WO2016119307A1 - Oled封装结构及oled封装方法 - Google Patents

Oled封装结构及oled封装方法 Download PDF

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WO2016119307A1
WO2016119307A1 PCT/CN2015/075846 CN2015075846W WO2016119307A1 WO 2016119307 A1 WO2016119307 A1 WO 2016119307A1 CN 2015075846 W CN2015075846 W CN 2015075846W WO 2016119307 A1 WO2016119307 A1 WO 2016119307A1
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groove
substrate
oled
package cover
package
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PCT/CN2015/075846
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English (en)
French (fr)
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钱佳佳
刘亚伟
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深圳市华星光电技术有限公司
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Priority to US14/758,244 priority Critical patent/US9634282B2/en
Publication of WO2016119307A1 publication Critical patent/WO2016119307A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED package structure and an OLED package method.
  • OLED is an Organic Light-Emitting Diode, which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., and has received extensive attention as a new generation display mode. It has gradually replaced traditional LCD monitors and is widely used in mobile phone screens, computer monitors, and full-color TVs. OLED display technology is different from traditional liquid crystal display technology. It does not require a backlight. It uses a very thin coating of organic materials and a glass substrate. When there is current, these organic materials will emit light. However, since organic materials are easily reacted with water vapor or oxygen, as an organic material-based display device, the OLED display has a very high requirement for packaging.
  • the packaging of OLED devices is mainly in the form of UV glue and desiccant package (Dam & Desiccant).
  • 1 is a schematic cross-sectional view of a conventional OLED package structure, including a substrate 100, a package cover 200 disposed opposite the substrate 100, and disposed between the substrate 100 and the package cover 200.
  • the substrate 100 and the sealant 300 of the package cover 200 are described.
  • a groove 220 is disposed on the inner side of the package cover 200 corresponding to the periphery of the OLED device 110, and the desiccant 210 is attached to the groove 220 to absorb moisture entering the OLED through the sealant 300.
  • the performance of the OLED device is improved, and the service life of the OLED is prolonged, but there is a large gap inside the OLED package structure, so the mechanical strength is low and the breakage is easy.
  • the object of the present invention is to provide an OLED package structure with high mechanical strength, good sealing performance and long service life.
  • Another object of the present invention is to provide an OLED packaging method capable of significantly enhancing the mechanical strength of the package structure, improving the sealing property, thereby improving the performance of the OLED device, and extending the OLED. The life of the device.
  • the present invention provides an OLED package structure, including a substrate, a package cover disposed opposite the substrate, an OLED device disposed on the substrate between the substrate and the package cover, and located at Bonding the substrate and the cover plate between the substrate and the package cover;
  • a groove corresponding to the OLED device is disposed on the package cover, and the groove is internally provided with a plurality of pleat-like protrusions extending outward along a bottom of the groove, wherein a bottom of the groove is A desiccant is attached to the area between the two adjacent pleats.
  • the depth of the groove is less than or equal to 1/3 of the thickness of the package cover.
  • the height of the pleats is less than or equal to the depth of the grooves.
  • the desiccant is calcium oxide.
  • the present invention also provides an OLED package structure, including a substrate, a package cover disposed opposite the substrate, an OLED device disposed on the substrate between the substrate and the package cover, and the substrate and the substrate Bonding the frame and the cover of the package cover between the package covers;
  • a groove corresponding to the OLED device on the package cover is provided, and the groove is internally provided with a plurality of pleat-like protrusions extending outward along the bottom of the groove, wherein the bottom of the groove is a desiccant is attached to the area between the two adjacent pleats;
  • the depth of the groove is less than or equal to 1/3 of the thickness of the package cover
  • the desiccant is calcium oxide.
  • the invention also provides an OLED packaging method, comprising the following steps:
  • Step 1 providing a substrate, and a package cover
  • Step 2 forming a groove on the package cover plate, and a plurality of pleat-like protrusions extending outward along the bottom of the groove inside the groove, wherein the pleated protrusions are connected to the groove Two side walls parallel to each other and perpendicular to the two side walls;
  • Step 3 attaching a desiccant to a region between two adjacent pleats at the bottom of the groove;
  • Step 4 applying a sealant on the periphery of the groove on the package cover;
  • Step 5 fabricating an OLED device on the substrate corresponding to the inside of the sealant
  • Step 6 the substrate and the package cover are relatively attached
  • Step 7 irradiating with ultraviolet light to cure the sealant, thereby completing packaging of the package cover plate to the substrate.
