WO2016123857A1 - Oled封装方法及oled封装结构 - Google Patents

Oled封装方法及oled封装结构 Download PDF

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WO2016123857A1
WO2016123857A1 PCT/CN2015/075847 CN2015075847W WO2016123857A1 WO 2016123857 A1 WO2016123857 A1 WO 2016123857A1 CN 2015075847 W CN2015075847 W CN 2015075847W WO 2016123857 A1 WO2016123857 A1 WO 2016123857A1
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Prior art keywords
tft substrate
oled
desiccant
package cover
cover plate
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PCT/CN2015/075847
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English (en)
French (fr)
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钱佳佳
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深圳市华星光电技术有限公司
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Priority to GB1708782.6A priority Critical patent/GB2549407B/en
Priority to JP2017540735A priority patent/JP6488395B2/ja
Priority to KR1020177015549A priority patent/KR101937068B1/ko
Priority to US14/758,806 priority patent/US9947891B2/en
Publication of WO2016123857A1 publication Critical patent/WO2016123857A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED packaging method and an OLED package structure.
  • OLED organic light emitting diodes
  • the OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate.
  • the biggest problem that restricts the development of the OLED industry today is that the biggest drawback of OLED is that the lifetime of OLED is short, and the reason why the lifetime of OLED is short is mainly that the electrode and the organic material constituting the OLED device are very sensitive to moisture and oxygen in the atmosphere. It is easy to cause electrochemical corrosion in an environment containing water vapor and oxygen, causing damage to OLED devices. Therefore, the OLED must be effectively encapsulated to prevent moisture and oxygen from entering the OLED.
  • an existing OLED package structure using a sealant and a desiccant generally includes a TFT substrate 100 , a package cover 200 disposed opposite to the TFT substrate 100 , and the TFT substrate 100 and the package cover 200 .
  • the method for fabricating the above package structure is to apply a ring of desiccant 120 on the periphery of the OLED device 110 on the package cover 200, and then bond the TFT substrate 100 to the package cover 200 through a sealant 130 such as an epoxy resin.
  • a sealant 130 such as an epoxy resin
  • An object of the present invention is to provide an OLED packaging method, which can effectively avoid the problem of squeezing caused by inconsistent air pressure inside and outside the package structure when the package cover and the TFT substrate are bonded, improve the water blocking performance of the package structure, and enhance the package structure.
  • the mechanical strength significantly improves the packaging effect.
  • the object of the present invention is to provide an OLED package structure, which can effectively avoid the problem of the glue which is caused by the inconsistent air pressure inside and outside the package structure when the package cover and the TFT substrate are attached, and has good water blocking performance and High mechanical strength and good packaging effect.
  • the present invention first provides an OLED packaging method, including the following steps:
  • Step 1 Providing a TFT substrate and a package cover
  • Step 2 forming a gas guiding passage penetrating the front and rear end faces of the package cover plate on both sides of the surface of the package cover plate facing the TFT substrate;
  • Step 3 fabricating an OLED device on the TFT substrate
  • Step 4 applying a ring of desiccant on the periphery of the OLED device on the TFT substrate, and then applying a ring of sealant on the periphery of the desiccant;
  • Step 5 The TFT substrate is relatively attached to the package cover plate, and the air guiding channel makes the internal and external air pressures consistent;
  • Step 6 The TFT substrate and the package cover are pressed together, and irradiated with ultraviolet light to cure the sealant to complete packaging of the OLED device.
  • the cross section of the air guiding passage made in the step 2 is pleated.
  • the step 2 uses an acid etching process to fabricate the air guiding channel.
  • the step 3 is to fabricate the OLED device by an evaporation process.
  • the desiccant in the step 4 is a liquid desiccant.
  • the height of the desiccant is less than or equal to the height of the sealant.
  • the air guiding channel is located outside the corresponding area of the OLED device.
