WO2014176828A1 - 柔性基板、显示装置及在柔性基板上贴附电子器件的方法 - Google Patents

柔性基板、显示装置及在柔性基板上贴附电子器件的方法 Download PDF

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Publication number
WO2014176828A1
WO2014176828A1 PCT/CN2013/079369 CN2013079369W WO2014176828A1 WO 2014176828 A1 WO2014176828 A1 WO 2014176828A1 CN 2013079369 W CN2013079369 W CN 2013079369W WO 2014176828 A1 WO2014176828 A1 WO 2014176828A1
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WO
WIPO (PCT)
Prior art keywords
attachment
sub
bending line
flexible substrate
auxiliary
Prior art date
Application number
PCT/CN2013/079369
Other languages
English (en)
French (fr)
Inventor
周伟峰
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP13840117.9A priority Critical patent/EP2993660B1/en
Priority to US14/348,481 priority patent/US9651996B2/en
Priority to JP2016509261A priority patent/JP2016526275A/ja
Priority to KR1020147010719A priority patent/KR101626685B1/ko
Publication of WO2014176828A1 publication Critical patent/WO2014176828A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1026—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina with slitting or removal of material at reshaping area prior to reshaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1043—Subsequent to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1051—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by folding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y10T428/24182—Inward from edge of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/2419—Fold at edge
    • Y10T428/24215—Acute or reverse fold of exterior component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/2419—Fold at edge
    • Y10T428/24264—Particular fold structure [e.g., beveled, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Definitions

  • the present invention relates to a flexible substrate, a display device, and a method of attaching an electronic device to a flexible substrate. Background technique
  • LCDs liquid crystal display devices
  • OLEDs organic electroluminescent display devices
  • the display areas such as smart cards, electronic paper, smart label applications, etc., cover almost all applications that can be applied to traditional display devices, and thus gradually become the new darling of display technology.
  • an integrated circuit chip for example, COG IC-chip on glass IC, that is, a chip directly attached to a carrier glass substrate, is suitable for an LCD of consumer electronic products.
  • OLEDs such as mobile phones, PDAs, etc. or flexible printed circuit boards (FPC: Flexible Printed Circuit), bonded or bonded to flexible substrates via anisotropic conductive film (ACF: Anisotropic Conductive Film)
  • ACF Anisotropic Conductive Film
  • the plastic substrate is generally thin (with a thickness ranging from 25 to 125 ⁇ m) and is soft, an integrated circuit chip or a flexible wiring board is attached to the flexible substrate.
  • the plastic substrate is easily deformed, thereby affecting the adhesion accuracy and the contact effect of the electronic device, thereby causing a process problem of inaccurate alignment or poor contact.
  • One of the solutions is: pre-setting a plastic substrate as a flexible substrate on a rigid carrier, For example: On the glass substrate, a higher hardness is obtained for attachment, and the plastic substrate is removed from the rigid carrier after the attachment is completed.
  • a high process stability and a clean environment are required, otherwise It is easy to cause the attached bubbles on the bonding surface, which in turn affects the subsequent process preparation.
  • Another solution is to replace the flexible substrate with a thicker plastic substrate.
  • a plastic substrate suitable as a flexible substrate for a display device is expensive, so that the cost of the flexible display device is drastically increased.
  • the use of thick plastic substrates has the following disadvantages: First, due to the large difference in thermal expansion coefficient between the plastic substrate and the glass substrate, in the heating process after the attaching process, the thick plastic substrate and the glass substrate are thermally expanded and cooled. The difference in shrinkage and the inherent heat shrinkage characteristics of the plastic substrate cause the plastic substrate to be warped after the heating process is completed. Second, the thicker plastic substrate is more rigid and does not easily conform to the glass substrate.
  • the attached surface causes the attached air bubbles, and under vacuum heating, the bubbles will agglomerate and expand, thereby affecting the flatness between the two. It can be seen that the proposal to use a thicker plastic substrate as a flexible substrate has yet to be improved.
  • Embodiments of the present invention provide a flexible substrate, a display device, and a method of attaching an electronic device to a flexible substrate.
  • the flexible substrate has a low cost, and the method of attaching the electronic device on the flexible substrate can ensure a better attaching effect, thereby ensuring a better display quality of the display device.
  • An aspect of the invention provides a flexible substrate including a bottom plate, the bottom plate including an attaching portion for attaching an electronic device, and an auxiliary attaching portion integrally formed with the attaching portion, the auxiliary attaching portion and the auxiliary attaching portion
  • the attaching portions are disposed opposite to each other, and the attaching portion completely falls into the auxiliary in a right projection direction The area where the attachment is located.
  • a first bending line is disposed between the attaching portion and the auxiliary attaching portion, and the auxiliary attaching portion includes a first sub-adhering portion, and an area of the first sub-adhering portion is greater than or equal to The area of the attaching portion, the first sub-attachment portion is bent along the first bending line and disposed on a back surface of the attaching portion.
  • the auxiliary attaching portion further includes a second sub-attachment portion having at least one laminate, and a second bending line is disposed between the first sub-adhering portion and the second sub-adhering portion.
  • the second sub-attachment portion is bent along the second bending line and disposed on the back surface of the first sub-attachment portion.
  • a groove along the thickness direction of the attaching portion is opened at a position corresponding to the first bending line and/or the second bending line on the bottom plate, and the depth of the groove is smaller than the a thickness of the attaching portion; or a plurality of through holes disposed along a thickness direction of the attaching portion or at a position corresponding to the first bending line and/or the second bending line on the bottom plate or Blind hole.
  • a third bending line is disposed between adjacent stacks in the second sub-attachment portion, and a second sub-attachment is provided on the bottom plate corresponding to the position of the third bending line a groove in a thickness direction of the portion, the groove having a depth smaller than a thickness of the laminate in the second sub-attachment portion; or, opening at a position corresponding to the third bending line on the bottom plate
  • There are a plurality of through holes or blind holes provided along the thickness direction of the laminate in the second sub-attachment portion.
  • auxiliary attachment portion and the attachment portion are made of the same material.
  • the auxiliary attachment portion is a removable auxiliary attachment portion.
  • Another aspect of the present invention provides a display device including the above-described flexible substrate.
  • Another aspect of the present invention provides a method of attaching an electronic device to a flexible substrate, comprising the steps of attaching an electronic device to an attaching portion in a bottom plate of the flexible substrate, and attaching an electronic component to the attaching portion Before the step of the device, the method further includes: forming an auxiliary attaching portion disposed opposite to the attaching portion, and causing the attaching portion to completely fall into an area where the auxiliary attaching portion is located in a right projection direction .
  • the step of forming the auxiliary attaching portion disposed opposite to the attaching portion, and causing the attaching portion to completely fall into the region where the auxiliary attaching portion is located in the orthographic projection direction includes:
  • the extended portion is bent toward the back surface of the attaching portion such that the extended portion forms an auxiliary attaching portion provided opposite to the attached portion.
  • a first bending line is disposed between the attaching portion and the extending portion, and the extending portion and the attaching portion are made of the same material, and the extending portion is provided with a first extending portion.
  • the area of the first extension portion is greater than or equal to the area of the attachment portion, and the first extension portion is bent along the first bending line and disposed on the back surface of the attachment portion, that is, the first extension portion A first sub-attachment portion is formed.