  • the step 2 forms the groove and the pleat-like protrusion located inside the groove by an acid etching process.
  • the depth of the groove is less than or equal to 1/3 of the thickness of the package cover.
  • the height of the pleats is less than or equal to the depth of the grooves.
  • the desiccant of the step 3 is calcium oxide.
  • the step 5 is to fabricate the OLED device by an evaporation process.
  • the OLED package structure of the present invention has a groove on the package cover plate, and a plurality of pleat-like protrusions extending outward along the bottom of the groove are provided inside the groove, thereby significantly improving the package cover.
  • the anti-shock and anti-stress ability of the board makes the OLED package structure of the invention have high mechanical strength, and a desiccant is attached inside the groove, and the moisture passing through the sealant into the inside of the package structure can be absorbed, and the sealing property is good. It has a long service life and is simple in structure and easy to manufacture.
  • the OLED packaging method of the invention has simple process and strong operability.
  • FIG. 1 is a schematic cross-sectional view of a conventional OLED package structure
  • FIG. 2 is a schematic cross-sectional view showing an OLED package structure of the present invention.
  • FIG. 3 is a flow chart of a method for packaging an OLED according to the present invention.
  • FIG. 4 is a cross-sectional view showing the first step of the OLED packaging method of the present invention.
  • FIG. 5 is a cross-sectional view showing the step 2 of the OLED packaging method of the present invention.
  • FIG. 6 is a cross-sectional view showing the step 3 of the OLED packaging method of the present invention.
  • step 3 of the OLED packaging method of the present invention is a top plan view of step 3 of the OLED packaging method of the present invention.
  • FIG. 8 is a cross-sectional view showing the step 4 of the OLED packaging method of the present invention.
  • step 4 of the OLED packaging method of the present invention is a schematic top plan view of step 4 of the OLED packaging method of the present invention.
  • FIG. 10 is a cross-sectional view showing the step 5 of the OLED packaging method of the present invention.
  • FIG. 11 is a cross-sectional view showing the step 6 of the OLED packaging method of the present invention.
  • FIG. 12 is a cross-sectional view showing the step 7 of the OLED packaging method of the present invention.
  • the present invention provides an OLED package structure, including a substrate 1 , a package cover 2 disposed opposite to the substrate 1 , and a substrate 2 disposed between the substrate 1 and the package cover 2 .
  • the OLED device 11 on the board 1 and the sealant 3 between the substrate 1 and the package cover 2 are bonded to the substrate 1 and the package cover 2.
  • a groove 21 is disposed on the package cover 2 corresponding to the OLED device 11, and the groove 21 is internally provided with a plurality of pleats 212 extending outward along the bottom of the groove, wherein A desiccant 211 is attached to a region between the two adjacent pleats 212 at the bottom of the groove 21.
  • the pleats 212 connect the mutually parallel sidewalls of the groove 21 and are perpendicular to the sidewalls.
  • the pleated protrusion 212 includes a plurality of protrusions and a channel formed between the adjacent two protrusions.
  • the substrate 1 and the package cover 2 are glass substrates, and the substrate 1 is a TFT substrate.
  • the sealant 3 is a UV curable adhesive.
  • the depth of the groove 21 is less than or equal to 1/3 of the thickness of the package cover 2, and the height of the pleats 212 is less than or equal to the depth of the groove 21.
  • the arrangement of the pleats 212 can significantly improve the seismic and compressive resistance of the package cover, and the OLED package structure of the present invention has high mechanical strength.
  • the desiccant 211 is calcium oxide and can be used to absorb water vapor that has passed through the sealant 3 into the interior of the package structure.
  • the OLED package structure is provided with a groove on the package cover plate, and the groove has a plurality of pleat-like protrusions extending outward along the bottom of the groove, which significantly improves the seismic and pressure resistance of the package cover plate.
  • the OLED package structure of the invention has high mechanical strength, and at the same time, a desiccant is attached inside the groove, which can absorb water vapor entering the inside of the package structure through the sealant, has good sealing property, has a long service life, and has a structure. Simple and easy to make.
