WO2015093281A1 - エポキシ樹脂接着剤 - Google Patents
エポキシ樹脂接着剤 Download PDFInfo
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- WO2015093281A1 WO2015093281A1 PCT/JP2014/081848 JP2014081848W WO2015093281A1 WO 2015093281 A1 WO2015093281 A1 WO 2015093281A1 JP 2014081848 W JP2014081848 W JP 2014081848W WO 2015093281 A1 WO2015093281 A1 WO 2015093281A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Definitions
- the present invention relates to an epoxy resin adhesive used for semiconductor encapsulants and the like. More specifically, the present invention relates to an epoxy resin adhesive having low shrinkage and excellent adhesion.
- the adhesive is being converted from lead-free solder to thermosetting epoxy epoxy adhesive.
- epoxy adhesives tend to cause cracks and spots due to thermal expansion and contraction, which can cause disconnection around the elements, and shrinkage during cooling. Deformation of the coated substrate due to the problem has become a problem.
- epoxy resin used as a sealing resin is melt-mixed with a polyolefin-based resin or elastomer resin as a stress relaxation agent (shrinkage inhibitor) using a biaxial kneader or roll.
- An epoxy resin composition is disclosed (Patent Documents 1 and 2).
- Patent Document 3 a liquid sealing resin composition containing a polymer particle having a layer structure in which a low-elastic polymer is used as a core and the surface thereof is coated with a glassy polymer, and a thermosetting resin composition
- Patent Document 4 an epoxy composition containing 50% by weight or more of crosslinked fine particles in an epoxy resin
- Patent Document 5 an epoxy composition containing particles mainly composed of acrylic rubber to improve shrinkage
- An adhesive composition Patent Document 5
- the additive is used as an epoxy resin.
- a heat kneader such as a biaxial kneader or roll is required.
- the epoxy resin composition produced by the above-described method uses a caulking agent (filler) such as fused silica or wax in order to prevent the curing reaction after kneading and ensure the coatability and fluidity of the epoxy adhesive. Contains 70% by mass or more of the entire epoxy adhesive. For this reason, the adhesive performance and physical properties of the epoxy resin itself are not sufficient.
- the present inventors focused on the functionality and particle size of the particles themselves, and as a result of examining the particle size, blending amount, functional group, surface treatment of the particles, etc., the polyolefin resin particles were identified as epoxy resin adhesives.
- the present invention has found that mixing the appropriate amount of particles can improve the problems of low shrinkage and dispersibility of the epoxy resin adhesive, and that an epoxy resin adhesive having excellent adhesion and low shrinkage can be obtained. It reached.
- the present invention includes, for example, the subject matters described in the following sections.
- Item 1. (A) an epoxy resin, (B) a curing agent and (C) a polyolefin resin particle having a volume average particle diameter of 1 to 25 ⁇ m, The polyolefin resin particles are spherical, The polyolefin resin particles are contained in an amount of 1 to 50 parts by mass with respect to 100 parts by mass of the epoxy resin. Epoxy resin adhesive.
- the polyolefin resin is low density polyethylene, high density polyethylene, a copolymer of ethylene and an epoxy group-containing monomer, a copolymer of ethylene and an acid-modified group-containing monomer, and a copolymer of ethylene and an ethylenically unsaturated monomer.
- the epoxy resin adhesive according to Item 1 or 2 comprising at least one selected from the group consisting of coalesces.
- Item 4. Item 4. The epoxy resin adhesive according to any one of Items 1 to 3, wherein the polyolefin resin particles are coated with silica.
- Item 5. Item 5. The epoxy resin adhesive according to Item 4, wherein the amount of silica added is 0.1 to 1 part by mass with respect to 100 parts by mass of the polyolefin resin particles.
- Item 6. A shrinkage-inhibiting agent for curing an epoxy resin adhesive, comprising spherical polyolefin resin particles having a volume average particle diameter of 1 to 25 ⁇ m.
- grains obtained by manufacture example 3 is shown.
- grains obtained by manufacture example 7 is shown.
- the epoxy resin adhesive according to the present invention is characterized by containing (A) an epoxy resin, (B) a curing agent, and (C) a polyolefin resin particle having a volume average particle diameter of 1 to 25 ⁇ m.
- the (A) epoxy resin used in the present invention may be a curable epoxy resin containing an epoxy group, and examples thereof include a monoepoxy compound and a polyvalent epoxy compound.
- Monoepoxy compounds include butyl glycidyl ether, hexyl glycidyl ether, phenyl glycidyl ether, allyl glycidyl ether, para-butylphenyl glycidyl ether, para-xylyl glycidyl ether, glycidyl acetate, glycidyl butyrate, glycidyl hexoate, glycidyl benzoate Etc.
- polyvalent epoxy compound examples include bisphenol type epoxy resins, epoxy resins obtained by glycidylation of divalent and polyvalent phenol types, novolac type epoxy resins, aliphatic ether type epoxy resins, ether ester type epoxy resins, ester type epoxy resins, amines Type epoxy resin, alicyclic epoxy resin and the like.
- Bisphenol type epoxy resins include bisphenol A, bisphenol F, bisphenol AD, bisphenol S, tetramethylbisphenol A, tetramethylbisphenol F, tetramethylbisphenol AD, tetramethylbisphenol S, tetrabromobisphenol A, tetrachlorobisphenol A, tetra Examples thereof include fluorobisphenol A.
- epoxy resins obtained by glycidylation of divalent and polyhydric phenol types include epoxy resins obtained by glycidylation of divalent phenol types such as biphenol, dihydroxynaphthalene, and 9,9-bis (4-hydroxyphenyl) fluorene. , 1-tris (4-hydroxyphenyl) methane and other trisphenol type glycidylated epoxy resins, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane and other glycidylated epoxy resins Etc.
- novolak type epoxy resin examples include epoxy resins obtained by glycidylating novolak types such as phenol novolak type, cresol novolak type, bisphenol A novolak type, brominated phenol novolak type, brominated bisphenol A novolak type and the like.
