WO2013132831A1 - Particules fines conductrices, procédé de fabrication associé, composition de résine conductrice, feuille conductrice, et feuille de blindage électromagnétique - Google Patents

Particules fines conductrices, procédé de fabrication associé, composition de résine conductrice, feuille conductrice, et feuille de blindage électromagnétique Download PDF

Info

Publication number
WO2013132831A1
WO2013132831A1 PCT/JP2013/001351 JP2013001351W WO2013132831A1 WO 2013132831 A1 WO2013132831 A1 WO 2013132831A1 JP 2013001351 W JP2013001351 W JP 2013001351W WO 2013132831 A1 WO2013132831 A1 WO 2013132831A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
fine particles
dendritic
conductive fine
sheet
Prior art date
Application number
PCT/JP2013/001351
Other languages
English (en)
Japanese (ja)
Inventor
努 早坂
祥太 森
祐司 西山
和規 松戸
高橋　政勝
Original Assignee
東洋インキＳｃホールディングス株式会社
トーヨーケム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋インキＳｃホールディングス株式会社, トーヨーケム株式会社 filed Critical 東洋インキＳｃホールディングス株式会社
Priority to KR1020147023849A priority Critical patent/KR102017121B1/ko
Priority to CN201380012622.XA priority patent/CN104170023B/zh
Publication of WO2013132831A1 publication Critical patent/WO2013132831A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers

