WO2016086533A1 - Oled封装方法及oled封装结构 - Google Patents

Oled封装方法及oled封装结构 Download PDF

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Publication number
WO2016086533A1
WO2016086533A1 PCT/CN2015/072474 CN2015072474W WO2016086533A1 WO 2016086533 A1 WO2016086533 A1 WO 2016086533A1 CN 2015072474 W CN2015072474 W CN 2015072474W WO 2016086533 A1 WO2016086533 A1 WO 2016086533A1
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Prior art keywords
oled
package cover
substrate
package
sealant
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PCT/CN2015/072474
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English (en)
French (fr)
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刘亚伟
王宜凡
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深圳市华星光电技术有限公司
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Priority to US14/423,706 priority Critical patent/US20160343975A1/en
Publication of WO2016086533A1 publication Critical patent/WO2016086533A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED packaging method and an OLED package structure.
  • OLED organic light emitting diodes
  • the OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate.
  • the biggest problem that restricts the development of the OLED industry and the biggest drawback of OLEDs is that the lifetime of OLEDs is short, and the reason why the lifetime of OLEDs is short is mainly due to the electrodes of the OLED devices and the organic materials of the luminescent layer for the pollutants, water vapor, and oxygen in the atmosphere. Very sensitive, it is prone to electrochemical corrosion in the environment containing water vapor and oxygen, causing damage to OLED devices. Therefore, the OLED must be effectively encapsulated to prevent moisture and oxygen from entering the OLED.
  • the OLED package mainly includes the following methods: desiccant package, UV glue package (also known as Dam only package), UV glue and filler package (also known as Dam&Fill package), glass glue package (also known as Frit package).
  • UV adhesive packaging technology is the earliest and most commonly used technology of OLED packaging. It has the following characteristics: no solvent or a small amount of solvent, which reduces the environmental pollution of solvent; low energy consumption, low temperature curing, suitable for UV sensitivity
  • the material has a fast curing speed and high efficiency, and can be used in a high-speed production line, and the curing equipment has a small footprint.
  • the sealant used in the UV adhesive package is an organic material, which has a large molecular gap after curing, and adopts a conventional OLED packaging method because the sealant has curing defects, porosity, and weak adhesion to the substrate and the package cover. For other reasons, water vapor and oxygen are more likely to penetrate into the inner sealing region through the gap, resulting in faster degradation of the performance of the OLED device and shortened life.
  • the internal sealing of the OLED device is ensured, and the contact between the OLED device and the external environment in oxygen and water vapor is minimized, which is essential for the stable performance of the OLED device and prolonging the service life of the OLED.
  • the object of the present invention is to provide an OLED packaging method, which can significantly improve the adhesion between the package cover plate and the substrate, improve the sealing property, effectively reduce oxygen and water vapor permeating into the OLED, thereby improving the performance of the OLED device and prolonging The lifetime of OLED devices.
  • the object of the present invention is to provide an OLED package structure, which can firmly bond the package cover plate and the substrate, has a better sealing effect, and effectively reduces oxygen and moisture permeating into the OLED, thereby improving the performance of the OLED device. Extend the life of OLED devices.
  • the present invention provides an OLED packaging method, including the following steps:
  • Step 1 Providing a package cover plate and a substrate provided with an OLED device, wherein the package cover plate is preliminarily provided with a ring of glue application area;
  • Step 2 performing surface roughening treatment on the rubberized area of the package cover to obtain a ring of matte surface
  • Step 3 applying a ring of sealant on the matte surface
  • Step 4 applying a layer of liquid desiccant on the inside of the sealant on the package cover;
  • Step 5 The package cover is pasted on the substrate, and the sealant is cured, and the package cover is bonded to the substrate to complete the packaging of the OLED device.
  • the package cover and the substrate are both glass substrates.
  • the matte surface is obtained by a method of grinding wheel rubbing or flannel rubbing.
  • the matte surface is composed of a plurality of irregular friction marks that are recessed on the surface of the package cover.
  • the surface of the matte surface is no more than 50 um.
  • the sealant is cured by ultraviolet light irradiation.
  • the present invention also provides an OLED package structure, including a package cover, a substrate disposed opposite the package cover, an OLED device disposed on the package cover and the substrate, and the OLED device. Externally bonding a sealant of the package cover and the substrate, filling a liquid desiccant inside the sealant and covering the OLED device; the package cover has a ring of rough surface treated by surface roughening The frame glue is disposed on the matte surface.