- Examples of the aliphatic ether type epoxy resin include epoxy resins obtained by glycidylation of polyhydric alcohols such as glycerin and polyethylene glycol.
- ether ester type epoxy resin examples include an epoxy resin obtained by glycidylating a hydroxycarboxylic acid such as paraoxybenzoic acid.
- ester type epoxy resins include epoxy resins obtained by glycidylation of polycarboxylic acids such as phthalic acid and terephthalic acid.
- amine type epoxy resins include epoxy resins obtained by glycidylating amine compounds such as 4,4-diaminodiphenylmethane and m-aminophenol.
- Alicyclic epoxy resins include 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, bis (3,4-epoxycyclohexylmethyl) adipate, Examples include 1-epoxyethyl 3,4-epoxycyclohexane, limonene diepoxide, and 3,4-epoxycyclohexyl methanol.
- (A) epoxy resins may be used alone or in admixture of two or more.
- bisphenol type epoxy resins are preferable, and among them, bisphenol A, bisphenol F, and the like are preferably used.
- the epoxy resin curing agent used in the present invention may be any resin that can be cured by reacting with (A) the epoxy resin.
- examples include phenolic compounds, acid anhydrides, imidazole compounds, carboxylic acid compounds, polythiol curing agents, isocyanate compounds, and amine compounds. Of these, phenol compounds are preferred.
- phenolic compounds include phenol novolak, xylylene novolak, bis A novolak, triphenylmethane novolak, biphenyl novolak, dicyclopentadienephenol novolak, and terpene phenol novolak.
- acid anhydrides include carbohydrazide, oxalic acid dicarbozide, malonic acid dihydrazide, succinic acid dihydrazide, adipic acid dihydrazide, pimelic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, Fumaric acid dihydrazide, diglycolic acid hydrazide, tartaric acid dihydrazide, malic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 4,4-bisbenzene dihydrazide, 1,4-naphthoic acid dihydrazide, etc. It is done.
- imidazole compounds include imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, and 1-aminoethyl-2-methylimidazole. It is done.
- Examples of the carboxylic acid compound include vinyl ether block carboxylic acid.
- a hemiacetal ester is produced by a reaction between an aliphatic vinyl ether and a carboxyl group, and the carboxyl group produced by the deblocking reaction of the hemiacetal ester in the presence of a Lewis acid And a method of curing by addition reaction with an epoxy group.
- isocyanate compound examples include toluene diisocyanate polyhydric alcohol adduct, phenylmethane-4,4'-diisocyanate (c-MDI), and blocked isocyanate obtained by blocking isocyanate with caprolactam.
- polythiol-based curing agent examples include aliphatic polythiol ether, aliphatic polythioester, and aromatic ring-containing polythioether.
- amine compounds include aliphatic polyamines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, m-xylenediamine, trimethylhexamethylenediamine, 2-methylpentamethylenediamine, diethylaminopropylamine, isophoronediamine, 1,3- Arocyclic polyamines such as bisaminomethylcyclohexane, bis (4-aminocyclohexyl) methane, norbornenediamine, 1,2-diaminocyclohexane, laromine C-260, aromatics such as diaminodiphenylmethane, metaphenylenediamine, and diaminodisulfonylsulfone Polyamine, polyoxypropylenediamine, polyoxypropylenetriamine, polycyclohexylpolyamine mixture, N-aminoethylpiperazine Etc., and the like.
- 1,3- Arocyclic polyamines
- (B) curing agents can be used alone or in admixture of two or more as long as they do not inhibit curing.
- Examples of the resin used in the (C) polyolefin-based resin particles used in the present invention include low-density polyethylene, high-density polyethylene, polypropylene, and copolymerized polyolefins of olefins and other monomers.
- the low density polyethylene is preferably polyethylene having a density of 0.910 or more and less than 0.930, as defined in the former JIS K6748: 1995.
- the high-density polyethylene is preferably polyethylene having a density of 0.942 or more, as defined in the former JIS K6748: 1995.
- (meth) acrylic acid carboxyl group-containing monomer ““(meth) acrylic acid” means “acrylic acid” or “methacrylic acid”. .
- Ethylenically unsaturated monomers such as vinyl group-containing monomers, epoxy group-containing monomers, amino group-containing monomers, acid-modified group-containing monomers, and monomers containing metal salts thereof.
- ethylenically unsaturated monomer examples include acrylonitrile, vinyl acetate, acrylic acid, methacrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) ) Acrylate and the like.
- (meth) acryl means “acryl” or “methacryl”. The same applies to the following.
- epoxy group-containing monomer examples include glycidyl (meth) acrylate, glycidyl acetate, glycidyl butyrate, glycidyl hexoate, and glycidyl benzoate.
- amino group-containing monomer examples include dimethylaminoethyl (meth) acrylate, (meth) acrylamide, N, N-butoxymethyl (meth) acrylamide, and N-methylacrylamide.
- Examples of the acid-modifying group-containing monomer include maleic anhydride and maleic acid ester.
- polystyrene resins examples include partially saponified ethylene-vinyl acetate copolymers, which are saponified ethylene-vinyl acetate copolymers, and ethylene-vinyl alcohol copolymers.
- low density polyethylene high density polyethylene, copolymers of ethylene and epoxy group-containing monomers, copolymers of ethylene and acid-modified group-containing monomers, ethylene and ethylenically unsaturated monomers
- a copolymer is preferably used, and a copolymer of ethylene and an epoxy group-containing monomer, a copolymer of ethylene and an acid-modified group-containing monomer, and a copolymer of ethylene and an ethylenically unsaturated monomer are particularly preferably used.
- ethylene-glycidyl methacrylate copolymer ethylene-maleic anhydride copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic ester-maleic anhydride terpolymer, ethylene-acetic acid
- a saponified product of a vinyl copolymer is preferably used.
- polyolefin resin particles having a volume average particle diameter of 1 to 25 ⁇ m are used.
- the volume average particle diameter is preferably 5 to 20 ⁇ m, and more preferably 8 to 18 ⁇ m. If the volume average particle diameter is larger than 25 ⁇ m, unevenness is likely to occur on the surface of the composition after curing of the epoxy resin adhesive, which is not preferable in terms of appearance and also increases the shrinkage rate.