  • the method further includes: forming a groove along a thickness direction of the attaching portion on a position corresponding to the first bending line on the bottom plate, the groove having a depth smaller than the attaching portion
  • a plurality of through holes or blind holes are formed in the thickness direction of the attaching portion on the bottom plate corresponding to the position of the first bending line.
  • the method further includes: the extension portion further includes a second sub-extension portion, and the second sub-extension portion and the second sub-extension portion are disposed with a second bending line, the second The sub-extension portion is bent along the second bending line and disposed on a back surface of the first sub-attachment portion, that is, the second extension portion forms a second sub-adhering portion.
  • the method further includes: disposing the second extension portion to have at least one laminate, and providing a third bending line between adjacent ones of the second sub-extension portions, in the extension portion a groove along the thickness direction of the extending portion is disposed at a position corresponding to the second bending line and/or the third bending line, the depth of the groove is smaller than the thickness of the extending portion; or For example, a plurality of through holes or blind holes disposed along the thickness direction of the extending portion are formed on the extension portion corresponding to the second bending line and/or the third bending line position.
  • the method further includes: removing the auxiliary attaching portion.
  • the flexible substrate provided by the present invention is provided with an auxiliary attaching portion beside the attaching portion for attaching an electronic device such as an IC or an FPC.
  • the auxiliary attaching portion can strengthen the strength of the attaching portion, thereby improving the alignment accuracy and contact characteristics of the electronic device, thereby improving the yield of the flexible display device, and the cost is higher. low.
  • Figure la is a schematic front view of a flexible substrate structure before bending in Embodiment 1 of the present invention, wherein an extension portion is provided on one side of the attachment portion of the flexible substrate;
  • Figure 1b is a schematic plan view of the flexible substrate structure before bending in Embodiment 1 of the present invention shown in Figure la;
  • FIG. 2 is a schematic front view showing a structure of a flexible substrate after bending according to Embodiment 1 of the present invention, wherein an extension portion of the drawing La-lb is bent at a back surface of the attaching portion to form an auxiliary attaching portion;
  • FIG. 3a is a schematic front view of a flexible substrate structure before bending according to Embodiment 2 of the present invention, wherein an extension portion is provided on one side of the attachment portion of the flexible substrate;
  • Figure 3b is a schematic plan view of the flexible substrate structure before bending in the embodiment 2 of the present invention shown in Figure 3a;
  • FIG. 4a is a schematic front view showing a structure of a flexible substrate before bending according to Embodiment 3 of the present invention, wherein a schematic structural view of an extending portion is provided on one side of the attaching portion of the flexible substrate;
  • Figure 4b is a schematic plan view of the flexible substrate structure before bending in the embodiment 3 of the present invention shown in Figure 4a;
  • Figure 5 is a schematic front view showing the structure of the flexible substrate after bending according to Embodiment 3 of the present invention, wherein the extending portion of Figures 4a-4b is bent at the back of the attaching portion to form an auxiliary attaching portion;
  • Figure 6a is a schematic front view showing the structure of a flexible substrate before bending in Embodiment 4 of the present invention, a schematic structural view of the extension portion provided on one side of the attachment portion of the flexible substrate;
  • Figure 6b is a schematic plan view of the flexible substrate structure before bending in the embodiment 4 of the present invention shown in Figure 6a;
  • Figure 7 is a schematic front view showing the structure of the flexible substrate after bending according to Embodiment 4 of the present invention, wherein the extending portion of Figures 6a-6b is bent at the back of the attaching portion to form an auxiliary attaching portion;
  • Figure 8a is a schematic front view showing the structure of a flexible substrate in which the auxiliary attaching portion is cut and removed in Embodiment 5 of the present invention
  • Fig. 8b is a schematic plan view showing the structure of a flexible substrate in which the auxiliary attaching portion is cut and removed in the fifth embodiment of the present invention. detailed description
  • An embodiment of the present invention provides a flexible substrate including a bottom plate, the bottom plate including an attaching portion for attaching an electronic device, and an auxiliary attaching portion integrally formed with the attaching portion, the auxiliary attaching portion
  • the attachment portion is disposed opposite to the attachment portion, and the attachment portion completely falls into a region where the auxiliary attachment portion is located in the right projection direction.
  • One embodiment of the present invention provides a display device including the above flexible substrate.
  • An embodiment of the present invention provides a method of attaching an electronic device on a flexible substrate, comprising the steps of attaching an electronic device to the attaching portion in a bottom plate of the flexible substrate, and attaching the attached portion Before the step of the electronic device, the method further includes: forming an auxiliary attaching portion disposed opposite to the attaching portion, and causing the attaching portion to completely fall into an area where the auxiliary attaching portion is located in a right projection direction step.
  • front surface is the surface on the paper side in the cross-sectional view shown in Fig. 2 (left) , or the plane on the paper shown in Figure 2 (right);
  • back is the surface pointing to the underside of the paper in the cross-sectional view shown in Figure 2 (left), or the paper shown in Figure 2 (right) The plane on the back of the face.
  • Figure 2 shows a flexible substrate comprising a base plate 1.
  • the base plate 1 includes an attaching portion 11 for attaching an electronic device, and further includes an auxiliary attaching portion 12 integrally formed with the attaching portion 11.
  • the auxiliary attaching portion 12 is disposed opposite to the attaching portion 11, and the attaching portion 11 completely falls into the region where the auxiliary attaching portion 12 is located in the orthographic projection direction.
  • the area of the auxiliary attaching portion 12 is greater than or equal to the area of the attaching portion 11, and the area of the attaching portion 11 is not smaller than the area covered by the COG IC to be attached and the FPC pin.
  • a first bending line is disposed between the attaching portion 11 and the auxiliary attaching portion 12.
  • the auxiliary attachment portion 12 includes a first sub-attachment portion 121 having an area greater than or equal to the area of the attachment portion 11.
  • the first sub-attachment portion 121 is bent and disposed on the back of the attaching portion 11 along the first bending line Face.
  • the first sub-attachment portion 121 may refer to a layer that closely fits the back of the attachment portion 11.
  • the thickness of the first sub-attachment portion 121 is equal to the thickness of the attaching portion 11.
  • the thickness of the first sub-attachment portion 121 and the thickness of the attachment portion 11 may also be designed to be unequal.
  • the auxiliary attaching portion 12 and the attaching portion 11 are made of the same material.
  • the auxiliary attachment portion 12 may be polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), fiber reinforced plastic (FRP), polyether. Made of sulfone (PES), polyarylate (PAR) or polycarbonate (PC).
  • PI polyimide
  • PEN polyethylene naphthalate
  • PET polyethylene terephthalate
  • FRP fiber reinforced plastic
  • PES polyether
  • PES polysulfone
  • PAR polyarylate
  • PC polycarbonate
  • auxiliary attachment portion 12 can be removed as needed, for example, the auxiliary attachment portion 12 is a removable auxiliary attachment portion.
  • the electronic device includes the integrated circuit chip 3 or the flexible wiring board 2.
  • the attaching portion 11 includes an FPC attaching area 112 and an IC attaching area 113 (see Fig. la).
  • the FPC attachment area 112 and the IC attachment area 113 are protruded from the other areas of the bottom plate 1.
  • a pin 31 of the integrated circuit chip is attached to the IC attaching area 113, and a pin 21 of the flexible wiring board is attached to the FPC attaching area 112.
