WO2013175882A1 - 切断機構、接合機構、基板処理システム、基板処理装置、及び基板処理方法 - Google Patents
切断機構、接合機構、基板処理システム、基板処理装置、及び基板処理方法 Download PDFInfo
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- WO2013175882A1 WO2013175882A1 PCT/JP2013/060705 JP2013060705W WO2013175882A1 WO 2013175882 A1 WO2013175882 A1 WO 2013175882A1 JP 2013060705 W JP2013060705 W JP 2013060705W WO 2013175882 A1 WO2013175882 A1 WO 2013175882A1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Definitions
- aspects of the present invention relate to a cutting mechanism, a bonding mechanism, a substrate processing system, a substrate processing apparatus, and a substrate processing method.
- a transparent electrode such as ITO (Indium Tin Oxide) or a semiconductor material such as Si is deposited on a flat glass substrate, and then a metal material is evaporated and a photoresist is applied. Then, the circuit pattern is transferred. Then, after developing the photoresist, a circuit pattern or the like is formed by etching.
- a roll-to-roll method hereinafter simply “roll method” in which a display element is formed on a flexible substrate (for example, a film member such as polyimide, PET, metal foil, or an ultrathin glass sheet).
- a flexible substrate for example, a film member such as polyimide, PET, metal foil, or an ultrathin glass sheet.
- Patent Document 2 a flexible long sheet (substrate) that is wound around a feed roller and traveled is disposed in the vicinity of the outer peripheral portion of a rotatable cylindrical mask, and the mask pattern is continuous.
- techniques for exposing a substrate have been proposed.
- Patent Document 3 a pattern forming region of a flexible long sheet (substrate) sent by a roll method is temporarily held on a flat stage, and a mask projected via an enlargement projection lens is disclosed. A technique for scanning and exposing a pattern image to a pattern formation region has been proposed.
- the substrate transport speed suitable for the process varies from unit to unit (each processing content) depending on the performance of each processing unit.
- the substrate transport speed (tact) is limited by the sensitivity of the photosensitive layer applied to the substrate surface, the brightness of the illumination light for exposure, and the like.
- a wet process such as etching or plating, or a drying / heating process after the wet process, there are obtained advantages that the liquid tank and the drying / heating furnace can be reduced in size by slowly transporting the substrate.
- the substrate transport speed (of the production line) The speed is adjusted to the processing unit having the lowest substrate transport speed during processing.
- a processing unit with a high processing speed transports the substrate at a low speed despite having a margin in performance. Therefore, the efficiency of the processing unit is deteriorated and the productivity of the entire production line may not be improved.
- An object of an aspect of the present invention is to provide a cutting mechanism, a bonding mechanism, a substrate processing system, and a substrate processing method that can contribute to an improvement in productivity.
- Patent Document 1 an electronic device is formed on a sheet substrate by mainly using a printing (inkjet) method while conveying a flexible sheet substrate by a roll method.
- a printing (inkjet) method in a general printing site, when the remaining amount of the sheet substrate wound around the supply roll decreases, the printing apparatus is temporarily stopped, the sheet substrate is cut between the printing apparatus and the collection roll, and the collection roll The printed sheet substrate wound as is sent to the next process.
- a sheet substrate in the middle of printing remains in the printing path from the entrance to the exit of the printing apparatus, and this is all discarded as defective products.
- the printing cost is extremely low.
- the manufacturing cost per unit length (m) of the sheet substrate is still expensive, and when the sheet substrate remaining in the apparatus is discarded as in a general printing site. This increases waste and increases costs.
- the sheet substrate is a series of a plurality of processing apparatuses, for example, a photosensitive layer printing apparatus, an exposure apparatus such as Patent Document 3, a wet processing apparatus, a drying apparatus. After continuously passing through the apparatus or the like, it is wound up on a collection roll. Accordingly, it is assumed that the sheet substrates in a plurality of processing apparatuses (processing steps) from the supply roll to the collection roll are extremely long, and once the conveyance of the sheet substrate is stopped, the sheet substrate is extended over a considerably long distance. Will be wasted.
- Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method in which productivity is suppressed by suppressing an increase in cost.
- a first processing unit that continuously performs a first process on a substrate transported at a speed V1 in the longitudinal direction, and a substrate processed by the first processing unit.
- a substrate processing system comprising: a second processing unit that transports the substrate at a speed V2 and continuously performs a second process on the substrate, wherein the speed of each of the first and second processing units depends on the performance of each If the relationship can be set to V1> V2, a plurality of second processing units are provided, and after the first processing unit, a cutting mechanism that cuts the substrate on which the first processing has been performed with a predetermined length in the longitudinal direction; And a selective loading mechanism for loading the cut substrate into any of the plurality of second processing units, and the speed relationship can be set to V1 ⁇ V2 depending on the performance of each of the first and second processing units.
- a plurality of first processing units are provided. Both have a joining mechanism that sequentially joins a plurality of substrates subjected to the first processing by each of the plurality of first processing units in the longitudinal direction and puts them into the second processing unit before the second processing unit.
- a substrate processing system characterized by comprising:
- the first processing unit continuously performs the first processing on the substrate transported at the speed V1 in the longitudinal direction, and is processed by the first processing unit.
- a substrate processing method comprising transporting a substrate at a speed V2 and continuously performing a second process on the substrate by a second processing unit, depending on the performance of each of the first and second processing units.
- the speed relationship can be set to V1> V2
- a plurality of second processing units are used, and the substrate subjected to the first processing is cut after the first processing unit by a predetermined length in the longitudinal direction.
- the accumulated amount of the substrate is variable according to the cutting unit for cutting the substrate subjected to the predetermined processing and the transport amount of the substrate subjected to the predetermined processing.
- a buffer unit that adjusts the conveyance amount of the substrate conveyed toward the unit.
- the accumulated amount of the substrate is variable according to the joining portion for joining the substrates to be subjected to the predetermined processing and the transport amount of the substrates to be subjected to the predetermined processing, And a buffer unit that adjusts the transport amount of the substrate that is input to the predetermined process from the unit.
- the substrate transport speed in the first processing unit in the substrate processing system in which the substrate transported in the longitudinal direction is passed through the first processing unit and then passed through the second processing unit.
- a cutting mechanism for cutting the substrate at a predetermined length in the longitudinal direction is provided between the first processing unit and the second processing unit.
- the substrate transport speed in the second processing unit is increased with respect to the substrate transport speed in the one processing unit, the substrate is joined in the longitudinal direction between the first processing unit and the second processing unit.
- a substrate processing system comprising a mechanism is provided.
- a first mounting portion for mounting a first roll wound with a long first substrate and a second roll for mounting a second roll wound with a long second substrate. 2 is disposed between the processing mechanism and the first mounting part, the processing mechanism performing a predetermined process while feeding one of the first substrate and the second substrate as a processing substrate in the long direction.
- the first substrate supplied from the first roll is temporarily accumulated within a predetermined longest accumulation range and then sent to the processing mechanism, and the first substrate is placed between the buffer mechanism and the first mounting portion.
- a substrate processing apparatus comprising: a substrate reconnecting mechanism that cuts and joins a leading end portion of a second substrate supplied from a second roll to a terminal portion of a first substrate to be cut and sends the substrate to a buffer mechanism.
- a first mounting portion for mounting a first roll wound with a long first substrate and a second roll for mounting a second roll wound with a long second substrate. 2 is disposed between the processing mechanism and the first mounting part, the processing mechanism performing a predetermined process while feeding one of the first substrate and the second substrate as a processing substrate in the long direction.
- the first substrate supplied from the first roll is temporarily accumulated within a predetermined longest accumulation range and then sent to the processing mechanism, and the first substrate is cut between the buffer mechanism and the first mounting portion.
- a substrate switching mechanism that connects the tip of the second substrate supplied from the second roll to a predetermined portion on the buffer mechanism side of the first substrate to be cut and sends the substrate to the buffer mechanism.
- a first mounting portion that detachably mounts a first roll on which a long first substrate is wound, and a second substrate having a standard equivalent to the first substrate are provided with a predetermined length.
- a processing mechanism that performs a predetermined process while feeding one of the first substrate and the second substrate as a processing substrate in the long direction, and the processing mechanism and the first mounting unit.
- a buffer mechanism disposed between and temporarily storing the first substrate supplied from the first roll within a predetermined longest accumulation range and then sending the first substrate to the processing mechanism; and between the buffer mechanism and the first mounting portion Cutting the substrate, connecting the tip of the second substrate supplied from the holding unit to a predetermined portion of the first substrate to be cut, on the buffer mechanism side, and transferring the substrate to the buffer mechanism;
- a substrate processing apparatus is provided.
- a substrate processing method for performing predetermined processing by a processing mechanism while feeding a long substrate that has been input as a processing substrate in a long direction. Mounting the rotated first roll on the first roll mounting portion, mounting the second roll wound with a long substrate on the second roll mounting portion, and between the processing mechanism and the first mounting portion The first substrate supplied from the first roll is temporarily accumulated within a predetermined longest accumulation range and then sent to the processing mechanism, and the temporarily accumulated first substrate is While being sent to the processing mechanism, the first substrate is cut between the buffer mechanism and the first mounting portion, and is supplied from the second roll to a predetermined portion on the buffer mechanism side of the first substrate to be cut.
- a substrate processing method comprising: coupling a tip portion of a second substrate; It is.
- a substrate processing method in which a predetermined processing is performed by a processing mechanism while feeding a long substrate that has been input in a long direction as a processing substrate, Mounting a first roll on which a long substrate is wound on the first roll mounting portion, holding a second substrate of a standard equivalent to the first substrate in a holding portion with a predetermined length, a processing mechanism, The buffer mechanism disposed between the first mounting unit temporarily accumulates the first substrate supplied from the first roll within a predetermined longest accumulation range, and then sends the first substrate to the processing mechanism.
- a substrate processing method includes connecting a tip portion of a second substrate supplied from a holding unit.
- the processing units used in each of the plurality of processing steps can be efficiently operated, and the productivity of the entire manufacturing line related to substrate processing can be improved.
- FIG. 1 is a diagram schematically illustrating a roll-type substrate processing system SYS that sequentially passes a sheet-like substrate P through three processing steps A, B, and C as an example.
- the substrate processing system performs a processing unit UA (first processing unit) that performs processing A (first processing) on the substrate P as step A, and processing B (first processing, second processing) as step B.
- Processing unit UB first processing unit, second processing unit
- Processing unit UC second processing unit
- processing C second processing
- cutting mechanism CU10, joining mechanism PU10, selective charging mechanism ST1 and ST2 and the control unit CT are mainly configured.
- the processing unit UA includes a roll mounting portion RSA on which the supply roll RRA is mounted, and sends the substrate P subjected to the processing A to the cutting mechanism CU10.
- the processing units UB are each composed of processing units UB1 to UB3 that perform the same processing B.
- the processing units UB are arranged vertically in three stages or horizontally in three rows on the downstream side of the processing unit UA in the substrate transport direction.
- Each of the processing units UB1 to UB3 includes mounting portions RSB11 to RSB31 to which the roll of the substrate P subjected to the processing A is mounted, and mounting portions RSB12 to RSB32 to which the roll of the substrate P subjected to the processing B is mounted.
