WO2016086538A1 - Oled封装结构及oled封装方法 - Google Patents

Oled封装结构及oled封装方法 Download PDF

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Publication number
WO2016086538A1
WO2016086538A1 PCT/CN2015/072494 CN2015072494W WO2016086538A1 WO 2016086538 A1 WO2016086538 A1 WO 2016086538A1 CN 2015072494 W CN2015072494 W CN 2015072494W WO 2016086538 A1 WO2016086538 A1 WO 2016086538A1
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Prior art keywords
package cover
oled
substrate
concave
package
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PCT/CN2015/072494
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English (en)
French (fr)
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刘亚伟
罗长诚
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深圳市华星光电技术有限公司
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Publication of WO2016086538A1 publication Critical patent/WO2016086538A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED package structure and an OLED package method.
  • OLED Organic Light-Emitting Diode
  • CRT cathode ray tube
  • the OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate.
  • the biggest problem that restricts the development of the OLED industry and the biggest drawback of OLEDs is that the lifetime of OLEDs is short, and the reason why the lifetime of OLEDs is short is mainly due to the electrodes of the OLED devices and the organic materials of the luminescent layer for the pollutants, water vapor, and oxygen in the atmosphere. Very sensitive, it is prone to electrochemical corrosion in the environment containing water vapor and oxygen, causing damage to OLED devices. Therefore, the OLED must be effectively encapsulated to prevent moisture and oxygen from entering the OLED.
  • the OLED package mainly includes the following methods: desiccant package, UV glue package (also known as Dam only package), UV glue and filler package (also known as Dam&Fill package), glass glue package (also known as Frit package).
  • UV adhesive packaging technology is the earliest and most commonly used technology of OLED packaging. It has the following characteristics: no solvent or a small amount of solvent, which reduces the environmental pollution of solvent; low energy consumption, low temperature curing, suitable for UV sensitivity
  • the material has a fast curing speed and high efficiency, and can be used in a high-speed production line, and the curing equipment has a small footprint.
  • the sealant used in the UV adhesive package is an organic material, which has a large molecular gap after curing, and adopts a conventional OLED packaging method because the sealant has curing defects, porosity, and weak adhesion to the substrate and the package cover. For other reasons, water vapor and oxygen are more likely to penetrate into the inner sealing region through the gap, resulting in faster degradation of the performance of the OLED device and shortened life.
  • the internal sealing of the OLED device is ensured, and the contact between the OLED device and the external environment in oxygen and water vapor is minimized, which is essential for the stable performance of the OLED device and prolonging the service life of the OLED.
  • To achieve better packaging efficiency It is still necessary to further improve the existing package structure and packaging method to block the path of moisture and oxygen from penetrating into the interior of the OLED package structure.
  • the object of the present invention is to provide an OLED package structure, which can improve the bonding strength between the package cover and the substrate, reduce the distance between the package cover and the substrate, effectively block the infiltration of water vapor and oxygen, and have a good packaging effect. It helps to improve the performance of OLED devices and extend the service life of OLED devices.
  • Another object of the present invention is to provide an OLED packaging method capable of firmly bonding a package cover plate and a substrate, and reducing the distance between the package cover plate and the substrate, thereby effectively blocking the infiltration of moisture and oxygen. Helps improve the performance of OLED devices, extend the service life of OLED devices, and has a simple process and good packaging effect.
  • the present invention provides an OLED package structure, including a package cover, a substrate disposed opposite the package cover, an OLED device disposed on the substrate between the package cover and the substrate, a desiccant disposed on the package cover on a periphery of the OLED device region, and a sealant on the periphery of the desiccant bonding the package cover and the substrate;
  • a plurality of grooves are formed on a periphery of the package cover corresponding to the OLED device region, and a plurality of annular structures are disposed on the periphery of the groove, and the desiccant is disposed in the groove, and the frame glue is disposed in the Between the uneven structure and the substrate.
  • the package cover and the substrate are both glass substrates.
  • the concave-convex structure includes a convex portion protruding from a surface of the package cover plate, and a concave portion adjacent to the convex portion and recessed into a surface of the package cover plate, the frame glue completely filling the concave portion And covering the raised portion.
  • Both the convex portion and the concave portion have a trapezoidal cross section.
  • the protrusion protrudes from the surface of the package cover plate by a height of 0.1 to 10 um; and the surface of the concave-convex structure and the groove is a rough surface.
  • the desiccant is calcium chloride, and the desiccant is flush with the surface of the package cover.