  • the matte surface is composed of a plurality of irregular friction marks that are recessed on the surface of the package cover.
  • the surface of the matte surface is no more than 50 um.
  • the package cover and the substrate are both glass substrates.
  • the present invention also provides an OLED package structure, including a package cover, a substrate disposed opposite the package cover, an OLED device disposed on the package cover and the substrate, and the OLED device. Externally bonding a sealant of the package cover and the substrate, filling a liquid desiccant inside the sealant and covering the OLED device; the package cover has a ring of rough surface treated by surface roughening The frame glue is disposed on the matte surface;
  • the matte surface is composed of a plurality of irregular friction marks that are recessed on the surface of the package cover;
  • the package cover and the substrate are both glass substrates.
  • the invention provides an OLED packaging method, which obtains a matte surface by surface roughening treatment on a pre-applied area of a package cover plate, and then applies a sealant on the matte surface to increase the sealant and the sealant.
  • the contact area of the package cover plate enhances the adhesion between the package cover plate and the substrate, improves the sealing property, effectively reduces oxygen and water vapor permeating into the OLED, improves the performance of the OLED device, and prolongs the OLED device.
  • Service life provides an OLED package structure, wherein the package cover has a ring surface roughened surface, and the frame glue is disposed on the matte surface, thereby increasing the contact area between the sealant and the package cover.
  • the package cover plate and the substrate are firmly bonded together, and the sealing effect is better, and the oxygen and water vapor which penetrate into the OLED are effectively reduced, thereby improving the performance of the OLED device and prolonging the service life of the OLED device.
  • step 1 of the OLED packaging method of the present invention is a schematic diagram of step 1 of the OLED packaging method of the present invention.
  • step 2 of the OLED packaging method of the present invention is a schematic diagram of step 2 of the OLED packaging method of the present invention.
  • Figure 4 is a cross-sectional view corresponding to Figure 3;
  • FIG. 5 is a schematic diagram of step 3 of the OLED packaging method of the present invention.
  • step 4 of the OLED packaging method of the present invention is a schematic diagram of step 4 of the OLED packaging method of the present invention.
  • FIG. 7 is a schematic diagram of step 5 of the OLED packaging method of the present invention and a schematic diagram of the OLED package structure of the present invention.
  • the present invention provides an OLED packaging method, including the following steps:
  • Step 1 please refer to FIG. 2 and FIG. 7 at the same time, and provide a package cover plate 1 and a substrate 2, and the package cover plate 1 is provided with a ring of glue application area 10 in advance.
  • the package cover 1 and the substrate 2 are both transparent substrates.
  • the package cover 1 and the substrate 2 are both glass substrates.
  • the substrate 2 is a substrate provided with an OLED device 21, and preferably, the substrate 2 is a TFT substrate provided with an OLED device 21.
  • Step 2 please refer to FIG. 3 and FIG. 4 at the same time, and the surface of the glue coating area 10 of the package cover 1 is roughened to obtain a ring surface 11 .
  • the matte surface 11 can be obtained by a method of grinding wheel rubbing or flannel rubbing. Further, the matte surface 11 obtained by the friction of the grinding wheel or the rubbing of the fleece is composed of a plurality of irregular rubbing marks 111 recessed on the surface of the package cover 1. Preferably, the depth of the matte surface 11 is controlled within 50 um.
  • Step 3 As shown in FIG. 5, a ring of sealant 12 is coated on the matte surface 11.
  • the sealant 12 is a UV curable adhesive.
  • Step 4 As shown in FIG. 6, a liquid desiccant 13 is coated on the inside of the sealant 12 on the package cover 1.
  • the liquid desiccant 13 is a liquid desiccant code-named "OleDry-F" developed by Japan Shuangye Electronics Co., Ltd., which is transparent, has certain viscosity, and has good hygroscopicity, and its chemical formula is :
  • R is a substituent such as ethyl (CH 3 CH 2 -) or the like.
  • Step 5 as shown in FIG. 7, the package cover 1 and the substrate 2 are relatively adhered, and the sealant 12 is cured by ultraviolet light irradiation, and the package cover 1 and the substrate 2 are bonded together.