- the substrate P from the rolls RRB11 to RRB31 (hereinafter referred to as child rolls RRB11 to RRB31 as appropriate) mounted on the mounting portions RSB11 to RSB31 is mounted on the mounting portions RSB12 to RSB32 after being treated B.
- Rolls RRB12 to RRB32 hereinafter appropriately referred to as child rolls RRB12 to RRB32).
- a roll RR ⁇ b> 1 that winds up the substrate P subjected to the processing A is provided after the cutting mechanism CU ⁇ b> 10 at the rear stage of the processing unit UA.
- the substrate P is cut there, and the roll RR1 is placed in any of the mounting portions RSB11 to RSB31 of each of the processing units UB1 to UB3 and any of the child rolls RRB11 to RRB31. Installed as one.
- the processing unit UC can mount any one of the child rolls RRB12 to RRB32 subjected to the processing B in the processing units UB1 to UB3 as a roll RR2.
- the substrate P (intermediate product subjected to the processes A and B) wound around the roll RR2 is carried into the processing unit UC via the joining mechanism PU10 and subjected to the process C.
- the substrate P that has received the process C is wound up and collected by the collection roll RRC mounted on the roll mounting unit RSC.
- Processing speed VA processing speed of substrate P
- processing speed VB processing speed of substrate P
- processing of processing C in processing unit UC The relationship of the speed VC (conveying speed of the substrate P) is as follows.
- VA ⁇ VC> VB Since the transport speed of the substrate P is VA> VB between the processing unit UA and any one of the processing units UB1 to UB3, the processing unit UA has a high transport speed (V1).
- any one of the processing units UB1 to UB3 corresponds to the second processing unit having a low transport speed (V2).
- any one of the processing units UB1 to UB3 is transport speed (V1).
- the processing unit UC corresponds to a second processing unit having a high transport speed (V2).
- the processing speeds VA and VC can be set to about three times the processing speed VB.
- the substrate P connected to one from the supply roll RRA to the recovery roll RRC sequentially passes through the processing units UA, UB, UC.
- the conveyance speed is adjusted to the slowest processing speed VB. That is, the tact (line speed, productivity) of the entire production line is regulated by the slowest processing unit.
- a configuration in which the processing unit UB having a low processing speed is double-tracked can be configured not to be bound by the rule.
- the substrate P is wound up by a predetermined length on the roll RR1, the substrate P is cut without temporarily stopping the processing step A and the processing step B.
- a mechanism CU10 is required.
- the cutting mechanism CU10 mainly cuts the substrate P that has been subjected to the processing A by a predetermined length. As shown in FIGS. 1 and 2, the cutting mechanism CU10 and the first buffer mechanism (first buffer unit) BF1 1 splicer part CSa (cutting part). Further, the cutting mechanism CU10 further includes an interlock control unit that links the operation of the first splicer unit CSa (cutting unit) with the accumulated amount of the substrate P in the first buffer mechanism BF1 (buffer unit).
- the first buffer mechanism BF1 is provided between the unit UA that performs the process A as the first process and the first splicer part CSa, and folds the substrate P with a large number of rollers or the like to accumulate a predetermined length.
- a roller mechanism DR1 is provided, and the substrate P is carried in and out while the accumulation length of the substrate P is variably adjusted by the vertical movement of the dancer roller.
- the first buffer mechanism BF1 is provided adjacent to the downstream side in the transport direction of the substrate P of the processing unit UA, and adjusts the transport amount (or transport speed) of the substrate P transported to the first splicer unit CSa.
- a roller NR1 (see FIG. 5). Driving of the dancer roller mechanism DR1 and driving of the nip driving roller NR1 are controlled by the control unit CT.
- the first splicer part CSa has a suction pad 1 formed of, for example, a porous material on the upper surface, and includes a slider 2 that is movable in the transport direction of the substrate P (hereinafter simply referred to as the transport direction), and the slider 2.
- the drive unit 4 that raises and lowers the elevator 3, and when the elevator 3 is in the raised position, it moves in the width direction of the substrate P,
- the cutter unit 5 capable of cutting the substrate P adsorbed to the suction pad 1 of the slider 2, the adhering unit 6 capable of adhering the adhesive tape TP to the substrate P, and the elevator 3 are provided above the processing A.
- a holding portion 8 (movable up and down) that holds the winding shaft 7 for the roll RR1 that winds the substrate P to which the substrate P is applied on both sides.
- the take-up shaft 7 has a resin film or material having a high adhesive force attached to a part (or the entire circumference) of the outer peripheral surface thereof, and the tip end of the substrate P is attached to the outer peripheral surface of the take-up shaft 7. After the contact, the substrate P can be automatically wound by rotating the winding shaft 7.
- slider 2, lift 3, drive unit 4, cutter unit 5, pasting unit 6, and holding unit 8 are configured as an integrated station unit SN, and can be placed on a caster table and transported. And it can be positioned at a predetermined position.
- Each drive of these slider 2, the drive part 4, the cutter part 5, and the sticking part 6 is controlled by the control part CT (refer FIG. 5).
- the station portion SN is movable in the longitudinal direction while holding the substrate P, and includes a moving portion including the slider 2, the lifting platform 3, the driving portion 4, and the like, a cutting region by the cutting mechanism CU10, or a bonding mechanism PU10. A movement control unit that moves the moving unit to the joining region.
- the affixing part 6 in this embodiment shall adhere
- the other affixing system may be sufficient.
- the substrate P is a resin film or the like
- a portion to be bonded to the substrate P is A heating and pressure bonding method or a method such as ultrasonic bonding may be used.
- the suction pad 1 provided on the upper surface of the slider 2 holds the substrate P by a vacuum pressure.
- the substrate P is placed on the upper surface of the slider 1 by a mechanical clamping mechanism (clamp band or the like) other than the vacuum pressure.
- the structure which latches may be sufficient.
- the selective loading mechanism ST1 shown in FIG. 1 is a roll RR1 (hereinafter referred to as a child roll RR1) in which the substrate P on which the process A has been wound is wound around the take-up shaft 7 under the control of the control unit CT.
- a child roll RR1 in which the substrate P on which the process A has been wound is wound around the take-up shaft 7 under the control of the control unit CT.
- One of the child rolls RRB11, RRB21, and RRB31 is selectively inserted into any of the mounting parts RSB11 to RSB31, and a spare roll RR1 is unloaded from the holding part 8 of the first splicer part CSa that is vacant.
- the take-up shaft 7 is conveyed.
- the processing speeds VA and VC are about three times the processing speed VC, and three processing units UB are installed, so that the child roll RR1 (that is, the child rolls RRB11 to RRB31, RRB12 to RRB32, The length of the substrate P taken up by RR2) to be described later is set to about 1/3 of the length of the substrate P wound around the supply roll RRA serving as a parent roll. Accordingly, the cutting mechanism CU10 cuts the substrate P at every predetermined length that divides the entire length of the substrate P wound around the supply roll RRA into approximately three equal parts.
- the selective loading mechanism ST2 in FIG. 1 is one of the child rolls RRB12 to RRB32 of the mounting portions RSB12 to RSB32 in which the substrate P that has been subjected to the processing B in any of the processing units UB1 to UB3 is wound up by a predetermined length. Is selected under the control of the control unit CT and put into the joining mechanism PU10 (roll conveyance), and any of the child rolls RRB12 to RRB32 is conveyed and spared for the vacant mounting parts RSB12 to RSB32. A take-up shaft is attached.
- the joining mechanism PU10 mainly joins one of the child rolls RRB12 to RRB32, which has been subjected to the processing B and conveyed, as a child roll RR2, near the end of the substrate that has been previously charged and cut.
- a second splicer part CSb (joining part) and a second buffer mechanism (second buffer part) BF2 are provided.
- the bonding mechanism PU10 has a variable amount of accumulated substrates according to the second splicer part CSb (bonding part) that bonds the substrates subjected to the processing B and the transport amount of the substrates subjected to the processing B.
- a second buffer mechanism (buffer unit) BF2 that adjusts the transport amount of the substrate put into the process B from the bonding unit.
- the second splicer unit CSb is installed in a state where the station unit SN installed in the first splicer unit CSa described above reverses the transport direction of the substrate P. That is, the second splicer part CSb has a suction pad 1 on the upper surface, a slider 2 that is movable in the transport direction, a lift 3 with a guide rail that supports the slider 2 so as to be movable in the transport direction, and a lift Drive unit 4 that moves up and down 3, and cutter unit 5 that can move in the width direction of substrate P and cut substrate P adsorbed to adsorption pad 1 of slider 2 when elevating platform 3 is in the raised position.
- the second buffer mechanism BF2 is configured in the same manner as the first buffer mechanism BF1, and variably accumulates the substrate P carried into the processing unit UC within an adjustable length range.
- the substrate P of the processing unit UC Adjacent to the upstream side in the transport direction.
- the second buffer mechanism BF2 includes a dancer roller mechanism DR2 capable of variably adjusting the accumulated amount of the substrate P by a plurality of rollers adjacent in the transport direction of the substrate P moving up and down in opposite directions, and the second splicer unit CSb.
- a nip drive roller NR2 (see FIG. 5) that adjusts the transport amount (transport speed) of the substrate P transported to the dancer roller mechanism DR2.
- Driving of the dancer roller mechanism DR2 and driving of the nip driving roller NR2 are controlled by the control unit CT.
- FIG. 5 is a control block diagram in the substrate processing system shown in FIGS.
- the control unit CT controls the operations of the processing units UA, UB (UB1 to UB3) and UC, and includes a slider 2 and a drive unit 4 provided in each of the cutting mechanism CU10 and the joining mechanism PU10.
- the driving of the cutter unit 5, the pasting unit 6, the selection loading mechanisms ST1 and ST2, the dancer roller mechanisms DR1 and DR2, the nip driving rollers NR1 and NR2, and the like are comprehensively controlled.
- control unit CT counts and manages the rotation of the supply roll RRA and the collection roll RRC, the transport length of the substrate P in each process (each processing unit), and the substrate of each roll serving as the substrate P supply side. Count and manage the remaining amount and the substrate winding amount of each roll on the substrate P collection side, manage the overall tact of processing steps A to C, and process problems for each roll. It also manages information such as the presence / absence and the extent of failure and location.
- the control unit CT includes an interlock control unit that links the operation of the cutting mechanism CU10 and the amount of accumulated substrate P in the first buffer unit BF1. Similarly, the control unit CT includes an interlocking control unit that links the operation of the bonding mechanism PU10 and the accumulated amount of the substrate P in the second buffer unit BF2.
- the operation of the substrate processing system configured as described above will be described.
- the child roll RRB12 is conveyed to the holding unit 8 of the second splicer unit CSb by the selective charging mechanism ST2.
- the processing B is performed on the substrate P drawn from the child roll RRB21 mounted on the mounting portion RSB21.
- the processing unit UB3 stands by until the child roll RRB31 to be processed next is mounted on the mounting unit RSB31.
- the nip driving roller NR1 is driven in the first buffer mechanism BF1. And the supply of the substrate P to the first splicer unit CSa is stopped. At this time, processing A is continuously performed in the processing unit UA, and the substrate P is sent to the first buffer mechanism BF1. Therefore, the dancer roller mechanism DR1 in the first buffer mechanism BF1 is driven in a direction that increases the accumulation amount of the substrate P.
