WO2014203843A1 - 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法 - Google Patents
無電解めっき用触媒、これを用いた金属皮膜及びその製造方法 Download PDFInfo
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- WO2014203843A1 WO2014203843A1 PCT/JP2014/065848 JP2014065848W WO2014203843A1 WO 2014203843 A1 WO2014203843 A1 WO 2014203843A1 JP 2014065848 W JP2014065848 W JP 2014065848W WO 2014203843 A1 WO2014203843 A1 WO 2014203843A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/06—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/26—Catalysts comprising hydrides, coordination complexes or organic compounds containing in addition, inorganic metal compounds not provided for in groups B01J31/02 - B01J31/24
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/26—Catalysts comprising hydrides, coordination complexes or organic compounds containing in addition, inorganic metal compounds not provided for in groups B01J31/02 - B01J31/24
- B01J31/28—Catalysts comprising hydrides, coordination complexes or organic compounds containing in addition, inorganic metal compounds not provided for in groups B01J31/02 - B01J31/24 of the platinum group metals, iron group metals or copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Definitions
- the present invention relates to a method for producing an electroless plating metal film using metal nanoparticles protected with an anionic compound, and a catalyst for electroless plating suitably used in the production method.
- noble metals are used as the electroless plating catalyst, and palladium is most widely used, but the following two methods are mainly used as a method for attaching such a noble metal catalyst to an object to be plated. It is used.
- a method in which an object to be plated is immersed in a sensitizer solution (a hydrochloric acid solution of palladium chloride), and then a palladium salt is reduced on the object to be plated to obtain a palladium colloid adherent (sensitator-activator method).
- a sensitizer solution a hydrochloric acid solution of palladium chloride
- a palladium salt is reduced on the object to be plated to obtain a palladium colloid adherent
- an accelerator solution made of an acidic solution such as sulfuric acid to dissolve excess tin ions, thereby improving the catalytic activity.
- a general method is to first attach a catalytic metal compound to the surface of the object to be plated and then convert it to reduced metal fine particles that exhibit a catalytic effect.
- these methods involve two steps (application and activation). ), The process is very complicated, and the process cost increases due to an increase in the number of processes.
- Patent Document 5 and Non-Patent Document 2 describe a method in which a silver colloidal particle catalyst prepared by a Sn-Ag reduction method is imparted to the surface of an object to be plated treated with a cationic polymer.
- Silver colloidal particles prepared by this method contain tin oxide compounds, and catalyst particles and non-catalytic tin compounds are competitively adsorbed on the object to be plated.
- it is difficult to uniformly adsorb a sufficient amount of catalyst on the surface of an object to be plated such as glass and ceramics, and when used industrially, there is a drawback that it tends to cause poor plating and poor adhesion. .
- a tin removal step is required before the electroplating step, and the process becomes complicated. Even after the removal step, impurities such as chloride ions derived from the tin compound remain. Therefore, there is a problem that concerns that impair the reliability of the electronic circuit, such as formation of metal whiskers and ion migration after the formation of the electronic circuit, cannot be eliminated.
- An object of the present invention is to provide an electroless plating catalyst which exhibits a sufficient amount of adsorption only by a simple dipping operation after surface treatment and exhibits catalytic activity and has excellent stability. Furthermore, by using the electroless plating catalyst, it is excellent in the ability to adhere to a minute part and the adhesion on the deposited metal film, so that it can be connected to the interlayer connection part (through hole, via hole) of the laminated electronic circuit board. It is providing the manufacturing method of the metal membrane
- the present inventors have used a complex of a compound having a specific anionic functional group and metal nanoparticles as a catalyst for electroless plating. Because there is no need to go through the two-stage process that is generally used, the number of processes can be reduced, it is stable as a plating catalyst solution, and a sufficient catalyst can be imparted to the object to be plated. It was found that a deposited metal film can be formed.
- the object to be plated may be treated by a general cationization method, and plating around through holes and via holes in laminated electronic circuit boards, insulating materials and copper wiring It has been found that the adhesion of the plating film to the film is sufficiently secured, and the present invention has been completed here.
- the present invention relates to (meth) acrylic acid having one or more anionic functional groups selected from the group consisting of carboxy group, phosphoric acid group, phosphorous acid group, sulfonic acid group, sulfinic acid group and sulfenic acid group.
- Electroless plating catalyst characterized by being a composite of a compound (X) obtained by polymerizing a monomer mixture (I) containing a monomer and a metal nanoparticle (Y), and The present invention provides a method for producing a metal film using an electroless plating method.
- the catalyst for electroless plating of the present invention is a complex of a compound having an anionic functional group and metal nanoparticles, and can be suitably used as a catalyst solution dispersed in an aqueous solvent.
- a complex of an anionic compound having such a specific structure and metal nanoparticles the catalyst solution in which the complex is dispersed due to the effect of the charge and steric repulsion group of the complex is heated without aggregation and precipitation. Excellent dispersion stability even in the state.
- the retention of catalytic ability after building bath is extremely good, process management is easy, and sufficient adsorption (catalyst imparting effect) is provided on the surface of the object to be plated pretreated with a general cationic treatment agent. Show.
- the complex which is a catalyst for electroless plating of the present invention can remove impurities by known purification methods such as centrifugation and ultrafiltration, so that plating that requires reliability as in the production of electronic circuit boards is required. It can also be suitably used for catalyst applications.
- the metal film obtained using the electroless plating catalyst of the present invention is inferior to the plating film obtained with a conventional palladium catalyst.
- a composite of silver or copper nanoparticles is used as a catalyst, it is extremely cheaper than palladium and has a low price fluctuation risk, so higher economic efficiency can be expected.
- the electroless plating catalyst and the method for producing a metal film of the present invention can be reduced from the conventionally used electroless plating step, and the process cost can be greatly reduced. Is possible.
- Example 2 it is a cross-sectional SEM photograph of the base material which plated the buildup board
- Example 2 it is a cross-sectional SEM photograph of a base material obtained by plating the buildup substrate formed with via holes using the Sn—Pd catalyst solution used in Comparative Example 1 [(a) 1000 ⁇ magnification, (b ) 5000 times magnification].
- the electroless plating catalyst used in the present invention has one or more anionic functional groups selected from the group consisting of carboxy group, phosphoric acid group, phosphorous acid group, sulfonic acid group, sulfinic acid group and sulfenic acid group.
- the carboxy group, phosphoric acid group, phosphorous acid group, sulfonic acid group, sulfinic acid group, and sulfenic acid group have a function of adsorbing to the metal nanoparticles (Y) via the lone pair of hetero atoms.
- a negative charge is imparted to the surface of the metal nanoparticle (Y)
- aggregation of colloidal particles can be prevented by charge repulsion between the particles, and the compound (X) and the metal nanoparticle (Y) It is possible to stably disperse the complex.
- a monomer mixture (I) essentially comprising a (meth) acrylic acid monomer having these functional groups is polymerized.
- a monomer mixture composed of (meth) acrylic acid monomers is preferably polymerized.
- the compound (X) introduced with a carboxy group can be easily obtained by homopolymerization of (meth) acrylic acid or copolymerization with other (meth) acrylic acid monomers by various methods. be able to.
- the compound (X) into which a phosphoric acid group and a phosphorous acid group are introduced has a phosphoric acid group-containing (meth) acrylic acid-based monomer as an essential component. And can be easily obtained by copolymerizing the mixture.
- Compound (X) may be a homopolymer or a copolymer, and in particular, a copolymer having a plurality of types of the aforementioned anionic functional groups.
- the copolymerization type is not particularly limited, and any of random or block can be preferably used. Moreover, you may use it, mixing 2 or more types of compounds (X) which have a different anionic functional group.
- the amount of the specific anionic functional group introduced into the compound (X) is not particularly limited, but from the viewpoint of stability when adsorbed on the metal nanoparticles (Y) and dispersed. It is preferable that 3 or more are contained in one molecule.
- the mass average molecular weight of the compound (X) is not particularly limited, but as described above, as a composite with the metal nanoparticles (Y), the effect of the electroless plating catalyst (adsorption to the substrate, dispersion) From the viewpoint of dispersion stability when it is used as a liquid, it is preferably 3,000 to 20,000, more preferably 4,000 to 8,000.
- the monomer mixture (I) contains a (meth) acrylic acid-based monomer having a polyethylene glycol chain, and the (meth) acrylic acid having the (meth) acrylic acid and phosphate groups described above. It can be easily obtained by copolymerizing with (meth) acrylic acid having a sulfonic acid group.
- the compound (X) having an anionic functional group which is a compound obtained by polymerization using a (meth) acrylic acid monomer having a polyethylene glycol chain having an ethylene glycol average unit number of 20 or more, is a noble metal, particularly It has a high ability to stabilize silver and copper nanoparticles and is a preferable protective agent. Synthesis of a compound having such an anionic functional group and a polyethylene glycol chain can be easily obtained by referring to, for example, Japanese Patent No. 4697356, Japanese Patent Application Laid-Open No. 2010-209421, and the like.
- the mass average molecular weight of the (meth) acrylic acid monomer having a polyethylene glycol chain having an ethylene glycol average unit number of 20 or more is preferably 1,000 to 2,000.
