WO2016194158A1 - 液冷冷却器、及び液冷冷却器に於ける放熱フィンの製造方法 - Google Patents
液冷冷却器、及び液冷冷却器に於ける放熱フィンの製造方法 Download PDFInfo
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- WO2016194158A1 WO2016194158A1 PCT/JP2015/065988 JP2015065988W WO2016194158A1 WO 2016194158 A1 WO2016194158 A1 WO 2016194158A1 JP 2015065988 W JP2015065988 W JP 2015065988W WO 2016194158 A1 WO2016194158 A1 WO 2016194158A1
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- Prior art keywords
- coolant
- heat sink
- liquid
- heat
- liquid cooling
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- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 239000000110 cooling liquid Substances 0.000 claims abstract description 58
- 239000002826 coolant Substances 0.000 claims description 164
- 238000001816 cooling Methods 0.000 claims description 119
- 239000007788 liquid Substances 0.000 claims description 104
- 238000010438 heat treatment Methods 0.000 claims description 89
- 230000005855 radiation Effects 0.000 claims description 56
- 238000005520 cutting process Methods 0.000 claims description 14
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- 239000012809 cooling fluid Substances 0.000 claims description 5
- 238000011144 upstream manufacturing Methods 0.000 abstract description 46
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- 230000003247 decreasing effect Effects 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 10
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- 229910052782 aluminium Inorganic materials 0.000 description 3
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- 239000010949 copper Substances 0.000 description 3
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- 238000001125 extrusion Methods 0.000 description 3
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- 238000012546 transfer Methods 0.000 description 3
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
Definitions
- the present invention relates to a liquid-cooled cooler provided with a heat sink that releases heat from a heating element to a coolant, and a method of manufacturing a radiating fin in the liquid-cooled cooler.
- liquid cooling has higher cooling performance than conventional air-cooled coolers.
- a vessel may be used.
- a liquid cooling type cooling device in which a fin region provided with cooling fins is formed long in the flow direction of the coolant, the cooling region is cooled by receiving heat from a heating element arranged in the upstream region in the downstream region of the coolant. The temperature of the liquid is higher than that in the upstream region.
- the heating element that is thermally connected to the cooling liquid in the downstream region has a higher temperature than the heating element that is thermally connected to the cooling liquid in the upstream region, and a temperature difference occurs between the heating elements. If there is a temperature difference between the heat generating elements, there will be a problem that the life of the heat generating elements will vary and the characteristics of the heat generating elements will vary, so there is a temperature difference between the coolant in the upstream region and the coolant in the downstream region. However, it is desirable to devise a device that does not cause a temperature difference between the heating element in the upstream region and the heating element in the downstream region.
- the fins are arranged on the two opposing surfaces of the cooler, and the fins contributing to heat radiation are only the fins arranged on the surface thermally connected to the heating element.
- the fins arranged on the other surface serve to agitate the coolant, but do not contribute to heat dissipation.
- the conventional liquid-cooled cooler disclosed in Patent Document 2 needs to provide fins that do not contribute to heat dissipation in the cooler, and thus there is a problem that the cooler is increased in size.
- the conventional liquid-cooled cooler disclosed in Patent Document 3 described above has a structure in which the coolant is agitated by providing irregularities for guiding the coolant on the surface of the comb-shaped heat dissipation fin.
- the structure is arranged only on the surface that is thermally connected to the heat generating element, it can be downsized to some extent, but it flows into the area away from the unevenness of the surface of the radiating fin, that is, near the middle of the radiating fin
- the cooling liquid which cannot be influenced by the unevenness has a problem that a sufficient stirring effect cannot be obtained.
- the present invention has been made to solve the above-described problems in the prior art, and provides a liquid cooling cooler that can suppress the temperature difference between the upstream end and the downstream end of each heating element. Objective.
- this invention aims at providing the liquid cooling cooler provided with the radiation fin which can stir a cooling liquid effectively.
- an object of the present invention is to provide a method of manufacturing a heat radiating fin that can easily manufacture a heat radiating fin in a liquid-cooled cooler.
- the liquid cooling cooler according to the present invention is A jacket that circulates the coolant in the interior; and a heat sink that contacts the coolant that circulates in the jacket; and the heat generated by the heating element is transmitted to the coolant via the heat sink to dissipate heat.
- a liquid cooling cooler, The heat sink is A heat sink base member having a first surface facing the inside of the jacket; A plurality of heat dissipating fins provided on the first surface portion of the heat sink base member and in contact with the coolant flowing through the jacket; With The plurality of radiating fins are inclined toward the downstream side of the coolant flowing through the inside of the jacket. It is characterized by that.
- the manufacturing method of the radiation fin in the liquid cooling cooler by this invention is as follows. On the first surface portion of the heat sink base member, a plate-like radiating fin region protruding from the first surface portion with a predetermined dimension is formed. A plurality of circular blades having different diameters arranged at predetermined intervals are rotated, and the plurality of radiating fins are simultaneously cut by the plurality of circular blades at an angle inclined with respect to the first surface portion. Form, It is characterized by that.
- the manufacturing method of the radiation fin in the liquid cooling cooler by this invention is as follows.
- a plurality of protrusions arranged in parallel with each other and protruding from the first surface portion with a predetermined dimension are formed on the first surface portion of the heat sink base member.
- the plurality of ridges are provided in contact with the first surface portion, are inclined in a predetermined direction with respect to the first surface portion, and are provided in contact with the inclined ridge portion and the inclined ridge portion, An upright ridge that stands upright with respect to the first surface, By cutting the plurality of protrusions, the plurality of radiation fins are formed. It is characterized by that.
- the heat sink has a thermal resistance in a direction in which the coolant flows from a portion that directly or indirectly contacts the heating element to a portion that contacts the coolant. Therefore, the temperature difference between the upstream end and the downstream end of each heating element can be suppressed.
- the plurality of radiating fins are configured to incline toward the downstream side of the cooling liquid flowing through the inside of the jacket.
