WO2014201759A1 - 有机电致发光器件封装盖板、有机电致发光器件及显示器 - Google Patents
有机电致发光器件封装盖板、有机电致发光器件及显示器 Download PDFInfo
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- WO2014201759A1 WO2014201759A1 PCT/CN2013/081313 CN2013081313W WO2014201759A1 WO 2014201759 A1 WO2014201759 A1 WO 2014201759A1 CN 2013081313 W CN2013081313 W CN 2013081313W WO 2014201759 A1 WO2014201759 A1 WO 2014201759A1
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- WIPO (PCT)
- Prior art keywords
- package
- organic electroluminescent
- package cover
- electroluminescent device
- cover
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims description 12
- 238000005401 electroluminescence Methods 0.000 claims description 6
- 239000008393 encapsulating agent Substances 0.000 claims description 6
- 238000009751 slip forming Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 230000035515 penetration Effects 0.000 abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24488—Differential nonuniformity at margin
Definitions
- the present invention relates to the field of organic electroluminescent display technologies, and in particular, to an organic electroluminescent device package cover, an organic electroluminescent device, and a display having the organic electroluminescent device.
- OLED Organic Light-Emitting Device
- Organic electroluminescent devices are very sensitive to water and oxygen content, and the presence of water and oxygen can cause device failure.
- the failure process is often the reaction of water and oxygen with the metal through the pinholes present in the device metal pole (usually A1), causing the metal cathode to peel off, the pinholes gradually develop into black spots, and the black dots follow the metal cathode and water. After the oxygen reaction, it peels off and gradually increases until the entire light-emitting region. Therefore, in order to block the influence of water and oxygen on the organic electroluminescent device, it is necessary to package the device.
- the most common way is to seal the light-emitting device in a sealed space by encapsulating the substrate with a package cover (the cover plate is made of glass or other materials) in an inert gas atmosphere for packaging purposes.
- the package surface of the package cover 10 of the conventional OLED is a smooth plane.
- the package adhesive 30 is coated on the smooth surface, the package is assembled with the substrate 20 to complete the device package.
- the gap between the package cover and the substrate is large, and the OLED package depends on the encapsulant 30.
- the encapsulant 30 has defects such as curing defects, porosity, weak adhesion to the substrate, and the like, and has a large water vapor barrier property. Insufficient.
- An object of the present invention is to provide a package cover plate of an organic electroluminescence device, an organic electroluminescence device having the package cover plate, and a display having the same, which can be improved
- the lateral barrier of the OLED device package effectively blocks the penetration of water and oxygen into the OLED device and prolongs the service life of the OLED device.
- a package cover plate of an organic electroluminescence device has a package surface for bonding with a substrate through a package adhesive, and a periphery of a package surface of the package cover plate is formed with a package for receiving the package The groove structure of the glue.
- the groove structure comprises at least one annular first groove continuously formed around a circumference of the package surface.
- the groove structure comprises at least one curved second groove continuously formed around the circumference of the package surface.
- the groove structure further comprises at least one third annular groove formed in a ring shape or a curved shape which is discontinuously formed around the circumference of the package surface.
- a central portion of the encapsulating surface of the encapsulating cover is formed with a receiving cavity for accommodating an anode layer, an organic light emitting layer and a cathode layer of the organic electroluminescent device, and the groove structure is formed in the receiving cavity. around.
- the package cover of the organic electroluminescent device is a glass package cover, and the groove structure is formed on the package surface of the glass package cover by etching.
- the groove structure has a depth of no more than 100 microns.
- An organic electroluminescent device comprising a substrate, an anode layer, an organic light-emitting layer, a cathode layer and a package cover; wherein the package cover is a package cover as described above.
- a display comprising an organic electroluminescent device as described above.
- the package adhesive for bonding the package cover and the substrate can be filled in the concave surface of the package cover.
- the gap between the package cover and the substrate can be greatly reduced, thereby reducing the water vapor transmission path, improving the packaging effect of the OLED device, and prolonging the service life of the OLED device.
- the package cover plate provided by the present invention uses a glass package substrate.
- the groove structure is formed by etching, which is convenient to manufacture, and the groove depth is easy to control, which is favorable for the uniformity of the gap between the cover substrate and the substrate, and the cost is low.
- Figure 1 is a schematic view showing the structure of a conventional OLED device
- FIG. 2 is a cross-sectional view showing a first embodiment of a package cover of an organic electroluminescent device according to the present invention
- Figure 3 is a cross-sectional view showing the organic electroluminescent device provided by the present invention.