  • the packaging of the OLED device 21 is completed.
  • the sealant 12 is coated on the matte surface 11 to make the sealant 12 and the package cover.
  • the contact area of the board 1 is increased, the bonding force between the sealant 12 and the package cover 1 is increased, thereby significantly enhancing the adhesion between the package cover 1 and the substrate 2, improving the sealing property and effectively reducing Oxygen and water vapor permeate into the interior of the OLED, and a liquid desiccant 13 is filled inside the sealant 12 for absorbing water vapor intruding into the OLED, which can improve the performance of the OLED device and prolong the service life of the OLED device.
  • the present invention further provides an OLED package structure, including a package cover plate 1 , a substrate 2 disposed opposite to the package cover plate 2 , and a substrate 2 disposed on the package cover plate 1 and the substrate 2 .
  • the OLED device 21 on the periphery of the OLED device 21, the sealant 12 on the package cover 1 and the substrate 2, and the liquid desiccant 13 filled on the inside of the sealant 12 and covering the OLED device 21 .
  • the package cover plate 1 has a ring surface roughened surface 11 on the surface of the package cover 1 It is disposed on the matte surface 11.
  • the package cover 1 and the substrate 2 are both transparent substrates.
  • the package cover 1 and the substrate 2 are both glass substrates.
  • the substrate 2 is a TFT substrate provided with an OLED device 21.
  • the matte surface 11 is obtained by grinding wheel rubbing or flannel rubbing, and is composed of a plurality of irregular rubbing marks 111 recessed on the surface of the package cover plate 1. Further, the surface of the matte surface 11 is no more than 50 um.
  • the liquid desiccant 13 is a liquid desiccant code-named "OleDry-F" developed by Japan Shuangye Electronics Industry Co., Ltd.
  • the liquid desiccant is transparent, has certain viscosity, and has good moisture absorption performance.
  • the chemical formula is:
  • R is a substituent such as ethyl (CH 3 CH 2 -) or the like.
  • the package cover 1 has a ring surface 11 which is subjected to surface roughening treatment, and the sealant 12 is disposed on the matte surface 11 to increase the sealant 12 and the package cover 1
  • the contact area increases the bonding force between the sealant 12 and the package cover 1, and the package cover 1 and the substrate 2 are firmly bonded together, and the sealing effect is good, thereby effectively reducing oxygen and the penetration into the OLED.
  • the water vapor is filled with a liquid desiccant 13 on the inner side of the sealant 12 for absorbing water vapor intruding into the OLED, thereby improving the performance of the OLED device and prolonging the service life of the OLED device.
  • the OLED packaging method of the present invention obtains a matte surface by roughening the pre-applied area of the package cover, and then applies a sealant on the matte surface to increase the sealant and the package cover.
  • the contact area enhances the adhesion between the package cover and the substrate, improves the sealing property, effectively reduces oxygen and water vapor permeating into the OLED, improves the performance of the OLED device, and prolongs the service life of the OLED device.
  • the package cover has a ring surface roughened surface, and the frame glue is disposed on the surface of the surface, thereby increasing the contact area between the sealant and the package cover, and enabling the package cover
  • the board and the substrate are firmly bonded together, and the sealing effect is good, and the oxygen and water vapor which penetrate into the OLED are effectively reduced, thereby improving the performance of the OLED device and prolonging the service life of the OLED device.

