip by making it a stepped pin.
  • the substrate positioning portion may be inserted into a through hole provided in the substrate, so that the substrate pin can be placed on the substrate. This is preferable because the substrate can be stably and fixed at a predetermined position by placing the substrate on the substrate pins.
  • a relief hole for the substrate positioning portion may be provided in an upper cavity frame member or the like, which will be described later, of the upper mold.
  • the resin sealing device of the present invention may further include a substrate transfer mechanism and a resin transfer mechanism.
  • the substrate transport mechanism transports a resin-sealed substrate to a predetermined position of each molding module, and the resin transport mechanism transports a resin to be supplied to the substrate onto the substrate.
  • the said resin conveyance mechanism conveys tablet-shaped resin to the position of a pot, for example.
  • the resin sealing device may be configured such that the substrate transport mechanism also serves as the resin transport mechanism.
  • the resin sealing device of the present invention is not limited to the third resin sealing device, and may include a substrate reversing mechanism. As described above, the substrate reversing mechanism reverses the top and bottom of the resin-sealed substrate.
  • the resin sealing device of the present invention is a block (member) that constitutes a cavity of a molding module for compression molding in order to absorb variation in the amount of resin when compression molding is performed by a molding module for compression molding, for example. ) May be provided with a spring to apply pressure to the resin.
  • a ball screw or a hydraulic cylinder or the like may be attached to the block (member) that constitutes the cavity, and pressure may be applied by direct motion.
  • each molding module has both an upper mold and a lower mold
  • a release for facilitating release of the molded resin-sealed product from the molding mold is performed on both of the molding modules.
  • a film may be provided, may be provided on either side, or may not be provided.
  • the resin sealing device of the present invention includes, for example, voids (bubbles) by including, in the sealing resin, air contained in the cavity, gas that has been gasified by heating moisture contained in the resin, or the like. May occur. If voids (bubbles) are generated, the durability or reliability of the resin-encapsulated product may be reduced. Therefore, in order to reduce voids (bubbles) as necessary, a vacuum pump or the like for performing resin sealing molding in a vacuum (reduced pressure) state may be included.
  • the substrate to be resin-sealed by the resin sealing device of the present invention is, for example, a mounting substrate on which chips are mounted on both sides.
  • a mounting substrate for example, as shown in FIG. 21 (a), a chip 1 and a wire 3 for electrically connecting the chip 1 and the substrate 2 are provided on one of both surfaces thereof.
  • the other is a mounting substrate 11 provided with a flip chip 4 and ball terminals 5 as external terminals.
  • the ball terminal 5 when molding both surfaces of the substrate 2 having the above-described configuration, it is necessary to expose the ball terminal 5 from at least one surface.
  • the ball terminal 5 is preferably pressed against the release film to be exposed.
  • the sealing resin may be subjected to a grinding process or the like in order to expose the ball terminal 5.
  • the terminals are exposed on the transfer molding side, for example, as shown in the mounting substrate of FIG. 21B, instead of the ball terminals 5, the exposed surfaces are replaced with the terminals 6, and molding for transfer molding is performed. It is preferable to perform mold clamping in advance with a convex portion provided on the module mold and press the flat terminal 6 to expose it.
  • the mounting substrate 11 in FIG. 21B is not provided with the ball terminal 5 of the mounting substrate 11 in FIG. 21A on the one surface but on the other surface, and is a flat terminal 6. Is the same as the mounting substrate 11 in FIG. This is preferable because reliable exposure is possible.
  • the substrate to be resin-sealed is not limited to each mounting substrate 11 in FIGS. 21A and 21B, and is arbitrary.
  • the substrate to be resin-sealed for example, at least one of the chip 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) is the substrate 2 as shown in FIGS. It may be mounted on one side or may be mounted on both sides of the substrate 2. Further, for example, the terminal may not be provided as long as electrical connection to the substrate (for example, connection of a power supply circuit, a signal circuit, and the like to the substrate) is possible.
  • each shape and each size of the substrate 2, the chip 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) are not particularly limited.
  • Examples of the substrate to be resin-sealed by the resin sealing device of the present invention include a high-frequency module substrate for a mobile communication terminal.
  • the substrate for portable communication terminals it is possible to open an opening in the cradle part in order to seal the both surfaces of the substrate with resin, but a resin sealing molding method that does not require opening the opening is desired. Yes.
  • the substrate for the mobile communication terminal is small and the components are built in at a high density, it may be difficult to mold the resin by opening the opening.
  • the resin sealing device of the present invention as described above, both sides of the substrate can be resin sealed without opening the opening, and such a small size and components are built in with high density. It can also be applied to existing substrates.
  • substrate sealed with the resin sealing apparatus of this invention For example, a power control module board, an apparatus control board, etc. are mentioned.
