WO2013088968A1 - 絶縁電線 - Google Patents
絶縁電線 Download PDFInfo
- Publication number
- WO2013088968A1 WO2013088968A1 PCT/JP2012/080931 JP2012080931W WO2013088968A1 WO 2013088968 A1 WO2013088968 A1 WO 2013088968A1 JP 2012080931 W JP2012080931 W JP 2012080931W WO 2013088968 A1 WO2013088968 A1 WO 2013088968A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluororesin
- resin
- insulating layer
- insulated wire
- conductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/18—Homopolymers or copolymers of tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/307—Other macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group
- C08G2650/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2927—Rod, strand, filament or fiber including structurally defined particulate matter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
Definitions
- the present invention relates to an insulated wire.
- Electric wires used in automobiles and robots, and coil windings used in motors are required to have excellent insulation and a strong bond between the conductor and the insulating layer covering the conductor. . Also, in recent years, the trend toward higher voltages and higher currents has accelerated, and electric wires and coils having an insulating layer with a low dielectric constant are required in order to prevent deterioration of the insulating layer due to partial discharge. Furthermore, high heat resistance is required for windings for motor coils mounted on automobiles.
- Patent Document 1 an insulated wire provided with a thin insulating coating layer having a film thickness of 0.2 mm or less made of a resin mixture of polyether ether ketone resin 90 to 50% by weight and polyetherimide resin 10 to 50% by weight. has been proposed.
- Patent Document 2 proposes a resin-coated wire / cable in which a fluororesin layer is formed between a conductor and a polyether ether ketone resin coating layer in a wire / cable obtained by extrusion-coating a polyether ether ketone resin on a conductor. Has been.
- Patent Document 3 a mixed resin of at least one resin selected from polyamideimide resin, polyimide resin, polyesterimide resin and H-type polyester resin and at least one resin selected from fluororesin and polysulfone resin is applied.
- An insulated wire having an insulating layer formed by baking has been proposed.
- Patent Document 4 a first coating layer in which a resin composition obtained by graft polymerization of an ethylene-tetrafluoroethylene copolymer with a grafting compound is formed immediately above a conductor, a polyphenylene sulfide resin, a polyamide resin, There has been proposed an insulated wire having a second coating layer in which a resin composition, which is a polymer alloy composed of the above, is formed immediately above the first coating layer.
- patent document 5 it consists of a polymer alloy which mix
- Patent Document 6 proposes an insulated wire having a resin layer formed by applying and baking a resin in which polyamideimide or polyesterimide and polyphenylene ether are mixed in a ratio (mass ratio) of 60:40 to 95: 5. Has been.
- Patent Document 7 describes a resin composition containing a polyaryl ketone resin and a fluororesin as a resin composition for the purpose of producing a molded body such as a film or a sheet.
- An object of this invention is to provide the insulated wire which has the insulating layer which is excellent in insulation and has a low dielectric constant.
- the present inventors diligently studied an insulated wire having excellent insulation properties and a low dielectric constant, and paid attention to the material of the insulating layer formed on the outer periphery of the conductor. As a result, aromatic polyetherketone resin and specific fluorine were used. Since the insulating layer made of resin has excellent insulating properties and exhibits a low dielectric constant, it has been found that the insulating layer is particularly suitable as an insulating layer of an insulated wire, and the present invention has been completed.
- this invention is an insulated wire which has a conductor (A) and the insulating layer (B) formed in the outer periphery of the said conductor (A), Comprising:
- An insulating layer (B) is aromatic polyetherketone resin.
- CF 2 CF-Rf 1 (1) (Wherein Rf 1 represents —CF 3 or —ORf 2 ; Rf 2 represents a perfluoroalkyl group having 1 to 5 carbon atoms)
- An insulated wire characterized in that the melt viscosity ratio (I) / (II) of the aromatic polyetherketone resin (I) and the fluororesin (II) is 0.3 to 5.0. .
- the fluororesin (II) is dispersed in the form of particles in the aromatic polyetherketone resin (I), and the average dispersed particle size of the fluororesin (II) is 0.5 ⁇ m or less. Is preferred.
- the fluororesin (II) is dispersed in the form of particles in the aromatic polyetherketone resin (I), and the maximum dispersed particle size of the fluororesin (II) is 1.0 ⁇ m or less. Is preferred.