  • the present invention also provides an OLED package structure, comprising: a TFT substrate, a package cover plate disposed opposite to the TFT substrate, and an OLED device disposed on the TFT substrate between the TFT substrate and the package cover plate. a ring of desiccant on the periphery of the OLED device, and a ring of sealant disposed on the periphery of the desiccant to bond the TFT substrate and the package cover;
  • An air guiding channel penetrating the front and rear end faces of the package cover plate is disposed on two sides of the surface of the TFT substrate, and the air guiding channel is located in a corresponding area of the OLED device. Outside.
  • the air guiding passage has a pleated cross section.
  • the desiccant is a liquid desiccant; the desiccant has a height less than or equal to the height of the sealant.
  • the present invention also provides an OLED package structure, comprising: a TFT substrate, a package cover plate disposed opposite to the TFT substrate, and an OLED device disposed on the TFT substrate between the TFT substrate and the package cover plate. a ring of desiccant on the periphery of the OLED device, and a ring of sealant disposed on the periphery of the desiccant to bond the TFT substrate and the package cover;
  • the encapsulating cover plate is disposed on the two sides of the surface of the TFT substrate with air guiding channels extending through the front and rear end faces of the package cover plate, and the air guiding channel is located outside the corresponding region of the OLED device;
  • the desiccant is a liquid desiccant; the height of the desiccant is less than or equal to the height of the sealant.
  • the OLED packaging method provided by the present invention is simple and easy to operate, and the air guiding passages penetrating the front and rear end faces of the package cover plate are formed on both sides of the surface of the package cover plate facing the TFT substrate, so that The inner and outer air pressures of the TFT substrate and the package cover are aligned, which effectively avoids the problem of the glue caused by the inconsistent air pressure inside and outside the package structure when the package cover and the TFT substrate are bonded, and the TFT substrate and the package After the cover plate is pressed, part of the sealant enters the air guide passage, which increases the bonding area of the sealant and the package cover, improves the sealing and waterproof performance, and enhances the mechanical strength of the sealant and the package cover.
  • the OLED package structure of the present invention can effectively avoid the encapsulation cover and the TFT substrate by providing air guiding passages through the front and rear end faces of the package cover plate on both sides of the surface of the package cover plate facing the TFT substrate.
  • the pressure difference between the inside and outside of the package structure is inconsistent, the water blocking performance is good, the mechanical strength is high, and the packaging effect is good.
  • FIG. 1 is a schematic cross-sectional view showing a conventional OLED package structure using a sealant and a desiccant
  • step 1 of the OLED packaging method of the present invention is a schematic diagram of step 1 of the OLED packaging method of the present invention.
  • FIG. 4 is a cross-sectional view showing a package cover in step 2 of the OLED packaging method of the present invention.
  • FIG. 5 is a bottom view of the package cover in step 2 of the OLED packaging method of the present invention.
  • FIG. 6 is a schematic diagram of step 3 of the OLED packaging method of the present invention.
  • step 4 of the OLED packaging method of the present invention is a schematic diagram of step 4 of the OLED packaging method of the present invention.
  • step 5 of the OLED packaging method of the present invention in the middle of the package cover;
  • step 9 is a cross-sectional view of step 5 of the OLED packaging method of the present invention near a front end surface or a rear end surface of the package cover;
  • FIG. 10 is a cross-sectional view of the OLED packaging method of the present invention in the middle of the package cover, and a cross-sectional view of the OLED package structure of the present invention in the middle of the package cover;
  • step 6 of the OLED packaging method of the present invention near a front end surface or a rear end surface of the package cover
  • a cross-sectional view of the OLED package structure of the present invention near a front end surface or a rear end surface of the package cover.
  • the present invention first provides an OLED packaging method, including the following steps:
  • Step 1 As shown in FIG. 3, a TFT substrate 1 and a package cover 2 are provided.
  • the TFT substrate 1 and the package cover 2 are both transparent.
  • the TFT substrate 1 is made of glass as a substrate, and the package cover 2 is a glass plate.
  • Step 2 as shown in FIG. 4 and FIG. 5, an air guiding passage 21 penetrating the front and rear end faces of the package cover 2 is formed on both sides of the surface of the package cover 2 facing the TFT substrate 1.
  • the gas guiding channel 21 is formed by an acid etching process.
  • the air guide passage 21 has a pleated cross section.