Definitions

  • the present invention relates to conductive fine particles and a method for producing the same.
  • the present invention also relates to a conductive resin composition containing the conductive fine particles. Furthermore, it is related with an electroconductive sheet and an electromagnetic wave shield sheet provided with the electroconductive layer formed from the said electroconductive resin composition.
  • Printed wiring boards are becoming thinner as electronic devices such as mobile phones and digital cameras become smaller, and flexible printed wiring boards are increasingly used.
  • a conductive sheet, an electromagnetic shielding sheet or the like (hereinafter also referred to as “conductive sheet or the like”) is usually used.
  • the conductive sheet or the like is required to have excellent conductive characteristics including stability over time, and the characteristics of the conductive filler contained in the sheet are important.
  • the conductive filler since silver powder is excellent in conductive properties, conductive sheets containing silver powder have been put to practical use so far. However, the price of silver powder is expensive compared to resins and other raw materials used for conductive sheets and the like, resulting in high costs. In addition, due to the recent increase in silver prices, the price increase of conductive sheets using silver powder has become a serious problem. In order to achieve a reduction in the price of electronic equipment, it is necessary to reduce the usage rate of the conductive filler. However, if the usage rate of the conductive filler is reduced, the desired conductivity cannot be maintained. Face the problem.
  • Patent Document 1 discloses a conductive paste in which dendritic silver-coated copper powder and scaly silver powder are mixed as conductive particles.
  • the present invention has been made in view of the above background, and the object of the present invention is that it is possible to reduce costs, have excellent conductive properties, and, for example, when a composition blended with a resin is formed into a sheet shape. It is to provide conductive fine particles that can be made thin.
  • the conductive fine particles according to the present invention include a core containing a conductive substance, a coating layer that covers the core and is made of a conductive substance different from the core, and at least a part of which constitutes the outermost layer.
  • the average value of the circularity degree coefficient obtained from the following formula (1) is 0.15 or more and 0.4 or less, and at least one of notches and branched leaves is formed in the outer edge shape. Yes.
  • conductive fine particles that can be reduced in cost, have excellent conductive characteristics, and can be thinned when, for example, a composition blended with a resin is formed into a sheet shape. There is an excellent effect of being able to.
  • the average value of the circularity coefficient is in the above range, and the leaf-like conductive fine particles include at least one of notches and branched leaves in the outer edge shape.
  • the conductive characteristics were excellent.
  • the average value of the circularity coefficient is within the above range. And it turned out that it can be made into a thin film when it kneads
  • the conductive fine particles of the present invention are so-called core-shell type particles, which are composed of a core containing a conductive substance and a core that covers the core and is made of a conductive substance different from the core. And a coating layer that constitutes the outermost layer.
  • the coating layer only needs to cover at least a part of the nucleus, but in order to obtain more excellent conductive characteristics, a higher coverage is preferable.
  • the average coverage by the coating layer is preferably 60% or more, more preferably 70% or more, and even more preferably 80% or more.
  • the average coverage in this specification says the value calculated
  • the conductive fine particles may be composed only of the nucleus and the coating layer, but may include other layers. For example, layers such as an intermediate layer and a bonding layer that strengthen the bonding between the core and the coating layer may be formed.
  • the core body, the coating layer, and the other layers may be independently formed of a single type or a plurality of types. Further, in the core body and the coating layer, other substances than the conductive substance may be kneaded within a range not departing from the gist of the present invention.
  • the average value of the circularity coefficient obtained from the following formula (1) is 0.15 or more and 0.4 or less, and the outer edge has at least one of notches and branched leaves. A plurality are formed.
  • the degree of unevenness (undulation degree) of the outer edge of the conductive fine particles can be grasped by the circularity degree coefficient of the above formula (1).
  • the true sphere has a circularity coefficient of 1, and the circularity coefficient decreases as the uneven shape increases. That is, the circularity coefficient is greater than 0 and 1 or less.
  • the circularity coefficient in this specification use the analysis software of Mac-View Ver.4 (Mounttech) to read the electron microscopic image (about 1000 to 10,000 times) of the conductive fine particles, and use the manual recognition mode. About 20 conductive particles were selected.
  • the particle reference data is a projected area equivalent circle diameter
  • the distribution is a volume distribution setting.
  • a circularity coefficient and a circular coefficient are calculated, and 20 average values are obtained.
  • the area is the area inside the line forming the outer periphery when projected two-dimensionally as a flat plate surface, and the outer periphery of the conductive fine particles when the flat plate surface is projected two-dimensionally is the peripheral length. Length.
  • a core shell using an average value of the circularity coefficient obtained from the above formula (1) of not less than 0.15 and not more than 0.4, and at least one of notches and branched leaves formed in the outer edge shape By using the type of conductive fine particles, the cost can be reduced, the conductive characteristics are excellent, and the film can be made thin.
  • the lower limit of the circularity coefficient is more preferably 0.15 or more, and further preferably 0.20 or more, from the viewpoint of preventing the conductive filler from penetrating into the insulating layer.
  • the upper limit value of the circularity coefficient is more preferably 0.4 or less, and further preferably 0.3 or less, from the viewpoint of the sheet resistance of the conductive layer.
  • the average value of the circularity coefficient and the average value of the circular coefficient are preferably about 10 or more particles defined per 1 cm 2 .
  • the circularity coefficient of the dendritic conductive fine particles as shown in FIG. 3 is about 0.11 or less, and the circularity coefficient of the scaly conductive fine particles exceeds 0.4, 0.5 It is about the following.
  • the conductive fine particles of the present invention preferably have an average value of circular coefficients representing circularity obtained from the following formula (2) of 2 or more and 5 or less.
  • the maximum diameter is the length of the maximum length of the selected particles.
  • the more preferable upper limit of the circular coefficient is 4.5 or less, and more preferably 4.0 or less.
  • a more preferable lower limit value of the circular coefficient is 2 or more, and more preferably 2.4 or more.
  • the circular coefficient indicates whether the shape of the entire fine particle is close to a circle (the smaller the value, the closer to the circle).
  • the circular coefficient is a shape factor 3 using the analysis software (Mac-View Ver. 4) used for the circularity coefficient.
  • the conductive fine particles of the present invention are leaf-shaped conductive fine particles having a plurality of at least one of scale leaves and branched leaves.
  • FIG. 1 shows an electron microscope image showing an example of conductive fine particles according to the present invention.
  • copper powder is used as the core and silver is used as the coating layer.
  • the conductive fine particle has a plurality of cuts and / or branch leaves formed in the outer edge shape.
  • a plurality of scale leaves, branched leaves, or similar shapes are formed.
  • the conductive fine particles of the present invention are also referred to as “leaf-shaped conductive fine particles”.
  • the thickness of the conductive fine particles is preferably 0.1 to 2 ⁇ m, more preferably 0.2 to 1 ⁇ m.
  • the conductive sheet can be manufactured thinner while maintaining the conductivity of the conductive sheet.
  • the thickness is obtained on the basis of an image magnified by about 1,000 to 50,000 times with an electron microscope, and the “thickness” here is a 10,000 times image of an electron microscope and different particles. About 10 to 20 were measured, and the average value was used.
  • the average particle diameter (D50) of the conductive fine particles is preferably 1 to 100 ⁇ m.
  • the average particle diameter (D50) of the conductive fine particles is more preferably 3 ⁇ m or more, and more preferably 50 ⁇ m or less.
  • the average particle size (D50) is obtained by measuring each conductive fine particle with a tornado dry powder sample module using a laser diffraction / scattering particle size distribution analyzer LS 13 320 (manufactured by Beckman Coulter).
  • the obtained numerical value is the average particle diameter of the diameter of the particle size where the integrated value of the particles is 50%.
  • the refractive index was set to 1.6.
  • the measurement method of the average particle diameter (D50) when the conductive fine particles are in the form of a conductive sheet is the same as the method for measuring the circularity coefficient, and the conductive fine particles are observed by SEM, and image analysis software In Mac-View Ver.4 (Mounttech), the particle reference data is the projected area circle equivalent diameter, and the distribution is the volume distribution setting, and the average particle diameter (D50) is obtained.
  • the nucleus functions as a core part of conductive fine particles.
  • the nucleus is preferably composed of only a conductive material from the viewpoint of improving the conductive properties, but may contain a non-conductive material.
