WO2014162372A1 - 電気機器用コーティング材、電気機器用コーティング材の製造方法および密閉型絶縁装置 - Google Patents
電気機器用コーティング材、電気機器用コーティング材の製造方法および密閉型絶縁装置 Download PDFInfo
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- WO2014162372A1 WO2014162372A1 PCT/JP2013/005173 JP2013005173W WO2014162372A1 WO 2014162372 A1 WO2014162372 A1 WO 2014162372A1 JP 2013005173 W JP2013005173 W JP 2013005173W WO 2014162372 A1 WO2014162372 A1 WO 2014162372A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/50—Mixing liquids with solids
- B01F23/57—Mixing high-viscosity liquids with solids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F33/00—Other mixers; Mixing plants; Combinations of mixers
- B01F33/25—Mixers with loose mixing elements, e.g. loose balls in a receptacle
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B13/00—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle
- H02B13/02—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle with metal casing
- H02B13/035—Gas-insulated switchgear
- H02B13/055—Features relating to the gas
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/50—Mixing liquids with solids
- B01F23/58—Mixing liquids with solids characterised by the nature of the liquid
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2272—Ferric oxide (Fe2O3)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2275—Ferroso-ferric oxide (Fe3O4)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B13/00—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle
- H02B13/02—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle with metal casing
- H02B13/035—Gas-insulated switchgear
- H02B13/065—Means for detecting or reacting to mechanical or electrical defects
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/06—Totally-enclosed installations, e.g. in metal casings
Definitions
- Embodiments of the present invention relate to a coating material for electrical equipment, a method for manufacturing a coating material for electrical equipment, and a sealed insulating device.
- a sealed insulation device such as a gas-sealed switch, which has a high-voltage conductor supported by an insulator in a container filled with an insulating gas
- the insulation design is designed to reduce costs and reduce environmental impact. Downsizing by streamlining and three-phase integration has become an issue.
- the size of the metal container of the sealed insulation device is determined by the insulation design and thermal design.
- One of the points of insulation design is to examine the influence on the insulation performance when foreign matter is present (attached) on the inner surface of the metal container.
- the hermetic type insulating device When the hermetic type insulating device is downsized, the electric field on the inner surface of the metal container increases, and the movement of foreign substances existing inside the metal container tends to become active. Excessive movement of foreign matter inside the metal container may affect the insulation performance. Further, the longer the shape of the foreign material, the greater the movement of the foreign material and the greater the influence on the insulation performance.
- a foreign matter management step is provided in the manufacturing process to remove foreign matters, thereby enhancing foreign matter management. Furthermore, it is necessary to design the electric field strength on the inner surface of the metal container when the operating voltage is applied so that a small foreign object that is difficult to manage does not float and move around above the height considered in the design.
- the height is the distance between the inner surface of the metal container and the foreign material.
- the electric field strength on the inner surface of the metal container depends on the distance between the high voltage conductor and the inner surface of the metal container, it is necessary to increase the metal container in order to reduce the flying height of the foreign matter. This is a factor that hinders downsizing of the hermetic insulation device.
- a partial discharge may be caused by a higher voltage such as a lightning impulse, and foreign matter may start to move.
- the problem to be solved by the present invention is to provide a coating material for electric equipment, a method for manufacturing the coating material for electric equipment, and a hermetic insulation device that can suppress the floating and movement of foreign matters in the electric equipment. .
- the coating material for an electric device includes a matrix resin made of an epoxy resin and a first filler made of whisker that is dispersed and contained in the matrix resin and has a semiconductive volume resistivity. Furthermore, the coating material for electrical equipment is dispersed and contained in the matrix resin, and is contained in the matrix resin as a second filler composed of particles having a semiconductive volume specific resistance and dispersed in the matrix resin. And a third filler made of a plate-like, fibrous or layered material.
- the electrical equipment coating material of the embodiment contains the first filler, the second filler, and the third filler dispersed in a matrix resin.
- the matrix resin is in a viscous liquid state and is cured by adding a curing agent.
- the epoxy resin is composed of an epoxy compound having two or more epoxy groups per molecule.
- an epoxy compound any compound that has two or more three-membered rings of two carbon atoms and one oxygen atom in one molecule and is curable can be used as appropriate. It is not particularly limited.