Abstract

一种OLED封装方法及OLED封装结构，该OLED封装方法包括：步骤1、提供一封装盖板(1)与一设有OLED器件(21)的基板(2)，所述封装盖板(1)上预先设有一圈涂胶区域(10)；步骤2、对所述封装盖板(1)的涂胶区域(10)进行表面粗糙处理，得到一圈毛面(11)；步骤3、在所述毛面(11)上涂覆一圈框胶(12)；步骤4、在所述封装盖板(1)上于所述框胶(12)的内侧涂覆一层液态干燥剂(13)；步骤5、将所述封装盖板(1)与基板(2)相对贴合，并使所述框胶(12)固化，将所述封装盖板(1)与基板(2)粘结在一起，完成对OLED器件的封装。该方法能够显著提高封装盖板与基板之间的粘结力，提高密封性。

Description

OLED封装方法及OLED封装结构 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED封装方法及OLED封装结构。
背景技术
在显示技术领域，液晶显示器(Liquid Crystal Display，LCD)与有机发光二极管显示器(Organic Light Emitting Diode，OLED)等平板显示技术已经逐步取代CRT显示器。其中，OLED具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，而被广泛应用在手机屏幕、电脑显示器、全彩电视等，被业界公认为是最有发展潜力的显示装置。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。制约OLED产业发展的最大问题与OLED的最大缺陷是OLED的寿命较短，造成OLED寿命较短的原因主要是构成OLED器件的电极和发光层有机材料对于大气中的污染物、水汽、以及氧气都非常敏感，在含有水汽、氧气的环境中容易发生电化学腐蚀，对OLED器件造成损害。因此，必须对OLED进行有效封装，阻止水汽、氧气进入OLED内部。
OLED封装主要包括以下几种方式：干燥剂封装、UV胶封装(又称Dam only封装)、UV胶和填充胶封装(又称Dam&Fill封装)、玻璃胶封装(又称Frit封装)等。其中，UV胶封装技术是OLED封装最早也是最常用的技术，其具有如下特点：不使用溶剂或使用少量溶剂，减少了溶剂对环境的污染；耗能少，可低温固化，适用于对UV敏感的材料；固化速度快，效率高，可在高速生产线上使用，固化设备占地面积小等。但是，UV胶封装中所使用的密封胶是有机材料，其固化后分子间隙较大，采用传统的OLED封装方法，由于密封胶具有固化缺陷、多孔性、与基板、封装盖板的结合力弱等原因，水汽与氧气比较容易透过间隙渗透入内部密封区域，从而导致OLED器件的性能较快退化，寿命缩短。
因此，通过对OLED进行有效封装，保证OLED器件内部良好的密封性，尽可能的减少OLED器件与外部环境中氧气、水汽的接触，对于OLED器件的性能稳定及延长OLED的使用寿命至关重要。
目前，OLED器件的封装技术成为国内外相关研究的热点。
发明内容
本发明的目的在于提供一种OLED封装方法，能够显著提高封装盖板与基板之间的粘结力，提高密封性，有效减少渗透到OLED内部的氧气与水汽，从而提高OLED器件的性能，延长OLED器件的使用寿命。
本发明的目的还在于提供一种OLED封装结构，能够使封装盖板与基板牢固的粘结在一起，密封效果较好，有效减少渗透到OLED内部的氧气与水汽，从而提高OLED器件的性能，延长OLED器件的使用寿命。
为实现上述目的，本发明提供一种OLED封装方法，包括如下步骤：
步骤1、提供一封装盖板与一设有OLED器件的基板，所述封装盖板上预先设有一圈涂胶区域；
步骤2、对所述封装盖板的涂胶区域进行表面粗糙处理，得到一圈毛面；
步骤3、在所述毛面上涂覆一圈框胶；
步骤4、在所述封装盖板上于所述框胶的内侧涂覆一层液态干燥剂；
步骤5、将所述封装盖板与基板相对贴合，并使所述框胶固化，将所述封装盖板与基板粘结在一起，完成对OLED器件的封装。
所述封装盖板与基板均为玻璃基板。
所述步骤2中采用砂轮摩擦或绒布摩擦的方法得到所述毛面。
所述毛面由多条凹陷于封装盖板表面的不规则摩擦痕构成。
所述毛面的深度不大于50um。
所述步骤5中利用紫外光照射使所述框胶固化。
本发明还提供一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板内部设于所述基板上的OLED器件、位于所述OLED器件外围粘结所述封装盖板与基板的框胶、填充于所述框胶内侧并覆盖所述OLED器件的液态干燥剂；所述封装盖板上具有一圈经过表面粗糙处理的毛面，所述框胶设于所述毛面上。
