WO2016169368A1 - Oled面板及其制造方法、显示装置 - Google Patents

Oled面板及其制造方法、显示装置 Download PDF

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Publication number
WO2016169368A1
WO2016169368A1 PCT/CN2016/076519 CN2016076519W WO2016169368A1 WO 2016169368 A1 WO2016169368 A1 WO 2016169368A1 CN 2016076519 W CN2016076519 W CN 2016076519W WO 2016169368 A1 WO2016169368 A1 WO 2016169368A1
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Prior art keywords
encapsulant
encapsulation layer
substrate
thin film
water
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PCT/CN2016/076519
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English (en)
French (fr)
Inventor
王俊然
施槐庭
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京东方科技集团股份有限公司
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Priority to US15/321,477 priority Critical patent/US10483490B2/en
Publication of WO2016169368A1 publication Critical patent/WO2016169368A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to an OLED panel, a method of manufacturing the same, and a display device.
  • OLED display technology With the continuous development of display technology, Organic Light-Emitting Diode (OLED) display technology is gradually replacing the traditional liquid crystal display technology. OLED display technology has many outstanding advantages: self-illumination, low power consumption, high contrast, wide viewing angle, and can be used for flexible display. Therefore, OLED display technology has great potential for development and is considered to be a next-generation display technology that can replace liquid crystal display technology.
  • OLED display technology still has many problems to be solved, including the problem that the packaging effect of the OLED panel is not easy to detect, the detection sensitivity is low, and the position of the defect area is difficult to judge.
  • OLED devices generally employ a sandwich structure in which an organic light-emitting layer is sandwiched between electrodes on both sides to inject holes and electrons from the anode and the cathode, respectively. The holes and electrons are transported in the organic light-emitting layer to form excitons, and the excitons are combined to emit light. Among them, the organic light-emitting layer easily reacts with water vapor. The compound formed by the reaction can significantly reduce the quantum efficiency of the OLED device.
  • the package level of the OLED panel has a direct impact on the reliability and lifetime of the OELD device.
  • the detection of the packaging effect of the OLED panel and the determination of the position of the package defect have important significance for improving the yield of the OLED panel and reducing the cost.
  • the prior art has very few detection techniques for the package structure of an OLED panel. It is generally necessary to use professional equipment to detect the water vapor content, or to add a structure for detecting water vapor in the package structure, thereby increasing the process complexity.
  • the contact surface between the encapsulant and the glass often has some residue or foreign matter, so that defects of incomplete bonding may occur.
  • the thin film encapsulation layer may also cause defects during vacuum coating, or foreign matter on the surface of the thin film encapsulation layer may cause incomplete defects in the encapsulation of the thin film encapsulation layer.
  • a heat-curing encapsulant is usually required, and it is easy to be encapsulated in the process of thermal curing. Hole defects are created on it. These defects may become a path of moisture infiltration, which in turn reduces the reliability and longevity of the OLED panel. These defects are mostly nano-scale defects, and the sensitivity of current line detection equipment is difficult to detect, or complex detection methods are required.
  • An object of the present disclosure is to provide an OLED panel, a manufacturing method thereof, and a display device, which are used to solve the problem that the detection method of the packaging effect of the OLED panel is complicated and the sensitivity is low.
  • An OLED panel comprising:
  • An OLED device disposed on the base substrate
  • the package structure disposed between the base substrate and the cover plate, the package structure comprising a thin film encapsulation layer and an encapsulant;
  • the thin film encapsulation layer covers a side of the OLED device away from the substrate; the encapsulant and/or the thin film encapsulation layer is added with a water-chromic material.
  • the encapsulant comprises a first encapsulant; wherein the first encapsulant covers a side of the thin film encapsulation layer away from the substrate, and a water-chromic material is added.
  • the encapsulant further includes a second encapsulant: wherein the second encapsulant surrounds the outside of the first encapsulant, blocking the first encapsulant from contacting with water vapor.
  • the encapsulant comprises a first encapsulant, a second encapsulant and a third encapsulant;
  • the first encapsulant covers a side of the thin film encapsulation layer away from the substrate; the second encapsulant surrounds the first encapsulant and adds a water-chromic material; The encapsulant surrounds the outside of the second encapsulant to block the second encapsulant from contacting the water vapor.
  • the thin film encapsulation layer is formed on a side of the OLED device away from the substrate substrate, and is sequentially formed by overlapping the inorganic encapsulation layer and the organic encapsulation layer in a direction away from the OLED device, the inorganic encapsulation layer and
  • the total number of layers of the organic encapsulating layer includes at least three layers; wherein at least one layer of the organic encapsulating layer is added with a water-chromic material; the encapsulant covers the side of the thin film encapsulating layer away from the substrate, and blocks The thin film encapsulation layer is in contact with moisture.
  • the total number of layers of the inorganic encapsulation layer and the organic encapsulation layer is three.
  • the water-chromic material is a water-discolored metal salt.
  • the metal salt is CaO or CuSO 4 .
  • the present disclosure also provides a method of manufacturing an OLED panel, including:
  • the package structure comprising a thin film encapsulation layer and an encapsulant; wherein the thin film encapsulation layer covers a side of the OLED device away from the substrate substrate; the encapsulant and/or Or adding a water-chromic material to the film encapsulation layer;
  • the cover plate and the base substrate on which the structure formed by the above steps are formed are aligned, and the encapsulant is UV-cured to form an OLED panel.
  • the step of forming the package structure specifically includes:
  • a first encapsulant to which a water-chromic material is added is formed on a side of the thin film encapsulation layer away from the OLED device.
  • the step of forming the package structure further includes:
  • the step of forming the package structure specifically includes:
  • the step of forming the package structure specifically includes:
  • the thin film encapsulation layer Forming a thin film encapsulation layer on a side of the OLED device away from the substrate substrate, the thin film encapsulation layer comprising a stacked structure of an inorganic encapsulation layer and an organic encapsulation layer which are sequentially alternated in a direction away from the OLED device, the inorganic
  • the total number of layers of the encapsulation layer and the organic encapsulation layer includes at least three layers, wherein at least one layer of the organic encapsulation layer is added with a water-chromic material; an encapsulant is formed on the thin film encapsulation layer to block the thin film encapsulation layer and Water vapor contact.