- the mass ratio (I) :( II) of the aromatic polyether ketone resin (I) to the fluororesin (II) is preferably 95: 5 to 50:50.
- the fluororesin (II) preferably has a melt flow rate of 0.1 to 100 g / 10 min.
- the aromatic polyether ketone resin (I) is preferably a polyether ether ketone.
- the insulating layer (B) Since the insulated wire of the present invention has the above-described configuration, the insulating layer (B) has excellent insulating properties and exhibits a low dielectric constant.
- the insulated wire of the present invention is formed of a conductor (A) and a resin composition formed on the outer periphery of the conductor (A) and containing an aromatic polyetherketone resin (I) and a specific fluororesin (II). And an insulating layer (B).
- the insulated wire of this invention shows a low dielectric constant while the insulating layer (B) has the outstanding insulation.
- an insulating layer (B) is formed from the resin composition containing the said aromatic polyether ketone resin (I) and the said fluororesin (II), it is excellent in heat resistance. Furthermore, it is excellent in mechanical strength and tensile elongation.
- the insulating layer (B) is excellent in crack resistance, and the insulated wire of the present invention can be suitably used for thin wires having a thin insulating layer (B).
- the insulating layer (B) formed on the outer periphery of the conductor (A) may be in contact with the conductor (A), or another layer, for example, another resin layer may be interposed between the conductor (A). It may be formed via.
- the insulating layer (B) is preferably in contact with the conductor (A), and in that case, an insulated wire in which the adhesion between the conductor (A) and the insulating layer (B) is strong can be obtained.
- the aromatic polyether ketone resin (I) is preferably at least one resin selected from the group consisting of polyether ketone, polyether ether ketone, polyether ketone ketone and polyether ketone ether ketone ketone. More preferred is at least one resin selected from the group consisting of polyetherketone and polyetheretherketone, and even more preferred is polyetheretherketone.
- the aromatic polyether ketone resin (I) preferably has a melt viscosity of 0.25 to 1.50 kNsm ⁇ 2 at 60 sec ⁇ 1 and 390 ° C. When the melt viscosity is in the above range, the molding characteristics of the insulated wire of the present invention are improved. A more preferred lower limit for the melt viscosity is 0.80 kNsm -2 . The upper limit of the melt viscosity is more preferably 1.30 kNsm -2. The melt viscosity of the aromatic polyetherketone resin (I) is measured according to ASTM D3835.
- the aromatic polyether ketone resin (I) preferably has a glass transition temperature of 130 ° C. or higher. More preferably, it is 135 degreeC or more, More preferably, it is 140 degreeC or more. When the glass transition temperature is within the above range, the heat resistance of the obtained insulating layer (B) can be improved.
- the glass transition temperature is measured by a differential scanning calorimetry (DSC) apparatus.
- the aromatic polyether ketone resin (I) preferably has a melting point of 300 ° C. or higher. More preferably, it is 320 degreeC or more. When the melting point is in the above range, the heat resistance of the obtained insulating layer (B) can be improved. The melting point is measured by a differential scanning calorimetry (DSC) apparatus.
- DSC differential scanning calorimetry
- the fluororesin (II) is efficiently dispersed with respect to the aromatic polyetherketone resin (I), and the insulating layer (B) in the insulated wire of the present invention is more excellent. In addition to showing mechanical properties, it has excellent insulating properties and a low dielectric constant. Furthermore, the adhesion between the insulating layer (B) and the conductor (A) becomes stronger.
- Rf 1 is —ORf 2
- Rf 2 is preferably a perfluoroalkyl group having 1 to 3 carbon atoms.
- the perfluoroethylenically unsaturated compound represented by the general formula (1) is selected from the group consisting of hexafluoropropylene, perfluoro (methyl vinyl ether), perfluoro (ethyl vinyl ether) and perfluoro (propyl vinyl ether). It is preferably at least one, and more preferably at least one selected from the group consisting of hexafluoropropylene and perfluoro (propyl vinyl ether).
- the fluororesin (II) is preferably composed of 80 to 99 mol% of TFE and 1 to 20 mol% of a perfluoroethylenically unsaturated compound represented by the general formula (1).