所述毛面由多条凹陷于封装盖板表面的不规则摩擦痕构成。
所述毛面的深度不大于50um。
所述封装盖板与基板均为玻璃基板。
本发明还提供一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板内部设于所述基板上的OLED器件、位于所述OLED器件外围粘结所述封装盖板与基板的框胶、填充于所述框胶内侧并覆盖所述OLED器件的液态干燥剂；所述封装盖板上具有一圈经过表面粗糙处理的毛面，所述框胶设于所述毛面上；
其中，所述毛面由多条凹陷于封装盖板表面的不规则摩擦痕构成；
其中，所述封装盖板与基板均为玻璃基板。
本发明的有益效果：本发明提供的一种OLED封装方法，通过对封装盖板的预涂胶区域进行表面粗糙处理得到毛面，再在毛面上涂覆框胶，增大了框胶与封装盖板的接触面积，增强了封装盖板与基板之间的粘结力，提高了密封性，有效减少了渗透到OLED内部的氧气以及水汽，提高了OLED器件的性能，延长了OLED器件的使用寿命。本发明提供的一种OLED封装结构，其封装盖板上具有一圈经过表面粗糙处理的毛面，框胶设于所述毛面上，增大了框胶与封装盖板的接触面积，能够使封装盖板与基板牢固的粘结在一起，密封效果较好，有效减少渗透到OLED内部的氧气与水汽，从而提高OLED器件的性能，延长OLED器件的使用寿命。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为本发明OLED封装方法的流程图；
图2为本发明OLED封装方法的步骤1的示意图；
图3为本发明OLED封装方法的步骤2的示意图；
图4为对应图3的剖面示意图；
图5为本发明OLED封装方法的步骤3的示意图；
图6为本发明OLED封装方法的步骤4的示意图；
图7为本发明OLED封装方法的步骤5的示意图暨本发明OLED封装结构的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1，本发明提供一种OLED封装方法，包括如下步骤：
步骤1、请同时参阅图2与图7，提供封装盖板1与基板2，所述封装盖板1上预先设有一圈涂胶区域10。
所述封装盖板1与基板2均为透明基板，优选的，所述封装盖板1与基板2均为玻璃基板。所述基板2为设有OLED器件21的基板，优选的，所述基板2为设有OLED器件21的TFT基板。
步骤2、请同时参阅图3与图4，对所述封装盖板1的涂胶区域10进行表面粗糙处理，得到一圈毛面11。
具体地，可以采用砂轮摩擦或绒布摩擦的方法得到所述毛面11。进一步的，经砂轮摩擦或绒布摩擦得到的毛面11由多条凹陷于封装盖板1表面的不规则摩擦痕111构成。优选的，所述毛面11的深度控制在50um以内。
步骤3、如图5所示，在所述毛面11上涂覆一圈框胶12。
所述框胶12为UV固化胶。
步骤4、如图6所示，在所述封装盖板1上于所述框胶12的内侧涂覆一层液态干燥剂13。
具体地，所述液态干燥剂13选用日本双叶电子工业株式会社研发的产品代号为“OleDry-F”的液态干燥剂，该液态干燥剂透明、具有一定黏性、吸湿性能良好，其化学式为：
Figure PCTCN2015072474-appb-000001
其中R为取代基，如乙基(CH3CH2-)等。
步骤5、如图7所示，将所述封装盖板1与基板2相对贴合，并利用紫外光照射使所述框胶12固化，将所述封装盖板1与基板2粘结在一起，完成对OLED器件21的封装。
在上述OLED封装方法中，由于对封装盖板1上的涂胶区域10进行了表面粗糙处理得到毛面11，再在所述毛面11上涂覆框胶12，使框胶12与封装盖板1的接触面积增大，加大了框胶12与封装盖板1之间的结合力，从而显著增强了封装盖板1与基板2之间的粘结力，提高了密封性，有效减少了渗透到OLED内部的氧气以及水汽，同时在框胶12的内侧填充了液态干燥剂13，用于吸收侵入OLED内部的水汽，能够提高OLED器件的性能，延长OLED器件的使用寿命。
请参阅图7，本发明还提供一种OLED封装结构，包括封装盖板1、与所述封装盖板1相对设置的基板2、位于所述封装盖板1与基板2内部设于所述基板2上的OLED器件21、位于所述OLED器件21外围粘结所述封装盖板1与基板2的框胶12、填充于所述框胶12内侧并覆盖所述OLED器件21的液态干燥剂13。
所述封装盖板1上具有一圈经过表面粗糙处理的毛面11，所述框胶12 设于所述毛面11上。