- Epoxy resins include bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, biphenyl type epoxy resin, Glycidyl such as naphthalene type epoxy resin, fluorene type epoxy resin, novolac type epoxy resin, phenol-novolac type epoxy resin, orthocresol-novolac type epoxy resin, tris (hydroxyphenyl) methane type epoxy resin, tetraphenylolethane type epoxy resin Ether type epoxy resin, glycidyl ester type epoxy resin obtained by condensation of epichlorohydrin and carboxylic acid, triglycidyl isocyanate And heterocyclic epoxy resins such as hydantoin epoxy resin obtained by the reaction of Ruhidorin and hydantoins and the like.
- an epoxy resin any 1 type in the above-mentioned epoxy resin may be used, and 2 or more types
- the curing agent that cures the epoxy resin is a substance that chemically reacts with the epoxy resin to cure the epoxy resin.
- the curing agent can be appropriately used as long as it cures the epoxy resin, and the type thereof is not particularly limited.
- a curing agent for example, an amine curing agent, an acid anhydride curing agent, or the like can be used.
- the amine-based curing agent for example, ethylenediamine, polyamidoamine, or the like can be used.
- Examples of the acid anhydride curing agent include phthalic anhydride, hexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, tetrabromophthalic anhydride, and the like. be able to.
- an antifoaming agent may be added to the matrix resin in order to prevent generation of bubbles in the matrix resin or to eliminate the generated bubbles.
- the antifoaming agent is not particularly limited, and for example, a dimethyl silicone-based antifoaming agent (for example, TSA720 (trade name manufactured by Momentive Performance Materials Japan GK), etc.) can be used. .
- a diluent solvent may be added to the matrix resin in order to improve workability when a coating material for electrical equipment is applied to the structure with a brush, or when painting is performed using an airless spray or the like.
- the diluting solvent quick-drying thinner (for example, a mixture in which ethyl acetate and toluene are mixed at a mass ratio of 8: 2) and the like can be used.
- the diluent solvent is preferably contained in an amount of 1 to 10 parts by mass with respect to 100 parts by mass of the epoxy resin in order to improve the workability described above.
- the first filler is made of a whisker made of ZnO having a semiconductive volume resistivity.
- FIG. 1 is a perspective view schematically showing a first filler 10 contained in a coating material for electrical equipment according to an embodiment.
- the whisker constituting the first filler 10 is composed of a core part 11 and a needle-like crystal part 12 extending from the core part 11 in four axial directions, and has a tetrapot shape. Yes.
- the volume resistivity of the whisker is 1 to 5000 ⁇ ⁇ cm.
- the semiconductive volume resistivity means a range of 1 ⁇ 10 ⁇ 3 to 1 ⁇ 10 5 ⁇ ⁇ cm.
- the length L of the whisker needle crystal part 12 is 2 ⁇ m to 50 ⁇ m, and the needle crystal part
- the average diameter D (arithmetic average diameter) of the portion having the maximum diameter of 12 is preferably 0.2 ⁇ m to 3 ⁇ m.
- a semiconductive whisker made of ZnO for example, Panatetra (manufactured by Amtec Corporation) can be used.
- the first filler 10 is preferably contained in an amount of 1 to 60 parts by mass with respect to 100 parts by mass of the matrix resin. By containing the first filler 10 in this range, the first filler 10 connects the second fillers in the matrix resin to form a good conductive path, thereby improving workability such as painting. Can be secured.
- the surface of the whisker may be subjected to titanate coupling treatment or silane coupling treatment.
- titanate coupling treatment is suitable regardless of whether or not a diluent solvent is added to the matrix resin.
- silane coupling treatment is suitable when no diluent solvent is added to the matrix resin.
- titanate coupling agents used in the titanate coupling process include isopropyl triisostearoyl tight, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl-tris (dioctyl pyrophosphate) titanate, tetraisopropyl-bis (dioctyl phosphite) titanate, Use tetraoctyl-bis (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) -bis (ditridecyl) phosphite titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, etc. Can do.
- the titanate coupling treatment for example, a method of mechanically mixing whisker (unsurface-treated product) made of ZnO together with a titanate coupling agent using a container in which powder can be mixed can be used.
- a titanate coupling process the method (integral blend method) etc. which add a titanate coupling agent, for example when mix
- silane coupling agent used for the silane coupling treatment for example, epoxy silane, amino silane, vinyl silane, methacryl silane, mercapto silane, methoxy silane, ethoxy silane and the like can be used.