- the mass average molecular weight is within this range, the water dispersibility of the composite with the metal nanoparticles (Y) becomes better.
- Y metal nanoparticles
- 2-methacryloyloxyphosphate for example, “Light Ester P-1M” manufactured by Kyoeisha Chemical
- methacrylic acid ester monomer having a polyethylene glycol chain for example, “Blenmer PME-1000” manufactured by NOF Corporation
- an arbitrary polymerization initiator for example, an oil-soluble azo polymerization initiator “V-59”.
- the mass fraction of the (meth) acrylic acid ester monomer having a phosphate group is less than 30% with respect to the monomer mixture (I)
- production of by-products, such as a homopolymer of the (meth) acrylic-acid type monomer which has this, is suppressed, and the dispersion stability by the compound (X) obtained improves.
- the monomer mixture (I) contains a third polymerizable monomer other than the (meth) acrylic acid monomer having an anionic group and the (meth) acrylic acid monomer having a polyethylene glycol chain. May be.
- the mass fraction when the third polymerizable monomer is a hydrophobic monomer is 20% with respect to the (meth) acrylic acid monomer having a polyethylene glycol chain in order to ensure good water dispersibility.
- the following is preferable, and 10% or less is more preferable.
- the third polymerizable monomer is not a hydrophobic monomer, it is not limited to this range.
- the mass average molecular weight of the compound (X) is preferably in the range of 3,000 to 20,000.
- the compound (X) obtained by the reaction has a molecular weight distribution.
- the mass average molecular weight of the compound (X) is 4,000 or more.
- the complex with the metal nanoparticle (Y) is likely to be coarsened, and the mass average molecular weight of the compound (X) is 8,000 from the viewpoint of easily causing precipitation in the catalyst solution.
- the following is more preferable.
- a chain transfer agent described in a known document such as JP 2010-209421 A may be used. It may be controlled depending on the polymerization conditions.
- the metal nanoparticles (Y) combined with the compound (X) having such an anionic functional group can be effectively adsorbed on the surface of the object to be plated and immersed in the solution.
- the catalyst can be evenly adsorbed even in minute recesses and through / non-through holes regardless of the shape of the object to be plated, thereby enabling plating deposition with good throwing power. Is.
- the electroless plating catalyst of the present invention is adsorbed on the surface of the object to be plated by electrostatic reciprocity due to the anionic functional group contained in the compound (X).
- the compound (X) incorporating an alkylene chain the steric repulsion effect of these chains can suppress aggregation not only in the liquid but also on the object to be plated. Can be formed.
- the electroless plating catalyst of the present invention is a composite with metal nanoparticles (Y) such as silver, copper, palladium, etc., produced using the compound (X) as a colloid protective agent.
- a metal compound for example, silver nitrate, copper acetate, palladium nitrate or the like is added thereto, and if necessary, a complexing agent is used in combination with a uniform dispersion. Or by mixing a reducing agent simultaneously with the complexing agent, these metal compounds are reduced, and the reduced metal becomes nano-sized particles (fine particles having a size on the order of nanometers) and the compound ( An aqueous dispersion of metal nanoparticles (Y) combined with X) can be obtained.
- a metal compound for example, silver nitrate, copper acetate, palladium nitrate or the like is added thereto, and if necessary, a complexing agent is used in combination with a uniform dispersion. Or by mixing a reducing agent simultaneously with the complexing agent, these metal compounds are reduced, and the reduced metal becomes nano-sized particles (fine particles having a size on the order of nanometers) and the compound ( An aqueous dispersion of metal nanoparticles (Y) combined
- the aqueous dispersion of the composite containing the metal nanoparticles (Y) obtained by such a method may be used as the electroless plating catalyst solution as it is, or an excess complexing agent, Refining agent or the counter ion contained in the metal compound used as a raw material is purified by various purification methods such as ultrafiltration, precipitation, centrifugation, distillation under reduced pressure, and drying under reduced pressure alone or in combination of two or more. You may use what passed the process, what changed the density
- the complex formed by protecting the metal nanoparticles (Y) with the compound (X) includes the compound (X) and metal nanoparticles (Y having an average particle diameter of preferably in the range of 0.5 to 100 nm. ) And the components.
- the size of the metal nanoparticles (Y) can be estimated by a transmission electron micrograph.
- the average value of 100 particles is in the range of 0.5 to 100 nm. It can be easily obtained by following methods such as Japanese Patent No. 4697356 and Japanese Patent Application Laid-Open No. 2010-209421.
- the metal nanoparticles (Y) thus obtained are protected by the compound (X) and exist individually one by one, and can exist stably without being fused at room temperature.
- the particle size of the metal nanoparticle (Y) is the type of metal compound, the molecular weight of the compound (X) that serves as a colloid protective agent, the chemical structure, its use ratio, the type of complexing agent and reducing agent, and the amount used.
- the temperature can be easily controlled by the temperature at the time of the reduction reaction. For these, reference may be made to the examples in the aforementioned patent documents.
- the metal species of the metal nanoparticle (Y) is not particularly limited as long as it can function as a catalyst in the electroless plating process.
- the viewpoint of the catalyst function and the stability of the composite in an aqueous medium is not particularly limited. Is preferably silver, copper or palladium, and from the viewpoint of effectively developing conductivity by integrating with a metal film after the plating step, silver or copper core particles or silver core copper shell particles Copper shell silver core particles are preferred, and those consisting of silver alone are most preferred from the viewpoint of economy.
- silver nanoparticles those having an average particle diameter in the range of 5 to 50 nm are most preferable as the catalyst.
- the content ratio of the compound (X) in the composite of the compound (X) and the metal nanoparticles (Y) is 1 to 30% by mass, preferably 2 to 20% by mass in the composite. . That is, in the composite, the metal nanoparticles (Y) occupy most of the mass is suitable for forming a uniform and stable plated metal film in the subsequent plating step.
- the composite can be dispersed in a range of about 0.001 to 70% by mass in an aqueous medium, that is, a mixed solvent of water or an organic solvent compatible with water, and can be dispersed at room temperature ( ⁇ 25 ° C.). ), It does not aggregate for several months and can be stored stably.
- an aqueous medium that is, a mixed solvent of water or an organic solvent compatible with water
- the electroless plating catalyst of the present invention can be used as a catalyst solution in which the composite is dispersed in an aqueous medium.
- the concentration of the electroless plating catalyst (non-volatile content) is 0.05 to 5 g / L from the viewpoint of securing the amount of adsorption to the object to be plated and improving the adhesion of the plating film to the object to be plated.
- the concentration is preferably in the range, and particularly considering the economy, the concentration is more preferably adjusted to a range of 0.1 to 2 g / L, and particularly preferably adjusted to a range of 0.2 to 2 g / L. .
- aqueous medium used for the electroless plating catalyst solution water alone or a mixed solvent of water and an organic solvent compatible with water can be suitably used.
- the organic solvent compatible with water can be selected without particular limitation as long as it does not impair the dispersion stability of the composite and the object to be plated does not suffer unnecessary damage.
- methanol , Ethanol, isopropanol, and acetone, or a mixture of two or more kinds can be appropriately selected and used according to the purpose.
- the mixing ratio of the organic solvent compatible with water mixed with water is preferably 50% by mass or less from the viewpoint of dispersion stability of the composite. From the viewpoint of convenience in the plating step, it is more preferably 30% by mass or less.
- the object to be plated that can be plated using the dispersion of the electroless plating catalyst of the present invention may be any substrate that can adsorb the above-described composite, It is not limited.
- a material one or more kinds of materials such as glass fiber reinforced epoxy, epoxy insulating material, plastics such as polyimide and PET, glass, ceramic, metal oxide, metal, paper, synthetic or natural fiber are used.
- the shape is a combination, and the shape may be any of plate shape, film shape, cloth shape, fiber shape, tube shape, and the like.
- the object to be plated shows a tendency to get wet with water, that is, the water contact angle on the surface of the object to be plated is 75 ° or less.
- surface treatment for example, plasma irradiation, corona discharge, ultraviolet irradiation, ozone treatment, etching, etc., or acid or alkali treatment to make the surface hydrophilic. Any material can be suitably used as long as it can impart the properties.
- the surface treatment method one or a plurality of treatment methods described above can be applied.
- the dispersion of the electroless plating catalyst of the present invention When the dispersion of the electroless plating catalyst of the present invention is used, a uniform metal film can be easily obtained on the object to be plated. Therefore, it is particularly suitable for plating for electronic materials.
- a material, a copper-clad circuit board, an epoxy-based insulating material, or a ceramic base material can be particularly preferably used as an object to be plated.
- the aqueous dispersion of the composite As a catalyst for electroless plating, by treating the object to be plated as it is or after washing with water and further drying with the aqueous dispersion,
- the metal nanoparticles having a catalytic function can be easily adsorbed on the object to be plated.
- the method for producing a metal film using the electroless plating catalyst of the present invention comprises the step of preparing a palladium catalyst using the compound (X) and metal nanoparticles (in the electroless plating metal film production step performed using a conventional palladium catalyst).