  • the invention also provides an OLED packaging method, comprising the following steps:
  • Step 1 providing a package cover and a substrate, wherein the substrate is provided with an OLED device;
  • Step 2 forming a plurality of concave and convex structures on the package cover on the outer side corresponding to the OLED device region;
  • Step 3 forming a ring groove on the package cover on the inner side of the concave-convex structure corresponding to the outer side of the OLED device region, and performing surface roughening treatment on the concave-convex structure and the groove;
  • Step 4 applying a sealant on the concave-convex structure
  • Step 5 filling the inside of the groove with a desiccant
  • Step 6 The package cover plate and the substrate are relatively adhered under vacuum conditions, and the sealant is cured by UV light irradiation, thereby bonding the package cover plate and the substrate together to complete the OLED device. Package.
  • the concave-convex structure and the groove are formed by an etching method; and the concave-convex structure and the groove are surface-finished by a plasma surface treatment method.
  • the concave-convex structure includes a convex portion protruding from a surface of the package cover plate, and a concave portion adjacent to the convex portion and recessed into a surface of the package cover plate, the frame glue completely filling the concave portion And covering the raised portion.
  • the raised portion and the recessed portion have a trapezoidal cross section; the raised portion protrudes from the surface of the package cover plate by a height of 0.1 to 10 um; the desiccant is calcium chloride, and the desiccant and the solution The surface of the package cover is flush.
  • the invention also provides an OLED packaging method, comprising the following steps:
  • Step 1 providing a package cover and a substrate, wherein the substrate is provided with an OLED device;
  • Step 2 forming a plurality of concave and convex structures on the package cover on the outer side corresponding to the OLED device region;
  • Step 3 forming a ring groove on the package cover on the inner side of the concave-convex structure corresponding to the outer side of the OLED device region, and performing surface roughening treatment on the concave-convex structure and the groove;
  • Step 4 applying a sealant on the concave-convex structure
  • Step 5 filling the inside of the groove with a desiccant
  • Step 6 The package cover plate and the substrate are relatively adhered under vacuum conditions, and the sealant is cured by UV light irradiation, thereby bonding the package cover plate and the substrate together to complete the OLED device.
  • the concave-convex structure and the groove are formed by an etching method; and the concave-convex structure is subjected to surface roughening treatment by a plasma surface treatment method;
  • the concave-convex structure comprises a convex portion protruding from a surface of the package cover plate, and a recess portion adjacent to the convex portion and recessed into a surface of the package cover plate, the sealant completely filling the The depressed portion covers the raised portion.
  • the OLED package structure provided by the present invention provides a concave-convex structure by applying a frame glue on the package cover plate, thereby ensuring a sufficient space between the package cover plate and the substrate to fill the frame glue, thereby improving
  • the bonding strength between the package cover plate and the substrate, and the distance between the package cover plate and the substrate is reduced, the penetration path of water vapor and oxygen is blocked, and the moisture and oxygen permeation are effectively blocked.
  • the encapsulation effect is better, and the desiccant is reduced to reduce the water vapor permeating through the sealant into the inner sealing area of the OLED, which helps to improve the performance of the OLED device and prolong the service life of the OLED device.
  • the invention provides an OLED packaging method, which is formed into a concave-convex structure by applying a frame glue on a package cover plate, and ensures a sufficient space between the package cover plate and the substrate to fill the frame glue, thereby improving the package cover plate and the substrate.
  • the bonding strength between the two sides reduces the distance between the package cover and the substrate, blocks the infiltration path of water vapor and oxygen, effectively blocks the infiltration of water vapor and oxygen, and at the same time reduces the penetration of the through-frame glue to the OLED by filling the desiccant.
  • the water vapor in the inner sealing area helps to improve the performance of the OLED device, prolong the service life of the OLED device, and has a simple process and a good packaging effect.
  • FIG. 1 is a schematic view of an OLED package structure of the present invention
  • FIG. 2 is a flow chart of a method for packaging an OLED according to the present invention.
  • step 1 of the OLED packaging method of the present invention is a schematic diagram of step 1 of the OLED packaging method of the present invention.
  • step 2 of the OLED packaging method of the present invention is a schematic diagram of step 2 of the OLED packaging method of the present invention.
  • FIG. 5 is a schematic diagram of step 3 of the OLED packaging method of the present invention.
  • step 4 of the OLED packaging method of the present invention is a schematic diagram of step 4 of the OLED packaging method of the present invention.
  • step 5 of the OLED packaging method of the present invention is a schematic diagram of step 5 of the OLED packaging method of the present invention.
  • FIG. 8 is a schematic diagram of step 6 of the OLED packaging method of the present invention.
  • an OLED package structure includes a package cover 1 , a substrate 2 disposed opposite to the package cover 1 , and a substrate 2 disposed between the package cover 1 and the substrate 2 .