  • Step 3 As shown in FIG. 6, an OLED device 11 is formed on the TFT substrate 1 by an evaporation process.
  • the OLED device 11 fabricated in the step 3 includes an anode, an organic light-emitting layer, and a cathode which are sequentially formed on the TFT substrate 1.
  • Step 4 As shown in FIG. 7, a ring of desiccant 12 is applied to the periphery of the OLED device 11 on the TFT substrate 1, and a ring of sealant 13 is applied to the periphery of the desiccant 12.
  • the desiccant 12 may be a liquid desiccant; the sealant 13 is sensitive to ultraviolet rays. Sense of UV sealant.
  • Step 5 as shown in FIGS. 8 and 9, the TFT substrate 1 and the package cover 2 are bonded to each other.
  • the package cover 2 is provided with air guiding passages 21 extending through the front and rear end faces of the package cover 2 toward both sides of the surface of the TFT substrate 1, the TFT substrate 1 and the package cover are performed in this step 5.
  • the air guiding channel 21 is located outside the corresponding area of the OLED device 11, and the air guiding channel 21 makes the internal and external air pressures consistent, thereby effectively avoiding the rush caused by the inconsistent internal and external air pressure. Bad problems such as glue.
  • Step 6 as shown in FIG. 10 and FIG. 11 the TFT substrate 1 and the package cover 2 are pressed together, and irradiated by ultraviolet light to cure the sealant 13 to complete the OLED device 11 .
  • the TFT substrate 1 and the package cover 2 are pressed together, and irradiated by ultraviolet light to cure the sealant 13 to complete the OLED device 11 .
  • the sealant 13 to complete the OLED device 11 .
  • the height of the desiccant 12 is less than or equal to the height of the sealant 13 , so that the sealant is 13 is closely adhered to the package cover 2; and a part of the sealant 13 adjacent to the front end surface and the rear end surface of the package cover 2 is pressed into the air guide passage 21, and the sealant 13 and the package cover are added.
  • the bonding area of 2 improves the sealing and waterproof performance, enhances the mechanical strength of the combination of the frame rubber 13 and the package cover 2, and significantly improves the packaging effect.
  • the present invention further provides an OLED package structure.
  • the OLED package structure includes: a TFT substrate 1 and a package cover plate 2 disposed opposite to the TFT substrate 1 .
  • An OLED device 11 disposed on the TFT substrate 1 between the TFT substrate 1 and the package cover 2, a ring of desiccant 12 disposed on the periphery of the OLED device 11, and a periphery disposed on the desiccant 12
  • a ring of sealant 13 of the TFT substrate 1 and the package cover 2 is bonded.
  • An air guiding passage 21 penetrating the front and rear end faces of the package cover 2 is disposed on two sides of the surface of the TFT substrate 1 , and the air guiding channel 21 is located in a corresponding region of the OLED device 11 . The outside.
  • the TFT substrate 1 and the package cover 2 are transparent, so that the OLED package structure is applicable to both a bottom emission type OLED display and a top emission type OLED display.
  • the TFT substrate 1 is used.
  • the glass is used as a substrate, and the package cover 2 is a glass plate.
  • the air guide passage 21 has a pleated cross section.
  • the OLED device 11 includes an anode, an organic light-emitting layer, and a cathode, which are sequentially disposed on the TFT substrate 1.
  • the desiccant 12 can be a liquid desiccant; the sealant 13 is a UV sealant that is sensitive to ultraviolet rays.
  • the height of the desiccant 12 is less than or equal to the height of the sealant 13.
  • the air guiding channel 21 is provided, it is possible to effectively avoid the inrush of the air pressure between the inside and the outside of the package structure when the package cover 2 and the TFT substrate 1 are bonded together.
  • a part of the sealant 13 adjacent to the front end surface and the rear end surface of the package cover 2 enters the air guide passage 21, which increases the bonding area of the sealant 13 and the package cover 2, and has a good resistance. Water performance, high mechanical strength and good packaging effect.