- Y) is a method changed to a composite comprising the electroless plating step suitable for obtaining the catalytic effect of the electroless plating catalyst of the present invention.
- the method for producing a metal film of the present invention includes: (1) The process of processing the to-be-plated object surface with a cationic processing agent (a), (2) The treatment object to be plated after the step (1) is immersed in a catalyst solution for electroless plating in which the catalyst is dispersed in an aqueous solvent, and the compound (X) and the metal nanoparticle are formed on the surface of the treatment object. Adsorbing the complex with the particles (Y), (3) It has the process of immersing the complex adsorption to-be-plated object obtained at the said process (2) in the metal ion solution (b) for electroless plating.
- Step (1) (cationization treatment of the surface of the object to be plated)
- the surface of the object to be plated is treated with the cationic treatment agent (a). If necessary, the surface of the object to be plated is applied to the surface of the object to be plated before the step (1).
- Various degreasing processes and etching processes for the purpose of removing adhered substances and making the surface of the object to be plated hydrophilic can be included.
- the cationic treatment agent (a) used for the cationization treatment of the object to be plated is a composition containing a cationic compound, and has various cationic surface activities.
- An agent or a compound having a cationic functional group (amino group or ammonium salt) dissolved or dispersed in an aqueous medium can be used.
- Examples of the cationic compound include higher alkyl monoamine salts such as monoalkylamine salts (acetates), alkyldiamine salts such as N-alkylpropylenediaminediolein salts, and quaternary compounds such as alkyltrimethylammonium salts (chlorides).
- higher alkyl monoamine salts such as monoalkylamine salts (acetates)
- alkyldiamine salts such as N-alkylpropylenediaminediolein salts
- quaternary compounds such as alkyltrimethylammonium salts (chlorides).
- Cationic surfactants commercially available as ammonium salts and the like (the number of carbon atoms in the alkyl group is 6 to 32, preferably about 8 to 24), polyethyleneimine, polyallylamine, polyallylamine salts (hydrochloric acid, sulfuric acid), poly Cationic polymers such as allylamine salt diallylamine salt copolymer and polyaniline (weight average molecular weight of about 1,000 to 100,000, preferably 5000 to 20,000) can be suitably used.
- a product obtained by dissolving or dispersing the cationic compound in an aqueous medium in the range of 0.01 to 50 g / L can be used. More preferably, it is 20 g / L.
- an organic solvent compatible with water may be used in combination.
- boric acid, phosphoric acid, ammonium chloride, ammonia, carbonic acid, acetic acid and the like can be used as a pH buffering agent.
- the amount of pH buffer used is preferably 1 to 50 g / L, more preferably 1 to 20 g / L.
- the said process (1) it does not specifically limit as a method of processing the to-be-plated object surface with a cationic processing agent (a), Even if a to-be-plated object is immersed in a cationic processing agent (a).
- the cationic treatment agent (a) may be applied to the surface of the object to be plated, but it is necessary to perform plating on particularly minute parts such as interlayer connection parts (through holes, via holes) of laminated electronic circuit boards.
- the method of treating by immersing in the cationic treating agent (a) is the simplest and preferred. The conditions are not particularly limited.
- the temperature of the cationization treatment agent (a) is set to about 10 to 80 ° C., preferably 20 to 50 ° C., and the object to be plated is immersed therein.
- the immersion time is preferably about 1 to 20 minutes, and more preferably in the range of 2 to 10 minutes.
- the treatment with such a cationization treatment agent (a) generally has a surface to be plated that is mostly acidic, and the cationization treatment for the object to be plated includes subsequent washing, soft etching, etc. It is derived from the fact that it is easy to maintain the effect during the process, and provides the simplicity of the process and the stability of the plated metal film formation as compared with the anionization treatment.
- Step (2) Catalyst Application Step (Method of Applying Plating Catalyst)] Especially as a method of providing the composite containing the metal nanoparticle which is a catalyst for electroless plating on the surface of the to-be-plated object (processed to-be-plated object) processed with the said cationic processing agent (a), It is limited.
- a method of immersing in a catalyst solution a method of applying the catalyst solution to the object to be plated can be applied, but when the object to be plated has a fine structure, for example, a laminated electronic circuit board
- a method of immersing in a catalyst solution is preferable. According to this method, an object to be plated having a minute part is applied.
- the catalyst metal nanoparticle composite
- the catalyst can be uniformly applied by a simple operation.
- the immersion conditions for applying the plating catalyst onto the surface of the object to be treated there is no particular limitation on the immersion conditions for applying the plating catalyst onto the surface of the object to be treated, and the temperature of the catalyst solution (aqueous dispersion) is usually 5 to 70 ° C., preferably 10 to 60. What is necessary is just to immerse the to-be-plated object obtained by process (1) in this as about degreeC.
- the time for immersing the treatment object in the catalyst solution is not particularly limited as long as the target plating metal film can be formed in the subsequent electroless plating step, but the immersion time is up to about 30 minutes. As the immersion time increases, the amount of adsorption of the catalyst (complex containing metal nanoparticles) increases. However, the amount of adsorption of the catalyst does not increase even if the immersion is continued for a longer time. From the viewpoint, the immersion time is preferably within 30 minutes, and it is usually possible to obtain a catalyst layer capable of obtaining the intended plating film with an immersion time of about 2 to 15 minutes.
- Electroless plating process The surface of the object to be plated is obtained by immersing the composite adsorbed object to be plated obtained through the above steps (1) and (2) in a metal ion solution (b) (electroless plating solution) for electroless plating. A metal film can be formed thereon.
- Electroless plating solution (b)> Various electroless plating solutions can be used as the electroless plating solution. Examples of such an electroless plating solution include gold, silver, and the like, in addition to electroless nickel plating solution and electroless copper plating solution. And electroless plating solutions of noble metals such as palladium and rhodium. These electroless plating solutions are commercially available, and can be easily selected, purchased and used according to the purpose of use.
- the copper film substrate can be easily obtained by the manufacturing method of the present invention, that is, according to the present invention, a glass epoxy copper clad laminate (glass epoxy substrate) and a laminated electron conventionally known as FR-4.
- the circuit board can be manufactured from a raw material that is inexpensive and has low toxicity.
- the metal film deposited by electroless plating obtained above may be used as a conductive film as it is, or may be further subjected to electrolytic plating to form a metal film having a desired thickness. Furthermore, a part of the obtained metal film can be removed by etching or the like to form a pattern for use.
- the analytical instruments used in the present invention are as follows. 1 H-NMR: manufactured by JEOL Ltd., AL300, 300 Hz TEM observation: JEM-2200FS, manufactured by JEOL Ltd. Electrical conductivity: B-173, manufactured by HORIBA, Ltd. SEM observation: Hitachi High-Technologies Corporation S-3400 TG-DTA measurement: TG / DTA6300, manufactured by SII Nano Technology Co., Ltd. Plasmon absorption spectrum: Hitachi, Ltd., UV-3500 Dynamic scattering particle size measuring device: FPAR-1000, manufactured by Otsuka Electronics Co., Ltd. Surface resistivity measurement: Mitsubishi Chemical Corporation, low resistivity meter Loresta EP (4-terminal method) Catalyst adsorption amount: manufactured by SII Nano Technology Co., Ltd., ICP emission analyzer SPS3100
- the dispersion after completion of the reaction obtained above was subjected to ultrafiltration purification using a hollow fiber UF membrane module (manufactured by Daisen Membrane Systems Co., Ltd., membrane area 0.13 m 2 ).
- the electrical conductivity of the filtrate was initially 20 mS / cm or more, and the ultrafiltration was terminated when it became 10 ⁇ S / cm or less.
- suction filtration was performed with a membrane filter having a pore size of 0.45 ⁇ m, and an aqueous dispersion of a complex with silver nanoparticles was obtained as a filtrate (1,050 g, nonvolatile content). 8.9%, yield 89%).
- the filtrate (coarse particles) at this time was 9.0 g (8.5% in terms of silver of the raw material).
- the dispersion after completion of the reaction obtained above was subjected to ultrafiltration purification using a hollow fiber UF membrane module (manufactured by Daisen Membrane Systems Co., Ltd., membrane area 0.13 m 2 ).
- the electrical conductivity of the filtrate was initially 20 mS / cm or more, and the ultrafiltration was terminated when it became 10 ⁇ S / cm or less.
- suction filtration was performed with a membrane filter having a pore size of 0.45 ⁇ m to obtain an aqueous dispersion of a complex with silver nanoparticles as a filtrate (1,029 g, non-volatile content). 9.9%, yield 97%).
- the filtrate (coarse particles) at this time was 135 mg (0.14% in terms of silver of the raw material).
- the obtained suspension was filtered with an ultrafiltration unit ("Vivapin 20" manufactured by Sartorius Stedim, fractional molecular weight 100,000, 2). Purified water was added to the filtration residue and centrifugal filtration was repeated four times. When water was added to the obtained residue to make a total of 2.1 g of dispersion, the compound (X-4) and silver nanoparticles were mixed. An aqueous dispersion of the composite was obtained (solid content about 30 w / w%, silver content in solid content 96.2% (TG-DTA), particle size 40-50 nm (TEM)).