- the temperature distribution of the coolant can be made uniform in a cross section perpendicular to the flow direction of the coolant. A decrease in cooling performance can be suppressed. Accordingly, since the radiating fins need only be arranged on the surface where the heat generating elements are arranged, the liquid cooling cooler can be reduced in size. In addition, there is no need to provide a header that is a flow path aggregate portion of the cooling liquid, and the liquid cooling cooler can be reduced in size.
- a plate-shaped heat radiating fin region protruding from the first surface portion with a predetermined dimension on the first surface portion of the heat sink base member.
- a plurality of circular blades having different diameters arranged at predetermined intervals are rotated, and the plurality of blades are simultaneously cut at an angle inclined with respect to the first surface portion by the plurality of rotary blades. Since the radiating fins are formed, the inclined radiating fins can be formed very easily.
- the heat sink base member is disposed in parallel with each other so as to protrude from the first surface portion with a predetermined dimension on the first surface portion.
- a plurality of ridges, the plurality of ridges being provided in contact with the first surface portion, inclined in a predetermined direction with respect to the first surface portion, and inclined ridge portions,
- the plurality of radiating fins are formed by cutting the plurality of ridges, the ridges being provided in contact with the inclined ridges and standing upright with respect to the first surface portion. Therefore, the heat radiation fin having the inclined portion and the upright portion in contact with the inclined portion can be formed very easily.
- FIG. 3 is an explanatory diagram schematically showing a cross section taken along the line WW in FIG. 2.
- Embodiment 2 of this invention It is a disassembled perspective view of the liquid cooling cooler by Embodiment 2 of this invention.
- Embodiment 2 of this invention It is a disassembled perspective view of the modification of the liquid cooling cooler by Embodiment 2 of this invention.
- FIG. 1 is an exploded perspective view of a liquid cooling cooler according to Embodiment 1 of the present invention
- FIG. 2 is a plan view of the liquid cooling cooler according to Embodiment 1 of the present invention
- FIG. It is explanatory drawing which shows typically the arrow cross section along a W line
- An arrow A shown in FIGS. 1 and 3 indicates a flow direction of a coolant such as water.
- a liquid cooling cooler 100 includes a water jacket 7 as a jacket for circulating a cooling liquid therein, a heat sink 40, a cooling liquid inlet pipe 8, and a cooling liquid outlet pipe 9. I have.
- the water jacket 7 includes a bottom portion 71, a peripheral wall portion 72 formed integrally with the bottom portion 71, and a coolant passage 6 surrounded by the bottom portion 71 and the peripheral wall portion 72.
- the opposite side 71 side of the coolant passage 6 is open.
- the peripheral wall portion 72 includes a pair of short side portions 721 and 722 facing each other and a pair of long side portions 723 and 724 facing each other.
- the coolant inlet pipe 8 fixed to the peripheral wall portion 72 passes through one short side portion 721 of the peripheral wall portion 72 and opens into the coolant passage 6.
- the coolant outlet pipe 9 fixed to the peripheral wall portion 72 passes through the other short side portion 722 of the peripheral wall portion 72 and opens into the coolant passage 6.
- the heat sink 40 includes a heat sink base member 4 and a large number of later-described heat radiation fins 5 formed on the first surface portion 41 of the heat sink base member 4.
- the heat sink 40 is liquid-tightly fixed to the peripheral wall portion 72 of the water jacket 7 so that the first surface portion 41 faces the coolant passage 6 and closes the coolant passage 6. That is, the coolant passage 6 is formed by a space formed by the bottom 71 of the water jacket 7, the peripheral wall 72, and the heat sink base member 4.
- the heat radiating fins 5 formed on the first surface portion 41 of the heat sink 40 are inserted into the coolant passage 6 of the water jacket 7.
- the first heat generating element 1, such as a power semiconductor element, the second heat generating element 2, and the third heat generating element 3 are fixed to the second surface portion 42 of the heat sink 40, respectively.
- the coolant flowing into the coolant passage 6 cools the first heat generating element 1, the second heat generating element 2, and the third heat generating element 3 via the heat radiation fin 5 and the heat sink base member 4.
- the first heat generating element 1 is arranged on the most upstream side in the flow direction A of the coolant in the coolant passage 6 with respect to the other heat generating elements
- the third heat generating element 3 is the other heat generating element 3.
- the second heat generating element 2 is disposed between the first heat generating element 1 and the third heat generating element 3 and is disposed on the most downstream side in the coolant flow direction A in the coolant passage 6 with respect to the element. Has been placed.
- Tw 1U is the coolant temperature immediately below the upstream portion of the heating element 1
- Tw 1D is the coolant temperature immediately below the downstream portion of the heating element 1
- Tw 2U is the cooling immediately below the upstream portion of the heating element 2.
- the liquid temperature Tw 2D is the coolant temperature immediately below the downstream part of the heating element 2
- Tw 3U is the coolant temperature immediately below the upstream part of the heating element 3
- Tw 3D is immediately below the downstream part of the heating element 3.
- the coolant temperature is shown. In the downstream area, the coolant becomes higher in temperature than the upstream area due to heat received from the heat generating elements arranged in the upstream area. Therefore, the relative relationship of the aforementioned temperatures of the coolant is as follows. Tw 1U ⁇ Tw 1D ⁇ Tw 2U ⁇ Tw 2D ⁇ Tw 3U ⁇ Tw 3D
- Tc 1U is the temperature of the upstream part of the heating element 1
- Tc 1D is the temperature of the downstream part of the heating element 1
- Tc 2U is the temperature of the upstream part of the heating element 2
- Tc 2D is the downstream side of the heating element 2.
- the temperature of the part, Tc 3U indicates the temperature of the upstream part of the heating element 3
- Tc 3D indicates the temperature of the downstream part of the heating element 3, respectively.
- the heating elements 1, 2, and 3 are affected by the temperature difference of the coolant, Tc 1U ⁇ Tc 1D ⁇ Tc 2U ⁇ Tc 2D ⁇ Tc 3U ⁇ Tc 3D
- Tc 1U ⁇ Tc 1D ⁇ Tc 2U ⁇ Tc 2D ⁇ Tc 3U ⁇ Tc 3D Tc 1U ⁇ Tc 1D ⁇ Tc 2U ⁇ Tc 2D ⁇ Tc 3U ⁇ Tc 3D
- the heat resistance is set so as to continuously decrease in the flow direction of the cooling liquid in accordance with the temperature rise of the cooling liquid as described above.