具体地，所述封装盖板1与基板2均为透明基板，优选的，所述封装盖板1与基板2均为玻璃基板。所述基板2为设有OLED器件21的TFT基板。
所述毛面11采用砂轮摩擦或绒布摩擦的方法得到，且由多条凹陷于封装盖板1表面的不规则摩擦痕111构成。进一步的，所述毛面11的深度不大于50um。
所述液态干燥剂13选用日本双叶电子工业株式会社研发的产品代号为“OleDry-F”的液态干燥剂，该液态干燥剂透明、具有一定黏性、吸湿性能良好，其化学式为：
Figure PCTCN2015072474-appb-000002
其中R为取代基，如乙基(CH3CH2-)等。
在上述OLED封装结构中，所述封装盖板1上具有一圈经过表面粗糙处理的毛面11，框胶12设于所述毛面11上，增大了框胶12与封装盖板1的接触面积，加大了框胶12与封装盖板1之间的结合力，能够使封装盖板1与基板2牢固的粘结在一起，密封效果较好，有效减少渗透到OLED内部的氧气与水汽，同时在框胶12的内侧填充了液态干燥剂13，用于吸收侵入OLED内部的水汽，从而提高OLED器件的性能，延长OLED器件的使用寿命。
综上所述，本发明的OLED封装方法，通过对封装盖板的预涂胶区域进行表面粗糙处理得到毛面，再在毛面上涂覆框胶，增大了框胶与封装盖板的接触面积，增强了封装盖板与基板之间的粘结力，提高了密封性，有效减少了渗透到OLED内部的氧气以及水汽，提高了OLED器件的性能，延长了OLED器件的使用寿命。本发明的OLED封装结构，其封装盖板上具有一圈经过表面粗糙处理的毛面，框胶设于所述毛面上，增大了框胶与封装盖板的接触面积，能够使封装盖板与基板牢固的粘结在一起，密封效果较好，有效减少渗透到OLED内部的氧气与水汽，从而提高OLED器件的性能，延长OLED器件的使用寿命。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims (12)

  1. 一种OLED封装方法，包括如下步骤：
    步骤1、提供一封装盖板与一设有OLED器件的基板，所述封装盖板上预先设有一圈涂胶区域；
    步骤2、对所述封装盖板的涂胶区域进行表面粗糙处理，得到一圈毛面；
    步骤3、在所述毛面上涂覆一圈框胶；
    步骤4、在所述封装盖板上于所述框胶的内侧涂覆一层液态干燥剂；
    步骤5、将所述封装盖板与基板相对贴合，并使所述框胶固化，将所述封装盖板与基板粘结在一起，完成对OLED器件的封装。
  2. 如权利要求1所述的OLED封装方法，其中，所述封装盖板与基板均为玻璃基板。
  3. 如权利要求1所述的OLED封装方法，其中，所述步骤2中采用砂轮摩擦或绒布摩擦的方法得到所述毛面。
  4. 如权利要求1所述的OLED封装方法，其中，所述毛面由多条凹陷于封装盖板表面的不规则摩擦痕构成。
  5. 如权利要求4所述的OLED封装方法，其中，所述毛面的深度不大于50um。
  6. 如权利要求1所述的OLED封装方法，其中，所述步骤5中利用紫外光照射使所述框胶固化。
  7. 一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板内部设于所述基板上的OLED器件、位于所述OLED器件外围粘结所述封装盖板与基板的框胶、填充于所述框胶内侧并覆盖所述OLED器件的液态干燥剂；所述封装盖板上具有一圈经过表面粗糙处理的毛面，所述框胶设于所述毛面上。
  8. 如权利要求7所述的OLED封装结构，其中，所述毛面由多条凹陷于封装盖板表面的不规则摩擦痕构成。
  9. 如权利要求8所述的OLED封装结构，其中，所述毛面的深度不大于50um。
  10. 如权利要求7所述的OLED封装结构，其中，所述封装盖板与基板均为玻璃基板。
  11. 一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板内部设于所述基板上的OLED器件、位 于所述OLED器件外围粘结所述封装盖板与基板的框胶、填充于所述框胶内侧并覆盖所述OLED器件的液态干燥剂；所述封装盖板上具有一圈经过表面粗糙处理的毛面，所述框胶设于所述毛面上；
    其中，所述毛面由多条凹陷于封装盖板表面的不规则摩擦痕构成；
    其中，所述封装盖板与基板均为玻璃基板。
  12. 如权利要求11所述的OLED封装结构，其中，所述毛面的深度不大于50um。
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