- silane coupling treatment for example, a method of mechanically mixing whiskers (unsurface-treated products) made of ZnO together with a silane coupling agent using a container in which powder can be mixed can be used. Further, as the silane coupling treatment, for example, a method of adding a silane coupling agent (integral blend method) when a whisker (unsurface-treated product) made of ZnO is blended with a resin can be used.
- the second filler is composed of particles having a semiconductive volume resistivity.
- the semiconductive volume resistivity is as described above.
- the second filler for example, a particle composed of Fe 2 O 3 or Fe 3 O 4.
- Fe 2 O 3 (specific gravity: about 5.2 g / cm 3 ) is a red powder, so-called bengara.
- the volume resistivity of Fe 2 O 3 is about 1 ⁇ 10 3 ⁇ ⁇ cm.
- the average particle diameter of Fe 2 O 3 is preferably 0.1 ⁇ m to 1 ⁇ m in order to ensure workability such as painting while exhibiting insulation resistance characteristics in the coating material for electrical equipment. Further, since the insulation resistance characteristics are good, the average particle diameter of Fe 2 O 3 is more preferably 0.5 ⁇ m to 1 ⁇ m.
- the insulation resistance characteristic is to indicate a value of about 1 ⁇ 10 6 to 1 ⁇ 10 18 ⁇ ⁇ cm in volume specific resistance (hereinafter the same).
- the average particle diameter is measured, for example, by observing a cross section of a predetermined resin containing the second filler dispersed therein with a scanning electron microscope (SEM) and measuring the particle diameter of each second filler. Then, it is obtained by arithmetic averaging.
- SEM scanning electron microscope
- Fe 2 O 3 is preferably contained in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the matrix resin. By containing Fe 2 O 3 in this range, workability such as formation of a conductive path and painting in the coating material for electric equipment can be ensured.
- Fe 3 O 4 (specific gravity: about 5.2 g / cm 3 ) is a black powder.
- the volume resistivity of Fe 3 O 4 is about 4 ⁇ 10 ⁇ 3 ⁇ ⁇ cm.
- the average particle diameter of Fe 3 O 4 is preferably 0.01 ⁇ m to 0.1 ⁇ m in order to ensure workability such as painting while exhibiting insulation resistance characteristics in the coating material for electrical equipment. Further, since the insulation resistance characteristics are good, the average particle size of Fe 3 O 4 is more preferably 0.05 ⁇ m to 0.08 ⁇ m. The average particle diameter is obtained in the same manner as when Fe 2 O 3 is used as the second filler.
- Fe 3 O 4 is preferably contained in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the matrix resin. By containing Fe 3 O 4 in this range, workability such as formation and painting of conductive paths in the coating material for electric equipment can be ensured.
- the third filler is made of a flat, fibrous, or layered material having insulating properties.
- the insulating property means that the volume resistivity is about 1 ⁇ 10 6 to 1 ⁇ 10 18 ⁇ ⁇ cm.
- the flat plate-like third filler is made of, for example, talc or boron nitride (BN).
- Talc is a flat compound composed mainly of MgO.SiO 2 .H 2 O.
- the volume resistivity of talc is about 1 ⁇ 10 14 to 1 ⁇ 10 15 ⁇ ⁇ cm.
- Boron nitride (BN) is a particle having a scaly structure. Boron nitride can be classified into hexagonal boron nitride, rhombohedral boron nitride, cubic boron nitride, turbostratic boron nitride, and wurtzite boron nitride depending on the crystal structure.
- hexagonal boron nitride which is a general boron nitride, is preferably used because it has a high accept ratio, high insulation resistance, and can further increase the dielectric breakdown electric field of the material.
- boron nitride when boron nitride is used as the plate-like third filler, since boron nitride itself has high thermal conductivity, for example, in a coating layer made of a coating material for electrical equipment, heat dissipation characteristics can be improved. it can.
- the average diameter of the flat material is preferably 1 ⁇ m to 50 ⁇ m.
- the average diameter of the plate-like substance is more preferably 10 ⁇ m to 30 ⁇ m.
- the average length of the longest straight line that can be drawn over the surface of the flat material (hereinafter referred to as the average straight line length) may be within the above range. .