  • the raw material of the nucleus is not particularly limited as long as it satisfies these, and examples thereof include conductive metal, conductive carbon, or conductive resin.
  • the conductive metal include gold, platinum, copper, nickel, aluminum, iron, or an alloy thereof, and ITO.
  • copper is preferable from the viewpoint of cost and conductivity.
  • the conductive carbon is preferably, for example, acetylene black, ketjen black, furnace black, carbon nanotube, carbon nanofiber, graphite, or graphene.
  • poly (3,4-ethylenedioxythiophene), polyacetylene, polythiophene, and the like are preferable. It is preferable that the nucleus itself has conductivity.
  • the coating layer is made of a conductive material different from the core.
  • the conductive material that can be used for the coating layer include the materials mentioned in the nucleus. Among them, the use of a material having high conductive characteristics meets the object of the present invention. Specifically, gold, platinum or silver is preferable, and silver is more preferable.
  • conductive materials other than metals, such as conductive resins have low conductivity. However, if the technology improves and the conductivity improves in the future, conductive resins and the like are also suitable as the coating layer. . From the viewpoint of achieving both cost reduction and improvement in conductive characteristics, it is preferable to use a conductive substance having excellent conductive characteristics in the coating layer and a conductive substance advantageous in cost for the core.
  • a conductive intermediate layer can be provided between the core and the coating layer.
  • the coating layer is preferably coated at a ratio of 1 to 40 parts by weight with respect to 100 parts by weight of the core, more preferably 5 to 30 parts by weight, and even more preferably 5 to 20 parts by weight.
  • the coating layer in the range of 1 to 40 parts by weight, it is possible to bring out the conductive characteristics while reducing the amount of the conductive material used as the coating layer. For example, when copper is used as the core and silver is used as the coating layer, the price of the conductive fine particles can be effectively reduced while maintaining the conductive characteristics.
  • the conductive characteristics are obtained by setting the average value of the circularity coefficient to the above range and the leaf-shaped conductive fine particles including at least one of notches and branched leaves in the outer edge shape.
  • the leaf-shaped conductive fine particles including at least one of notches and branched leaves in the outer edge shape.
  • the dendritic conductive fine particles have a problem that it is difficult to reduce the thickness, but the conductive fine particles according to the present invention can be easily reduced in thickness. This is because it is flattened rather than dendritic. Further, since different conductive materials are used for the core and the coating layer, the choice of materials can be increased and the cost can be reduced.
  • the conductive fine particles of the present invention are of the core-shell type, even when particles satisfying the circularity coefficient and the outer edge shape are produced in a single conductive substance, excellent conductive characteristics and Thin film can be achieved. Therefore, if the price of silver or the like is reduced, it is useful even with a single conductive material if the problem of cost reduction can be solved. In addition, when copper is used, there is a problem that the conductive characteristics are lowered due to oxidation. However, if the conductive characteristics can be satisfactorily maintained by the development of an anti-oxidation technique, it is useful even in a single conductive substance.
  • the method for producing conductive fine particles of the present invention comprises a core containing a conductive substance and a conductive substance which covers the core and is different from the core, and at least partly Is a method for producing conductive fine particles comprising a coating layer constituting the outermost layer. More specifically, a step of preparing a dendritic particle having conductivity and a solid medium for deforming the dendritic particle by colliding with the dendritic particle, and the dendritic particle and the solid medium are sealed in a sealed container.
  • the circularity coefficient obtained from the following mathematical formula (1) is 0.15 or more and 0.4 or less, and at least one of notches and branch leaves is formed in the outer edge shape.
  • a step of deforming so as to be formed will be described in order to embody the method for producing conductive fine particles of the present invention. However, it is not limited by the following manufacturing methods, and various manufacturing methods are possible.
  • a step of preparing a dendritic fine particle having conductivity and a solid medium for deforming the dendritic fine particle by colliding with the dendritic fine particle step 1).
  • a step (step 2) of deforming the dendritic fine particles by causing the dendritic fine particles and the solid medium to collide with each other in a closed container.
  • Step 1 for the dendritic particles, particles having so-called dendritic (dendritic) conductive properties as shown in FIG. 3 are prepared.
  • the dendritic particles non-leaf-like conductive fine particles which are precursors of leaf-like conductive fine particles comprising a nucleus and a coating layer can be suitably used.
  • the dendritic particle which consists only of a nucleus may be sufficient.
  • a step of providing a coating layer on the core is performed as step 3.
  • the solid medium in Step 1 is caused to collide with the dendritic fine particles so that the circularity coefficient obtained from the mathematical formula (1) is 0.15 or more and 0.4 or less, and the outer edge shape is There is no particular limitation as long as it is possible to obtain conductive fine particles in which at least one of notches and branched leaves is formed.
  • the solid medium is preferably a metal such as iron steel, or a material such as glass, zirconia, alumina, plastic, titania or ceramic.
  • a known disperser such as a ball mill or a sand mill, or a pulverizer can be used.
  • the shape of the solid medium is preferably a shape with few irregularities such as a spherical shape and an elliptical shape.
  • the size of the solid medium is, for example, about 0.1 to 3 mm.
  • the specific gravity of the solid medium is, for example, about 1.0 to 10.0.
  • Step 2 the dendritic particles and the solid medium are put into a sealed container, and the dendritic particles and the solid medium are caused to collide with each other.
  • the solid medium collides with the dendritic fine particles the dendritic fine particles are deformed, and for example, leaf-like conductive fine particles as shown in FIG. 1 can be obtained.
  • the solid medium may be collided in the presence of the resin.
  • the conductive resin composition mentioned later can be manufactured simultaneously with manufacture of conductive fine particles.
  • the dispersion time and the collision condition for the collision in Step 2 are not particularly limited as long as the conductive fine particles having the above characteristics can be obtained.
  • the dispersion time can be 10 to 60 minutes.
  • a thickener, a dispersant, a heavy metal deactivator, or the like can be used as an additive to the conductive fine particles when producing the conductive fine particles.
  • a thickener By using a thickener, it is possible to prevent the fine particles from precipitating excessively.
  • the thickener include silica-based compounds, polycarboxylic acid-based compounds, polyurethane-based compounds, urea-based compounds, and polyamide-based compounds.
  • the dispersibility of the body conductive fine particles can be further improved by using a dispersant.
  • the dispersant include an acidic dispersant composed of a carboxylic acid or a phosphate group, a basic dispersant containing an amine group, and a salt type dispersant neutralized with an acid base.
  • heavy metal deactivator By using a heavy metal deactivator, even when metal ions are mixed as impurities, the conductivity is hardly inhibited.
  • heavy metal deactivators include acetylacetone, carboxybenzotriazole compounds, hindered phenol compounds, hydrazine compounds, thiocarbamate compounds, salicylic acid imidazoles and thiadiazole compounds.
  • a compound having a unit represented by the chemical formula (1) “hereinafter also referred to as“ compound A ”” is a preferred example.
  • the amount of compound A added is not limited within a range that does not depart from the spirit of the present invention, but the viscosity stability of the conductive resin composition described later, the temporal stability of the resistance value of the conductive sheet, and the adhesive strength of the electromagnetic shielding sheet
  • the content is preferably 0.1 parts by weight or more and 30 parts by weight or less with respect to 100 parts by weight of the conductive fine particles. From the viewpoint of improving the temporal stability, 0.5 parts by weight or more is more preferable. Moreover, from a viewpoint of cost reduction, 15 parts by weight or less is more preferable.
  • Compound A includes various compounds and is not particularly limited. Preferred examples include N-salicyloyl-N′-aldehyderazine, N, N-dibenzal (oxalhydrazide), and bis (2-phenoxypropionylhydrazine) isophthalic acid. ), 3- (N-salicyloyl) amino-1,2,4-hydroxyphenyl) propionyl] hydrazine, chemical formula (2) (decamethylene carboxylic acid disalicyloyl hydrazide) and chemical formula (3) (N, N'- Bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionyl] hydrazine) can be exemplified.
  • the compounds of chemical formula (2) and chemical formula (3) are more preferable.
  • a highly reliable conductive resin composition can be provided.
  • the timing of addition is not limited to the production of the conductive fine particles, and the timing of mixing the conductive fine particles and the resin after the production of the conductive fine particles and the conductive resin composition may be added after the production.
  • a production example of silver-coated copper powder As an example of the conductive fine particles, a production example of silver-coated copper powder will be described below.
  • a dendritic silver-coated copper powder obtained by silver plating of copper powder is prepared.
