WO2016183839A1 - 一种2bits per circle高速逐次逼近型模数转换器 - Google Patents

一种2bits per circle高速逐次逼近型模数转换器 Download PDF

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Publication number
WO2016183839A1
WO2016183839A1 PCT/CN2015/079456 CN2015079456W WO2016183839A1 WO 2016183839 A1 WO2016183839 A1 WO 2016183839A1 CN 2015079456 W CN2015079456 W CN 2015079456W WO 2016183839 A1 WO2016183839 A1 WO 2016183839A1
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gate
inverter
output
flip
capacitor
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PCT/CN2015/079456
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English (en)
French (fr)
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徐代果
徐世六
胡刚毅
陈光炳
王健安
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中国电子科技集团公司第二十四研究所
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Priority to US15/521,178 priority Critical patent/US9966967B2/en
Publication of WO2016183839A1 publication Critical patent/WO2016183839A1/zh

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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • H03M1/06Continuously compensating for, or preventing, undesired influence of physical parameters
    • H03M1/08Continuously compensating for, or preventing, undesired influence of physical parameters of noise
    • H03M1/0809Continuously compensating for, or preventing, undesired influence of physical parameters of noise of bubble errors, i.e. irregularities in thermometer codes
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12Analogue/digital converters
    • H03M1/14Conversion in steps with each step involving the same or a different conversion means and delivering more than one bit
    • H03M1/144Conversion in steps with each step involving the same or a different conversion means and delivering more than one bit the steps being performed sequentially in a single stage, i.e. recirculation type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • H03M1/06Continuously compensating for, or preventing, undesired influence of physical parameters
    • H03M1/0617Continuously compensating for, or preventing, undesired influence of physical parameters characterised by the use of methods or means not specific to a particular type of detrimental influence
    • H03M1/0675Continuously compensating for, or preventing, undesired influence of physical parameters characterised by the use of methods or means not specific to a particular type of detrimental influence using redundancy
    • H03M1/069Continuously compensating for, or preventing, undesired influence of physical parameters characterised by the use of methods or means not specific to a particular type of detrimental influence using redundancy by range overlap between successive stages or steps
    • H03M1/0695Continuously compensating for, or preventing, undesired influence of physical parameters characterised by the use of methods or means not specific to a particular type of detrimental influence using redundancy by range overlap between successive stages or steps using less than the maximum number of output states per stage or step, e.g. 1.5 per stage or less than 1.5 bit per stage type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • H03M1/10Calibration or testing
    • H03M1/1009Calibration
    • H03M1/1014Calibration at one point of the transfer characteristic, i.e. by adjusting a single reference value, e.g. bias or gain error
    • H03M1/1023Offset correction
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12Analogue/digital converters
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12Analogue/digital converters
    • H03M1/20Increasing resolution using an n bit system to obtain n + m bits
    • H03M1/202Increasing resolution using an n bit system to obtain n + m bits by interpolation
    • H03M1/203Increasing resolution using an n bit system to obtain n + m bits by interpolation using an analogue interpolation circuit
    • H03M1/204Increasing resolution using an n bit system to obtain n + m bits by interpolation using an analogue interpolation circuit in which one or more virtual intermediate reference signals are generated between adjacent original reference signals, e.g. by connecting pre-amplifier outputs to multiple comparators
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12Analogue/digital converters
    • H03M1/22Analogue/digital converters pattern-reading type
    • H03M1/24Analogue/digital converters pattern-reading type using relatively movable reader and disc or strip
    • H03M1/28Analogue/digital converters pattern-reading type using relatively movable reader and disc or strip with non-weighted coding
    • H03M1/282Analogue/digital converters pattern-reading type using relatively movable reader and disc or strip with non-weighted coding of the pattern-shifting type, e.g. pseudo-random chain code

Definitions

  • the invention belongs to the technical field of analog or digital-analog hybrid integrated circuits, and particularly relates to a 2bits per circle High-speed successive approximation analog-to-digital converter.
  • the structure of successive approximation analog-to-digital converter usually adopts a capacitor array and a comparator structure.
  • the schematic diagram is shown in Figure 1.
  • the working principle is as follows: when the circuit is in the sampling phase, the sampling switch S1 is turned on, and the capacitor is turned on.
  • Array The sampling plate of the DAC samples the input signals VIN+ and VIN-.
  • the non-sampling plate is connected to the common-mode voltage VCM.
  • the switch S1 is turned off, and the comparator COMP is connected to the capacitor array.
  • the voltages VP and VN on the DAC sampling plate are sequentially compared, and a digital code is output for each comparison cycle.
  • the capacitor array is controlled step by step from the highest bit to the lowest bit by one output of each comparator.
  • DAC Each capacitor in the process until the end of the successive approximation process.
  • the difference between VP and VN and three reference voltages are compared at the same time, and then passed through the encoding circuit ENCODE
  • the three-digit thermometer code outputted after each comparison of the three comparators is converted into a two-digit binary code, that is, two digital codes are outputted in each comparison cycle.
  • CODEM/CODEL Each of the two output capacitors in the capacitor array DAC is controlled stepwise from the highest bit to the lowest bit by one output of each of the three comparators until the end of the successive approximation process.
  • the bit-wise successive approximation analog-to-digital converter requires only N/2 comparison cycles to get the final result compared to the traditional 1bit per circle
  • the successive approximation analog-to-digital converter of the structure has twice the working speed, which greatly improves the working speed of the successive approximation analog-to-digital converter.
  • the inventors of the present invention have found through research that such a structure also has its own disadvantages: since two capacitors are required to be simultaneously established in each approximation cycle, it is required when the highest bit and the next highest bit capacitance are required to be completely established at the same time. The long settling time seriously affects the working speed of the whole circuit, and it is also difficult to compensate by the method of inserting redundant bits in the subsequent approximation process. Therefore, the above two successive approximation analog-to-digital converters have certain problems.
  • the structure of the successive approximation analog-to-digital converter works slower, it is difficult to adapt to the requirements of high-speed applications, and 2bit per circle
  • the successive approximation analog-to-digital converter of the structure requires two capacitors to be established at the same time in each approximation period, which requires a long setup time, which seriously affects the working speed of the entire circuit, and it is also difficult to adopt a method of inserting redundant bits.
  • the technical problem of compensating in the subsequent approximation process, the present invention provides a novel High-speed successive approximation analog-to-digital converter with 2bit per circle structure.
  • a 2bits per circle high speed successive approximation analog-to-digital converter including:
  • the switch S2 and the sampling switches S1 and S3 are adapted to be turned on according to the sampling signal, and when the high-level large capacitance has been completed, the switch S1 and S3 remain disconnected, and switch S2 is turned on for the second time;
  • Capacitor arrays DAC1 and DAC2 for circuits in the sampling phase and when switches S1, S2 and S3 When closed at the same time, the sampling plate simultaneously samples the input signals VIN+ and VIN-; and is suitable for the capacitor array DAC2 when the high-capacity large capacitor has been completed.
  • the capacitor non-sampling plate is re-set to the state at the time of sampling, and the capacitance of the capacitor array DAC1 is kept connected to the corresponding reference voltage, and then undergoes a successive approximation process;
  • Comparators COMP1, COMP2 and COMP3 suitable for circuits after sampling is completed and when switches S1, S2 and When S3 is disconnected at the same time, the voltages VP and VN on the sampling plates of the capacitor array DAC1 and DAC2 The difference is compared with three reference voltages at the same time, and the three comparators output a three-digit thermometer code each time;
  • An encoding circuit adapted to convert the three-digit thermometer code into a two-digit binary code to output a two-digit code for each comparison period;
  • Switch array SW1 corresponding to capacitor array DAC1 and switch array SW2 corresponding to capacitor array DAC2 Suitable for the two-digit code generated in each comparison cycle, and sequentially control the corresponding two-capacitance of the capacitor array DAC2 and DAC1 from the highest bit to the lowest bit in sequence, when the capacitor array DAC2
  • the capacitor array DAC1 also completes the connection with the corresponding reference, and the high-level large capacitance has been completed;
  • the shift register and the digital correction unit are adapted to integrate and output the two digital codes outputted in each comparison period.
  • the present invention provides a 2bits per circle high speed successive approximation analog to digital converter, compared to the traditional 1bit per
  • the successive approximation analog-to-digital converter of the circle structure can double its working speed compared to the traditional 2bit per circle
  • the successive approximation analog-to-digital converter of the structure can continue the successive approximation process without high-level large capacitance and does not cause errors, and does not need to add redundant bit capacitance to compensate for the establishment of the front-stage large capacitance.
  • Completely caused error at the same time, due to the existence of the encoding circuit, the conversion from thermometer code to binary code can be effectively realized, and the inherent error caused by the comparator can be reduced by randomly strobing three comparators. .
  • the capacitor array DAC1 is a high-level capacitor array, which includes N parallel capacitors, N is an even number, and N capacitors are 2 ( 2N - 1 ) C , 2 ( 2N - 2 ) in order from highest to lowest .