  • a circumference of the OLED device 21 is disposed on the periphery of the OLED device 21, and a plurality of concave and convex structures 101 are disposed on the periphery of the groove 103.
  • the desiccant 11 is disposed in the groove.
  • the sealant 12 is disposed between the uneven structure 101 and the substrate 2 . Place The uneven structure 101 allows a sufficient space between the package cover 1 and the substrate 2 to fill the sealant 12, and the bonding strength between the package cover 1 and the substrate 2 can be improved.
  • the package cover 1 and the substrate 2 are both transparent substrates.
  • the package cover 1 and the substrate 2 are both glass substrates.
  • the concave-convex structure 101 includes a convex portion 102 protruding from the surface of the package cover 1 and a concave portion 104 adjacent to the convex portion 102 and recessed into the surface of the package cover 1.
  • the sealant 12 completely fills the recessed portion 104 and covers the raised portion 102. Since the raised portion 102 protrudes from the surface of the package cover 1 by a certain height, the gap between the package cover 1 and the substrate 2 is reduced. The distance, blocking the infiltration path of water vapor and oxygen, effectively blocks the infiltration of water vapor and oxygen, and reduces the penetration rate of water vapor and oxygen.
  • Both the convex portion 102 and the concave portion 104 have a trapezoidal cross section.
  • the protrusion 102 protrudes from the surface of the package cover 1 by a height of 0.1 to 10 um.
  • the surface of the concave-convex structure 101 and the groove 103 is preferably a rough surface to make the sealant 12 adhere more firmly.
  • the desiccant 11 is preferably calcium chloride, and the desiccant 11 is flush with the inner surface of the package cover 1.
  • the concave and convex structure 101 is disposed on the package cover 1 at a position where the sealant 12 is applied to ensure sufficient space between the package cover 1 and the substrate 2 to fill the sealant 12, and the package cover 1 is improved.
  • the bonding strength with the substrate 2 reduces the distance between the package cover 1 and the substrate 2, blocks the infiltration path of water vapor and oxygen, effectively blocks the infiltration of water vapor and oxygen, and has a good encapsulation effect, and at the same time, a desiccant is provided. 11 to reduce the moisture that penetrates through the sealant 12 to the inner sealing area of the OLED, which helps to improve the performance of the OLED device and prolong the service life of the OLED device.
  • the present invention further provides an OLED packaging method, including the following steps:
  • Step 1 as shown in FIG. 3, a package cover 1 and a substrate 2 are provided, and the substrate 2 is provided with an OLED device 21.
  • the package cover 1 and the substrate 2 are both transparent substrates.
  • the package cover 1 and the substrate 2 are both glass substrates.
  • Step 2 As shown in FIG. 4, a plurality of annular structures 101 are formed on the package cover 1 on the outer side of the region corresponding to the OLED device 21.
  • the uneven structure 101 can be formed by an etching method or the like.
  • the concave-convex structure 101 includes a convex portion 102 protruding from the surface of the package cover 1 and a concave portion 104 adjacent to the convex portion 102 and recessed into the surface of the package cover 1. Further, the protrusions 102 and the recesses 104 have a trapezoidal cross section. Preferably, the protrusions 102 protrude from the surface of the package cover 1 by a height of 0.1 to 10 um.
  • Step 3 as shown in FIG. 5, a groove 103 is formed on the package cover 1 on the inner side of the concave-convex structure 101, corresponding to the outer side of the OLED device 21, and the concave-convex structure 101 and the The groove 103 is subjected to surface roughening treatment.
  • the groove 103 may be formed by an etching method or other methods; the uneven structure 101 and the groove 103 may be surface roughened by a plasma surface treatment method.
  • Step 4 As shown in FIG. 6, the sealant 12 is coated on the concave-convex structure 101, so that the sealant 12 completely fills the recessed portion 104 and covers the raised portion 102.
  • Step 5 As shown in FIG. 7, a desiccant 11 is coated inside the groove 103.
  • the desiccant 11 is preferably calcium chloride; the desiccant 11 is flush with the surface of the package cover 1.
  • Step 6 as shown in FIG. 8, the package cover 1 and the substrate 2 are relatively adhered under vacuum conditions, and the sealant 12 is cured by UV light irradiation, thereby encapsulating the package cover 1 and the substrate. 2 bonded together to complete the packaging of the OLED device 21.
  • the position of the sealant 12 on the package cover 1 is formed into the concave-convex structure 101, and there is sufficient space between the package cover 1 and the substrate 2 to fill the sealant 12, thereby improving the package cover.