  • the silver-coated copper powder is charged into a sealed container together with a solid medium, the solid medium is collided with the silver-coated copper powder in the sealed container, and the dendritic silver-coated copper powder is transformed into the conductive fine particles of the present invention.
  • the conductive fine particles having the scale leaf or the branch leaf of the present invention are obtained.
  • a dendritic copper powder is prepared.
  • the copper powder is charged into a sealed container together with the solid medium, the solid medium is collided with the copper powder in the sealed container, and the dendritic copper powder is deformed like the conductive fine particles of the present invention.
  • the solid medium collides with the branch portion of the copper powder, copper powder having scale leaves or branched leaves is obtained.
  • the obtained finely divided copper powder having scale leaves or branched leaves is coated with silver by plating to obtain conductive fine particles having scale leaves or branched leaves of the present invention.
  • the conductive resin composition of the present invention contains the conductive fine particles of the present invention and a resin.
  • the conductive resin composition of the present invention may contain conductive fine particles other than the conductive fine particles of the present invention within a range not departing from the object of the present invention.
  • the conductive fine particles other than the conductive fine particles of the present invention are preferably, for example, about 3 parts by weight or less with respect to 100 parts by weight of the resin.
  • the resin used for the conductive resin composition can be a thermoplastic resin or a curable resin.
  • the curable resin is preferably a thermosetting resin or a photocurable resin.
  • thermoplastic resins polyolefin resins, vinyl resins, styrene / acrylic resins, diene resins, terpene resins, petroleum resins, cellulose resins, polyamide resins, polyurethane resins, polyester resins, polycarbonate resins, polyimide resins, A fluororesin etc. are mentioned.
  • the polyolefin resin is preferably a homopolymer or copolymer such as ethylene, propylene, and ⁇ -olefin compound. Specific examples include polyethylene ethylene propylene rubber, olefinic thermoplastic elastomer, ⁇ -olefin polymer, and the like.
  • the vinyl resin is preferably a polymer obtained by polymerization of vinyl ester such as vinyl acetate or a copolymer of vinyl ester and olefin compound such as ethylene. Specific examples include ethylene-vinyl acetate copolymer and partially saponified polyvinyl alcohol.
  • the styrene / acrylic resin is preferably a homopolymer or copolymer made of styrene, (meth) acrylonitrile, acrylamides, (meth) acrylic acid esters, maleimides, or the like. Specific examples include syndiotactic polystyrene, polyacrylonitrile, acrylic copolymer, ethylene-methyl methacrylate copolymer, and the like.
  • the diene resin is preferably a homopolymer or copolymer of a conjugated diene compound such as butadiene or isoprene and a hydrogenated product thereof. Specific examples include styrene-butadiene rubber and styrene-isoprene block copolymer.
  • the terpene resin is preferably a polymer composed of terpenes or a hydrogenated product thereof. Specific examples include terpene resins and hydrogenated terpene resins.
  • the petroleum resin is preferably a dicyclopentadiene type petroleum resin or a hydrogenated petroleum resin.
  • the cellulose resin is preferably a cellulose acetate butyrate resin.
  • the polycarbonate resin is preferably bisphenol A polycarbonate.
  • the polyimide resin is preferably a thermoplastic polyimide, a polyamideimide resin, or a polyamic acid type polyimide resin.
  • Thermosetting resins are functional groups that can be used for crosslinking reactions by heating, such as hydroxyl groups, phenolic hydroxyl groups, methoxymethyl groups, carboxyl groups, amino groups, epoxy groups, oxetanyl groups, oxazoline groups, oxazine groups, aziridine groups, thiols. Any resin having at least one group, isocyanate group, blocked isocyanate group, blocked carboxyl group, silanol group, etc.
  • thermosetting resin in the present invention may contain a so-called “curing agent” such as a resin or a low molecular compound that reacts with the above functional group to form a chemical crosslink as necessary. preferable.
  • the photocurable resin may be a resin having at least one unsaturated bond that causes a crosslinking reaction by light, for example, acrylic resin, maleic acid resin, polybutadiene resin, polyester resin, polyurethane resin, epoxy resin.
  • examples include resins, oxetane resins, phenoxy resins, polyimide resins, polyamide resins, phenolic resins, alkyd resins, amino resins, polylactic acid resins, oxazoline resins, benzoxazine resins, silicone resins, and fluorine resins.
  • the conductive resin composition preferably contains 50 to 500 parts by weight of conductive fine particles, more preferably 100 to 400 parts by weight with respect to 100 parts by weight of the resin. By blending 50 to 500 parts by weight of conductive fine particles, the conductivity is further improved and the conductive layer can be more easily formed.
  • the conductive resin composition includes, for example, the dispersant, the silane coupling agent, the rust preventive agent, the copper damage preventive agent in addition to the metal deactivator and the thickener described above. , Reducing agents, antioxidants, pigments, dyes, tackifying resins, plasticizers, ultraviolet absorbers, antifoaming agents, leveling regulators, fillers, flame retardants, and the like.
  • the production of the conductive resin composition can be obtained by charging the dendritic silver-coated powder and the resin simultaneously and colliding the solid medium before producing the conductive fine particles as described above. It can also be obtained by mixing with a resin after the production of conductive fine particles.
  • a method of adding the resin while stirring the dispersion with a disperse mat can be exemplified.
  • the conductive sheet of the present invention is provided with a conductive layer formed from the conductive resin composition of the present invention.
  • the manufacturing method of an electroconductive sheet is not specifically limited, As an example, the method of coating an electroconductive resin composition on a peelable sheet and forming an electroconductive layer can be illustrated.
  • the conductive sheet may be only a single layer of the conductive layer, but may be a laminate of other functional layers and support layers.
  • the functional layer has insulating properties, thermal conductivity, electromagnetic wave absorption properties, hard coat properties, water vapor barrier properties, oxygen barrier properties, low dielectric constant, high dielectric constant properties, low dielectric loss tangent, high dielectric loss tangent, heat resistance, etc. Layer.
  • a thermosetting resin is included from a heat resistant viewpoint.
  • the conductive sheet of the present invention can be used without limitation for various applications.
  • Preferred examples include an anisotropic conductive sheet, an electrostatic removal sheet, a ground connection sheet, a membrane circuit, a conductive bonding sheet, and a heat conduction.
  • conductive sheets and conductive sheets for jumper circuits are examples of conductive sheets and conductive sheets for jumper circuits.
  • Examples of the coating method include a gravure coating method, a kiss coating method, a die coating method, a lip coating method, a comma coating method, a blade method, a roll coating method, a knife coating method, a spray coating method, a bar coating method, a spin coating method, and a dip coating. Can use method etc.
  • the thickness of the conductive layer in the conductive sheet is preferably 1 to 100 ⁇ m, and more preferably 3 to 50 ⁇ m. When the thickness is in the range of 1 to 100 ⁇ m, it becomes easy to achieve both conductivity and other physical properties.
  • the electromagnetic wave shield sheet of the present invention comprises a conductive layer formed from the conductive resin composition of the present invention and an insulating layer, and is intended to shield electromagnetic waves generated from a circuit, for example.
  • an electromagnetic wave shield sheet is not specifically limited, As an example, the method of bonding the electrically conductive layer manufactured by the above-mentioned method and an insulating layer can be illustrated.
  • the insulating layer a pre-formed insulating film may be used, or the insulating layer is formed by applying an insulating resin composition to the peelable sheet, and this is attached to the conductive layer with the peelable sheet. You may combine them.
  • the insulating layer may be formed by coating the insulating resin composition directly on the conductive layer.
  • the thickness of the insulating layer may vary depending on applications and needs. For example, when used for a flexible printed wiring board, the thickness is 2 to 10 ⁇ m from the viewpoint of enhancing the shielding effect of the electromagnetic wave shielding sheet while maintaining flexibility. It is preferable.
  • the thickness of the insulating layer is preferably 50 to 200 when the thickness of the conductive layer is 100. It becomes easy to balance various physical properties by becoming the said ratio.
  • the material of the insulating film is not particularly limited, but a plastic film such as polyester, polycarbonate, polyimide, polyphenylene sulfide can also be used. Moreover, the film which shape
  • the insulating resin composition contains a resin as an essential component, and it is preferable to use a resin that can be used for the conductive layer.
  • the insulating resin composition includes a silane coupling agent, an antioxidant, a pigment, a dye, a dispersant, a tackifier resin, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling regulator, and a filling agent.
  • An agent, a flame retardant, etc. can be mix
  • the electromagnetic wave shielding sheet of the present invention can include other layers in addition to the conductive layer and the insulating layer.
  • Other layers include, for example, hard coat properties, thermal conductivity, heat insulation properties, electromagnetic wave absorption properties, water vapor barrier properties, oxygen barrier properties, low dielectric constant, high dielectric constant, low dielectric loss tangent, high dielectric loss tangent, heat resistance, etc. The layer which has is mentioned.
  • a thermosetting resin is included from a heat resistant viewpoint.