- Figure 4 is a front elevational view showing a first embodiment of a package cover of an organic electroluminescent device provided by the present invention
- Figure 5 is a front elevational view showing a second embodiment of the package cover of the organic electroluminescent device provided by the present invention.
- Fig. 6 is a front elevational view showing a fourth embodiment of the package cover of the organic electroluminescent device of the present invention.
- the present invention provides a package cover 100 for an organic electroluminescent device, and the package cover 100 has a package surface 101 for bonding with a substrate through a package adhesive, and the package surface 101 is A groove structure 102 for accommodating the encapsulant is formed on the periphery.
- the central portion of the package cover 100 may further be provided with a receiving cavity 103 for accommodating the anode layer, the organic light emitting layer and the cathode layer in the OLED device.
- the groove structure 102 is formed around the receiving cavity 103.
- FIG. 3 is a cross-sectional view showing the structure of an OLED device using the package cover 100 of the present invention.
- the illuminating device body 300 composed of the anode layer, the organic luminescent layer and the cathode layer in the OLED device is placed in the accommodating cavity of the package cover 100. 103, and filled in the accommodating cavity 103 by an encapsulant to fix the illuminating
- the device body 300 is also filled with a package adhesive in the groove structure 102 disposed on the periphery of the package surface 101 of the package cover 100 to bond the package cover 100 and the substrate 200 to complete the device package.
- the gap between the package cover 100 and the substrate 200 of the OLED device is extremely small (the gap between the conventional OLED device package cover 100 and the substrate 200 is up to 0! ⁇ 30mm, the gap between the package cover 100 and the substrate 200 of the OLED device using the package cover 100 of the present invention can be reduced to less than 5 m), so that external water and oxygen can penetrate into the lateral direction of the package device.
- the area is reduced, thereby effectively reducing the water and oxygen breakthrough paths and improving the lateral barrier properties of the OLED device package.
- the accommodating cavity 103 for accommodating the anode layer, the organic luminescent layer and the cathode layer of the OLED device may not be disposed on the package cover 100, but is provided with the accommodating cavity 103.
- the substrate 200 of the OLED device can be matched.
- groove structure 102 on the package cover 100 of the organic electroluminescent device provided by the present invention may be embodied in the following manners.
- the groove structure 102 on the package cover 100 includes only one ring formed continuously around the circumference of the package surface 101 of the package cover 100.
- the first groove 102a is a front elevational view of a first embodiment of a package cover 100 provided by the present invention.
- Figure 5 is a front elevational view of a second embodiment of a package cover 100 provided by the present invention.
- the groove structure 102 on the package cover 100 includes a plurality of circumferentially formed circumferential edges of the package surface 101 of the package cover 100.
- the groove structure 102 on the package cover 100 includes at least one curved second concave formed continuously around the circumference of the package surface 101 of the package cover 100. groove.
- the curved second groove surrounds at least the package surface 101 - circumference to ensure that the peripheral gap between the package cover 100 and the substrate 200 is reduced.
- Figure 6 shows the package cover provided by the present invention! A front view of a fourth embodiment of 00. As shown in FIG.
- the groove structure 102 includes at least one first groove 102a which is formed in a ring shape or a curved shape continuously formed around the circumference of the package surface.
- Fig. 6 shows only the structure in which the first groove 102a is annular
- a third groove formed in a ring shape discontinuously surrounding the circumference of the package surface 101! 02b.
- the number of the third grooves may also be multiple, and the number of the third grooves is not limited herein.
- the third groove may also be curved around the circumference of the package surface.
- the above embodiment only provides several preferred embodiments of the package cover 100.
- the specific structure of the groove structure 102 may also be a combination of the above several embodiments. It may not be limited to the above embodiment.
- the package cover 100 of the organic electroluminescent device provided by the present invention
- the package cover 100 is a glass package cover 100 made of glass
- the groove structure 102 on the package cover 100 is It is formed by exposure and development etching.
- the depth H of the groove structure 102 does not exceed 100 m, thereby reducing the package cover due to the presence of the groove structure 102.
- the effect of the strength of the board 100 preferably, the width of the groove structure 102 can be adjusted according to the size of the package cover 100 without affecting the strength of the package cover 100.