  • the bonding strength between the substrate 1 and the substrate 2 reduces the distance between the package cover plate 1 and the substrate 2, blocks the infiltration path of water vapor and oxygen, effectively blocks the infiltration of moisture and oxygen, and simultaneously fills the desiccant 11
  • the water vapor that penetrates into the inner sealing region of the OLED through the sealant 12 is reduced, which helps to improve the performance of the OLED device, prolong the service life of the OLED device, and has a simple process and a good packaging effect.
  • the OLED package structure of the present invention by providing a concave-convex structure at a position where the sealant is coated on the package cover plate, a sufficient space is provided between the package cover plate and the substrate to fill the sealant, and the package cover plate is improved.
  • the bonding strength between the substrates reduces the distance between the package cover and the substrate, blocks the infiltration path of water vapor and oxygen, effectively blocks the infiltration of water vapor and oxygen, and has a good encapsulation effect, and reduces the transmission by providing a desiccant.
  • the water vapor infiltrated into the inner sealing area of the OLED helps to improve the performance of the OLED device and prolong the service life of the OLED device.
  • the position of the sealant on the package cover plate is formed into a concave-convex structure, and a sufficient space is provided between the package cover plate and the substrate to fill the sealant, thereby improving the gap between the package cover plate and the substrate.
  • the bonding strength reduces the distance between the package cover and the substrate, blocks the infiltration path of water vapor and oxygen, effectively blocks the infiltration of water vapor and oxygen, and at the same time reduces the penetration of the through-frame glue into the OLED internal seal by filling the desiccant.
  • the water vapor in the area helps to improve the performance of the OLED device, prolong the service life of the OLED device, and has a simple process and a good packaging effect.

Abstract

一种OLED封装结构及OLED封装方法，该OLED封装结构包括封装盖板(1)、基板(2)、OLED器件(21)、位于所述OLED器件(21)外围设于所述封装盖板(1)上的干燥剂(11)、及位于所述干燥剂(11)外围粘结所述封装盖板(1)与基板(2)的框胶(12)；所述封装盖板(1)上对应所述OLED器件(21)区域的外围设有一圈凹槽(103)，所述凹槽(103)外围设有数圈凹凸结构(101)，所述干燥剂(11)设于所述凹槽(103)中，所述框胶(12)设于所述凹凸结构(101)与基板(2)之间。该OLED封装结构能够提高封装盖板与基板之间的结合强度，并减小封装盖板与基板之间的距离，有效阻挡水汽及氧气的渗入。