- volume average particle diameter is less than 1 ⁇ m, the viscosity of the epoxy resin adhesive increases, and the polyolefin resin particles are difficult to disperse.
- the volume average particle diameter of the polyolefin resin particles is a value determined by an electrical detection band method (pore electrical resistance method).
- an electric detection type particle size distribution measuring apparatus Coulter Multisizer, manufactured by Beckman Coulter, Inc.
- the shape of the polyolefin resin particles used in the present invention is spherical.
- the term “spherical” refers to those in which the ratio of the longest diameter to the shortest diameter (longest diameter / shortest diameter) of the polyolefin resin particles is 0.98 to 1.02.
- the method for producing the (C) polyolefin resin particles used in the present invention is not particularly limited as long as spherical particles having a volume average particle diameter of 1 to 25 ⁇ m can be obtained.
- a method in which polyolefin resin is mechanically pulverized using a high shear pulverizer, a polyolefin resin is dissolved in a good solvent, a non-solvent is added as necessary, particles are precipitated by cooling examples thereof include a method of obtaining particles by evaporation or a method of obtaining dispersed resin particles by mixing a resin with a dispersant and water.
- a method of obtaining resin particles dispersed by mixing the resin with a dispersant and water is preferable, and spherical particles can be particularly preferably obtained by this method.
- a surfactant can be used, and for example, an ethylene oxide-propylene oxide copolymer can be preferably used.
- the surface of the polyolefin resin particles used in the present invention is preferably coated with silica, and more preferably particles whose surface is hydrophobized. This is because the surface of the polyolefin resin particles is coated with silica, so that the compatibility with the epoxy resin is improved and the dispersion between the particles and the epoxy resin is improved. Because it can be expected.
- the shape of the silica to be used is a particle shape (that is, it is silica particles).
- Silica is preferably added in an amount of 0.1 to 1.0 part by mass with respect to 100 parts by mass of the polyolefin resin particles.
- the addition amount of silica is 1.0 part by mass or less, the epoxy resin adhesive is less likely to become cloudy, and spots are hardly generated on the surface of the composition during curing.
- the addition amount of silica is 0.1 parts by mass or more, dispersibility in a solvent can be further improved (that is, the polyolefin resin particles are more easily dispersed uniformly).
- the entire surface of the polyolefin resin particles may be coated with silica, or a part of the particle surface may be coated with silica.
- the method for coating the polyolefin resin particles with silica is not particularly limited, but the silica is surface-treated by adding a suitable amount of silica and mixing and stirring the polyolefin resin particles with a general mixer, that is, silica. Can be obtained.
- the epoxy resin adhesive of the present invention can be obtained by mixing an epoxy resin (A), a curing agent (B), and polyolefin resin particles (C).
- an epoxy resin (A) a curing agent (B)
- the mixing method For example, the method of adding and mixing a polyolefin-type resin particle (C) to the solution which melt
- organic solvents that dissolve epoxy resins and curing agents include aromatic hydrocarbon solvents such as benzene, toluene, xylene, and trimethylbenzene, ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, and tetrahydrofuran. And ether solvents such as isopropanol and butanol, ether alcohol solvents such as 2-methoxyethanol, and amide solvents such as N-methylpyrrolidone and N, N-dimethylformamide. These may be used alone or in combination of two or more.
- aromatic hydrocarbon solvents such as benzene, toluene, xylene, and trimethylbenzene
- ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone
- tetrahydrofuran tetrahydrofuran.
- ether solvents such as isoprop
- the blending ratio of the epoxy resin (A) and the curing agent (B) is not particularly limited and may be mixed at an arbitrary ratio, but the epoxy equivalent of the epoxy resin (A) and It is preferable to blend so that the equivalent of the reactive group of the curing agent (B) (for example, phenol group in the case of a phenolic compound) is 1: 2 to 2: 1. It is more preferable to mix
- the addition amount of the polyolefin resin particles (C) in the epoxy resin adhesive of the present invention is preferably 1 to 50 parts by weight, preferably 2 to 30 parts by weight, based on 100 parts by weight of the epoxy resin (A). Is more preferable. In another preferred embodiment of the addition amount of the polyolefin resin particles (C) in the epoxy resin adhesive of the present invention, 1 to 50 parts by mass is preferable with respect to 100 parts by mass of the epoxy resin (A), and 3 to 49 parts by mass. 25 to 48 parts by mass is more preferable, and 40 to 45 parts by mass is particularly preferable.
- the addition amount of the polyolefin resin particles is 50 parts by mass or less with respect to 100 parts by mass of the epoxy resin, “the viscosity of the epoxy resin adhesive is increased and it becomes difficult to disperse. There is less concern that the curing strength will decrease.
- the addition amount of the polyolefin resin particles is 1 part by mass or more, the effects of adhesiveness and low shrinkage can be more preferably exhibited.
- the addition amount of the polyolefin resin particles (C) in the epoxy resin adhesive of the present invention is preferably 1 to 50 parts by mass with respect to 100 parts by mass of the total amount of the epoxy resin (A) and the curing agent (B). Mass parts are preferred, and 3 to 15 parts by mass are more preferred.
- the addition amount of the polyolefin resin particles is 50 parts by mass or less with respect to 100 parts by mass of the epoxy resin, “the viscosity of the epoxy resin adhesive is increased and it becomes difficult to disperse. There is less concern that the curing strength will decrease.
- the addition amount of the polyolefin resin particles is 1 part by mass or more, the effects of adhesiveness and low shrinkage can be more preferably exhibited.
- the method for adding the polyolefin resin particles to the epoxy resin is not particularly limited, and can be uniformly dispersed by stirring with a paddle blade or stirring with a homomixer.
- additives such as a lubricant, a pigment, a coupling agent, and a leveling agent may be blended as necessary.
- a lubricant include paraffin wax, polyethylene wax, polypropylene wax, microcrystalline wax, ester wax, petrolatum, carnauba wax, fatty acid such as fatty acid, fatty acid amide, and stearic acid, and metal salts thereof.