- the lower limit of the content of TFE constituting the fluororesin (II) is more preferably 85 mol%, further preferably 87 mol%, particularly preferably 90 mol%, and particularly preferably 93 mol%.
- the upper limit of the content of TFE constituting the fluororesin (II) is more preferably 97 mol%, still more preferably 95 mol%.
- the lower limit of the content of the perfluoroethylenically unsaturated compound represented by the general formula (1) constituting the fluororesin (II) is more preferably 3 mol%, further preferably 5 mol%.
- the upper limit of the content of the perfluoroethylenically unsaturated compound represented by the general formula (1) constituting the fluororesin (II) is more preferably 15 mol%, further preferably 13 mol%, and more preferably 10 mol%. Is particularly preferred, with 7 mol% being even more preferred.
- the fluororesin (II) preferably has a melt flow rate (MFR) measured under conditions of 372 ° C. and a load of 5000 g of 0.1 to 100 g / 10 minutes, preferably 10 to 40 g / 10 minutes. More preferred.
- MFR melt flow rate
- the processing characteristics of the insulating layer (B) of the present invention are improved. Further, the insulating layer (B) and the conductor (A) are more firmly bonded.
- the more preferable lower limit of MFR is 12 g / 10 minutes, and the particularly preferable lower limit is 15 g / 10 minutes.
- the more preferable upper limit of MFR is 38 g / 10 minutes, and the particularly preferable upper limit is 35 g / 10 minutes.
- the MFR of the fluororesin (II) is measured using a melt indexer according to ASTM D3307-01.
- the melting point of the fluororesin (II) is not particularly limited, but it is preferable in molding that the fluororesin (II) is already melted at a temperature at which the aromatic polyetherketone resin (I) used in molding is melted.
- the temperature is preferably not higher than the melting point of the aromatic polyether ketone resin (I).
- the melting point of the fluororesin (II) is preferably 230 to 350 ° C.
- the melting point of the fluororesin (II) is determined as a temperature corresponding to the maximum value in the heat of fusion curve when the temperature is raised at a rate of 10 ° C./min using a differential scanning calorimetry (DSC) apparatus.
- DSC differential scanning calorimetry
- the fluororesin (II) preferably has a melt viscosity of 0.3 to 3.0 kNsm -2 at 60 sec -1 and 390 ° C.
- the melt viscosity is in the above range, the molding characteristics of the insulated wire of the present invention are improved.
- a more preferable lower limit of the melt viscosity is 0.4 kNsm -2 .
- a more preferable upper limit of the melt viscosity is 2.0 kNsm- 2 .
- the melt viscosity of the fluororesin (II) is measured according to ASTM D3835.
- the fluororesin (II) may be treated with fluorine gas by a known method or may be treated with ammonia.
- the mass ratio (I) :( II) of the aromatic polyether ketone resin (I) to the fluororesin (II) is preferably 95: 5 to 50:50.
- the insulating layer (B) has excellent insulating properties and heat resistance, and exhibits a low dielectric constant. Further, the insulating layer (B) and the conductor (A) are firmly bonded. If the fluororesin (II) content exceeds 50 by mass with the aromatic polyetherketone resin (I), the adhesive strength and heat resistance between the insulating layer (B) and the conductor (A) tend to be inferior. If it is less than 5, the dielectric constant may increase.
- a more preferred range is 90:10 to 60:40.
- the fluororesin (II) is dispersed in the form of particles in the aromatic polyetherketone resin (I), and the average dispersed particle size of the fluororesin (II) is 0.5 ⁇ m or less. Is preferred. Moreover, it is also preferable that it is less than 0.5 micrometer.
- the fluororesin dispersed in the aromatic polyetherketone resin (I) is dispersed with an average dispersed particle diameter in the above range, the mechanical properties of the insulating layer (B) and the conductor (A) and the insulating layer (B) And the adhesive strength is greatly improved. If the average dispersed particle size is too large, the mechanical properties are lowered, and the adhesive strength with the conductor (A) may be inferior.
- the lower limit is not particularly limited, but may be 0.01 ⁇ m.
- the average dispersed particle size of the fluororesin (II) is more preferably 0.3 ⁇ m or less.
- the average dispersed particle size is more preferably 0.2 ⁇ m or less.