- the substrate P is cut in the first splicer unit CSa.
- the lift 3 is raised together with the slider 2 by the operation of the drive unit 4.
- the suction pad 1 sucks and holds the substrate P from the back surface (lower surface) and positions it at a cutting position by the cutter unit 5.
- the cutter unit 5 moves in the width direction of the substrate P and cuts the substrate P.
- the selective loading mechanism ST1 loads the child roll RR1 into the mounting portion RSB31 of the processing unit UB3 here as the child roll RRB31.
- the selective charging mechanism ST1 loads the preliminary winding shaft 7 into the holding portion 8 of the first splicer portion CSa that has become empty after the child roll RR1 is discharged.
- the slider when the take-up shaft 7 is attached to the holding part 8, the slider is arranged such that the tip portion of the substrate P sucked and held on the upper surface of the slider 2 is positioned below the take-up shaft 7. 2 moves at the same time (the nip driving roller NR1 also rotates in synchronization with a predetermined amount), the holding portion 8 supporting the winding shaft 7 is lowered by a certain distance, and the tip portion of the substrate P is the outer periphery of the winding shaft 7 Adheres to the adhesive part of the surface.
- the rotational driving of the nip driving roller NR1 and the new take-up shaft 7 is resumed, the supply of the substrate P from the first buffer mechanism BF1 is resumed, and the substrate P is taken up by the new take-up shaft 7.
- the nip driving roller NR1 is slightly faster than the feed rate of the substrate P corresponding to the processing speed VA in the processing unit UA (that is, the speed at which the substrate P is sent to the first buffer mechanism BF1). It is rotated by.
- the dancer roller mechanism DR1 is driven in a direction to reduce the accumulation amount of the substrate P in accordance with the driving of the nip driving roller NR1.
- the nip driving roller NR1 is driven at the same speed as the feeding speed of the substrate P in the processing unit UA.
- the substrate P is pulled out from the child roll RRB31 mounted on the mounting portion RSB31 of the processing unit UB3, sent at a speed corresponding to the processing speed VB, processed B, and mounted on the mounting portion RSB32. It is wound on a roll RRB32.
- the processing unit UB2 completes the processing B for the substrate P drawn from the child roll RRB21.
- the child roll RRB2 that has wound up is waiting at the mounting portion RSB22.
- processing C is continuously performed in the processing unit UC. Therefore, the dancer roller mechanism DR2 is activated, and the substrate P stored in the second buffer mechanism BF2 is sent out to the processing unit UC at a constant speed according to the feed amount (processing speed VC) of the substrate P in the processing unit UC. .
- the lift 3 is lifted together with the slider 2 by the operation of the driving section 4 after the slider 2 has moved to a position facing the cutter section 5 as in the cutting process in the first splicer section CSa.
- the suction pad 1 sucks and holds the substrate P from the child roll RRB 12 from the back surface (lower surface) and positions it at the cutting position by the cutter unit 5.
- the cutter unit 5 moves in the width direction of the substrate P and cuts the substrate P.
- the selective loading mechanism ST2 takes out the take-up shaft 7 around which the child roll RR2 (RRB12) is wound from the holding unit 8, and waits at the mounting unit RSB22 in the empty holding unit 8.
- the child roll RRB22 is mounted as the child roll RR2.
- the front end portion of the substrate P drawn from the child roll RR2 is the substrate P on the second buffer mechanism BF2 side that has been cut first.
- the two substrates P are held by the suction pad 1 together with the rear end portion.
- the two substrates P are joined by the adhesive tape TP.
- the lift 3 is lowered together with the slider 2 by the operation of the drive unit 4 after releasing the suction holding by the suction pad 1. Thereafter, the supply of the substrate P from the second splicer unit CSb to the second buffer mechanism BF2 is resumed by driving the nip driving roller NR2.
- the nip drive roller NR2 is rotated at a speed slightly faster than the feed speed of the substrate P corresponding to the processing speed VC in the processing unit UC.
- the dancer roller mechanism DR2 is driven in a direction to increase the accumulation amount of the substrate P according to the driving of the nip driving roller NR2.
- the nip driving roller NR2 is driven at the same speed as the feeding speed of the substrate P in the processing unit UC. Then, the substrate P pulled out from the child roll RRB22 (child roll RR2) sent to the processing unit UC via the second buffer mechanism BF2 is subjected to the processing C at the processing speed VC.
- the substrate P subjected to the processing A by the processing unit UA is wound as the child roll RR1 having a length divided according to the number of the processing units UB, and then sequentially inserted into the processing units UB1 to UB3.
- the processing units UB1 to UB3 are sequentially inserted into the processing unit UC as the child roll RR2, and the processing C is performed. Since three processing units UB having a processing speed VB slower than the processing speed VC are provided in accordance with the ratio of the processing speeds, the three processing units UB1 to UB3 apparently have three times the processing speed VB.
- the child roll RR2 is input to the processing unit VC at the same cycle as when the processing B is performed at the processing speed of.
- the processing speed VA> the processing speed VB when the processing speed VA> the processing speed VB can be set according to the performance of each processing unit UA, UB, the number n of processing units UA and the number m of processing units UB are set. Where n ⁇ m, the substrate P is cut into child rolls having a length corresponding to the number m, and selectively fed into any one of the m processing units UB1 to UBm. Therefore, the substrate P can be processed at the processing speed VA when viewed from the entire production line without being restricted by the low processing speed VB.
- the processing speed VB ⁇ processing speed VC can be set depending on the performance of each of the processing units UB and UC, the substrate of the child roll RR2 subjected to the processing B by a plurality of (m) processing units UB1 to UBm. P is sequentially joined and supplied to n (n ⁇ m) processing units UC. Therefore, the waiting time until the substrate P is carried into the processing unit UC from the processing unit UB can be substantially suppressed. Therefore, also in this case, the substrate P can be processed at the processing speed VC ( ⁇ VA) without being restricted by the low processing speed VB.
- the number of processing units UB is set in accordance with the processing speed ratio. Therefore, efficient substrate processing can be realized without installing excessive equipment.
- efficient substrate processing can be performed without increasing the installation area (footprint).
- the cutting mechanism CU10 with a buffer mechanism and the joining mechanism PU10 with a buffer mechanism are installed as a station unit SN in a common configuration that can be used for both cutting and joining. Yes. Therefore, it is not necessary to install different types of devices individually, and it is possible to reduce the cost related to production facilities.
- the station unit SN Is installed as the cutting mechanism CU10, and the relationship between the processing speeds is reversed, the station portion SN may be installed as the joining mechanism PU10 between the adjacent processing units.
- the substrate processing system of the present embodiment is configured to transfer the substrate P in the upstream processing unit (first processing unit) in the substrate P transport direction between adjacent processing units among a plurality of processing units.
- first processing unit the upstream processing unit
- second processing unit the substrate P is placed between the first processing unit and the second processing unit in a predetermined length in the longitudinal direction.
- a cutting mechanism CU10 for cutting at the time of increasing the transport speed of the substrate P in the second processing unit relative to the transport speed of the substrate P in the first processing unit, between the first processing unit and the second processing unit.
- a joining mechanism PU10 for joining the substrate P in the longitudinal direction can be provided.
- FIG. 6 is a diagram showing a partial configuration of a device manufacturing system (flexible display manufacturing line) as a substrate processing system.
- the flexible substrate P sheet, film, etc. pulled out from the supply roll RR1 is sequentially passed through n processing devices U1, U2, U3, U4, U5,... Un to the recovery roll RR2.
- An example of winding up is shown.
- the host control device CONT control unit controls the respective processing devices U1 to Un constituting the production line.
- the processing devices U1 to Un shown in FIG. 6 may be any of the processing units UA to UC shown in FIG. 1, and two or more continuous processing devices are included in the processing devices U1 to Un. Collectively, it may correspond to any one of the processing units UA to UC.
- the orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is the Y-axis direction. It shall be set.
- the substrate P may be activated by modifying the surface in advance by a predetermined pretreatment, or may have a fine partition structure (uneven structure) for precise patterning formed on the surface.
- the substrate P wound around the supply roll RR1 is pulled out by the nipped driving roller DR10 and conveyed to the processing apparatus U1.
- the center of the substrate P in the Y-axis direction (width direction) is servo-controlled by the edge position controller EPC1 so as to be within a range of about ⁇ 10 ⁇ m to several tens ⁇ m with respect to the target position.
- the processing device U1 prints photosensitive functional liquid (photoresist, photosensitive silane coupling material, photosensitive coupling material, photosensitive lyophobic modifier, photosensitive plating reducing agent, UV on the surface of the substrate P by a printing method.
- photosensitive functional liquid photoresist, photosensitive silane coupling material, photosensitive coupling material, photosensitive lyophobic modifier, photosensitive plating reducing agent, UV on the surface of the substrate P by a printing method.
- This is a coating apparatus that continuously or selectively applies a cured resin liquid or the like) in the transport direction (long direction) of the substrate P.
- a pressure drum DR20 around which the substrate P is wound, a coating roller for uniformly applying the photosensitive functional liquid to the surface of the substrate P on the pressure drum DR20, or a photosensitive functional liquid is provided.
- a coating mechanism Gp1 including a letterpress or intaglio plate cylinder roller that prints a pattern as ink, a drying mechanism Gp2 that rapidly removes solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, and the like are provided. .
- the processing device U2 heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.) to stably fix the photosensitive functional layer applied on the surface.
- a predetermined temperature for example, about several tens to 120 ° C.
- a plurality of rollers and an air turn bar for returning and transporting the substrate P, a heating chamber HA1 for heating the substrate P that has been carried in, and the temperature of the heated substrate P are set in a post-process (processing)
- a cooling chamber HA2 that lowers the ambient temperature of the apparatus U3) and a nipped drive roller DR3 are provided.
- the processing apparatus U3 is an exposure apparatus that irradiates the photosensitive functional layer of the substrate P conveyed from the processing apparatus U2 with ultraviolet patterning light corresponding to a circuit pattern or a wiring pattern for display.
- an edge position controller EPC for controlling the center of the substrate P in the Y-axis direction (width direction) to a fixed position, the nipped drive roller DR4, and the substrate P are partially wound with a predetermined tension
- a rotary drum DR5 for supporting a pattern exposed portion on the substrate P in a uniform cylindrical surface, and two sets of drive rollers DR6, DR7 for giving a predetermined slack (play) DL to the substrate P. Yes.
- a transmissive cylindrical mask DM an illumination mechanism IU provided in the cylindrical mask DM and illuminating a mask pattern formed on the outer peripheral surface of the cylindrical mask DM, and a cylinder by a rotating drum DR5 are provided.
- an alignment mark or the like previously formed on the substrate P is provided.
- Alignment microscopes AM1 and AM2 for detection are provided.
- the processing apparatus U4 is a wet processing apparatus that performs at least one of various wet processes such as a wet development process and an electroless plating process on the photosensitive functional layer of the substrate P conveyed from the process apparatus U3. It is.