- Example 1 Synthesis of a silver hydrosol using a non-polymerizable compound having a cationic functional group> Based on Example 1 of Patent Document 3, while vigorously stirring a solution obtained by dissolving 50 ⁇ mol of silver nitrate in 94 mL of pure water, 1 mL of an aqueous solution containing 10 mg of stearyltrimethylammonium chloride and 5 mL of an aqueous solution containing 200 ⁇ mol of sodium borohydride are sequentially added to this solution. When injected, the color of the solution changed to tan, and 100 mL of a uniform transparent silver hydrosol containing 0.5 mg of silver particles was obtained.
- ⁇ Comparative Synthesis Example 4 Synthesis of a silver hydrosol in which a non-polymerizable compound having a sulfonic acid group and a compound having a polyethylene glycol chain were simultaneously present> Similar to Comparative Synthesis Example 1, except that 1 mL of an aqueous solution containing 5 mg of sodium dodecylbenzenesulfonate and 5 mg of polyethylene glycol-p-nonylphenyl ether was used in place of the surfactant stearyltrimethylammonium chloride based on Patent Document 3. Thus, a uniform transparent hydrosol was prepared.
- Catalyst solutions 1 to 8 were prepared by diluting the aqueous dispersions of the compounds obtained in Synthesis Examples 1 to 7 and metal nanoparticle composites with purified water and adjusting the concentrations to predetermined concentrations.
- Comparative Catalyst Solutions 1 to 5 were prepared by diluting the hydrosols obtained in Comparative Synthesis Examples 1 to 5 with purified water and adjusting the concentration to 0.05 g / L.
- Table 1 summarizes the catalyst solutions prepared in Synthesis Examples 1 to 7 and Comparative Synthesis Examples 1 to 5.
- Example 1 Production of electroless plating film of copper using catalyst solutions-1 to 7> Using the catalyst liquids 1 to 7, electroless plating was performed on the following objects to be plated by the following steps.
- [Plate] Glass fiber reinforced epoxy resin plate: FR4 standard copper-clad substrate (substrate thickness 1.6 mm, copper foil thickness 18 ⁇ m).
- the copper foil is etched by dipping in a sodium persulfate aqueous solution. The resin substrate removed.
- Interlayer insulation for build-up substrates After the copper foil surface of the FR4 substrate (substrate thickness 0.8 mm, copper foil thickness 18 ⁇ m) is immersed in “CZ8100” and “CZ8300” (MEC Co., Ltd.) and roughened, the epoxy resin insulating material “ ABF-GX13 ”(40 ⁇ m thickness) or“ ABF-GX92 ”(40 ⁇ m thickness) vacuum-laminated and then desmeared.
- the desmear treatment of the substrate was performed by the following operation.
- Swelling step The substrate was immersed for 10 minutes in 1 L of water added with OPC-1080 conditioner (Okuno Pharmaceutical Co., Ltd.) 500 mL / L and sodium hydroxide 15 g / L set at 60 ° C., and then washed with water. did.
- Micro-etching step KMnO 4 30 g / L set to 85 ° C., “OPC1200 Epochet” (Okuno Pharmaceutical Co., Ltd.) 200 mL / L added to 1 L of water and the substrate treated in 1) for 20 minutes After soaking, it was washed with water.
- a degreasing / conditioning agent OPC Condy Clean FCR, manufactured by Okuno Pharmaceutical Co., Ltd.
- OPC Condy Clean FCR manufactured by Okuno Pharmaceutical Co., Ltd.
- 25 mL was dissolved in water to make 500 mL and maintained at 65 ° C.
- the object to be plated was immersed in this for 5 minutes.
- the surface of the object to be plated was degreased and cationized, then washed with warm water for 2 minutes, and then washed with running water for 2 minutes.
- Soft etching process 50 g of sodium persulfate and 2.5 mL of 98% purified sulfuric acid were dissolved in water to make 500 mL and kept at 25 ° C. The treated object after the degreasing and conditioning process was immersed in this for 2 minutes, and then washed with running water for 2 minutes.
- Desmutting process 50 mL of 98% purified sulfuric acid was dissolved in water to make 500 mL, and kept at 25 ° C. The treated object after the soft etching step was immersed in this for 2 minutes, and then washed with running water for 2 minutes. Further, it was washed with pure water for 1 minute.
- Catalyst application process The catalyst solutions -1 to 7 were kept at 25 ° C., and the treated object after the desmutting step was immersed in the catalyst solution for 5 minutes, respectively, to adsorb the composite onto the surface of the treated object.
- Electroless plating process Electroless copper plating solution (“MOON-700 Copper-1” (15 mL), “MOON-700 Copper-2” (15 mL), “MOON-700 Copper-3” (100 mL), all manufactured by Okuno Pharmaceutical Co., Ltd.) ) was mixed with water to 500 mL and kept at 45 ° C. The treated object after the catalyst application step was immersed in this for 15 minutes to deposit a copper plating film.
- Example 1 Electroless copper plating film using Sn-Pd colloidal catalyst> Instead of the catalyst solution used in Example 1, a commercially available palladium-tin colloidal solution was used, and electroless plating was performed on the same object to be plated as in Example 1. Steps 1 to 3 were the same as in Example 1, but were further complicated steps requiring two steps of pre-dip and activation as described below.
- Pre-dip process 130 g of pre-dip solution (“OPC-SAL-M”, manufactured by Okuno Pharmaceutical Co., Ltd.) was diluted with water to 500 mL and kept at 25 ° C. The object to be plated after the desmutting step was immersed in this for 1 minute.
- OPC-SAL-M manufactured by Okuno Pharmaceutical Co., Ltd.
- Catalyst compound application step 130 g of pre-dip solution (OPC-SAL-M, manufactured by Okuno Pharmaceutical Co., Ltd.) and 15 mL of Sn-Pd colloidal catalyst solution (OPC-90 catalyst, manufactured by Okuno Pharmaceutical Co., Ltd.) are diluted with water to make 500 mL, 25 Held at 0C. The treated object after the pre-dip process was immersed in this for 5 minutes, and then washed with running water for 2 minutes.
- pre-dip solution OPC-SAL-M, manufactured by Okuno Pharmaceutical Co., Ltd.
- OPC-90 catalyst manufactured by Okuno Pharmaceutical Co., Ltd.
- Activation process 50 mL of activation liquid (“OPC-505 Accelerator A”, manufactured by Okuno Pharmaceutical Co., Ltd.) and 4 mL of activation liquid (“OPC-505 Accelerator B”, manufactured by Okuno Pharmaceutical Industries, Ltd.) are diluted with water to 500 mL. And kept at 30 ° C. The treated object after the catalyst compound application step was immersed in this for 5 minutes, and then washed with running water for 2 minutes.
- Electroless plating process A copper plating film was formed on the object to be plated after the activation step by electroless copper plating using the MOON-700 copper series (Okuno Pharmaceutical Co., Ltd., electroless copper plating chemical stock solution).
- Example 2 Electroless copper plating film using Pd colloid catalyst> Instead of the catalyst solution used in Example 1, a commercially available palladium colloid solution was used, and electroless plating was performed on the same object to be plated as in Example 1 by the following steps. Since a pre-dip process and an activation process are required, it is a complicated process that requires more two steps than Example 1.
- a degreasing / conditioning agent (“OPC-370 Condy Clean MA”, manufactured by Okuno Pharmaceutical Co., Ltd.) (50 mL) was dissolved in water to 500 mL, and maintained at 65 ° C. The object to be plated was immersed in this for 5 minutes. In this step, the surface of the object to be plated was degreased and cationized, then washed with warm water for 2 minutes, and then washed with running water for 2 minutes.
- Desmutting process Desmutting using sulfuric acid as in Example 1 was performed.
- Pre-dip process A pre-dip solution (“OPC pre-dip 49L”, manufactured by Okuno Pharmaceutical Co., Ltd.) 5 mL and 98% purified sulfuric acid 0.75 mL were dissolved in water to make 500 mL and kept at 25 ° C. The object to be plated after the desmutting step was immersed in this for 1 minute.
- OPC pre-dip 49L manufactured by Okuno Pharmaceutical Co., Ltd.
- Catalyst compound application step 25 mL each of Pd colloid catalyst precursor liquid (OPC-50 inducer A and OPC-50 inducer C, both manufactured by Okuno Pharmaceutical Co., Ltd.) was dissolved in water to make 500 mL, and kept at 40 ° C. The treated object after the de-prepipping step was immersed in this for 5 minutes, and then washed with running water for 2 minutes.
- Pd colloid catalyst precursor liquid OPC-50 inducer A and OPC-50 inducer C, both manufactured by Okuno Pharmaceutical Co., Ltd.
- Activation process 75 mL of the activation liquid (OPC-150 Cryster MU, manufactured by Okuno Pharmaceutical Co., Ltd.) was dissolved in water to make 500 mL, and kept at 25 ° C. The treated object to be plated after the step of applying the catalyst compound was immersed in this for 5 minutes, and then washed with running water for 2 minutes.