  • the present invention also provides a display device, which may include the flexible substrate described above.
  • the present invention also provides a method of attaching an electronic device to a flexible substrate, and specifically includes the step of attaching an electronic device to the attaching portion in the bottom plate of the flexible substrate. Before the step of attaching the electronic device to the attaching portion, the method further includes: forming the auxiliary attaching portion 12 disposed opposite to the attaching portion 11, and causing the attaching portion 11 to completely fall into the auxiliary sticker in the orthographic projection direction. The steps of the area where the appendage 12 is located.
  • the step of forming the auxiliary attaching portion 12 disposed opposite to the attaching portion 11 and causing the attaching portion 11 to completely fall into the region where the auxiliary attaching portion 12 is located in the orthographic projection direction specifically includes: attaching the bottom plate The outer side of the portion is extended to provide an extension portion having an area greater than or equal to the surface of the attachment portion And bending the extension to the back of the attachment portion such that the extension forms an auxiliary attachment portion disposed opposite the attachment portion.
  • the bottom plate 1 is extended to the outside of the attaching portion 11 to provide the extending portion 14, wherein the first bending line 101 is disposed between the attaching portion 11 and the extending portion 14 (in FIG. Specifically shown).
  • the extension portion 14 and the attachment portion 11 are made of the same material.
  • the extension portion 14 includes a first extension portion 141 having an area greater than or equal to the area of the attachment portion 11, and the thickness of the first extension portion 141 is equal to the thickness of the attachment portion 11.
  • the first extension portion 141 is bent and disposed on the back surface of the attaching portion 11 along the first bending line 101, that is, the first sub-adhering portion 121 is formed by the first extension portion 141.
  • the first sub-attachment portion 121 is also the auxiliary attachment portion 12.
  • the first bending line 101 is not shown in FIG. 2, it is understood that the first bending line 101 is disposed on the attaching portion 11 Between the auxiliary attachment portion 12.
  • the auxiliary attaching portion 12 by providing the auxiliary attaching portion 12 on the back surface of the region of the bottom plate 1 corresponding to the attaching portion 11, the strength of the portion of the flexible substrate corresponding to the attaching portion 11 at the time of attachment is enhanced. Then, an attaching process is performed to attach the lead 31 of the integrated circuit chip 3 to the IC attaching region 113 through an anisotropic conductive film (ACF), and pass the lead 21 of the flexible wiring board 2 through the anisotropic conductive film. (ACF) is attached to the FPC attachment area 112, as shown in FIG.
  • ACF anisotropic conductive film
  • the difference between the embodiment and the embodiment 1 is that, as shown in FIG. 3a - 3b, in the flexible substrate of the embodiment, the first bending line position of the attaching portion 11 and the auxiliary attaching portion 12 is also easy to fold.
  • the auxiliary structure 13 may be: the first bending line position on the bottom plate 1 A groove is formed along the thickness direction of the attaching portion 11, and the depth of the groove is smaller than the thickness of the attaching portion 11.
  • a plurality of through holes or blind holes along the thickness direction of the attaching portion 11 may be opened at a position corresponding to the first bending line on the bottom plate 1, and the through holes or blind holes are disposed such that the attaching portion 11 and the first sub-portion The attaching portion 121 is easy to fold.
  • the arrangement of the through holes or the blind holes may be set according to a fixed preset interval distance, for example, the predetermined separation distance between adjacent through holes or blind holes is 3 mm or less.
  • the process of providing the auxiliary attaching portion 12 further includes: extending the bottom plate 1 to the outside of the attaching portion 11 to set
  • the extension portion 14 has an area larger than or equal to the area of the attachment portion 11; and the extension portion 14 is bent toward the back surface of the attachment portion 11 such that the extension portion 14 is formed opposite to the attachment portion 11 Auxiliary attachments set.
  • the method further includes: forming a groove on the bottom plate 1 corresponding to the position of the first bending line and in the thickness direction of the attaching portion 11, the depth of the groove being smaller than the attaching The thickness of the portion 11; or, in the bottom plate 1 corresponding to the position of the first bending line, a plurality of through holes or blind holes are formed along the thickness direction of the attaching portion 11, and the density of the through hole or the blind hole is set such that the The attachment portion 11 and the first sub-attachment portion 121 are easily folded to improve production efficiency.
  • the present invention also provides a display device comprising the above flexible substrate.
  • the auxiliary attaching portion 12 includes more in this embodiment. Stacks.
  • the auxiliary attachment portion 12 includes a first sub-attachment portion 121, and further includes a second sub-adhering portion 122 having at least one laminate.
  • a second bending line is disposed between the first sub-attachment portion 121 and the second sub-adhering portion 122, and the second sub-adhering portion 122 is bent along the second bending line to be disposed on the back surface of the first sub-attachment portion 121.
  • the area of the second sub-attachment portion 122 is not limited. When the area of the second sub-attachment portion 122 is much larger than the area of the first sub-attachment portion 121, the formation may be sequentially separated from the first sub-attachment. unit
  • the 121 is provided with a plurality of laminates, and the area of each laminate is not limited, and the area of each laminate may be equal or different, as long as the first sub-attachment portion 121 can be further reinforced. The effect can be achieved.
  • the area of each of the second sub-attachment portions 122 is equal to the area of the attaching portion 11 or the first sub-adhering portion 121, and the respective stacks are disposed opposite each other; Further, the second sub-attachment portion 122 is provided as a plurality of laminations having the same area as the area of the first sub-attachment portion 121, and is sequentially laminated on the back surface of the first sub-attachment portion 121.
  • an auxiliary attaching portion disposed opposite to the attaching portion is formed, and the attaching portion is completely dropped into the auxiliary sticker in the orthographic projection direction.
  • the step of the region in which the attachment portion is located further includes a step of forming the second sub-attachment portion 122 on the back surface of the first sub-attachment portion 121.
  • the extension portion 14 is further provided with a second sub-extension portion 142, and a second bending line 102 is disposed between the first sub-extension portion 141 and the second sub-extension portion 142.
  • the second sub-extension portion 142 is bent along the second bending line 102 and disposed on the back surface of the first sub-attachment portion 121, that is, the second extension portion 142 forms the second sub-adhering portion 122.
  • FIG. 5 does not show the second bending line 102, it can be understood that the second bending line 102 is disposed on the first sub-attachment.
  • the portion 121 is between the second sub-attachment portion 122.
  • a groove may be formed along the thickness direction of the attaching portion 11, and the depth of the groove is smaller than the attaching portion.
  • a plurality of through holes or blind holes are provided along the thickness direction of the attaching portion 11 at the second bending line position of the first sub-attachment portion 121 and the second sub-adhering portion 122, the through hole or the blind hole.
  • the holes are disposed such that the second sub-attachment portion 122 and the first sub-attachment portion 121 are easily folded. Through holes or blind holes can be set at a fixed predetermined separation distance.
  • the thickness of any one of the second sub-attachments 122 is equal to the thickness of the attaching portion 11.
  • the thickness of any of the second sub-attachment portions 122 and the thickness of the attaching portion 11 may also be designed to be unequal.
  • the second sub-attachment portion includes a plurality of laminates
  • the total thickness of the laminate is large, and the attachment portion 11 can be provided with greater support rigidity than the embodiments 1 and 2, enabling the electronic device. Get better attachment results.
  • This embodiment provides a display device including the above flexible substrate.