  • the OLED packaging method of the present invention is simple and easy to operate, and the air guiding passages penetrating the front and rear end faces of the package cover plate are formed on both sides of the surface of the package cover plate facing the TFT substrate, so that the TFT substrate is
  • the inner and outer air pressures of the package cover plate are consistent with each other, which effectively avoids the problem of the glue being caused by the inconsistent air pressure inside and outside the package structure when the package cover and the TFT substrate are bonded, and the TFT substrate and the package cover are pressed.
  • An OLED package structure of the present invention can effectively prevent the package cover and the TFT substrate from being disposed on the two sides of the surface of the package cover plate facing the front and rear end faces of the package cover plate.
  • the pressure difference between the inside and outside of the package structure is inconsistent, which has better water blocking performance, high mechanical strength and good packaging effect.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供一种OLED封装方法及OLED封装结构。该OLED封装方法包括如下步骤：步骤1、提供TFT基板(1)及封装盖板(2)；步骤2、在封装盖板(2)上制作导气通道(21)；步骤3、在TFT基板(1)上制作OLED器件(11)；步骤4、在TFT基板(1)上于OLED器件(11)的外围涂布一圈干燥剂(12)，再在干燥剂(12)的外围涂布一圈框胶(13)；步骤5、将TFT基板(1)与封装盖板(2)相对贴合；步骤6、对TFT基板(1)与封装盖板(2)进行压合，并通过紫外光进行照射，使框胶(13)固化。该方法能够有效避免由于封装盖板与TFT基板进行贴合时封装结构内外的气压不一致而导致的冲胶问题，提高封装结构的阻水性能，增强封装结构的机械强度，显著改善封装效果。

Description

OLED封装方法及OLED封装结构 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED封装方法及OLED封装结构。
背景技术
在显示技术领域，液晶显示器(Liquid Crystal Display，LCD)与有机发光二极管显示器(Organic Light Emitting Diode，OLED)等平板显示技术已经逐步取代CRT显示器。其中，OLED具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，而被广泛应用在手机屏幕、电脑显示器、全彩电视等，被业界公认为是最有发展潜力的显示装置。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。现今制约OLED产业发展的最大问题与OLED的最大缺陷是OLED的寿命较短，造成OLED寿命较短的原因主要是构成OLED器件的电极和发光层有机材料对于大气中的水汽、以及氧气都非常敏感，在含有水汽、氧气的环境中容易发生电化学腐蚀，对OLED器件造成损害。因此，必须对OLED进行有效封装，阻止水汽、氧气进入OLED内部。