- OPC-150 Cryster MU manufactured by Okuno Pharmaceutical Co., Ltd.
- Electroless plating process A copper plating film was formed on the object to be plated after the activation step by electroless copper plating using the MOON-700 copper series (Okuno Pharmaceutical Co., Ltd., electroless copper plating chemical stock solution).
- Example 3 Electroless copper plating film using Sn-Ag colloidal catalyst> Instead of the catalyst solution used in Example 1, a commercially available tin-silver colloid catalyst solution was used, and the same object to be plated as in Example 1 was subjected to electroless plating by the following steps. Since an activation process for removing Sn is required, it is a complicated process that requires one more process compared to Example 1.
- a degreasing / conditioning agent (MOON-300 Condy Clean, Okuno Pharmaceutical Co., Ltd.) (50 mL) was dissolved in water to make 500 mL and maintained at 60 ° C. The object to be plated was immersed in this for 5 minutes. In this step, the surface of the object to be plated was degreased and cationized, then washed with warm water for 2 minutes, and then washed with running water for 2 minutes.
- Desmutting process Desmutting using sulfuric acid as in Example 1 was performed.
- Catalyst compound application step The Sn—Ag catalyst solution (“MOON-500 Catalyst”, manufactured by Okuno Pharmaceutical Co., Ltd.) was kept at 25 ° C. The treated object after the desmutting step was immersed in this for 5 minutes, and then washed with running water for 2 minutes.
- Sn—Ag catalyst solution (“MOON-500 Catalyst”, manufactured by Okuno Pharmaceutical Co., Ltd.) was kept at 25 ° C. The treated object after the desmutting step was immersed in this for 5 minutes, and then washed with running water for 2 minutes.
- Activation process 50 mL of the activation liquid (“MOON-600 Accelerator”, manufactured by Okuno Pharmaceutical Co., Ltd.) was dissolved in water to make 500 mL, and maintained at 45 ° C. The treated object after the catalyst compound application step was immersed in this for 5 minutes, and then washed with running water for 2 minutes.
- MOON-600 Accelerator manufactured by Okuno Pharmaceutical Co., Ltd.
- Electroless plating process A copper plating film was formed on the object to be plated after the activation step by electroless copper plating using the MOON-700 copper series (Okuno Pharmaceutical Co., Ltd., electroless copper plating chemical stock solution).
- Example 4 Preparation of electroless plating film using comparative catalyst solutions -1 to 5>
- electroless plating was performed on an object to be plated in the same manner as in Example 1 except that the catalyst solution was changed to Comparative Catalyst Solutions-1 to 5.
- Example 2 A base material in which a via hole having a hole diameter of 70 ⁇ m was formed on the interlayer insulating material for a build-up substrate laminated with ABF-GX92 produced in Example 1, and the catalyst solution-4 and the Sn—Pd colloid used in Comparative Example 1 were used.
- electroless plating was performed on the surface of the object to be plated in the same manner as in Example 1.
- the via hole portion was cut by the FIB method, and SEM observation of the cross section was performed. As a result, it was reduced by two steps compared to the Sn-Pd colloidal catalyst. It has been confirmed that it has the ability to rotate with plating.
- FIG. 1 A base material in which a via hole having a hole diameter of 70 ⁇ m was formed on the interlayer insulating material for a build-up substrate laminated with ABF-GX92 produced in Example 1, and the catalyst solution-4 and the Sn—Pd colloid used in Comparative Example 1 were used.
- electroless plating was performed on the surface of
- FIG. 1 is a cross-sectional SEM photograph of the substrate plated with the catalyst solution-4
- FIG. 2 is a cross-sectional SEM photograph of the substrate plated with the Sn—Pd catalyst solution used in Comparative Example 1. A cross-sectional SEM photograph is shown respectively.
- Example 3 Production of electroless plating film of copper using catalyst solutions-1 to 8>
- electroless plating was performed on the following objects to be plated using the catalyst solutions 1 to 8 by the following steps.
- NACE conditioner OEM (Okuno Pharmaceutical Co., Ltd.) was used as the degreasing and conditioning agent in step 1 (the amount used was 50 mL), and NACE Copper-1 ( 15 mL), NACE Copper-2 (15 mL), NACE Copper-3 ”(100 mL) (both manufactured by Okuno Pharmaceutical Co., Ltd.) and the holding temperature in Step 5 was changed to 40 ° C.
- a copper plating film was deposited in the same manner as in the electroless plating process.
- the obtained plating film was evaluated in the same manner as in Example 1, and the results are shown in Table 3.
