JP6107986B2 - 基板処理方法、および基板の切断又は接合装置 - Google Patents
基板処理方法、および基板の切断又は接合装置 Download PDFInfo
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- JP6107986B2 JP6107986B2 JP2016018903A JP2016018903A JP6107986B2 JP 6107986 B2 JP6107986 B2 JP 6107986B2 JP 2016018903 A JP2016018903 A JP 2016018903A JP 2016018903 A JP2016018903 A JP 2016018903A JP 6107986 B2 JP6107986 B2 JP 6107986B2
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Description
本願は、2012年5月23日に出願された米国仮出願61/650,712及び2012年6月1日に出願された米国仮出願61/654,500に基づき優先権を主張し、その内容をここに援用する。
長尺のシート状基板に対して複数の処理を順次施す場合、各処理ユニットの性能によって、処理に適した基板の搬送速度はユニット毎(処理内容毎)にまちまちになる。例えば、特許文献2のような露光処理の場合は、基板表面に塗布された感光層の感度と露光用照明光の輝度等により、基板の搬送速度(タクト)は制限される。また、エッチングやメッキ等の湿式処理や、その湿式処理後の乾燥・加熱工程でも、基板をゆっくり搬送することにより、液槽や乾燥・加熱炉を小型化できる等の利点が得られる。
以下、本発明の切断機構、接合機構、基板処理システム、及び基板処理方法の実施形態を、図1から図6を参照して説明する。
図1は、例として、シート状の基板Pを順次3つの処理工程A、B、Cに通すロール方式の基板処理システムSYSを模式的に示した図である。
VA≒VC>VB
なお、処理ユニットUAと処理ユニットUB1〜UB3のいずれか1つとの間では、基板Pの搬送速度がVA>VBとなっているため、処理ユニットUAが搬送速度(V1)の高い第1処理ユニットに対応し、処理ユニットUB1〜UB3のいずれか1つが搬送速度(V2)の低い第2処理ユニットに対応する。一方、処理ユニットUB1〜UB3のいずれか1つと処理ユニットUCとの間では、基板Pの搬送速度がVB<VCとなっているため、処理ユニットUB1〜UB3のいずれか1つが搬送速度(V1)の低い第1処理ユニットに対応し、処理ユニットUCが搬送速度(V2)の高い第2処理ユニットに対応する。
第1スプライサー部CSaは、上面に、例えば多孔質材で形成された吸着パッド1を有し、基板Pの搬送方向(以下、単に搬送方向と称する)に移動自在なスライダー2と、スライダー2を搬送方向に移動自在に支持するガイドレール付の昇降台3と、昇降台3を昇降させる駆動部4と、昇降台3が上昇した位置にあるときに、基板Pの幅方向に移動して、スライダー2の吸着パッド1に吸着された基板Pを切断可能なカッター部5、及び基板Pに対して粘着テープTPを貼り付け可能な貼り付け部6、昇降台3の上方に設けられ、処理Aが施された基板Pを巻き取るロールRR1用の巻き取り軸7を両側で保持する保持部8(上下動可能)、とを備えている。
これらのスライダー2、駆動部4、カッター部5、貼り付け部6の各駆動は、制御部CTによって制御される(図5参照)。
また、ステーション部SNは、基板Pを保持して長尺方向に移動可能で、スライダー2、昇降台3、駆動部4などを含む移動部と、切断機構CU10による切断領域、または接合機構PU10による接合領域に移動部を移動させる移動制御部とを備える。
従って、切断機構CU10は、供給ロールRRAに巻かれた基板Pの全長をほぼ3等分するような所定長毎に基板Pを切断する。
図5に示すように、制御部CTは、処理ユニットUA、UB(UB1〜UB3)、UCの動作を制御するとともに、切断機構CU10と接合機構PU10の各々に設けられるスライダー2、駆動部4、カッター部5、貼り付け部6、選択投入機構ST1、ST2、ダンサーローラ機構DR1、DR2、ニップ駆動ローラNR1、NR2等の駆動を統括的に制御する。その他、制御部CTは、供給ロールRRA、回収ロールRRCの回転駆動、各工程(各処理ユニット)における基板Pの搬送長を計数して管理したり、基板Pの供給側となる各ロールの基板残量と、基板Pの回収側となる各ロールの基板巻上げ量とを計数して管理したり、処理工程A〜Cまでの全体的なタクトの管理、各ロール毎に、処理上の問題の有無や不良が発生した場合の程度や場所等の情報の管理、等も行なう。制御部CTは、切断機構CU10の動作と第1バッファ部BF1における基板Pの蓄積量とを連動させる連動制御部を含む。同様に、制御部CTは、接合機構PU10の動作と第2バッファ部BF2における基板Pの蓄積量とを連動させる連動制御部を含む。