  • the total number of layers of the inorganic encapsulation layer and the organic encapsulation layer is three.
  • the water-chromic material is a water-discolored metal salt.
  • the metal salt is CaO or CuSO 4 .
  • the present disclosure provides a display device comprising the OLED panel of any of the above.
  • the OLED panel of the present disclosure includes a substrate substrate, a cap plate, an OLED device, and a package structure.
  • the package structure includes a thin film encapsulation layer and an encapsulant, and a water-chromic material is added to the thin film encapsulation layer and/or the encapsulant.
  • the color of the water-chromic material has extremely high sensitivity to water vapor.
  • the inspector can judge the packaging effect of the OLED panel, and determine the defect area of the packaging structure of the OLED panel from the discolored area of the package structure. s position.
  • the OLED panel, the manufacturing method thereof and the display device provided by the present disclosure can solve the problem that the packaging effect of the OLED panel is not easy to detect, the detection sensitivity is low, and the position of the defect area is difficult to judge.
  • FIG. 1 is a schematic structural view of an OLED panel according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural view of an OLED panel according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural view of an OLED panel according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural view of an OLED panel according to an embodiment of the present disclosure.
  • FIG. 5 is a flowchart of a method for fabricating an OLED panel according to an embodiment of the present disclosure
  • FIG. 6 is a flow chart of a method of fabricating an OLED panel in an embodiment of the present disclosure.
  • the OLED panel provided by the present disclosure includes: an oppositely disposed substrate substrate and a cap plate, an OLED device disposed on the substrate substrate, and a package structure disposed between the substrate substrate and the cap plate.
  • the package structure includes a thin film encapsulation layer and an encapsulant covering the side of the OLED device away from the substrate, and a water-chromic material is added to the thin film encapsulation layer and/or the encapsulant.
  • water-chromic materials to absorb visible light has a very high sensitivity to water vapor, and can detect nano-scale defects on the package structure.
  • existing detection equipment can only detect micro-scale defects.
  • the addition of a water-chromic material to the encapsulant or thin film encapsulation layer does not increase the complexity of the process, ie, does not require the addition of new structures in existing OLED package structures.
  • the inspector can determine the position of the defect region of the package structure of the OLED panel from the color-changing region of the package structure.
  • an embodiment of the present disclosure provides an OLED panel 10 including: an oppositely disposed substrate substrate 11 and a cover plate 12 , and an OLED device 13 disposed on the substrate substrate 11 .
  • the first encapsulant 151 is disposed on a side of the thin film encapsulation layer 14 away from the substrate substrate, and the water is discolored in the first encapsulant 151. material.
  • the water-chromic material means that the material's ability to selectively absorb visible light is highly sensitive to water vapor.
  • the hydrochromic material may include a water-discolored metal salt, and specifically CuSO 4 or CaO may be selected. CuSO 4 encounters water vapor changing from a colorless substance to a blue substance, and CaO encounters water vapor from a white substance to a colorless substance.
  • the thin film encapsulation layer 14 may include an organic encapsulation layer, an inorganic encapsulation layer, and a composite film layer or a passivation layer formed by overlapping the two.
  • the first encapsulant 151 may specifically be an inorganic rubber material.
  • the water vapor passes through the defects of the package structure of the OLED panel, it contacts the water-chromic material in the first encapsulant 151, and the ability of the water-chromic material to selectively absorb visible light changes, thereby causing discoloration of the first encapsulant 151.
  • the ability of water-chromic materials to absorb visible light has a very high sensitivity to water vapor, which can detect nano-scale defects on the package structure, while existing detection equipment can only detect micro-scale defects.
  • adding a water-chromic material to the first encapsulant 151 does not require an additional process, that is, without adding a new structure to the package structure of the existing OLED panel.
  • the water-chromic material is distributed throughout the first encapsulant 151. When the color changes, the inspector can determine the defect area of the package structure of the OLED panel from the discolored area of the first encapsulant 151.
  • the present disclosure provides an OLED panel 10 including an oppositely disposed substrate substrate 11 and a cover plate 12, and an OLED device 13 disposed on the substrate substrate 11 covering the OLED device 13
  • the thin film encapsulation layer 14 on the side away from the substrate substrate is disposed on the first encapsulant 151 on the side of the thin film encapsulation layer 14 away from the substrate.
  • the second encapsulant 152 is formed outside the first encapsulant 151 to block the first encapsulant 151 from contacting with water vapor.
  • the water-chromic material is added to the first encapsulant 151.
  • the water-chromic material means that the material has the ability to selectively absorb visible light, and has high sensitivity to water vapor, including metal salts which are discolored by water, and specifically CuSO 4 or CaO.
  • CuSO 4 encounters water vapor changing from a colorless substance to a blue substance
  • CaO encounters water vapor from a white substance to a colorless substance.
  • the thin film encapsulation layer 14 may include an organic film layer, an inorganic film layer, and a composite film layer formed by overlapping them, or a structure having only one passivation layer.
  • the first encapsulant 151 and the second encapsulant 152 may specifically be selected from inorganic glue.
  • the water vapor breaks through the second encapsulant 152 of the package structure, it contacts the water-chromic material in the first encapsulant 151, and changes the ability of the water-chromic material to selectively absorb visible light, thereby causing the first encapsulant 151.
  • Discoloration The ability of water-chromic materials to absorb visible light has a very high sensitivity to water vapor, and can detect nano-scale defects on the package structure, while existing inspections Measuring equipment generally only detects micron-level defects.
  • adding a water-chromic material to the first encapsulant 151 does not require an additional process, that is, without adding a new structure to the package structure of the existing OLED panel.
  • the water-chromic material is distributed in the first encapsulant 151.
  • the inspector can determine the position of the defect region of the package structure of the OLED panel from the discolored area of the first encapsulant 151.
  • the second encapsulant 152 is disposed around the first encapsulant 151 to reduce the probability of moisture contacting the first encapsulant 151 and improve the yield of the product.