- the catalyst for electroless plating of the present invention has very good retention of catalytic ability after building bath, easy process management, and sufficient adsorption on the surface of the object to be plated pretreated with a general cationic treatment agent. Property (catalyst imparting effect).
- the composite which is a catalyst for electroless plating according to the present invention can be suitably used for the use of a plating catalyst for which reliability is required as in the production of an electronic circuit board.
- the metal film obtained using the electroless plating catalyst of the present invention is inferior to the plating film obtained with the conventional palladium-based catalyst, is extremely cheap compared to palladium, and has a low price fluctuation risk. Higher economic efficiency can be expected.
- the electroless plating catalyst and the method for producing a metal film of the present invention the number of steps can be reduced from the conventionally used electroless plating step, and the process cost can be greatly reduced. Since it is possible, it is industrially useful.
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Abstract
Description
(2)スズ-パラジウム混合コロイド溶液に浸漬して、被めっき物にコロイドを付着させた後、硫酸などの酸性溶液からなるアクセレーター溶液に浸漬して、過剰のスズイオンを溶解させ、触媒活性を発現させる方法(キャタリスト-アクセラレーター法)。
<化合物(X)>
本発明で用いる無電解めっき用触媒は、カルボキシ基、リン酸基、亜リン酸基、スルホン酸基、スルフィン酸基及びスルフェン酸基からなる群から選ばれる1種以上のアニオン性官能基を有する(メタ)アクリル酸系単量体、すなわちアクリロイル基又はメタクリロイル基を有する重合性単量体を含有する単量体混合物(I)を重合してなる化合物(X)と、金属ナノ粒子(Y)との複合体であり、それを水系溶媒に分散した触媒液として用いることができる。
前述のように、本発明の無電解めっき用触媒は、前記の化合物(X)をコロイド保護剤として製造した、銀、銅、パラジウム等の金属ナノ粒子(Y)との複合体である。
本発明の無電解めっき用触媒は、前記複合体を水性媒体中に分散させた触媒液として用いられ得る。被めっき物への吸着量を確保し、且つめっき皮膜の被めっき物との密着性を良好にする点から、無電解めっき用触媒の濃度(不揮発分濃度)が0.05~5g/Lの範囲であることが好ましく、特に経済性を加味すると、その濃度が0.1~2g/Lの範囲に調整することがより好ましく、0.2~2g/Lの範囲に調整することが特に好ましい。
本発明の無電解めっき用触媒の分散液(無電解めっき用触媒液)を用いてめっき処理を施すことができる被めっき物は、前述の複合体を吸着させ得る基材であればよく、特に限定されるものではない。例えば、素材としては、ガラス繊維強化エポキシ、エポキシ系絶縁材、ポリイミド、PET等のプラスチック類、ガラス、セラミック、金属酸化物、金属、紙、合成又は天然繊維などの材質を1種又は複数種を組み合わせてなるものであり、その形状としては、板状、フィルム状、布状、繊維状、チューブ状等のいずれであってもよい。特に、吸着させる複合体を水性分散体として用いる場合には、被めっき物としては、水にぬれる傾向を示す、即ち、被めっき物表面の水接触角が75°以下であることが望ましい。また、水にぬれにくい材質からなるものであっても、それを表面処理、例えば、プラズマ照射、コロナ放電、紫外線照射、オゾン処理、エッチングなどを施すか、酸、もしくはアルカリ処理により、表面に親水性を付与することが可能なものであれば、好適に用いることができる。表面処理の方法は、前記の種々の処理方法の1種類、もしくは複数の処理方法を適用することができる。
本発明の無電解めっき用触媒を用いた金属皮膜の製造方法は、従来のパラジウム触媒を用いて行なう無電解めっき金属皮膜作製工程において、パラジウム触媒を、前記の化合物(X)と金属ナノ粒子(Y)からなる複合体に変更した方法であり、本発明の無電解めっき用触媒の触媒効果を得るために適した無電解めっき工程である。
(1)被めっき物表面をカチオン性処理剤(a)で処理する工程、
(2)前記工程(1)後の処理被めっき物を、前記触媒を水性溶媒に分散させた無電解めっき用触媒液に浸漬し、当該処理被めっき物表面上に化合物(X)と金属ナノ粒子(Y)との複合体を吸着させる工程、
(3)前記工程(2)で得られた複合体吸着被めっき物を無電解めっき用の金属イオン液(b)に浸漬する工程
を有することを特徴とする。
本発明の製造方法では、工程(1)において、被めっき物表面をカチオン性処理剤(a)で処理するが、必要に応じて、工程(1)の前に、被めっき物基材表面に付着している物質の除去、被めっき物表面の親水化を目的とする、各種の脱脂工程やエッチング工程を入れることができる。
前記カチオン性処理剤(a)による処理がなされた被めっき物(処理被めっき物)の表面上に、無電解めっき用触媒である金属ナノ粒子を含有する複合体を付与する方法としては特に限定されるものではなく、例えば、触媒液に浸漬する方法、触媒液を処理被めっき物に塗布する方法等を適用できるが、処理被めっき物が微小な構造を有する場合、例えば、積層電子回路基板の層間接続部(スルーホール、ビアホール)など、特に微小な部分へのめっき処理が必要な場合には、触媒液に浸漬する方法が好ましく、この方法によれば、微小部分を有する被めっき物に対して簡単な操作で触媒(金属ナノ粒子複合体)を均一に付与することができる。
上記の工程(1)及び工程(2)を経て得られた複合体吸着被めっき物を無電解めっき用の金属イオン液(b)(無電解めっき液)に浸漬することにより、被めっき物表面上に金属皮膜を形成することができる。
無電解めっき液としては、種々の無電解めっき液を使用することができ、この様な無電解めっき液としては、例えば、無電解ニッケルめっき液、無電解銅めっき液等の他、金、銀、パラジウム、ロジウム等の貴金属の無電解めっき液を挙げることができる。これら無電解めっき液は市販されており、使用目的に応じて、適宜選択、購入して使用するのが簡便である。
1H-NMR:日本電子株式会社製、AL300、300Hz
TEM観察:日本電子株式会社製、JEM-2200FS
電気伝導度:株式会社堀場製作所製、B-173
SEM観察:株式会社日立ハイテクノロジーズ社製 S-3400
TG-DTA測定:SIIナノテクノロジー株式会社製、TG/DTA6300
プラズモン吸収スペクトル:株式会社日立製作所製、UV-3500
動的散乱粒径測定装置:大塚電子株式会社製、FPAR-1000
表面抵抗率測定:三菱化学株式会社製、低抵抗率計ロレスタEP(4端子法)
触媒吸着量:SIIナノテクノロジー株式会社製、ICP発光分析装置 SPS3100
本発明で用いる複合体、及びその水性分散体は、特開2010-209421号公報、特許4697356号公報をもとに、下記のように行なった。
〔リン酸基を有する化合物(X-1)の合成〕
窒素雰囲気下、反応容器にエタノール210gと2-ブタノン174gを入れ、攪拌しながら75℃に加熱した。ここにライトエステルP-1M(共栄社化学株式会社製)600gをエタノール90gと2-ブタノン90gとの混合溶媒に溶解させた混合溶液を3.5時間かけて滴下し、重合開始剤「V-59」3g、連鎖移動剤(3-メルカプトプロピオン酸メチル)18gを2-ブタノン30gに溶解させたものを4.5時間かけて同時に滴下した。反応開始から21時間後に加熱を停止し、室温まで空冷の後、蒸留水300gを添加した。ロータリーエバポレータで溶剤を減圧留去し、蒸留水100gを足して再び減圧留去を行い、残液をポリプロピレンメッシュで濾過して、アニオン性官能基としてリン酸基を有する化合物(X-1)の水溶液を得た(1,030g、不揮発分58.8%、酸価488)。当該樹脂(化合物(X-1))のゲルパーミエーション・クロマトグラフィーにより測定された質量平均分子量は5,000程度であった。
反応容器に、前記合成で得られたリン酸基を有する化合物(X-1)の水溶液14.6gを2-ジメチルアミノエタノール31g(0.35mol)、65%硝酸34g(0.35mol)、蒸留水39gの混合物に溶解させたものを入れ、更に150gの硝酸銀を150gの蒸留水に溶解させたものを添加し、最後に2-ジメチルアミノエタノール34.5g(0.39mol)を添加した。反応容器を油浴に浸け、内温50℃で4時間加熱し、茶黒色の分散体を得た。
〔カルボキシ基を有する化合物(X-2)の合成〕
メチルエチルケトン(以下、MEK)70部を、窒素気流中80℃に保ち、攪拌しながらメタクリル酸10部、メタクリル酸ベンジル10部、ブレンマーPME-1000(日油株式会社製)80部、チオグリコール酸2部、MEK80部、及び重合開始剤(「パーブチル(登録商標)O、日油株式会社製)4部からなる混合物を2時間かけて滴下した。滴下終了後、「パーブチル(登録商標)O」2部を添加し、80℃で更に22時間攪拌した。得られた反応混合物に水を加え、減圧脱溶剤した後、水で不揮発分量を調整した。このようにして、アニオン性官能基としてカルボキシ基有する化合物(X-2)の水溶液を得た(不揮発分33%)。当該樹脂(化合物(X-2))のゲルパーミエーション・クロマトグラフィーにより測定された質量平均分子量は10,000、酸価は76.5mgKOH/gであった。