- an embodiment of the present invention further provides an organic electroluminescent device comprising a substrate 200, an anode layer, an organic light-emitting layer and a cathode layer, and a package cover provided by the present invention. Further, the present invention A display having the above organic electroluminescent device is also provided in the embodiment.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
一种有机电致发光器件的封装盖板（100）、有机电致发光器件及显示器，该有机电致发光器件的封装盖板（100）具有用于与基板（200）通过封装胶粘结的封装面（101），在该封装盖板（100）的封装面（101）的周缘形成有用于容置所述封装胶的凹槽结构（102）。通过在封装盖板（100）的封装面（101）上设置凹槽结构（102），在采用该封装盖板（100）进行OLED器件封装时，可以将用于粘结封装盖板（100）与基板（200）的封装胶填充于封装盖板（100）的凹槽结构（102）内，从而可以大幅减少封装盖板（100）与基板（200）之间的间隙，从而减少水汽穿透路径，改善OLED器件封装效果，延长OLED器件使用寿命。
Description
本发明涉及有机电致发光显示技术领域， 尤其涉及一种有机电致发光器 封装盖板、 有机电致发光器件以及具有该有机电致发光器件的显示器。
近年来， 有机电致发光器件 (Organic Light-Emitting Device, OLED)以其 发光柔和、 接近自然光、 宽视角、 响应速度快、 轻而薄、 高亮度、 高效率和 主动发光等优异性能， 已在全色显示、背光源及照明等领域成为研究的热点。
有机电致发光器件对水、 氧含量非常敏感， 水、 氧的存在会使器件失效。 失效过程往往是水、 氧通过存在于器件金属明极 （通常为 A1) 中的针孔与金 属发生反应， 使金属阴极发生剥离， 针孔渐渐发展为黑点， 黑点随着金属阴 极与水、 氧反应后剥离而逐渐增大直至整个发光区域。 所以为了阻隔水、 氧 对有机电致发光器件的影响， 需要对器件进行封装。
最为普遍的方式就是在惰性气体气氛中采用封装盖板 （封装盖板为玻璃 材质或其他材质） 与基板迸行粘接的方式将发光器件密封于一个密闭空间， 以达到封装目的。如图 I所示，传统 OLED的封装盖板 10的封装面为光滑平 面， 在该光滑平面上涂覆封装胶 30后与基板 20对合完成器件封装。 这种方 式封装盖板与基板之间的间隙大， OLED封装依赖于封装胶 30, 然而封装胶 30具有固化缺陷、 多孔性、 与基板的结合力弱等缺陷， 在水汽阻隔性上有很 大的不足。 因此， 应尽可能降低封装盖板与基板之间的间隙， 减小水、 氧穿 透的侧向面积可有效提高封装效果。 现有技术中， 可以遥过在封装盖板的封 装面上设置采 ^玻璃胶制成的凸起的封装环来减少水汽穿透。 这种结构制作 容易， 但是缺点是玻璃胶为高单价材料， 采用这种结构的 OLED成本较高， 此外， 凸起的封装环的高度不易控制， 尤其是高度小于 10微米时， 压合 H寸玻 璃间隙均匀度会不佳。
本发明的目的是提供一种有机电致发光器件的封装盖板、 具有该封装盖 板的有机电致发光器件以及具有该有机电致发光器件的显示器， 可以提高
OLED器件封装的侧向阻隔性， 有效地阻挡水、 氧向 OLED器件内部渗透， 延长 OLED器件的使用寿命。
本发明所提供的技术方案如下：
一种有机电致发光器件的封装盖板， 所述封装盖板具有用于与基板通过 封装胶粘结的封装面， 在所述封装盖板的封装面的周缘形成有用于容置所述 封装胶的凹槽结构。
优选的， 所述凹槽结构至少包括一条连续地环绕所述封装面周缘形成的 呈环状的第一凹槽。
优选的， 所述凹槽结构至少包括一条连续地环绕所述封装面周缘形成的 呈曲线状的第二凹槽。
优选的， 所述凹槽结构还至少包括一条非连续地环绕所述封装面周缘形 成的呈环状或曲线状的第三凹槽。
优选的， 所述封装盖板的封装面中部形成有用于容置有机电致发光器件 的阳极层、 有机发光层和阴极层的容置腔， 所述凹槽结构形成于所述容置腔 的周围。