- the plate-like third filler enters between the first filler and the second filler, and the first filler and the second filler.
- the filler can be uniformly dispersed in the matrix resin.
- the average diameter is obtained by observing the cured resin with an SEM (scanning electron microscope).
- the average straight line length can be obtained by observing the cured resin with an SEM (scanning electron microscope).
- the plate-like third filler is preferably contained in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the matrix resin. By containing the flat plate-like third filler in this range, the viscosity of the coating material for electric equipment can be optimally maintained.
- the plate-like third filler is more preferably contained in an amount of 1 to 15 parts by mass with respect to 100 parts by mass of the matrix resin.
- the fibrous third filler is composed of, for example, potassium titanate whisker or glass milled fiber.
- the average fiber length of the potassium titanate whisker and the glass milled fiber is preferably 1 ⁇ m to 50 ⁇ m, and more preferably 10 ⁇ m to 20 ⁇ m.
- the fibrous third filler enters between the first filler and the second filler, and the first filler and the second filler
- the two fillers can be uniformly dispersed in the matrix resin.
- the average fiber length is obtained by arithmetically averaging the lengths of the fibers in the longitudinal direction.
- the average fiber length can be obtained by observing the cured resin with an SEM (scanning electron microscope).
- the fibrous third filler is preferably contained in an amount of 1 to 60 parts by mass with respect to 100 parts by mass of the matrix resin. By containing the fibrous third filler in this range, the viscosity of the coating material for electric equipment can be optimally maintained.
- the fibrous third filler is more preferably contained in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the matrix resin.
- the layered third filler is made of, for example, mica or smectite.
- Mica is a kind of layered silicate mineral and is a layered compound composed mainly of SiO 2 , Al 2 O 3 , K 2 O, and crystal water.
- the volume resistivity of hard mica is about 1 ⁇ 10 12 to 1 ⁇ 10 15 ⁇ ⁇ cm.
- the volume resistivity of soft mica is about 1 ⁇ 10 10 to 1 ⁇ 10 13 ⁇ ⁇ cm. Since these mica exhibit the same property in the coating material for electric equipment according to the embodiment, they will be described below without distinction.
- the average diameter or average linear length of mica and smectite is preferably 0.1 ⁇ m to 2 ⁇ m, and more preferably 0.5 ⁇ m to 1 ⁇ m.
- the layered third filler is preferably contained in an amount of 1 to 30 parts by mass with respect to 100 parts by mass of the matrix resin. By containing the layered third filler in this range, the viscosity of the coating material for electrical equipment can be optimally maintained. Further, the layered third filler is more preferably contained in an amount of 1 to 15 parts by mass with respect to 100 parts by mass of the matrix resin.
- FIG. 2 schematically illustrates the configuration of the coating material 20 for an electric device according to the embodiment in order to explain the conductive path 60 formed by the first filler 10 and the second filler 30. It is a figure.
- the third filler 40 enters between the first filler 10 and the second filler 30, and the first filler 10 and the second filler 30 are separated from the matrix resin. 50 evenly dispersed. Thereby, the insulation resistance characteristic which the 1st filler 10 expresses can be improved.
- the particles of the second filler 30 come into contact with the first filler 10 to form a three-dimensional conductive path 60.
- first filler 10 and the second filler 30 are uniformly dispersed in the matrix resin 50 so that the first filler 10 and the second filler 30 are, for example, a coating for an electric device. It arranges uniformly in the coating layer which consists of material. Therefore, the conductive path 60 formed by the first filler 10 and the second filler 30 can be lengthened. Thereby, for example, even when the coating layer is thick or the coating layer has irregularities, a stable and long conductive path 60 can be formed. Therefore, the electric field concentrated between the coating layer and the foreign material can be relaxed.
- the foreign matter levitation electric field is an electric field at which foreign matter begins to rise, and the higher this value, the more the foreign matter can float and move around in the electrical equipment.
- the conductive path 60 is formed only by adding the first filler 10, it is necessary to bring the end portions of the first filler 10 close to each other. However, this is difficult even considering the thickness of the coating layer and the size of the first filler 10. Therefore, the conductive path 60 can be reliably formed by adding the second filler 30.
- the second filler 30 when only the second filler 30 is added, the second filler 30 is in the form of particles and has a small particle size. Therefore, even if the second filler 30 is uniformly dispersed, the conductive path 60 It becomes difficult to form.