  • the present invention further provides an OLED packaging method, including the following steps:
  • Step 1 As shown in FIG. 4, the substrate 1 and the package cover 2 are provided.
  • the substrate 1 and the package cover 2 are glass substrates, and the substrate 1 is a TFT substrate.
  • Step 2 as shown in FIG. 5, a groove 21 is formed on the package cover 2, and a plurality of pleats 212 extending outward along the bottom of the groove 21 inside the groove 21, wherein The pleated protrusions 212 connect the mutually parallel side walls of the groove 21 and are perpendicular to the two side walls.
  • the pleated protrusion 212 includes a plurality of protrusions and a channel formed between the adjacent two protrusions.
  • the provision of the pleats 212 can significantly improve the seismic and compressive resistance of the package structure, so that it has high mechanical strength.
  • the groove 21 and the pleated protrusion 212 may be formed by an acid etching process.
  • the depth of the groove 21 is less than or equal to 1/3 of the thickness of the package cover 2,
  • the height of the pleats 212 is less than or equal to the depth of the groove 21.
  • Step 3 as shown in FIG. 6 and FIG. 7, a desiccant 211 is attached to a region between the two pleated protrusions 212 at the bottom of the groove 21.
  • the desiccant 211 is calcium oxide and can be used to absorb water vapor that has passed through the sealant 3 into the interior of the package structure.
  • Step 4 as shown in FIG. 8-9, a sealant 3 is applied to the periphery of the recess 21 on the package cover 2.
  • the sealant 3 is a UV curable adhesive.
  • Step 5 As shown in FIG. 10, an OLED device 11 is fabricated on a region of the substrate 1 corresponding to the recess 21.
  • the OLED device 11 can be fabricated by an evaporation process.
  • Step 6 As shown in FIG. 11, the substrate 1 and the package cover 2 are attached to each other.
  • Step 7 the frame glue 3 is cured by irradiation with ultraviolet light, thereby completing the encapsulation of the substrate 1 by the package cover 2.
  • the above OLED packaging method by forming a groove on the package cover plate, a plurality of pleat-like protrusions extending outward along the bottom of the groove are provided inside the groove, thereby improving the earthquake resistance and compression resistance of the package cover plate.
  • the ability to make the prepared OLED package structure has high mechanical strength, and by attaching a desiccant inside the groove, for absorbing moisture passing through the sealant into the inside of the package structure, improving the sealing property and effectively extending the OLED device
  • the service life is simple, and the operability is strong.
  • the OLED package structure of the present invention has a groove on the package cover, and a plurality of pleat-like protrusions extending outward along the bottom of the groove are provided inside the groove, which significantly improves the package cover.
  • the anti-vibration and anti-stress ability of the OLED package structure of the invention has high mechanical strength, and a desiccant is attached inside the groove, which can absorb moisture passing through the sealant into the interior of the package structure, and has good sealing performance. Long service life, simple structure and easy to manufacture.