  • an embodiment of the present disclosure provides an OLED panel 10 including: a substrate substrate 11 and a cover plate 12 disposed oppositely, and an OLED device 13 disposed on the substrate substrate 11 to be covered away from the OLED device 13
  • the thin film encapsulation layer 14 on one side of the substrate substrate, the first encapsulant 151, the second encapsulant 152 and the third encapsulant 153 disposed between the substrate and the cover.
  • the first encapsulant 151 covers the side of the thin film encapsulation layer 14 away from the substrate.
  • the second encapsulant 152 surrounds the outside of the first encapsulant 151, and the second encapsulant 152 is added with a water-chromic material.
  • the third encapsulant 153 is wound around the second encapsulant 152 to block the second encapsulant 152 from contacting the water vapor.
  • the water-chromic material means that the material has the ability to selectively absorb visible light, and has high sensitivity to water vapor, including metal salts which are discolored by water, and specifically CuSO 4 or CaO.
  • CuSO 4 encounters water vapor changing from a colorless substance to a blue substance
  • CaO encounters water vapor from a white substance to a colorless substance.
  • the thin film encapsulation layer 14 may include an organic film layer, an inorganic film layer, and a composite film layer formed by overlapping them, or a passivation layer.
  • the first encapsulant 151, the second encapsulant 152, and the third encapsulant 153 may specifically be selected from inorganic rubber.
  • the water vapor breaks through the third encapsulant 153 of the OLED panel, it contacts the water-chromic material in the second encapsulant 152, and changes the ability of the water-chromic material to selectively absorb visible light, thereby causing the second package.
  • the glue 152 is discolored.
  • the ability of water-chromic materials to absorb visible light has a very high sensitivity to water vapor and can detect nanoscale defects present on the package structure.
  • the existing detection device can only detect micron-level defects; in addition, adding the water-chromic material to the second encapsulant 152 does not require an increase in the process, that is, it does not need to be added to the package structure of the existing OLED panel. New structure.
  • the water-chromic material is distributed in the second encapsulant 152.
  • the inspector can determine the position of the defect region of the package structure of the OLED panel from the discolored area of the second encapsulant 152.
  • the third encapsulant 153 surrounds the second package
  • the glue 152 is disposed to reduce the probability of moisture contacting the second encapsulant 152 and improve the yield of the product.
  • the first encapsulant 151 is configured to insulate the water vapor in the second encapsulant 152 from contacting the OLED device, and may pre-detect defects in the package structure that may cause defects in the OLED device during normal operation of the OLED device.
  • an embodiment of the present disclosure provides an OLED panel 10 including: a substrate substrate 11 and a cover plate 12 disposed oppositely, and an OLED device 13 disposed on the substrate substrate 11 disposed away from the OLED device 13
  • a thin film encapsulation layer 14 on one side of the base substrate is provided on the side of the thin film encapsulation layer 14 away from the substrate.
  • the thin film encapsulation layer 14 is formed by overlapping the inorganic encapsulation layer 141 and the organic encapsulation layer 142 in a direction away from the OLED device.
  • the total number of layers of the inorganic encapsulation layer 141 and the organic encapsulation layer 142 includes at least three layers. Wherein at least one layer of the organic encapsulating layer is added with a water-chromic material.
  • the encapsulant 15 is used to block the thin film encapsulation layer 14 from moisture contact.
  • the total number of layers of the inorganic encapsulation layer 141 and the organic encapsulation layer 142 may be a three-layer structure.
  • the two inorganic encapsulation layers 141 sandwich the organic encapsulation layer 142, and the organic encapsulation layer 142 is added with a water-chromic material.
  • the water-chromic material means that the material has the ability to selectively absorb visible light, and has high sensitivity to water vapor, including metal salts which are discolored by water, and specifically CuSO 4 or CaO. Among them, CuSO 4 encounters water vapor changing from a colorless substance to a blue substance, and CaO encounters water vapor from a white substance to a colorless substance.
  • the encapsulant 15 surrounds the thin film encapsulation layer 14 to block the thin film encapsulation layer from contacting with water vapor.
  • the organic encapsulation layer 142 in the thin film encapsulation layer 14 not only has the functions of blocking water, detecting moisture intrusion, but also stress releasing the inorganic encapsulation layer 141 in the overlapping structure. Also, since the organic encapsulation layer 142 has a larger thickness than the inorganic encapsulation layer 141 and is not formed by a vacuum plating process, the addition of the water-chromic material in the second encapsulation layer 142 does not require a change in the film formation process, and The negative effects of water-chromic materials on the packaging effect are minimized.
  • the ability of the water-chromic material to selectively absorb visible light has a very high sensitivity to water vapor, and can detect nano-scale defects existing on the package structure, while existing detection devices generally can only detect micro-scale defects. And the water-chromic material is distributed throughout the second encapsulation layer 142. When the color changes, the inspector can determine the position of the defect region of the package structure of the OLED panel from the discoloration region of the second encapsulation layer 142.
  • the base substrate described in the above embodiments includes a glass substrate or a plastic substrate, and the cover plate includes a glass or a hard film.
  • the OLED device generally includes an electrode and a functional layer, wherein the functional layer further includes one or more of a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, and a light-emitting layer. It should be noted that the specific structure and connection circuit of the OLED device do not appear in the drawing, and those skilled in the art may select the OLED top emission or bottom emission structure and the connection circuit according to actual conditions.
  • an embodiment of the present disclosure provides a method for fabricating an OLED panel, the method comprising the following steps:
  • Step 101 Providing a base substrate and a cover plate, and forming an OLED device on the base substrate.
  • the substrate substrate includes an array substrate of a thin film transistor, and the OLED device can be formed on the substrate by using a patterning process, evaporation, transfer, solution formation, or the like.
  • Step 102 Form a package structure on the substrate, and add a water-chromic material to the package structure.
  • a patterning process may be employed to form a thin film encapsulation layer on a side of the OLED device away from the substrate.
  • An encapsulant is formed on the base substrate.
  • the encapsulant and/or the thin film encapsulation layer is added with a waterchromic material.
  • Step 103 align the cover plate with the base substrate on which the structure formed by the above steps is formed, and cure the encapsulant using ultraviolet light to form an OLED panel.