Description

OLED封装结构及OLED封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED封装结构及OLED封装方法。
背景技术
在显示技术领域，液晶显示器(LCD，Liquid Crystal Display)、有机发光二极管(OLED，Organic Light-Emitting Diode)显示器等平板显示技术已经逐步取代阴极射线显像管(CRT，Cathode Ray Tube)显示器。其中，OLED具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，而被广泛应用在手机屏幕、电脑显示器、全彩电视等，被业界公认为是最有发展潜力的显示装置。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。制约OLED产业发展的最大问题与OLED的最大缺陷是OLED的寿命较短，造成OLED寿命较短的原因主要是构成OLED器件的电极和发光层有机材料对于大气中的污染物、水汽、以及氧气都非常敏感，在含有水汽、氧气的环境中容易发生电化学腐蚀，对OLED器件造成损害。因此，必须对OLED进行有效封装，阻止水汽、氧气进入OLED内部。
OLED封装主要包括以下几种方式：干燥剂封装、UV胶封装(又称Dam only封装)、UV胶和填充胶封装(又称Dam&Fill封装)、玻璃胶封装(又称Frit封装)等。其中，UV胶封装技术是OLED封装最早也是最常用的技术，其具有如下特点：不使用溶剂或使用少量溶剂，减少了溶剂对环境的污染；耗能少，可低温固化，适用于对UV敏感的材料；固化速度快，效率高，可在高速生产线上使用，固化设备占地面积小等。但是，UV胶封装中所使用的密封胶是有机材料，其固化后分子间隙较大，采用传统的OLED封装方法，由于密封胶具有固化缺陷、多孔性、与基板、封装盖板的结合力弱等原因，水汽与氧气比较容易透过间隙渗透入内部密封区域，从而导致OLED器件的性能较快退化，寿命缩短。
因此，通过对OLED进行有效封装，保证OLED器件内部良好的密封性，尽可能的减少OLED器件与外部环境中氧气、水汽的接触，对于OLED器件的性能稳定及延长OLED的使用寿命至关重要。要达到更好的封装效 果仍需进一步对现有的封装结构及封装方法进行改进，以阻隔水汽与氧气渗入OLED封装结构内部的路径。
发明内容
本发明的目的在于提供一种OLED封装结构，能够提高封装盖板与基板之间的结合强度，并减小封装盖板与基板之间的距离，有效阻挡水汽及氧气的渗入，封装效果较好，有助于提高OLED器件的性能，延长OLED器件的使用寿命。
本发明的另一目的在于提供一种OLED封装方法，能够将封装盖板与基板牢固的粘结在一起，并减小封装盖板与基板之间的距离，有效阻挡水汽及氧气的渗入，有助于提高OLED器件的性能，延长OLED器件的使用寿命，且制程简单，封装效果较好。
为实现上述目的，本发明提供一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间设于所述基板上的OLED器件、位于所述OLED器件区域的外围设于所述封装盖板上的干燥剂、及位于所述干燥剂外围粘结所述封装盖板与基板的框胶；
所述封装盖板上对应所述OLED器件区域的外围设有一圈凹槽，所述凹槽外围设有数圈凹凸结构，所述干燥剂设于所述凹槽中，所述框胶设于所述凹凸结构与基板之间。
所述封装盖板与基板均为玻璃基板。
所述凹凸结构包括凸出所述封装盖板表面的凸起部、及与所述凸起部相邻且凹入所述封装盖板表面的凹陷部，所述框胶完全填充所述凹陷部并覆盖所述凸起部。
所述凸起部与凹陷部的截面均呈梯形。
所述凸起部凸出所述封装盖板表面的高度为0.1～10um；所述凹凸结构与凹槽的表面为粗糙表面。所述干燥剂为氯化钙，所述干燥剂与所述封装盖板的表面平齐。
本发明还提供一种OLED封装方法，包括如下步骤：
步骤1、提供封装盖板与基板，所述基板上设有OLED器件；
步骤2、在所述封装盖板上于对应所述OLED器件区域的外侧制作数圈凹凸结构；
步骤3、在所述封装盖板上于所述凹凸结构内侧、对应所述OLED器件区域的外侧制作一圈凹槽，并对所述凹凸结构与所述凹槽进行表面粗糙处理；
步骤4、在所述凹凸结构上涂布框胶；
步骤5、在所述凹槽内部填充干燥剂；
步骤6、将所述封装盖板与基板在真空条件下相对贴合，并使用UV光照射使所述框胶固化，从而将所述封装盖板与基板粘结在一起，完成对OLED器件的封装。
所述OLED封装方法，采用蚀刻法制作所述凹凸结构与凹槽；采用等离子表面处理法对所述凹凸结构与凹槽进行表面粗糙处理。
所述凹凸结构包括凸出所述封装盖板表面的凸起部、及与所述凸起部相邻且凹入所述封装盖板表面的凹陷部，所述框胶完全填充所述凹陷部并覆盖所述凸起部。
所述凸起部、及凹陷部的截面均呈梯形；所述凸起部凸出所述封装盖板表面的高度为0.1～10um；所述干燥剂为氯化钙，所述干燥剂与所述封装盖板的表面平齐。
本发明还提供一种OLED封装方法，包括如下步骤：
步骤1、提供封装盖板与基板，所述基板上设有OLED器件；
步骤2、在所述封装盖板上于对应所述OLED器件区域的外侧制作数圈凹凸结构；