  • the electromagnetic wave shielding sheet of the present invention can be used as an electromagnetic wave shielding layer by being attached to a flexible printed circuit board, a rigid printed circuit board, a rigid flexible substrate, etc. and thermocompression bonded. It can also be used by directly pasting the electronic component housing.
  • the printed wiring board incorporating the electromagnetic wave shielding sheet of the present invention is, for example, a mobile phone such as a smartphone, a personal computer, a tablet terminal, LED lighting, organic EL lighting, liquid crystal television, organic EL television, digital camera, digital video camera, automobile, etc. It can be used for automotive parts.
  • Table 1 shows non-leaf-like conductive fine particles used as a raw material.
  • the dendritic silver-coated copper powder of the conductive fine particles 1 to 7 a product manufactured by Mitsui Mining & Smelting Co., Ltd. was used. Further, as the dendritic copper powder of the conductive fine particles 8, the spherical silver-coated copper powder of the conductive fine particles 9, and the scaly silver powder of the conductive fine particles 11, products made by Fukuda Metal Foil Powder Industry Co., Ltd. were used. Moreover, the product made from Mitsui Metal Mining Co., Ltd. was used for the scale-like silver coat copper powder of the electroconductive fine particles 10.
  • FIG. The average particle diameter (D50) of the conductive fine particles as a raw material was determined with a laser diffraction / scattering particle size distribution analyzer LS-13-320 (manufactured by Beckman Coulter).
  • Example A (Production of conductive fine particles)> 100 parts of non-leaf-like conductive fine particles 1 shown in Table 1, 400.0 parts of toluene, 10.0 parts of thickener (AEROSIL R972 manufactured by Nippon Aerosil Co., Ltd.), and heavy metal deactivator (decamethylene carboxylic acid) 1.0 parts of disalicyloyl hydrazide) was weighed and mixed and stirred so as to be uniform. Next, this was introduced into an Eiger mill (“Mini Model M-250 MKII” manufactured by Eiger Japan) together with zirconia beads having a diameter of 0.5 mm, followed by dispersion treatment for 10 minutes.
  • Eiger mill Mini Model M-250 MKII” manufactured by Eiger Japan
  • the obtained fine particles were decanted with methyl ethyl ketone five times. Furthermore, the leaf-like electroconductive fine particle of Example A was obtained by drying in 100 degreeC oven. The average particle diameter (D50), thickness, circularity degree coefficient, and circular coefficient of the leaf-like conductive fine particles according to Example A were measured. The average particle diameter (D50) and thickness were determined by the method described above. In addition, the circularity coefficient and the circular coefficient were calculated by the method described above after preparing a sample by the following method. Table 2 shows values of the thickness, average particle diameter (D50), circularity coefficient, circular coefficient, and coverage of the obtained leaf-shaped conductive fine particles.
  • a sample using corresponding conductive fine particles was prepared by a method for producing an electromagnetic wave shielding sheet described later. And the sample of 1 cm ⁇ 2 > was fixed to the column-shaped sample stand for SEM through the electrically conductive adhesive. Specifically, the separator on the conductive layer side of the electromagnetic wave shield sheet was peeled off and fixed to the sample stage so that the conductive layer was the upper layer and the insulating layer was the lower layer. And the electrically conductive paste was apply
  • Example 2 ⁇ Examples B to K, Comparative Example ⁇ (Production of conductive fine particles)> Conductive fine particles were produced in the same manner as in Example A, except that the raw material of non-leaf conductive fine particles and the dispersion treatment time using Eiger mill were changed as described in Table 2.
  • Example 1 ⁇ Examples 1 to 20, Comparative Examples 1 to 4, Reference Example 1 (Production of Conductive Resin Composition)> The raw materials shown in Table 3 were charged into a container and stirred for 5 minutes with a disper to obtain conductive resin compositions of Examples 1 to 20, Comparative Examples 1 to 4, and Reference Example 1.
  • the base resin urethane is polyurethane resin (Toyochem)
  • amide is polyamideimide resin (Toyochem)
  • polyester is condensed polyester (Toyochem) and addition polyester (Toyochem).
  • a curing agent aziridine compound
  • Example 1 ⁇ Manufacture of the electroconductive sheet of Example 1>
  • the conductive resin composition of Example 1 was coated on a polyethylene terephthalate peelable sheet using a bar coater so that the dry thickness was 5 ⁇ m, and dried in an electric oven at 100 ° C. for 2 minutes to form a conductive layer.
  • thermosetting urethane resin manufactured by Toyochem Co., Ltd.
  • a bar coater to a dry thickness of 5 ⁇ m, and then dried in an electric oven at 100 ° C. for 2 minutes for insulation.
  • a layer was obtained.
  • the conductive layer of the conductive sheet C1 and the insulating layer were overlapped, and an electromagnetic wave shield sheet E1 was obtained by thermocompression bonding under conditions of 80 ° C. and 2 MPa.
  • Conductive sheets C2 to C20 were obtained in the same manner as in Example 1, except that the conductive resin compositions of Examples 2 to 20 were used instead of the conductive resin composition of Example 1. Further, the conductive sheets C21 to C25 were prepared in the same manner as in Example 1 except that the conductive resin compositions of Comparative Examples 1 to 4 and Reference Example 1 were used instead of the conductive resin composition of Example 1. Obtained.
  • Electromagnetic wave shield sheets E2 to E25 were obtained in the same manner as in Example 1 except that the conductive sheet described in Table 4 was used instead of the conductive sheet 1. Electromagnetic wave shield sheets E2 to E20 were obtained in the same manner as in Example 1, except that the conductive resin compositions of Examples 2 to 20 were used instead of the conductive resin composition of Example 1. Further, the electromagnetic wave shielding sheets E21 to E25 were prepared in the same manner as in Example 1 except that the conductive resin compositions of Comparative Examples 1 to 4 and Reference Example 1 were used instead of the conductive resin composition of Example 1. Obtained.
  • connection resistance Prepare conductive sheet 10 cut to 25mm length and 25mm width, and fix it to the end of stainless steel plate 11 with width 25mm, length 100mm, thickness 0.5mm, and temporarily press bonded under conditions of 80 ° C and 2MPa. did. Thereafter, the peelable sheet was peeled off, and the stainless steel plates 12 having the same size were stacked in the same manner as described above, and then temporarily bonded by thermocompression bonding under the conditions of 80 ° C. and 2 MPa. This was thermocompression bonded for 30 minutes under the conditions of 150 ° C. and 2 MPa to obtain a test piece for connection resistance measurement shown in FIG.
  • connection resistance value is measured by bringing the BSP probe of “Lorester GP” manufactured by Mitsubishi Chemical Analytech into contact with the B side of the stainless steel plate 11 and the A side of the stainless steel plate 12 as shown in FIG. did.
  • the evaluation criteria are as follows. A: Less than 1.0 ⁇ 10 ⁇ 3 B: 1.0 ⁇ 10 ⁇ 3 or more, less than 1.0 ⁇ 10 ⁇ 2 C: 1.0 ⁇ 10 ⁇ 2 or more, less than 1.0 ⁇ 10 ⁇ 1 D: 1.0 ⁇ 10 -1 or more
  • the surface resistance value of the conductive layer of the obtained electromagnetic wave shielding sheet was measured using a four-point probe of “Loresta GP” manufactured by Mitsubishi Chemical Analytech.
  • the evaluation criteria are as follows. A: Less than 1.0 B: 1.0 or more and less than 10.0 C: 10.0 or more and less than 50.0 D: 50.0 or more
  • the surface resistance value of the insulating layer of the electromagnetic wave shielding sheet was measured using a ring probe URS of “HIRESTA UP” manufactured by Mitsubishi Chemical Analytech.
  • the evaluation criteria are as follows. A: 1 ⁇ 10 7 or more B: less than 1 ⁇ 10 7 1 ⁇ 10 6 or more C: less than 1 ⁇ 10 6 1 ⁇ 10 4 or more D: less than 1 ⁇ 10 4
  • An electromagnetic wave shielding sheet having a width of 25 mm and a length of 70 mm was prepared.
  • the polyimide film (“Kapton 200EN” manufactured by Toray DuPont Co., Ltd.) having a thickness of 50 ⁇ m on the exposed conductive layer under the conditions of 150 ° C., 1.0 MPa, and 30 min.
  • the conductive layer and the insulating layer were cured.
  • the release film that contacts the 50 ⁇ m-thick insulating layer is removed, and the exposed insulating layer is a polyimide film using an adhesive sheet using a polyurethane polyurea adhesive.
  • Appendix The present specification also discloses the invention of the technical idea shown below, which is grasped from the above-described embodiment.
  • Appendix 1 A leaf-shaped conductive fine particle having a plurality of scale leaves or branched leaves, which is formed by coating a conductive core with a conductive substance different from the core.
  • (Appendix 2) A step in which a solid medium collides with a dendritic fine particle coated with silver on a conductive core, whereby the dendritic conductive fine particle is deformed to obtain a plurality of leaf-like fine particles having scale leaves or branch leaves
  • a method for producing leaf-shaped conductive fine particles comprising: (Appendix 3) Conductive fine particles having a circularity coefficient determined from the following mathematical formula (1) of 0.15 or more and 0.4 or less, and at least one of notches and branched leaves is formed in the outer edge shape.
  • the conductive fine particles of the present invention can be used for various applications as a filler that requires conductive properties.
  • the conductive resin composition containing the conductive fine particles of the present invention and a resin can be used for various applications.
  • a conductive layer can be formed from a conductive resin composition and used as a conductive sheet or an electromagnetic wave shielding sheet.
  • the conductive sheet can be used for the purpose of electrical connection between circuits, for example.
  • the conductive sheet and electromagnetic wave shield sheet of the present invention are suitable for, for example, a flexible printed wiring board that is repeatedly bent, a rigid printed wiring board, a metal plate, a flexible connector, and the like.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