  • the capacitor array DAC2 is a low-capacitance array, which includes N+1 parallel capacitors, and N+1 capacitors are The highest to lowest order is 2 ( N-1 ) C , 2 ( N-2 ) C , ... , 2C , C , C , where C is the capacitance of the unit capacitance and the non-sampling of the lowest capacitance C in DAC2
  • the plate is always connected to the common mode voltage VCM.
  • sampling plates of the capacitor arrays DAC1 and DAC2 can pass sampling switches S1 and S3 Sampling is performed and the two sampling plates are controlled by switch S2.
  • the encoding circuit includes a low bit digital code generating circuit and an upper bit digital code generating circuit including an AND gate and an AND gate, two inputs of the AND gate and a comparator COMP2 and The forward output of COMP3 is connected.
  • the two inputs of the AND gate are connected to the output of the same OR gate and the positive output of the comparator COMP1.
  • the output of the AND gate produces the low bit of the two-digit code, which is recorded as CODEL.
  • the high-order digital code generating circuit includes an AND gate and an OR gate, and the two inputs of the AND gate are connected to the forward outputs of the comparators COMP1 and COMP2, and the two inputs of the OR gate and the output of the AND gate are Comparators
  • the forward output of COMP3 is connected, and the output of the OR gate produces the high bit of the two-digit code, denoted as CODEM.
  • analog-to-digital converter further includes a NAND gate correspondingly connected to each of the comparator outputs, and the output of the NAND gate outputs a clock signal Valid.
  • the shift register includes N D flip-flops DFF1, N-1 inverters, and N D flip-flops DFF2 , N is a positive integer not less than 3; wherein the clock signal Valid is connected to the clock end of each D flip-flop DFF1, the first to the Nth D flip-flop DFF1
  • the reset terminal S is connected to the sampling signal Clks
  • the first D flip-flop DFF1 input D is connected to the power supply VDD
  • the output of each D flip-flop DFF1 Q The input terminal D of the next D flip-flop DFF1 is sequentially connected, and the output terminal Q of the first to Nth D flip-flops DFF1 sequentially outputs the first output signals Clk1 to ClkN
  • the output terminals Q of the first to the Nth D flip-flops DFF1 are sequentially connected to the first to N-1th inverter inputs, and the output terminals of each inverter are sequentially connected to their corresponding Ds.
  • the reset terminal S, the output of the comparator is connected to the input of each D flip-flop DFF2, and the clock signal Valid is connected to the clock end of each D flip-flop DFF2, the first to the first
  • the output terminals of the N D flip-flops DFF2 sequentially output the second output signals D1 to DN.
  • the D flip-flop DFF1 includes a first OR gate, a first inverter, a second inverter, a third inverter, and a first NMOS a first transmission gate and a second transmission gate; wherein the input of the first OR gate is coupled to a clock signal and a set signal, and the output is coupled to an input of the first inverter, the first The outputs of the gate and the first inverter are respectively connected to the two control ends of the first transmission gate and the second transmission gate, D flip-flop DFF1 input signal is connected to one end of the first transmission gate, the other end is connected to the drain of the first NMOS transistor and the input end of the second inverter, the first NMOS The source of the tube is grounded, the gate is connected to the set signal, the output of the second inverter is connected to one end of the second transmission gate, the other end is connected to the input of the third inverter, and the output of the third inverter is VOUT As D flip-flop DFF1 Output signal.
  • the D flip-flop DFF2 The second gate, the fourth inverter, the fifth inverter, the sixth inverter, the seventh inverter, the eighth inverter, the ninth inverter, the second NMOS a third transfer gate, a fourth transfer gate, and a fifth transfer gate; wherein the input of the second OR gate is connected to a clock signal, a latch signal, and a set signal, and the output end and the fourth inverter The input terminal is connected, and the latch signal is further connected to the input end of the fifth inverter, and the outputs of the second OR gate and the fourth inverter are respectively controlled with the third transmission gate and the fourth transmission gate
  • the end connection, the latch signal and the output of the fifth inverter are connected to the two control ends of the fifth transmission gate
  • D flip-flop DFF2 input signal is connected to one end of the third transmission gate, the other end is connected to the drain of the second NMOS transistor, the input end of the sixth inverter and the end of the fifth transmission gate, the second NMOS
  • analog to digital converter further includes an OR gate, an input terminal of the OR gate and a sampling signal Clks Connected, the other input is connected to the output Q of the last D flip-flop DFF1 and the latch L of the last D flip-flop DFF2.
  • the switch arrays SW1 and SW2 Each includes a plurality of sets of switches, each set of switches includes two symmetrically arranged switched capacitor units, each of which includes a NAND gate, an AND gate, a tenth inverter, an eleventh inverter, and a twelfth Inverter, NAND gate and AND gate with one input and clock signal Clki is connected, the output signal of the encoding circuit is CODEM (P Connected to the input of the tenth inverter and the other input of the AND gate, the output of the tenth inverter is connected to the other input of the NAND gate, and the output of the NAND gate is connected to the eleventh
  • CODEM Connected to the input of the tenth inverter and the other input of the AND gate, the output of the tenth inverter is connected to the other input of the NAND gate, and the output of the NAND gate is connected to the eleventh
  • the input end of the phase comparator is connected to the output end of the twelf
  • Figure 1 is a schematic diagram of the principle of a conventional 1 bit per circle successive approximation analog-to-digital converter.
  • Figure 2 is a schematic diagram of the principle of a conventional 2bit per circle successive approximation analog-to-digital converter.
  • FIG. 3 is a schematic diagram of the principle of a 2 bit per circle high speed successive approximation analog-to-digital converter provided by the present invention.
  • Figure 4 is a schematic diagram of the operation of the capacitor array DAC1 in Figure 3.
  • Figure 5 is a schematic diagram of the relevant operation timing of the capacitor array DAC1 in Figure 3.
  • FIG. 6 is a schematic diagram of the principle of the D flip-flop DFF1 provided by the present invention. .
  • FIG. 7 is a schematic diagram of the principle of the D flip-flop DFF2 provided by the present invention.
  • Figure 8 is a schematic diagram of the operation of the capacitor array DAC2 in Figure 3.
  • Figure 9 is a schematic diagram of the relevant operation timing of the capacitor array DAC2 in Figure 3.
  • FIG. 10 is a schematic diagram of the principle of the switched capacitor unit provided by the present invention.
  • Figure 11 is a schematic diagram of the circuit principle of the encoding circuit of Figure 3.
  • FIG. 12 is a schematic diagram showing an example application principle of an 8-bits analog-to-digital converter provided by the present invention.
  • FIG. 13 is a schematic diagram showing an example application principle of a 12-bits analog-to-digital converter provided by the present invention.
  • the present invention provides a 2bits per circle.
  • High-speed successive approximation analog-to-digital converter including sampling switches S1 and S3, switch S2, capacitor array DAC1 and DAC2, and switch array SW1 corresponding to capacitor array DAC1
  • Switch array SW2 corresponding to capacitor array DAC2 comparator COMP1, COMP2 and COMP3, encoding circuit ENCODE, and shift register and digital correction unit SARREG AND DIGITAL CORRECTION ; among them,
  • the switch S2 and the sampling switches S1 and S3 are adapted to be turned on according to the sampling signal, and when the high-level large capacitance has been completed, the switch S1 and S3 remain disconnected, and switch S2 is turned on for the second time;
  • Capacitor arrays DAC1 and DAC2 for circuits in the sampling phase and when switches S1, S2 and S3 When closed at the same time, the sampling plate simultaneously samples the input signals VIN+ and VIN-; and is suitable for the capacitor array DAC2 when the high-capacity large capacitor has been completed.
  • the capacitor non-sampling plate is re-set to the state at the time of sampling, and the capacitance of the capacitor array DAC1 is kept connected to the corresponding reference voltage, and then undergoes a successive approximation process;
  • Comparators COMP1, COMP2 and COMP3 suitable for circuits after sampling is completed and when switches S1, S2 and When S3 is disconnected at the same time, the voltages VP and VN on the sampling plates of the capacitor array DAC1 and DAC2 The difference is compared with three reference voltages at the same time, and the three comparators output a three-digit thermometer code each time;
  • the encoding circuit ENCODE is adapted to convert the three-digit thermometer code into a two-digit binary code to output two-digit code for each comparison period;
  • Switch array SW1 corresponding to capacitor array DAC1 and switch array SW2 corresponding to capacitor array DAC2 Suitable for the two-digit code generated in each comparison cycle, and sequentially control the corresponding two-capacitance of the capacitor array DAC2 and DAC1 from the highest bit to the lowest bit in sequence, when the capacitor array DAC2
  • the capacitor array DAC1 also completes the connection with the corresponding reference, and the high-level large capacitance has been completed;
  • Shift register and digital correction unit SARREG AND DIGITAL CORRECTION It is suitable for integrating the two digital codes outputted in each comparison cycle and outputting them in parallel.
  • the present invention provides a 2bits per circle high speed successive approximation analog to digital converter, compared to the traditional 1bit per
  • the successive approximation analog-to-digital converter of the circle structure can double its working speed compared to the traditional 2bit per circle
  • the successive approximation analog-to-digital converter of the structure can continue the successive approximation process without high-level large capacitance and does not cause errors, and does not need to add redundant bit capacitance to compensate for the establishment of the front-stage large capacitance.