  • a frame member having a through hole may be used.
  • the substrate is attracted and fixed to the lower surface of the frame member.
  • the said resin is supplied in the said through-hole of the said frame member.
  • the substrate fixed by the frame member is inserted between the upper die and the lower die with the mold opened, and the frame member is lowered or the lower die is raised, so that the substrate is mounted on a substrate pin or the like. Put.
  • the frame member may be withdrawn as necessary. It is preferable to use the frame member because the resin can be stably disposed on the substrate.
  • the resin is not particularly limited, and may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. Further, it may be a composite material partially including a thermosetting resin or a thermoplastic resin. Examples of the form of the resin to be supplied include a granular resin, a fluid resin, a sheet-like resin, a tablet-like resin, and a powdery resin.
  • the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin.
  • the liquid resin refers to, for example, a resin that is liquid at room temperature or has fluidity.
  • the molten resin refers to, for example, a resin that is in a liquid or fluid state by melting.
  • the form of the resin may be other forms as long as it can be supplied to a cavity, pot, or the like of the mold.
  • the term “electronic component” may refer to a chip before resin-sealing or a state in which the chip is resin-sealed.
  • the term “electronic component” Unless otherwise specified, it means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin.
  • “chip” refers to a chip before resin sealing, and specifically includes chips such as ICs, semiconductor chips, and semiconductor elements for power control.
  • the chip before resin sealing is referred to as “chip” for convenience in order to distinguish it from the electronic component after resin sealing.
  • the “chip” in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not be in a chip shape.
  • flip chip refers to an IC chip having bump-like protruding electrodes called bumps on an electrode (bonding pad) on the surface of the IC chip, or such a chip form. This chip is mounted downward (face down) on a wiring portion such as a printed circuit board.
  • the flip chip is used as, for example, a chip for wireless bonding or one of mounting methods.
  • the resin sealing method of the present invention is a resin sealing method in which both surfaces of a substrate are resin-sealed, and includes a first resin sealing step in which one surface of the substrate is resin-sealed by compression molding, And a second resin sealing step of resin sealing the other surface of the substrate after the one resin sealing step.
  • the resin sealing method of the present invention since one surface of the substrate is first resin-sealed by compression molding, when the other surface is resin-sealed, one surface is supported by a resin for compression molding. Thus, even when a resin pressure is applied to the substrate from the other surface side, the warpage of the substrate can be suppressed. For this reason, in this invention, suppression of the curvature of a board
  • substrate are compatible.
  • the resin sealing method of the present invention performs the first resin sealing step by the first molding module using the resin sealing device of the present invention, and the second molding module performs the first Two resin sealing steps may be performed.
  • the first resin sealing step and the second resin sealing step are performed by using the first resin sealing device of the present invention. Module).
  • the first resin sealing step is performed by the lower mold of the first molding module using the second resin sealing device of the present invention, and the second resin The sealing step may be performed by the upper mold of the second molding module.
  • the one surface is placed between the first resin sealing step and the second resin sealing step.
  • the first resin sealing step may be performed by an upper mold of the first molding module of the resin sealing device.
  • the second resin sealing step may be performed by the transfer molding molding module of the resin sealing device.
  • the resin sealing device of the present invention when used, the resin sealing device causes the tip of the ejector pin to protrude from the bottom surface of the mold cavity when the mold is opened. And a step of raising or lowering the tip of the ejector pin so as not to protrude from the bottom surface of the cavity of the mold when the mold is clamped by the resin sealing device.
  • an unnecessary resin separation step of separating from the resin-sealed substrate by the unnecessary resin separation means may be included.
  • the resin sealing method may include a substrate mounting step of mounting the substrate on the substrate pin in a state where the substrate is released from the lower mold upper surface when the resin sealing device of the present invention is used. Furthermore, in the substrate mounting step, the substrate pin may mount the substrate by inserting the substrate positioning portion into a through hole provided in the substrate.
  • the upper and lower mold modules serve as both the first molding module and the second molding module.
  • the upper and lower mold modules are provided with an upper mold and a lower mold, the upper mold is a compression mold, and the lower mold is a transfer mold.
  • the present invention is not limited to this. That is, in the present invention, for example, the upper mold may be a transfer mold and the lower mold may be a compression mold, contrary to the present embodiment described below.
  • FIG. 1A shows a cross-sectional view of the resin sealing device of this example and a substrate that is resin-sealed thereby.
  • the upper and lower mold forming module 10 includes an upper mold 200 and a lower mold 300 disposed opposite to the upper mold.
  • a release film 40 for facilitating the release of the molded resin-sealed product from the mold is adsorbed (attached) to the mold surface (lower surface) of the upper mold 200. Can be fixed.
  • the upper mold 200 is a compression mold (molding module).