优选的， 所述有机电致发光器件的封装盖板为玻璃封装盖板， 所述凹槽 结构采用刻蚀的方式形成于所述玻璃封装盖板的封装面上。
优选的， 所述凹槽结构的深度不超过 100微米。
一种有机电致发光器件， 包括基板、 阳极层、 有机发光层、 阴极层与封 装盖板； 其中所述封装盖板为如上所述的封装盖板。
一种显示器， 其包括如上所述的有机电致发光器件。
本发明的有益效果如下：
以上方案， 通过在封装盖板的封装面上设置凹槽结构， 在采用该封装盖 板进行 OLED器件封装时， 可以将用于粘结封装盖板与基板的封装胶填充于 封装盖板的凹槽结构内， 从而可以大幅减少封装盖板与基板之间的间隙， 从 而减少水汽穿透路径，改善 OLED器件封装效果，延长 OLED器件使用寿命。
在本发明的进一步方案中，本发明所提供的封装盖板采用玻璃封装基板，
凹槽结构采用刻蚀的方式加工形成， 制作方便， 凹槽深度容易控制， 有利于 封盖基板与基材之间的间隙均匀度， 且成本较低。
图 1表示传统的 OLED器件的结构示意图；
图 2表示本发明所提供的有机电致发光器件的封装盖板的第一实施例的 剖视示意图；
图 3表示本发明所提供的有机电致发光器件的剖视示意图；
图 4表示本发明所提供的有机电致发光器件的封装盖板的第一实施例的 主视图；
图 5表示本发明所提供的有机电致发光器件的封装盖板的第二实施例的 主视图；
图 6表示本发明所提供的有机电致发光器件的封装盖板的第四实施例的 主视图。
发明
如图 2所示， 本发明提 -种有机电致发光器件的封装盖板 100, 所述封 装盖板 100具有用于与基板通过封装胶粘结的封装面 101 ,在所述封装面 101 的周缘形成有用于容置所述封装胶的凹槽结构 102。
其中， 封装盖板 100的中部还可以设置有一用于容纳 OLED器件中的阳 极层、 有机发光层和阴极层的容置腔 103， 凹槽结构 102形成于所述容置腔 103的周围。
图 3所示为采用本发明的封装盖板 100的 OLED器件的结构剖视示意图。 如图 3所示， 在采用本发明的封装盖板 100进行 OLED器件封装时， OLED 器件中由阳极层、 有机发光层和阴极层组成的发光器件本体 300置于封装盖 板 100的容置腔 103内， 并通过封装胶填充于该容置腔 103以固定所述发光
器件本体 300， 而设置于封装盖板 100的封装面 101周缘的凹槽结构 102内 也填充有封装胶， 以将封装盖板 100与基板 200粘结起来， 认而完成器件封 装。 由于封装胶填充于封装盖板 100的凹槽结构 102内， 使得封装盖板 100 与 OLED器件的基板 200之间的间隙极小 （传统的 OLED器件封装盖板 100 与基板 200间隙可达！0〜30mm，采用本发明的封装盖板 100的 OLED器件的 封装盖板 100与基板 200间隙可减小至小于 5 m)， 因此， 外界的水、 氧可 以穿透进入到封装器件内的侧向面积减小， 由此有效降低水、 氧穿透路径， 提高 OLED器件封装的侧向阻隔性。
需要说明的是， 在实际应用中， 封装盖板 100上也可以不设置用于容置 OLED器件的阳极层、有机发光层和阴极层的容置腔 103，而是与设置有容置 腔 103的 OLED器件的基板 200配合即可。
此外， 本发明所提供的有机电致发光器件的封装盖板 100上的凹槽结构 102具体实现方式可以有以下几种。
如图 4所示为本发明所提供的封装盖板 100的第一实施例的主视图。 如 图 4所示，在本发明所提供的第一实施例中，封装盖板 100上的凹槽结构 102 中仅包括一条连续地环绕所述封装盖板 100的封装面 101周缘形成的呈环状 的第一凹槽 102a。 采用上述方案， 由于第一凹槽 102a连续环绕封装盖板 100 的封装面 101周缘， 可以保证封装盖板 100的周缘与基板 200之间的间隙均 匀， 以提高 OLED器件的周缘侧向阻隔性。
如图 5所示为本发明所提供的封装盖板 100的第二实施例的主视图。 如 图 5所示，在本发明所提供的第二实施例中，封装盖板 100上的凹槽结构 102 中包括多条连续地环绕于所述封装盖板 100的封装面 101周缘形成的呈环状 的第一凹槽 102a。采用上述方案可以进一步保证水汽不会渗入 OLED器件内。
在本发明所提供的第三实施例中， 封装盖板 100上的凹槽结构 102中包 括至少一条连续地环绕于所述封装盖板 100的封装面 101周缘形成的呈曲线 状的第二凹槽。 采用上述方案， 呈曲线状的第二凹槽至少环绕封装面 101 - 周， 以保证封装盖板 100与基板 200的周缘间隙均减少。 应当理解的是， 在 实际应 ^中， 呈曲线状的第二凹槽的数量也可以为多条， 在此并不对第二凹 槽的数量进行限定。