  • the step of forming the package structure on the side of the OLED device away from the substrate substrate in the step 102 includes:
  • a first encapsulant is formed on a side of the thin film encapsulation layer away from the OLED device by a coating method, and a water-chromic material is added to the first encapsulant.
  • the step of forming the package structure on the side of the OLED device away from the substrate substrate further includes:
  • step 102 forms a package on a side of the OLED device away from the substrate substrate.
  • the steps of the structure specifically include:
  • a PECVD, evaporation or patterning process to form a thin film encapsulation layer on a side of the OLED device remote from the substrate;
  • an embodiment of the present disclosure provides a method for fabricating an OLED panel, the method comprising the following steps:
  • Step 201 providing a base substrate and a cover plate, and forming an OLED device on the base substrate.
  • the OLED device can be formed on the base substrate by a patterning process, evaporation, transfer, solution formation, or the like.
  • Step 202 Form a thin film encapsulation layer adding a water-chromic material on a side of the OLED device away from the substrate.
  • a thin film encapsulation layer is formed on the side of the OLED device away from the substrate by PECVD, evaporation or patterning.
  • the thin film encapsulation layer includes a stacked structure in which an inorganic encapsulation layer and an organic encapsulation layer are alternately formed in a direction away from the OLED device, and the total number of layers of the inorganic encapsulation layer and the organic encapsulation layer includes at least three layers. Wherein at least one of the organic encapsulating layers is added with a water-chromic material.
  • the total number of layers of the first encapsulation layer and the second encapsulation layer may be three.
  • the hydrochromic material comprises a water-discolored metal salt, optionally CuSO 4 or CaO. Among them, CuSO 4 encounters water vapor changing from a colorless substance to a blue substance, and CaO encounters water vapor from a white substance to a colorless substance.
  • Step 203 Forming an encapsulant on the base substrate.
  • the encapsulant is disposed between the base substrate and the cover plate, and bonds the base substrate and the cover plate.
  • the substrate substrate and the cover plate are aligned and bonded together by the encapsulant, and the encapsulant is ultraviolet-cured to form an OLED panel.
  • a method for fabricating an OLED panel includes providing a package structure including a thin film encapsulation layer and an encapsulant.
  • the encapsulant is UV-cured to avoid forming fine holes in the package structure to prevent moisture from penetrating the OLED device; and the substrate and the cover plate are more closely adhered to avoid forming a permeation path at the bonding interface.
  • the ability of water-chromic materials to absorb visible light has a very high sensitivity to water vapor, and can detect nano-scale defects on the package structure. However, existing detection equipment can only detect micro-scale defects.