  • Example 4
  • the difference between this embodiment and the third embodiment is that in the flexible substrate of the embodiment, a third bend is disposed between adjacent layers in the second sub-attachment portion 122.
  • the fold line 103 further defines an auxiliary structure 13 that is easy to fold at a position corresponding to the third bending line 103 at the bottom plate, so that the stacks of the second sub-attachment portion 122 are easier to bend, and at the same time, the stacks can be More compliant.
  • a third bending line is disposed between adjacent stacks in the second sub-attachment portion 122.
  • a groove along the thickness direction of the stack in the second sub-attachment portion 122 is opened at a position corresponding to the third bending line 103 on the bottom plate 1, and the depth of the groove is smaller than the lamination in the second sub-attachment portion
  • a plurality of through holes or blind holes are provided along the thickness direction of the second sub-attachment portion 122 in the bottom plate 1 corresponding to the position of the third bending line 103, and the through holes or blind holes are disposed.
  • the arrangement of the through holes or the blind holes can be set at a fixed preset interval distance.
  • an auxiliary attaching portion disposed opposite to the attaching portion is formed, and the attaching portion is completely dropped into the auxiliary sticker in the orthographic projection direction.
  • the step of the region in which the attachment portion is located further includes the step of forming a laminate in the second sub-attachment portion 122.
  • the second extension portion 142 is disposed to have at least one laminate, and a third bending line 103 is disposed between adjacent layers of the second extension portion 142, and the second extension portion 142 corresponds to the position of the third bending line 103.
  • a groove extending along the thickness direction of the second extension portion 142 is formed, and the depth of the groove is smaller than the thickness of the second extension portion 142; or the second extension portion 142 is located at a position corresponding to the third bending line 103.
  • a plurality of through holes or blind holes are provided in the thickness direction of the extending portion 142, and the through holes or the blind holes are disposed such that the attaching portion and the auxiliary attaching portion are easily folded. Through holes or blind holes can be set at a fixed preset separation distance.
  • the embodiment further provides a display device comprising the above flexible substrate.
  • the method further includes removing the auxiliary attaching portion.
  • FIG. 8a-8b A schematic structural view of the final flexible substrate is shown in Figures 8a-8b.
  • the auxiliary attaching portion (Examples 1-4) may be selectively retained or the auxiliary attaching portion may be cut off according to the actual situation (this embodiment).
  • the flexible display device can maintain a thin thickness, which is advantageous for thinning production of the flexible display device.
  • a groove or a plurality of through holes or blinds in the thickness direction of the attaching portion or the auxiliary attaching portion are further opened at the position of the bending line of the auxiliary attaching portion and the attaching portion. The hole, therefore, is easier to cut off the auxiliary attachment portion than in Embodiment 1.