封装是OLED显示器制造过程中至关重要的一个环节，封装的优劣程度直接影响OLED显示器件的密封性能，进而影响对OLED的使用寿命和质量。目前，OLED显示器主要采用框胶与干燥剂封装(Dam & Desiccant)的方式。如图1所示，现有的采用框胶与干燥剂的OLED封装结构一般包括TFT基板100、与所述TFT基板100相对设置的封装盖板200、位于所述TFT基板100与封装盖板200之间设于所述TFT基板100上的OLED器件110、设于所述OLED器件110外围的一圈干燥剂120、及设于所述干燥剂120外围粘结所述TFT基板100与封装盖板200的一圈框胶130。制作上述封装结构的方法是在封装盖板200上对应OLED器件110的外围位置涂布一圈干燥剂120，再通过环氧树脂等密封框胶130将TFT基板100与封装盖板200相结合。该种封装方式由于封装时封装结构内外的气压不一致，在对TFT基板100与封装盖板200进行贴合时，极易形成冲胶等不良。
因此，有必要提供一种新的OLED封装方法及OLED封装结构，以解决上述问题。
发明内容
本发明的目的在于提供一种OLED封装方法，能够有效避免由于封装盖板与TFT基板进行贴合时封装结构内外的气压不一致而导致的冲胶问题，提高封装结构的阻水性能，增强封装结构的机械强度，显著改善封装效果。
本发明的目的还在于提供一种OLED封装结构，能够有效避免由于封装盖板与TFT基板进行贴合时封装结构内外的气压不一致而导致的冲胶问题，具有较好的阻水性能，同时具备较高的机械强度，封装效果好。
为实现上述目的，本发明首先提供一种OLED封装方法，包括如下步骤：
步骤1、提供TFT基板、及封装盖板；
步骤2、在所述封装盖板朝向所述TFT基板的表面的两侧制作贯穿该封装盖板前、后端面的导气通道；
步骤3、在所述TFT基板上制作OLED器件；
步骤4、在所述TFT基板上于所述OLED器件的外围涂布一圈干燥剂，再在所述干燥剂的外围涂布一圈框胶；
步骤5、将所述TFT基板与封装盖板相对贴合，所述导气通道使得内、外气压一致；
步骤6、对所述TFT基板与封装盖板进行压合，并通过紫外光进行照射，使所述框胶固化，完成对所述OLED器件的封装。
所述步骤2中制作的导气通道的横截面呈褶皱状。
所述步骤2采用酸蚀刻制程制作所述导气通道。
所述步骤3采用蒸镀制程制作所述OLED器件。
所述步骤4中的干燥剂为液态干燥剂。
所述步骤6中对所述基板与封装盖板进行压合后，所述干燥剂的高度小于或等于所述框胶的高度。
所述导气通道位于所述OLED器件对应区域的外侧。
本发明还提供一种OLED封装结构，包括：TFT基板、与所述TFT基板相对设置的封装盖板、位于所述TFT基板与封装盖板之间设于所述TFT基板上的OLED器件、设于所述OLED器件外围的一圈干燥剂、及设于所述干燥剂外围粘结所述TFT基板与封装盖板的一圈框胶；
所述封装盖板朝向所述TFT基板的表面的两侧设有贯穿该封装盖板前、后端面的导气通道，且所述导气通道位于所述OLED器件对应区域的 外侧。
所述导气通道的横截面呈褶皱状。
所述干燥剂为液态干燥剂；所述干燥剂的高度小于或等于所述框胶的高度。
本发明还提供一种OLED封装结构，包括：TFT基板、与所述TFT基板相对设置的封装盖板、位于所述TFT基板与封装盖板之间设于所述TFT基板上的OLED器件、设于所述OLED器件外围的一圈干燥剂、及设于所述干燥剂外围粘结所述TFT基板与封装盖板的一圈框胶；
所述封装盖板朝向所述TFT基板的表面的两侧设有贯穿该封装盖板前、后端面的导气通道，且所述导气通道位于所述OLED器件对应区域的外侧；
其中，所述导气通道的横截面呈褶皱状；
其中，所述干燥剂为液态干燥剂；所述干燥剂的高度小于或等于所述框胶的高度。