  • the addition of a water-chromic material to the encapsulant or thin film encapsulation layer does not require the addition of a new structure to the existing OLED package structure, ie, does not increase the complexity of the process. And since the water-chromic material is distributed in the package structure, when the color changes, the inspector can judge the position of the defect region of the package structure of the OLED panel from the color-changing region of the package structure.
  • An embodiment of the present disclosure provides a display device, which includes any of the OLED panels provided in the above embodiments, and the display device may be: a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator, or the like.
  • the display device may be: a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator, or the like.
  • a product or part display device with display function may be: a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator, or the like.
  • the display device provided by the embodiment of the present disclosure uses any of the above OLED panels.
  • the OLED panel is provided with a package structure in which a water-chromic material is added.
  • the encapsulant in the package structure uses UV curing to avoid the formation of fine holes in the package structure to prevent moisture from penetrating the OLED device. And the base substrate and the cover plate are more closely adhered, and no penetration path is formed on the bonding interface.
  • the ability of the water-chromic material in the package structure to absorb visible light has a very high sensitivity to water vapor, and can detect nano-scale defects existing in the package structure, and the existing detection equipment can generally only detect micro-scale defects.
  • the addition of a water-chromic material to the encapsulant or thin film encapsulation layer does not require the addition of a new structure to the existing OLED package structure, ie, does not increase the complexity of the process. And the water-chromic material is distributed in the package structure. When the color changes, the inspector can determine the defect area of the package structure of the OLED panel from the color-changing area of the package structure.

Abstract

一种OLED面板（10）及其制造方法、显示装置。该OLED面板（10）包括：衬底基板（11），盖板（12），OLED器件（13）和封装结构。其中封装结构包括薄膜封装层（14）和封装胶（151，152，153），并添加了水致变色材料。

Description

OLED面板及其制造方法、显示装置
相关申请的交叉引用
本申请主张在2015年4月24日在中国提交的中国专利申请号No.201510201061.9的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，尤其涉及一种OLED面板及其制造方法、显示装置。
背景技术
随着显示技术的不断发展，有机发光二极管(Organic Light-Emitting Diode，以下简称OLED)显示技术正在逐步替代传统的液晶显示技术。OLED显示技术具有很多突出的优点：自发光、低能耗、高对比度、宽视角、可以用于柔性显示等。因此，OLED显示技术具有很大的发展潜力，被认为是可以替代液晶显示技术的下一代显示技术。
尽管发展迅速，OLED显示技术仍然有许多需要解决的问题，包括OLED面板的封装效果不易检测，检测灵敏度低以及缺陷区域的位置不易判断等问题。OLED器件通常采用夹层式结构，将有机发光层夹在两侧的电极之间，分别从阳极和阴极注入空穴和电子。空穴和电子在有机发光层中传输，相遇形成激子，激子复合发光。其中，有机发光层易与水汽发生反应。反应生成的化合物会明显降低OLED器件的量子效率。因此，OLED面板的封装水平对OELD器件的信赖度和寿命有直接影响。而检测OLED面板的封装效果、判断封装缺陷的位置对提高OLED面板的良率、降低成本有重要的意义。现有技术针对OLED面板的封装结构的检测技术非常少。一般需要使用专业设备对水汽含量进行检测，或者在封装结构中增加用于检测水汽的结构，增加工艺复杂度。
现有的封装结构中的封装胶与玻璃间的接触面往往存在一些残留物或异物，因此会产生不完全贴合的缺陷。而薄膜封装层也可能在真空镀膜时产生缺陷，或者，薄膜封装层表面的异物也会造成薄膜封装层包覆不完全缺陷。并且，现有技术中通常需要热固化封装胶，在热固化的过程中容易在封装胶 上产生孔洞缺陷。这些缺陷都可能成为水气渗入的路径，并进而降低OLED面板的信赖性和寿命。而这些缺陷多是纳米级的缺陷，以目前产线检测设备的灵敏度难以检测，或需要复杂的检测方法。