  • an auxiliary attaching portion is provided by attaching a flexible substrate to an attaching portion of an electronic device such as an IC or an FPC, and the auxiliary attaching portion can be attached to the attaching portion when the electronic device is attached to the attaching portion.
  • the strength of the attaching portion is enhanced, and the alignment accuracy and contact characteristics of the electronic device are improved, thereby improving the yield of the flexible display device.
  • the bottom plate of the flexible substrate is correspondingly increased in area, the overall cost is still low since a thin flexible substrate is still used.

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Abstract

一种柔性基板、显示装置及在柔性基板上贴附电子器件的方法。该柔性基板包括底板（1），所述底板（1）包括用于贴附电子器件的贴附部（11）和与所述贴附部（11）一体成型的辅助贴附部（12，121，122），所述辅助贴附部（12，121，122）与所述贴附部（11）相背设置，且所述贴附部（11）在正投影方向上完全落入所述辅助贴附部（12，121，122）所在的区域。通过提供在用于贴附IC或FPC等电子器件的贴附部（11）旁设置辅助贴附部（12，121，122），该辅助贴附部（12，121，122）在电子器件贴附至贴附部（11）时加强贴附部（11）的强度，提高电子器件的贴附对位精度和接触特性，进而提高柔性显示器件的良品率并降低成本。

Description

柔性基板、 显示装置及在柔性基板上贴附电子器件的方法 技术领域
本发明涉及一种柔性基板、显示装置及在柔性基板上贴附电子器件的方 法。 背景技术
平板显示技术在近十年有了飞速地发展，从屏幕的尺寸到显示的质量都 取得了很大进步， 各方面的性能已经达到了传统 CRT 的水平， 大有取代笨 重的 CRT显示装置的趋势。 目前， 液晶显示装置（ Liquid Crystal Display: 筒称 LCD )和有机电致发光显示装置（OLED )是主流的平板显示装置， 而 柔性显示装置（ flexible display )凭借其能够弯曲的特性广泛应用于需要曲面 显示的领域， 如智能卡、 电子纸、 智能标签应用等， 几乎覆盖了传统显示装 置所能适用的所有应用， 因此逐渐成为显示技术领域的新宠。
在柔性显示装置中，如图 1所示，通过将集成电路芯片（IC,例如： COG IC-chip on glass IC, 即芯片被直接贴附在载体玻璃基板上， 适用于消费类电 子产品的 LCD或 OLED,如：手机， PDA等便携式产品）或柔性线路板（ FPC: Flexible Printed Circuit )通过各向异性导电膜 ( ACF: Anisotropic Conductive Film )贴附（bonding, 或者称绑定）到柔性基板上是所有柔性显示器件制备 过程中重要的工序之一。目前，柔性基板一般采用塑料基板（ plastic substrate ) 作为底板， 由于塑料基板一般较薄（厚度范围为 25 -125 μ ιη )且柔软， 在将 集成电路芯片或柔性线路板贴附到柔性基板上的过程中， 受较大贴附压力的 影响， 容易导致塑料基板发生变形， 从而影响贴附精度和电子器件的接触效 果， 进而产生对位不准确或者接触不良的工艺问题。
为了解决上述问题， 目前常采用以下两种方案：
其中一种方案是： 将作为柔性基板的塑料基板预先设置在硬质载体上， 比如： 玻璃基板上， 获得较高的硬度以便于贴附， 贴附完成后再将塑料基板 从硬质载体上取下。 采用这种方案， 虽然能保证塑料基板的硬度， 但是， 相 应的， 在将集成电路芯片或柔性线路板与塑料基板贴附的过程中， 需要较高 的工艺稳定性和洁净化的环境， 否则容易在贴合面引起贴附气泡， 进而影响 后续的工艺制备。
另一种方案是： 将柔性基板调换为较厚的塑料基板。 但是， 适合作为显 示器件的柔性基板的塑料基板价格昂贵， 使得柔性显示装置的成本大幅上 升。 同时， 采用较厚的塑料基板还存在如下不足： 第一， 由于塑料基板与玻 璃基板的热膨胀系数差异较大， 在贴附工艺后的加热工序中， 较厚的塑料基 板与玻璃基板热胀冷缩的差异以及塑料基板本身固有的受热收缩特性，会使 得塑料基板在加热工序完成后牵动玻璃基板而发生翘曲； 第二， 较厚的塑料 基板刚度较大， 不易与玻璃基板完全贴合， 从而在贴合面引起贴附气泡， 在 真空加热条件下， 气泡会集聚膨胀， 从而影响二者之间的平整度。 可见， 采 用较厚的塑料基板作为柔性基板的方案也有待继续改进。
随着平板显示产品生产的不断扩大， 行业内的竟争也日趋激烈。 因此， 如何既能保证电子器件在柔性基板取得较好的贴附效果以提高产品性能， 同 时还能降低柔性显示装置的生产成本， 从而提高产品的市场竟争力， 成为目 前显示技术领域亟待解决的技术问题。 发明内容
本发明的实施例提供一种柔性基板、显示装置及在柔性基板上贴附电子 器件的方法。 该柔性基板成本较低， 在柔性基板上贴附电子器件的方法能保 证较好的贴附效果， 从而能保证显示装置具有较好的显示质量。
本发明的一个方面提供一种柔性基板， 包括底板， 所述底板包括用于贴 附电子器件的贴附部和与所述贴附部一体成型的辅助贴附部， 所述辅助贴附 部与所述贴附部相背设置，且所述贴附部在正投影方向上完全落入所述辅助 贴附部所在的区域。
例如， 所述贴附部和所述辅助贴附部之间设置有第一弯折线， 所述辅助 贴附部包括第一子贴附部， 所述第一子贴附部的面积大于或等于所述贴附部 的面积， 所述第一子贴附部沿所述第一弯折线弯折设置于所述贴附部的背 面。
例如， 所述辅助贴附部还包括具有至少一个叠层的第二子贴附部， 所述 第一子贴附部与所述第二子贴附部之间设置有第二弯折线，所述第二子贴附 部沿所述第二弯折线弯折设置于所述第一子贴附部的背面。
例如，在所述底板上的对应着所述第一弯折线和 /或所述第二弯折线位置 处开设有沿所述贴附部厚度方向的凹槽， 所述凹槽的深度小于所述贴附部的 厚度； 或者，在所述底板上的对应着所述第一弯折线和 /或所述第二弯折线位 置处开设有沿所述贴附部厚度方向设置的多个通孔或盲孔。
例如， 所述第二子贴附部中相邻叠层之间设置有第三弯折线， 在所述底 板上的对应着所述第三弯折线位置处开设有沿所述第二子贴附部中叠层厚 度方向的凹槽，所述凹槽的深度小于所述第二子贴附部中叠层的厚度；或者， 在所述底板上的对应着所述第三弯折线位置处开设有沿所述第二子贴附部 中叠层厚度方向设置的多个通孔或盲孔。
例如， 所述辅助贴附部与所述贴附部采用相同的材料制成。
所述辅助贴附部为可去除的辅助贴附部。
本发明另一个方面提供一种显示装置， 所述显示装置包括上述的柔性基 板。
本发明另一个方面提供一种在柔性基板上贴附电子器件的方法， 包括在 所述柔性基板的底板中的贴附部上贴附电子器件的步骤，在所述贴附部上贴 附电子器件的步骤之前，还包括：形成与所述贴附部相背设置的辅助贴附部， 且使得所述贴附部在正投影方向上完全落入所述辅助贴附部所在的区域的 步骤。 例如， 形成与所述贴附部相背设置的辅助贴附部， 且使得所述贴附部在 正投影方向上完全落入所述辅助贴附部所在的区域的步骤包括：