ここでは、図1に示すように、処理ユニットUB1において処理Bが完了した直後で子ロールRRB12が選択投入機構ST2によって、第2スプライサー部CSbの保持部8に搬送される。また、処理ユニットUB2においては、装着部RSB21に装着された子ロールRRB21から引き出された基板Pに対して処理Bが施される。また、処理ユニットUB3においては、次の処理対象となる子ロールRRB31が装着部RSB31に装着されるまで待機しているものとする。
具体的には、まず、スライダー2がカッター部5と対向する位置に移動した後に駆動部4の作動により昇降台3がスライダー2とともに上昇する。スライダー2の上昇により、吸着パッド1が基板Pを裏面(下面)から吸着保持し、カッター部5による切断位置に位置決めする。その後、カッター部5が、基板Pの幅方向に移動して基板Pを切断する。基板Pが切断されると、選択投入機構ST1が子ロールRR1を、ここでは処理ユニットUB3の装着部RSB31に子ロールRRB31として投入する。また、選択投入機構ST1は、子ロールRR1が排出されて空きとなった第1スプライサー部CSaの保持部8に予備の巻き取り軸7を装填する。
従ってこの場合も、低い処理速度VBに律則されることなく、基板Pを処理速度VC(≒VA)で処理することが可能となる。
次に、上記基板処理システムが適用されるデバイス製造システムについて、図6を参照して説明する。
その後、処理ユニットUCは、1番目の400mの基板に接合された2番目の400m分の基板を、搬送速度15cm/sで継続的に処理する。
以下、本発明の基板処理装置及び基板処理方法の実施形態を、図9から図25を参照して説明する。本実施形態において、上記の実施形態と同様の構成要素については、同じ符号を付してその説明を簡略化あるいは省略する。
第2バッファ機構BF2は、処理装置(処理機構)Unと第2スプライサー部CSbとの間に配置され、処理装置Unから送られる基板Pを所定の最長蓄積範囲内で一時的に蓄積してから第2スプライサー部CSbに送り出すものであって、ニップ駆動ローラNR3とダンサーローラ機構DR2とを備えている。
これら切断接合ユニットCU3、CU4の移動は、上位制御装置CONTによって制御される。
上記の基板P2の吸着パッド1Bへの吸着、及び両面テープTの貼設は、オペレータによって行われるか、ロボット等を用いて行われる。
Claims (5)
- 供給ロールに巻かれた長尺の第1のシート基板を長尺方向に処理装置に搬入し、前記処理装置で電子デバイスを形成する為の処理が施された前記第1のシート基板を回収ロールに巻き上げて回収する基板処理方法であって、
前記供給ロールと前記処理装置の間に配置されるバッファ機構によって、前記処理装置に搬入される前記第1のシート基板を所定の最長蓄積範囲内で長尺方向の長さが変えられるように蓄積することと、
前記供給ロールと前記バッファ機構との間に配置される接合機構によって、前記バッファ機構に搬入される前記第1のシート基板の前記長尺方向の端部となる部分に第2のシート基板を接合することと、
前記第1のシート基板と接合された前記第2のシート基板が接合部から所定長さに渡って前記処理装置を通る間はパイロット処理を行うことと、
を含む基板処理方法。 - 請求項1に記載の基板処理方法であって、
前記パイロット処理は、前記処理装置の条件出し又はメンテナンス管理の為に行われる、
基板処理方法。 - 請求項1又は請求項2に記載の基板処理方法であって、
前記供給ロールと前記バッファ機構との間を通る前記第1のシート基板を一時的に停止し、前記供給ロールと前記バッファ機構との間に前記接合機構と共に配置される切断機構によって、前記第1のシート基板を長尺方向に関して切断することを含み、
前記第2のシート基板は、前記切断される前記第1のシート基板の端部に前記接合機構によって接合される、
基板処理方法。 - 請求項1又は請求項2に記載の基板処理方法であって、
前記供給ロールと前記バッファ機構との間を通る前記第1のシート基板を一時的に停止し、前記供給ロールと前記バッファ機構との間に前記接合機構と共に配置される切断機構によって、前記第1のシート基板を長尺方向に関して切断する切断工程を含み、
前記切断機構による切断によって端部となる前記第1のシート基板の部分に、前記接合機構によって前記第2のシート基板の端部を接合した後に、前記切断工程を実行する、
基板処理方法。 - 請求項3又は請求項4に記載の基板処理方法であって、
前記処理装置は、