- the temperature difference between 1, 2, 3 is suppressed.
- variations in the life of the heating elements and variations in the characteristics of the heating elements due to temperature variations between the heating elements are suppressed.
- the thermal resistance is set so as to continuously decrease in the flow direction of the coolant, but the setting of the thermal resistance is specifically any one of the following means or those This can be done by combining these means.
- the heat dissipating capacity of the heat dissipating fins is sequentially increased toward the downstream side in the coolant flow direction.
- the thickness of the heat sink base member 4 is gradually reduced toward the downstream side in the coolant flow direction.
- the heat conductivity of the heat sink base member 4 is gradually increased toward the downstream side in the coolant flow direction.
- the heat conductive filler is mixed with the material of the heat sink base member 4, and the heat conductivity of the heat sink base member 4 is gradually increased toward the downstream side in the coolant flow direction.
- the shape of the radiating fin 5 may be a plurality of plates having a predetermined thickness, or a plurality of columns such as a cylinder, an elliptical column, a cone, an elliptical cone, a polygonal column, and a polygonal column.
- the thermal resistance does not necessarily need to be gradually decreased toward the downstream side in the flow direction of the coolant, and may be appropriately increased or decreased in the coolant passage 6 according to the cooling priority of the heating elements.
- Embodiment 2 a liquid cooling cooler according to Embodiment 2 of the present invention will be described.
- the liquid cooling cooler according to the second embodiment of the present invention has a cooling liquid temperature between the heating element arranged on the most upstream side in the flow direction of the cooling liquid and the heating element arranged on the most downstream side. It is characterized in that the cross-sectional area of the coolant passage is changed according to the rise.
- FIG. 4 is an exploded perspective view of a liquid cooling cooler according to Embodiment 2 of the present invention
- FIG. 5 is an exploded perspective view of a modification of the liquid cooling cooler according to Embodiment 2 of the present invention.
- Arrows A shown in FIGS. 4 and 5 indicate the flow direction of the coolant. 4 and 5, V 1 is the flow velocity of the coolant in the region where the cross-sectional area of the coolant passage 6 is large, and V 2 is the cooling in the region where the cross-sectional area of the coolant passage 6 is small. The flow rate of the liquid is shown respectively.
- the liquid-cooled cooler according to the second embodiment of the present invention has a cooling liquid passage 6 in response to a continuous increase in the cooling liquid temperature from the most upstream side to the most downstream side of the cooling liquid in the cooling liquid passage 6.
- the cross-sectional area is configured to be reduced. Therefore, the flow rate of the coolant (a V- 1 ⁇ V 2) increases with the decrease of the cross-sectional area of the coolant passages 6.
- the heat dissipation capability of the heat dissipating fins 5 increases, so that the thermal resistance decreases.
- the sectional area of the coolant passage 6 is gradually decreased in the width direction of the water jacket 7 toward the downstream side in the coolant flow direction. ing.
- the number of the radiating fins 5 is adjusted according to the cross-sectional area of the coolant passage 6. That is, the number of the radiating fins 5 gradually decreases toward the downstream side in the flow direction A of the coolant.
- the cross-sectional area of the cooling fluid passage 6 is set in the direction perpendicular to the thickness direction of the water jacket 7, that is, the flow direction of the cooling fluid (high (Direction), the temperature is gradually decreased toward the downstream side in the flow direction of the coolant.
- the height of the radiating fin 5 is adjusted according to the cross-sectional area of the coolant passage 6. That is, the height of the heat radiating fins 5 gradually decreases toward the downstream side in the flow direction A of the coolant.
- the cross-sectional area of the coolant passage 6 does not necessarily need to be gradually decreased toward the downstream side in the coolant flow direction, and may be increased or decreased as appropriate according to the cooling priority of the heating elements.
- Embodiment 3 FIG. Next, a liquid cooling cooler according to Embodiment 3 of the present invention will be described.
- the liquid-cooled cooler according to Embodiment 3 of the present invention has a cooling liquid temperature between the heating element arranged on the most upstream side in the flow direction of the cooling liquid and the heating element arranged on the most downstream side.
- the height of the radiating fin is changed according to the rise.
- FIG. 6 is a cross-sectional view in the coolant flow direction of the liquid cooling cooler according to the third embodiment of the present invention.
- An arrow A shown in FIG. 6 indicates the flow direction of the coolant.
- the height of the radiating fin 5 is between the heating element 1 arranged on the most upstream side in the flow direction of the coolant and the heating element 3 arranged on the most downstream side. It is comprised so that it may become large gradually toward the downstream of the distribution direction A of a liquid.
- the surface area of the radiating fins increases as the height of the radiating fins 5 increases. When the surface area of the radiating fin 5 is increased, the heat radiating capability of the radiating fin 5 is increased, so that the thermal resistance is decreased.
- the height of the heat dissipating fins 5 does not necessarily need to be gradually increased toward the downstream side in the flow direction of the coolant, and may be appropriately increased or decreased according to the cooling priority of the heating elements.
- Embodiment 4 FIG. Next, a liquid cooling cooler according to Embodiment 4 of the present invention will be described.
- the liquid cooling cooler according to the fourth embodiment of the present invention has a cooling liquid temperature between the heating element arranged on the most upstream side in the flow direction of the cooling liquid and the heating element arranged on the most downstream side.
- the number of radiating fins per unit area of the region where the radiating fins are arranged is changed according to the rise.
- FIG. 7 is a perspective view showing a heat sink in the liquid-cooled cooler according to Embodiment 4 of the present invention, and shows the heat dissipating fins at the top of the figure.
- An arrow A in FIG. 7 indicates the flow direction of the coolant.
- the cooling is performed from the heating element arranged on the most upstream side in the flow direction of the cooling liquid to the heating element arranged on the most downstream side.