发明内容
本公开的目的在于提供一种OLED面板及其制造方法、显示装置，用于解决OLED面板的封装效果的检测方法复杂、灵敏度低的问题。
为了实现上述目的，本公开的实施例提供如下技术方案：
一种OLED面板，包括：
相对设置衬底基板和盖板；
设置在所述衬底基板上的OLED器件；
设置在所述衬底基板和所述盖板之间的封装结构，所述封装结构包括薄膜封装层和封装胶；
其中，所述薄膜封装层覆盖在所述OLED器件远离衬底基板的一侧；所述封装胶和/或所述薄膜封装层添加了水致变色材料。
可选的，所述封装胶包括第一封装胶；其中，所述第一封装胶覆盖在所述薄膜封装层远离衬底基板的一侧，并添加了水致变色材料。
进一步的，所述封装胶还包括第二封装胶：其中，所述第二封装胶围绕在所述第一封装胶外侧，阻隔所述第一封装胶和水汽接触。
可选的，所述封装胶包括第一封装胶、第二封装胶和第三封装胶；
其中，所述第一封装胶覆盖在所述薄膜封装层远离衬底基板的一侧；所述第二封装胶围绕在所述第一封装胶外侧，并添加水致变色材料；所述第三封装胶围绕在所述第二封装胶外侧，阻隔所述第二封装胶和水汽接触。
可选的，所述薄膜封装层形成在OLED器件远离衬底基板的一侧，且沿远离所述OLED器件的方向依序由无机封装层和有机封装层交叠构成，所述无机封装层和有机封装层的总层数至少包括三层；其中，至少一层所述有机封装层中添加了水致变色材料；所述封装胶覆盖在所述薄膜封装层远离衬底基板的一侧，阻隔所述薄膜封装层和水汽接触。
进一步的，无机封装层和有机封装层的总层数为三层。
可选的，所述水致变色材料为遇水变色的金属盐。
具体的，所述的金属盐为CaO或CuSO4。
本公开还提供一种OLED面板的制造方法，包括：
提供衬底基板和盖板；
在所述衬底基板上形成OLED器件；
在所述衬底基板上形成封装结构，所述封装结构包括薄膜封装层和封装胶；其中，所述薄膜封装层覆盖在所述OLED器件远离衬底基板的一侧；所述封装胶和/或所述薄膜封装层添加了水致变色材料；
将所述盖板和形成有上述步骤所形成的结构的衬底基板对位压合，对所述封装胶进行紫外固化，形成OLED面板。
可选的，形成所述封装结构的步骤具体包括：
在所述OLED器件远离衬底基板的一侧形成薄膜封装层；
在所述薄膜封装层远离OLED器件的一侧形成添加了水致变色材料的第一封装胶。
进一步的，形成所述封装结构的步骤还包括：
在所述第一封装胶外侧形成第二封装胶，阻隔所述第一封装胶和水汽接触。
可选的，形成所述封装结构的步骤具体包括：
在所述OLED器件远离衬底基板的一侧形成薄膜封装层；
在所述薄膜封装层远离OLED器件的一侧形成第一封装胶；
在所述第一封装胶外侧形成添加了水致变色材料的第二封装胶；
在所述第二封装胶外侧形成第三封装胶，阻隔所述第二封装胶和水汽接触。
可选的，形成所述封装结构的步骤具体包括：
在所述OLED器件远离衬底基板的一侧形成薄膜封装层，所述薄膜封装层沿远离所述OLED器件的方向包括依序交替的无机封装层和有机封装层的叠层结构，所述无机封装层和有机封装层的总层数至少包括三层，其中至少一层所述有机封装层中添加了水致变色材料；在所述薄膜封装层上形成封装胶，阻隔所述薄膜封装层和水汽接触。
可选的，所述无机封装层和有机封装层的总层数为三层。
可选的，所述水致变色材料为遇水变色的金属盐。
可选的，所述金属盐为CaO或CuSO4。
本公开提供一种显示装置，包括上述任意一项所述的OLED面板。
本公开所述OLED面板包括：衬底基板、盖板、OLED器件和封装结构。其中封装结构包括薄膜封装层和封装胶，并在薄膜封装层和/或封装胶中添加了水致变色材料。所述水致变色材料的颜色对水汽具有极高的灵敏度，当其颜色发生变化后，检测人员可以判断OLED面板的封装效果，并从封装结构的变色区域判断出OLED面板的封装结构的缺陷区域的位置。本公开提供的OLED面板及其制造方法、显示装置能够解决OLED面板的封装效果不易检测，检测灵敏度低，和缺陷区域的位置不易判断的问题。
附图说明
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1为本公开实施例中OLED面板的结构示意图；
图2为本公开实施例中OLED面板的结构示意图；
图3为本公开实施例中OLED面板的结构示意图；
图4为本公开实施例中OLED面板的结构示意图；
图5为本公开实施例中OLED面板的制造方法的方法流程图；
图6为本公开实施例中OLED面板的制造方法的方法流程图。
附图标记：
10-OLED面板，                  11-衬底基板，
12-盖板，                      13-OLED器件，
14-薄膜封装层，                15-封装胶，
141-无机封装层，               142-有机封装层，
151-第一封装胶，               152-第二封装胶，
153-第三封装胶。
具体实施方式
下面将结合说明书附图，对本公开实施例中的技术方案进行清楚、完整 地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
本公开提供的OLED面板包括：相对设置的衬底基板和盖板，设置在衬底基板上的OLED器件，和设置在所述衬底基板和所述盖板之间的封装结构。其中封装结构包括薄膜封装层和封装胶，薄膜封装层覆盖在所述OLED器件远离衬底基板的一侧，并在薄膜封装层和/或封装胶中添加了水致变色材料。
水致变色材料选择吸收可见光的能力对水汽具有极高的灵敏度，可以检测出封装结构上存在的纳米级缺陷，而现有的检测设备一般只能检测出微米级缺陷。另外，将水致变色材料添加在封装胶或薄膜封装层中不会增加工艺的复杂度，即不需要在现有的OLED封装结构中添加新结构。并且，由于水致变色材料分布在封装结构内，当其颜色发生变化后，检测人员可以从封装结构的变色区域判断出OLED面板的封装结构的缺陷区域的位置。
具体地，请参阅图1，本公开在一实施例中提供了一种OLED面板10，包括：相对设置的衬底基板11和盖板12，设置在衬底基板11上的OLED器件13，覆盖在OLED器件13远离衬底基板一侧的薄膜封装层14，设置在薄膜封装层14远离衬底基板的一侧的第一封装胶151，且所述第一封装胶151中添加了水致变色材料。
其中，所述水致变色材料指该材料选择吸收可见光的能力对水汽灵敏度很高。所述水致变色材料可以包括遇水变色的金属盐，具体可以选择CuSO4或CaO。CuSO4遇到水汽从无色物质变成蓝色物质，CaO遇到水汽从白色物 质变成无色物质。
所述薄膜封装层14可以包括有机封装层、无机封装层以及两者交叠形成的复合膜层、或钝化层。第一封装胶151具体可以选择无机胶材。
当水汽通过OLED面板的封装结构的缺陷后，会与第一封装胶151中的水致变色材料接触，并使得水致变色材料选择吸收可见光的能力发生改变，从而导致第一封装胶151变色。水致变色材料选择吸收可见光的能力对水汽具有极高的灵敏度，可以检测出封装结构上存在的纳米级别的缺陷，而现有的检测设备一般只能检测出微米级别的缺陷。另外将水致变色材料添加在所述第一封装胶151中不需要增加工艺，即不用在现有的OLED面板的封装结构中添加新结构。并且水致变色材料分布在整个第一封装胶151内，当其颜色发生变化后，检测人员可以从所述第一封装胶151的变色区域判断出OLED面板的封装结构的缺陷区域。