前記シート基板の表面に感光性機能液を連続的又は選択的に塗布する塗布装置と、前記感光性機能液によって前記シート基板上に形成された感光性機能層に対して紫外線のパターニング光を照射する露光装置と、前記シート基板の感光性機能層に湿式処理を施すウェット処理装置と、前記湿式処理で湿った前記シート基板を乾燥させる乾燥装置とを含み、
前記供給ロールは前記塗布装置の前記シート基板の搬入側に設けられ、前記回収ロールは前記乾燥装置の前記シート基板の搬出側に設けられる、
基板処理方法。
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JP6156369B2 (ja) * | 2012-05-23 | 2017-07-05 | 株式会社ニコン | 切断機構、接合機構、基板処理システム、基板処理装置、及び基板処理方法 |
DE102014116615A1 (de) * | 2014-11-13 | 2016-05-19 | Packsys Global Ag | Substratzuführvorrichtung für ein Verpackungstubenherstellungsprozess sowie Substratzuführverfahren |
CN108040500B (zh) * | 2015-09-29 | 2022-04-08 | 株式会社尼康 | 制造系统 |
JP6645157B2 (ja) * | 2015-12-10 | 2020-02-12 | 株式会社ニコン | 基板処理装置 |
CN109562902B (zh) * | 2016-08-08 | 2020-08-21 | 株式会社尼康 | 基板处理装置 |
JP6829870B2 (ja) * | 2016-11-25 | 2021-02-17 | 三星ダイヤモンド工業株式会社 | 基板分断システム |
JP6376483B2 (ja) * | 2017-01-10 | 2018-08-22 | 大日本印刷株式会社 | 蒸着マスクの製造方法、蒸着マスク装置の製造方法および蒸着マスクの良否判定方法 |
JP7015987B2 (ja) * | 2017-10-03 | 2022-02-04 | パナソニックIpマネジメント株式会社 | 部品実装装置および実装基板の製造方法 |
JP6967276B2 (ja) * | 2017-12-28 | 2021-11-17 | 三星ダイヤモンド工業株式会社 | ブレーク装置 |
JP7064885B2 (ja) * | 2018-01-05 | 2022-05-11 | 東京エレクトロン株式会社 | 基板把持機構、基板搬送装置及び基板処理システム |
TWI823598B (zh) * | 2018-01-23 | 2023-11-21 | 日商東京威力科創股份有限公司 | 接合系統及接合方法 |
KR20230051717A (ko) * | 2018-07-09 | 2023-04-18 | 다이니폰 인사츠 가부시키가이샤 | 증착 마스크의 제조 방법 및 증착 마스크 장치의 제조 방법 |
JP7454837B2 (ja) | 2020-02-03 | 2024-03-25 | 三光機械株式会社 | 包装フィルムの接合装置及び包装フィルム自動交換装置 |
WO2024053441A1 (ja) * | 2022-09-05 | 2024-03-14 | 株式会社瑞光 | スプライス装置および方法 |
KR102553891B1 (ko) * | 2022-09-05 | 2023-07-11 | 주식회사 스타테크 | 롤투롤 장치 |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4157934A (en) * | 1977-07-18 | 1979-06-12 | Compensating Tension Controls, Inc. | Low tension lap slicer unit |
JPS625327Y2 (ja) * | 1980-06-02 | 1987-02-06 | ||
JPS6019037A (ja) | 1983-07-14 | 1985-01-31 | Nissan Motor Co Ltd | 排ガス処理用触媒の製造方法 |
JPS6019037U (ja) | 1983-07-18 | 1985-02-08 | 株式会社リコー | 露光装置 |
JPH07176507A (ja) * | 1993-12-20 | 1995-07-14 | Hitachi Ltd | ウエット処理装置およびウエット処理方法 |
JPH08157112A (ja) * | 1994-10-06 | 1996-06-18 | Kyodo Printing Co Ltd | ウェブ巻取装置および巻取方法 |