- the maximum dispersed particle size of the fluororesin (II) is preferably 1.0 ⁇ m or less, and more preferably 0.8 ⁇ m or less. When the maximum dispersed particle size is in the above range, it is possible to produce an insulating layer (B) with less fish eyes. When the fluororesin dispersed in the aromatic polyetherketone resin (I) is dispersed with a particle size smaller than the maximum dispersed particle size described above, the processability of the insulating layer (B) becomes excellent, and the mechanical properties are increased. The physical properties and the adhesive strength between the conductor (A) and the insulating layer (B) are greatly improved.
- the average dispersed particle size and the maximum dispersed particle size of the fluororesin (II) are obtained by observing the insulating layer (B) of the present invention with a confocal laser microscope or observing with a transmission electron microscope (TEM). In other words, the obtained image can be obtained by binarizing with an optical analyzer.
- Insulating layer (B) preferably has a melt viscosity ratio (I) / (II) of aromatic polyether ketone resin (I) and fluororesin (II) of 0.3 to 5.0.
- the melt viscosity ratio is in the above range, the fluororesin (II) is effectively dispersed in the aromatic polyetherketone resin (I), and as a result, the insulating layer (B) has particularly excellent insulating properties.
- the adhesion between the conductor (A) and the insulating layer (B) becomes stronger.
- the melt viscosity ratio (I) / (II) is more preferably 0.4 to 4.0, and (I) / (II) is further preferably 0.5 to 3.0.
- melt viscosity ratio (I) / (from the point that an insulating layer (B) with little fish eye can be obtained and the average dispersed particle size and maximum dispersed particle size of the fluororesin (II) can be reduced.
- II) is particularly preferably 0.5 to 2.5.
- the insulating layer (B) contains the aromatic polyether ketone resin (I) and the fluororesin (II), but may contain other components as necessary. Although it does not specifically limit as said other component, For example, a titanium oxide, a silica, an alumina, barium sulfate, a calcium carbonate, aluminum hydroxide, a potassium titanate, a magnesium oxide, a calcium oxide, clay, a talc etc. are mentioned.
- the insulating layer (B) may also contain a filler, an adhesion promoter, an antioxidant, a lubricant, a processing aid, a colorant, and the like.
- the thickness of the insulating layer (B) is not limited, but can be 1 to 100 ⁇ m, for example.
- the film thickness of the insulating layer (B) can be 60 ⁇ m or less, or 40 ⁇ m or less. Moreover, it can also be thinned to 30 ⁇ m or less. Reducing the thickness of the insulating layer (B) is advantageous in that it has excellent heat dissipation performance.
- the said insulating layer (B) can be obtained by forming the resin composition which consists of aromatic polyether ketone resin (I) and specific fluororesin (II) on the outer periphery of a conductor (A).
- the insulated wire of the present invention includes, for example, a step of preparing a resin composition containing an aromatic polyetherketone resin (I) and a fluororesin (II), and molding the resin composition to obtain an outer periphery of the conductor (A). Forming an insulating layer (B) on the substrate.
- the method for preparing the resin composition is not particularly limited, and a mixer such as a compounding mill, a Banbury mixer, a pressure kneader, and an extruder that are usually used for mixing a resin composition such as a molding composition is used. And can be carried out under normal conditions. Since the average dispersed particle size of the fluororesin (II) can be reduced, the mixer is preferably a twin screw extruder, and particularly preferably a twin screw extruder having a screw configuration with a large L / D.
- L / D is the effective length of the screw (L) / screw diameter (D).
- a method for preparing the resin composition for example, a method in which the aromatic polyether ketone resin (I) and the fluororesin (II) are mixed in a molten state is preferable.
- a resin composition having a desired dispersion state can be obtained by sufficiently kneading the aromatic polyether ketone resin (I) and the fluororesin (II). Since the dispersion state of the resin composition affects the insulation properties of the obtained insulating layer (B) and the adhesion between the insulating layer (B) and the conductor (A), a desired dispersion state is obtained in the insulating layer (B). As such, the selection of the kneading method should be made appropriately.
- the aromatic polyetherketone resin (I) and the fluororesin (II) are charged into a mixer at an appropriate ratio, and the other components are added as desired.
- a method of producing by melting and kneading at a melting point of (I) and (II) is preferable.