  • Completely caused error at the same time, due to the existence of the encoding circuit, the conversion from thermometer code to binary code can be effectively realized, and the inherent error caused by the comparator can be reduced by randomly strobing three comparators. .
  • the high-speed successive approximation analog-to-digital converter has the following working principle: when the circuit is in the sampling phase, the switches S1, S2 and S3 are simultaneously turned on, the sampling plate of the capacitor array DAC1 and the capacitor array DAC2 The sampling plates are simultaneously sampled, where DAC1 is the high capacitance array and DAC2 is the low capacitance array, while the comparators COMP1, COMP2 and COMP3 In the offset cancellation phase; after sampling, switches S1, S2 and S3 are disconnected at the same time, comparators COMP1, COMP2 and COMP3 At the same time, the output of the three comparators converts the thermometer code into a binary code through the encoding circuit ENCODE, realizing a function of outputting 2bits digital code in a comparison cycle, and generating 2bits per cycle.
  • the digital code sequentially controls the capacitor array from the highest bit to the lowest bit.
  • the corresponding capacitor of the DAC2 is connected to the corresponding reference voltage, and the corresponding capacitor of the control capacitor array DAC1 is also connected to the corresponding reference voltage.
  • the capacitance of DAC2 is connected to the corresponding reference
  • the capacitance of the capacitor array DAC1 is also connected to the corresponding reference, and the high-capacity large capacitance has been established.
  • the invention utilizes the advantage of the 2bits per circle successive approximation analog-to-digital converter, and solves the problem of 2bits per circle
  • the successive approximation analog-to-digital converter has a high-level large-capacitor settling time.
  • the low-capacitance comparison result is used to control the high-level capacitor. While the high-level capacitor is established, the low-level capacitor continues the successive approximation process.
  • the invention does not need to wait for the high-level capacitor to be completely established, and does not need to add redundant bit capacitors to compensate for the incomplete influence of the pre-stage establishment, thereby shortening the conversion time and improving the successive approximation analog-to-digital converter.
  • Working speed; simultaneous to three comparators COMP1, COMP2, and COMP3 introduce random selection to eliminate systematic errors in the entire analog-to-digital converter.
  • the capacitor array DAC1 shown in FIG. 3 is a high-capacitance array including N parallel capacitors, N is an even number, and N capacitors are 2 ( 2N - 1 ) C in order from highest to lowest. 2 ( 2N-2 ) C , ... , 2 ( N+1 ) C , 2 N C , where C is the capacitance of the unit capacitor; capacitor array DAC2 is the low capacitance array, which includes N+1 parallel capacitors, N +1 capacitors from the highest to the lowest are 2 ( N-1 ) C , 2 ( N-2 ) C , ... , 2C , C , C , where C is the capacitance of the unit capacitor and the lowest in DAC2
  • the non-sampling plate of bit capacitor C is always connected to the common mode voltage VCM.
  • the sampling plates of the capacitor arrays DAC1 and DAC2 shown in Figure 3 can pass the sampling switches S1 and S3. Sampling is performed and the two sampling plates are controlled by switch S2. Specifically, when the circuit is in the sampling phase, switches S1, S2, and S3 are simultaneously turned on, and the capacitor array DAC1 Sampling plate and capacitor array The sampling plate of DAC2 is sampled simultaneously; when the high capacitance of the capacitor array DAC1 has been established, switches S1 and S3 remain disconnected, switch S2 For the second turn, the capacitor arrays DAC1 and DAC2 are connected together, and the capacitor non-sampling plate of the DAC2 is reset to the state of the sample, that is, the common mode voltage VCM. While the capacitance of DAC1 remains in the state of the previous (ie, the corresponding reference voltage), then a successive approximation is performed, thereby completing a complete successive approximation cycle.
  • the circuit schematic of the encoding circuit is shown in FIG. 11, and the encoding circuit ENCODE
  • the invention comprises a low bit digital code generating circuit and a high bit digital code generating circuit, the low bit digital code generating circuit comprising an AND gate XNOR and an AND gate AND, an OR gate XNOR two inputs and a comparator
  • the forward outputs of COMP2 and COMP3 are connected to Outp2 and Outp3, and the two inputs of AND gate AND are output of the same OR gate XNOR and comparator COMP1
  • the forward output is connected to the Outp1, and the output of the AND gate generates the lower of the two-digit code, denoted as CODEL
  • the high-order digital code generation circuit includes an AND gate AND and an OR gate OR
  • the two inputs of the AND gate AND are connected to the forward outputs Outp1 and Outp2 of the comparators COMP1 and COMP2, and the two inputs and AND gates of the OR gate OR
  • the output is connected to the forward output of the COMP3, Outp3, and the
  • Capacitor array DAC1 The relevant working principle is shown in Figure 4. To illustrate the principle, only one comparator is shown in the figure as an illustration. For D flip-flops DFF1 and DFF2, when the reset terminal S is high, the output Q is set low and is not affected by the input clock and D input value. For D flip-flop DFF2, when L is high, the value of output Q is latched and is not affected by the input clock. And D The effect of the input value of the terminal, it should be noted here that for the D flip-flop DFF2, the S terminal and the L terminal cannot be simultaneously high.
  • the analog to digital converter further includes a NAND gate correspondingly connected to each of the comparator COMP outputs. NAND, that is, the output of the comparator COMP Outp and Outn are connected to the input of the NAND gate NAND, and the output of the NAND gate NAND is valid. Valid is the clock signal for D flip-flop DFF1 and D flip-flop DFF2.
  • the shift register includes N D flip-flops DFF1 , N-1 inverters, and N D Trigger DFF2, N is a positive integer not less than 3; wherein the clock signal Valid is connected to the clock end of each D flip-flop DFF1, the first to Nth D flip-flops The reset terminal S of DFF1 is connected to the sampling signal Clks , the input terminal D of the first D flip-flop DFF1 is connected to the power supply VDD , and the output terminal of each D flip-flop DFF1 Q The input terminal D of the next D flip-flop DFF1 is sequentially connected, and the output terminal Q of the first to Nth D flip-flops DFF1 sequentially outputs the first output signals Clk1 to ClkN The output terminals Q of the first to the Nth D flip-flops DFF1 are sequentially connected to the first to N-1th inverter INV inputs, and each inverter INV The output terminals are sequentially connected to the reset terminal S of the corresponding D flip-flop D
  • the sampling signal Clks is high, and all D flip-flops in Figure 4.
  • the output Q of DFF1 is set to 0.
  • the output Q of all D flip-flops DFF2 in Figure 4 is also set to 0.
  • the comparator enable unit COMP_ENABLE causes the comparator to start the first comparison.
  • the clock signal Valid triggers the unset D.
  • Trigger DFF1 and DFF2 the first output signal Clk1 changes from low level to high level, the first output signal Clk2 to ClkN remains low, and the first comparison result CODEM (CODEL) is output to D1. Thereafter, since the first output signal Clk1 is high, the D flip-flop DFF2 corresponding to D1 is latched, and D corresponding to D2. Trigger DFF2 exits the set state, and the remaining D flip-flops DFF2 remain set. At this point, the first duty cycle ends. Thereafter, the comparator enable unit COMP_ENABLE Causes the comparator to start a second comparison.
  • the clock signal Valid triggers the D flip-flops DFF1 and DFF2 that are not set or latched.
  • the first output signal Clk1 remains high, the first output signal Clk2 changes from low level to high level, the first output signal Clk3 to ClkN remains low, and the second comparison result CODEM (CODEL) is output to D2 Due to the latching effect, the value of D1 remains unchanged. Thereafter, since the first output signal Clk2 is high, the D flip-flop DFF2 corresponding to D2 is latched, and the D flip-flop corresponding to D3 When DFF2 exits the set state, the remaining D flip-flops DFF2 remain set or latched, at which point the second duty cycle ends.
  • the working state after that is deduced by analogy. For the specific overall timing, please refer to Figure 5. Shown.
  • the D flip-flop DFF1 includes a first OR gate OR1 and a first inverter. INV1, second inverter INV2, third inverter INV3, first NMOS transistor N1, first transfer gate K1 and second transfer gate K2; wherein the first OR gate OR1
  • the input terminal is connected to the clock signal CP and the set signal S (ie, the sampling signal Clks), and the output terminal is connected to the input terminal of the first inverter INV1, the first OR gate OR1 and the first inverter
  • the control signals C and CN generated at the output of INV1 are respectively connected to the two control terminals of the first transmission gate K1 and the second transmission gate K2 as control signals for the transmission gates K1 and K2, D
  • the input signal VIN of the flip-flop DFF1 is connected to one end of the first transmission gate K1, and the other end of the first transmission gate K1 is connected to the drain of the first NMOS transistor N1 and the second inverter INV2 At the input end, the source
  • the D flip-flop DFF2 includes a second OR gate OR2 and a fourth inverter.