步骤3、在所述封装盖板上于所述凹凸结构内侧、对应所述OLED器件区域的外侧制作一圈凹槽，并对所述凹凸结构与所述凹槽进行表面粗糙处理；
步骤4、在所述凹凸结构上涂布框胶；
步骤5、在所述凹槽内部填充干燥剂；
步骤6、将所述封装盖板与基板在真空条件下相对贴合，并使用UV光照射使所述框胶固化，从而将所述封装盖板与基板粘结在一起，完成对OLED器件的封装；
其中，采用蚀刻法制作所述凹凸结构与凹槽；采用等离子表面处理法对所述凹凸结构进行表面粗糙处理；
其中，所述凹凸结构包括凸出所述封装盖板表面的凸起部、及与所述凸起部相邻且凹入所述封装盖板表面的凹陷部，所述框胶完全填充所述凹陷部并覆盖所述凸起部。
本发明的有益效果：本发明提供的一种OLED封装结构，通过在封装盖板上涂布框胶的位置设置凹凸结构，保证封装盖板与基板之间有足够的空间填装框胶，提高封装盖板与基板之间的结合强度，并减小封装盖板与基板之间的距离，阻隔水汽及氧气的渗入路径，有效阻挡水汽及氧气的渗 入，封装效果较好，同时通过设置干燥剂来减少透过框胶渗透至OLED内部密封区域的水汽，有助于提高OLED器件的性能，延长OLED器件的使用寿命。本发明提供一种OLED封装方法，将封装盖板上涂布框胶的位置制作成凹凸结构，保证封装盖板与基板之间有足够的空间填装框胶，提高了封装盖板与基板之间的结合强度，并减小了封装盖板与基板之间的距离，阻隔水汽及氧气的渗入路径，有效阻挡水汽及氧气的渗入，同时通过填充干燥剂，减少了透过框胶渗透至OLED内部密封区域的水汽，有助于提高OLED器件的性能，延长OLED器件的使用寿命，且制程简单，封装效果较好。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为本发明OLED封装结构的示意图；
图2为本发明OLED封装方法的流程图；
图3为本发明OLED封装方法的步骤1的示意图；
图4为本发明OLED封装方法的步骤2的示意图；
图5为本发明OLED封装方法的步骤3的示意图；
图6为本发明OLED封装方法的步骤4的示意图；
图7为本发明OLED封装方法的步骤5的示意图；
图8为本发明OLED封装方法的步骤6的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1，本发明提供一种OLED封装结构，包括封装盖板1、与所述封装盖板1相对设置的基板2、位于所述封装盖板1与基板2之间设于所述基板2上的OLED器件21、位于所述OLED器件21区域的外围设于所述封装盖板1上的干燥剂11、及位于所述干燥剂11外围粘结所述封装盖板1与基板2的框胶12。
具体的，所述封装盖板1上对应所述OLED器件21区域的外围设有一圈凹槽103，所述凹槽103外围设有数圈凹凸结构101，所述干燥剂11设于所述凹槽103中，所述框胶12设于所述凹凸结构101与基板2之间。所 述凹凸结构101使得封装盖板1与基板2之间有足够的空间填装框胶12，能够提高封装盖板1与基板2之间的结合强度。
所述封装盖板1与基板2均为透明基板，优选的，所述封装盖板1与基板2均为玻璃基板。
进一步的，所述凹凸结构101包括凸出所述封装盖板1表面的凸起部102、及与所述凸起部102相邻且凹入所述封装盖板1表面的凹陷部104。所述框胶12完全填充所述凹陷部104并覆盖所述凸起部102，由于凸起部102相对于封装盖板1表面凸出一定高度，减小了封装盖板1与基板2之间的距离，阻隔水汽及氧气的渗入路径，有效阻挡水汽及氧气的渗入，降低了水汽、氧气的渗透速率。
所述凸起部102与凹陷部104的截面均呈梯形。优选的，所述凸起部102凸出所述封装盖板1表面的高度为0.1～10um。
更进一步的，所述凹凸结构101与凹槽103的表面最好是粗糙表面，以使框胶12粘结的更牢固。
所述干燥剂11优选为氯化钙，所述干燥剂11与所述封装盖板1的内表面平齐。
上述OLED封装结构中，所述封装盖板1上涂布框胶12的位置设置凹凸结构101，保证封装盖板1与基板2之间有足够的空间填装框胶12，提高封装盖板1与基板2之间的结合强度，并减小封装盖板1与基板2之间的距离，阻隔水汽及氧气的渗入路径，有效阻挡水汽及氧气的渗入，封装效果较好，同时通过设置干燥剂11来减少透过框胶12渗透至OLED内部密封区域的水汽，有助于提高OLED器件的性能，延长OLED器件的使用寿命。请参阅图2，本发明还提供一种OLED封装方法，包括如下步骤：
步骤1、如图3所示，提供封装盖板1与基板2，所述基板2上设有OLED器件21。
所述封装盖板1与基板2均为透明基板，优选的，所述封装盖板1与基板2均为玻璃基板。
步骤2、如图4所示，在所述封装盖板1上于对应所述OLED器件21区域的外侧制作数圈凹凸结构101。
具体的，可采用蚀刻法或其它方法制作所述凹凸结构101。
所述凹凸结构101包括凸出所述封装盖板1表面的凸起部102、及与所述凸起部102相邻且凹入所述封装盖板1表面的凹陷部104。进一步的，所述凸起部102、及凹陷部104的截面均呈梯形，优选的，所述凸起部102凸出所述封装盖板1表面的高度为0.1～10um。
步骤3、如图5所示，在所述封装盖板1上于所述凹凸结构101内侧、对应所述OLED器件21区域的外侧制作一圈凹槽103，并对所述凹凸结构101与所述凹槽103进行表面粗糙处理。
具体的，可以采用蚀刻法或其他方法制作所述凹槽103；采用等离子表面处理(plasma)法对所述凹凸结构101与凹槽103进行表面粗糙处理。
步骤4、如图6所示，在所述凹凸结构101上涂布框胶12，使所述框胶12完全填充所述凹陷部104并覆盖所述凸起部102。