本发明的有益效果：本发明提供的一种OLED封装方法，简单易操作，通过在封装盖板朝向TFT基板的表面的两侧制作贯穿该封装盖板前、后端面的导气通道，使得在将TFT基板与封装盖板相对贴合时的内、外气压一致，有效避免了由于封装盖板与TFT基板进行贴合时封装结构内外的气压不一致而导致的冲胶问题，且TFT基板与封装盖板进行压合后，部分框胶进入所述导气通道内，增加了框胶与封装盖板的贴合面积，提高了密封及防水性能，增强了框胶与封装盖板结合的机械强度，显著改善了封装效果。本发明提供的一种OLED封装结构，通过在封装盖板朝向所述TFT基板的表面的两侧设置贯穿该封装盖板前、后端面的导气通道，能够有效避免由于封装盖板与TFT基板进行贴合时封装结构内外的气压不一致而导致的冲胶问题，具有较好的阻水性能，同时具备较高的机械强度，封装效果好。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为现有的采用框胶与干燥剂的OLED封装结构的剖面示意图；
图2为本发明的OLED封装方法的流程图；
图3为本发明的OLED封装方法的步骤1的示意图；
图4为本发明的OLED封装方法的步骤2中封装盖板的剖面示意图；
图5为本发明的OLED封装方法的步骤2中封装盖板的仰视示意图；
图6为本发明的OLED封装方法的步骤3的示意图；
图7为本发明的OLED封装方法的步骤4的示意图；
图8为本发明的OLED封装方法的步骤5在靠近封装盖板中部的剖面示意图；
图9为本发明的OLED封装方法的步骤5在靠近封装盖板前端面或后端面的剖面示意图；
图10为本发明的OLED封装方法的步骤6在靠近封装盖板中部的剖面示意图暨本发明的OLED封装结构在靠近封装盖板中部的剖面示意图；
图11为本发明的OLED封装方法的步骤6在靠近封装盖板前端面或后端面的剖面示意图暨本发明的OLED封装结构在靠近封装盖板前端面或后端面的剖面示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明首先提供一种OLED封装方法，包括如下步骤：
步骤1、如图3所示，提供TFT基板1、及封装盖板2。
具体地，所述TFT基板1及封装盖板2均透明，优选的，所述TFT基板1以玻璃作为基底，所述封装盖板2为玻璃板。
步骤2、如图4、图5所示，在所述封装盖板2朝向所述TFT基板1的表面的两侧制作贯穿该封装盖板2前、后端面的导气通道21。
具体地，该步骤2采用酸蚀刻制程制作所述导气通道21。
所述导气通道21的横截面呈褶皱状。
步骤3、如图6所示，采用蒸镀制程在所述TFT基板1上制作OLED器件11。
具体地，该步骤3制作的OLED器件11包括依次形成于TFT基板1上的阳极、有机发光层和阴极。
步骤4、如图7所示，在所述TFT基板1上于所述OLED器件11的外围涂布一圈干燥剂12，再在所述干燥剂12的外围涂布一圈框胶13。
具体地，所述干燥剂12可为液态干燥剂；所述框胶13为对紫外线敏 感的UV框胶。
步骤5、如图8、图9所示，将所述TFT基板1与封装盖板2相对贴合。
由于所述封装盖板2朝向所述TFT基板1的表面的两侧设有贯穿该封装盖板2前、后端面的导气通道21，在进行该步骤5将所述TFT基板1与封装盖板2相对贴合时，所述导气通道21位于所述OLED器件11对应区域的外侧，且所述导气通道21使得内、外气压一致，有效避免了由于内、外气压不一致导致的冲胶等不良问题。
步骤6、如图10、图11所示，对所述TFT基板1与封装盖板2进行压合，并通过紫外光进行照射，使所述框胶13固化，完成对所述OLED器件11的封装。
值得一提的是，如图11所示，该步骤6将TFT基板1与封装盖板2进行压合后，所述干燥剂12的高度小于或等于所述框胶13的高度，使得框胶13与封装盖板2紧密贴合；且靠近所述封装盖板2前端面与后端面的部分框胶13被压入所述导气通道21内，增加了所述框胶13与封装盖板2的贴合面积，提高了密封及防水性能，增强了框胶13与封装盖板2结合的机械强度，显著改善了封装效果。
本发明还提供一种OLED封装结构，请参阅图10、图11，结合图4、图5，该OLED封装结构包括：TFT基板1、与所述TFT基板1相对设置的封装盖板2、位于所述TFT基板1与封装盖板2之间设于所述TFT基板1上的OLED器件11、设于所述OLED器件11外围的一圈干燥剂12、及设于所述干燥剂12外围粘结所述TFT基板1与封装盖板2的一圈框胶13。所述封装盖板2朝向所述TFT基板1的表面的两侧设有贯穿该封装盖板2前、后端面的导气通道21，且所述导气通道21位于所述OLED器件11对应区域的外侧。
具体地，所述TFT基板1及封装盖板2均透明，从而所述OLED封装结构既适用于底发光型的OLED显示器，也适用于顶发光型的OLED显示器，优选的，所述TFT基板1以玻璃作为基底，所述封装盖板2为玻璃板。