- the pigment include titanium, talc, calcium carbonate, and silica.
- the coupling agent is not particularly limited and known ones can be used, and examples include 3-aminopropyltriethoxysilane, 3-mercaptopropyltriethoxysilane, and 3-isocyanatopropylethoxysilane.
- the method for applying the epoxy resin adhesive according to the present invention to the substrate is not particularly limited, and examples thereof include brush coating, roller coating, and spray coating. Furthermore, for the purpose of improving the coating efficiency, electrostatic spray coating, curtain coating, roll coater coating, impregnation coating and the like can also be used.
- the substrate is not particularly limited, and for example, metal, wood, paper, film product, plastic molded product, elastomer, and the like can be used.
- metals include stainless steel, aluminum, copper, and brass
- films and plastics include aromatic polyester resins, epoxy resins, polycarbonate, polystyrene, ABS, polyethylene, polypropylene, polyacetal, cellulose, polyethylene terephthalate, and polybutylene. Terephthalate, polyvinyl chloride, polyamide, polyphenylene oxide, polyurethane, unsaturated polyester, etc .; as the elastomer, natural rubber, chloroprene rubber, urethane rubber, fluoro rubber, silicone rubber, fluorosilicone rubber, etc. Examples thereof include thermoplastic elastomers such as styrene, urethane, polyester, and polyamide.
- the method for curing the epoxy resin adhesive of the present invention is not particularly limited, and it is sufficient that the crosslinking reaction of (A) the epoxy resin and (B) the curing agent proceeds, and is performed by a general method for curing an epoxy adhesive. It is also possible to melt the epoxy resin in order to promote cross-linking, allow an appropriate curing time, and allow to cool to room temperature.
- the present invention also includes a shrinkage-inhibiting agent for epoxy resin adhesive, which is made of spherical polyolefin resin particles having a volume average particle diameter of 1 to 25 ⁇ m.
- the shrinkage inhibitor is an appropriate amount for the epoxy resin adhesive (preferably 1 to 50 parts by weight, more preferably 2 to 30 parts by weight, further preferably 3 to 15 parts by weight, or epoxy resin based on 100 parts by weight of the epoxy resin). And preferably 1 to 50 parts by weight, more preferably 2 to 30 parts by weight, and still more preferably 3 to 15 parts by weight) with respect to 100 parts by weight of the total amount of the curing agent. Shrinkage can be suppressed.
- the epoxy resin adhesive to which the shrinkage inhibitor of the present invention is added is preferably an adhesive containing the above (A) epoxy resin and (B) curing agent.
- the details of the particles are also as described above.
- Adhesive cured film evaluation method ⁇ Curing method> A masking tape with a thickness of 1 mm is applied to a slide glass measuring 76 mm long x 52 mm wide, 10 mm from both ends of the glass, and an appropriate amount of adhesive is dropped on the glass, and then the adhesive is evenly spread with a scraper. It applied to 32 mm. After primary curing and drying at 150 ° C. for 3 hours, secondary curing and drying at 180 ° C. for 3 hours, and then allowed to cool to room temperature.
- Shrinkage (%) ⁇ Coating surface area (cm 2 ) ⁇ Dry film area (cm 2 ) ⁇ / Coating surface area (cm 2 ) ⁇ 100 If the shrinkage rate is 30% or less, it can be said that the shrinkage rate is low.
- ⁇ Cross-cut test> With reference to JIS K5600 (former JIS K5400) (cross-cut peeling tape method test), using a cutter, a grid-like cut (100 squares of 10 x 10) with a clearance of 3 mm has reached the glass plate. ), And then a gum tape was applied to the cut portion on the film. Subsequently, one to two minutes after the tape was applied, the tape was peeled off at a right angle with one end of the tape, and the adhesion was evaluated.
- the evaluation criteria are as follows.
- the “lattice” referred to in the evaluation criteria is a grid-like 10 ⁇ 10 100 square cut cut on the film.
- a masking tape with a thickness of 1 mm is applied to an aluminum plate with a length of 76 mm, a width of 45 mm, and a thickness of 1 mm, and 10 mm from both ends of the aluminum plate, and a suitable amount of adhesive is dropped on the aluminum plate. It was applied to the surface of 56 mm long ⁇ 25 mm wide.
- An aluminum plate to be an adherend of the same size is brought into close contact with the adherend side so that the adhesion area is 25 mm ⁇ 10 mm, cured and dried in an oven at 150 ° C. for 1 hour, and 25 ° C. at room temperature.
- the aluminum plates were bonded to each other by cooling at 0 ° C. for 1 hour, and the shear shear strength of the aluminum plates bonded at a pulling rate of 1 mm / min was measured with an autograph (SHIMADZU AGS-J).
- ⁇ Particle shape measurement method> The manufactured polyolefin resin particles were enlarged 50 to 300 times with an electron microscope (JEOL JSM-6390LA, manufactured by JEOL Ltd.), and the shape of the polyolefin resin particles was confirmed by observing the enlarged view. . As described above, the shape was determined to be spherical if the ratio of the longest diameter to the shortest diameter (longest diameter / shortest diameter) of the polyolefin resin particles was 0.98 to 1.02.
- the volume average particle size was measured with an electric detection type particle size distribution analyzer (Coulter Multisizer, manufactured by Beckman Coulter, Inc.). Specifically, 20 ml of ISOTON II (electrolytic solution manufactured by Beckman Coulter, Inc.) and 0.2 ml of an anionic surfactant such as sodium alkyl sulfate were mixed in a 100 ml beaker. Thereto was added 0.1 g of the particles obtained in each of the following production examples, and the particles were dispersed by applying ultrasonic waves for 3 minutes while stirring with a spatula. Using this dispersion, the volume average particle size was measured with an electric detection type particle size distribution analyzer (Coulter Multisizer, manufactured by Beckman Coulter, Inc.).
- the aqueous dispersion was filtered with a filter paper, washed with water, and dried in a vacuum dryer at 60 ° C. for 24 hours to obtain polyethylene particles.