步骤5、如图7所示，在所述凹槽103内部涂布干燥剂11。
所述干燥剂11为优选为氯化钙；所述干燥剂11与所述封装盖板1的表面平齐。
步骤6、如图8所示，将所述封装盖板1与基板2在真空条件下相对贴合，并使用UV光照射使所述框胶12固化，从而将所述封装盖板1与基板2粘结在一起，完成对OLED器件21的封装。
上述OLED封装方法中，将封装盖板1上涂布框胶12的位置制作成凹凸结构101，保证封装盖板1与基板2之间有足够的空间填装框胶12，提高了封装盖板1与基板2之间的结合强度，并减小了封装盖板1与基板2之间的距离，阻隔了水汽及氧气的渗入路径，有效阻挡了水汽及氧气的渗入，同时通过填充干燥剂11，减少了透过框胶12渗透至OLED内部密封区域的水汽，有助于提高OLED器件的性能，延长OLED器件的使用寿命，且制程简单，封装效果较好。
综上所述，本发明的OLED封装结构，通过在封装盖板上涂布框胶的位置设置凹凸结构，保证封装盖板与基板之间有足够的空间填装框胶，提高封装盖板与基板之间的结合强度，并减小封装盖板与基板之间的距离，阻隔水汽及氧气的渗入路径，有效阻挡水汽及氧气的渗入，封装效果较好，同时通过设置干燥剂来减少透过框胶渗透至OLED内部密封区域的水汽，有助于提高OLED器件的性能，延长OLED器件的使用寿命。本发明的OLED封装方法，将封装盖板上涂布框胶的位置制作成凹凸结构，保证封装盖板与基板之间有足够的空间填装框胶，提高了封装盖板与基板之间的结合强度，并减小了封装盖板与基板之间的距离，阻隔水汽及氧气的渗入路径，有效阻挡水汽及氧气的渗入，同时通过填充干燥剂，减少了透过框胶渗透至OLED内部密封区域的水汽，有助于提高OLED器件的性能，延长OLED器件的使用寿命，且制程简单，封装效果较好。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims (12)

  1. 一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间设于所述基板上的OLED器件、位于所述OLED器件区域的外围设于所述封装盖板上的干燥剂、及位于所述干燥剂外围粘结所述封装盖板与基板的框胶；
    所述封装盖板上对应所述OLED器件区域的外围设有一圈凹槽，所述凹槽外围设有数圈凹凸结构，所述干燥剂设于所述凹槽中，所述框胶设于所述凹凸结构与基板之间。
  2. 如权利要求1所述的OLED封装结构，其中，所述封装盖板与基板均为玻璃基板。
  3. 如权利要求1所述的OLED封装结构，其中，所述凹凸结构包括凸出所述封装盖板表面的凸起部、及与所述凸起部相邻且凹入所述封装盖板表面的凹陷部，所述框胶完全填充所述凹陷部并覆盖所述凸起部。
  4. 如权利要求3所述的OLED封装结构，其中，所述凸起部与凹陷部的截面均呈梯形。
  5. 如权利要求4所述的OLED封装结构，其中，所述凸起部凸出所述封装盖板表面的高度为0.1～10um；所述凹凸结构与凹槽的表面为粗糙表面。
  6. 如权利要求1所述的OLED封装结构，其中，所述干燥剂为氯化钙，所述干燥剂与所述封装盖板的表面平齐。
  7. 一种OLED封装方法，包括如下步骤：
    步骤1、提供封装盖板与基板，所述基板上设有OLED器件；
    步骤2、在所述封装盖板上于对应所述OLED器件区域的外侧制作数圈凹凸结构；
    步骤3、在所述封装盖板上于所述凹凸结构内侧、对应所述OLED器件区域的外侧制作一圈凹槽，并对所述凹凸结构与所述凹槽进行表面粗糙处理；
    步骤4、在所述凹凸结构上涂布框胶；
    步骤5、在所述凹槽内部填充干燥剂；
    步骤6、将所述封装盖板与基板在真空条件下相对贴合，并使用UV光照射使所述框胶固化，从而将所述封装盖板与基板粘结在一起，完成对OLED器件的封装。
  8. 如权利要求7所述的OLED封装方法，其中，采用蚀刻法制作所述 凹凸结构与凹槽；采用等离子表面处理法对所述凹凸结构进行表面粗糙处理。
  9. 如权利要求7所述的OLED封装方法，其中，所述凹凸结构包括凸出所述封装盖板表面的凸起部、及与所述凸起部相邻且凹入所述封装盖板表面的凹陷部，所述框胶完全填充所述凹陷部并覆盖所述凸起部。
  10. 如权利要求9所述的OLED封装方法，其中，所述凸起部、及凹陷部的截面均呈梯形；所述凸起部凸出所述封装盖板表面的高度为0.1～10um；所述干燥剂为氯化钙，所述干燥剂与所述封装盖板的表面平齐。
  11. 一种OLED封装方法，包括如下步骤：
    步骤1、提供封装盖板与基板，所述基板上设有OLED器件；
    步骤2、在所述封装盖板上于对应所述OLED器件区域的外侧制作数圈凹凸结构；
    步骤3、在所述封装盖板上于所述凹凸结构内侧、对应所述OLED器件区域的外侧制作一圈凹槽，并对所述凹凸结构与所述凹槽进行表面粗糙处理；
    步骤4、在所述凹凸结构上涂布框胶；
    步骤5、在所述凹槽内部填充干燥剂；
    步骤6、将所述封装盖板与基板在真空条件下相对贴合，并使用UV光照射使所述框胶固化，从而将所述封装盖板与基板粘结在一起，完成对OLED器件的封装；
    其中，采用蚀刻法制作所述凹凸结构与凹槽；采用等离子表面处理法对所述凹凸结构进行表面粗糙处理；
    其中，所述凹凸结构包括凸出所述封装盖板表面的凸起部、及与所述凸起部相邻且凹入所述封装盖板表面的凹陷部，所述框胶完全填充所述凹陷部并覆盖所述凸起部。