- the content of the second filler 30 is increased, the viscosity increases and the workability decreases. Even when a diluting solvent is added, when the content of the second filler 30 is increased, the viscosity similarly increases.
- the particle size of the second filler 30 when the particle size of the second filler 30 is increased, the second filler 30 cannot be uniformly dispersed, and it is difficult to form the conductive path 60.
- the first filler 10 and the second filler 30 need to be added simultaneously and in an appropriate content.
- a dense packing structure is formed by containing the first filler 10 and the second filler 30 having different shapes.
- the conductive path 60 can be formed.
- the volume resistivity of the first filler 10 and the second filler 30 needs to be approximate and semiconductive. This is because, if the volume specific resistances of the two are greatly different, dielectric breakdown may occur at the adjacent ends of the two.
- the volume specific resistance of the semiconductive region is the antistatic region, it is also suitable for preventing foreign matter from being charged.
- the needle-like crystal part 12 of the first filler 10 may be broken in the stirring process. Even in such a case, the portion where the third filler 40 is broken is supported by containing the third filler 40 having insulating properties. As a result, the conductive path 60 can be formed. On the other hand, even when the first filler 10 is not folded, the first filler 10 is supported by the third filler 40, so that the conductive path can be formed reliably.
- a master batch is prepared by stirring a part of the epoxy resin to be blended (for example, about 10 to 50 mass% of the total blended amount of the epoxy resin) and a predetermined amount of the first filler 10 with a rotating and rotating mixer or the like. To do.
- the remainder of the epoxy resin, a predetermined amount of the second filler 30 and a predetermined amount of the third filler 40 are added to the master batch, and the mixture is agitated by a revolving mixer.
- the coating material 20 for electrical equipment is manufactured.
- the antifoaming agent when added, the antifoaming agent is added when a master batch is prepared.
- the dilution solvent or the curing agent is added when the remainder of the epoxy resin, the second filler 30 and the third filler 40 are added to the master batch.
- a master batch containing the first filler 10 is prepared, and the remaining components are mixed with the master batch, whereby the first filler 10 and the first filler 10 are mixed in the matrix resin 50.
- the second filler 30 and the third filler 40 can be uniformly dispersed. As a result, a good conductive path 60 can be formed.
- the coating material 20 for an electric device may be manufactured as follows.
- a part of the epoxy resin to be blended, a predetermined amount of the first filler 10, a predetermined amount of the second filler 30, and a predetermined amount of the third filler 40 are larger than the sizes of these fillers.
- the first mixture is formed by stirring together with the stirring particles having a size (particle diameter) by a rotating and rotating mixer or the like.
- the stirring particles are composed of, for example, glass particles.
- the remainder of the epoxy resin is added to the first mixture and stirred to form a second mixture.
- the first mixture and the remainder of the epoxy resin are stirred using a stirring blade or the like.
- the second mixture is filtered to separate the stirring particles.
- other than the stirring particles for example, pass through a filter to be filtered.
- the coating material 20 for electrical equipment is manufactured.
- the antifoaming agent when added, the antifoaming agent is added when the first mixture is formed.
- curing agent When adding a dilution solvent and a hardening
- stirring can be performed with high shear.
- a filler that easily aggregates can be dispersed while being loosened. Therefore, the first filler 10, the second filler 30, and the third filler 40 can be uniformly dispersed in the matrix resin 50. As a result, a good conductive path 60 can be formed.
- the cast cured product can be manufactured by, for example, injecting and molding the coating material 20 for an electrical device produced as described above into a mold and allowing it to stand for a predetermined time to be cured.
- a coating layer film
- a coating layer can be formed by apply
- the coating layer 20 can be formed by spraying the coating material 20 for an electrical device on the structure using airless spray or the like, and allowing it to stand for a predetermined time to be cured.
- the coating layer When forming the coating layer, it is preferable that the coating layer is thicker from the viewpoint of expression of insulation resistance characteristics. From the viewpoint of workability when forming the coating layer, the upper limit of the thickness of the coating layer is about 500 ⁇ m.
- FIG. 3 is a partial cross-sectional view of an electric device in which a coating layer 74 is formed using the electric material coating material 20 of the embodiment. Note that FIG. 3 shows a hermetic insulating device 70 as an example of an electric device.