- the processing apparatus U4 there are provided three processing tanks BT1, BT2, BT3 layered in the Z-axis direction, a plurality of rollers for bending and transporting the substrate P, a nipped drive roller DR8, and the like. .
- the processing apparatus U5 is a heating and drying apparatus that warms the substrate P transported from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but the details are omitted.
- the substrate P that has passed through several processing devices and passed through the last processing device Un of the series of processes is wound up on the collection roll RR2 via the nipped drive roller DR10.
- the drive roller DR10 and the collection roll are driven by the edge position controller EPC2 so that the center of the substrate P in the Y-axis direction (width direction) or the substrate end in the Y-axis direction does not vary in the Y-axis direction.
- the relative position of RR2 in the Y-axis direction is successively corrected and controlled.
- the processing units having a low processing speed are double-tracked according to the processing speeds of the processing apparatuses U1, U2, U3, U4, U5,.
- a cutting mechanism CU10 is provided in front of the processing apparatus, and a selective loading mechanism ST1 for loading the substrate into any of the plurality of processing apparatuses is provided.
- the processing apparatus U2 that performs the heat treatment can reduce the volume of the chamber portions HA1 and HA2 by suppressing the transfer speed of the substrate P as much as possible. There is an advantage that the footprint of the apparatus can be reduced.
- a plate cylinder (intaglio or letterpress) roller for pattern printing is used.
- the photosensitive functional liquid is applied as ink
- the pattern is transferred by pressing the substrate P against the plate cylinder roller.
- processing speed differs greatly depending on the apparatus performance between the processing apparatus U1 and the processing apparatus U2. Therefore, in such a case, if the processing unit U1 is the processing unit UA in FIG. 1 and the processing unit U2 is double-tracked like the processing units UB1 to UB3 in FIG. 1, efficient and highly productive manufacturing is possible. A line can be constructed.
- FIG. 7 shows a model example in the case where the processing units UA, UB, UC responsible for each of the three processes A, B, C are performed one by one.
- a substrate P having a total length of 1200 m is wound around the supply roll RRA.
- each processing unit UA to UC has the following processing capability as the performance of the apparatus. That is, the processing unit UA has the ability to send and process the substrate P at a maximum of 15 cm / s, the processing unit UB has the ability to send and process the substrate P at a maximum of 5 cm / s, and the processing unit UC has Suppose that the substrate P has the ability to send and process at a maximum of 15 cm / s.
- the production tact time (all processing steps A, B, C on a 1200 m substrate) is achieved. ) Is 400 minutes (6 hours 40 minutes).
- FIG. 1 An example of a model of a production line doubled as shown in FIG. 1 is shown in FIG.
- the performances of the processing units UA, UB (UB1 to UB3), and UC are the same as those described with reference to FIG.
- the processing unit UB responsible for the processing step B is double-tracked to provide three units UB1 to UB3, and the cutting processing time in the cutting mechanism CU10 after the processing unit UA and the selective charging mechanism ST1.
- the setup time including the child roll exchange time and the like is 3 minutes
- the setup time including the joining processing time in the joining mechanism PU10 before the processing unit UC and the child roll exchange time and the like by the selective charging mechanism ST2 is 3 minutes.
- the processing units UA and UC can transfer the substrate P at a maximum speed of 15 cm / s guaranteed by each performance. Set to transport.
- the time chart of FIG. 8 estimates the tact according to the model example of FIG. 7B, and the lines S1, S2, and S3 are virtually associated with each of the three processing units UB1 to UB3. It represents the processing time.
- the substrate P from the supply roll RRA is processed by the processing unit UA.
- the substrate P is divided by the cutting mechanism CU10 every 1/3 of the total length of 1200 m. Therefore, the first 400 m of the substrate put into the processing unit UA is processed in about 44.4 minutes as shown in the line S1, and then passes through a setup time of 3 minutes in the cutting mechanism CU10. It is sent to the processing unit UB1.
- the tact time for the processing unit UB1 to process the substrate P for 400 m is 133.3 minutes. Thereafter, after about 3 minutes as a predetermined setup time (attachment of child rolls, etc.), the first 400 m substrate is put into the processing unit UC and processed at a transport speed of 15 cm / s. The tact time of the 400 m substrate by the processing unit UC is 44.4 minutes.
- the processing unit UA continues processing the second 400 m substrate for about 44.4 minutes, and then continues to the third 400 m substrate as shown in line S3. The process is continued for about 44.4 minutes at a transfer speed of 15 cm / s.
- the second 400 m substrate is sent to the processing unit UB2 after a setup time of 3 minutes by the cutting mechanism CU10, where it is processed over about 133.3 minutes.
- the processing unit UC It is 228.1 minutes after the start time that the processing of the first 400 m substrate is completed in the processing unit UC. However, before that, the processing of the second 400 m substrate is completed in the processing unit UB2, and the second 400 m substrate is set up for about 3 minutes via the joining mechanism PU10 and the selective loading mechanism ST2C. After time, it is bonded to the terminal portion of the first 400 m substrate. Thereafter, the processing unit UC continuously processes the second 400 m substrate bonded to the first 400 m substrate at a transfer speed of 15 cm / s.
- the third (last) 400 m substrate cut by the cutting mechanism CU10 is loaded into the processing unit UB3 when the processing in the processing unit UA is completed, and 133.3. After a minute, it is wound on a child roll RRB32.
- the processing for the third 400 m substrate is completed in the processing unit UB32 before the processing for the second 400 m substrate is completed in the processing unit UC.
- the third 400 m substrate passes through the bonding mechanism PU10 and the selective loading mechanism ST2C, after a setup time of about 3 minutes. Bonded to the terminal portion of the substrate for 400 m. Thereafter, the processing unit UC continuously processes the third 400 m substrate bonded to the second 400 m substrate at a transfer speed of 15 cm / s.
- the processing of the substrate P for 1200 m is completed in 317 minutes (5 hours and 17 minutes) by doubling the unit of the processing step B.
- the total length of the substrate P wound around the supply roll RRA as the parent roll is 1200 m. However, even if the total length is longer than that, the substrate in the cutting mechanism CU10. If the division is performed every 400 m, the substrate put into the production line can be continuously flowed until the last processing step C.
- the three processing units UB1 to UB3 are all operated at the same processing speed (5 cm / s). However, each unit UB1 to UB1 can be adjusted within the adjustable range. The substrate transfer speed in UB3 may be changed by a minute amount.
- three processing units UB1 to UB3 are provided.
- two or four or more units may be provided as long as they are set according to the processing speed ratio.
- the cutting mechanism CU10 (CU101, CU101, CU101, CU2) is placed after each of the two processing units UA (UA1, UA2).
- CU102 the cutting mechanism CU10
- two low-tact processing units UB are added to form a double line as five units UB1 to UB5, followed by two joint mechanisms PU10 (PU101, PU102).
- two processing units UC (UC1, UC2) may be provided.
- a substrate having a unit length (for example, 400 m) cut by one of the cutting mechanisms CU101 and CU102 is sent to any one of the five processing units UB1 to UB5 that is free.
- the selective charging mechanism ST2 is configured, and each of the bonding mechanisms PU101 and PU102 is selectively charged so that a substrate having a unit length (for example, 400 m) processed by any of the five processing units UB1 to UB5 can be received.
- the mechanism ST2 is configured.
- the processing unit UA2 when the processing unit UA1 processes a substrate from the supply roll RRA for a unit length (for example, 400 m), the processing unit UA2 starts processing the substrate from the supply roll RRA. It is better to give an intentional time difference.
- FIG. 9 is a diagram showing a partial configuration of a device manufacturing system (flexible display manufacturing line) SYS as a substrate processing apparatus of the present embodiment.
- the device manufacturing system SYS has a first mounting portion RS1 for mounting a supply roll (first roll) RR1, a second mounting portion RS2 (holding portion) for mounting a supply roll (second roll) RR2, and a collection roll ( 3rd roll) It is equipped with 3rd mounting part RS3 which mounts RR3, 4th mounting part RS4 which mounts
- Substrate P (sheet, film, etc.) is sequentially connected to first splicer section (substrate connection changing mechanism) CSa, first buffer mechanism BF1, n processing devices U1, U2, U3, U4, U5,.
- first splicer section substrate connection changing mechanism
- first buffer mechanism BF1 first buffer mechanism BF1
- n processing devices U1, U2, U3, U4, U5 An example is shown in which the buffer mechanism BF2 and the second splicer unit (second substrate connection mechanism) CSb are passed through the recovery rolls RR3 and RR4.
- the substrate loaded as the processing substrate in the first and second buffer mechanisms BF1, BF2, and the processing apparatuses U1 Substrates drawn from the supply rolls RR1 and RR2 before being loaded will be referred to as substrates P1 and P2 as appropriate. Substrates recovered by the recovery rolls RR3 and RR4 after processing by the processing apparatuses U1... Un will be referred to as substrates P3 and P4 as appropriate.
- the host control device CONT (control unit, second control unit) includes the processing devices U1 to Un, the first and second splicer units CSa and CSb, and the first and second buffer mechanisms BF1 and BF2 constituting the production line. Take overall control. Further, the host controller CONT controls the rotational drive of the motor shaft MT1 mounted on the supply roll RR1 in the first mounting portion RS1, and the rotational drive of the motor shaft MT2 mounted on the supply roll RR2 in the second mounting portion RS2. To do.
- the host controller CONT includes an interlock control unit that links the cutting operation of the substrate P1 (first substrate) with the accumulation amount of the substrate P1 in the first buffer mechanism BF1 (buffer mechanism). In addition, the host controller CONT includes an interlock control unit that links the cutting operation of the substrate P (processing substrate) with the accumulated amount of the substrate P in the second buffer mechanism BF2.
- a supply sensor S1 for detecting the supply status of the substrate P1 on the supply roll RR1 is provided in the vicinity of the first mounting portion RS1.
- the supply sensor S1 outputs an end signal to the host controller CONT when the end of the supply of the substrate P1 is detected.
- a supply sensor S2 that detects the supply status of the substrate P2 in the supply roll RR2 is provided in the vicinity of the second mounting portion RS2.
- the supply sensor S2 outputs an end signal to the host controller CONT when the end of the supply of the substrate P2 is detected.
- an orthogonal coordinate system XYZ is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is the Y-axis direction. It shall be set.
- the substrate P may be one obtained by modifying and activating the surface in advance by a predetermined pretreatment, or one having a fine partition wall structure (concavo-convex structure) with fine patterning formed on the surface.
- FIG. 10 is a diagram showing a schematic configuration of the first splicer unit CSa and the first buffer mechanism BF1.
- the first splicer unit CSa is used to connect the substrate drawn out from one of the supply rolls RR1 and RR2 and sent to the first buffer mechanism BF1 to the substrate drawn out from the other of the supply rolls RR1 and RR2. And a nip driving roller NR1 and cutting and joining units CU1 and CU2.
- the first splicer unit CSa (substrate connection changing mechanism) is a substrate P2 (second substrate) that is supplied from the supply roll RR2 (second roll) to a position that is a terminal portion of the substrate P1 (first substrate) to be cut. ),
- the control unit controls the cutting operation and the bonding operation so as to cut the substrate P1 (first substrate).