- the number of radiating fins 5 per unit area in the region where the radiating fins are arranged gradually increases toward the downstream side in the liquid flow direction.
- the surface area of the radiating fins 5 is increased as a whole, and the cross-sectional area of the coolant passage 6 is also decreased, so that the flow rate of the coolant is increased. Since the surface area of the radiating fin 5 is increased and the flow rate of the coolant is increased, the radiating capability of the radiating fin 5 is increased, so that the thermal resistance is reduced.
- the surface area of the heat dissipating fins 5 is increased and the cross-sectional area of the coolant passage 6 is also decreased, so that the flow rate of the coolant increases. Since the surface area of the radiating fin 5 is increased and the flow rate of the coolant is increased, the radiating capability of the radiating fin 5 is increased, so that the thermal resistance is reduced.
- Embodiment 6 FIG. Next, a liquid cooling cooler according to Embodiment 6 of the present invention will be described.
- the liquid cooling cooler according to the sixth embodiment of the present invention is characterized in that the radiating fin is inclined toward the downstream side in the flow direction of the cooling liquid.
- FIG. 9 is a perspective view showing a heat sink in a liquid-cooled cooler according to Embodiment 6 of the present invention, in which the first surface portion 41 of the heat sink base member 4 is positioned above the figure.
- the heat sink 40 shown in FIG. the first surface portion 41 of the heat sink base member 4 is provided with a large number of heat radiating fins 5 aligned vertically and horizontally.
- the length direction of these radiating fins 5 is inclined toward the downstream side in the coolant flow direction A at a predetermined angle ⁇ with respect to the direction V perpendicular to the first surface portion 41 of the heat sink base member 4.
- the angle ⁇ is referred to as an inclination angle.
- each of the radiating fins 5 has a quadrilateral cross section in a direction perpendicular to the length direction.
- the quadrangle includes any of a square, a rectangle, or a rhombus.
- the first ridge line 51 of the radiating fin 5 is located on the most upstream side in the coolant flow direction A with respect to the other parts of the radiating fin 5, and the second ridge line 52 facing the first ridge line 51 is: It is located on the most downstream side in the flow direction A of the coolant from the other parts of the heat dissipating fins 5.
- a plurality of radiating fin groups aligned in a direction orthogonal to the flow direction A of the coolant is referred to as a “radiation fin row group”, and a plurality of radiating fin groups aligned in the direction A of the coolant is radiated. This is referred to as “fin row group”.
- a first gap 50 a is provided between adjacent radiating fins 5.
- a second gap 50b is provided between adjacent radiating fins 5. It does not matter whether the size of the first gap 50a and the size of the second gap 50b are the same.
- the individual radiating fins 5 of one radiating fin row group are arranged at positions corresponding to the first gaps 50a of the adjacent radiating fin row groups. Similarly, the individual radiating fins 5 of one radiating fin row group are arranged at positions corresponding to the aforementioned second gaps 50b of the adjacent radiating fin row groups (see FIG. 1).
- the radiating fins 5 are columnar bodies inclined toward the downstream side in the coolant flow direction A at a predetermined angle ⁇ with respect to the direction V perpendicular to the first surface portion 41 of the heat sink base member 4. 9, 10, and 11, the cross-sectional shape is a quadrangular prism, but the shape of the radiating fin 5 is a polygonal column other than a cylinder, an elliptical column, a cone, an elliptical cone, and a rectangular column. , Multi-faceted reasoning or the like.
- the radiating fins 5 are inclined to the downstream side in the coolant flow direction A at a predetermined inclination angle ⁇ with respect to the direction V orthogonal to the first surface portion 41 of the heat sink base member 4.
- the first fin surface 53 and the second fin surface 54 in contact with the first ridge line 51 located on the upstream side in the flow direction A of the coolant are the first fin surface 53 and the second fin surface 54 of the heat sink base member 4.
- the first surface portion 41 extends at an obtuse angle.
- the third fin surface 55 and the fourth fin surface 56 that are in contact with the second ridge line 52 located on the downstream side in the coolant flow direction A are acute with respect to the first surface portion 41 of the heat sink base member 4. Is extended.
- the coolant is composed of the third fin surface 55 and the fourth fin surface that form the side surfaces of the radiation fins 5 that have an acute angle with the first surface portion 41 of the heat sink base member 4.
- the first heat sink base member 4 in addition to changing the direction of flow in a direction parallel to the first surface portion 41 of the heat sink base member 4 (see the arrow indicated by the thin solid line in FIG. 4), the first heat sink base member 4 The direction of the flow is also changed in a direction perpendicular to the first surface portion 41 of the heat sink base member 4 so as to approach the surface portion 41 (see the arrow indicated by the thin wavy line in FIG. 4).
- the coolant is perpendicular to the direction parallel to the first surface portion 41 of the heat sink base member 4 by the heat radiating fins 5. Agitated in both directions.
- the radiating fins 5 are arranged in the radiating fin row group and the radiating fin row group as described above, and the individual radiating fins 5 of the radiating fin row group are the individual radiating fin row groups. It arrange
- the coolant since the coolant always collides with the first fin surface 53 and the second fin surface 54 as the side surfaces of the heat radiating fins 5, the coolant cannot travel straight through the interior of the coolant passage 6, and the heat sink base It is sufficiently stirred in both directions parallel and perpendicular to the first surface portion 41 of the member 4. Therefore, the radiating fins 5 need only be provided on the heat sink base member 4 to which the heating elements are fixed, and need not be provided on the bottom 71 of the water jacket 7. Therefore, the liquid cooling cooler can be downsized.
- FIG. 12A is a graph for explaining the heat radiation performance of the liquid-cooled cooler, and is a graph comparing the heat radiation performance due to the difference in the inclination direction by calculating the heat transfer coefficient of the heat radiation fin by numerical simulation.
- the vertical axis represents “heat transfer coefficient” [a. u] (arbitrary unit: arbitrary unit)
- the horizontal axis is the “distance from the upstream of the radiating fin” [a. u].