  • the OLED packaging method of the invention has simple process and strong operability.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED封装结构及OLED封装方法，该OLED封装结构包括基板(1)、与基板(1)相对设置的封装盖板(2)、位于基板(1)与封装盖板(2)之间设于基板(1)上的OLED器件(11)、及位于基板(1)与封装盖板(2)之间粘结基板(1)与封装盖板(2)的框胶(3)；封装盖板(2)上对应OLED器件(11)的位置设有凹槽(21)，凹槽(21)内部设有沿凹槽(21)底部向外延伸的数处褶皱状突起(212)，其中，在凹槽(21)底部相邻两处褶皱状突起(212)之间的区域贴附有干燥剂(211)。

Description

OLED封装结构及OLED封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED封装结构及OLED封装方法。
背景技术
OLED即有机发光二极管(Organic Light-Emitting Diode)，具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示器，被广泛应用在手机屏幕、电脑显示器、全彩电视等。OLED显示技术与传统的液晶显示技术不同，无需背光灯，采用非常薄的有机材料涂层和玻璃基板，当有电流通过时，这些有机材料就会发光。但是由于有机材料易与水汽或氧气反应，作为基于有机材料的显示设备，OLED显示屏对封装的要求非常高。
目前OLED器件的封装主要采用UV胶和干燥剂封装(Dam&Desiccant)方式。图1为一种现有的OLED封装结构的剖面示意图，该结构包括基板100、与所述基板100相对设置的封装盖板200、位于所述基板100与封装盖板200之间设于所述基板100上的OLED器件110，位于所述基板100与封装盖板200之间设于所述封装盖板200上的干燥剂210、及位于所述基板100与封装盖板200之间粘结所述基板100与封装盖板200的框胶300。通过在封装盖板200内侧对应所述OLED器件110的外围设置凹槽220，并将所述干燥剂210贴附于所述凹槽220中，以吸收透过框胶300进入OLED内部的水汽，提升OLED器件的性能，延长OLED的使用寿命，但该OLED封装结构内部存在较大空隙，因此机械强度较低，易破碎。
因此，有必要提出一种新的OLED封装结构及OLED封装方法，以解决上述问题。
发明内容
本发明的目的在于提供一种OLED封装结构，机械强度高，密封性好，具有较长的使用寿命。
本发明的另一目的在于提供一种OLED封装方法，能够显著增强封装结构的机械强度，提高密封性，从而提升OLED器件的性能，延长OLED 器件的使用寿命。
为实现上述目的，本发明提供一种OLED封装结构，包括基板、与所述基板相对设置的封装盖板、位于所述基板与封装盖板之间设于所述基板上的OLED器件、及位于所述基板与封装盖板之间粘结所述基板与封装盖板的框胶；
所述封装盖板上对应所述OLED器件的位置设有凹槽，所述凹槽内部设有沿所述凹槽底部向外延伸的数处褶皱状突起，其中，在所述凹槽底部相邻两处褶皱状突起之间的区域贴附有干燥剂。
所述凹槽的深度小于或等于所述封装盖板的厚度的1/3。
所述褶皱状突起的高度小于或等于所述凹槽的深度。
所述干燥剂为氧化钙。
本发明还提供一种OLED封装结构，包括基板、与所述基板相对设置的封装盖板、位于所述基板与封装盖板之间设于所述基板上的OLED器件、及位于所述基板与封装盖板之间粘结所述基板与封装盖板的框胶；
所述封装盖板上对应所述OLED器件的位置设有凹槽，所述凹槽内部设有沿所述凹槽底部向外延伸的数处褶皱状突起，其中，在所述凹槽底部相邻两处褶皱状突起之间的区域贴附有干燥剂；
其中，所述凹槽的深度小于或等于所述封装盖板的厚度的1/3；
其中，所述干燥剂为氧化钙。
本发明还提供一种OLED封装方法，包括如下步骤：
步骤1、提供基板、及封装盖板；
步骤2、在所述封装盖板上形成凹槽、及位于所述凹槽内部沿所述凹槽底部向外延伸的数处褶皱状突起，其中，所述褶皱状突起连接所述凹槽的互相平行的两侧壁，并垂直于该两侧壁；
步骤3、在所述凹槽底部相邻两处褶皱状突起之间的区域贴附干燥剂；