  • INV4 fifth inverter INV5, sixth inverter INV6, seventh inverter INV7, eighth inverter INV8, ninth inverter INV9, second NMOS transistor N2 a third transfer gate K3, a fourth transfer gate K4, and a fifth transfer gate K5;
  • the input of the second OR gate OR2 is coupled to the clock signal CP, the latch signal L, and the set signal S Connection
  • the output of the second OR gate OR2 is connected to the input of the fourth inverter INV4, and the latch signal L is also connected to the fifth inverter INV5
  • the input terminals are connected, and the control signals C and CN generated by the outputs of the second or fourth inverter and the fourth inverter are respectively connected to the two control terminals of the third transmission gate K3 and the fourth transmission gate K4 as transmission Door K3 And the control signal of K4, the control LN and the latch signal
  • the other end of the fourth transmission gate K4 is connected to the input terminal of the seventh inverter INV7, and the output VOUT of the seventh inverter INV7 is used as the output signal of the D flip-flop DFF2; meanwhile, the second The drain of the NMOS transistor N2 and the end connected to the fifth transfer gate K5 serve as the input terminals of the eighth inverter INV8 and the ninth inverter INV9 in series, and two series inverters INV8 and The output of the INV9 is connected to the other end of the fifth transmission gate K5.
  • the analog-to-digital converter further includes an OR gate OR, the OR gate OR One input is connected to the sampling signal Clks, the other input is connected to the output terminal Q of the last D flip-flop DFF1 and the latch terminal L of the last D flip-flop DFF2 Connected.
  • OR gate OR One input is connected to the sampling signal Clks, the other input is connected to the output terminal Q of the last D flip-flop DFF1 and the latch terminal L of the last D flip-flop DFF2 Connected.
  • the relevant working principle of the capacitor array DAC2 is shown in Figure 8.
  • Figure 8 The difference between Figure 8 and Figure 4 is that in Figure 4, when the first output signal ClkN After going high, the entire module will be in a hold state until the next sampling signal Clks is re-triggered; in Figure 8, when the first output signal ClkN goes high, due to the OR gate OR The presence of the D flip-flops DFF1 and DFF2 is quickly set by the set signal Clkc and immediately begins the next conversion process to achieve the previously described operation.
  • Figure 8 The corresponding operation timing diagram is shown in Figure 9, where TDAC1 and TDAC2 represent the conversion times of the capacitor arrays DAC1 and DAC2, respectively.
  • the switch arrays SW1 and SW2 Each includes a plurality of sets of switches, each set of switches includes two symmetrically arranged switched capacitor units, each of which includes a NAND gate NAND, an AND gate AND, a tenth inverter INV10, and an eleventh inverter INV11 and the twelfth inverter INV12, one input of the NAND gate NAND and the AND gate AND are connected to the clock signal Clki (i takes 1 to N), the encoding circuit
  • the output signal of ENCODE CODEM ( P ) is connected to the input of the tenth inverter INV10 and the other input of the AND gate, the tenth inverter INV10
  • the output is connected to the other input of the NAND gate NAND
  • the output of the NAND gate NAND is connected to the input of the eleventh inverter INV11
  • the output of the AND gate is connected to the twelfth inverter.
  • the output terminals of the eleventh inverter INV11 and the twelfth inverter INV12 are respectively connected to one plate of two identical capacitors, and the other two plates of the same capacitor are connected to the comparator.
  • One input of COMP at the same time, these two identical capacitors form a capacitor that represents a single weight.
  • the switched capacitor shown in Figure 10 works as follows: When the clock signal Clki (i takes 1 to N) When it is low, the eleventh inverter INV11 corresponding to the NAND gate NAND outputs a low level (negative reference), and the twelfth inverter INV12 corresponding to the AND gate AND The output is high (positive reference).
  • Signal due to the input of the encoding circuit to the other end CODEM ( P ) is a signal with opposite polarity, so, at this time, the same one of the two capacitors of the same capacitance, its non-sampling plate is equivalent to a high level (positive reference), otherwise, equivalent Is connected to low level (negative reference).
  • Implementation example 1 Please refer to the example application principle of the 8-bits analog-to-digital converter shown in Figure 12, capacitor array DAC1 And the capacitor array DAC2 is a 4bits capacitor array, which can realize a 2bits per circle 8-bit high-speed successive approximation analog-to-digital converter. In this case, only 4 The 8-bit successive approximation process can be implemented in the second comparison cycle.
  • Implementation Example 2 Please refer to the schematic diagram of the application principle of the 12bits analog-to-digital converter shown in Figure 13, capacitor array DAC1 And the capacitor array DAC2 is a 6bits capacitor array, which can realize a 2bits per circle 12-bit high-speed successive approximation analog-to-digital converter. In this case, only 6 The 12-bit successive approximation process can be implemented in the second comparison cycle.
  • the capacitor array DAC1 and the capacitor array DAC2 in the present invention can be realized as long as the number of bits is equal and even, and is not limited to the above two embodiments.