- Hydrophobic-treated silica particles R972, manufactured by Nippon Aerosil Co., Ltd. (0.32 g) were added to 80 g of the obtained particles, and the mixture was stirred and mixed with a mixer and classified to obtain spherical polyethylene particles having a volume average particle diameter of 10 ⁇ m.
- the aqueous dispersion was filtered with a filter paper, washed with water, and dried in a vacuum dryer at 60 ° C. for 24 hours to obtain polyethylene particles.
- Hydrophobic-treated silica particles (R972 manufactured by Nippon Aerosil Co., Ltd., 0.32 g) were added to 80 g of the obtained particles, and the mixture was stirred and mixed with a mixer, and classified to obtain spherical polyethylene particles having a volume average particle diameter of 13 ⁇ m (see FIG. 1).
- aqueous dispersion of an ethylene-glycidyl methacrylate copolymer.
- the aqueous dispersion was filtered through a filter paper, washed with water, and dried in a vacuum dryer at 60 ° C. for 24 hours to obtain ethylene-glycidyl methacrylate copolymer particles.
- 0.32 g of hydrophobically treated silica particles RX200 manufactured by Nippon Aerosil Co., Ltd.
- was added stirred and mixed with a mixer, classified, and a spherical ethylene-glycidyl methacrylate copolymer having a volume average particle diameter of 17 ⁇ m. Particles were obtained.
- aqueous dispersion of an ethylene-maleic anhydride copolymer was obtained.
- the aqueous dispersion was filtered through a filter paper, washed with water, and dried in a vacuum dryer at 60 ° C. for 24 hours to obtain ethylene-maleic anhydride copolymer particles.
- 0.32 g of hydrophobically treated silica particles R974 manufactured by Nippon Aerosil Co., Ltd.
- was added stirred and mixed with a mixer, classified, and spherical ethylene-maleic anhydride copolymer having a volume average particle size of 9 ⁇ m. Combined particles were obtained.
- the aqueous dispersion was filtered with a filter paper, washed with water, and dried in a vacuum dryer at 60 ° C. for 24 hours to obtain polyethylene particles.
- 0.32 g of hydrophobically treated silica particles (Nipseal SS100 manufactured by Tosoh Silica Co., Ltd.) was added, mixed by stirring with a mixer, classified, and spherical ethylene-acrylic acid copolymer having a volume average particle size of 12 ⁇ m. Combined particles were obtained.
- Production Example 8 The particles obtained in Production Example 2 were classified to obtain particles having a volume average particle diameter of 30 ⁇ m.
- Example 1 ⁇ Preparation of epoxy resin> Bisphenol A type epoxy resin (Epiclon 1050; Epoxy equivalent 476 manufactured by DIC) was dissolved in a methyl ethyl ketone solvent to a concentration of 70% by mass.
- Bisphenol A type epoxy resin (Epiclon 1050; Epoxy equivalent 476 manufactured by DIC) was dissolved in a methyl ethyl ketone solvent to a concentration of 70% by mass.
- a phenolic curing agent for epoxy resin (HF-1M: phenol number 105 manufactured by Meiwa Kasei Co., Ltd.) was dissolved in methyl ethyl ketone solvent to a concentration of 70% by mass.
- the epoxy resin adhesive was prepared by adding 5 mass parts of the low density polyethylene particles obtained in Production Example 1 to the parts, stirring and mixing. Using the obtained adhesive, the film prepared under the above curing conditions was evaluated according to each evaluation method. The results are shown in Table 1.
- Example 2 An epoxy resin adhesive was prepared in the same manner as in Example 1 except that the low-density polyethylene particles obtained in Production Example 2 were used as the polyolefin resin particles. Using the obtained adhesive, the film prepared under the above curing conditions was evaluated according to each evaluation method. The results are shown in Table 1.
- Example 3 An epoxy resin adhesive was prepared in the same manner as in Example 1 except that the high-density polyethylene particles obtained in Production Example 3 were used as the polyolefin resin particles. Using the obtained adhesive, the film prepared under the above curing conditions was evaluated according to each evaluation method. The results are shown in Table 1.
- Example 4 An epoxy resin adhesive was prepared in the same manner as in Example 1 except that the ethylene-glycidyl methacrylate copolymer particles obtained in Production Example 4 were used as polyolefin resin particles. Using the obtained adhesive, the film prepared under the above curing conditions was evaluated according to each evaluation method. The results are shown in Table 1.
- Example 5 An epoxy resin adhesive was prepared in the same manner as in Example 1 except that the ethylene-maleic anhydride copolymer particles obtained in Production Example 5 were used as the polyolefin resin particles. Using the obtained adhesive, the film prepared under the above curing conditions was evaluated according to each evaluation method. The results are shown in Table 1.
- Example 6 An epoxy resin adhesive was prepared in the same manner as in Example 1 except that the ethylene-acrylic acid copolymer particles obtained in Production Example 6 were used as polyolefin resin particles. Using the obtained adhesive, the film prepared under the above curing conditions was evaluated according to each evaluation method. The results are shown in Table 1.
- Example 4 An epoxy resin adhesive was prepared in the same manner as in Example 2 except that 55 parts by weight of low density polyethylene particles were added in Example 2. Using the obtained adhesive, the film prepared under the above curing conditions was evaluated according to each evaluation method. The results are shown in Table 1.
- the epoxy resin adhesive according to the present invention can be cured by heat to obtain a cured product having low shrinkage and excellent adhesion, and the adhesion of the formed product coated with this epoxy resin adhesive, It is possible to solve problems such as wrinkles and warpage of the coated material of the agent and the substrate to be adhered.
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Abstract
Description
項1.
(A)エポキシ樹脂、(B)硬化剤および(C)体積平均粒子径が1~25μmのポリオレフィン系樹脂粒子を含有し、
前記ポリオレフィン系樹脂粒子が球状であり、
前記エポキシ樹脂100質量部に対し、前記ポリオレフィン系樹脂粒子は1~50質量部含有される、
エポキシ樹脂接着剤。
項2.