  • the upper mold outside air blocking member 203 having a base plate 202 and O-rings 204A and 204B is formed.
  • the upper cavity 220 is configured by the upper cavity frame member 210 and the upper cavity upper surface member 230.
  • the upper mold 200 is fixed to, for example, a fixed plate (not shown) of the upper and lower mold forming module 10.
  • the upper mold 200 or the upper / lower mold module 10 is provided with a heating means (not shown) for heating the upper mold 200, for example.
  • the resin in the upper cavity 220 is heated and cured (melted and cured).
  • the heating means may be provided in one or both of the upper mold 200 and the lower mold 300, and the position thereof is not limited as long as at least one of the upper mold 200 and the lower mold 300 can be heated. .
  • the upper cavity frame member 210 and the upper cavity upper surface member 230 are installed in a state of being suspended from the upper mold base plate 202 via a plurality of elastic members 201, for example.
  • An upper mold outside air blocking member 203 is provided at the outer peripheral position of the upper mold base plate 202. As will be described later, the upper mold outside air blocking member 203 is joined to the lower mold outside air blocking member 302 via the O-ring 204B, so that the inside of the cavity can be in an outside air blocking state.
  • An O-ring 204A for blocking outside air is provided on the upper end surface of the upper mold outside air blocking member 203 (a portion sandwiched between the upper mold base plate 202 and the upper mold outside air blocking member 203).
  • an O-ring 204B for blocking outside air is also provided on the lower end surface of the upper mold outside air blocking member 203.
  • the upper mold base plate 202 is provided with, for example, a hole (through hole) 205 of the upper mold 200 for forcibly sucking and reducing the pressure of the air in the space in the mold.
  • the upper cavity frame member 210 and the upper cavity upper surface member 230 are separated from each other.
  • the resin sealing device of the present embodiment is not limited to this, The structure which both integrated may be sufficient.
  • the lower mold 300 is a transfer molding mold (molding module), and is formed of, for example, a lower mold outside air blocking member 302 having a lower cavity block 320, a lower mold base plate 301, and an O-ring 303.
  • the lower cavity block 320 has a lower cavity 310.
  • the lower mold 300 or the upper / lower mold module 10 is provided with a heating means (not shown) for heating the lower mold 300, for example. By heating the lower mold 300 with the heating means, the resin in the lower cavity 310 is heated and cured (melted and cured).
  • the lower mold 300 can be moved in the vertical direction by a drive mechanism (not shown) provided in the upper / lower mold module 10. That is, the lower mold 300 can be moved in the direction approaching the (fixed) upper mold 200 and clamped. Then, the lower mold 300 can move in a direction away from the upper mold 200 to open the mold.
  • the lower cavity block 320 is installed in a state of being mounted on the lower mold base plate 301, for example.
  • a lower mold outside air blocking member 302 is provided at the outer peripheral position of the lower mold base plate 301.
  • the lower mold outside air blocking member 302 is disposed directly below the upper mold outside air blocking member 203 and the outside air blocking O-rings 204A and 204B.
  • An O-ring 303 for blocking outside air is provided on the lower end surface of the lower mold outside air blocking member 302 (a portion sandwiched between the lower mold base plate 301 and the lower mold outside air blocking member 302).
  • the upper mold outside air blocking member 203 including the O rings 204A and 204B and the lower mold outside air blocking member 302 including the O ring 303 are interposed via the O ring 204B.
  • the inside of the cavity can be brought into an outside air blocking state.
  • the lower mold 300 is provided with a resin passage 304 for supplying a resin material, for example.
  • the lower cavity 310 and the pot 305 are connected by the resin passage 304.
  • the plunger 306 disposed in the pot 305 can be moved in the vertical direction by a plunger driving mechanism (not shown) provided in the vertical mold module 10.
  • a plunger driving mechanism not shown
  • the plunger 306 may inject the resin into the lower cavity 310 via the resin passage 304. it can.
  • the lower mold 300 is further provided with substrate pins 330 placed on elastic members 340 provided inside the lower cavity block 320 outside the lower cavity 310 of the lower mold 300. In this state, it may be provided so as to protrude upward.
  • each substrate pin 330 is provided on the outside of the cavity 310 of the lower mold 300 so as to protrude upward, and the substrate 2 is released from the upper surface of the lower mold 300. May be mountable.
  • Each substrate pin 330 is, for example, a stepped pin as shown in FIG. 1B, and may include a protruding substrate positioning portion 331 at the tip thereof.
  • the board pin 330 in FIG. 1B is the same as the board pin 330 in FIG. 1A except that it includes a board positioning portion 331.
  • each substrate pin 330 is separated from the lower cavity block 320 by inserting the substrate positioning portion 331 into the through hole (not shown) provided in the substrate 2. It may be fixed in a free state.