如图 6所示为本发明所提供的封装盖板！00的第四实施例的主视图。 如 图 6所示， 在本发明所提供的第四实施例中， 所述凹槽结构 102至少包括一 条连续地环绕所述封装面的周缘形成的呈环状或曲线状的第一凹槽 102a (图 6仅示出第一凹槽 102a呈环状的结构），还可以包括非连续地环绕于所述封装 面 101周缘形成的呈环状的第三凹槽！ 02b。 需要说明的是， 在实际应用中， 第三凹槽的数量也可以为多条， 在此并不对第三凹槽的数量进行限定。此外， 还需说明的是， 第三凹槽也可以是呈曲线状环绕于封装面的周缘。
此外， 还需说明的是， 上述实施例仅是提供了封装盖板 100的几种优选 实施方式， 在实际应用中， 凹槽结构 102的具体结构也可以是上述几种实施 例的结合， 也可以并不局限于上述实施例。
此外， 在本发明所提供的有机电致发光器件的封装盖板 100中， 优选的， 该封装盖板 100为玻璃材质的玻璃封装盖板 100, 该封装盖板 100上的凹槽 结构 102是采用曝光显影蚀刻的方式加工形成的。 采用上述加工方式， 制作 简单， 成本较低， —且.凹槽结构 102的深度和宽度容易控制， 有利于玻璃封装 盖板 100与基板 200之间的间隙均匀度。
此外， 在本发明所提供的有机电致发光器件的封装盖板 100中， 优选的， 凹槽结构 102的深度 H不超过 lOO m, 由此可减少由于凹槽结构 102的存 在而对封装盖板 100的强度的影响。 并且， 在实际应用中， 凹槽结构 102的 宽度可以在不影响封装盖板 100的强度的情况下， 根据封装盖板 100的尺寸 进行调整。
此外， 如图 3所示， 本发明实施例中还提供了一种有机电致发光器件， 其包括基板 200、 阳极层、 有机发光层和阴极层以及本发明所提供的封装盖 此外， 本发明实施例中还提供了一种具有上述有机电致发光器件的显示 器。
以上是本发明的优选实施方式， 应当指出， 对于本技术领域的普通技术 人员来说， 在不脱离本发明原理的前提下， 还可以作出若干改进和润饰， 这 些改进和润饰也应视为本发明的保护范围。
Claims
1. 一种有机电致发光器件的封装盖板， 所述封装盖板具有用于与基板通 过封装胶粘结的封装面， 其特征在于， 在所述封装盖板的封装面的周缘形成 有用于容置所述封装胶的凹槽结构。
2. 根据权利要求 1所述的有机电致发光器件的封装盖板， 其特征在于， 所述凹槽结构至少包括一条连续地环绕所述封装面周缘形成的呈环状的 第一凹槽。
3. 根据权利要求 1所述的有机电致发光器件的封装盖板， 其特征在于， 所述凹槽结构至少包括一条连续地环绕所述封装面周缘形成的呈曲线状 的第二凹槽。
4. 根据权利要求 2或 3所述的有机电致发光器件的封装盖板， 其特征在 于，
所述凹槽结构还至少包括一条非连续地环绕所述封装面周缘形成的呈环 状或曲线状的第三凹槽。
5. 根据权利要求 1-4任一项所述的有机电致发光器件的封装盖板， 其特 征在于，
所述封装盖板的封装面中部形成有用于容置有机电致发光器件的阳极 层、有机发光层和阴极层的容置腔， 所述凹槽结构形成于所述容置腔的周围。
6. 根据权利要求 1 5任一项所述的有机电致发光器件的封装盖板， 其特 征在于，
所述有机电致发光器件的封装盖板为玻璃封装盖板， 所述凹槽结构采用 刻蚀的方式形成于所述玻璃封装盖板的封装面上。
7. 根据权利要求 1 6任一项所述的有机电致发光器件的封装盖板， 其特 征在于， 所述凹槽结构的深度不超过 100微米。
8. —种有机电致发光器件， 包括基板、 阳极层、 有机发光层、 阴极层与 封装盖板； 其特征在于， 所述封装盖板为如权利要求 1至 7任一项所述的封 装盖板。
9. 一种显示器， 其特征在于， 包括如权利要求 8所述的有机电致发光器
CTC180/C10ZN3/X3d 6S 薦 OZ OAV
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| CN105226202A (zh) * | 2015-11-04 | 2016-01-06 | 京东方科技集团股份有限公司 | 封装基板及其制作方法、oled显示装置及其制作方法 |
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