将所述底板向所述贴附部的外侧延伸以设置延展部， 所述延展部的面积 大于或等于所述贴附部的面积； 和
将所述延展部向所述贴附部的背面弯折， 以使得所述延展部形成与所述 贴附部相背设置的辅助贴附部。
例如， 所述贴附部和所述延展部之间设置有第一弯折线， 所述延展部与 所述贴附部采用相同的材料制成， 所述延展部设有第一延展部， 所述第一延 展部的面积大于或等于所述贴附部的面积， 所述第一延展部沿所述第一弯折 线弯折设置于所述贴附部的背面， 即所述第一延展部形成第一子贴附部。
例如， 所述方法还进一步包括： 在所述底板上的对应着所述第一弯折线 的位置、 沿所述贴附部厚度方向开设凹槽， 所述凹槽的深度小于所述贴附部 的厚度； 或者， 例如， 在所述底板上的对应着所述第一弯折线的位置、 沿所 述贴附部厚度方向开设多个通孔或盲孔。
例如， 所述方法还进一步包括： 所述延展部还设有第二子延展部， 所述 第一子延展部与所述第二子延展部之间设置有第二弯折线，所述第二子延展 部沿所述第二弯折线弯折设置于所述第一子贴附部的背面， 即所述第二延展 部形成第二子贴附部。
例如， 所述方法还进一步包括： 将所述第二延展部设置为具有至少一个 叠层， 所述第二子延展部中相邻叠层之间设置有第三弯折线， 在所述延展部 上的对应着所述第二弯折线和 /或所述第三弯折线位置处开设有沿所述延展 部厚度方向的凹槽， 所述凹槽的深度小于所述延展部的厚度； 或者， 例如， 所述延展部上对应着所述第二弯折线和 /或所述第三弯折线位置处开设有沿 所述延展部厚度方向设置的多个通孔或盲孔。
例如， 在所述柔性基板的底板中的贴附部上贴附电子器件的步骤之后， 还进一步包括： 去除所述辅助贴附部。 本发明提供的柔性基板， 在用于贴附 IC或 FPC等电子器件的贴附部旁 设置辅助贴附部。 该辅助贴附部在电子器件贴附至贴附部时， 能加强贴附部 的强度， 使得电子器件的贴附对位精度和接触特性提高， 进而提高柔性显示 器件的良品率， 且成本较低。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 la为本发明实施例 1 中弯折前的柔性基板结构的示意性主视图， 其 中， 在柔性基板的贴附部的一侧设置延展部；
图 lb为图 la中所示的本发明实施例 1中弯折前的柔性基板结构的示意 性俯视图；
图 2为本发明实施例 1中弯折后的柔性基板结构的示意性主视图， 其中 将图 la-lb中延展部弯折在贴附部的背面形成辅助贴附部；
图 3a为本发明实施例 2中弯折前的柔性基板结构的示意性主视图， 其 中， 在柔性基板的贴附部的一侧设置延展部；
图 3b为图 3a中所示的本发明实施例 2中弯折前的柔性基板结构的示意 性俯视图；
图 4a为本发明实施例 3中弯折前的柔性基板结构的示意性主视图， 其 中， 在柔性基板的贴附部的一侧设置延展部的结构示意图；
图 4b为图 4a中所示的本发明实施例 3中弯折前的柔性基板结构的示意 性俯视图；
图 5为本发明实施例 3中弯折后的柔性基板结构的示意性主视图， 其中 将图 4a-4b中延展部弯折在贴附部的背面形成辅助贴附部；
图 6a为本发明实施例 4中弯折前的柔性基板结构的示意性主视图， 其 中， 在柔性基板的贴附部的一侧设置延展部的结构示意图；
图 6b为图 6a中所示的本发明实施例 4中弯折前的柔性基板结构的示意 性俯视图；
图 7为本发明实施例 4中弯折后的柔性基板结构的示意性主视图， 其中 将图 6a-6b中延展部弯折在贴附部的背面形成辅助贴附部；
图 8a为本发明实施例 5中辅助贴附部被切割除去的柔性基板结构的示 意性主视图；
图 8b为本发明实施例 5中辅助贴附部被切割除去的柔性基板结构的示 意性俯视图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
除非另作定义， 此处使用的技术术语或者科学术语应当为本发明所属领 域内具有一般技能的人士所理解的通常意义。本发明专利申请说明书以及权 利要求书中使用的 "第一"、 "第二" 以及类似的词语并不表示任何顺序、 数 量或者重要性， 而只是用来区分不同的组成部分。 同样， "一个" 或者 "一" 等类似词语也不表示数量限制， 而是表示存在至少一个。 "包括" 或者 "包 含" 等类似的词语意指出现在 "包括" 或者 "包含" 前面的元件或者物件涵 盖出现在 "包括" 或者 "包含" 后面列举的元件或者物件及其等同， 并不排 除其他元件或者物件。 "连接" 或者 "相连" 等类似的词语并非限定于物理 的或者机械的连接， 而是可以包括电性的连接， 不管是直接的还是间接的。 "上"、 "下"、 "左"、 "右" 等仅用于表示相对位置关系， 当被描述对象的绝 对位置改变后， 则该相对位置关系也可能相应地改变。
本发明的一个实施例提供一种柔性基板， 包括底板， 所述底板包括用于 贴附电子器件的贴附部和与所述贴附部一体成型的辅助贴附部， 所述辅助贴 附部与所述贴附部相背设置，且所述贴附部在正投影方向上完全落入所述辅 助贴附部所在的区域。
本发明的一个实施例提供一种显示装置， 包括上述的柔性基板。
本发明的一个实施例提供一种在柔性基板上贴附电子器件的方法， 包括 在所述柔性基板的底板中对应着贴附部贴附电子器件的步骤，在所述贴附部 上贴附电子器件的步骤之前， 还包括： 形成与所述贴附部相背设置的辅助贴 附部，且使得所述贴附部在正投影方向上完全落入所述辅助贴附部所在的区 域的步骤。
在本发明中， 贴附部、 辅助贴附部以及叠层的 "正面" 和 "背面" 的定 义分别为： "正面" 为图 2 (左）所示的剖视图中指向纸面上侧的表面， 或图 2 (右）所示的在纸面上的平面； "背面" 为图 2 (左）所示的剖视图中指向 纸面下侧的表面， 或图 2 (右）所示的在纸面背面的平面。 实施例 1:
图 2示出了一种柔性基板， 包括底板 1。 该底板 1包括用于贴附电子器 件的贴附部 11 , 还包括与贴附部 11一体成型的辅助贴附部 12。 该辅助贴附 部 12与贴附部 11相背设置， 且贴附部 11在正投影方向上完全落入辅助贴 附部 12所在的区域。
其中， 辅助贴附部 12的面积大于或等于贴附部 11 的面积， 贴附部 11 的面积不小于待贴附的 COG IC与 FPC引脚覆盖的面积。
优选的是， 贴附部 11和辅助贴附部 12之间设置有第一弯折线。 辅助贴 附部 12包括第一子贴附部 121 ,该第一子贴附部 121的面积大于或等于贴附 部 11的面积。 该第一子贴附部 121沿第一弯折线弯折设置于贴附部 11的背 面。 在本发明的实施例中， 例如， 第一子贴附部 121可以是指紧密贴合在贴 附部 11背部的一层。
为便于生产， 第一子贴附部 121的厚度与贴附部 11的厚度相等。 当然， 根据实际情况或特殊需要， 第一子贴附部 121的厚度与贴附部 11的厚度也 可以设计为不相等。
其中， 辅助贴附部 12与贴附部 11采用相同的材料制成。 例如， 辅助贴 附部 12可采用聚酰亚胺（PI )、 聚奈二甲酸乙二酯（PEN )、 聚对苯二甲酸乙 二醇酯 （PET )、 纤维强化塑料（FRP )、 聚醚砜（PES )、 聚芳酯 （PAR )或 聚碳酸酯（PC )制成。 当然， 根据不同生产线的需要， 辅助贴附部 12所采 用的材料、 工艺参数可以进行灵活调整， 以和生产设备相适配。
当然， 辅助贴附部 12可根据需要进行去除， 例如， 辅助贴附部 12为可 去除的辅助贴附部。
在本实施例中， 电子器件包括集成电路芯片 3或柔性线路板 2。 贴附部 11包括 FPC贴附区 112以及 IC贴附区 113 (参见图 la )。 FPC贴附区 112 以及 IC贴附区 113相对底板 1的其他区域为突出状。 集成电路芯片的引脚 31贴附于所述 IC贴附区 113,柔性线路板的引脚 21贴附于所述 FPC贴附区 112。
本发明还提供一种显示装置， 可以包括上述的柔性基板。