- the nip driving roller NR1 holds the substrate P1 or the substrate P2 and sends it to the first buffer mechanism BF1 or stops feeding the substrate P under the control of the host controller CONT. It arrange
- the cutting and joining units CU1 and CU2 are arranged symmetrically in the Z-axis direction with a virtual joining surface VF1 parallel to the XY plane passing through the position in the Z-axis direction of the nip driving roller NR1 as a center.
- the cutting and joining unit CU1 includes a suction pad 1A, a cutter 2A, and a tension roller 3A at a position facing the virtual joining surface VF1. Further, the cutting and joining unit CU1 is connected to the joining position where the cutting and joining unit CU2 and the suction pad 1A face each other as shown by a solid line in FIG. 10 and a two-dot chain line in FIG.
- the suction pad 1A rotates (oscillates) between the attachment position facing the first mounting part RS1. Furthermore, the cutting / bonding unit CU1 moves in a direction of separating and approaching the virtual bonding surface VF1 (that is, the cutting / bonding unit CU2) by a moving mechanism (not shown) at the bonding position.
- the suction pad 1A is disposed on the downstream side (+ X axis side) in the feed direction of the substrate P (substrate P1) with respect to the cutter 2A when the cutting and bonding unit CU1 is in the bonding position.
- the cutting and joining unit CU2 includes a suction pad 1B, a cutter 2B, and a tension roller 3B at a position facing the virtual joining surface VF1.
- the cutting / bonding unit CU2 is rotated by a rotation mechanism (not shown), as shown by a solid line in FIG. 10, and at a bonding position where the cutting / bonding unit CU1 and the suction pad 1B face each other, The suction pad 1B rotates (swings) between the attachment position facing the first mounting portion RS2.
- the cutting / bonding unit CU2 moves in the direction of separating and approaching the virtual bonding surface VF1 (that is, the cutting / bonding unit CU1) by a moving mechanism (not shown) at the bonding position.
- the suction pad 1B is disposed on the downstream side (+ X axis side) in the feeding direction of the substrate P (substrate P2) relative to the cutter 2B when the cutting and bonding unit CU2 is at the bonding position.
- the movement of these cutting and joining units CU1 and CU2 is controlled by the host controller CONT.
- the first buffer mechanism BF1 is disposed between the processing apparatus (processing mechanism) U1 and the first splicer unit CSa, and temporarily accumulates the substrate P sent from the first splicer unit CSa within a predetermined longest accumulation range. Is sent to the processing device U1, and includes a dancer roller mechanism DR1 and a nip drive roller NR2.
- the nip drive roller NR2 holds the substrate P accumulated in the first buffer mechanism BF1 and sends it to the processing device U1, and is connected to the nip drive roller NR1 on the downstream side of the dancer roller mechanism DR1 in the feed direction of the substrate P. Arranged at substantially the same Z-axis position.
- a plurality of upper rollers RJ1 whose lifting range is relatively above and lower rollers RK1 whose lifting range is relatively below are alternately arranged in the X direction, and each roller RJ1. , RK1 can move independently in the Z-axis direction.
- the upper dead center position JU1 and the lower dead center position JD1 of the upper roller RJ1 are set to positions above the upper dead center position JU2 and the lower dead center position JD2 of the lower roller RK1.
- the operation of the dancer roller mechanism DR1 is also controlled by the host controller CONT.
- FIG. 11 is a diagram illustrating a schematic configuration of the second splicer unit CSb and the second buffer mechanism BF2.
- the second buffer mechanism BF2 is disposed between the processing apparatus (processing mechanism) Un and the second splicer unit CSb, and temporarily accumulates the substrate P sent from the processing apparatus Un within a predetermined longest accumulation range. It is sent to the second splicer section CSb and includes a nip drive roller NR3 and a dancer roller mechanism DR2.
- the dancer roller mechanism DR2 includes a plurality of upper rollers RJ2 whose lifting ranges are positioned relatively upward and lower rollers RK2 whose lifting ranges are positioned relatively downward in the X-axis direction. RJ2 and RK2 can move independently in the Z-axis direction.
- the top dead center position JU3 and the bottom dead center position JD3 of the upper roller RJ2 are set to positions above the top dead center position JU4 and the bottom dead center position JD4 of the lower roller RK2.
- the operation of the dancer roller mechanism DR2 is also controlled by the host controller CONT.
- the second splicer unit CSb transfers the substrate P, which is sent from the second buffer mechanism BF2 and is collected by one of the collection rolls RR3 and RRR4, to be collected by either one of the collection rolls RR3 and RRR4.
- a nip driving roller NR4 and cutting and joining units CU3 and CU4 are provided.
- the nip driving roller NR4 sends the substrate P sent from the second buffer mechanism BF2 toward the cutting and joining units CU3 and CU4 or stops the feeding of the substrate P under the control of the host controller CONT.
- the position in the Z-axis direction is a substantially intermediate position between the third mounting portion RS3 and the fourth mounting portion RS4, and is disposed at the position of the virtual joint surface VF2 parallel to the XY plane.
- the cutting joining units CU3 and CU4 are arranged symmetrically in the Z-axis direction with the virtual joining surface VF2 as the center.
- the cutting and joining unit CU3 includes a suction pad 1C, a cutter 2C, and a tension roller 3C at a position facing the virtual joining surface VF2. Further, the cutting and joining unit CU3 is rotated by a rotation mechanism (not shown), as shown by a solid line in FIG. 11, and at a joining position where the cutting and joining unit CU4 and the suction pad 1C face each other, and as shown by a two-dot chain line in FIG.
- the suction pad 1C is rotationally moved (oscillated) between the attachment position facing the third mounting portion RS3. Further, the cutting / bonding unit CU3 moves in a direction of separating and approaching the virtual bonding surface VF2 (that is, the cutting / bonding unit CU4) by a moving mechanism (not shown) at the bonding position.
- the suction pad 1C is arranged on the upstream side ( ⁇ X axis side) in the feed direction of the substrate P with respect to the cutter 2C when the cutting and joining unit CU3 is in the joining position.
- the cutting and joining unit CU4 includes a suction pad 1D, a cutter 2D, and a tension roller 3D at a position facing the virtual joining surface VF2. Further, the cutting and joining unit CU4 is connected to a joining position where the cutting and joining unit CU3 and the suction pad 1D face each other by a rotation mechanism (not shown) as shown by a solid line in FIG. 11, and as shown by a two-dot chain line in FIG. The suction pad 1D is rotationally moved (oscillated) between the attachment position facing the fourth mounting portion RS4.
- the cutting / bonding unit CU4 moves in the direction of separating and approaching the virtual bonding surface VF2 (that is, the cutting / bonding unit CU3) by a moving mechanism (not shown) at the bonding position.
- the suction pad 1D is arranged on the upstream side ( ⁇ X axis side) in the feed direction of the substrate P with respect to the cutter 2D when the cutting and joining unit CU4 is in the joining position.
- the movement of these cutting and joining units CU3 and CU4 is controlled by the host controller CONT.
- the recovery roller RR3 is mounted on the motor shaft MT3 in the third mounting portion RS3.
- the collection roller RR4 is mounted on the motor shaft MT4.
- the rotational drive of the motor shaft MT3 and the rotational drive of the motor shaft MT4 are controlled by the host controller CONT.
- a winding sensor S3 for detecting the winding state of the substrate P3 on the collection roller RR3 is provided in the vicinity of the third mounting portion RS3.
- the winding sensor S3 outputs an end signal to the host control device CONT when the end of winding of the substrate P3 is detected.
- a winding sensor S4 that detects the winding state of the substrate P4 on the collection roller RR4 is provided in the vicinity of the fourth mounting portion RS4.
- the winding sensor S4 outputs an end signal to the host control device CONT when the end of winding of the substrate P4 is detected.
- the collection rollers RR3 and RR4 have a leading end connected to the roll core and a pull-in pull-in substrate (third substrate) PK (the substrate PK of the collection roller RR4 in FIG. 11) to which the substrate P3 or the substrate 4 is bonded to the terminal end. Only shown).
- the substrate PK may be the same material as the substrate P to be processed by the processing apparatuses U1 to Un, or may be substantially the same thickness as the substrate P and made of a different material.
- the processing apparatus U5 of the present embodiment warms the substrate P transferred from the processing apparatus U4, adjusts the moisture content of the substrate P moistened by a wet process to a predetermined value, crystallizes semiconductor material, and metal nano Although it is a heat drying apparatus that performs thermal annealing (200 ° or less) for removing the solvent of ink containing particles, the details are omitted. After that, the substrate P that has passed through several processing apparatuses and passed through the last processing apparatus Un of the series of processes is temporarily accumulated in the second buffer mechanism BF2, and is appropriately switched in the second splicer unit CSb. Then, it is wound up on the recovery roll RR3 or the recovery roll RR4.
- the substrate P1 drawn from the supply roll RR1 is sent to the first buffer mechanism BF1 as the first substrate via the roller 3A and the nip driving roller NR1 of the cutting and joining unit CU1, and the first buffer mechanism BF1 It is the figure accumulate
- the upper roller RJ1 is located at the top dead center position JU1
- the lower roller RK1 is located at the bottom dead center position JD2, so that the substrate P is in the first buffer mechanism.
- a length close to the longest in the mechanism BF1 is accumulated.
- the cutting and joining unit CU2 is rotated and sucked.
- the pad 1B is moved to the attachment position.
- the tip of the substrate P2 is sucked (connected or connected) and fixed to the suction pad 1B at the sticking position, and then a double-sided tape T is stuck on the surface opposite to the suction side.
- the suction of the substrate P2 to the suction pad 1B and the attachment of the double-sided tape T are performed by an operator or using a robot or the like.
- the cutting and joining unit CU2 is rotated to move the substrate P2 to the joining position as shown in FIG.
- a predetermined tension is applied to the substrate P2 by rotating the supply roll RR2 in the direction opposite to the supply direction of the substrate P2 (counterclockwise in FIG. 13) by rotating the MT2.
- the supply sensor S1 detects the end of the supply of the substrate P1 from the supply roll RR1
- the driving of the nip drive roller NR1 is stopped and the motor shaft MT1 is rotated in the direction opposite to the feeding direction of the substrate P1.
- a weak tension is applied to the substrate P1 between the nip driving roller NR1 and the supply roll RR1.
- the nip driving roller NR2 continues to be driven even after the driving of the nip driving roller NR1 is stopped. Therefore, the dancer roller mechanism DR1 is operated, and the upper roller RJ1 is lowered and the lower roller RK1 is appropriately raised according to the driving of the nip driving roller NR2. As a result, the substrate P accumulated in the first buffer mechanism BF1 is continuously sent to the processing device U1 at a constant speed by the nip driving roller NR2.
- the cutting and joining units CU1 and CU2 are moved in a direction approaching each other, and the substrates P1 and P2 are pressure-bonded between the suction pads 1A and 1B for a predetermined time with the double-sided tape T interposed therebetween. .
- substrate P2 is bonded and bonded to the board
- the nip driving roller NR2 and the dancer roller mechanism DR1 are continuously driven even while the substrates P1 and P2 are bonded, and the substrate P accumulated in the first buffer mechanism BF1 is transferred to the nip driving roller.