所述导气通道21的横截面呈褶皱状。
所述OLED器件11包括依次设于TFT基板1上的阳极、有机发光层和阴极。
所述干燥剂12可为液态干燥剂；所述框胶13为对紫外线敏感的UV框胶。所述干燥剂12的高度小于或等于所述框胶13的高度。
上述OLED封装结构，由于设置了导气通道21，能够有效避免由于封装盖板2与TFT基板1进行贴合时封装结构内外的气压不一致而导致的冲 胶问题，且靠近所述封装盖板2前端面与后端面的部分框胶13进入所述导气通道21内，增加了框胶13与封装盖板2的贴合面积，具有较好的阻水性能，同时具备较高的机械强度，封装效果好。
综上所述，本发明的OLED封装方法，简单易操作，通过在封装盖板朝向TFT基板的表面的两侧制作贯穿该封装盖板前、后端面的导气通道，使得在将TFT基板与封装盖板相对贴合时的内、外气压一致，有效避免了由于封装盖板与TFT基板进行贴合时封装结构内外的气压不一致而导致的冲胶问题，且TFT基板与封装盖板进行压合后，部分框胶进入所述导气通道内，增加了框胶与封装盖板的贴合面积，提高了密封及防水性能，增强了框胶与封装盖板结合的机械强度，显著改善了封装效果。本发明的一种OLED封装结构，通过在封装盖板朝向所述TFT基板的表面的两侧设置贯穿该封装盖板前、后端面的导气通道，能够有效避免由于封装盖板与TFT基板进行贴合时封装结构内外的气压不一致而导致的冲胶问题，具有较好的阻水性能，同时具备较高的机械强度，封装效果好。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (11)

  1. 一种OLED封装方法，包括如下步骤：
    步骤1、提供TFT基板、及封装盖板；
    步骤2、在所述封装盖板朝向所述TFT基板的表面的两侧制作贯穿该封装盖板前、后端面的导气通道；
    步骤3、在所述TFT基板上制作OLED器件；
    步骤4、在所述TFT基板上于所述OLED器件的外围涂布一圈干燥剂，再在所述干燥剂的外围涂布一圈框胶；
    步骤5、将所述TFT基板与封装盖板相对贴合，所述导气通道使得内、外气压一致；
    步骤6、对所述TFT基板与封装盖板进行压合，并通过紫外光进行照射，使所述框胶固化，完成对所述OLED器件的封装。
  2. 如权利要求1所述的OLED封装方法，其中，所述步骤2中制作的导气通道的横截面呈褶皱状。
  3. 如权利要求1所述的OLED封装方法，其中，所述步骤2采用酸蚀刻制程制作所述导气通道。
  4. 如权利要求1所述的OLED封装方法，其中，所述步骤3采用蒸镀制程制作所述OLED器件。
  5. 如权利要求1所述的OLED封装方法，其中，所述步骤4中的干燥剂为液态干燥剂。
  6. 如权利要求1所述的OLED封装方法，其中，所述步骤6中对所述基板与封装盖板进行压合后，所述干燥剂的高度小于或等于所述框胶的高度。
  7. 如权利要求1所述的OLED封装方法，其中，所述导气通道位于所述OLED器件对应区域的外侧。
  8. 一种OLED封装结构，包括：TFT基板、与所述TFT基板相对设置的封装盖板、位于所述TFT基板与封装盖板之间设于所述TFT基板上的OLED器件、设于所述OLED器件外围的一圈干燥剂、及设于所述干燥剂外围粘结所述TFT基板与封装盖板的一圈框胶；
    所述封装盖板朝向所述TFT基板的表面的两侧设有贯穿该封装盖板前、后端面的导气通道，且所述导气通道位于所述OLED器件对应区域的外侧。
  9. 如权利要求8所述的OLED封装结构，其中，所述导气通道的横截面呈褶皱状。
  10. 如权利要求8所述的OLED封装结构，其中，所述干燥剂为液态干燥剂；所述干燥剂的高度小于或等于所述框胶的高度。
  11. 一种OLED封装结构，包括：TFT基板、与所述TFT基板相对设置的封装盖板、位于所述TFT基板与封装盖板之间设于所述TFT基板上的OLED器件、设于所述OLED器件外围的一圈干燥剂、及设于所述干燥剂外围粘结所述TFT基板与封装盖板的一圈框胶；
    所述封装盖板朝向所述TFT基板的表面的两侧设有贯穿该封装盖板前、后端面的导气通道，且所述导气通道位于所述OLED器件对应区域的外侧；
    其中，所述导气通道的横截面呈褶皱状；
    其中，所述干燥剂为液态干燥剂；所述干燥剂的高度小于或等于所述框胶的高度。
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