参阅图2，本公开在一实施例中提供了一种OLED面板10，包括：相对设置的衬底基板11和盖板12，设置在衬底基板11上的OLED器件13，覆盖在OLED器件13远离衬底基板的一侧的薄膜封装层14，设置在薄膜封装层14远离衬底基板的一侧的第一封装胶151。为了进一步增强所述第一封装胶151对水汽的隔绝能力，将第二封装胶152形成在于所述第一封装胶151外侧，阻隔第一封装胶151和水汽接触。其中，第一封装胶151中添加了水致变色材料。
其中，所述水致变色材料指该材料选择吸收可见光的能力对水汽灵敏度很高，包括遇水变色的金属盐，具体可以选择CuSO4或CaO。CuSO4遇到水汽从无色物质变成蓝色物质，CaO遇到水汽从白色物质变成无色物质。所述薄膜封装层14可以包括有机膜层、无机膜层以及两者交叠形成的复合膜层、或只有一层钝化层的结构。第一封装胶151和第二封装胶152具体可以选择无机胶材。
当水汽突破封装结构的第二封装胶152后，会与第一封装胶151中的水致变色材料接触，并使得水致变色材料选择吸收可见光的能力发生改变，从而导致第第一封装胶151变色。水致变色材料选择吸收可见光的能力对水汽具有极高的灵敏度，可以检测出封装结构上存在的纳米级缺陷，而现有的检 测设备一般只能检测出微米级别的缺陷。另外将水致变色材料添加在所述第一封装胶151中不需要增加工艺，即不用在现有的OLED面板的封装结构中添加新结构。并且水致变色材料分布在第一封装胶151内，当其颜色发生变化后，检测人员可以从所述第一封装胶151的变色区域判断出OLED面板的封装结构的缺陷区域的位置。所述第二封装胶152围绕所述第一封装胶151设置，可以降低水汽接触所述第一封装胶151的几率，提高产品的良率。
参阅图3，本公开在一实施例中提供了一种OLED面板10包括：相对设置的衬底基板11和盖板12，设置在衬底基板11上的OLED器件13，覆盖在OLED器件13远离衬底基板一侧的薄膜封装层14，设置在衬底基板与盖板之间的第一封装胶151、第二封装胶152和第三封装胶153。所述第一封装胶151覆盖在所述薄膜封装层14远离衬底基板一侧。所述第二封装胶152围绕在第一封装胶151装胶外侧，所述第二封装胶152中添加了水致变色材料。所述第三封装胶围153绕在所述第二封装胶152外侧，阻隔所述第二封装胶152和水汽接触。
其中，所述水致变色材料指该材料选择吸收可见光的能力对水汽灵敏度很高，包括遇水变色的金属盐，具体可以选择CuSO4或CaO。CuSO4遇到水汽从无色物质变成蓝色物质，CaO遇到水汽从白色物质变成无色物质。所述薄膜封装层14可以包括有机膜层、无机膜层以及两者交叠形成的复合膜层、或钝化层。第一封装胶151、第二封装胶152和第三封装胶153具体可以选择无机胶材。
当水汽突破OLED面板的所述第三封装胶围153后，会与第二封装胶152中的水致变色材料接触，并使得水致变色材料选择吸收可见光的能力发生改变，从而导致第二封装胶152变色。水致变色材料选择吸收可见光的能力对水汽具有极高的灵敏度，可以检测出封装结构上存在的纳米级别的缺陷。而现有的检测设备一般只能检测出微米级别的缺陷；另外将水致变色材料添加在所述第二封装胶152中不需要增加工艺，即不用在现有的OLED面板的封装结构中添加新结构。并且水致变色材料分布在第二封装胶152内，当其颜色发生变化后，检测人员可以从所述第二封装胶152的变色区域判断出OLED面板的封装结构的缺陷区域的位置。所述第三封装胶153围绕所述第二封装 胶152设置，可以降低水汽接触所述第二封装胶152的几率，提高产品的良率。设置所述第一封装胶151可以隔绝第二封装胶152中的水汽接触所述OLED器件，可以在所述OLED器件正常工作时，预检测到封装结构中可能引发OLED器件不良的缺陷。
参阅图4，本公开在一实施例中提供了一种OLED面板10包括：相对设置的衬底基板11和盖板12，设置在衬底基板11上的OLED器件13，设置在OLED器件13远离衬底基板的一侧薄膜封装层14，设置在所述薄膜封装层14远离衬底基板的一侧的封装胶15。其中，所述薄膜封装层14，沿远离所述OLED器件的方向依序由无机封装层141与有机封装层142交叠构成。所述无机封装层141和有机封装层142的总层数至少包括三层。其中，至少一层所述有机封装层中添加了水致变色材料。封装胶15用以阻隔所述薄膜封装层14和水汽接触。
可选的，所述无机封装层141和有机封装层142的总层数可选的为三层结构。其中，两层无机封装层141将有机封装层142夹在中间，且所述有机封装层142添加了水致变色材料。
其中，所述水致变色材料指该材料选择吸收可见光的能力对水汽灵敏度很高，包括遇水变色的金属盐，具体可以选择CuSO4或CaO。其中CuSO4遇到水汽从无色物质变成蓝色物质，CaO遇到水汽从白色物质变成无色物质。
所述封装胶15围绕在所述薄膜封装层14外，阻隔所述薄膜封装层和水汽接触。薄膜封装层14中的有机封装层142不仅有阻水、侦测水气入侵的功能，也有对交叠结构中的无机封装层141进行应力释放的功能。并且，由于有机封装层142和无机封装层141相比具有较大的厚度，并且不通过真空镀膜工艺制成，所以第二封装层142中添加水致变色材料不需要改变成膜工艺，并且将水致变色材料对封装效果的负面影响降到最低。所述水致变色材料选择吸收可见光的能力对水汽具有极高的灵敏度，可以检测出封装结构上存在的纳米级缺陷，而现有的检测设备一般只能检测出微米级缺陷。并且水致变色材料分布在整个第二封装层142内，当其颜色发生变后，检测人员可以从所述第二封装层142的变色区域判断出OLED面板的封装结构的缺陷区域的位置。
以上实施例中所述衬底基板包括玻璃基板或塑料基板，所述盖板包括玻璃或硬膜。所述OLED器件一般包括电极和功能层，其中功能层又包括空穴注入层、空穴传输层、电子注入层、电子传输层和发光层中的一层或多层。需要说明的是，在附图中没有出现OLED器件的具体结构和连接电路，本领域技术人员可以根据实际情况选择OLED顶发射或底发射结构以及连接电路。
参照图5，本公开的实施例提供一种OLED面板的制作方法，该方法包括以下步骤：
步骤101：提供衬底基板和盖板，在所述衬底基板上形成OLED器件。
具体的，所述衬底基板包括薄膜晶体管的阵列基板，可以采用构图工艺、蒸镀、转印、溶液制成等在衬底基板上形成OLED器件。
步骤102：所述衬底基板上形成封装结构，所述封装结构中添加了水致变色材料。
具体的，可以采用构图工艺，在OLED器件远离衬底基板的一侧形成薄膜封装层。
在所述衬底基板上形成封装胶。
其中所述封装胶和/或所述薄膜封装层添加了水致变色材料。
步骤103：将所述盖板和形成有上述步骤所形成的结构的衬底基板对位压合，使用紫外光固化所述封装胶，形成OLED面板。
另外，步骤102形成在所述OLED器件远离衬底基板的一侧形成封装结构的步骤具体包括：
通过PECVD、蒸镀或构图工艺，在所述OLED器件远离衬底基板的一侧形成薄膜封装层；
通过涂覆的方式，在所述薄膜封装层远离OLED器件的一侧形成第一封装胶，且所述第一封装胶中添加了水致变色材料。
进一步的，步骤102形成在所述OLED器件远离衬底基板的一侧形成封装结构的步骤还包括：
通过涂覆的方式，在所述第一封装胶外侧形成第二封装胶，阻隔所述第一封装胶和水汽接触。
可选的，步骤102形成在所述OLED器件远离衬底基板的一侧形成封装 结构的步骤具体包括：
PECVD、蒸镀或构图工艺，在所述OLED器件远离衬底基板的一侧形成薄膜封装层；
通过涂覆的方式，在所述薄膜封装层远离OLED器件的一侧形成第一封装胶；
通过涂覆的方式，在所述第一封装胶外侧形成第二封装胶，并在所述第二封装胶中添加了水致变色材料；
通过涂覆的方式，在所述第二封装胶外侧形成第三封装胶，阻隔所述第二封装胶和水汽接触。
参照图6，本公开的实施例提供一种OLED面板的制作方法，该方法包括以下步骤：