步骤4、在所述封装盖板上于所述凹槽外围涂覆框胶；
步骤5、在所述基板上对应所述框胶内侧制作OLED器件；
步骤6、将所述基板与封装盖板相对贴合；
步骤7、利用紫外光进行照射，使所述框胶固化，从而完成所述封装盖板对基板的封装。
所述步骤2通过酸刻蚀制程形成所述凹槽、及位于所述凹槽内部的褶皱状突起。
所述凹槽的深度小于或等于所述封装盖板的厚度的1/3。
所述褶皱状突起的高度小于或等于所述凹槽的深度。
所述步骤3的干燥剂为氧化钙。
所述步骤5通过蒸镀制程制作所述OLED器件。
本发明的有益效果：本发明的OLED封装结构，在封装盖板上设有凹槽，在凹槽的内部设置沿所述凹槽底部向外延伸的数处褶皱状突起，显著提高了封装盖板的抗震、抗压能力，使得本发明的OLED封装结构具有较高的机械强度，同时在凹槽内部贴附有干燥剂，可以吸收透过框胶进入封装结构内部的水汽，密封性好，具有较长的使用寿命，且结构简单，易于制作。本发明的OLED封装方法，制程简单，可操作性强。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为一种现有OLED封装结构的剖面示意图；
图2为本发明OLED封装结构的剖面示意图；
图3为本发明OLED封装方法的流程图；
图4为本发明OLED封装方法的步骤1的剖面示意图；
图5为本发明OLED封装方法的步骤2的剖面示意图；
图6为本发明OLED封装方法的步骤3的剖面示意图；
图7为本发明OLED封装方法的步骤3的俯视示意图；
图8为本发明OLED封装方法的步骤4的剖面示意图；
图9为本发明OLED封装方法的步骤4的俯视示意图；
图10为本发明OLED封装方法的步骤5的剖面示意图；
图11为本发明OLED封装方法的步骤6的剖面示意图；
图12为本发明OLED封装方法的步骤7的剖面示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种OLED封装结构，包括基板1、与所述基板1相对设置的封装盖板2、位于所述基板1与封装盖板2之间设于所述基 板1上的OLED器件11、及位于所述基板1与封装盖板2之间粘结所述基板1与封装盖板2的框胶3。
所述封装盖板2上对应所述OLED器件11的位置设有凹槽21，所述凹槽21内部设有沿所述凹槽底部向外延伸的数处褶皱状突起212，其中，在所述凹槽21底部相邻两处褶皱状突起212之间的区域贴附有干燥剂211。
具体的，所述褶皱状突起212连接所述凹槽21的互相平行的两侧壁，并垂直于该两侧壁。
具体的，所述褶皱状突起212包括数个突起及相邻两突起之间形成的通道。优选的，所述基板1、及封装盖板2均为玻璃基板，所述基板1为TFT基板。
具体的，所述框胶3为UV固化胶。
优选的，所述凹槽21的深度小于或等于所述封装盖板2的厚度的1/3，所述褶皱状突起212的高度小于或等于所述凹槽21的深度。
所述褶皱状突起212的设置能够显著提高封装盖板的抗震、抗压能力，使本发明的OLED封装结构具有较高的机械强度。
优选的，所述干燥剂211为氧化钙，可以用于吸收透过所述框胶3进入封装结构内部的水汽。
上述OLED封装结构，在封装盖板上设有凹槽，凹槽内部设有沿所述凹槽底部向外延伸的数处褶皱状突起，显著提高了封装盖板的抗震、抗压能力，使本发明的OLED封装结构具有较高的机械强度，同时在凹槽内部贴附有干燥剂，可以吸收透过框胶进入封装结构内部的水汽，密封性好，具有较长的使用寿命，且结构简单，易于制作。
请参阅图3-12，本发明还提供一种OLED封装方法，包括如下步骤：
步骤1、如图4所示，提供基板1、及封装盖板2。
优选的，所述基板1、及封装盖板2均为玻璃基板，所述基板1为TFT基板。
步骤2、如图5所示，在所述封装盖板2上形成凹槽21及位于所述凹槽21内部沿所述凹槽21底部向外延伸的数处褶皱状突起212，其中，所述褶皱状突起212连接所述凹槽21的互相平行的两侧壁，并垂直于该两侧壁。
具体的，所述褶皱状突起212包括数个突起及相邻两突起之间形成的通道。所述褶皱状突起212的设置能够显著提高封装结构的抗震、抗压能力，使其具有较高的机械强度。
具体地，可以通过酸刻蚀制程形成所述凹槽21及褶皱状突起212。
优选的，所述凹槽21的深度小于或等于所述封装盖板2的厚度的1/3， 所述褶皱状突起212的高度小于或等于所述凹槽21的深度。
步骤3、如图6、图7所示，在所述凹槽21底部相邻两处褶皱状突起212之间的区域贴附干燥剂211。