- the “distance from the upstream side of the radiating fin” is the distance from the most upstream side portion in the flow direction A of the coolant in each radiating fin 5 to each portion in the length direction of the radiating fin. is there.
- the radiating fin 5 when the radiating fin 5 is inclined to the downstream side in the coolant flow direction A at the aforementioned inclination angle ⁇ , the radiating fin 5
- the portion on the most upstream side in the flow direction A of the cooling liquid in this is the base portion of the radiating fin 5 in contact with the first surface portion 41 of the heat sink base member 4. It means the distance from the root portion of the fin 5 to each part in the length direction of the heat radiating fin 5 extending inclined toward the downstream side in the coolant flow direction A.
- the radiating fin 5 when the radiating fin 5 is inclined to the upstream side in the coolant flow direction A at the aforementioned inclination angle ⁇ , the coolant flow direction A in the radiating fin 5 is changed. Since the most upstream side portion is the tip portion opposite to the root portion of the radiating fin 5, the “distance from the upstream side of the radiating fin” refers to the radiating fin 5 from the tip portion opposite to the root portion of the radiating fin 5. It means the distance to each part in the length direction.
- the solid line X indicates that the radiating fin 5 is inclined at an inclination angle ⁇ toward the downstream side in the coolant flow direction A as shown in the sixth embodiment of the present invention and FIG. 12B.
- the heat dissipation characteristic of the heat dissipation fin is shown.
- the broken line Y indicates the heat radiation characteristics of the heat radiation fin when the heat radiation fin 5 is inclined at the inclination angle ⁇ toward the upstream side in the coolant flow direction A, as shown in FIG. 12C. From the comparison between the heat dissipation characteristic X and the heat dissipation characteristic Y shown in FIG.
- the heat transfer rate in each part of the heat dissipation fin is not limited regardless of the distance from the upstream in the flow direction A of the coolant.
- the first embodiment inclined toward the downstream side in the direction A and the heat dissipating fin shown in FIG. 12B heat more than the heat dissipating fin inclined toward the upstream side in the coolant flow direction A. It can be seen that the transmission rate is high and the heat dissipation performance is excellent.
- the heat dissipating fin 5 in the liquid cooling cooler according to the sixth embodiment of the present invention described above is cut, forged, processed by die casting, 3D printer, etc., using a good heat conductive material such as aluminum, copper, ceramics, etc. Can be produced.
- the heat radiating fin is formed vertically on the first surface portion of the heat sink base member, and then an external force is applied to the vertically formed heat radiating fin to downstream of the coolant flow direction. You may make it manufacture the radiation fin 5 by making it incline toward the side.
- the heat sink base member 4 may be provided with irregularities in the region where the heat dissipating fins 5 do not exist in the first surface portion 41 so as to disturb the flow of the cooling liquid to improve the heat dissipating capability.
- the inclination angle ⁇ of the fin 5 may be changed in accordance with the position of the radiation fin 5 on the first surface portion 41 of the heat sink base member 4.
- Embodiment 7 FIG. Next, a liquid cooling cooler according to Embodiment 7 of the present invention will be described.
- the shape of the radiating fin is a triangular prism, a quadrangular prism, or a hexagonal prism, and the side surfaces of the individual radiating fins are arranged in parallel with the side surfaces of other adjacent radiating fins. It is characterized by doing so.
- Other configurations are the same as those in the first embodiment.
- FIG. 13 is an explanatory view showing heat radiating fins in the liquid cooling cooler according to the seventh embodiment of the present invention.
- each of the heat dissipating fins 501 provided on the first surface portion 41 (see FIGS. 1 to 4) of the heat sink base member 4 has a triangular cross section perpendicular to the length direction. It is composed of a triangular prism, and is disposed such that adjacent fin surfaces 501a of adjacent heat dissipating fins 501 are parallel to each other.
- the coolant flows in the direction of arrow A.
- Each radiating fin 501 is inclined at an inclination angle ⁇ toward the flow direction A of the coolant.
- Other configurations are the same as those of the sixth embodiment.
- FIG. 14 is an explanatory view showing a modification of the heat dissipating fins in the liquid cooling cooler according to the seventh embodiment of the present invention.
- the heat dissipating fin 502 provided on the first surface portion 41 (see FIGS. 1, 9 to 11) of the heat sink base member 4 has a rectangular cross section perpendicular to its length direction.
- the fin surfaces 502a of the adjacent radiating fins 502 facing each other are arranged in parallel to each other.
- the coolant flows in the direction of arrow A.
- Each radiating fin 502 is inclined at an inclination angle ⁇ toward the flow direction A of the coolant.
- Other configurations are the same as those of the sixth embodiment.
- FIG. 15 is an explanatory view showing still another modified example of the radiating fin in the liquid cooling cooler according to the seventh embodiment of the present invention.
- the heat dissipating fin 503 provided on the first surface portion 41 (see FIGS. 1, 9 to 11) of the heat sink base member 4 has a hexagonal cross section perpendicular to its length direction.
- the fin surfaces 503a of the adjacent radiating fins 503 facing each other are arranged so as to be parallel to each other.
- the coolant flows in the direction of arrow A.
- Each radiating fin 503 is inclined at an inclination angle ⁇ toward the coolant flow direction A.
- Other configurations are the same as those of the sixth embodiment.
- the heat sink base member 4 in the radiation fins 501, 502, and 503 is the same as in the sixth embodiment.
- the coolant contacting the fin surface having an obtuse angle with the first surface portion 41 not only changes the flow direction in a direction parallel to the first surface portion 41 of the heat sink base member 4 but also the heat sink.
- the direction of the flow is also changed in a direction perpendicular to the first surface portion 41 of the heat sink base member 4 so as to be away from the first surface portion 41 of the base member 4.
- the coolant that comes into contact with the fin surface having an acute angle with the first surface portion 41 of the heat sink base member 4 is removed from the first surface portion of the heat sink base member 4.
- the direction of flow is also perpendicular to the first surface portion 41 of the heat sink base member 4 so as to approach the first surface portion 41 of the heat sink base member 4. Change the direction of the flow.