步骤201：提供衬底基板和盖板，在衬底基板上形成OLED器件。
具体的，可以采用构图工艺、蒸镀、转印、溶液制成等在衬底基板上形成OLED器件。
步骤202：在所述OLED器件远离衬底基板的一侧形成添加水致变色材料的薄膜封装层。
通过PECVD、蒸镀或构图工艺，在所述OLED器件远离衬底基板的一侧形成薄膜封装层。所述薄膜封装层包括沿远离所述OLED器件的方向依序交替形成无机封装层和有机封装层的叠层结构，所述无机封装层和有机封装层的总层数至少包括三层。其中，其中至少一层所述有机封装层中添加了水致变色材料。
本实施例中所述第一封装层和第二封装层的总层数可选为三层。所述水致变色材料包括遇水变色的金属盐，可选为CuSO4或CaO。其中CuSO4遇到水汽从无色物质变成蓝色物质，CaO遇到水汽从白色物质变成无色物质。
步骤203：在所述衬底基板上形成封装胶。
所述封装胶设置在所述衬底基板与所述盖板之间、粘接所述衬底基板和盖板。
204将衬底基板和盖板对位贴合，并通过所述封装胶粘合在一起，紫外固化所述封装胶，形成OLED面板。
本公开的实施例提供的OLED面板的制作方法，设置封装结构包括薄膜封装层和封装胶。其中封装胶使用紫外固化的方式，避免在封装结构上形成细微孔洞，以防止水汽渗透OLED器件；并使得衬底基板和盖板更加紧密贴合，避免在贴合界面上形成渗透路径。由于在封装结构中添加了水致变色材料。水致变色材料选择吸收可见光的能力对水汽具有极高的灵敏度，可以检测出封装结构上存在的纳米级缺陷，而现有的检测设备一般只能检测出微米级别的缺陷。另外将水致变色材料添加在封装胶或薄膜封装层中不需要在现有的OLED封装结构中添加新结构，即不会增加工艺的复杂度。并且由于水致变色材料分布在封装结构内，当其颜色发生变化后，检测人员可以从封装结构的变色区域判断出OLED面板的封装结构的缺陷区域的位置。
本公开的实施例提供一种显示装置，该显示装置包括上述实施例中提供的任一OLED面板，该显示装置可以为：手机、平板电脑、电视机、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件显示装置。
本公开的实施例提供的显示装置，使用上述任一OLED面板。该OLED面板通过设置添加了遇水变色材料的封装结构。其中封装架构中的封装胶使用紫外固化的方式，避免在封装结构上形成细微孔洞，以防止水汽渗透OLED器件。并使得衬底基板和盖板更加紧密贴合，不会在贴合界面上形成渗透路径。封装结构中的水致变色材料选择吸收可见光的能力对水汽具有极高的灵敏度，可以检测出封装结构上存在的纳米级缺陷，而现有的检测设备一般只能检测出微米级缺陷。另外将水致变色材料添加在封装胶或薄膜封装层中不需要在现有的OLED封装结构中添加新结构，即不会增加工艺的复杂度。并且水致变色材料分布在封装结构内，当其颜色发生变化后，检测人员可以从封装结构的变色区域判断出OLED面板的封装结构的缺陷区域。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (17)

  1. 一种OLED面板，包括：
    相对设置的衬底基板和盖板；
    设置在所述衬底基板上的OLED器件；
    设置在所述衬底基板和所述盖板之间的封装结构，所述封装结构包括薄膜封装层和封装胶；
    其中，所述薄膜封装层覆盖在所述OLED器件远离衬底基板的一侧；所述封装胶和/或所述薄膜封装层添加了水致变色材料。
  2. 根据权利要求1所述的OLED面板，其中，所述封装胶包括第一封装胶；
    其中，所述第一封装胶覆盖在所述薄膜封装层远离衬底基板的一侧，并添加了水致变色材料。
  3. 根据权利要求2所述的OLED面板，其中，所述封装胶还包括第二封装胶；
    其中，所述第二封装胶围绕在所述第一封装胶外侧，阻隔所述第一封装胶和水汽接触。
  4. 根据权利要求1所述的OLED面板，其中，所述封装胶包括第一封装胶、第二封装胶和第三封装胶；
    其中，所述第一封装胶覆盖在所述薄膜封装层远离衬底基板的一侧；所述第二封装胶围绕在所述第一封装胶外侧，并添加了水致变色材料；所述第三封装胶围绕在所述第二封装胶外侧，阻隔所述第二封装胶和水汽接触。
  5. 根据权利要求1所述的OLED面板，其中，所述薄膜封装层形成在OLED器件远离衬底基板的一侧，且沿远离所述OLED器件的方向依序由无机封装层和有机封装层交叠构成，所述无机封装层和有机封装层的总层数至少包括三层；其中，至少一层所述有机封装层中添加了水致变色材料；所述封装胶覆盖在所述薄膜封装层远离衬底基板的一侧，阻隔所述薄膜封装层和水汽接触。
  6. 根据权利要求5所述的OLED面板，其中，所述无机封装层和有机封 装层的总层数为三层。
  7. 根据权利要求1～6中任意一项所述的OLED面板，其中，所述水致变色材料为遇水变色的金属盐。
  8. 根据权利要求7所述的OLED面板，其中，所述金属盐为CaO或CuSO4。
  9. 一种OLED面板的制造方法，包括：
    提供衬底基板和盖板；
    在所述衬底基板上形成OLED器件；
    在所述衬底基板上形成封装结构，所述封装结构包括薄膜封装层和封装胶；其中，所述薄膜封装层覆盖在所述OLED器件远离衬底基板的一侧；所述封装胶和/或所述薄膜封装层添加了水致变色材料；
    将所述盖板和形成有上述步骤所形成的结构的衬底基板对位压合，对所述封装胶进行紫外固化，形成OLED面板。
  10. 根据权利要求9所述的OLED面板的制造方法，其中，形成所述封装结构的步骤具体包括：
    在所述OLED器件远离衬底基板的一侧形成薄膜封装层；
    在所述薄膜封装层远离OLED器件的一侧形成添加了水致变色材料的第一封装胶。
  11. 根据权利要求10所述的OLED面板的制造方法，其中，形成所述封装结构的步骤还包括：
    在所述第一封装胶外侧形成第二封装胶，阻隔所述第一封装胶和水汽接触。
  12. 根据权利要求9所述的OLED面板的制造方法，其中，形成所述封装结构的步骤具体包括：
    在所述OLED器件远离衬底基板的一侧形成薄膜封装层；
    在所述薄膜封装层远离OLED器件的一侧形成第一封装胶；
    在所述第一封装胶外侧形成添加了水致变色材料的第二封装胶；
    在所述第二封装胶外侧形成第三封装胶，阻隔所述第二封装胶和水汽接触。
  13. 根据权利要求9所述的OLED面板的制造方法，其中，形成所述封 装结构的步骤具体包括：
    在所述OLED器件远离衬底基板的一侧形成薄膜封装层，所述薄膜封装层沿远离所述OLED器件的方向包括依序交替的无机封装层和有机封装层的叠层结构，所述无机封装层和有机封装层的总层数至少包括三层，其中至少一层所述有机封装层中添加了水致变色材料；在所述薄膜封装层上形成封装胶，阻隔所述薄膜封装层和水汽接触。
  14. 根据权利要求13所述的OLED面板的制造方法，其中，所述无机封装层和有机封装层的总层数为三层。
  15. 根据权利要求9-14任意一项所述的OLED面板的制造方法，其中，所述水致变色材料为遇水变色的金属盐。
  16. 根据权利要求15所述的OLED面板的制造方法，其中，所述金属盐为CaO或CuSO4。
  17. 一种显示装置，包括如权利要求1～8中任意一项所述的OLED面板。
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CN110165082B (zh) * 2019-05-31 2021-07-06 昆山国显光电有限公司 显示面板及显示装置
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