(A)エポキシ樹脂、(B)硬化剤および(C)体積平均粒子径が1~25μmのポリオレフィン系樹脂粒子を含有し、
前記ポリオレフィン系樹脂粒子が球状であり、
前記エポキシ樹脂および前記硬化剤の総量100質量部に対し、前記ポリオレフィン系樹脂粒子は1~50質量部含有される、
エポキシ樹脂接着剤。
項3.
ポリオレフィン系樹脂が、低密度ポリエチレン、高密度ポリエチレン、エチレンとエポキシ基含有モノマーとの共重合体、エチレンと酸変性基含有モノマーとの共重合体、及びエチレンとエチレン性不飽和モノマーとの共重合体からなる群より選ばれる少なくとも1種を含む、項1または2に記載のエポキシ樹脂接着剤。
項4.
前記ポリオレフィン系樹脂粒子が、シリカにより被覆されている、項1~3のいずれか1項に記載のエポキシ樹脂接着剤。
項5.
シリカの添加量が、前記ポリオレフィン系樹脂粒子100質量部に対して0.1~1質量部である、項4に記載のエポキシ樹脂接着剤。
項6.
体積平均粒子径が1~25μmの、球状ポリオレフィン系樹脂粒子を含む、エポキシ樹脂接着剤用硬化時収縮抑制剤。
接着剤硬化皮膜評価方法
<硬化方法>
縦76mm×横52mmのスライドガラスに厚さ1mmのマスキングテープをガラス両端から10mmに張り、この上に接着剤を適量垂らしたのちスクレーパーにて接着剤を均一に伸ばし、ガラス表面の縦56mm×横32mmに塗布した。150℃、3時間で一次硬化、乾燥し、180℃、3時間で二次硬化、乾燥後、室温まで放冷した。
上記硬化乾燥後の皮膜について、以下の式により、皮膜の収縮率を算出した。
収縮率(%)={塗工面面積(cm2)-乾燥皮膜面積(cm2)}/塗工面面積(cm2)×100
収縮率が30%以下であれば、低収縮率といえる。
JIS K5600(旧JIS K5400)(碁盤目剥離テープ法試験)を参考に、カッターを用いて、すきま間隔3mmの碁盤目状(10×10の100マス)の切り傷(ガラス版にまで到達している)を付けた後、皮膜上の当該切り傷部にガムテープを貼り付けた。次いで、テープを貼り付けてから1~2分後に、テープの一方の端を持って直角に引き剥がし接着性を評価した。評価基準は下記の通りである。なお、当該評価基準でいう「格子」とは、皮膜上に付けた碁盤目状の10×10の100マスの切り傷のことである。
碁盤目試験評価基準;
○格子が剥がれないか、剥がれても20%未満である。
△格子が20%以上剥がれる。
×格子が50%以上剥がれる。
縦76mm×横45mm×厚さ1mmのアルミ板に厚さ1mmのマスキングテープをアルミ板両端から10mmに張り、この上に接着剤を適量垂らしたのちスクレーパーにて接着剤を均一に伸ばし、アルミ板表面の縦56mm×横25mmに塗布した。同様な大きさの被着体となるアルミ板を接着面積25mm×10mmになるように被着体側のアルミ板をずらして密着させ、150℃のオーブンで、1時間で硬化乾燥させ、室温で25℃、1時間、放冷で冷却することでアルミ板同士を接着させ、オートグラフ(SHIMADZU AGS-J)にて、引っ張り速度1mm/minで接着されたアルミ板のずれせん断強度を測定した。
製造したポリオレフィン系樹脂粒子を、電子顕微鏡(日本電子(株)製 JEOL JSM-6390LA)で50~300倍に拡大し、当該拡大図を観察することにより、当該ポリオレフィン系樹脂粒子の形状を確認した。形状については上述したように、ポリオレフィン系樹脂粒子の最長となる径と最短となる径の比率(最長径/最短径)が0.98~1.02であれば球状と判定した。
電気検知式粒度分布測定装置(ベックマンコールター社製 コールターマルチサイザー)にて体積平均粒子径を測定した。具体的には、100mlのビーカーにISOTONII(ベックマンコールター社製 電解液)を20ml、アルキル硫酸ナトリウム等のアニオン系界面活性剤を0.2ml混合した。そこへ下記の各々の製造例で得られた粒子を0.1g添加し、スパチュラで撹拌しながら3分間超音波をあてて粒子を分散させた。この分散液を用いて電気検知式粒度分布測定装置(ベックマンコールター社製 コールターマルチサイザー)にて体積平均粒子径を測定した。
500mL容の攪拌機付き耐圧容器に、低密度ポリエチレン樹脂(LDPE)を100g、乳化剤としてエチレンオキシド-プロピレンオキシド共重合体(株式会社ADEKA製、商品名:プルロニックF108、エチレンオキシド含有割合80質量%)15g、および水135gを仕込み密閉した。引き続き、毎分500回転で攪拌しながら、180℃まで昇温した。容器内を180℃に保って30分間攪拌した。次いで、50℃まで冷却して、ポリエチレンの水分散体を得た。その水分散液をろ紙によりろ過、水洗し、60℃で24時間、減圧乾燥機にて乾燥し、体積平均粒子径10μmの球状ポリエチレン粒子を得た。
500mL容の攪拌機付き耐圧容器に、低密度ポリエチレン樹脂(LDPE)を100g、乳化剤としてエチレンオキシド-プロピレンオキシド共重合体(株式会社ADEKA製、商品名:プルロニックF108、エチレンオキシド含有割合80質量%)15g、および水135gを仕込み密閉した。引き続き、毎分500回転で攪拌しながら、180℃まで昇温した。容器内を180℃に保って30分間攪拌した。次いで、50℃まで冷却して、ポリエチレンの水分散体を得た。その水分散液をろ紙によりろ過、水洗し、60℃で24時間、減圧乾燥機にて乾燥し、ポリエチレン粒子を得た。得られた粒子80gに疎水性処理シリカ粒子(日本アエロジル社製 R972)0.32gを添加し、ミキサーにて攪拌混合し、分級して、体積平均粒子径が10μmの球状ポリエチレン粒子を得た。
500mL容の攪拌機付き耐圧容器に、高密度ポリエチレン樹脂(HDPE)を100g、乳化剤としてエチレンオキシド-プロピレンオキシド共重合体(株式会社ADEKA製、商品名:プルロニックF108、エチレンオキシド含有割合80質量%)15g、および水135gを仕込み密閉した。引き続き、毎分500回転で攪拌しながら、180℃まで昇温した。容器内を180℃に保って30分間攪拌した。次いで、50℃まで冷却して、ポリエチレンの水分散体を得た。その水分散液をろ紙によりろ過、水洗し、60℃で24時間、減圧乾燥機にて乾燥し、ポリエチレン粒子を得た。得られた粒子80gに疎水性処理シリカ粒子(日本アエロジル社製 R972)0.32gを添加し、ミキサーにて攪拌混合し、分級して、体積平均粒子径13μmの球状ポリエチレン粒子を得た(図1参照)。