- the hermetic insulation device 70 includes a cylindrical metal container 71 that can be divided into a plurality of parts in the axial direction, a high-voltage conductor 72 that extends in the axial direction at the center, and a metal container 71. And provided spacers 73.
- the metal container 71 is configured to cover the periphery of the high voltage conductor 72 with a predetermined gap from the high voltage conductor 72.
- the spacer 73 is disposed so as to divide the space inside the metal container 71 in the axial direction.
- a through hole is formed in the center of the spacer 73, and the high voltage conductor 72 passes through the through hole.
- the high voltage conductor 72 is supported by the spacer 73.
- a coating layer 74 made of the coating material 20 for electrical equipment of the present embodiment is formed on the inner wall surface of the metal container 71.
- An insulating gas 75 such as SF 6 gas is enclosed in the metal container 71.
- the coating layer 74 made of the coating material 20 for electrical equipment that provides good insulation resistance characteristics on the inner wall surface of the metal container 71 the movement of foreign matter existing on the surface of the coating layer 74 is suppressed. be able to. Therefore, the design electric field of the metal container can be increased as compared with the conventional hermetic insulation device, and the metal container 71 can be made compact.
- the coating material 20 for electric equipment of embodiment is various, for example, an electric equipment, an electronic device, an industrial equipment, a heavy electrical machinery. It can be applied to vessels. And even when applied to these, the same effect as mentioned above can be obtained.
- the first filler 10, the second filler 30, and the third filler 40 are uniformly dispersed in the matrix resin 50.
- a good conductive path 60 can be formed.
- the coating material 20 for electrical equipment a high foreign matter floating electric field can be obtained, and for example, the floating and movement of foreign matter in the electrical equipment can be suppressed.
- the coating material for an electric device has an effect of suppressing floating and movement of a foreign substance in the electric device.
- a coating material 20 for electrical equipment was produced as follows.
- a bisphenol A type epoxy resin product name: Epofix
- a whisker that is the first filler 10 a whisker having a length L of the needle crystal portion 12 of 2 ⁇ m to 50 ⁇ m and an average diameter D of the portion having the maximum diameter of the needle crystal portion 12 of 3 ⁇ m is used. did.
- Table 1 shows materials and parts by mass of each filler added to 100 parts by mass of epoxy resin (total amount of epoxy resin).
- the second filler 30 Fe 2 O 3 having an average particle diameter of 0.8 ⁇ m was used.
- Fe 3 O 4 having an average particle diameter of 0.06 ⁇ m was used.
- the talc of the third filler 40 one having an average linear length of 10 ⁇ m was used.
- the boron nitride of the third filler 40 one having an average linear length of 10 ⁇ m was used.
- a potassium titanate whisker having an average fiber length of 10 ⁇ m was used.
- the mica of the third filler 40 one having an average linear length of 1 ⁇ m was used.
- the smectite of the third filler 40 one having an average linear length of 1 ⁇ m was used.
- FIG. 4 is a diagram showing a cross section of the test apparatus 80 in which the foreign object floating electric field was evaluated.
- the test apparatus 80 includes an aluminum metal container 81 having an inner diameter of 254 mm, and a high voltage conductor 82 having a diameter of 154 mm at the center of the metal container 81.
- the high voltage conductor 82 was installed such that the central axes of the metal container 81 and the high voltage conductor 82 are coaxial.
- the coating material 20 for electrical equipment (sample 1 to sample 36) was applied to the inner wall surface of the lower half of the metal container 81. And it forcedly dried (80 degreeC, 30 minutes) with the drying furnace, and the coating layer 83 was formed. That is, 36 kinds of metal containers 81 each having the coating layer 83 formed by applying each of the samples 1 to 36 were prepared. The thickness of any coating layer 83 was 100 ⁇ m.
- the metal container 81 was filled with SF 6 gas (0.4 MPa).
- the applied electric field was 0.6 kVrms / mm to 4.0 kVrms / mm in alternating current (AC).
- the applied electric field was increased by 0.2 kVrms / mm every minute.
- the electric field at which one of the metal foreign objects 84 first floated was defined as the foreign object floating electric field. Measurements were made 5 times for each sample.
- Table 1 shows the measurement results of the foreign substance floating electric field in each sample.