上記の合成で得た化合物(X-2)(固形分に換算して0.578g)を水12mLに溶解し、これに1mol/L硝酸12mLを加えた。硝酸銀2.00g(11.77mmol)を水35mLに溶解したものをこれに加え、トリエタノールアミン8.78g(58.85mmol)を加えて60℃で2.5時間攪拌した。得られた懸濁液を限外濾過ユニット(ザルトリウス・ステディム社ビバスピン20、分画分子量10万、4個)で濾過した。濾過残渣に精製水を加えて再び遠心濾過することを4回繰り返し、得られた残渣に水を加えると、化合物(X-2)と銀ナノ粒子の複合体の水性分散体4.23gが得られた(固形分約30w/w%、固形分中の銀含量94.8%(TG-DTA)、粒子径5~40nm(TEM))。
〔化合物(X-2)と銅ナノ粒子との複合体の水性分散体の合成〕
前記合成例2で得られた化合物(X-2)(固形分に換算して2.00g)を水40mLに溶解し、酢酸銅水和物10.0g(50.09mmol)を水500mLに溶解したものを加えた。これに穏やかに発泡が起こるよう80%ヒドラジン水溶液10g(約160mmol)を約2時間かけて滴下し、発泡得が止むまで室温で更に1時間攪拌すると、濃褐色の溶液が得られた。
〔リン酸基を有する化合物(X-3)の合成〕
窒素雰囲気下、反応容器にエタノール210gと2-ブタノン174gを入れ、攪拌しながら75℃に加熱した。ここに、ライトエステルP-1M(共栄社化学株式会社製)120g、ブレンマーPME-1000(日油株式会社製)450g、ブレンマーPME-100(日油株式会社製)30gをエタノール90gと2-ブタノン90gに溶解させた混合溶液を3.5時間かけて滴下し、重合開始剤「V-59」3g、連鎖移動剤(3-メルカプトプロピオン酸メチル)18gを2-ブタノン30gに溶解させたものを4.5時間かけて同時に滴下した。反応開始から21時間後に加熱を停止し、室温まで空冷の後、蒸留水300gを添加した。ロータリーエバポレータで溶剤を減圧留去し、蒸留水100gを足して再び減圧留去を行い、残液をポリプロピレンメッシュで濾過してアニオン性官能基としてリン酸基を有する化合物(X-3)の水溶液を得た(950g、不揮発分62.6%、酸価99)。当該樹脂(化合物(X-3))のゲルパーミエーション・クロマトグラフィーにより測定された質量平均分子量は7,000程度であった。
1H-NMR(CD3OD)測定結果:
δ(ppm):3.85~4.45(bs),3.45~3.75(bs),3.20~3.40,2.65~2.95(bs),2.40~2.65(bs),1.75~2.35(bs),0.75~1.50(m)
反応容器に、前記で得られた化合物(X-3)の水溶液15.5gを2-ジメチルアミノエタノール155g(1.75mol)、65%硝酸170g(1.75mol)、蒸留水195gの混合物に溶解させたものを入れ、更に150gの硝酸銀を150gの蒸留水に溶解させたものを添加し、最後に2-ジメチルアミノエタノール172.5g(1.95mol)を添加した。反応容器を油浴に浸け、内温50℃で4時間加熱し、茶黒色の分散体を得た。
〔化合物(X-3)と銅ナノ粒子との複合体の水性分散体の合成〕
反応容器に、前記合成例4で得られた化合物(X-3)の水溶液3.19g(固形分に換算して2.00g)を量り取り、水40mLで希釈した。これに、酢酸銅水和物10.0g(50.09mmol)を水500mLに溶解して加えた。この溶液に、穏やかに発泡が起こるよう80%ヒドラジン水溶液10g(約160mmol)を約2時間かけて滴下し、発泡が止むまで更に室温で1時間攪拌すると、赤褐色の溶液が得られた。
〔化合物(X-3)とパラジウムナノ粒子との複合体の水性分散体の合成〕
前記合成例4で得られた化合物(X-3)(固形分に換算して0.102g)を水5mLに溶解し、硝酸パラジウム(II)(585mg、2.54mmol)を水5mLに溶解したものを加えた。これにジメチルアミノエタノール1.81g(20.31mmol)と水5mLの混合物を加え、室温で2時間攪拌した。これを限外濾過ユニット(ザルトリウス・ステディム社製「ビバスピン20」、分画分子量5万、2個)に分け入れ、遠心力(5800G)により濾過を行った。濾過残渣に精製水を加えて再び遠心濾過することを4回繰り返し、得られた残渣に水を加えて全量2.5gとすると、化合物(X-3)とパラジウムナノ粒子との複合体の水性分散体が得られた(固形分約10w/w%)。この水性分散体は茶色であり、その一滴をエタノール(50mL)に溶解して紫外可視吸収スペクトルを測定すると、約520nm付近に弱い吸収が確認された。
〔スルホン酸基を有する化合物(X-4)の合成〕
70w/w%エタノール40部を、窒素気流中80℃に保ち、攪拌しながら2-アクリルアミド-2-メチルプロパンスルホン酸10部、メトキシポリエチレングリコールメタクリレート(分子量100)5部、メトキシポリエチレングリコールメタクリレート(分子量1000)85部、β-メルカプトプロピオン酸メチル5部、70w/w%エタノール80部からなる混合物、及び重合開始剤「パーブチル(登録商標)O」(日油株式会社製)0.5部、エタノール5部からなる混合物を2時間かけて滴下した。滴下終了後、「パーブチル(登録商標)O」1部を添加し、80℃で12時間攪拌した。
上記の合成で得た化合物(X-4)0.245g(固形分に換算して0.098g)を水6mLに溶解し、これに1mol/L硝酸6mLを加えた。硝酸銀1.00g(5.89mmol)を水17.5mLに溶解したものをこれに加え、トリエタノールアミン4.39g(29.43mmol)を加えて60℃で2.5時間攪拌した。得られた懸濁液を限外濾過ユニット(ザルトリウス・ステディム社製「ビバスピン20」、分画分子量10万、2個)で濾過した。濾過残渣に精製水を加えて再び遠心濾過することを4回繰り返し、得られた残渣に水を加えて全量を2.1gの分散液とすると、化合物(X-4)と銀ナノ粒子との複合体の水性分散体が得られた(固形分約30w/w%、固形分中の銀含量96.2%(TG-DTA)、粒子径40~50nm(TEM))。
特許文献3の実施例1に基づき、硝酸銀50μmolを純水94mLに溶解した溶液を激しく撹拌しながら、この溶液にステアリルトリメチルアンモニウムクロライド10mgを含む水溶液1mL及び水素化ホウ素ナトリウム200μmolを含む水溶液5mLを順次注入したところ、溶液の色が黄褐色に変化し、銀粒子を0.5mg含有する均一透明な銀ヒドロゾル100mLが得られた。
特許文献3に基づき、界面活性剤であるステアリルトリメチルアンモニウムクロライドの代わりにドデシルベンゼンスルホン酸ナトリウムを用いた以外は、比較合成例1と同様にして、均一透明なヒドロゾルを調製した。
特許文献3に基づき、界面活性剤であるステアリルトリメチルアンモニウムクロライドの代わりにポリエチレングリコール-p-ノニルフェニルエーテルを用いた以外は、比較合成例1と同様にして、均一透明なヒドロゾルを調製した。
特許文献3に基づき、界面活性剤であるステアリルトリメチルアンモニウムクロライドの代わりにドデシルベンゼンスルホン酸ナトリウム5mgとポリエチレングリコール-p-ノニルフェニルエーテル5mgと含む水溶液1mLを用いた以外は、比較合成例1と同様にして、均一透明なヒドロゾルを調製した。
特許文献3に基づき、界面活性剤であるステアリルトリメチルアンモニウムクロライドの代わりに水溶性高分子であるポリビニルピロリドンを用いた以外は、比較合成例1と同様にして、均一透明なヒドロゾルを調製した。
比較合成例1~5で得た銀ヒドロゾルを、エバポレータで0.5g/Lとなるように濃縮したところ、いずれの場合にも、銀コロイドの凝集が認められ、安定な分散液が得られなかった。
触媒液-1~7を用いて、下記の被めっき物に対し、下記の工程により無電解めっきを行った。
1.ガラス繊維強化エポキシ樹脂板:FR4規格銅張基板(基板厚み1.6mm、銅箔厚み18μm)。
FR4基板(基板厚み0.8mm、銅箔厚み18μm)の銅箔表面を、「CZ8100」及び「CZ8300」(メック株式会社製)に浸漬して粗面化処理した後、エポキシ樹脂系絶縁材料「ABF-GX13」(40μm厚)、もしくは「ABF-GX92」(40μm厚)を、真空ラミネートした後、デスミア処理を行ったもの。
1)膨潤工程:60℃に設定した、OPC-1080コンディショナー(奥野製薬工業株式会社製)500mL/L、水酸化ナトリウム15g/Lを加えた水1Lに、基材を10分間浸漬した後、水洗した。
2)マイクロエッチング工程:85℃に設定した、KMnO430g/L、「OPC1200エポエッチ」(奥野製薬工業株式会社製)200mL/Lを加えた水1Lに、1)で処理した基材を20分間浸漬した後、水洗した。
3)中和工程:45℃に設定した、OPC-1300ニュートライザー(奥野製薬工業株式会社製)200mL/Lを加えた水1Lに、2)の処理を行った基材を5分間浸漬した後、水洗を行い、デスミア処理を行った。
1.脱脂及びコンディショニング工程:
脱脂・コンディショニング剤(OPCコンディクリーンFCR、奥野製薬工業株式会社製)25mLを水に溶かし500mLとし、65℃に保持した。これに被めっき物を5分間浸漬した。この工程により被めっき物表面の脱脂とカチオン化を行い、その後、温水で2分間洗浄し、続いて流水洗浄を2分間行った。
過硫酸ナトリウム50g及び98%精製硫酸2.5mLを水に溶かして500mLとし、25℃に保持した。これに、前記脱脂及びコンディショニング工程後の処理被めっき物を2分間浸漬し、その後、流水洗浄を2分間行った。
98%精製硫酸50mLを水に溶かし、500mLとし、25℃に保持した。これに、前記ソフトエッチング工程後の処理被めっき物を2分間浸漬した後、流水洗浄を2分間行った。更に純水で1分間洗浄した。
前記触媒液-1~7を、25℃に保持し、これに前記脱スマット工程後の処理被めっき物をそれぞれ5分間浸漬して当該処理被めっき物の表面に複合体を吸着させた。
無電解銅めっき薬液(「MOON-700カッパー-1」(15mL)、「MOON-700カッパー―2」(15mL)、「MOON-700カッパー―3」(100mL)、いずれも奥野製薬工業株式会社製)を水に混合して500mLとし、45℃に保持した。これに前記触媒付与工程後の処理被めっき物を15分間浸漬して、銅めっき皮膜を析出させた。
〔銅めっき皮膜の評価〕
1.皮膜被覆率(%):
被めっき物の面積と、銅めっき皮膜が形成された面積を計測し、その割合から算出した。
100倍の顕微鏡下、スルーホール部の裏から光を照射し、光透過の程度を観察することでスルーホールのめっき充填度を評価した。
銅めっき皮膜をGa収束イオンビーム法(FIB法)で切断し、断面をSEMにより観察した。これにより、ビアホール部のめっき付き回り性の良否を判断した。
前記実施例1で用いた触媒液に代えて、市販のパラジウム-錫コロイド液を使用し、実施例1と同様の被めっき物に対して、無電解めっきを行った。工程1~3については、実施例1と同様であったが、更に、下記の様に、プリディップ、活性化工程の2工程が必要な煩雑な工程であった。