500mL容の攪拌機付き耐圧容器に、エチレン-グリシジルメタクリレート共重合体樹脂(GMA含有量20質量%)を100g、乳化剤としてエチレンオキシド-プロピレンオキシド共重合体(株式会社ADEKA製、商品名:プルロニックF108、エチレンオキシド含有割合80質量%)15g、および水135gを仕込み密閉した。引き続き、毎分500回転で攪拌しながら、150℃まで昇温した。容器内を150℃に保って30分間攪拌した。次いで、50℃まで冷却して、エチレン-グリシジルメタクリレート共重合体の水分散体を得た。その水分散液をろ紙によりろ過、水洗し、60℃で24時間、減圧乾燥機にて乾燥し、エチレン-グリシジルメタクリレート共重合体粒子を得た。得られた粒子80gに疎水性処理シリカ粒子(日本アエロジル社製 RX200)0.32gを添加し、ミキサーにて攪拌混合し、分級して、体積平均粒子径17μmの球状エチレン-グリシジルメタクリレート共重合体粒子を得た。
500mL容の攪拌機付き耐圧容器に、変性ポリオレフィン樹脂(エチレン-無水マレイン酸共重合体 無水マレイン酸含有量3質量%)を100g、乳化剤としてエチレンオキシド-プロピレンオキシド共重合体(株式会社ADEKA製、商品名:プルロニックF108、エチレンオキシド含有割合80質量%)15g、および水135gを仕込み密閉した。引き続き、毎分500回転で攪拌しながら、180℃まで昇温した。容器内を180℃に保って30分間攪拌した。次いで、50℃まで冷却して、エチレン-無水マレイン酸共重合体の水分散体を得た。その水分散液をろ紙によりろ過、水洗し、60℃で24時間、減圧乾燥機にて乾燥し、エチレン-無水マレイン酸共重合体粒子を得た。得られた粒子80gに疎水性処理シリカ粒子(日本アエロジル社製 R974)0.32gを添加し、ミキサーにて攪拌混合し、分級して、体積平均粒子径9μmの球状エチレン-無水マレイン酸共重合体粒子を得た。
500mL容の攪拌機付き耐圧容器に、エチレン-アクリル酸共重合体樹脂(アクリル酸含有量7質量%)を100g、乳化剤としてエチレンオキシド-プロピレンオキシド共重合体(株式会社ADEKA製、商品名:プルロニックF108、エチレンオキシド含有割合80質量%)15g、および水135gを仕込み密閉した。引き続き、毎分500回転で攪拌しながら、180℃まで昇温した。容器内を180℃に保って30分間攪拌した。次いで、50℃まで冷却して、エチレン-アクリル酸共重合体の水分散体を得た。その水分散液をろ紙によりろ過、水洗し、60℃で24時間、減圧乾燥機にて乾燥し、ポリエチレン粒子を得た。得られた粒子80gに疎水性処理シリカ粒子(東ソーシリカ社製 ニップシールSS100)0.32gを添加し、ミキサーにて攪拌混合し、分級して、体積平均粒子径12μmの球状エチレン-アクリル酸共重合体粒子を得た。
1000ml容の四つ口フラスコに130℃~140℃の熱キシレン495g、低密度ポリエチレン(LDPE) 25gを仕込み、高速攪拌しつつ室温にて放冷し、ポリエチレンの微粉を析出させた。析出したポリマーを取り出し、水洗、乾燥しポリエチレン粒子を得た。これを分級して、体積平均粒子径15μmの粒子を得た。この粒子の形状は異形状であった(図2参照)。
製造例2により得られた粒子を分級して、体積平均粒子径が30μmの粒子を得た。
<エポキシ樹脂の調製>
メチルエチルケトン溶媒にビスフェノールA型エポキシ樹脂(エピクロン 1050;DIC社製 エポキシ当量476)を70質量%濃度になるように溶解させた。
<硬化剤の調製>
メチルエチルケトン溶媒にエポキシ樹脂用フェノール系硬化剤(HF-1M:明和化成(株)社製 フェノール価105)を70質量%濃度になるように溶解させた。
<エポキシ樹脂接着剤の調製>
上記メチルエチルケトンに溶解させた70質量%濃度のエポキシ樹脂およびフェノール系硬化樹脂の溶液を、質量比で4.5:1(エポキシ当量:フェノール価=1:1)になるように混合した溶液95質量部に対して、製造例1で得られた低密度ポリエチレン粒子5質量部を添加し、撹拌、混合してエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
ポリオレフィン系樹脂粒子として製造例2で得られた低密度ポリエチレン粒子を用いた以外は実施例1と同様にしてエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
ポリオレフィン系樹脂粒子として製造例3で得られた高密度ポリエチレン粒子を用いた以外は実施例1と同様にしてエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
ポリオレフィン系樹脂粒子として製造例4で得られたエチレン-グリシジルメタクリレート共重合体粒子を用いた以外は実施例1と同様にしてエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
ポリオレフィン系樹脂粒子として製造例5で得られたエチレン-無水マレイン酸共重合体粒子を用いた以外は実施例1と同様にしてエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
ポリオレフィン系樹脂粒子として製造例6で得られたエチレン-アクリル酸共重合体粒子を用いた以外は実施例1と同様にしてエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
低密度ポリエチレン粒子を添加しなかった以外は実施例1と同様にしてエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
ポリオレフィン系樹脂粒子として製造例8で得られた体積平均粒子径が30μmの低密度ポリエチレン粒子に変更した以外は同様に評価した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
ポリオレフィン系樹脂粒子として製造例7で得られた低密度ポリエチレン粒子を用いた以外は実施例1と同様にしてエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
実施例2において低密度ポリエチレン粒子を55重量部添加した以外は実施例2と同様にしてエポキシ樹脂接着剤を調製した。得られた接着剤を用いて、上記硬化条件にて作成した皮膜について各評価方法に従って評価した。結果を表1に示した。
Claims (6)
- (A)エポキシ樹脂、(B)硬化剤および(C)体積平均粒子径が1~25μmのポリオレフィン系樹脂粒子を含有し、
前記ポリオレフィン系樹脂粒子が球状であり、
前記エポキシ樹脂100質量部に対し、前記ポリオレフィン系樹脂粒子は1~50質量部含有される、
エポキシ樹脂接着剤。 - (A)エポキシ樹脂、(B)硬化剤および(C)体積平均粒子径が1~25μmのポリオレフィン系樹脂粒子を含有し、
前記ポリオレフィン系樹脂粒子が球状であり、
前記エポキシ樹脂および前記硬化剤の総量100質量部に対し、前記ポリオレフィン系樹脂粒子は1~50質量部含有される、
エポキシ樹脂接着剤。 - ポリオレフィン系樹脂が、低密度ポリエチレン、高密度ポリエチレン、エチレンとエポキシ基含有モノマーとの共重合体、エチレンと酸変性基含有モノマーとの共重合体、及びエチレンとエチレン性不飽和モノマーとの共重合体からなる群より選ばれる少なくとも1種を含む、請求項1または2に記載のエポキシ樹脂接着剤。