- the result shown in Table 1 is an arithmetic average of five measurement results.
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Abstract
Description
次に、実施の形態の電気機器用コーティング材が、電気機器内における異物の浮上や動き回りを抑制する効果を有することについて説明する。
Claims (15)
- エポキシ樹脂からなるマトリックス樹脂と、
前記マトリックス樹脂に分散して含有され、半導電性の体積固有抵抗を有するウィスカからなる第1の充填剤と、
前記マトリックス樹脂に分散して含有され、半導電性の体積固有抵抗を有する粒子からなる第2の充填剤と、
前記マトリックス樹脂に分散して含有され、絶縁性を有する、平板状、繊維状または層状の物質からなる第3の充填剤と
を具備することを特徴とする電気機器用コーティング材。 - 前記ウィスカが、ZnOからなり、核部および前記核部から4軸方向に延びる針状結晶部を備えるテトラポット形状であることを特徴とする請求項1記載の電気機器用コーティング材。
- 前記第2の充填剤が、Fe2O3またはFe3O4からなることを特徴とする請求項1または2記載の電気機器用コーティング材。
- 平板状の前記第3の充填剤が、タルクまたは窒化ホウ素からなることを特徴とする請求項1乃至3のいずれか1項記載の電気機器用コーティング材。
- 繊維状の前記第3の充填剤が、チタン酸カリウムウィスカまたはガラスミルドファイバからなることを特徴とする請求項1乃至3のいずれか1項記載の電気機器用コーティング材。
- 層状の前記第3の充填剤が、マイカまたはスメクタイトからなることを特徴とする請求項1乃至3のいずれか1項記載の電気機器用コーティング材。
- 前記第1の充填剤を構成するウィスカの表面は、チタネートカップリング処理が施されていることを特徴とする請求項1乃至6のいずれか1項記載の電気機器用コーティング材。
- 前記第1の充填剤が、前記マトリックス樹脂100質量部に対して1~60質量部含有されていることを特徴とする請求項1乃至7のいずれか1項記載の電気機器用コーティング材。
- 前記マトリックス樹脂を硬化させる硬化剤が添加されたことを特徴とする請求項1乃至8のいずれか1項記載の電気機器用コーティング材。
- 前記マトリックス樹脂が、希釈溶剤をさらに含有することを特徴とする請求項1乃至9のいずれか1項記載の電気機器用コーティング材。
- 配合するエポキシ樹脂の一部、およびZnOからなり、半導電性の体積固有抵抗を有するウィスカからなる第1の充填剤を攪拌してマスターバッチを作製する工程と、
前記マスターバッチに、前記エポキシ樹脂の残部、半導電性の体積固有抵抗を有する粒子からなる第2の充填剤、および絶縁性を有する、平板状、繊維状または層状の物質からなる第3の充填剤を加えて攪拌し、混合物を形成する工程と
を具備することを特徴とする電気機器用コーティング材の製造方法。 - 前記混合物に、前記マトリックス樹脂を硬化させる硬化剤を添加する工程を具備することを特徴とする請求項11記載の電気機器用コーティング材の製造方法。
- 配合するエポキシ樹脂の一部、半導電性の体積固有抵抗を有するウィスカからなる第1の充填剤、半導電性の体積固有抵抗を有する粒子からなる第2の充填剤、および絶縁性を有する、平板状、繊維状または層状の物質からなる第3の充填剤を、これらの充填材よりも粒径の大きな攪拌粒子とともに攪拌し、第1の混合物を形成する工程と、
前記第1の混合物に、前記エポキシ樹脂の残部を加えて攪拌し、第2の混合物を形成する工程と、
前記第2の混合物を濾過して、前記攪拌粒子を分離する工程と
を具備することを特徴とする電気機器用コーティング材の製造方法。 - 前記攪拌粒子を分離した前記第2の混合物に、前記マトリックス樹脂を硬化させる硬化剤を添加する工程を具備することを特徴とする請求項13記載の電気機器用コーティング材の製造方法。
- 一方向に延設された導体と、
前記導体と所定の空隙をあけて前記導体の周囲を覆う、絶縁ガスが充填された金属容器と、
前記金属容器の内壁面に形成された、請求項1乃至10のいずれか1項記載の電気機器用コーティング材からなるコーティング層と
を具備することを特徴とする密閉型絶縁装置。
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