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Abstract

一种2bits per circle高速逐次逼近型模数转换器,包括开关S2、采样开关S1和S3、电容阵列DAC1和DAC2、比较器COMP1-COMP3、编码电路、与电容阵列DAC1对应的开关阵列SW1和与电容阵列DAC2对应的开关阵列SW2,以及移位寄存器和数字校正单元。该模数转换器,相比于传统1bit per circle结构的逐次逼近型模数转换器其工作速度可以提高一倍,相比于传统2bit per circle结构的逐次逼近型模数转换器,可以在高位大电容不完全建立的情况下,继续进行逐次逼近过程并且不会因此发生错误,且不需要加入冗余位电容来补偿前级大电容建立不完全所造成的误差;且由于编码电路的存在,可以有效的实现从温度计码到二进制码的转换,并且还可通过随机化选通三个比较器来减小比较器所带来的固有误差。

Description

一种2bits per circle高速逐次逼近型模数转换器 一种2bits per circle高速逐次逼近型模数转换器
技术领域
本发明属于模拟或数模混合集成电路技术领域,具体涉及一种 2bits per circle 高速逐次逼近型模数转换器。
背景技术
近年来,随着 CMOS 集成电路工艺水平的不断提高,对逐次逼近型模数转换器的研究也随之深入。以下将对两种传统结构的逐次逼近型模数转换的优点和缺点进行简单分析。
对于传统 1bit per circle 结构的逐次逼近型模数转换器,通常采用一个电容阵列和一个比较器的结构,其原理图如图 1 所示,其工作原理为:当电路处于采样阶段时,采样开关 S1 导通,电容阵列 DAC 的采样极板对输入信号 VIN+ 和 VIN- 进行采样,非采样极板接共模电压 VCM ,采样阶段结束后,开关 S1 断开,比较器 COMP 对电容阵列 DAC 采样极板上的电压 VP 和 VN 进行逐次比较,每次比较周期输出一个数字码,通过比较器每一次比较后的一个输出结果,从最高位到最低位逐级控制电容阵列 DAC 中的每一位电容,直至逐次逼近过程结束。这种结构的优点是结构比较简单,在每个比较周期中只需要一个电容完全建立,所需的建立时间较短,即使某个电容不能完全建立,也可以通过在后级插入冗余位的方式来进行补偿,但其缺点在于,对于一个 N 位的逐次逼近型模数转换器,需要至少 N 个比较周期才能得到最终的结果,因而很难适应高速应用的要求。
基于上述问题,出现了 2bits per circle 结构的逐次逼近型模数转换器,该种结构通常采用一个电容阵列和三个比较器,其原理图如图 2 所示,其工作原理为:当电路处于采样阶段时,采样开关 S1 导通,电容阵列 DAC 的采样极板对输入信号 VIN+ 和 VIN- 进行采样,非采样极板接共模电压 VCM ,采样阶段结束后,开关 S1 断开,比较器 COMP1 、 COMP2 和 COMP3 对电容阵列 DAC 采样极板上的电压 VP 和 VN 进行逐次比较,由于三个比较器的存在,可以将采样极板上的电压 VP 与 VN 之差和三个基准电压同时进行比较,然后通过编码电路 ENCODE ,将三个比较器每一次比较后输出的三位温度计码转换为两位二进制码,即每次比较周期输出两个数字码 CODEM/CODEL ,通过三个比较器每一次比较后的一个输出结果,从最高位到最低位逐级控制电容阵列 DAC 中的每两位电容,直至逐次逼近过程结束。因此,对于一个 N 位的逐次逼近型模数转换器,只需要 N/2 个比较周期就能得到最终的结果,相比于传统 1bit per circle 结构的逐次逼近型模数转换器,其工作速度为原来的两倍,大大提高了逐次逼近型模数转换器的工作速度。但是,本发明的发明人经过研究发现,这种结构也存在其自身的缺点:由于在每个逼近周期中需要两个电容同时建立,当需要最高位和次高位电容同时完全建立时,会需要很长的建立时间,严重影响整个电路的工作速度,同时也很难采用插入冗余位的方法在此后的逼近过程中进行补偿。所以,上述两种逐次逼近型模数转换器都存在一定的问题。
发明内容
针对现有技术中 1bit per circle 结构的逐次逼近型模数转换器工作速度较慢,很难适应高速应用的要求,以及 2bit per circle 结构的逐次逼近型模数转换器在每个逼近周期中需要两个电容同时建立,会需要很长的建立时间,严重影响整个电路的工作速度,同时也很难采用插入冗余位的方法在此后的逼近过程中进行补偿的技术问题,本发明提供一种新型 2bit per circle 结构的高速逐次逼近型模数转换器。
为了实现上述目的,本发明采用如下技术方案:
一种 2bits per circle 高速逐次逼近型模数转换器,包括:
开关 S2 、采样开关 S1 和 S3 ,适于根据采样信号进行导通,且当高位大电容已经完成建立时,开关 S1 和 S3 仍然保持断开,而开关 S2 第二次导通;
电容阵列 DAC1 和 DAC2 ,适于电路处于采样阶段且当开关 S1 、 S2 和 S3 同时闭合时,其采样极板同时对输入信号 VIN+ 和 VIN- 进行采样;并适于当高位大电容已经完成建立时,电容阵列 DAC2 的电容非采样极板重新置位为采样时的状态,而电容阵列 DAC1 的电容保持接对应的基准电压,再经历一次逐次逼近的过程;
比较器 COMP1 、 COMP2 和 COMP3 ,适于电路处于采样结束后且当开关 S1 、 S2 和 S3 同时断开时,将电容阵列 DAC1 和 DAC2 采样极板上的电压 VP 与 VN 之差和三个基准电压同时进行比较,三个比较器每次比较输出一个三位温度计码;
编码电路,适于将该三位温度计码转换为两位二进制码,实现每个比较周期输出两位数字码;
与电容阵列 DAC1 对应的开关阵列 SW1 以及与电容阵列 DAC2 对应的开关阵列 SW2 ,适于将每个比较周期产生的两位数字码,同时依次从最高位到最低位逐级控制电容阵列 DAC2 和 DAC1 相应的两位电容接对应的基准电压,当电容阵列 DAC2 的电容都接上对应的基准电压时,电容阵列 DAC1 也完成了和对应基准的连接,且高位大电容已经完成建立;
移位寄存器和数字校正单元,适于对每个比较周期输出的两个数字码进行整合后并行输出。
本发明提供的 2bits per circle 高速逐次逼近型模数转换器,相比于传统 1bit per circle 结构的逐次逼近型模数转换器其工作速度可以提高一倍,相比于传统 2bit per circle 结构的逐次逼近型模数转换器,可以在高位大电容不完全建立的情况下,继续进行逐次逼近过程并且不会因此发生错误,且不需要加入冗余位电容来补偿前级大电容建立不完全所造成的误差;同时,由于编码电路的存在,可以有效的实现从温度计码到二进制码的转换,并且还可通过随机化选通三个比较器来减小比较器所带来的固有误差。
进一步,所述电容阵列 DAC1 为高位电容阵列,其包括 N 个并联的电容, N 为偶数, N 个电容大小从最高位到最低位依次为 2 ( 2N-1 ) C , 2 ( 2N-2 ) C , … , 2 ( N+1 ) C , 2NC ,其中 C 为单位电容的容值;电容阵列 DAC2 为低位电容阵列,其包括 N+1 个并联的电容, N+1 个电容大小从最高位到最低位依次为 2 ( N-1 ) C , 2 ( N-2 ) C , … , 2C , C , C ,其中 C 为单位电容的容值, DAC2 中的最低位电容 C 的非采样极板始终接共模电压 VCM 。
进一步,所述电容阵列 DAC1 和 DAC2 的采样极板可通过采样开关 S1 和 S3 进行采样,并可通过开关 S2 来控制这两个采样极板是否连接在一起。
进一步,所述编码电路包括低位数字码产生电路和高位数字码产生电路,该低位数字码产生电路包括一个同或门和一个与门,同或门的两个输入端与比较器 COMP2 和 COMP3 的正向输出端连接,与门的两个输入端与同或门的输出端和比较器 COMP1 的正向输出端连接,与门的输出端产生两位数字码中的低位,记为 CODEL ;该高位数字码产生电路包括一个与门和一个或门,与门的两个输入端与比较器 COMP1 和 COMP2 的正向输出端连接,或门的两个输入端与与门的输出端和比较器 COMP3 的正向输出端连接,或门的输出端产生两位数字码中的高位,记为 CODEM 。
进一步,所述模数转换器还包括与每个所述比较器输出端对应连接的与非门,该与非门的输出端输出时钟信号 Valid 。
进一步,所述移位寄存器包括 N 个 D 触发器 DFF1 、 N-1 个反相器和 N 个 D 触发器 DFF2 , N 为不小于 3 的正整数;其中,所述时钟信号 Valid 与每个 D 触发器 DFF1 的时钟端相连,第一个至第 N 个 D 触发器 DFF1 的复位端 S 连接采样信号 Clks ,第一个 D 触发器 DFF1 的输入端 D 连接电源 VDD ,每个 D 触发器 DFF1 的输出端 Q 依次连接其下一个 D 触发器 DFF1 的输入端 D ,且第一个至第 N 个 D 触发器 DFF1 的输出端 Q 依次输出第一输出信号 Clk1 至 ClkN ,所述第一个至第 N 个 D 触发器 DFF1 的输出端 Q 依次对应连接第一个至第 N-1 个反相器输入端,且每个反相器的输出端依次连接其对应 D 触发器 DFF2 的复位端 S ;第一个至第 N 个 D 触发器 DFF2 的锁存端 L 一一对应连接第一个至第 N 个 D 触发器 DFF1 的输出端 Q ,第一个 D 触发器 DFF2 的复位端 S 连接采样信号 Clks ,且第一个至第 N-1 个反相器的输出端一一对应连接第 2 个至第 N 个 D 触发器 DFF2 的复位端 S ,所述比较器的输出端连接每个 D 触发器 DFF2 的输入端,所述时钟信号 Valid 与每个 D 触发器 DFF2 的时钟端相连,第一个至第 N 个 D 触发器 DFF2 的输出端依次输出第二输出信号 D1 至 DN 。
进一步,所述 D 触发器 DFF1 包括第一或门、第一反相器、第二反相器、第三反相器、第一 NMOS 管、第一传输门和第二传输门;其中,所述第一或门的输入端与时钟信号和置位信号连接,输出端与第一反相器的输入端连接,所述第一或门和第一反相器的输出端分别与第一传输门和第二传输门的两个控制端连接, D 触发器 DFF1 的输入信号接第一传输门的一端,另一端接第一 NMOS 管的漏极和第二反相器的输入端,第一 NMOS 管的源极接地,栅极与置位信号连接,第二反相器的输出端接第二传输门的一端,另一端接第三反相器的输入端,第三反相器的输出 VOUT 作为 D 触发器 DFF1 的输出信号。
进一步,所述 D 触发器 DFF2 包括第二或门、第四反相器、第五反相器、第六反相器、第七反相器、第八反相器、第九反相器、第二 NMOS 管、第三传输门、第四传输门和第五传输门;其中,所述第二或门的输入端与时钟信号、锁存信号和置位信号连接,输出端与第四反相器的输入端连接,且锁存信号还与第五反相器的输入端连接,所述第二或门和第四反相器的输出端分别与第三传输门和第四传输门的两个控制端连接,锁存信号和第五反相器的输出端与第五传输门的两个控制端连接, D 触发器 DFF2 的输入信号接第三传输门的一端,另一端接第二 NMOS 管的漏极、第六反相器的输入端和第五传输门的一端,第二 NMOS 管的源极接地,栅极与置位信号连接,第六反相器的输出端接第四传输门的一端,另一端接第七反相器的输入端,第七反相器的输出 VOUT 作为 D 触发器 DFF2 的输出信号;同时,第二 NMOS 管的漏极和第五传输门相连的一端,作为串联的第八反相器和第九反相器的输入端,两个串联反相器的输出端与第五传输门的另一端相连。
进一步,所述模数转换器还包括一个或门,所述或门的一个输入端与采样信号 Clks 连接,另一个输入端与最末一个 D 触发器 DFF1 的输出端 Q 和最末一个 D 触发器 DFF2 的锁存端 L 连接。
进一步,所述开关阵列 SW1 和 SW2 均包括多组开关,每组开关包括两个对称设置的开关电容单元,每个开关电容单元包括一个与非门、一个与门、第十反相器、第十一反相器和第十二反相器,与非门和与门的一个输入端与时钟信号 Clki 相连,编码电路的输出信号 CODEM ( P )连接到第十反相器的输入端和与门的另一个输入端,第十反相器的输出端连接到与非门的另一个输入端,与非门的输出端连接第十一反相器的输入端,与门的输出端连接第十二反相器的输入端,第十一反相器和第十二反相器的输出端分别连接两个相同的电容的一个极板。
附图说明
图 1 是传统 1bit per circle 逐次逼近型模数转换器的原理示意图。
图 2 是传统 2bit per circle 逐次逼近型模数转换器的原理示意图。
图 3 是本发明提供的 2bit per circle 高速逐次逼近型模数转换器的原理示意图。
图 4 是图 3 中电容阵列 DAC1 的相关工作原理示意图。
图 5 是图 3 中电容阵列 DAC1 的相关工作时序示意图。
图 6 是本发明提供的 D 触发器 DFF1 的原理示意图。 .