  12. 如权利要求11所述的OLED封装方法，其中，所述凸起部、及凹陷部的截面均呈梯形；所述凸起部凸出所述封装盖板表面的高度为0.1～10um；所述干燥剂为氯化钙，所述干燥剂与所述封装盖板的表面平齐。
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CN109742258B (zh) * 2019-01-08 2021-01-26 京东方科技集团股份有限公司 一种oled面板、显示装置和面板封装方法
CN109860426A (zh) * 2019-04-15 2019-06-07 湖畔光电科技（江苏）有限公司 一种oled封装结构及封装方法
CN112456431A (zh) * 2019-09-06 2021-03-09 深圳市中光工业技术研究院 一种微机电系统装置的封装系统及其加工方法
CN111399101A (zh) * 2020-04-02 2020-07-10 苏州市联超光电科技有限公司 一种多波段滤光片
CN112758883A (zh) * 2021-01-21 2021-05-07 杭州海康微影传感科技有限公司 Mems传感器及其制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101794866A (zh) * 2009-12-24 2010-08-04 彩虹集团公司 一种封装盖板及用该盖板封装oled器件的方法
JP2010228998A (ja) * 2009-03-27 2010-10-14 Asahi Glass Co Ltd 封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法
CN101866943A (zh) * 2010-02-26 2010-10-20 信利半导体有限公司 一种有机电致发光显示器及其封装方法
CN101866944A (zh) * 2010-02-26 2010-10-20 信利半导体有限公司 一种有机电致发光显示器
CN101867023A (zh) * 2010-02-26 2010-10-20 信利半导体有限公司 一种有机电致发光显示器的封装方法
CN103424936A (zh) * 2013-08-30 2013-12-04 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035536A (ja) * 2005-07-29 2007-02-08 Rohm Co Ltd フラットパネルディスプレイ
CN201796893U (zh) * 2010-09-28 2011-04-13 四川虹视显示技术有限公司 有源矩阵有机电致发光显示器封装结构
US8778496B2 (en) * 2010-11-30 2014-07-15 Corning Incorporated Anti-glare glass sheet having compressive stress equipoise and methods thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010228998A (ja) * 2009-03-27 2010-10-14 Asahi Glass Co Ltd 封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法
CN101794866A (zh) * 2009-12-24 2010-08-04 彩虹集团公司 一种封装盖板及用该盖板封装oled器件的方法
CN101866943A (zh) * 2010-02-26 2010-10-20 信利半导体有限公司 一种有机电致发光显示器及其封装方法
CN101866944A (zh) * 2010-02-26 2010-10-20 信利半导体有限公司 一种有机电致发光显示器
CN101867023A (zh) * 2010-02-26 2010-10-20 信利半导体有限公司 一种有机电致发光显示器的封装方法
CN103424936A (zh) * 2013-08-30 2013-12-04 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11785794B2 (en) 2017-03-22 2023-10-10 Boe Technology Group Co., Ltd. OLED package structure, display panel and method for preparing package structure
CN107237472A (zh) * 2017-07-28 2017-10-10 浙江恒誉建设有限公司 装配式外墙挂板防水结构及水平缝施工方法
US10680204B2 (en) * 2017-12-15 2020-06-09 Chengdu Boe Optoelectronics Technology Co., Ltd. Encapsulation structure, substrate and display panel
US11314111B2 (en) * 2019-04-03 2022-04-26 AU Optronics (Kunshan) Co., Ltd. Display panel

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