JP6429465B2 - 装置及びその作製方法 - Google Patents
装置及びその作製方法 Download PDFInfo
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- JP6429465B2 JP6429465B2 JP2014040269A JP2014040269A JP6429465B2 JP 6429465 B2 JP6429465 B2 JP 6429465B2 JP 2014040269 A JP2014040269 A JP 2014040269A JP 2014040269 A JP2014040269 A JP 2014040269A JP 6429465 B2 JP6429465 B2 JP 6429465B2
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- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
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Description
本実施の形態では、本発明の一態様の封止体について図1〜図4を用いて説明する。
図1(A)に本発明の一態様の封止体の平面図を示す。また、図1(A)に示す一点鎖線A−B間の断面図の例を3種類挙げ、それぞれ図1(B)〜(D)に示す。
次に、本発明の一態様の封止体に用いることができる材料について説明する。
本発明の一態様の封止体に被封止体を封入する場合の作製方法の一例について、図4を用いて説明する。
まず、基板101の第1の面上に溝部107及び被封止体111を形成する(図4(A))。
まず、基板101の第1の面上、及び基板109の第1の面上にそれぞれ溝部107及び被封止体111a、bを形成する(図4(E)(F))。
本実施の形態では、本発明の一態様の発光装置や表示装置について図5〜図8を用いて説明する。本実施の形態では、特に、有機EL素子を有する発光装置及び表示装置を例に挙げて説明する。
本実施の形態では、本発明の一態様の封止体を用いた電子機器及び照明装置の一例について、図9及び図10を用いて説明する。
本実施例では、本発明の一態様を適用したモデル1と、比較例のモデル2と、について計算を行った。モデル1の構造を図11(A)に、モデル2の構造を図11(B)にそれぞれ示す。
図12(A)、図13(A)、図14(A)に、モデル1における温度分布の計算結果を示す。図12(B)、図13(B)、図14(B)に、モデル2における温度分布の計算結果を示す。図12は、加熱開始直後の結果、図13は、時刻0.031sの結果、図14は、時刻0.100sの結果である。
L2 距離
L3 最短経路
L4 最短経路
101 基板
103 空間
104 フリットペースト
105 封止材
107 溝部
107a 溝部
107b 溝部
107c 溝部
107d 溝部
107e 溝部
109 基板
111 被封止体
111a 被封止体
111b 被封止体
115 樹脂層
121 第1の電極
123 EL層
125 第2の電極
127 導電層
129 隔壁
131 画素部
133 駆動回路部
135 FPC
137 端子部
141 トランジスタ
143 トランジスタ
144 トランジスタ
145 発光素子
146 発光素子
147 発光素子
151 ブラックマトリクス
152 オーバーコート
153 カラーフィルタ
163 絶縁層
164 絶縁層
171 カラーフィルタ
209 接続体
301 ガラス基板
302 加熱箇所
305 封止材
307 溝部
309 ガラス基板
7100 テレビジョン装置
7101 筐体
7102 表示部
7103 スタンド
7111 リモコン操作機
7200 コンピュータ
7201 本体
7202 筐体
7203 表示部
7204 キーボード
7205 外部接続ポート
7206 ポインティングデバイス
7300 携帯型ゲーム機
7301a 筐体
7301b 筐体
7302 連結部
7303a 表示部
7303b 表示部
7304 スピーカ部
7305 記録媒体挿入部
7306 操作キー
7307 接続端子
7308 センサ
7400 携帯電話機
7401 筐体
7402 表示部
7403 操作ボタン
7404 外部接続ポート
7405 スピーカ
7406 マイク
7500 タブレット型端末
7501a 筐体
7501b 筐体
7502a 表示部
7502b 表示部
7503 軸部
7504 電源
7505 操作キー
7506 スピーカ
7601 照明装置
7603 卓上照明装置
7604 面状照明装置
Claims (6)
- 溝部を有する第1の基板と、
第2の基板と、
前記第1の基板と前記第2の基板との間に位置する表示部と、駆動回路部と、封止材と、を有し、
前記駆動回路部及び前記溝部は、前記表示部を取り囲むように設けられ、
前記封止材は、前記駆動回路部及び前記溝部を取り囲むように設けられ、
前記封止材は、
前記封止材と前記表示部との間に、前記駆動回路部があり、前記溝部がない領域と、
前記表示部と前記封止材との間に、前記駆動回路部がなく、前記溝部がある領域と、を有し、
前記表示部は、トランジスタと、前記トランジスタと電気的に接続される有機EL素子と、を有する装置。 - 請求項1において、
前記溝部は複数の溝を有する装置。 - 請求項1または請求項2において、
前記封止材はガラスフリットを有する装置。 - 請求項1乃至請求項3のいずれか一において、
前記第1の基板及び前記第2の基板はガラス基板である装置。 - 第1の基板の表面に溝部を形成し、
前記第1の基板の前記表面に、表示部及び駆動回路部を形成し、
第2の基板上に封止材を設け、
前記表示部及び前記駆動回路部を、前記第1の基板、前記第2の基板、及び前記封止材で封止するように、前記第1の基板と第2の基板とを対向させ、
前記封止材を加熱することで硬化させ、
前記駆動回路部及び前記溝部は、前記表示部を取り囲むように設けられ、
前記封止材は、前記駆動回路部及び前記溝部を取り囲むように設けられ、
前記封止材は、
前記封止材と前記表示部との間に、前記駆動回路部があり、前記溝部がない領域と、
前記表示部と前記封止材との間に、前記駆動回路部がなく、前記溝部がある領域と、を有する装置の作製方法。 - 請求項5において、
前記加熱は、レーザ光の照射により行われる装置の作製方法。
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JP7249106B2 (ja) | 2018-03-27 | 2023-03-30 | 黒崎播磨株式会社 | 内装体及びその製造方法 |
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