优选的，所述干燥剂211为氧化钙，可以用于吸收透过所述框胶3进入封装结构内部的水汽。
步骤4、如图8-9所示，在所述封装盖板2上于所述凹槽21外围涂覆框胶3。
具体地，所述框胶3为UV固化胶。
步骤5、如图10所示，在所述基板1上对应所述凹槽21的区域制作OLED器件11。
具体地，可以通过蒸镀制程制作所述OLED器件11。
步骤6、如图11所示，将所述基板1与封装盖板2相对贴合。
步骤7、如图12所示，利用紫外光进行照射，使所述框胶3固化，从而完成所述封装盖板2对基板1的封装。
上述OLED封装方法，通过在封装盖板上形成凹槽的同时，在凹槽的内部设有沿所述凹槽底部向外延伸的数处褶皱状突起，提高了封装盖板的抗震、抗压能力，使制得的OLED封装结构具有较高的机械强度，并且通过在凹槽内部贴附干燥剂，用于吸收透过框胶进入封装结构内部的水汽，提高了密封性，有效延长OLED器件的使用寿命，且制程简单，可操作性强。
综上所述，本发明的OLED封装结构，在封装盖板上设有凹槽，在凹槽的内部设置沿所述凹槽底部向外延伸的数处褶皱状突起，显著提高了封装盖板的抗震、抗压能力，使得本发明的OLED封装结构具有较高的机械强度，同时在凹槽内部贴附有干燥剂，可以吸收透过框胶进入封装结构内部的水汽，密封性好，具有较长的使用寿命，且结构简单，易于制作。本发明的OLED封装方法，制程简单，可操作性强。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (12)

  1. 一种OLED封装结构，包括基板、与所述基板相对设置的封装盖板、位于所述基板与封装盖板之间设于所述基板上的OLED器件、及位于所述基板与封装盖板之间粘结所述基板与封装盖板的框胶；
    所述封装盖板上对应所述OLED器件的位置设有凹槽，所述凹槽内部设有沿所述凹槽底部向外延伸的数处褶皱状突起，其中，在所述凹槽底部相邻两处褶皱状突起之间的区域贴附有干燥剂。
  2. 如权利要求1所述的OLED封装结构，其中，所述凹槽的深度小于或等于所述封装盖板的厚度的1/3。
  3. 如权利要求2所述的OLED封装结构，其中，所述褶皱状突起的高度小于或等于所述凹槽的深度。
  4. 如权利要求1所述的OLED封装结构，其中，所述干燥剂为氧化钙。
  5. 一种OLED封装结构，包括基板、与所述基板相对设置的封装盖板、位于所述基板与封装盖板之间设于所述基板上的OLED器件、及位于所述基板与封装盖板之间粘结所述基板与封装盖板的框胶；
    所述封装盖板上对应所述OLED器件的位置设有凹槽，所述凹槽内部设有沿所述凹槽底部向外延伸的数处褶皱状突起，其中，在所述凹槽底部相邻两处褶皱状突起之间的区域贴附有干燥剂；
    其中，所述凹槽的深度小于或等于所述封装盖板的厚度的1/3；
    其中，所述干燥剂为氧化钙。
  6. 如权利要求5所述的OLED封装结构，其中，所述褶皱状突起的高度小于或等于所述凹槽的深度。
  7. 一种OLED封装方法，包括如下步骤：
    步骤1、提供基板、及封装盖板；
    步骤2、在所述封装盖板上形成凹槽及位于所述凹槽内部沿所述凹槽底部向外延伸的数处褶皱状突起，其中，所述褶皱状突起连接所述凹槽的互相平行的两侧壁，并垂直于该两侧壁；
    步骤3、在所述凹槽底部相邻两处褶皱状突起之间的区域贴附干燥剂；
    步骤4、在所述封装盖板上于所述凹槽外围涂覆框胶；
    步骤5、在所述基板上对应所述凹槽的区域制作OLED器件；
    步骤6、将所述基板与封装盖板相对贴合；
    步骤7、利用紫外光进行照射，使所述框胶固化，从而完成所述封装盖 板对基板的封装。
  8. 如权利要求7所述的OLED封装方法，其中，所述步骤2通过酸刻蚀制程形成所述凹槽、及位于所述凹槽内部的褶皱状突起。
  9. 如权利要求7所述的OLED封装方法，其中，所述凹槽的深度小于或等于所述封装盖板的厚度的1/3。
  10. 如权利要求9所述的OLED封装方法，其中，所述褶皱状突起的高度小于或等于所述凹槽的深度。
  11. 如权利要求7所述的OLED封装方法，其中，所述步骤3的干燥剂为氧化钙。
  12. 如权利要求7所述的OLED封装方法，其中，所述步骤5通过蒸镀制程制作所述OLED器件。
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