- the signal is continuously sent to the processing unit U1 by NR2.
- the opposing substrate P1 is cut by the cutter 2A in the cutting and joining unit CU1 in a state where tension is applied to the substrate P1 between the cutting and joining unit CU1 and the supply roll RR1.
- the cutter 2A for example, a configuration in which the substrate P1 is cut by sliding the blade edge in the width direction (Y-axis direction) of the substrate P1 can be adopted.
- the nip driving roller NR2 and the dancer roller mechanism DR1 are continuously driven, and the substrate P accumulated in the first buffer mechanism BF1 is processed by the nip driving roller NR2. It continues to be sent to U1 at a constant speed.
- the suction pad 1A in the cutting / bonding unit CU1 is opened to the atmosphere, and then, as shown in FIG. 16, the cutting / bonding unit CU1 is separated from the cutting / bonding unit CU2 (virtual bonding surface VF1) ( ⁇ Move in the Z-axis direction).
- the substrate P1 drawn out from the supply roll RR1 is wound around the supply roll RR1 by rotation in the direction opposite to the feeding direction of the supply roll RR1.
- the substrate P2 is tensioned between the rotary roll RR2 and the nip drive roller NR1 (and the roller 3B) by the rotational torque in the direction opposite to the feed direction of the supply roll RR2.
- the substrate connected to the substrate P stored in the first buffer mechanism BF1 is switched to the substrate P2 as the second substrate drawn out from the supply roll RR2.
- the substrate P2 as the second substrate may have a standard equivalent to that of the substrate P1 (first group).
- the nip driving roller NR1 rotates at a slightly faster speed than the nip driving roller NR2, and in the dancer roller mechanism DR1, as shown in FIG. 17, the upper roller RJ1 is driven according to the driving of the nip driving roller NR1. Raise and lower the lower roller RK1 as appropriate. Further, when the motor shaft MT2 is rotationally driven in the feeding direction, the substrate P2 drawn from the supply roll RR2 is fed, and the accumulation length of the substrate P in the first buffer mechanism BF1 increases.
- the nip drive roller NR1 rotates at the same speed as the nip drive roller NR2, so that the accumulation length of the substrate P in the first buffer mechanism BF1.
- the supply roll RR1 almost depleted of the substrate P1 is removed (detachable) from the first mounting portion RS1, and another supply roll RR5 around which the substrate P5 is wound is mounted as shown in FIG.
- the cutting and joining unit CU1 is rotated to attach the suction pad 1A as shown in FIG. Move to the set position.
- the tip of the substrate P5 is sucked and fixed (connected or connected) to the suction pad 1A at the sticking position, and then a double-sided tape T is stuck on the surface opposite to the suction side.
- the supply roll RR5 is rotated in the direction opposite to the supply direction of the substrate P5 (counterclockwise in FIG. 18) by rotating the motor shaft MT1, thereby cutting the substrate P5 while applying a predetermined tension.
- the joining unit CU1 is rotated and moved to the joining position as shown in FIG.
- the supply sensor S2 detects the end of the supply of the substrate P2 on the supply roll RR2
- the driving of the nip drive roller NR1 is stopped and the cutting and joining units CU1 and CU2 are brought closer to each other in the same manner as described above.
- the substrates P2 and P5 are pressure-bonded between the suction pads 1A and 1B for a certain time with the double-sided tape T interposed therebetween, and the substrate P2 is cut by the cutter 2B in the cutting and joining unit CU2.
- the substrate connected to the substrate P accumulated in the first buffer mechanism BF1 is switched to the substrate P5 drawn out from the supply roll RR5.
- the sequentially switched substrate P is subjected to the photosensitive functional liquid coating process in the processing apparatus U1, the heating process in the processing apparatus U2, the pattern exposure process in the processing apparatus U3, the wet process in the processing apparatus U4, and the processing apparatus U5.
- the heat-drying process is performed, it is sequentially sent to the second buffer mechanism BF2 and the second splicer part CSb, and is recovered to the recovery roll RR3 or the recovery roll RR4.
- the substrate P which is a processing substrate, is sent to and accumulated in the second buffer mechanism BF2 via the nip drive roller NR3, and sent (discharged) from the second buffer mechanism BF2 via the nip drive roller NR4.
- the substrate P is recovered by the recovery roll RR3 mounted on the third mounting portion RS3 via the roller 3C of the cutting and joining unit CU3.
- the upper roller RJ2 is positioned at the bottom dead center position JD3, and the lower roller RK2 is positioned at the top dead center position JU4. The length close to the shortest is accumulated in the two-buffer mechanism BF2.
- the cutting and joining unit CU4 is rotated to attach the suction pad 1D. Move to the set position.
- the end portion of the drawing substrate PK hereinafter simply referred to as the substrate PK
- the substrate PK the end portion of the drawing substrate PK (hereinafter simply referred to as the substrate PK) whose tip is connected to the recovery roll RR4 is sucked and fixed (connected or connected), Then, the double-sided tape T is stuck on the surface opposite to the suction side.
- the cutting and joining unit CU4 When the double-sided tape T is pasted on the substrate PK, the cutting and joining unit CU4 is rotated and moved to the joining position, and the collection roll RR4 is driven by the rotational drive of the motor shaft MT4 to collect the substrate PK (substrate P) (see FIG. In FIG. 20, a predetermined tension is applied to the substrate PK by rotating it clockwise.
- the winding sensor S3 detects the end of the recovery of the substrate P by the recovery roll RR3
- the driving of the nip drive roller NR4 is stopped and the dancer roller mechanism DR2 is operated to raise the upper roller RJ2 and lower roller RK2. Is lowered as appropriate.
- the substrate P sent from the processing device U5 by the nip drive roller NR3 increases the accumulation length in the second buffer mechanism BF2 by a constant amount (feed amount corresponding to the transport speed of the substrate P on the production line). Accumulated.
- the cutting and joining units CU3 and CU4 are moved toward each other, and the suction pads 1C and 1D are interposed with the double-sided tape T interposed therebetween.
- the substrates P and PK are pressure-bonded for a certain period of time.
- the terminal portion of the substrate PK is bonded to (bonded to or connected to) the substrate P via the double-sided tape T at a position that becomes a tip when the substrate P is cut in a subsequent process.
- the opposing substrate P is cut by the cutter 2C in the cutting and joining unit CU3 in a state where tension is applied to the substrate P between the cutting and joining unit CU3 and the recovery roll RR3.
- the suction pad 1C in the cutting / bonding unit CU3 is released to the atmosphere, and then the cutting / bonding unit CU3 is moved away from the cutting / bonding unit CU4 ( ⁇ Z-axis direction) as shown in FIG.
- the upper roller RJ2 and the lower roller RK2 in the second buffer mechanism BF2 are appropriately raised and lowered from the processing device U5.
- the substrate P sent by the nip drive roller NR3 is accumulated while increasing the accumulation length in the second buffer mechanism BF2 by a certain amount.
- the nip drive roller NR4 rotates at a slightly faster speed than the nip drive roller NR3, and the dancer roller mechanism DR2 drives the nip drive roller NR4. Accordingly, the upper roller RJ2 is lowered and the lower roller RK2 is appropriately moved to reduce the length of the substrate P accumulated in the second buffer mechanism BF2 during the joining process and the cutting process in the second splicer unit CSb.
- the minimum accumulation length in the initial state is set (see FIG. 24). After the length of the substrate P accumulated in the second buffer mechanism BF2 becomes almost minimum, the nip driving roller NR4 is rotated at the same speed as the nip driving roller NR3.
- the recovery roll RR3 is removed, and the leading end portion of the drawing substrate PK2 (hereinafter simply referred to as the substrate PK2) is connected (connected) as shown in FIG. (Or bonded) is attached to the motor shaft MT3 and fixed to the suction pad 1C of the cutting and joining unit CU3 rotated to the attaching position by adsorbing the terminal portion of the substrate PK2, and then reverse to the suction side.
- a double-sided tape T is attached to the side surface.
- the cutting and joining unit CU3 When the double-sided tape T is pasted on the substrate PK2, the cutting and joining unit CU3 is rotated and moved to the joining position, and the collecting roller RR6 is rotated by the motor shaft MT3 and the collecting direction of the substrate PK2 (substrate P) (see FIG. In the state in which a predetermined tension is applied to the substrate PK2, the apparatus waits until the end of recovery of the recovery roll RR3 by the winding sensor S4.
- the substrate P is temporarily accumulated by the first buffer mechanism BF1 and sent to the processing apparatus U1, the substrate P is connected to the substrate P2 drawn from the new supply roll RR2. Instead, it is sent to the first buffer mechanism BF1. Therefore, it is possible to change the roll serving as the supply source without stopping the processes by the processing devices U1 to Un. Therefore, in this embodiment, it is possible to avoid a situation in which the substrate P that has been put into the processing apparatuses U1 to Un at the time of changing the supply roll is wasted and causes an increase in cost.
- the substrate collection destination is switched while the substrate P sent from the processing apparatus Un is temporarily stored in the second buffer mechanism BF2. Therefore, even when the collection destination of the substrate P is changed, it is possible to avoid a situation in which the substrate P that has been put into the processing apparatuses U1 to Un at the time of the change is wasted and causes an increase in cost.
- the previous substrate is cut. For this reason, when cutting is performed first, stable substrate processing can be performed without causing problems such as separation of the substrate at the time of cutting due to the applied tension and hindering bonding. .
- the processing mechanism includes the plurality of processing devices U1 to Un is illustrated.
- the present invention is not limited to this, and a configuration in which the above-described substrate switching mechanism is provided in one processing apparatus may be employed.
- a configuration is adopted in which a collection roll to which the pull-in substrate PK is connected is separately provided.
- a configuration in which a supply roll that has been used and the tip end substrate is cut may be used.
- the processing is continued without stopping the production line by automatically adding the substrate from the other roll. I tried to do it. If there is a defect in the pattern formed on the substrate somewhere in the production line, or if a defect occurs in the production apparatus, a large number of defective products may be produced.
- a number of processes for performing a process with a long substrate are divided into several blocks, and each block performs continuous processing by roll-to-roll. Even if it is a production line (factory) configuration that the process block is transported in roll units wound around the substrate on which the semi-finished product is formed and set in a predetermined mounting portion (RS1 or RS2) good. In that case, substrate transfer can be performed continuously in units of process blocks, and even if a problem (pattern defect, equipment failure, etc.) occurs in a certain process block, only that process block is temporarily stopped. The generation of a large number of defective products can be reduced.
- the supply rolls RR1 and RR2 mounted on each of the two mounting portions RS1 and RS2 are formed by winding a sheet-like substrate for product manufacture by an equal length, Immediately before the substrate supply from the supply roll RR1 is completed (roll end), the substrate is switched to the substrate of the other supply roll RR2, and the processing is continued until the end of the substrate of the supply roll RR2.
- the supply roll mounted on one of the mounting portions RS1 and RS2 is used such that the substrate is continuously supplied to the processing apparatuses U1 to Un only while the other supply roll serving as the roll end is replaced with a new roll. May be.