- 前記ポリオレフィン系樹脂粒子が、シリカにより被覆されている、請求項1~3のいずれか1項に記載のエポキシ樹脂接着剤。
- シリカの添加量が、前記ポリオレフィン系樹脂粒子100質量部に対して0.1~1質量部である、請求項4に記載のエポキシ樹脂接着剤。
- 体積平均粒子径が1~25μmの、球状ポリオレフィン系樹脂粒子を含む、エポキシ樹脂接着剤用硬化時収縮抑制剤。
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US15/102,981 US11242476B2 (en) | 2013-12-16 | 2014-12-02 | Epoxy resin adhesive agent |
CN201480068820.2A CN105829481B (zh) | 2013-12-16 | 2014-12-02 | 环氧树脂胶粘剂 |
JP2015553463A JP6526571B2 (ja) | 2013-12-16 | 2014-12-02 | エポキシ樹脂接着剤 |
KR1020167015912A KR102261598B1 (ko) | 2013-12-16 | 2014-12-02 | 에폭시 수지 접착제 |
EP14872044.4A EP3085751B1 (en) | 2013-12-16 | 2014-12-02 | Epoxy resin adhesive agent |
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KR (1) | KR102261598B1 (ja) |
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DE102015207110A1 (de) * | 2015-04-20 | 2016-10-20 | Volkswagen Aktiengesellschaft | Klebstoffzusammensetzung mit verbesserter Delta-Alpha-Toleranz, dazugehöriges Fügeverfahren und erhältliches Verbundwerkstück |
JP2016210905A (ja) * | 2015-05-11 | 2016-12-15 | 日本化薬株式会社 | 樹脂組成物の製造方法 |
TWI629308B (zh) * | 2016-04-21 | 2018-07-11 | 山榮化學股份有限公司 | Thermosetting resin composition and electronic component mounting substrate |
WO2018131570A1 (ja) | 2017-01-10 | 2018-07-19 | 住友精化株式会社 | エポキシ樹脂組成物 |
JP2020079383A (ja) * | 2019-09-02 | 2020-05-28 | 日本化薬株式会社 | 樹脂組成物の製造方法 |
US11066510B2 (en) | 2015-07-10 | 2021-07-20 | Sumitomo Seika Chemicals Co., Ltd. | Epoxy resin composition, process for producing same, and uses of said composition |
US11091627B2 (en) | 2017-01-10 | 2021-08-17 | Sumitomo Seika Chemicals Co., Ltd. | Epoxy resin composition |
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US11292872B2 (en) | 2017-01-10 | 2022-04-05 | Sumitomo Seika Chemicals Co., Ltd. | Epoxy resin composition |
WO2023033075A1 (ja) * | 2021-08-31 | 2023-03-09 | 住友精化株式会社 | 接着剤組成物 |
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KR102396332B1 (ko) * | 2015-09-22 | 2022-05-12 | 삼성전자주식회사 | Led 디스플레이용 미세간격 코팅부재 및 이를 이용한 코팅방법 |
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DE102015207110A1 (de) * | 2015-04-20 | 2016-10-20 | Volkswagen Aktiengesellschaft | Klebstoffzusammensetzung mit verbesserter Delta-Alpha-Toleranz, dazugehöriges Fügeverfahren und erhältliches Verbundwerkstück |
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WO2023033074A1 (ja) * | 2021-08-31 | 2023-03-09 | 住友精化株式会社 | 接着剤組成物 |
Also Published As
Publication number | Publication date |
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EP3085751B1 (en) | 2020-02-26 |
JPWO2015093281A1 (ja) | 2017-03-16 |
EP3085751A1 (en) | 2016-10-26 |
US20160355711A1 (en) | 2016-12-08 |
JP6526571B2 (ja) | 2019-06-05 |
KR20160097216A (ko) | 2016-08-17 |
CN105829481B (zh) | 2019-08-30 |
US11242476B2 (en) | 2022-02-08 |
EP3085751A4 (en) | 2017-07-19 |
KR102261598B1 (ko) | 2021-06-07 |
CN105829481A (zh) | 2016-08-03 |
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