此外， 本发明还提供一种在柔性基板上贴附电子器件的方法， 具体可以 包括在柔性基板的底板中的贴附部上贴附电子器件的步骤。 其中， 在贴附部 上贴附电子器件的步骤之前， 还包括： 形成与贴附部 11相背设置的辅助贴 附部 12,且使得贴附部 11在正投影方向上完全落入辅助贴附部 12所在的区 域的步骤。
其中， 形成与贴附部 11 相背设置的辅助贴附部 12, 且使得贴附部 11 在正投影方向上完全落入辅助贴附部 12所在的区域的步骤具体包括:将底板 向贴附部的外侧延展以设置延展部，该延展部的面积大于或等于贴附部的面 积;和将延展部向贴附部的背面弯折，以使得延展部形成与贴附部相背设置的 辅助贴附部。 以下将参考图 la-lb来说明上述步骤。
如图 la-lb所示，首先，将底板 1向贴附部 11的外侧延展以设置延展部 14, 其中， 贴附部 11和延展部 14之间设置有第一弯折线 101 (图 lb中具体 示出）。 延展部 14与贴附部 11采用相同的材料制成。 延展部 14包括第一延 展部 141 ,该第一延展部 141的面积大于或等于贴附部 11的面积， 第一延展 部 141的厚度与贴附部 11的厚度相等。
然后， 将第一延展部 141沿所述第一弯折线 101 弯折设置于贴附部 11 的背面， 即由第一延展部 141形成第一子贴附部 121。 在本实施例中， 第一 子贴附部 121也即辅助贴附部 12。
在本实施例的经过弯折后形成的柔性基板结构中（参见图 2 ), 尽管图 2 未示出第一弯折线 101 , 但是可以理解的是， 第一弯折线 101设置于贴附部 11和辅助贴附部 12之间。
在本实施例中， 通过在底板 1 中对应着贴附部 11的区域的背面设置辅 助贴附部 12,从而加强了贴附时柔性基板中对应着贴附部 11的部分的强度。 然后再进行贴附工艺， 将集成电路芯片 3 的引脚 31 通过各向异性导电膜 ( ACF )贴附于 IC贴附区 113, 并且将柔性线路板 2的引脚 21通过各向异 性导电膜（ACF )贴附于 FPC贴附区 112, 如图 3所示。 当形成柔性显示装 置时， 辅助贴附部 12被完全设置在显示屏的背面， 因此不会对显示装置的 显示效果造成任何影响。 实施例 2:
本实施例与实施例 1的区别在于， 如图 3a-3b所示， 本实施例的柔性基 板中， 在贴附部 11与辅助贴附部 12的第一弯折线位置处还开设易于折叠的 辅助结构 13, 例如沿贴附部 11厚度方向的凹槽或多个通孔或盲孔。
如图 3a-3b所示，辅助结构 13可以是：底板 1上对应着第一弯折线位置 处开设的沿贴附部 11厚度方向的凹槽， 该凹槽的深度小于所述贴附部 11的 厚度。
在底板 1上的对应着第一弯折线位置处也可以开设有沿贴附部 11厚度 方向的多个通孔或盲孔， 该通孔或盲孔的设置使得贴附部 11 与第一子贴附 部 121易于折叠。通孔或盲孔的设置可以按照固定的预设间隔距离进行设置， 例如， 相邻通孔或盲孔之间的预设间隔距离小于等于 3mm。
相应的， 在上述柔性基板的底板中的贴附部上贴附电子器件之前， 设置 辅助贴附部 12的过程中还包括： 将所述底板 1向所述贴附部 11的外侧延展 以设置延展部 14,该延展部 14的面积大于或等于所述贴附部 11的面积； 和 将延展部 14向贴附部 11的背面弯折， 以使得延展部 14形成与贴附部 11相 背设置的辅助贴附部。
相比实施例 1 , 在本实施例中， 还进一步包括： 在所述底板 1上对应着 第一弯折线的位置、 沿贴附部 11厚度方向开设凹槽， 该凹槽的深度小于贴 附部 11的厚度； 或者， 在所述底板 1上对应着第一弯折线的位置、 沿贴附 部 11厚度方向开设多个通孔或盲孔， 该通孔或盲孔的密度设置成使得贴附 部 11与第一子贴附部 121易于折叠， 以便提高生产效率。
本实施例中柔性基板的其他结构和贴附电子器件的方法与实施例 1 相 同， 这里不再详述。
本发明还提供一种显示装置， 包括上述的柔性基板。
本实施例的柔性基板中， 由于在贴附部与辅助贴附部 （第一子贴附部） 之间设置了凹槽或多个通孔或盲孔， 因此有利于柔性基板中贴附部与辅助贴 附部的弯折， 降低弯折过程中柔性基板的翘曲， 也间接地保证了显示装置的 显示质量。 实施例 3:
本实施例与实施例 1的区别在于， 本实施例中辅助贴附部 12包括有多 个叠层。
如图 5所示，辅助贴附部 12包括第一子贴附部 121 ,还包括具有至少一 个叠层的第二子贴附部 122。 第一子贴附部 121与第二子贴附部 122之间设 置有第二弯折线， 第二子贴附部 122沿第二弯折线弯折设置于第一子贴附部 121的背面。
其中， 对第二子贴附部 122的面积不做限定， 当第二子贴附部 122的面 积远大于第一子贴附部 121 的面积时， 可将其形成依次远离第一子贴附部
121设置的多个叠层， 且对于每一叠层的面积不做限定， 每一叠层的面积可 以全相等， 也可以各不相等， 只要能对第一子贴附部 121起进一步加强制成 的作用即可。 在本实施例中， 如图 5所示， 第二子贴附部 122中各层叠的面 积均分别与贴附部 11或第一子贴附部 121 的面积相等，各个叠层相背设置； 并且，将第二子贴附部 122设置为面积分别与第一子贴附部 121的面积相等 的多个叠层， 依次层叠在第一子贴附部 121的背面。
相应的， 在上述柔性基板的底板中的贴附部上贴附电子器件之前， 形成 与贴附部相背设置的辅助贴附部，且使得贴附部在正投影方向上完全落入辅 助贴附部所在的区域的步骤中还包括，在第一子贴附部 121的背面形成第二 子贴附部 122的步骤。
具体的， 如图 4a-4b所示， 延展部 14还设有第二子延展部 142, 第一子 延展部 141与所述第二子延展部 142之间设置有第二弯折线 102。 第二子延 展部 142沿第二弯折线 102弯折设置于第一子贴附部 121的背面， 即第二延 展部 142形成第二子贴附部 122。
在本实施例的经过弯折后形成的柔性基板结构中,参见图 5,尽管图 5未 示出第二弯折线 102, 但是可以理解的是， 第二弯折线 102设置于第一子贴 附部 121与第二子贴附部 122之间。
优选的是， 在第一子贴附部 121与第二子贴附部 122的第二弯折线 102 位置处， 可以沿贴附部 11厚度方向开设有凹槽， 凹槽的深度小于贴附部 11 的厚度； 或者， 第一子贴附部 121与第二子贴附部 122的第二弯折线位置处 沿贴附部 11 的厚度方向设置有多个通孔或盲孔， 该通孔或盲孔被设置为使 得第二子贴附部 122与第一子贴附部 121易于折叠。通孔或盲孔可以按照固 定的预设间隔距离进行设置。
为便于生产， 第二子贴附部 122中任一叠层的厚度与贴附部 11的厚度 相等。 当然， 根据实际情况或特殊需要， 第二子贴附部 122中任一叠层的厚 度与贴附部 11的厚度也可以设计为不相等。
本实施例中， 由于第二子贴附部包括有多个叠层， 因此层叠的总厚度较 大， 能为贴附部 11提供比实施例 1、 2更大的支撑刚度， 能使电子器件获得 更好的贴附效果。
本实施例中柔性基板的其他结构和贴附电子器件的方法与实施例 1 相 等， 这里不再详述。
本实施例提供一种显示装置， 包括上述的柔性基板。 实施例 4:
如图 6a-6b以及图 7所示， 本实施例与实施例 3的区别在于， 本实施例 的柔性基板中，在第二子贴附部 122中相邻叠层之间设置有第三弯折线 103 , 在底板对应着第三弯折线 103位置处还开设易于折叠的辅助结构 13,使得第 二子贴附部 122的各叠层在弯折时更容易， 同时使得各叠层之间能更服贴。
在本实施例中， 第二子贴附部 122 中相邻叠层之间设置有第三弯折线
103, 在底板 1上对应着第三弯折线 103位置处开设有沿第二子贴附部 122 中叠层厚度方向的凹槽， 所述凹槽的深度小于第二子贴附部中叠层的厚度； 或者，在底板 1上对应着第三弯折线 103位置处沿所述第二子贴附部 122中 叠层厚度方向的设置有多个通孔或盲孔，通孔或盲孔设置为使得第二子贴附 部 122中的相邻叠层易于折叠。所述通孔或盲孔的设置可以按照固定的预设 间隔距离进行设置。 相应的， 在上述柔性基板的底板中的贴附部上贴附电子器件之前， 形成 与贴附部相背设置的辅助贴附部，且使得贴附部在正投影方向上完全落入辅 助贴附部所在的区域的步骤中还包括，在第二子贴附部 122中形成叠层的步 骤。