L'invention concerne de fines particules conductrices qui sont capables de réduire les coûts, ont d'excellentes propriétés conductrices, et peuvent être rendues minces lorsque, par exemple, une composition mélangée avec de la résine est formée en forme de feuille. Les fines particules conductrices selon la présente invention sont formées d'un corps nucléaire comprenant un matériau conducteur, et d'une couche de recouvrement constituée d'un autre matériau conducteur qui recouvre le corps nucléaire, dont au moins une partie forme la couche la plus à l'extérieur. Un coefficient de diamètre de cercle obtenu à partir de la formule suivante (1) est compris entre 0,15 et 0,4, et au moins une découpe qui a une forme de bord extérieur et une feuille de ramification est prévue en plusieurs exemplaires. [Formule 1] coefficient de diamètre du cercle = (surface × 4π ) / ( périmètre ) 2 ⋅ ⋅ ⋅ Formule (1)
PCT/JP2013/001351 2012-03-06 2013-03-05 Particules fines conductrices, procédé de fabrication associé, composition de résine conductrice, feuille conductrice, et feuille de blindage électromagnétique WO2013132831A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020147023849A KR102017121B1 (ko) 2012-03-06 2013-03-05 도전성 미립자 및 그 제조 방법, 도전성 수지 조성물, 도전성 시트 및 전자파 차폐 시트
CN201380012622.XA CN104170023B (zh) 2012-03-06 2013-03-05 导电性微粒及其制造方法、导电性树脂组成物、导电性薄片、以及电磁波屏蔽薄片