  • an ejector pin 550 may be provided at the bottom of the lower cavity 310 of the lower mold 300 as shown in FIG.
  • the ejector pin may be one, but may be a plurality.
  • Each of the ejector pins rises so that the tip protrudes from the bottom surface of the lower cavity 310 of the lower mold 300 when the mold is opened, and the tip protrudes from the bottom surface of the lower cavity 310 of the lower mold 300 when the mold is clamped. You may descend so as not to.
  • the resin sealing device of the present embodiment may further include unnecessary resin separation means (not shown).
  • the unnecessary resin separating means may be capable of separating an unnecessary resin portion from the resin-sealed substrate after sealing one surface and the other surface of the substrate with resin.
  • the resin sealing method of this embodiment will be described with reference to FIGS. Below, the resin sealing method using the resin sealing apparatus of a present Example is demonstrated. More specifically, the resin sealing device of FIGS. 2 to 8 is the same as the resin sealing device of FIG. Note that the ejector pin 550 of FIG. 8 may or may not be provided. In the resin sealing method, the upper and lower mold modules 10 perform the first resin sealing step and the second resin sealing step.
  • a mold raising step, a release film supplying step, a substrate placing step, and a resin supplying step described below are performed prior to the first resin sealing step.
  • a mold raising step, a release film supplying step, a substrate placing step, and a resin supplying step described below are performed prior to the first resin sealing step.
  • Each step is an optional component in the resin sealing method.
  • heating means can heat the mold (upper mold 200 and lower mold 300), and the mold (upper mold 200 and lower mold 300) can cure (melt and cure) the resin.
  • the temperature is raised to a temperature (molding temperature raising step).
  • the release film 40 is supplied to the upper mold 200 (release film supply step).
  • the substrate 2 is placed on the substrate pins 330 in a state where it is separated from the upper surface of the lower mold 300 (substrate placing step).
  • the substrate 2 may be placed on the substrate pin 330 by inserting the substrate positioning portion 331 into a through hole (not shown) provided in the substrate 2.
  • the granular resin 20a is supplied to the upper surface of the substrate 2, and the tablet resin (not shown) is supplied (set) to the pot (on the plunger 306) of the lower mold 300 (resin supplying step). Further, the tablet resin is heated and melted by the heated pot (and the lower mold 300) to become a molten resin (flowable resin) 30a.
  • the resin sealing method of the present embodiment it is not limited to supplying the granule resin 20a to the upper surface of the substrate 2 after supplying the substrate 2 to the lower mold 300.
  • the substrate 2 supplied with the granular resin 20a may be supplied to the lower mold 300 after being supplied (set) to the upper surface.
  • the first resin sealing step is performed.
  • one surface of the substrate 2 is resin-sealed by compression molding in the first resin sealing step.
  • the intermediate mold clamping step and the upper cavity resin filling step described in the above are performed.
  • the lower mold 300 is raised by a drive mechanism (not shown) to perform intermediate mold clamping (intermediate mold clamping process).
  • intermediate mold clamping intermediate mold clamping process
  • the upper mold outside air blocking member 203 and the lower mold outside air blocking member 302 are joined via the O-ring 204B, and the inside of the mold is blocked from the outside air.
  • suction in the arrow direction X shown in FIG. 4 is started from the hole 205 of the upper mold 200 to reduce the pressure in the mold.
  • the lower mold 300 is raised to a position where the upper cavity 220 is filled with the resin 20a by a drive mechanism (not shown), and the lower mold 300 is temporarily stopped at the position (upper). Cavity resin filling process).
  • the granular resin 20a is heated and melted by the heated (heated) upper mold 200 to become a molten resin (flowable resin) 20b.
  • the molten resin (flowable resin) 20b has a low viscosity, and even when the resin pressure is applied to the substrate 2 from the upper mold side and the substrate is temporarily warped, it is subsequently melted in the lower cavity 310.
  • the warp of the substrate becomes a level at which there is no problem.
  • the lower mold 300 may be raised to a position where the resin pressure is applied to 220.
  • the second resin sealing step is performed.
  • the other surface of the substrate 2 is resin-sealed by transfer molding in the second resin-sealing step.
  • the lower cavity resin filling step, the resin pressure step, and the mold opening step described in the above are performed.
  • the plunger 306 is raised to a position where the lower cavity 310 is filled with the fluid resin 30 a by a plunger driving mechanism (not shown), and the plunger 306 is temporarily stopped at that position. (Lower cavity resin filling step).
  • the lower mold 300 and the plunger 306 are further raised substantially simultaneously, and the resin pressure is applied to the upper surface side and the lower surface side of the substrate substantially simultaneously by the fluid resin 20b for compression molding. (Resin pressure process). By doing in this way, the curvature of a board
  • the resin pressure is applied to the upper cavity 220 at the time shown in FIG. 7, only the plunger 306 is raised.