- the supply roll serving as the roll end is RR2
- the roll RR2 is removed from the mounting portion RS2
- the new supply roll is mounted on the mounting portion RS2
- the preparation for joining at the first splicer portion CSa is completed ( Assuming that the setup time up to the state of FIG. 13 is 180 seconds, the length of the substrate (P1) put into the processing apparatus U1 (production line) from the other supply roll RR1 during this period is the feed rate of the substrate being processed If it is 50 mm / sec, it will be 9 m.
- the tip of the substrate (P2) from the new supply roll RR2 mounted on the mounting unit RS2 is immediately removed by the first splicer unit CSa.
- the substrate (P1) is cut and the substrate (P2) from the supply roll RR2 You may change the connection.
- the substrate (P1) from the supply roll RR1 loaded in the mounting portion RS1 is used as a temporary connection substrate (for example, about 9 m), it is performed on the substrate (P1).
- the processing to be performed may be pilot processing for setting the conditions of the processing apparatuses U1 to Un and maintenance management, and the device formed there may not be used as a final product.
- the substrate when used as a temporary connection substrate (for example, about 9 m), it is not necessary to wind the substrate (P1) around the supply roll RR1, for example, a single substrate cut into a length of 10 m. May be folded and stored in a case or the like, and substrates (10 m) may be taken out one by one from the case and supplied to the first splicer unit CSa.
- BF1 first buffer mechanism (first buffer section, buffer mechanism), BF2: second buffer mechanism (second buffer section), CSa: first splicer section (substrate switching mechanism), CSb: second splicer section (second 2 substrate reconnection mechanism), CU ... cutting mechanism, FS ... substrate, P ... substrate, PK, PK2 ... pull-in substrate (third substrate), PU10 ... joining mechanism, RR1 ... supply roll (first roll), RR2 ... supply Roll (second roll), RR3 ... recovery roll (third roll), RR4 ... recovery roll (fourth roll), RS1 ... first mounting part, RS2 ... second mounting part, RS3 ... third mounting part, RS4 ... 4th mounting part, ST ... selective loading mechanism, SYS ... device manufacturing system (substrate processing apparatus), UA, UB, UB1 to UB3, UC ... processing unit , U1 ⁇ Un ... processing unit (processing mechanism)
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Abstract
Description
本願は、2012年5月23日に出願された米国仮出願61/650,712及び2012年6月1日に出願された米国仮出願61/654,500に基づき優先権を主張し、その内容をここに援用する。
長尺のシート状基板に対して複数の処理を順次施す場合、各処理ユニットの性能によって、処理に適した基板の搬送速度はユニット毎(処理内容毎)にまちまちになる。例えば、特許文献2のような露光処理の場合は、基板表面に塗布された感光層の感度と露光用照明光の輝度等により、基板の搬送速度(タクト)は制限される。また、エッチングやメッキ等の湿式処理や、その湿式処理後の乾燥・加熱工程でも、基板をゆっくり搬送することにより、液槽や乾燥・加熱炉を小型化できる等の利点が得られる。
長尺の基板を巻回した第1ロールを第1ロール装着部に装着することと、第1基板と同等の規格の第2基板を保持部に所定長さで保持することと、処理機構と第1装着部との間に配置したバッファ機構で、第1ロールから供給される第1基板を所定の最長蓄積範囲内で一時的に蓄積してから処理機構に送り出すことと、一時的に蓄積していた第1基板を処理機構に送り出している間に、バッファ機構と第1装着部との間で第1基板を切断すると共に、切断される第1基板のバッファ機構側の所定部分に、保持部から供給される第2基板の先端部を連結することと、を含む基板処理方法が提供される。
以下、本発明の切断機構、接合機構、基板処理システム、及び基板処理方法の実施形態を、図1から図6を参照して説明する。
図1は、例として、シート状の基板Pを順次3つの処理工程A、B、Cに通すロール方式の基板処理システムSYSを模式的に示した図である。
VA≒VC>VB
なお、処理ユニットUAと処理ユニットUB1~UB3のいずれか1つとの間では、基板Pの搬送速度がVA>VBとなっているため、処理ユニットUAが搬送速度(V1)の高い第1処理ユニットに対応し、処理ユニットUB1~UB3のいずれか1つが搬送速度(V2)の低い第2処理ユニットに対応する。一方、処理ユニットUB1~UB3のいずれか1つと処理ユニットUCとの間では、基板Pの搬送速度がVB<VCとなっているため、処理ユニットUB1~UB3のいずれか1つが搬送速度(V1)の低い第1処理ユニットに対応し、処理ユニットUCが搬送速度(V2)の高い第2処理ユニットに対応する。
第1スプライサー部CSaは、上面に、例えば多孔質材で形成された吸着パッド1を有し、基板Pの搬送方向(以下、単に搬送方向と称する)に移動自在なスライダー2と、スライダー2を搬送方向に移動自在に支持するガイドレール付の昇降台3と、昇降台3を昇降させる駆動部4と、昇降台3が上昇した位置にあるときに、基板Pの幅方向に移動して、スライダー2の吸着パッド1に吸着された基板Pを切断可能なカッター部5、及び基板Pに対して粘着テープTPを貼り付け可能な貼り付け部6、昇降台3の上方に設けられ、処理Aが施された基板Pを巻き取るロールRR1用の巻き取り軸7を両側で保持する保持部8(上下動可能)、とを備えている。
これらのスライダー2、駆動部4、カッター部5、貼り付け部6の各駆動は、制御部CTによって制御される(図5参照)。
また、ステーション部SNは、基板Pを保持して長尺方向に移動可能で、スライダー2、昇降台3、駆動部4などを含む移動部と、切断機構CU10による切断領域、または接合機構PU10による接合領域に移動部を移動させる移動制御部とを備える。
従って、切断機構CU10は、供給ロールRRAに巻かれた基板Pの全長をほぼ3等分するような所定長毎に基板Pを切断する。
図5に示すように、制御部CTは、処理ユニットUA、UB(UB1~UB3)、UCの動作を制御するとともに、切断機構CU10と接合機構PU10の各々に設けられるスライダー2、駆動部4、カッター部5、貼り付け部6、選択投入機構ST1、ST2、ダンサーローラ機構DR1、DR2、ニップ駆動ローラNR1、NR2等の駆動を統括的に制御する。その他、制御部CTは、供給ロールRRA、回収ロールRRCの回転駆動、各工程(各処理ユニット)における基板Pの搬送長を計数して管理したり、基板Pの供給側となる各ロールの基板残量と、基板Pの回収側となる各ロールの基板巻上げ量とを計数して管理したり、処理工程A~Cまでの全体的なタクトの管理、各ロール毎に、処理上の問題の有無や不良が発生した場合の程度や場所等の情報の管理、等も行なう。制御部CTは、切断機構CU10の動作と第1バッファ部BF1における基板Pの蓄積量とを連動させる連動制御部を含む。同様に、制御部CTは、接合機構PU10の動作と第2バッファ部BF2における基板Pの蓄積量とを連動させる連動制御部を含む。
ここでは、図1に示すように、処理ユニットUB1において処理Bが完了した直後で子ロールRRB12が選択投入機構ST2によって、第2スプライサー部CSbの保持部8に搬送される。また、処理ユニットUB2においては、装着部RSB21に装着された子ロールRRB21から引き出された基板Pに対して処理Bが施される。また、処理ユニットUB3においては、次の処理対象となる子ロールRRB31が装着部RSB31に装着されるまで待機しているものとする。
具体的には、まず、スライダー2がカッター部5と対向する位置に移動した後に駆動部4の作動により昇降台3がスライダー2とともに上昇する。スライダー2の上昇により、吸着パッド1が基板Pを裏面(下面)から吸着保持し、カッター部5による切断位置に位置決めする。その後、カッター部5が、基板Pの幅方向に移動して基板Pを切断する。基板Pが切断されると、選択投入機構ST1が子ロールRR1を、ここでは処理ユニットUB3の装着部RSB31に子ロールRRB31として投入する。また、選択投入機構ST1は、子ロールRR1が排出されて空きとなった第1スプライサー部CSaの保持部8に予備の巻き取り軸7を装填する。
従ってこの場合も、低い処理速度VBに律則されることなく、基板Pを処理速度VC(≒VA)で処理することが可能となる。
次に、上記基板処理システムが適用されるデバイス製造システムについて、図6を参照して説明する。
その後、処理ユニットUCは、1番目の400mの基板に接合された2番目の400m分の基板を、搬送速度15cm/sで継続的に処理する。
以下、本発明の基板処理装置及び基板処理方法の実施形態を、図9から図25を参照して説明する。本実施形態において、上記の実施形態と同様の構成要素については、同じ符号を付してその説明を簡略化あるいは省略する。
第2バッファ機構BF2は、処理装置(処理機構)Unと第2スプライサー部CSbとの間に配置され、処理装置Unから送られる基板Pを所定の最長蓄積範囲内で一時的に蓄積してから第2スプライサー部CSbに送り出すものであって、ニップ駆動ローラNR3とダンサーローラ機構DR2とを備えている。
これら切断接合ユニットCU3、CU4の移動は、上位制御装置CONTによって制御される。
上記の基板P2の吸着パッド1Bへの吸着、及び両面テープTの貼設は、オペレータによって行われるか、ロボット等を用いて行われる。
Claims (31)
- 長尺方向に速度V1で搬送される基板に対して連続的に第1の処理を施す第1処理ユニットと、