图 7 是本发明提供的 D 触发器 DFF2 的原理示意图。
图 8 是图 3 中电容阵列 DAC2 的相关工作原理示意图。
图 9 是图 3 中电容阵列 DAC2 的相关工作时序示意图。
图 10 是本发明提供的开关电容单元的原理示意图。
图 11 是图 3 中编码电路的电路原理示意图。
图 12 是本发明提供的 8bits 模数转换器的实例应用原理示意图。
图 13 是本发明提供的 12bits 模数转换器的实例应用原理示意图。
具体实施方式
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体图示,进一步阐述本发明。
请参考图 3 所示,本发明提供一种 2bits per circle 高速逐次逼近型模数转换器,包括采样开关 S1 和 S3 、开关 S2 、电容阵列 DAC1 和 DAC2 、与电容阵列 DAC1 对应的开关阵列 SW1 、与电容阵列 DAC2 对应的开关阵列 SW2 、比较器 COMP1 、 COMP2 和 COMP3 、编码电路 ENCODE 以及移位寄存器和数字校正单元 SARREG AND DIGITAL CORRECTION ;其中,
开关 S2 、采样开关 S1 和 S3 ,适于根据采样信号进行导通,且当高位大电容已经完成建立时,开关 S1 和 S3 仍然保持断开,而开关 S2 第二次导通;
电容阵列 DAC1 和 DAC2 ,适于电路处于采样阶段且当开关 S1 、 S2 和 S3 同时闭合时,其采样极板同时对输入信号 VIN+ 和 VIN- 进行采样;并适于当高位大电容已经完成建立时,电容阵列 DAC2 的电容非采样极板重新置位为采样时的状态,而电容阵列 DAC1 的电容保持接对应的基准电压,再经历一次逐次逼近的过程;
比较器 COMP1 、 COMP2 和 COMP3 ,适于电路处于采样结束后且当开关 S1 、 S2 和 S3 同时断开时,将电容阵列 DAC1 和 DAC2 采样极板上的电压 VP 与 VN 之差和三个基准电压同时进行比较,三个比较器每次比较输出一个三位温度计码;
编码电路 ENCODE ,适于将该三位温度计码转换为两位二进制码,实现每个比较周期输出两位数字码;
与电容阵列 DAC1 对应的开关阵列 SW1 以及与电容阵列 DAC2 对应的开关阵列 SW2 ,适于将每个比较周期产生的两位数字码,同时依次从最高位到最低位逐级控制电容阵列 DAC2 和 DAC1 相应的两位电容接对应的基准电压,当电容阵列 DAC2 的电容都接上对应的基准电压时,电容阵列 DAC1 也完成了和对应基准的连接,且高位大电容已经完成建立;
移位寄存器和数字校正单元 SARREG AND DIGITAL CORRECTION ,适于对每个比较周期输出的两个数字码进行整合后并行输出。
本发明提供的 2bits per circle 高速逐次逼近型模数转换器,相比于传统 1bit per circle 结构的逐次逼近型模数转换器其工作速度可以提高一倍,相比于传统 2bit per circle 结构的逐次逼近型模数转换器,可以在高位大电容不完全建立的情况下,继续进行逐次逼近过程并且不会因此发生错误,且不需要加入冗余位电容来补偿前级大电容建立不完全所造成的误差;同时,由于编码电路的存在,可以有效的实现从温度计码到二进制码的转换,并且还可通过随机化选通三个比较器来减小比较器所带来的固有误差。
请参考图 3 所示的 2bits per circle 高速逐次逼近型模数转换器,其工作原理具体为:当电路处于采样阶段时,开关 S1 、 S2 和 S3 同时导通,电容阵列 DAC1 的采样极板和电容阵列 DAC2 的采样极板同时进行采样,其中 DAC1 为高位电容阵列, DAC2 为低位电容阵列,与此同时,比较器 COMP1 、 COMP2 和 COMP3 处于失调消除阶段;采样结束后,开关 S1 、 S2 和 S3 同时断开,比较器 COMP1 、 COMP2 和 COMP3 同时开始工作,三个比较器的输出通过编码电路 ENCODE 将温度计码转换为二进制码,实现一个比较周期输出 2bits 数字码的功能,每个周期产生的 2bits 数字码依次从最高位到最低位逐级控制电容阵列 DAC2 相应的电容接对应的基准电压,同时控制电容阵列 DAC1 相应的电容也接对应的基准电压,当电容阵列 DAC2 的电容都接上对应的基准时,电容阵列 DAC1 的电容也完成了和对应基准的连接,并且高位大电容已经完成建立,此时,开关 S1 和 S3 仍然保持断开,开关 S2 第二次导通,同时电容阵列 DAC2 的电容非采样极板被重新置位为采样时的状态,即接共模电压 VCM ,而 DAC1 的电容保持之前(即接对应的基准电压)的状态,随后再经历一次逐次逼近的过程,由此完成一个完整的逐次逼近周期。相比于传统的 1bit per circle 逐次逼近型模数转换器,本发明利用了 2bits per circle 逐次逼近型模数转换器速度快的优点,同时解决了 2bits per circle 逐次逼近型模数转换器高位大电容建立时间慢的问题,用低位电容的比较结果去控制高位电容,在高位电容进行建立的同时,低位电容继续进行逐次逼近过程;而相比于传统的 2bits per circle 逐次逼近型模数转换器,本发明不用等待高位电容完全建立,也不用加入冗余位电容来补偿前级建立不完全的影响,从而缩短了转换时间,提高了逐次逼近型模数转换器的工作速度;同时对三个比较器 COMP1 、 COMP2 和 COMP3 可引入随机选择来消除整个模数转换器的系统性误差。
作为具体实施例,图 3 所示的电容阵列 DAC1 为高位电容阵列,其包括 N 个并联的电容, N 为偶数, N 个电容大小从最高位到最低位依次为 2 ( 2N-1 ) C , 2 ( 2N-2 ) C , … , 2 ( N+1 ) C , 2NC ,其中 C 为单位电容的容值;电容阵列 DAC2 为低位电容阵列,其包括 N+1 个并联的电容, N+1 个电容大小从最高位到最低位依次为 2 ( N-1 ) C , 2 ( N-2 ) C , … , 2C , C , C ,其中 C 为单位电容的容值, DAC2 中的最低位电容 C 的非采样极板始终接共模电压 VCM 。
作为具体实施例,图 3 所示的电容阵列 DAC1 和 DAC2 的采样极板可通过采样开关 S1 和 S3 进行采样,并可通过开关 S2 来控制这两个采样极板是否连接在一起。具体地,当电路处于采样阶段时,开关 S1 、 S2 和 S3 同时导通,电容阵列 DAC1 的采样极板和电容阵列 DAC2 的采样极板同时进行采样;当电容阵列 DAC1 的高位大电容已经完成建立时,开关 S1 和 S3 仍然保持断开,开关 S2 第二次导通,将电容阵列 DAC1 和 DAC2 的采样极板连接在一起,同时将电容阵列 DAC2 的电容非采样极板重新置位为采样时的状态,即接共模电压 VCM ,而 DAC1 的电容保持之前(即接对应的基准电压)的状态,随后再经历一次逐次逼近的过程,由此完成一个完整的逐次逼近周期。
作为具体实施例,编码电路的电路原理图请参考图 11 所示,所述编码电路 ENCODE 包括低位数字码产生电路和高位数字码产生电路,该低位数字码产生电路包括一个同或门 XNOR 和一个与门 AND ,同或门 XNOR 的两个输入端与比较器 COMP2 和 COMP3 的正向输出端 Outp2 和 Outp3 连接,与门 AND 的两个输入端与同或门 XNOR 的输出端和比较器 COMP1 的正向输出端 Outp1 连接,与门 AND 的输出端产生两位数字码中的低位,记为 CODEL ;该高位数字码产生电路包括一个与门 AND 和一个或门 OR ,与门 AND 的两个输入端与比较器 COMP1 和 COMP2 的正向输出端 Outp1 和 Outp2 连接,或门 OR 的两个输入端与与门 AND 的输出端和比较器 COMP3 的正向输出端 Outp3 连接,或门 OR 的输出端产生两位数字码中的高位,记为 CODEM ,通过此编码电路,可以实现从温度计码到二进制码的转换。同时,所述编码电路的真值表如下表 1 所示。
表 1 :
Outp3 Outp2 Outp1 CODEM CODEL
0 0 0 0 0
0 0 1 0 1
0 1 1 1 0
1 1 1 1 1
以下将介绍电容阵列 DAC1 和电容阵列 DAC2 控制模块的工作原理。电容阵列 DAC1 的相关工作原理如图 4 所示,为了说明原理,该图中只画出一个比较器作为示意。对于 D 触发器 DFF1 和 DFF2 ,当复位端 S 为高电平的时候,输出端 Q 置位为低电平,不受输入时钟和 D 端输入值的影响;而对于 D 触发器 DFF2 ,当 L 端为高电平的时候,输出端 Q 的值被锁存,不受输入时钟和 D 端输入值的影响,这里需要注意的是对于 D 触发器 DFF2 , S 端和 L 端不能同时为高电平。当比较器使能单元 COMP_ENABLE 产生的使能信号 EN_COMP 为低电平的时候,比较器 COMPi 处于工作状态,当使能信号 EN_COMP 为高电平的时候,比较器 COMPi 处于复位状态,此时,比较器的输出 Outp 和 Outn 同时为高电平。作为具体实施例,所述模数转换器还包括与每个所述比较器 COMP 输出端对应连接的与非门 NAND ,即比较器 COMP 的输出 Outp 和 Outn 连接到与非门 NAND 的输入,该与非门 NAND 的输出端输出信号 Valid ,信号 Valid 作为 D 触发器 DFF1 和 D 触发器 DFF2 的时钟信号。