JPH08152718A (ja) * | 1994-11-28 | 1996-06-11 | Nippon Seiko Kk | 露光装置 |
JPH08239144A (ja) * | 1995-03-03 | 1996-09-17 | Canon Inc | 連続体を加工素材とする物品の製造における加工素材の交換方法 |
JPH08330205A (ja) * | 1995-05-29 | 1996-12-13 | Matsushita Electron Corp | アライメント方法 |
JPH10279142A (ja) * | 1997-04-09 | 1998-10-20 | Takao Eng Kk | テープ材接着装置 |
JP3586582B2 (ja) * | 1999-04-09 | 2004-11-10 | 三菱重工業株式会社 | ウェブ継ぎ装置及び継ぎウェブ生成方法 |
JP4328460B2 (ja) * | 2000-11-09 | 2009-09-09 | 株式会社トパック | フィルム供給機 |
JP2002313880A (ja) * | 2001-04-19 | 2002-10-25 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP2003024865A (ja) * | 2001-07-11 | 2003-01-28 | Minolta Co Ltd | フィルム基板の湿式処理方法及び湿式処理装置 |
ATE512106T1 (de) * | 2002-03-22 | 2011-06-15 | Magnum Mfg Ltd | Verfahren und vorrichtung zur bildung eines geschuppten bogenstroms in einer bogenzuführvorrichtung und zum zuführen des geschuppten bogenstroms in einer druckmaschine |
JP2003327354A (ja) * | 2002-05-10 | 2003-11-19 | Zuiko Corp | ウエブの継ぎ方法および継ぎ装置 |
JP3965329B2 (ja) * | 2002-06-20 | 2007-08-29 | 東洋鋼鈑株式会社 | 樹脂フィルムの接続方法および接続装置 |
JP4475864B2 (ja) * | 2002-09-11 | 2010-06-09 | 大日本印刷株式会社 | 混流型製造ラインシステム |
JP2004182353A (ja) * | 2002-11-29 | 2004-07-02 | Rengo Co Ltd | ウェブ継ぎ装置 |
JP2004186469A (ja) * | 2002-12-04 | 2004-07-02 | Nippon Telegr & Teleph Corp <Ntt> | 帯状連続基材およびそれを用いた半導体装置ならびに製造方法 |
JP2004189379A (ja) * | 2002-12-10 | 2004-07-08 | Rengo Co Ltd | ウェブ継ぎ装置 |
JP4259882B2 (ja) * | 2003-01-15 | 2009-04-30 | シチズンファインテックミヨタ株式会社 | テープ貼り付け方法、及びテープ貼り付け装置 |
US20050241774A1 (en) * | 2004-04-30 | 2005-11-03 | Kimberly-Clark Worldwide, Inc. | Apparatus and process for aligning materials during a splice |
JP2005347618A (ja) | 2004-06-04 | 2005-12-15 | Fuji Photo Film Co Ltd | 感光性ウエブユニット、感光性積層体の製造装置及び製造方法 |
JP2006060066A (ja) * | 2004-08-20 | 2006-03-02 | Mitsubishi Electric Corp | シリコン酸化膜の成膜方法および成膜装置 |
JP4515331B2 (ja) * | 2005-05-30 | 2010-07-28 | 東京エレクトロン株式会社 | 基板の処理システム |
JP4224479B2 (ja) * | 2005-09-07 | 2009-02-12 | 富士フイルム株式会社 | パターン露光方法及び装置 |
EP1922588B1 (en) * | 2005-09-07 | 2015-01-07 | FUJIFILM Corporation | Pattern exposure method and pattern exposure apparatus |