前記第1処理ユニットで処理された前記基板を速度V2で搬送し、前記基板に対して連続的に第2の処理を施す第2処理ユニットと、
を備えた基板処理システムであって、
前記第1、第2処理ユニットの各々の性能によって、前記速度の関係をV1>V2に設定できる場合は、前記第2処理ユニットを複数設けると共に、前記第1処理ユニットの後に、前記第1の処理が施された前記基板を前記長尺方向の所定長で切断する切断機構と、前記切断された基板を前記複数の第2処理ユニットの何れかに投入する選択投入機構とをさらに備え、
前記第1、第2処理ユニットの各々の性能によって、前記速度の関係をV1<V2に設定できる場合は、前記第1処理ユニットを複数設けると共に、前記第2処理ユニットの前に、前記複数の第1処理ユニットの各々により前記第1の処理が施される複数の基板を、前記長尺方向に順次接合して前記第2処理ユニットに投入する接合機構をさらに備える
ことを特徴とする基板処理システム。 - 前記速度の関係をV1>V2に設定できる場合、前記第1の処理が施された前記基板の搬送量に応じて前記基板の蓄積量が可変であり、前記切断機構に向けて搬送される前記基板の搬送量を調整する第1バッファ部をさらに備える
請求項1に記載の基板処理システム。 - 前記切断機構の動作と前記第1バッファ部における前記基板の蓄積量とを連動させる連動制御部をさらに備える
請求項2に記載の基板処理システム。 - 前記速度の関係をV1<V2に設定できる場合、前記第2の処理が施される前記基板の搬送量に応じて前記基板の蓄積量が可変であり、前記接合機構から前記第2処理ユニットに投入される前記基板の搬送量を調整する第2バッファ部をさらに備える
請求項1から3のいずれか一項に記載の基板処理システム。 - 前記接合機構の動作と前記第2バッファ部における前記基板の蓄積量とを連動させる第2連動制御部をさらに備える
請求項4に記載の基板処理システム。 - 前記第1処理ユニット及び前記第2処理ユニットに隣り合ってそれぞれ設けられ、前記切断機構及び前記接合機構を一体的に備えるステーション部を備える
請求項1から5のいずれか一項に記載の基板処理システム。 - 前記ステーション部は、前記基板を保持して前記長尺方向に移動可能な移動部と、
前記切断機構による切断領域、または前記接合機構による接合領域に前記移動部を移動させる移動制御部とを備える
請求項6に記載の基板処理システム。 - 長尺方向に速度V1で搬送される基板に対して第1処理ユニットにより連続的に第1の処理を施すことと、
前記第1処理ユニットで処理された前記基板を速度V2で搬送し、第2処理ユニットにより前記基板に対して連続的に第2の処理を施すことと、
を備えた基板処理方法であって、
前記第1、第2処理ユニットの各々の性能によって、前記速度の関係をV1>V2に設定できる場合は、前記第2処理ユニットを複数用いると共に、前記第1処理ユニットの後に、前記第1の処理が施された前記基板を前記長尺方向の所定長で切断する工程と、前記切断された基板を前記複数の第2処理ユニットの何れかに投入する選択投入工程とをさらに有し、
前記第1、第2処理ユニットの各々の性能によって、前記速度の関係をV1<V2に設定できる場合は、前記第1処理ユニットを複数用いると共に、前記第2処理ユニットの前に、前記複数の第1処理ユニットの各々により前記第1の処理が施される複数の基板を、前記長尺方向に順次接合して前記第2処理ユニットに投入する接合工程をさらに有する
ことを特徴とする基板処理方法。 - 前記速度の関係をV1>V2に設定できる場合、前記第1の処理が施された前記基板の搬送量に応じて前記基板の蓄積量を調整し、前記切断が行われる領域に向けて搬送される前記基板の搬送量を調整する
請求項8に記載の基板処理方法。 - 前記基板の切断動作と、前記基板の蓄積量の調整と、を連動させる
請求項9に記載の基板処理方法。 - 前記速度の関係をV1<V2に設定できる場合、前記第2の処理が施される前記基板の搬送量に応じて前記基板の蓄積量を調整し、前記接合が行われる領域から前記第2処理ユニットに投入される前記基板の搬送量を調整する
請求項8に記載の基板処理方法。 - 前記基板の接合動作と、前記基板の蓄積量の調整と、を連動させる
請求項11に記載の基板処理方法。 - 所定の処理が行われた基板を切断する切断部と、
前記所定の処理が施された前記基板の搬送量に応じて前記基板の蓄積量が可変であり、前記切断部に向けて搬送される前記基板の搬送量を調整するバッファ部と、
を備える切断機構。 - 前記切断部の動作と前記バッファ部における基板の蓄積量とを連動させる連動制御部をさらに備える
請求項13に記載の切断機構。 - 所定の処理が施される基板を接合する接合部と、
前記所定の処理が施される前記基板の搬送量に応じて前記基板の蓄積量が可変であり、前記接合部から前記所定の処理に投入される前記基板の搬送量を調整するバッファ部と、
を備える接合機構。 - 長尺方向に搬送される基板を、第1の処理を施す第1処理ユニットに通した後、第2の処理を施す第2処理ユニットに通す基板処理システムであって、
前記第1処理ユニットにおける前記基板の搬送速度に対して、前記第2処理ユニットにおける前記基板の搬送速度を低減させる際は、前記第1処理ユニットと前記第2処理ユニットとの間に、前記基板を前記長尺方向の所定長で切断する切断機構を備え、
前記第1処理ユニットにおける前記基板の搬送速度に対して、前記第2処理ユニットにおける前記基板の搬送速度を増加させる際は、前記第1処理ユニットと前記第2処理ユニットとの間に、前記基板を前記長尺方向に接合する接合機構を備える
ことを特徴とする基板処理システム。 - 前記第1処理ユニットの設置台数をn(n≧1)台、前記第2処理ユニットの設置台数をm(m≧1)台としたとき、前記切断機構を設ける場合はn<mに設定され、前記接合機構を設ける場合はn>mに設定される、
請求項16に記載の基板処理システム。 - 長尺の第1基板が巻かれた第1ロールを装着する第1装着部と、
長尺の第2基板が巻かれた第2ロールを装着する第2装着部と、
前記第1基板と前記第2基板の何れか一方を処理基板として前記長尺の方向に送りつつ、所定の処理を施す処理機構と、
前記処理機構と前記第1装着部との間に配置され、前記第1ロールから供給される前記第1基板を、所定の最長蓄積範囲内で一時的に蓄積してから前記処理機構に送り出すバッファ機構と、
前記バッファ機構と前記第1装着部との間で前記第1基板を切断すると共に、前記切断される前記第1基板の終端部に前記第2ロールから供給される前記第2基板の先端部を接合して、前記バッファ機構に送り出す基板つなぎ換え機構と、
を備える基板処理装置。 - 前記基板つなぎ換え機構は、前記切断される前記第1基板の終端部となる位置に前記第2ロールから供給される前記第2基板の先端部を接合した後に、前記第1基板を切断するように前記切断動作及び前記接合動作を制御する制御部を備える
請求項18に記載の基板処理装置。 - 前記第1基板の切断動作と前記バッファ機構における前記基板の蓄積量とを連動させる連動制御部をさらに備える
請求項18または請求項19に記載の基板処理装置。 - 前記処理機構から排出された前記処理基板を巻き取って回収する第3ロールを装着する第3装着部と、
前記処理機構から排出された前記処理基板を巻き取って回収する第4ロールを装着する第4装着部と、
前記処理機構と前記第3装着部との間に配置され、前記処理機構から供給される前記処理基板を所定の最長蓄積範囲内で一時的に蓄積してから前記第3ロールに送り出す第2バッファ機構と、
前記第2バッファ機構と前記第3装着部との間で、前記第3ロールに巻かれた前記処理基板を切断すると共に、前記切断される前記処理基板の先端部を、前記第4ロールに接続された第3基板の終端部に接合して、前記第4ロールに送り出す第2の基板つなぎ換え機構と、
を備える請求項18から20のいずれか一項に記載の基板処理装置。 - 前記第2の基板つなぎ換え機構は、前記切断される前記処理基板の先端部となる位置に前記第3基板の終端部を接合した後に、前記処理基板を切断するように前記切断動作及び前記接合動作を制御する第2制御部を備える
請求項21に記載の基板処理装置。 - 前記処理基板の切断動作と前記第2バッファ機構における前記処理基板の蓄積量とを連動させる第2連動制御部をさらに備える
請求項21または請求項22に記載の基板処理装置。 - 長尺の第1基板が巻かれた第1ロールを装着する第1装着部と、
長尺の第2基板が巻かれた第2ロールを装着する第2装着部と、
前記第1基板と前記第2基板の何れか一方を処理基板として前記長尺の方向に送りつつ、所定の処理を施す処理機構と、
前記処理機構と前記第1装着部との間に配置され、前記第1ロールから供給される前記第1基板を所定の最長蓄積範囲内で一時的に蓄積してから前記処理機構に送り出すバッファ機構と、
前記バッファ機構と前記第1装着部との間で前記第1基板を切断すると共に、前記切断される前記第1基板の前記バッファ機構側の所定部分に、前記第2ロールから供給される前記第2基板の先端部を連結して、前記バッファ機構に送り出す基板つなぎ換え機構と、
を備える基板処理装置。 - 長尺の第1基板が巻かれた第1ロールを着脱可能に装着する第1装着部と、
前記第1基板と同等の規格の第2基板を所定長さで保持する保持部と、
前記第1基板と前記第2基板との何れか一方を処理基板として前記長尺の方向に送りつつ、所定の処理を施す処理機構と、
前記処理機構と前記第1装着部との間に配置され、前記第1ロールから供給される前記第1基板を所定の最長蓄積範囲内で一時的に蓄積してから前記処理機構に送り出すバッファ機構と、
前記バッファ機構と前記第1装着部との間で前記第1基板を切断すると共に、前記切断される前記第1基板の前記バッファ機構側の所定部分に、前記保持部から供給される前記第2基板の先端部を接続して、前記バッファ機構に送り出す基板つなぎ換え機構と、
を備える基板処理装置。 - 投入された長尺の基板を処理基板として前記長尺の方向に送りつつ処理機構で所定の処理を施す基板処理方法であって、
長尺の基板を巻回した第1ロールを第1ロール装着部に装着することと、
長尺の基板を巻回した第2ロールを第2ロール装着部に装着することと、
前記処理機構と前記第1装着部との間に配置したバッファ機構で、前記第1ロールから供給される前記第1基板を所定の最長蓄積範囲内で一時的に蓄積してから前記処理機構に送り出すことと、
前記一時的に蓄積していた第1基板を前記処理機構に送り出している間に、前記バッファ機構と前記第1装着部との間で前記第1基板を切断すると共に、前記切断される前記第1基板の前記バッファ機構側の所定部分に、前記第2ロールから供給される前記第2基板の先端部を連結することと、
を含む基板処理方法。 - 前記切断される第1基板の終端部となる位置に前記第2ロールから供給される前記第2基板の先端部を連結した後に、前記第1基板を切断する
請求項26に記載の基板処理方法。 - 前記処理機構から排出された前記処理基板を巻き取って回収する第3ロールを第3ロール装着部に装着することと、
前記処理機構から排出された前記処理基板を巻き取って回収する第4ロールを第4ロール装着部に装着することと、
前記処理機構と前記第3装着部との間に配置した第2バッファ機構で、前記処理機構から供給される前記処理基板を所定の最長蓄積範囲内で一時的に蓄積してから前記第3ロールに送り出すことと、
前記処理機構から供給される前記処理基板を第2バッファ機構で一時的に蓄積している間に、前記第3ロールに巻かれた前記処理基板を切断すると共に、前記切断される前記処理基板の先端部を、前記第4ロールに接続された第3基板の終端部に接合して、前記第4ロールに送り出すことと、
を含む請求項26または請求項27に記載の基板処理方法。 - 前記切断される処理基板の終端部となる位置に前記第3基板の終端部を接合した後に、前記処理基板を切断する
請求項28に記載の基板処理方法。 - 前記第3基板は、前記処理基板とは異なる材質で形成された基板である
請求項28または請求項29に記載の基板処理方法。 - 投入された長尺の基板を処理基板として前記長尺の方向に送りつつ処理機構で所定の処理を施す基板処理方法であって、
前記長尺の基板を巻回した第1ロールを第1ロール装着部に装着することと、
前記第1基板と同等の規格の第2基板を保持部に所定長さで保持することと、
前記処理機構と前記第1装着部との間に配置したバッファ機構で、前記第1ロールから供給される前記第1基板を所定の最長蓄積範囲内で一時的に蓄積してから前記処理機構に送り出すことと、
前記一時的に蓄積していた第1基板を前記処理機構に送り出している間に、前記バッファ機構と前記第1装着部との間で前記第1基板を切断すると共に、前記切断される前記第1基板の前記バッファ機構側の所定部分に、前記保持部から供給される前記第2基板の先端部を連結することと、
を含む基板処理方法。
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