- the resin composition may contain other components different from the aromatic polyether ketone resin (I) and the fluororesin (II).
- the other components may be added to the aromatic polyether ketone resin (I) and the fluororesin (II) in advance and mixed, or the aromatic polyether ketone resin (I) and the fluororesin (II). You may add when mix
- the temperature at the time of the melt kneading may be appropriately set depending on the kind of the aromatic polyetherketone resin (I) and the fluororesin (II) to be used, but it is preferably, for example, 360 to 400 ° C.
- the kneading time is usually 1 minute to 1 hour.
- the adhesive strength between the insulating layer (B) obtained from the resin composition and the conductor (A) can be 10 N / cm or more. Due to the adhesive strength within the above range, it is particularly suitable for use in automobile electric wires and motor coil windings.
- the adhesive strength is more preferably 15 N / cm or more, and further preferably 20 N / cm or more.
- the method for forming the insulating layer (B) is not particularly limited, and various conditions can be used as conventionally known. Further, the insulating layer (B) may be formed directly on the conductor (A) or may be formed through another layer, for example, another resin layer.
- the insulating layer (B) is formed by melting and extruding the resin composition on the surface of the conductor (A) or the surface of the resin layer of the conductor (A) on which another resin layer has been formed in advance.
- a resin composition is melt-extruded to produce a film, the film is slit to a predetermined size, and then the surface of the conductor (A) or the surface of the resin layer of the conductor (A) in which another resin layer is formed in advance.
- the film can be formed by a method of winding the film.
- the forming temperature is a temperature equal to or higher than the melting point of the aromatic polyether ketone resin (I) used.
- the molding temperature is preferably a temperature lower than the lower one of the decomposition temperature of the fluororesin (II) and the decomposition temperature of the aromatic polyether ketone resin (I).
- Such a molding temperature may be 250 to 400 ° C., for example.
- the molding temperature is preferably 320 to 400 ° C.
- the insulated wire of the present invention may be heated after forming the insulating layer (B).
- the heating may be performed at a temperature near the melting point of the fluororesin.
- the insulating layer (B) is formed on the outer periphery of the conductor (A). Another layer such as another resin layer may be provided between the conductor (A) and the insulating layer (B). Moreover, the insulated wire of this invention may have another layer, for example, another resin layer, in the outer periphery of the said insulating layer (B).
- the other resin layer is different from the insulating layer (B).
- the other resin layer is, for example, a layer made of at least one resin selected from the group consisting of aromatic polyetherketone resin, fluororesin, polyamideimide, polyetherimide, polyethersulfone, and polyphenylene sulfide. It is preferable.
- the material for forming the conductor (A) is not particularly limited as long as the material has good conductivity, and examples thereof include copper, copper alloy, copper clad aluminum, aluminum, silver, gold, and galvanized iron.
- the shape of the conductor (A) is not particularly limited, and may be circular or flat. In the case of a circular conductor, the diameter of the conductor (A) may be 0.3 to 2.5 mm.
- the insulated wire of the present invention can be suitably used for wrapping wires, automotive wires, robot wires, and the like. Moreover, it can be used conveniently also as a coil winding (magnet wire), and if it uses the electric wire of this invention, it will be hard to produce the damage by winding processing.
- the above winding is suitable for motors, rotating electrical machines, compressors, transformers, etc., requires high voltage, high current and high thermal conductivity, requires high-density winding processing, and is downsized. -It has the characteristics that it can sufficiently withstand the use with high output motors. Moreover, it is suitable also as an electric wire for power distribution, power transmission, or communication.
- melt viscosity of the aromatic polyetherketone resin was measured at 60 sec ⁇ 1 and 390 ° C. according to ASTM D3835.
- the melt viscosity of the fluororesin was measured at 60 sec ⁇ 1 and 390 ° C. in accordance with ASTM D3835.
- the negative film obtained by microscopic observation is electronically imaged with a scanner (GT-9400UF manufactured by Seiko Epson Corporation), and binarization processing of the electronic image is performed using an optical analyzer (LUZEX AP manufactured by Nireco Corporation). The average dispersed particle size and the maximum dispersed particle size of the dispersed phase were determined.