  • the lower mold 300 is moved to the drive mechanism (illustrated). (Omitted) to lower and perform mold opening (mold opening process).
  • the other surface is resin-sealed by transfer molding.
  • warping of the substrate 2 can be suppressed by supporting one surface with a resin for compression molding, even if a resin pressure is applied to the substrate 2 from the other surface side.
  • substrate 2 are compatible.
  • both surfaces of the substrate 2 can be collectively formed using one forming module, the production efficiency is improved and the configuration is simplified, so that the cost can be reduced.
  • the tip of the ejector pin 550 rises so as to protrude from the bottom surface of the cavity of the lower mold, and the mold clamping is performed.
  • a lowering step may be included in which the tip of the ejector pin 550 is lowered so as not to protrude from the bottom surface of the cavity of the lower mold.
  • the unnecessary resin separation means (shown in FIG. 8) is further collected after the resin-sealed substrate (molded substrate) 2 and the unnecessary resin portion 33 shown in FIG. (Omitted) may separate the resin-sealed substrate (molded substrate) 2 and the unnecessary resin portion 33.
  • the resin-sealed substrate (molded substrate) 2 and the upper and lower mold modules 10 are combined together or separately.
  • the unnecessary resin portion 33 may be collected together from the upper and lower mold modules 10.
  • the resin sealing method may be performed using the frame member 32 as shown in FIGS.
  • the substrate mounting step and the resin supply step have an internal through hole 31.
  • the substrate 2 is adsorbed and fixed to the lower surface of the frame member 32, the granular resin 20a is supplied to the internal through-hole 31 of the frame member 32, and when the upper mold 200 and the lower mold 300 are opened, the frame member 32, the substrate 2, And the granular resin 20a is allowed to enter between the upper and lower molds.
  • the substrate 2 on which the frame member 32 and the granular resin 20 a are placed is placed on the substrate pin 330 by lowering the frame member 32 or raising the lower mold 300. To do. Then, as shown in FIG. 9C, the frame member 32 is retracted. The rest is the same as the substrate placing step and the resin supplying step shown in FIGS. Thereafter, each step shown in FIGS. 4 to 8 may be performed.
  • the resin such as the granular resin 20a can be stably supplied onto the substrate 2 by using the frame member 32.
  • one of the two cavities of the mold is first filled by compression molding.
  • the amount of resin (resin for compression molding) supplied to the cavity can be adjusted in the case of compression molding.
  • the amount of compression molding resin is set to approximately the same volume as that of one (compression molding) cavity when the substrate is flat, and the compression molding resin is supplied to the one cavity. To fill.
  • substrate or dent by at least excess and deficiency of a resin can be suppressed.
  • the amount of resin supplied to the one of the cavities varies depending on the vertical position of the plunger. Therefore, the substrate may bulge or dent due to excessive or insufficient resin amount. Therefore, it is preferable to fill one cavity first by compression molding.
  • one of the cavities is filled first by compression molding, and if the resin for compression molding in the molten state has a high viscosity, it has a strong resistance to the substrate when filling the one cavity with the resin. Power may work. In that case, the substrate may swell due to the volume of the unfilled portion without the resin filling the entire one cavity. Even in such a case, by filling the other cavity with resin and applying resin pressure to the substrate from the other surface side of the substrate, the swollen substrate is flattened, and the entire cavity is filled with resin. Can be made.
  • the substrate used in this example is different from the substrate 2 shown in FIG. 21B except that the number of flat terminals 6 is different and the flat terminals 6 are provided on the same side as the flip chip 4. It is almost the same.
  • the number of flat terminals 6 is 2 in this embodiment and Example 3 (FIGS. 10 to 20) described later, and 3 in FIG. 21B, but these numbers are merely examples, and the present invention There is no limitation. The same applies to the chip 1, the wire 3, the flip chip 4, and the ball terminal 5 (Example 1 and FIG. 21A).
  • the resin sealing device of the present embodiment includes two molding modules: a first molding module having a lower mold for compression molding and a second molding module having an upper mold for transfer molding, and the first molding module.
  • the lower surface of the substrate can be resin-sealed by compression molding with the lower mold of the module, and the upper surface of the substrate can be resin-sealed by transfer molding with the upper mold of the second molding module.
  • the resin sealing device of the present embodiment may include, for example, a substrate transport mechanism.
  • FIG. 10 is a cross-sectional view of the first molding module 500 of the resin sealing device of the present embodiment and the substrate 2 that is resin-sealed thereby.
  • the first molding module 500 includes a substrate holding member (upper die) 600 and a lower die 700 disposed to face the substrate holding member (upper die) 600.