- the coolant is sufficiently agitated in both directions parallel and perpendicular to the first surface portion 41 of the heat sink base member 4. Therefore, the radiation fins 501, 502, and 503 need only be provided on the heat sink base member 4 to which the heat generating elements are fixed, and do not need to be provided on the bottom 71 of the water jacket 7. Therefore, the liquid cooling cooler can be downsized.
- the shape of the radiating fin is a triangular column, a quadrangular column, or a hexagonal column, it is possible to arrange the side surfaces and side surfaces of adjacent radiating fins in parallel by adjusting the dimensions.
- the fact that the side surfaces of adjacent radiating fins are parallel means that the gap between the adjacent radiating fins and the radiating fins is kept constant, and the flow rate of the coolant flowing between the adjacent radiating fins and the radiating fins Is kept constant.
- the minimum gap size between adjacent heat sink fins is defined, the gap between all adjacent heat sink fins and heat sink fins is set to the minimum gap size, so that The flow rate of the coolant flowing between the fins can be maximized within dimensional constraints. Since the heat dissipating capacity of the heat dissipating fins increases as the flow rate of the coolant increases, the cooling performance of the liquid cooling cooler according to the second embodiment of the present invention increases.
- Embodiment 8 FIG. Next, a method for manufacturing a heat radiating fin in a liquid-cooled cooler according to Embodiment 8 of the present invention will be described.
- the manufacturing method of the radiation fin in the liquid cooling cooler according to the eighth embodiment is characterized in that the radiation fin is manufactured by using a cutting tool having a plurality of circular blades having different diameters. And, like the heat radiation fin in the liquid cooling cooler according to the second embodiment, the heat radiation fin is generally inclined from the first surface portion of the heat sink base member toward the downstream side in the coolant flow direction. This is a method for manufacturing heat dissipating fins in a liquid cooling cooler.
- the cutting tool 200 is formed by fixing a plurality of circular blades 141, 142, and 143 having different diameters to the shaft 15 at a predetermined interval and with respect to the plane of the radiating fin region 510.
- a plurality of inclined fins 505 can be easily manufactured by forming a plurality of inclined grooves at the same time in the radiating fin region 510. I can do it.
- FIG. 18 is a perspective view showing a heat sink of a liquid cooling cooler according to Embodiment 9 of the present invention
- FIG. 19 is a side view showing the heat sink of the liquid cooling cooler according to Embodiment 9 of the present invention.
- the individual radiating fins 504 provided on the first surface portion 41 of the heat sink base member 4 are aligned as a radiating fin row group as in the first embodiment. Also, they are arranged as a group of radiating fins.
- the radiating fin 504 is configured by a triangular prism as shown in FIG. 6 in the second embodiment. Of course, the shape may be other than the triangular prism.
- the inclined portion 504 a is provided at the root portion of the heat radiating fin 504, and the cooling that circulates near the first surface portion 41 of the heat sink base member 4
- the cooling performance of the liquid cooling cooler is improved by mainly stirring the liquid.
- a method for manufacturing a heat radiating fin according to Embodiment 9 of the present invention is a method for manufacturing a heat radiating fin in the liquid cooling cooler shown in FIGS.
- the protrusions are formed by extruding or the like, and then the protrusions are cut in a direction perpendicular to the surface portion of the heat sink base member by a plurality of circular blades having the same diameter, so that the heat radiation fins are formed. It is characterized by manufacturing.
- the inclined ridge portion is formed on the root portion connected to the surface portion of the heat sink base member. And an upstanding ridge extending in a direction perpendicular to the surface of the heat sink base member from the inclined ridge, and is cut in a direction perpendicular to the surface of the heat sink base member with a circular blade.
- the radiation fin provided with the inclined ridge portion and the upright ridge portion of the root portion is formed.
- FIG. 20 is a perspective view for explaining a method of manufacturing the heat dissipating fin of the liquid cooling cooler according to the fourth embodiment of the present invention.
- the heat sink base member 4 made of a heat-conductive material such as aluminum, copper, or ceramics is formed on the first surface portion 41 of the heat sink base member 4 in the row direction by extrusion or the like.
- Continuously extending ridges 500 are formed by being aligned in the row direction at a predetermined interval.
- the ridge body 500 continuous in the row direction includes an inclined ridge portion 500 a inclined at an inclination angle ⁇ at a portion in contact with the first surface portion 41 of the heat sink base member 4, and the inclined protrusion.
- the upright protrusion 500b extends perpendicularly to the first surface 41 of the heat sink base member 4 from the stripe 500a.
- an arrow B direction and an arrow C are formed by using a cutting tool in which a plurality of circular blades having the same diameter are arranged at equal intervals in a protrusion 500 formed in a comb shape.
- a plurality of grooves having a predetermined width are formed at equal intervals in any one of the directions.
- grooves having a predetermined width are formed at equal intervals in the other direction of the arrow B direction and the arrow C direction.
- the plurality of circular blades having the same diameter cut the upright ridge portion 500 b of the ridge body 500 perpendicularly to the first surface portion 41 of the heat sink base member 4.
- the number of circular blades is not limited as in the eighth embodiment. By increasing the number, the heat radiation fins can be manufactured very efficiently and easily.