具体的， 将第二延展部 142设置为具有至少一个叠层， 第二延展部 142 中相邻叠层之间设置有第三弯折线 103 , 第二延展部 142对应着第三弯折线 103位置处开设有沿第二延展部 142厚度方向的凹槽， 该凹槽的深度小于第 二延展部 142的厚度； 或者， 第二延展部 142对应着第三弯折线 103位置处 开设有沿第二延展部 142厚度方向设置的多个通孔或盲孔，通孔或盲孔设置 为使得贴附部与辅助贴附部易于折叠。通孔或盲孔可以按照固定的预设间隔 距离进行设置。
本实施例中柔性基板的其他结构和贴附电子器件的方法与实施例 2相 同， 这里不再详述。
本实施例还提供一种显示装置， 包括上述的柔性基板。
本实施例的柔性基板中， 由于在第二子贴附部的各叠层之间设置了凹槽 或多个通孔或盲孔， 因此有利于辅助贴附部各叠层的弯折， 降低弯折过程中 柔性基板的翘曲。 实施例 5:
本实施例与实施例 1-4任一的区别在于， 在柔性显示装置中， 柔性基板 中辅助贴附部在电子器件贴附工艺完成即被去除。
本实施例中， 在柔性基板的底板中的贴附部上贴附电子器件的步骤之 后， 还进一步包括去除辅助贴附部。
最终的柔性基板的结构示意图如图 8a-8b所示。
即， 在电子器件贴附工艺完成后可以根据实际情况， 有选择性地保留辅 助贴附部 （实施例 1-4 )或将辅助贴附部切除（本实施例）。 在本实施例中， 由于辅助贴附部最终被去除， 使得柔性显示装置能保持 较薄厚度， 有利于柔性显示装置的薄型化生产。 而且， 实施例 2-4中的柔性 基板， 由于在辅助贴附部与贴附部的弯折线位置处还开设有沿贴附部或辅助 贴附部厚度方向的 槽或多个通孔或盲孔， 因此相对实施例 1更易于将辅助 贴附部切割除去。
本发明的柔性显示装置中， 通过在柔性基板用于贴附 IC或 FPC等电子 器件的贴附部旁设置辅助贴附部， 该辅助贴附部能在电子器件贴附至贴附部 时， 加强贴附部的强度， 使得电子器件的贴附对位精度和接触特性提高， 进 而提高柔性显示器件的良品率。 同时， 虽然柔性基板的底板相应地增大了面 积， 但由于仍然采用较薄的柔性基板， 因此整体成本仍然较低。
可以理解的是， 以上实施方式仅仅是为了说明本发明的原理而采用的示 例性实施方式， 然而本发明并不局限于此。 对于本领域内的普通技术人员而 言， 在不脱离本发明的精神和实质的情况下， 可以做出各种变型和改进， 这 些变型和改进也视为本发明的保护范围。

Claims

权利要求书
1.一种柔性基板， 包括底板， 其中， 所述底板包括用于贴附电子器件的 贴附部和与所述贴附部一体成型的辅助贴附部， 所述辅助贴附部与所述贴附 部相背设置，且所述贴附部在正投影方向上完全落入所述辅助贴附部所在的 区域。
2.根据权利要求 1所述的柔性基板，其中，所述贴附部和所述辅助贴附 部之间设置有第一弯折线， 所述辅助贴附部包括第一子贴附部， 所述第一子 贴附部的面积大于或等于所述贴附部的面积， 所述第一子贴附部沿所述第一 弯折线弯折设置于所述贴附部的背面。
3.根据权利要求 2所述的柔性基板，其中，所述辅助贴附部还包括具有 至少一个叠层的第二子贴附部，所述第一子贴附部与所述第二子贴附部之间 设置有第二弯折线， 所述第二子贴附部沿所述第二弯折线弯折设置于所述第 一子贴附部的背面。
4.根据权利要求 3所述的柔性基板，其中，在所述底板上的对应着所述 第一弯折线和 /或所述第二弯折线位置处开设有沿所述贴附部厚度方向的 槽， 所述凹槽的深度小于所述贴附部的厚度； 或者
在所述底板上的对应着所述第一弯折线和 /或所述第二弯折线位置处开 设有沿所述贴附部厚度方向设置的多个通孔或盲孔。
5.根据权利要求 3或 4所述的柔性基板，其中，所述第二子贴附部中相 邻叠层之间设置有第三弯折线，在所述底板上的对应着所述第三弯折线位置 处开设有沿所述第二子贴附部中叠层厚度方向的凹槽， 所述凹槽的深度小于 所述第二子贴附部中叠层的厚度； 或者
在所述底板上的对应着所述第三弯折线位置处开设有沿所述第二子贴 附部中叠层厚度方向设置的多个通孔或盲孔。
6.根据权利要求 1-5中任一项所述的柔性基板， 其中， 所述辅助贴附部 与所述贴附部采用相同的材料制成。
7.根据权利要求 1-6中任一项所述的柔性基板， 其中， 所述辅助贴附部 为可去除的辅助贴附部。
8.一种显示装置，所述显示装置包括权利要求 1-7中任一项所述的柔性 基板。
9. 一种在柔性基板上贴附电子器件的方法，包括在所述柔性基板的底板 中的贴附部上贴附电子器件的步骤， 其中， 在所述贴附部上贴附电子器件的 步骤之前， 还包括： 形成与所述贴附部相背设置的辅助贴附部， 且使得所述 贴附部在正投影方向上完全落入所述辅助贴附部所在的区域的步骤。
10. 根据权利要求 9所述的方法， 其中， 形成与所述贴附部相背设置的 辅助贴附部，且使得所述贴附部在正投影方向上完全落入所述辅助贴附部所 在的区域的步骤包括：
将所述底板向所述贴附部的外侧延伸以设置延展部， 所述延展部的面积 大于或等于所述贴附部的面积；
将所述延展部向所述贴附部的背面弯折， 以使得所述延展部形成与所述 贴附部相背设置的辅助贴附部。
11.根据权利要求 10所述的方法， 其中， 所述贴附部和所述延展部之间 设置有第一弯折线， 所述延展部与所述贴附部采用相同的材料制成， 所述延 展部设有第一延展部， 所述第一延展部的面积大于或等于所述贴附部的面 积， 所述第一延展部沿所述第一弯折线弯折设置于所述贴附部的背面， 以形 成第一子贴附部。
12. 根据权利要求 11所述的方法，进一步包括： 在所述底板上的对应着 所述第一弯折线的位置、 沿所述贴附部厚度方向开设凹槽， 所述凹槽的深度 小于所述贴附部的厚度； 或者，
在所述底板上的对应着所述第一弯折线的位置、 沿所述贴附部厚度方向 开设多个通孔或盲孔。
13. 根据权利要求 11或 12所述的方法， 进一步包括： 所述延展部还设 有第二子延展部，所述第一子延展部与所述第二子延展部之间设置有第二弯 折线， 所述第二子延展部沿所述第二弯折线弯折设置于所述第一子贴附部的 背面， 以形成第二子贴附部。
14. 根据权利要求 13所述的方法，进一步包括： 将所述第二延展部设置 为具有至少一个叠层， 所述第二子延展部中相邻叠层之间设置有第三弯折 线，所述延展部上对应着所述第二弯折线和 /或所述第三弯折线位置处开设有 沿所述延展部厚度方向的凹槽， 所述凹槽的深度小于所述延展部的厚度； 或 者，
所述延展部上对应着所述第二弯折线和 /或所述第三弯折线位置处开设 有沿所述延展部厚度方向设置的多个通孔或盲孔。
15. 根据权利要求 14所述的方法，其中，在所述柔性基板的底板中的贴 附部上贴附电子器件的步骤之后， 还包括： 去除所述辅助贴附部。
PCT/CN2013/079369 2013-04-28 2013-07-15 柔性基板、显示装置及在柔性基板上贴附电子器件的方法 WO2014176828A1 (zh)

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US20150192961A1 (en) 2015-07-09
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US9651996B2 (en) 2017-05-16
KR101626685B1 (ko) 2016-06-01
KR20140138585A (ko) 2014-12-04
EP2993660A1 (en) 2016-03-09
EP2993660A4 (en) 2016-11-30
JP2016526275A (ja) 2016-09-01

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