作为具体实施方式,所述移位寄存器包括 N 个 D 触发器 DFF1 、 N-1 个反相器和 N 个 D 触发器 DFF2 , N 为不小于 3 的正整数;其中,所述时钟信号 Valid 与每个 D 触发器 DFF1 的时钟端相连,第一个至第 N 个 D 触发器 DFF1 的复位端 S 连接采样信号 Clks ,第一个 D 触发器 DFF1 的输入端 D 连接电源 VDD ,每个 D 触发器 DFF1 的输出端 Q 依次连接其下一个 D 触发器 DFF1 的输入端 D ,且第一个至第 N 个 D 触发器 DFF1 的输出端 Q 依次输出第一输出信号 Clk1 至 ClkN ,所述第一个至第 N 个 D 触发器 DFF1 的输出端 Q 依次对应连接第一个至第 N-1 个反相器 INV 输入端,且每个反相器 INV 的输出端依次连接其对应 D 触发器 DFF2 的复位端 S ;第一个至第 N 个 D 触发器 DFF2 的锁存端 L 一一对应连接第一个至第 N 个 D 触发器 DFF1 的输出端 Q ,第一个 D 触发器 DFF2 的复位端 S 连接采样信号 Clks ,且第一个至第 N-1 个反相器的输出端一一对应连接第 2 个至第 N 个 D 触发器 DFF2 的复位端 S ,所述比较器 COMPi 的输出端 Outp ( CODEM )和 Outn ( CODEL )连接每个 D 触发器 DFF2 的输入端,所述时钟信号 Valid 与每个 D 触发器 DFF2 的时钟端相连,第一个至第 N 个 D 触发器 DFF2 的输出端依次输出第二输出信号 D1 至 DN 。
具体地,当模数转换器 ADC 处于采样阶段时,采样信号 Clks 为高电平,图 4 中所有 D 触发器 DFF1 的输出端 Q 被置位为 0 ,同时,图 4 中所有 D 触发器 DFF2 的输出端 Q 也被置位为 0 ,当采样结束后,采样信号 Clks 变为低电平,所有的 D 触发器 DFF1 和第二输出信号 D1 对应的 D 触发器 DFF2 退出置位状态,其余 D 触发器 DFF2 保持置位状态。此时,通过比较器使能单元 COMP_ENABLE 使得比较器开始第一次比较,当比较器完成第一次比较时,时钟信号 Valid 触发未被置位的 D 触发器 DFF1 和 DFF2 ,第一输出信号 Clk1 由低电平变为高电平,第一输出信号 Clk2 到 ClkN 保持低电平,同时,第一次比较结果 CODEM ( CODEL )输出到 D1 ,此后,由于第一输出信号 Clk1 为高电平, D1 所对应的 D 触发器 DFF2 被锁存, D2 对应的 D 触发器 DFF2 退出置位状态,其余 D 触发器 DFF2 仍然保持置位状态,此时,第一次工作周期结束。此后,比较器使能单元 COMP_ENABLE 使得比较器开始第二次比较,时钟信号 Valid 触发未被置位或者锁存的 D 触发器 DFF1 和 DFF2 ,第一输出信号 Clk1 保持高电平,第一输出信号 Clk2 由低电平变为高电平,第一输出信号 Clk3 到 ClkN 保持低电平,同时,第二次比较结果 CODEM ( CODEL )输出到 D2 ,由于锁存效果, D1 的值保持不变,此后,由于第一输出信号 Clk2 为高电平, D2 所对应的 D 触发器 DFF2 被锁存, D3 对应的 D 触发器 DFF2 退出置位状态,其余 D 触发器 DFF2 仍然保持置位或者锁存状态,此时,第二次工作周期结束。此后的工作状态以此类推,其具体整体时序请参考图 5 所示。
作为具体实施例,请参考图 6 所示,所述 D 触发器 DFF1 包括第一或门 OR1 、第一反相器 INV1 、第二反相器 INV2 、第三反相器 INV3 、第一 NMOS 管 N1 、第一传输门 K1 和第二传输门 K2 ;其中,所述第一或门 OR1 的输入端与时钟信号 CP 和置位信号 S (即采样信号 Clks )连接,输出端与第一反相器 INV1 的输入端连接,所述第一或门 OR1 和第一反相器 INV1 的输出端产生的控制信号 C 和 CN ,分别与第一传输门 K1 和第二传输门 K2 的两个控制端连接,作为传输门 K1 和 K2 的控制信号, D 触发器 DFF1 的输入信号 VIN 接第一传输门 K1 的一端,第一传输门 K1 的另一端接第一 NMOS 管 N1 的漏极和第二反相器 INV2 的输入端,第一 NMOS 管的源极接地,栅极与置位信号 S 连接,第二反相器 INV2 的输出端接第二传输门 K2 的一端,第二传输门 K2 的另一端接第三反相器 INV3 的输入端,第三反相器 INV3 的输出 VOUT 作为 D 触发器 DFF1 的输出信号。
作为具体实施例,请参考图 7 所示,所述 D 触发器 DFF2 包括第二或门 OR2 、第四反相器 INV4 、第五反相器 INV5 、第六反相器 INV6 、第七反相器 INV7 、第八反相器 INV8 、第九反相器 INV9 、第二 NMOS 管 N2 、第三传输门 K3 、第四传输门 K4 和第五传输门 K5 ;其中,所述第二或门 OR2 的输入端与时钟信号 CP 、锁存信号 L 和置位信号 S 连接,第二或门 OR2 的输出端与第四反相器 INV4 的输入端连接,且锁存信号 L 还与第五反相器 INV5 的输入端连接,所述第二或门和第四反相器的输出端产生的控制信号 C 和 CN ,分别与第三传输门 K3 和第四传输门 K4 的两个控制端连接,作为传输门 K3 和 K4 的控制信号,第五反相器 INV5 的输出端产生的控制 LN 和锁存信号 L 与第五传输门 K5 的两个控制端连接,作为传输门 K5 的控制信号, D 触发器 DFF2 的输入信号 VIN 接第三传输门 K3 的一端,第三传输门 K3 的另一端接第二 NMOS 管 N2 的漏极、第六反相器 INV6 的输入端和第五传输门 K5 的一端,第二 NMOS 管 N2 的源极接地,栅极与置位信号 S 连接,第六反相器 INV6 的输出端接第四传输门 K4 的一端,第四传输门 K4 的另一端接第七反相器 INV7 的输入端,第七反相器 INV7 的输出 VOUT 作为 D 触发器 DFF2 的输出信号;同时,第二 NMOS 管 N2 的漏极和第五传输门 K5 相连的一端,作为串联的第八反相器 INV8 和第九反相器 INV9 的输入端,两个串联反相器 INV8 和 INV9 的输出端与第五传输门 K5 的另一端相连。
作为具体实施例,请参考图 8 所示,所述模数转换器还包括一个或门 OR ,所述或门 OR 的一个输入端与采样信号 Clks 连接,另一个输入端与最末一个 D 触发器 DFF1 的输出端 Q 和最末一个 D 触发器 DFF2 的锁存端 L 连接。电容阵列 DAC2 的相关工作原理如图 8 所示,图 8 和图 4 的区别在于,在图 4 中,当第一输出信号 ClkN 变为高电平后,整个模块会处于一个保持状态,直到下一次采样信号 Clks 重新触发工作;而在图 8 中,当第一输出信号 ClkN 变为高电平后,由于或门 OR 的存在, D 触发器 DFF1 和 DFF2 会被置位信号 Clkc 快速的置位,并且立即开始下一次转换过程,从而实现前面描述的工作原理。图 8 所对应的工作时序图如图 9 所示,其中 TDAC1 和 TDAC2 分别表示电容阵列 DAC1 和 DAC2 的转换时间。
作为具体实施例,请参考图 10 所示,所述开关阵列 SW1 和 SW2 均包括多组开关,每组开关包括两个对称设置的开关电容单元,每个开关电容单元包括一个与非门 NAND 、一个与门 AND 、第十反相器 INV10 、第十一反相器 INV11 和第十二反相器 INV12 ,与非门 NAND 和与门 AND 的一个输入端与时钟信号 Clki ( i 取 1 到 N )相连,编码电路 ENCODE 的输出信号 CODEM ( P )连接到第十反相器 INV10 的输入端和与门 AND 的另一个输入端,第十反相器 INV10 的输出端连接到与非门 NAND 的另一个输入端,与非门 NAND 的输出端连接第十一反相器 INV11 的输入端,与门 AND 的输出端连接第十二反相器 INV12 的输入端,第十一反相器 INV11 和第十二反相器 INV12 的输出端分别连接两个相同的电容的一个极板,这两个相同的电容的另一个极板接比较器 COMP 的一个输入端,同时,这两个相同的电容构成了一个代表一位权重的电容。图 10 所示开关电容的工作原理为:当时钟信号 Clki ( i 取 1 到 N )为低电平时,与非门 NAND 所对应的第十一反相器 INV11 输出低电平(负基准),而与门 AND 对应的第十二反相器 INV12 输出高电平(正基准),此时,对于这两个相同电容所构成的一位权重电容而言,它的非采样极板等效为和一个共模电压相连;当时钟信号 Clki ( i 取 1 到 N )由低电平变为高电平后,编码电路产生相应的信号 CODEM ( P ),如果这个信号为高电平,那么,这两个相同电容所构成的一位权重电容而言,它的非采样极板等效为接低电平(负基准),反之,等效为接高电平(正基准)。由于编码电路输入到另一端的信号 CODEM ( P )为极性相反的信号,所以,此时另一端两个相同电容所构成的一位权重电容而言,它的非采样极板等效为接高电平(正基准),反之,等效为接低电平(负基准)。