JP4861778B2 (ja) * | 2005-09-08 | 2012-01-25 | 富士フイルム株式会社 | パターン露光方法及び装置 |
JP4360684B2 (ja) * | 2006-02-22 | 2009-11-11 | 日東電工株式会社 | 半導体ウエハの粘着テープ貼付け方法およびこれを用いた装置 |
JP2008001429A (ja) * | 2006-05-22 | 2008-01-10 | Sanko Kikai Kk | 充填包装機の自動フィルム継ぎ装置 |
JP5059382B2 (ja) | 2006-11-20 | 2012-10-24 | ディップ株式会社 | 職務経歴書自動作成システム及び方法 |
KR101538281B1 (ko) * | 2007-04-13 | 2015-07-22 | 가부시키가이샤 니콘 | 표시 소자의 제조 방법과 제조 장치 |
WO2008146744A1 (ja) * | 2007-05-25 | 2008-12-04 | Hamamatsu Photonics K.K. | 切断用加工方法 |
JP4894010B2 (ja) * | 2007-06-12 | 2012-03-07 | 株式会社トーモク | コルゲートマシンにおける紙継方法及び紙継装置 |
JP2009023301A (ja) * | 2007-07-23 | 2009-02-05 | Fujifilm Corp | 積層体フイルムの貼り付け方法 |
TW200919117A (en) * | 2007-08-28 | 2009-05-01 | Tokyo Electron Ltd | Coating-developing apparatus, coating-developing method and storage medium |
US8782234B2 (en) | 2008-05-05 | 2014-07-15 | Siemens Industry, Inc. | Arrangement for managing data center operations to increase cooling efficiency |
KR101015227B1 (ko) * | 2008-08-06 | 2011-02-18 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
KR101181560B1 (ko) * | 2008-09-12 | 2012-09-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그것에 사용되는 기판반송장치 |
JP2010113268A (ja) * | 2008-11-10 | 2010-05-20 | Kyodo Printing Co Ltd | シールド材の製造方法及びフォトマスク |
US8541163B2 (en) * | 2009-06-05 | 2013-09-24 | Nikon Corporation | Transporting method, transporting apparatus, exposure method, and exposure apparatus |
JP5630113B2 (ja) | 2009-07-17 | 2014-11-26 | 株式会社ニコン | パターン形成装置及びパターン形成方法、並びにデバイス製造方法 |
JP5465944B2 (ja) | 2009-07-30 | 2014-04-09 | 日東電工株式会社 | 保護テープ貼付け方法 |
JP4503689B1 (ja) * | 2009-10-13 | 2010-07-14 | 日東電工株式会社 | 液晶表示素子の連続製造方法及び装置 |
JP5313945B2 (ja) | 2010-02-25 | 2013-10-09 | パナソニック株式会社 | テープ貼付装置、保護シートユニット、及び保護シート送り方法 |
JP5708179B2 (ja) * | 2010-04-13 | 2015-04-30 | 株式会社ニコン | 露光装置、基板処理装置及びデバイス製造方法 |
JP5830233B2 (ja) * | 2010-09-17 | 2015-12-09 | 日東電工株式会社 | シート接合体の製造方法及びシート接合体の製造装置 |
JP6156369B2 (ja) * | 2012-05-23 | 2017-07-05 | 株式会社ニコン | 切断機構、接合機構、基板処理システム、基板処理装置、及び基板処理方法 |
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