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012049680 2012-03-06
JP2012-049680 2012-03-06

Publications (1)

Publication Number Publication Date
WO2013132831A1 true WO2013132831A1 (fr) 2013-09-12

Family

ID=49116326

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/001351 WO2013132831A1 (fr) 2012-03-06 2013-03-05 Particules fines conductrices, procédé de fabrication associé, composition de résine conductrice, feuille conductrice, et feuille de blindage électromagnétique

Country Status (5)

Country Link
JP (2) JP6264731B2 (fr)
KR (1) KR102017121B1 (fr)
CN (2) CN104170023B (fr)
TW (2) TWI546823B (fr)
WO (1) WO2013132831A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015065342A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、及び、電子機器
JP2015065343A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法
CN105917427A (zh) * 2013-11-25 2016-08-31 智能启动科技有限公司 电气系统增强器
KR20180006872A (ko) 2015-05-20 2018-01-19 세키스이가가쿠 고교가부시키가이샤 도전성 점착재 및 도전성 기재 부착 도전성 점착재
US20180154436A1 (en) * 2015-05-15 2018-06-07 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder
EP3275571A4 (fr) * 2015-03-26 2018-11-21 Sumitomo Metal Mining Co., Ltd. Poudre de cuivre revêtue d'argent, et pâte conductrice, matériau conducteur et feuille conductrice la comprenant
US10695830B2 (en) 2015-05-15 2020-06-30 Sumitomo Metal Mining Co., Ltd. Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105960683A (zh) * 2014-02-12 2016-09-21 东丽株式会社 导电糊剂、图案的制造方法、导电图案的制造方法和传感器
JP6466758B2 (ja) * 2014-07-31 2019-02-06 Ｄｏｗａエレクトロニクス株式会社 銀被覆フレーク状銅粉およびその製造方法、並びに当該銀被覆フレーク状銅粉を用いた導電性ペースト
JP6406359B2 (ja) * 2015-01-14 2018-10-17 東洋紡株式会社 導電性布帛
JP6332125B2 (ja) * 2015-04-17 2018-05-30 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
JP5871098B1 (ja) * 2015-07-16 2016-03-01 東洋インキＳｃホールディングス株式会社 導電性接着剤層、導電性接着シートおよびプリント配線板
WO2017026130A1 (fr) * 2015-08-07 2017-02-16 太陽インキ製造株式会社 Composition conductrice, conducteur et base
WO2017035103A1 (fr) * 2015-08-25 2017-03-02 Plant Pv, Inc Particules à noyau-enveloppe, résistant à l'oxydation pour des applications conductrices à basse température
KR102517052B1 (ko) * 2017-07-07 2023-03-31 타츠타 전선 주식회사 도전성 수지 조성물 및 그것을 사용한 차폐 패키지의 제조 방법
KR102113732B1 (ko) * 2019-03-21 2020-05-21 주식회사 아이에스시 도전성 분말 및 이를 포함하는 검사용 커넥터
JP7236326B2 (ja) * 2019-05-30 2023-03-09 東洋紡株式会社 電子部品の封止体、及び電子部品の封止体の製造方法
CN111462935A (zh) * 2020-05-12 2020-07-28 无锡市伍豪机械设备有限公司 导电性颗粒及其制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11152505A (ja) * 1997-11-18 1999-06-08 Sumitomo Metal Mining Co Ltd 扁平な形状のニッケル粉末およびその製造方法
JP2003257245A (ja) * 2002-03-06 2003-09-12 Dowa Mining Co Ltd 箔片状銅粉およびこれを用いた導電ペースト
JP2004149903A (ja) * 2002-11-01 2004-05-27 Kaken Tec Kk 導電粉、導電性組成物、および導電粉の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000133050A (ja) * 1998-10-27 2000-05-12 Sekisui Chem Co Ltd 異方性導電膜及び導電接続構造体
JP4864195B2 (ja) 2000-08-30 2012-02-01 三井金属鉱業株式会社 被覆銅粉
US6663799B2 (en) * 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
JP4779134B2 (ja) * 2001-02-13 2011-09-28 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用の導電フイラーおよびその製法
JP4183924B2 (ja) * 2001-03-30 2008-11-19 日揮触媒化成株式会社 金属微粒子および該微粒子の製造方法、該微粒子を含む透明導電性被膜形成用塗布液、透明導電性被膜付基材、表示装置
KR100694529B1 (ko) * 2002-03-25 2007-03-13 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 전기전도성 입자 및 접착제
JP4178374B2 (ja) * 2002-08-08 2008-11-12 三井金属鉱業株式会社 銀コートフレーク銅粉及びその銀コートフレーク銅粉の製造方法並びにその銀コートフレーク銅粉を用いた導電性ペースト
JP4724369B2 (ja) * 2003-09-29 2011-07-13 ソニーケミカル＆インフォメーションデバイス株式会社 導電粒子の製造方法
JP4583147B2 (ja) * 2004-11-19 2010-11-17 三井金属鉱業株式会社 導電性複合粉末及びその製造方法
JP4613362B2 (ja) * 2005-01-31 2011-01-19 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用金属粉および導電ペースト
CN100588453C (zh) * 2006-05-24 2010-02-10 比亚迪股份有限公司 一种球形镍粉前驱体以及球形镍粉的制备方法
JP4922793B2 (ja) * 2007-03-09 2012-04-25 アルファーサイエンティフィック株式会社 混合導電粉及びその製造方法並びに導電ペースト及びその製造方法
CN101041430A (zh) * 2007-04-23 2007-09-26 华东理工大学 一种球状炭气凝胶的制备方法
JP4936142B2 (ja) 2008-03-21 2012-05-23 福田金属箔粉工業株式会社 導電性ペースト組成物及び電子回路並びに電子部品
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
JP5521207B2 (ja) * 2009-01-28 2014-06-11 東ソー株式会社 導電膜形成用組成物及びその製造方法、並びに導電膜の形成方法
TW201121405A (en) 2009-09-18 2011-06-16 Toyo Ink Mfg Co Electro-magnetic wave shielding film and wiring board
TWI443458B (zh) * 2010-04-21 2014-07-01 Toyo Ink Sc Holdings Co Ltd 彩色濾光片用紅色著色組成物及彩色濾光片