  • the substrate holding member (upper mold) 600 exposes a communication member 610 communicating with a high-pressure gas source 650 such as a compressor and a compressed air tank, a cavity upper surface and a frame member 620, and a flat terminal 6 mounted on the substrate 2. And a plurality of elastic members 602 and a plate member 640.
  • the cavity upper surface and the frame member 620 have a cavity 601.
  • the communication member 610, the cavity upper surface, and the frame member 620 are installed in a state of being suspended from the plate member 640 via a plurality of elastic members 602.
  • the communication member 610 is provided with an air passage (air passage) 603 for sending the air compressed by the high-pressure gas source 650 to the cavity 601.
  • the cavity upper surface and the frame member 620 are configured such that the upper cavity upper surface member having the cavity 601 and the frame member surrounding the upper cavity upper surface member are integrated.
  • a plurality of air holes 604 are provided on the upper surface of the cavity 601 for communicating the air passage 603 of the communication member 610 with the cavity 601.
  • the convex member 630 may suppress the substrate 2 such as the upper surface of the flat terminal 6 so that the substrate 2 is not warped by resin sealing by the first molding module 500. It is preferable to provide in a part.
  • the lower mold 700 is a compression mold, and is formed of, for example, a lower cavity lower surface member 710, a lower cavity frame member 720, an elastic member 702, and a lower mold base plate 730.
  • the lower mold 700 includes a lower cavity lower surface member 710 and a lower cavity frame member 720 to form a lower cavity 701.
  • the lower cavity lower surface member 710 is installed in a state of being placed on the lower mold base plate 730, for example. Further, the lower cavity lower surface member 710 may be mounted in a state of being mounted on the lower mold base plate 730 via the elastic member 702, for example.
  • the lower cavity frame member 720 is disposed so as to surround the lower cavity lower surface member 710 in a state where the lower cavity frame member 720 is placed on the lower mold base plate 730 via a plurality of elastic members 702.
  • a sliding hole 711 is formed by a gap between the lower cavity lower surface member 710 and the lower cavity frame member 720.
  • a release film or the like can be adsorbed by suction through the sliding hole 711.
  • the lower mold 700 is provided with heating means (not shown) for heating the lower mold 700, for example. By heating the lower mold 700 with the heating means, the resin in the lower cavity 701 is heated and cured (melted and cured).
  • the lower mold 700 can be moved in the vertical direction by a drive mechanism (not shown) provided in the first molding module 500, for example.
  • the lower mold outside air blocking member of the lower mold 700 is not illustrated or described in detail for the sake of simplicity.
  • FIG. 11 shows a cross-sectional view of the second molding module 800 of the resin sealing device of the present embodiment and the substrate 2 to be resin-sealed thereby.
  • the second molding module 800 includes an upper mold 900 and a substrate holding member (lower mold) 1000 disposed to face the upper mold.
  • the upper mold 900 is a transfer mold, for example, an upper cavity upper surface member 910, an upper cavity frame member 920 that is a frame member surrounding the upper cavity upper surface member 910, and a flat terminal mounted on the substrate 2.
  • 6 is formed of a convex member 930 for exposing 6, a plurality of elastic members 902, and an upper mold base plate 940.
  • the upper cavity 901 is configured by the upper cavity upper surface member 910.
  • the upper mold 900 is mounted in a state where the upper cavity upper surface member 910 is suspended from the upper mold base plate 940 via a plurality of elastic members 902, and the upper cavity frame member 920 is suspended from the upper mold base plate 940. It is equipped with.
  • mold 900 illustration and detailed description are abbreviate
  • the upper mold 900 is provided with, for example, a resin passage 950 for supplying a resin material.
  • the upper cavity 901 and the pot 960 are connected by the resin passage 950.
  • the plunger 970 arranged inside the pot 960 can move in the vertical direction by a plunger driving mechanism (not shown) provided in the second molding module 800, for example.
  • the substrate holding member (lower mold) 1000 is a plate for placing the substrate 2 whose one surface is resin-sealed by the first molding module 500, and includes, for example, a cavity lower surface member 1010, a cavity frame member 1020, and a plurality of substrates.
  • the elastic member 1030 and the base member 1040 are formed.
  • a cavity lower surface member 1010 and a cavity frame member 1020 constitute a cavity 1001.
  • the cavity lower surface member 1010 and the cavity frame member 1020 are installed in a state of being placed on the base member 1040 via a plurality of elastic members 1030.
  • the substrate 2 is placed on the substrate holding member (lower mold) 1000 such that the resin sealing region is accommodated in the cavity 1001.
  • the second molding module 800 is provided with a heating means (not shown) for heating the pot 960, for example.
  • a heating means for heating the pot 960, for example.
  • the resin supplied (set) to the pot 960 is heated and cured (melted and cured).