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Abstract
Description
内部に冷却液を流通させる冷却液通路を備えたジャケットと、少なくとも一つの発熱素子に直接または間接的に接触すると共に前記ジャケットの内部を流通する前記冷却液に接触するヒートシンクとを備え、前記発熱体が発生した熱を前記ヒートシンクを介して前記冷却液に伝達して放熱するようにした液冷冷却器であって、
前記ヒートシンクは、前記発熱素子に直接または間接的に接触する部位から前記冷却液に接触する部位に至る間の熱抵抗が、前記冷却液の流通する方向の異なる位置との間で異なる値に設定されている、
ことを特徴とする。
内部に冷却液を流通させるジャケットと、前記ジャケットの内部を流通する前記冷却液に接触するヒートシンクとを備え、発熱体が発生した熱を前記ヒートシンクを介して前記冷却液に伝達して放熱するようにした液冷冷却器であって、
前記ヒートシンクは、
前記ジャケットの内部に対向する第1の面部を有するヒートシンクベース部材と、
前記ヒートシンクベース部材の前記第1の面部に設けられ、前記ジャケットの内部を流通する前記冷却液に接触する複数の放熱フィンと、
を備え、
前記複数の放熱フィンは、前記ジャケットの内部を流通する前記冷却液の下流側に向かって傾斜している、
ことを特徴とする。
前記ヒートシンクベース部材の前記第1の面部に、前記第1の面部から所定の寸法で突出するプレート状の放熱フィン領域を形成し、
所定間隔で配置した直径が異なる複数の円形刃を回転させ、前記放熱フィン領域を前記複数の円形刃により、前記第1の面部に対して傾斜した角度で同時に切削して前記複数の放熱フィンを形成する、
ことを特徴とする。
前記ヒートシンクベース部材の前記第1の面部に、前記第1の面部から所定の寸法で突出する互いに平行に配置された複数の突条体を形成し、
前記複数の突条体は、前記第1の面部に接して設けられ、前記第1の面部に対して所定方向に傾斜して傾斜突条部と、前記傾斜突条部に接して設けられ、前記第1の面部に対して直立する直立突条部とからなり、
前記複数の突条体を切削加工することにより、前記複数の放熱フィンを形成する、
ことを特徴とする。
以下、この発明の実施の形態1による液冷冷却器について、図面を参照して詳細に説明する。図1は、この発明の実施の形態1による液冷冷却器の分解斜視図、図2は、この発明の実施の形態1による液冷冷却器の平面図、図3は、図2のW-W線に沿う矢視断面を模式的に示す説明図である。図1及び図3に示す矢印Aは、水等の冷却液の流通方向を示している。図1、及び図2に於いて、液冷冷却器100は、内部に冷却液を流通させるジャケットとしてのウォータージャケット7と、ヒートシンク40と、冷却液入口パイプ8と、冷却液出口パイプ9とを備えている。
R1U>R1D>R2U>R2D>R3U>R3D
Tw1U<Tw1D<Tw2U<Tw2D<Tw3U<Tw3D
Tc1U<Tc1D<Tc2U<Tc2D<Tc3U<Tc3D
となり、発熱素子間に温度差が生ずる筈である。
Tc1U=Tc2U=Tc3U
Tc1D=Tc2D=Tc3D
とすることが出来る。その結果、発熱素子間の温度のばらつきに起因する発熱素子の寿命のばらつきや、発熱素子の特性のばらつきが抑制される。
Tc1U=Tc1D、Tc2U=Tc2D、Tc3U=Tc3D
とすることが出来る。その結果、発熱素子内の温度差に起因する、発熱素子内部の電流分布の悪化、電流集中による発熱素子の局部過熱による破壊、短絡耐量の低下が抑制される。
(1)放熱フィンの放熱能力を冷却液の流通方向の下流側に向かって順次大きくする。
(2)ヒートシンクベース部材4の肉厚を冷却液の流通方向の下流側に向かって漸次薄くする。
(3)異種材料を接合してヒートシンクベース部材4を形成することにより、ヒートシンクベース部材4の熱伝導率を冷却液の流通方向の下流側に向かって漸次大きくする。
(4)熱伝導フィラーをヒートシンクベース部材4の材料に混合し、ヒートシンクベース部材4の熱伝導率を冷却液の流通方向の下流側に向かって漸次大きくする。
次に、この発明の実施の形態2による液冷冷却器について説明する。この発明の実施の形態2による液冷冷却器は、冷却液の流通方向の最も上流側に配置した発熱素子から最も下流側に配置した発熱素子に至るまでの間に於いて、冷却液の温度上昇に応じて冷却液通路の断面積を変化させたことを特徴としている。
次に、この発明の実施の形態3による液冷冷却器について説明する。この発明の実施の形態3による液冷冷却器は、冷却液の流通方向の最も上流側に配置した発熱素子から最も下流側に配置した発熱素子に至るまでの間に於いて、冷却液の温度上昇に応じて放熱フィンの高さを変化させるようにしたことを特徴とする。
次に、この発明の実施の形態4による液冷冷却器について説明する。この発明の実施の形態4による液冷冷却器は、冷却液の流通方向の最も上流側に配置した発熱素子から最も下流側に配置した発熱素子に至るまでの間に於いて、冷却液の温度上昇に応じて、放熱フィンが配置される領域の単位面積当たりの放熱フィンの個数を変化させることを特徴とする。
次に、この発明の実施の形態5による液冷冷却器について説明する。この発明の実施の形態5による液冷冷却器は、冷却液の流通方向の最も上流側に配置した発熱素子から最も下流側に配置した発熱素子に至るまでの間に於いて、冷却液の温度上昇に応じて、放熱フィンの1個当たりの体積を変化させたことを特徴とする。
次に、この発明の実施の形態6による液冷冷却器について説明する。この発明の実施の形態6による液冷冷却器は、放熱フィンを冷却液の流通方向の下流側に向かって傾斜したことを特徴としている。
次に、この発明の実施の形態7による液冷冷却器について説明する。この発明の実施の形態7による液冷冷却器は、放熱フィンの形状を、三角柱、四角柱、若しくは六角柱とし、個々の放熱フィンの側面が、隣接する他の放熱フィンの側面と平行に配置するようにしたことを特徴としている。その他の構成は、前述の実施の形態1の場合と同様である。
次に、この発明の実施の形態8による液冷冷却器に於ける放熱フィンの製造方法について説明する。実施の形態8による液冷冷却器に於ける放熱フィンの製造方法は、直径の異なる複数の円形刃を有する切削工具を用いて放熱フィンを製造することを特徴としており、前述の実施の形態1及び実施の形態2による液冷冷却器に於ける放熱フィンのように、放熱フィンがヒートシンクベース部材の第1の面部から冷却液の流通方向の下流側に向かって全体的に傾斜している場合の、液冷冷却器に於ける放熱フィンの製造方法である。