プリディップ液(「OPC-SAL-M」、奥野製薬工業株式会社製)130gを水で希釈して500mLとし、25℃に保持した。これに前記脱スマット工程後の処理被めっき物を1分間浸漬した。
プリディップ液(OPC-SAL-M、奥野製薬工業株式会社製)130gとSn-Pdコロイド触媒液(OPC-90キャタリスト、奥野製薬工業株式会社製)15mLを水で希釈して500mLとし、25℃に保持した。これに前記プリディップ工程後の処理被めっき物を5分間浸漬した後、流水洗浄を2分間行った。
活性化液(「OPC-505アクセレーターA」、奥野製薬工業株式会社製)50mL及び活性化液(「OPC-505アクセレーターB」、奥野製薬工業株式会社製)4mLを水で希釈して500mLとし、30℃に保持した。これに前記触媒化合物の付与工程後の処理被めっき物を5分間浸漬した後、流水洗浄を2分間行った。
前記のMOON-700カッパーシリーズ(奥野製薬工業株式会社製、無電解銅めっき薬原液)を用いる無電解銅めっきにより、前記活性化工程後の処理被めっき物に銅めっき皮膜を形成した。
前記実施例1で用いた触媒液に代えて、市販のパラジウムコロイド液を使用し、実施例1と同様の被めっき物に対して、下記の工程によって無電解めっきを行った。プリディップ工程、活性化工程を必要とするため、実施例1と比較して2工程を多く必要とする煩雑な工程であった。
脱脂・コンディショニング剤(「OPC-370コンディクリーンMA」、奥野製薬工業株式会社製)50mLを水に溶かし500mLとし、65℃に保持した。これに被めっき物を5分間浸漬した。この工程により被めっき物表面の脱脂とカチオン化を行い、その後、温水で2分間洗浄し、続いて流水洗浄を2分間行った。
実施例1と同様の過硫酸ナトリウムを用いるソフトエッチングを行った。
実施例1と同様の硫酸を用いる脱スマットを行った。
プリディップ液(「OPCプリディップ49L」、奥野製薬工業株式会社製)5mL及び98%精製硫酸0.75mLを水に溶かし500mLとし、25℃に保持した。これに前記脱スマット工程後の処理被めっき物を1分間浸漬した。
Pdコロイド触媒前駆体液(OPC-50インデューサーAならびにOPC-50インデューサーC、いずれも奥野製薬工業株式会社製)各25mLを水に溶かし500mLとし、40℃に保持した。これに前記脱プリディップ工程後の処理被めっき物を5分間浸漬した後、流水洗浄を2分間行った。
活性化液(OPC-150クリスターMU、奥野製薬工業株式会社製)75mLを水に溶かし500mLとし、25℃に保持した。これに触媒化合物の付与工程後の処理被めっき物を5分間浸漬した後、流水洗浄を2分間行った。
前記のMOON-700カッパーシリーズ(奥野製薬工業株式会社製、無電解銅めっき薬原液)を用いる無電解銅めっきにより、前記活性化工程後の処理被めっき物に銅めっき皮膜を形成した。
前記実施例1で用いた触媒液に代えて、市販の錫-銀コロイド触媒液を使用し、実施例1と同様の被めっき物に対して、下記の工程によって無電解めっきを行った。Snを除去するための活性化工程を必要とするため、実施例1と比較して1工程を多く必要とする煩雑な工程であった。
脱脂・コンディショニング剤(MOON-300コンディクリーン、奥野製薬工業株式会社製)50mLを水に溶かし500mLとし、60℃に保持した。これに被めっき物を5分間浸漬した。この工程により被めっき物表面の脱脂とカチオン化を行い、その後、温水で2分間洗浄し、続いて流水洗浄を2分間行った。
実施例1と同様の過硫酸ナトリウムを用いるソフトエッチングを行った。
実施例1と同様の硫酸を用いる脱スマットを行った。
Sn-Ag触媒液(「MOONー-500キャタリスト」、奥野製薬工業株式会社製)を25℃に保持した。これに前記脱スマット工程後の処理被めっき物を5分間浸漬した後、流水洗浄を2分間行った。
活性化液(「MOON-600アクセレーター」、奥野製薬工業株式会社製)50mLを水に溶かし500mLとし、45℃に保持した。これに前記触媒化合物の付与工程後の処理被めっき物を5分間浸漬した後、流水洗浄を2分間行った。
前記のMOON-700カッパーシリーズ(奥野製薬工業株式会社製、無電解銅めっき薬原液)を用いる無電解銅めっきにより、前記活性化工程後の処理被めっき物に銅めっき皮膜を形成した。
実施例1において、触媒液を比較触媒液-1~5に変えた以外は、実施例1と同様にして、被めっき物に無電解めっきを行った。
実施例1で作製した、ABF-GX92をラミネートしたビルドアップ基板用層間絶縁材に、孔径70μmのビアホールを形成した基材を用い、触媒液-4及び、比較例1で用いたSn-Pdコロイド触媒を用いて、実施例1と同様にして、被めっき物表面上に無電解めっきを行った。ビアホール内へのめっき付き回り性を確認するため、ビアホール部をFIB法で切断し、断面のSEM観察を行ったところ、Sn-Pdコロイド触媒と比べて2工程少ない、簡便な方法によって、同等のめっき付き回り性を示すことが確認できた。図1に、触媒液-4を用いてめっき処理を行った基材の断面SEM写真を、図2に、比較例1で用いたSn-Pd触媒液を用いてめっき処理を行った基材の断面SEM写真、それぞれ示す。
上記とは別の脱脂・コンディショニング剤及び無電解銅めっき薬液を使用する態様として、触媒液-1~8を用いて、下記の被めっき物に対し、下記の工程により無電解めっきを行った。
上記の無電解めっき工程中、工程1の脱脂・コンディショニング剤としてNACEコンディショナー(奥野製薬工業株式会社製)を使用し(使用量は50mL)、工程5の無電解銅めっき薬液としてNACEカッパー-1(15mL)、NACEカッパー-2(15mL)、NACEカッパー-3」(100mL)(いずれも奥野製薬工業株式会社製)を使用し、工程5中の保持温度を40℃に変更する以外は、上記の無電解めっき工程と同様にして銅めっき皮膜を析出させた。
得られためっき皮膜の評価は、実施例1と同様に行い結果は表3に示す。
また、本発明の無電解めっき用触媒である複合体は、電子回路基板製造のような信頼性が求められるめっき触媒の用途にも好適に用いることができる。
更に、本発明の無電解めっき用触媒を用いて得られる金属皮膜は、従来のパラジウム系触媒で得られるめっき皮膜に比べて遜色がなく、パラジウムに比べて極めて安価で、価格変動リスクも少ないため、より高い経済性が期待できる。
更にまた、本発明の無電解めっき用触媒、及び金属皮膜の製造方法を用いることで、従来用いられている無電解めっき工程から、工程数を減じることができ、プロセスコストを大きく低減することが可能であるので、産業上有用である。
Claims (8)
- カルボキシ基、リン酸基、亜リン酸基、スルホン酸基、スルフィン酸基及びスルフェン酸基からなる群から選ばれる1種以上のアニオン性官能基を有する(メタ)アクリル酸系単量体を含有する単量体混合物(I)を重合してなる化合物(X)と、金属ナノ粒子(Y)との複合体であることを特徴とする無電解めっき用触媒。
- 前記単量体混合物(I)が、更に、エチレングリコールの平均ユニット数が20以上のポリエチレングリコール鎖を有する(メタ)アクリル酸系単量体を含有する請求項1に記載の無電解めっき用触媒。
- 前記化合物(X)の質量平均分子量が3,000~20,000の範囲である請求項1又は2に記載の無電解めっき用触媒。
- 前記金属ナノ粒子(Y)の金属種が、銀、銅又はパラジウムである請求項1~3の何れか1項に記載の無電解めっき用触媒。
- 前記金属ナノ粒子(Y)の透過型電子顕微鏡写真から求められる平均粒子径が0.5~100nmの範囲である請求項1~4の何れか1項に記載の無電解めっき用触媒。
- 前記単量体混合物(I)が、(メタ)アクリル酸、リン酸基含有(メタ)アクリル酸及びスルホン酸基含有(メタ)アクリル酸からなる群から選ばれる1種以上のアニオン性官能基を有する(メタ)アクリル酸系単量体を含有する請求項1~5の何れか1項に記載の無電解めっき用触媒。
- 請求項1~6の何れか1項に記載の無電解めっき用触媒を用いて無電解めっきを行って得られたものであることを特徴とする金属皮膜。
- 無電解めっき金属皮膜を製造する方法であって、
カルボキシ基、リン酸基、亜リン酸基、スルホン酸基、スルフィン酸基及びスルフェン酸基からなる群から選ばれる1種以上のアニオン性官能基を有する(メタ)アクリル酸系単量体を含有する単量体混合物(I)を重合してなる化合物(X)と、金属ナノ粒子(Y)との複合体を触媒とし、(1)被めっき物表面をカチオン性処理剤(a)で処理する工程、(2)前記工程(1)後の処理被めっき物を、前記触媒を水性溶媒に分散させた無電解めっき用触媒液に浸漬し、当該処理被めっき物表面上に前記化合物(X)と前記金属ナノ粒子(Y)との複合体を吸着させる工程、及び(3)前記工程(2)で得られた複合体吸着被めっき物を、無電解めっき用の金属イオン液(b)に浸漬する工程、を有することを特徴とする金属皮膜の製造方法。
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EP14813518.9A EP2930256B1 (en) | 2013-06-21 | 2014-06-16 | Method for producing a metallic coating film |
US14/761,106 US20160215399A1 (en) | 2013-06-21 | 2014-06-16 | Catalyst for electroless plating, metal film produced using same, and method for producing said metal film |
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JP6269909B1 (ja) * | 2016-08-25 | 2018-01-31 | Dic株式会社 | 金属ナノ粒子水分散液 |
TWI707923B (zh) * | 2017-05-19 | 2020-10-21 | 日商迪愛生股份有限公司 | 金屬奈米粒子水分散液 |
JP6943050B2 (ja) * | 2017-07-18 | 2021-09-29 | Dic株式会社 | 金属ナノ粒子水分散液 |
JP7005363B2 (ja) * | 2018-01-29 | 2022-01-21 | マクセル株式会社 | メッキ膜被覆体の製造方法及び前処理液 |
KR102621646B1 (ko) * | 2018-03-06 | 2024-01-05 | 닛산 가가쿠 가부시키가이샤 | 고분자 및 금속미립자를 포함하는 무전해도금하지제 |
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EP2930256B1 (en) | 2018-11-07 |
KR20150083934A (ko) | 2015-07-20 |
KR20160045907A (ko) | 2016-04-27 |
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