  • the substrate holding member (lower mold) 1000 can be moved in the vertical direction by a substrate holding member driving mechanism (not shown) provided in the second molding module 800, for example.
  • the cavity 601 may be filled with a gel-like solid instead of the configuration in which the compressed air is supplied to the cavity 601.
  • the resin sealing method of this embodiment will be described with reference to FIGS.
  • a resin sealing method using the resin sealing device of this embodiment will be described.
  • the resin sealing method of this embodiment is not limited to using the resin sealing device.
  • a substrate supply step and a resin supply step described below are performed prior to the first resin sealing step.
  • Each step is an optional component in the resin sealing method.
  • the substrate transport mechanism 1100 supplies the substrate 2 to the substrate holding member (upper mold) 600 of the first molding module 500, and the substrate 2 is removed by the substrate clamper and the suction holes (not shown). Fix (substrate supply process). After the substrate supply process, the substrate transport mechanism 1100 is withdrawn.
  • a resin transport mechanism (not shown) is inserted between the substrate holding member (upper mold) 600 and the lower mold 700.
  • the resin transport mechanism causes the release film 130, the resin frame member 140 placed on the release film 130, and the granular resin 150 a supplied to the internal through hole 140 ⁇ / b> A of the resin frame member 140, Transport to lower mold 700.
  • the release film 130 is adsorbed from the sliding hole 711 in the gap between the lower cavity lower surface member 710 and the lower cavity frame member 720 by suction in the arrow direction Y shown in FIG.
  • granular resin 150a are supplied (resin supply step). Thereafter, the resin transport mechanism and the resin frame member 140 are withdrawn.
  • the first resin sealing step of this embodiment is performed.
  • one surface of the substrate is resin-sealed by compression molding using the first molding module 500 having a lower mold.
  • the granular resin 150a is heated and melted by the lower mold 700 heated by a heating means (not shown) to be a molten resin (flowable resin) 150b.
  • the lower mold 700 is raised by a drive mechanism (not shown), and attached to the lower surface of the substrate 2 on a molten resin (fluid resin) 150 b filled in the lower cavity 701.
  • the chip 1 and the wire 3 are immersed.
  • the high-pressure gas source 650 supplies air having the same pressure as the molding pressure to the substrate holding member (upper mold) 600 in the direction of the arrow in FIG.
  • one surface (lower surface) of the substrate 2 can be resin-sealed while the substrate warpage is suppressed.
  • the lower mold 700 is lowered by a drive mechanism (not shown) to open the mold. Perform (mold opening process).
  • opening the mold for example, as shown in FIG. 15, suction through the sliding hole 711 may be released.
  • the substrate transport mechanism 1100 transports the substrate 2 on which one surface (lower surface) is molded to the second molding module 800 (second module transport step).
  • the substrate 2 is transported to the substrate holding member (lower mold) 1000 of the second molding module 800 by the substrate transport mechanism 1100 shown in FIG. Thereafter, the tablet resin is supplied to the pot 960 by a resin transport mechanism (not shown), and further the tablet resin is heated and melted by a pot (lower mold) heated by a heating means (not shown) to be melted.
  • (Flowable resin) 971a (resin supply step).
  • the substrate transport mechanism 1100 may supply the tablet resin.
  • the substrate 2 may be turned upside down by a substrate turning mechanism (not shown). In that case, the cavity is upside down.
  • the upper mold 900 and the substrate holding member (lower mold) 1000 are clamped.
  • the lower surface of the convex member 930 attached to the upper cavity surface of the upper mold 900 is pressed against the upper surface of the flat terminal 6 attached to the upper surface of the substrate 2.
  • the second resin sealing step of this embodiment is performed.
  • the second surface of the substrate 2 (upper surface) is resin-sealed by transfer molding by the second molding module 800.
  • the substrate holding member (lower mold) 1000 is raised by a substrate holding member driving mechanism (not shown) to clamp the substrate 2.
  • the plunger 970 is raised by a plunger drive mechanism (not shown) to fill the upper cavity 901 with molten resin (fluid resin) 971a, and further, the fluid resin 971a is cured.
  • the sealing resin 971 is used.
  • the upper surface of the substrate 2 is resin-sealed with the sealing resin 971 and molded.
  • the upper surface of the flat terminal 6 is pressed against the lower surface of the convex member 930, it is not immersed in the molten resin 971a. Therefore, resin sealing can be performed in a state where the upper surface of the flat terminal 6 is exposed from the sealing resin 971.
  • the other surface is resin-sealed by transfer molding.
  • the other surface is resin-sealed by transfer molding.
  • the substrate used in this example is the same as the substrate 2 shown in FIG.
  • the compression molding mold module (one molding module) serves as both the first molding module and the second molding module.