实施实例一:请参考图 12 所示的 8bits 模数转换器的实例应用原理示意图,电容阵列 DAC1 和电容阵列 DAC2 都为 4bits 电容阵列,从而可以实现一个 2bits per circle 的 8 位高速逐次逼近型模数转换器,此时只需要 4 次比较周期就可以实现 8 位逐次逼近过程。
实施实例二:请参考图 13 所示的 12bits 模数转换器的实例应用原理示意图,电容阵列 DAC1 和电容阵列 DAC2 都为 6bits 电容阵列,从而可以实现一个 2bits per circle 的 12 位高速逐次逼近型模数转换器,此时只需要 6 次比较周期就可以实现 12 位逐次逼近过程。
另外,需要特别说明的是,理论上,本发明中的电容阵列 DAC1 和电容阵列 DAC2 的位数只要相等并且是偶数,就可以实现本发明的工作原理,并不局限于上述两种实施实例。
以上仅为本发明的实施方式,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构,直接或间接运用在其他相关的技术领域,均同理在本发明的专利保护范围之内。

Claims (10)

  1. 一种2bits per circle高速逐次逼近型模数转换器,其特征在于,包括:
    开关S2、采样开关S1和S3,适于根据采样信号进行导通,且当高位大电容已经完成建立时,开关S1和S3仍然保持断开,而开关S2第二次导通;
    电容阵列DAC1和DAC2,适于电路处于采样阶段且当开关S1、S2和S3同时闭合时,其采样极板同时对输入信号VIN+和VIN-进行采样;并适于当高位大电容已经完成建立时,电容阵列DAC2的电容非采样极板重新置位为采样时的状态,而电容阵列DAC1的电容保持接对应的基准电压,再经历一次逐次逼近的过程;
    比较器COMP1、COMP2和COMP3,适于电路处于采样结束后且当开关S1、S2和S3同时断开时,将电容阵列DAC1和DAC2采样极板上的电压VP与VN之差和三个基准电压同时进行比较,三个比较器每次比较输出一个三位温度计码;
    编码电路,适于将该三位温度计码转换为两位二进制码,实现每个比较周期输出两位数字码;
    与电容阵列DAC1对应的开关阵列SW1以及与电容阵列DAC2对应的开关阵列SW2,适于将每个比较周期产生的两位数字码,同时依次从最高位到最低位逐级控制电容阵列DAC2和DAC1相应的两位电容接对应的基准电压,当电容阵列DAC2的电容都接上对应的基准电压时,电容阵列DAC1也完成了和对应基准的连接,且高位大电容已经完成建立;
    移位寄存器和数字校正单元,适于对每个比较周期输出的两个数字码进行整合后并行输出。
  2. 根据权利要求1所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述电容阵列DAC1为高位电容阵列,其包括N个并联的电容,N为偶数,N个电容大小从最高位到最低位依次为2(2N-1)C,2(2N-2)C,…,2(N+1)C,2NC,其中C为单位电容的容值;电容阵列DAC2为低位电容阵列,其包括N+1个并联的电容,N+1个电容大小从最高位到最低位依次为2(N-1)C,2(N-2)C,…,2C,C,C,其中C为单位电容的容值,DAC2中的最低位电容C的非采样极板始终接共模电压VCM。
  3. 根据权利要求1或2所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述电容阵列DAC1和DAC2的采样极板可通过采样开关S1和S3进行采样,并可通过开关S2来控制这两个采样极板是否连接在一起。
  4. 根据权利要求1所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述编码电路包括低位数字码产生电路和高位数字码产生电路,该低位数字码产生电路包括一个同或门和一个与门,同或门的两个输入端与比较器COMP2和COMP3的正向输出端连接,与门的两个输入端与同或门的输出端和比较器COMP1的正向输出端连接,与门的输出端产生两位数字码中的低位,记为CODEL;该高位数字码产生电路包括一个与门和一个或门,与门的两个输入端与比较器COMP1和COMP2的正向输出端连接,或门的两个输入端与与门的输出端和比较器COMP3的正向输出端连接,或门的输出端产生两位数字码中的高位,记为CODEM。
  5. 根据权利要求1所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述模数转换器还包括与每个所述比较器输出端对应连接的与非门,该与非门的输出端输出时钟信号Valid。
  6. 据权利要求5所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述移位寄存器包括N个D触发器DFF1、N-1个反相器和N个D触发器DFF2,N为不小于3的正整数;其中,所述时钟信号Valid与每个D触发器DFF1的时钟端相连,第一个至第N个D触发器DFF1的复位端S连接采样信号Clks,第一个D触发器DFF1的输入端D连接电源VDD,每个D触发器DFF1的输出端Q依次连接其下一个D触发器DFF1的输入端D,且第一个至第N个D触发器DFF1的输出端Q依次输出第一输出信号Clk1至ClkN,所述第一个至第N个D触发器DFF1的输出端Q依次对应连接第一个至第N-1个反相器输入端,且每个反相器的输出端依次连接其对应D触发器DFF2的复位端S;第一个至第N个D触发器DFF2的锁存端L一一对应连接第一个至第N个D触发器DFF1的输出端Q,第一个D触发器DFF2的复位端S连接采样信号Clks,且第一个至第N-1个反相器的输出端一一对应连接第2个至第N个D触发器DFF2的复位端S,所述比较器的输出端连接每个D触发器DFF2的输入端,所述时钟信号Valid与每个D触发器DFF2的时钟端相连,第一个至第N个D触发器DFF2的输出端依次输出第二输出信号D1至DN。
  7. 根据权利要求6所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述D触发器DFF1包括第一或门、第一反相器、第二反相器、第三反相器、第一NMOS管、第一传输门和第二传输门;其中,所述第一或门的输入端与时钟信号和置位信号连接,输出端与第一反相器的输入端连接,所述第一或门和第一反相器的输出端分别与第一传输门和第二传输门的两个控制端连接,D触发器DFF1的输入信号接第一传输门的一端,另一端接第一NMOS管的漏极和第二反相器的输入端,第一NMOS管的源极接地,栅极与置位信号连接,第二反相器的输出端接第二传输门的一端,另一端接第三反相器的输入端,第三反相器的输出VOUT作为D触发器DFF1的输出信号。
  8. 根据权利要求6所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述D触发器DFF2包括第二或门、第四反相器、第五反相器、第六反相器、第七反相器、第八反相器、第九反相器、第二NMOS管、第三传输门、第四传输门和第五传输门;其中,所述第二或门的输入端与时钟信号、锁存信号和置位信号连接,输出端与第四反相器的输入端连接,且锁存信号还与第五反相器的输入端连接,所述第二或门和第四反相器的输出端分别与第三传输门和第四传输门的两个控制端连接,锁存信号和第五反相器的输出端与第五传输门的两个控制端连接,D触发器DFF2的输入信号接第三传输门的一端,另一端接第二NMOS管的漏极、第六反相器的输入端和第五传输门的一端,第二NMOS管的源极接地,栅极与置位信号连接,第六反相器的输出端接第四传输门的一端,另一端接第七反相器的输入端,第七反相器的输出VOUT作为D触发器DFF2的输出信号;同时,第二NMOS管的漏极和第五传输门相连的一端,作为串联的第八反相器和第九反相器的输入端,两个串联反相器的输出端与第五传输门的另一端相连。
  9. 根据权利要求6所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述模数转换器还包括一个或门,所述或门的一个输入端与采样信号Clks连接,另一个输入端与最末一个D触发器DFF1的输出端Q和最末一个D触发器DFF2的锁存端L连接。
  10. 根据权利要求1所述的2bits per circle高速逐次逼近型模数转换器,其特征在于,所述开关阵列SW1和SW2均包括多组开关,每组开关包括两个对称设置的开关电容单元,每个开关电容单元包括一个与非门、一个与门、第十反相器、第十一反相器和第十二反相器,与非门和与门的一个输入端与时钟信号Clki相连,编码电路的输出信号CODEM(P)连接到第十反相器的输入端和与门的另一个输入端,第十反相器的输出端连接到与非门的另一个输入端,与非门的输出端连接第十一反相器的输入端,与门的输出端连接第十二反相器的输入端,第十一反相器和第十二反相器的输出端分别连接两个相同的电容的一个极板。
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