前述の実施の形態8による液冷冷却器に於ける放熱フィンの製造方法は、放熱フィンがヒートシンクベース部材の第1の面部から冷却液の流通方向の下流側に向かって全体的に傾斜している場合の、液冷冷却器に於ける放熱フィンの製造方法に関するものであり、直径の異なる複数の円形刃を有する切削工具を用いて放熱フィンを製造することを特徴としている。しかしながら、円形刃の枚数を多くすると、直径が極めて大きい円形刃や直径が極めて小さい円形刃が必要となる。作業性を考慮すれば、直径が過度に大きい円形刃や直径が過度に小さい円形刃を用いることが出来ないので、実用上、直径の異なる円形刃の枚数には限度があり、従って、一度に加工できる溝の数は限定されることになる。
Claims (12)
- 内部に冷却液を流通させる冷却液通路を備えたジャケットと、少なくとも一つの発熱素子に直接または間接的に接触すると共に前記ジャケットの内部を流通する前記冷却液に接触するヒートシンクとを備え、前記発熱体が発生した熱を前記ヒートシンクを介して前記冷却液に伝達して放熱するようにした液冷冷却器であって、
前記ヒートシンクは、前記発熱素子に直接または間接的に接触する部位から前記冷却液に接触する部位に至る間の熱抵抗が、前記冷却液の流通する方向の異なる位置との間で異なる値に設定されている、
ことを特徴とする液冷冷却器。 - 前記ヒートシンクの前記熱抵抗の値は、前記ジャケットの内部を流通する前記冷却液の下流側に向かって減少するように設定されている、
ことを特徴とする請求項1に記載の液冷冷却器。 - 前記ヒートシンクの前記熱抵抗の値の減少は、前記冷却液の流通する方向に対して直交する方向に於ける前記冷却液通路の断面積を減少させることにより行われる、
ことを特徴とする請求項2に記載の液冷冷却器。 - 前記ヒートシンクは、前記冷却液に接触する複数個の放熱フィンを備え、
前記冷却液通路の前記断面積の減少は、前記冷却液の流通する方向に対して直交する方向に、前記複数個の放熱フィンの長さを増大させることにより行われる、
ことを特徴とする請求項3に記載の液冷冷却器。 - 前記ヒートシンクは、前記冷却液に接触する複数個の放熱フィンを備え、
前記冷却液通路の断面積の減少は、前記冷却液通路の単位面積当たりに配置される前記放熱フィンの個数を増大させることにより行われる、
ことを特徴とする請求項3に記載の液冷冷却器。 - 前記ヒートシンクは、前記冷却液に接触する複数個の放熱フィンを備え、
前記冷却液通路の断面積の減少は、前記放熱フィンの1個当たりの体積を増大させることにより行われる、
ことを特徴とする請求項3記載の液冷冷却器。 - 前記発熱体は、複数個設けられており、
前記ヒートシンクは、前記冷却液の流通する方向の異なる位置で個々の前記発熱素子に直接または間接的に接触しており、
前記ヒートシンクの前記異なる位置に於ける前記熱抵抗は、前記複数個の発熱素子の冷却優先順位に応じて、異なる値に設定されている、
ことを特徴とする請求項1に記載の液冷冷却器。 - 内部に冷却液を流通させるジャケットと、前記ジャケットの内部を流通する前記冷却液に接触するヒートシンクとを備え、発熱体が発生した熱を前記ヒートシンクを介して前記冷却液に伝達して放熱するようにした液冷冷却器であって、
前記ヒートシンクは、
前記ジャケットの内部に対向する第1の面部を有するヒートシンクベース部材と、
前記ヒートシンクベース部材の前記第1の面部に設けられ、前記ジャケットの内部を流通する前記冷却液に接触する複数の放熱フィンと、
を備え、
前記複数の放熱フィンは、前記ジャケットの内部を流通する前記冷却液の下流側に向かって傾斜している、
ことを特徴とする液冷冷却器。 - 前記放熱フィンは、三角柱、四角柱、若しくは六角柱により構成され、
前記放熱フィンの側面は、隣接する他の放熱フィンの側面に対して平行である、
ことを特徴とする請求項8に記載の液冷冷却器。 - 前記放熱フィンは、
前記ヒートシンクベース部材の前記第1の面部に接し、前記ジャケットの内部を流通する前記冷却液の下流側に向かって傾斜する傾斜部と、
前記傾斜部から前記第1の面部に対して直立する直立部と、
を備えている、
ことを特徴とする請求項8又は9に記載の液冷冷却器。 - 請求項8又は9に記載の液冷冷却器に於ける放熱フィンの製造方法であって、
前記ヒートシンクベース部材の前記第1の面部に、前記第1の面部から所定の寸法で突出するプレート状の放熱フィン領域を形成し、
所定間隔で配置した直径が異なる複数の円形刃を回転させ、前記放熱フィン領域を前記複数の円形刃により、前記第1の面部に対して傾斜した角度で同時に切削して前記複数の放熱フィンを形成する、
ことを特徴とする液冷冷却器に於ける放熱フィンの製造方法。 - 請求項10に記載の液冷冷却器に於ける放熱フィンの製造方法であって、
前記ヒートシンクベース部材の前記第1の面部に、前記第1の面部から所定の寸法で突出する互いに平行に配置された複数の突条体を形成し、
前記複数の突条体は、前記第1の面部に接して設けられ、前記第1の面部に対して所定方向に傾斜して傾斜突条部と、前記傾斜突条部に接して設けられ、前記第1の面部に対して直立する直立突条部とからなり、
前記複数の突条体を切削加工することにより、前記複数の放熱フィンを形成する、
ことを特徴とする液冷冷却器に於ける放熱フィンの製造方法。
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JPWO2016194158A1 (ja) | 2017-12-14 |
EP3745455A1 (en) | 2020-12-02 |
EP3306659A1 (en) | 2018-04-11 |
US20180024599A1 (en) | 2018-01-25 |
EP3306659B1 (en) | 2021-08-04 |
EP3627549B1 (en) | 2021-07-21 |
CN107615479B (zh) | 2020-08-11 |
EP3306659A4 (en) | 2019-06-19 |
US11003227B2 (en) | 2021-05-11 |
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