  • the compression molding mold module is provided with a compression molding mold.
  • the resin sealing device further includes a substrate reversing mechanism for reversing the upper limit of the substrate.
  • FIG. 19 shows a cross-sectional view of the resin sealing device of this example and the substrate that is resin-sealed thereby.
  • the compression molding mold module 500A includes a substrate holding member (upper die) 600B and a lower die 700 disposed to face the substrate holding member (upper die) 600B.
  • the substrate holding member (upper die) 600B is the same as the substrate holding member (upper die) 600 shown in FIG. 15 except that the convex member 630 is not included, and the lower die 700 is the same as the lower die 700 shown in FIG.
  • the height of the cavity 601 is assumed in consideration of, for example, actual processing (molding mold and resin sealing), the height of each sealing resin after resin sealing, and the like. The height is equal to or slightly higher than the height of the sealing resin of the molded substrate. By doing so, the sealing resin can be reliably accommodated in the cavity 601.
  • a compression molding mold module 500A is used instead of the first molding module 500 of the second embodiment, and a substrate holding member (upper mold) is used instead of the substrate holding member (upper mold) 600 of the first molding module 500. Except for supplying the substrate 2 to 600B and using the same substrate 2 as in FIG. 20A (that is, having the ball terminal 5 instead of the flat terminal 6) instead of the substrate 2 of the second embodiment.
  • the substrate supply process is performed in the same manner as the substrate supply process of Example 2.
  • the resin supply process is performed in the same manner as the resin supply process of Example 2.
  • the first resin sealing step is performed (not shown).
  • the mold opening process is performed in the same manner as the mold opening process of the second embodiment.
  • the substrate 2 whose one surface is sealed with resin is withdrawn from the compression mold module 500A by the substrate reversing mechanism 1100A (withdrawing step).
  • the substrate reversing mechanism may also serve as a substrate transport mechanism similar to the substrate transport mechanism 1100 in the second embodiment.
  • the substrate reversing mechanism 1100A is rotated 180 degrees together with the substrate 2 fixed to the substrate reversing mechanism 1100A (substrate reversing step).
  • the substrate reversing mechanism 1100A enters the compression molding mold module 500A (entry process).
  • the substrate 2 fixed to the substrate reversing mechanism 1100A is fixed to the substrate holding member (upper die) 600B by the substrate clamper and the suction hole (not shown) (substrate supply step).
  • the exiting step and the entering step are optional components. For example, the exiting step and the entering step do not have to exit, as long as the substrate 2 can be reversed.
  • the substrate inversion step is not limited to this, and the substrate may be rotated in any direction different from the arrow in FIG. 20B, for example, as long as the substrate can be inverted.
  • the resin supply process is performed.
  • the release film (used release film) used in the first resin sealing step may be collected, and a new release film may be used in the resin supply step.
  • a second resin sealing step is performed in the same manner as the first resin sealing step in Example 2 except that the other surface is resin-sealed instead of the one surface ( (Not shown).
  • the resin-sealed surface may be pressed with compressed air, but may not be pressed.
  • the other surface is sealed with resin.
  • warping of the substrate can be suppressed even when resin pressure is applied to the substrate from the other surface side.

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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention concerne un dispositif d'encapsulation par résine et un procédé d'encapsulation par résine, lesquels permettent à la fois la limitation du gauchissement et le moulage sur les deux faces d'un substrat. Plus spécifiquement, le dispositif d'encapsulation par résine de l'invention se caractérise en ce qu'il est destiné à l'encapsulation par résine des deux faces d'un substrat et en ce qu'il comporte un premier module de moulage et un deuxième module de moulage. Ce dispositif d'encapsulation se caractérise en outre en ce que le premier module de moulage est un module de moulage pour moulage par compression, et en ce qu'il permet, après encapsulation par résine lors d'une étape de moulage par compression d'une première face du substrat au niveau du premier module de moulage, l'encapsulation par résine de l'autre face du substrat au niveau du deuxième module de moulage.
PCT/JP2016/069186 2015-11-09 2016-06-28 Dispositif d'encapsulation par résine et procédé d'encapsulation par résine WO2017081883A1 (fr)

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KR1020187016324A KR102192732B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법
CN202010234428.8A CN111403303B (zh) 2015-11-09 2016-06-28 树脂封装装置以及树脂封装方法
CN202310498021.XA CN116435200A (zh) 2015-11-09 2016-06-28 树脂封装装置以及树脂封装方法
KR1020207023465A KR102228644B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 장치 및 수지 밀봉 방법
CN201680053681.5A CN108025466B (zh) 2015-11-09 2016-06-28 树脂封装装置以及树脂封装方法

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JP2015219978A JP6506680B2 (ja) 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法
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CN116435200A (zh) 2023-07-14
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