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11152505A (ja) * 1997-11-18 1999-06-08 Sumitomo Metal Mining Co Ltd 扁平な形状のニッケル粉末およびその製造方法
JP2003257245A (ja) * 2002-03-06 2003-09-12 Dowa Mining Co Ltd 箔片状銅粉およびこれを用いた導電ペースト
JP2004149903A (ja) * 2002-11-01 2004-05-27 Kaken Tec Kk 導電粉、導電性組成物、および導電粉の製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015065342A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、及び、電子機器
JP2015065343A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法
CN105917427A (zh) * 2013-11-25 2016-08-31 智能启动科技有限公司 电气系统增强器
CN105917427B (zh) * 2013-11-25 2020-09-22 智能启动科技有限公司 电气系统增强器
EP3275571A4 (fr) * 2015-03-26 2018-11-21 Sumitomo Metal Mining Co., Ltd. Poudre de cuivre revêtue d'argent, et pâte conductrice, matériau conducteur et feuille conductrice la comprenant
US20180154436A1 (en) * 2015-05-15 2018-06-07 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder
EP3296042A4 (fr) * 2015-05-15 2019-01-16 Sumitomo Metal Mining Co., Ltd. Poudre de cuivre enrobée d'argent, pâte de cuivre la mettant en uvre, matériau de revêtement conducteur, feuille conductrice, et procédé de fabrication d'une poudre de cuivre enrobée d'argent
US10654101B2 (en) 2015-05-15 2020-05-19 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder
US10695830B2 (en) 2015-05-15 2020-06-30 Sumitomo Metal Mining Co., Ltd. Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder
KR20180006872A (ko) 2015-05-20 2018-01-19 세키스이가가쿠 고교가부시키가이샤 도전성 점착재 및 도전성 기재 부착 도전성 점착재

Also Published As

Publication number Publication date
JP6410064B2 (ja) 2018-10-24
JP6264731B2 (ja) 2018-01-24
TWI546823B (zh) 2016-08-21
TWI600033B (zh) 2017-09-21
KR20140138136A (ko) 2014-12-03
TW201344703A (zh) 2013-11-01
JP2018067531A (ja) 2018-04-26
CN104170023A (zh) 2014-11-26
CN106424711B (zh) 2019-02-15
JP2013214508A (ja) 2013-10-17
CN104170023B (zh) 2016-12-28
TW201705156A (zh) 2017-02-01
KR102017121B1 (ko) 2019-09-02
CN106424711A (zh) 2017-02-22

Similar Documents

Publication Publication Date Title
JP6410064B2 (ja) 導電性微粒子および導電性シート
JP5796690B1 (ja) 電磁波シールドシートおよびプリント配線板
JP6255816B2 (ja) 電磁波シールドシートおよびプリント配線板
JP6287430B2 (ja) 導電性接着シート、電磁波シールドシートおよびプリント配線板
JP6597927B1 (ja) 電磁波シールドシート、および電磁波シールド性配線回路基板
JP2016222748A (ja) 導電性接着剤、ならびにそれを用いた導電性接着シートおよび電磁波シールドシート
JP2012231021A (ja) Ｆｐｃ用電磁波シールド材
WO2019239710A1 (fr) Feuille de protection contre les ondes électromagnétiques
JP2016115725A (ja) 電磁波シールドシートおよびプリント配線板
JP2018129498A (ja) 電子部品搭載基板、積層体、電磁波遮蔽シートおよび電子機器
JP2017193717A (ja) 導電性樹脂組成物、導電性接着シート、電磁波シールドシート及びプリント配線板
JP6098688B1 (ja) 電磁波シールドシートおよびプリント配線板
JP6624331B1 (ja) 電磁波シールドシート、および電磁波シールド性配線回路基板
JP2015192073A (ja) 電磁波シールドフィルム、シールドプリント配線板及び電磁波シールドフィルムの製造方法
WO2020071356A1 (fr) Feuille de blindage électromagnétique et substrat de montage de composants électroniques
JP6566008B2 (ja) 電磁波シールドシートおよびプリント配線板
JP2020178118A (ja) ノイズ抑制層形成用シート状前駆体、ノイズ抑制シート、およびノイズを抑制する方法
TW201922999A (zh) 導電性接著劑
JP6645610B1 (ja) 電磁波シールドシート、および電磁波シールド性配線回路基板
JP6516108B2 (ja) 真空成形用電磁波シールド積層体、およびこれを用いた電磁波シールド成形体
JP2020057759A (ja) 電磁波シールドシート、および電子部品搭載基板
JP6451879B2 (ja) 導電性接着シート、電磁波シールドシートおよびプリント配線板
JP2022124461A (ja) 電磁波シールドフィルム、及び電磁波シールドフィルム付きプリント配線板
JP2019041132A (ja) 導電性樹脂組成物、導電性接着シート、電磁波シールドシートおよびプリント配線板
CN114945268A (zh) 电磁波屏蔽膜和带电磁波屏蔽膜印刷布线板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13757565

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20147023849

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13757565

Country of ref document: EP

Kind code of ref document: A1