- a film (thickness 25 ⁇ m) obtained by using a resin composition of the following Examples or Comparative Examples or a polyether ether ketone single resin was cut into a strip shape having a width of 2 mm and a length of 100 mm, and a cavity resonator perturbation method ( The relative dielectric constant at 1 MHz was measured with a dielectric constant measuring device manufactured by Kanto Electronics Co., Ltd. and a network analyzer manufactured by Agilent Technologies.
- ⁇ Measurement of the number of fish eyes in the insulation layer The number of fish eyes in a 12 cm ⁇ 50 cm square was measured using a film (thickness 25 ⁇ m) obtained by using a resin composition of the following Examples or Comparative Examples or a polyether ether ketone single resin. ⁇ : Less than 10 ⁇ : 10 or more and less than 30 ⁇ : 30 or more
- Aromatic polyether ketone resin (1) Polyether ether ketone (melt viscosity; 1.19 kNsm ⁇ 2 )
- Aromatic polyetherketone resin (2) polyetheretherketone (melt viscosity; 0.31 kNsm ⁇ 2 )
- MFR 23 g / 10 min.
- Fluororesin (3) Polytetrafluoroethylene (trade name: Lubron L5, manufactured by Daikin Industries, Ltd.)
- Fluororesin (4) ethylene / tetrafluoroethylene copolymer (trade name: NEOFLON EP541, manufactured by Daikin Industries, Ltd., melt viscosity; 2.27 kNsm ⁇ 2 )
- said film was slit to the magnitude
- the conductor wound with the film was placed in an electric furnace, and heat treatment was performed at 340 ° C. for 1 minute to bond the film and the conductor to obtain an insulated wire.
- a film and an insulated wire were produced under the same conditions as in Examples 1 and 2 except that the obtained resin composition was used.
- each evaluation was performed under the same conditions as in Examples 1 and 2. The results are shown in Table 1.
- a resin composition was produced by melt-kneading under conditions of a temperature of 390 ° C. and a screw rotation speed of 300 rpm.
- a film and an insulated wire were produced under the same conditions as in Examples 1 and 2 except that the obtained resin composition was used. Thereafter, each evaluation was performed under the same conditions as in Examples 1 and 2. The results are shown in Table 1.
Landscapes
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
CF2=CF-Rf1 (1)
(式中、Rf1は、-CF3または-ORf2を表す。Rf2は、炭素数1~5のパーフルオロアルキル基を表す。)で表されるパーフルオロエチレン性不飽和化合物の共重合体であり、芳香族ポリエーテルケトン樹脂(I)とフッ素樹脂(II)との溶融粘度比(I)/(II)が0.3~5.0であることを特徴とする絶縁電線である。
本発明の絶縁電線は、上記構成を有することによって、絶縁層(B)が優れた絶縁性を有するとともに、低い誘電率を示す。また、絶縁層(B)が、上記芳香族ポリエーテルケトン樹脂(I)及び上記フッ素樹脂(II)を含む樹脂組成物から形成されるものであるため、耐熱性に優れる。更に、力学的強度、引張伸びにも優れている。更に、絶縁層(B)のフィッシュアイの数を低減させることができるため、絶縁層(B)の成形不良を抑制することができる。そのため、絶縁層(B)が耐クラック性に優れるものとなるし、本発明の絶縁電線は、絶縁層(B)の厚みが薄い細線にも好適に使用できる。
導体(A)の外周に形成される絶縁層(B)は、導体(A)と接するものであってもよいし、導体(A)との間に、他の層、例えば他の樹脂層を介して形成されたものであってもよい。絶縁層(B)は、導体(A)と接するものであることが好ましく、その場合、導体(A)と絶縁層(B)との接着が強固な絶縁電線が得られる。
上記芳香族ポリエーテルケトン樹脂(I)の溶融粘度は、ASTM D3835に準拠して測定する。
テトラフルオロエチレン(TFE)及び下記一般式(1):
CF2=CF-Rf1 (1)
(式中、Rf1は、-CF3又は-ORf2を表す。Rf2は、炭素数1~5のパーフルオロアルキル基を表す。)で表されるパーフルオロエチレン性不飽和化合物の共重合体である。上記フッ素樹脂(II)を用いることによって、フッ素樹脂(II)が芳香族ポリエーテルケトン樹脂(I)に対して効率よく分散し、本発明の絶縁電線における絶縁層(B)は、より優れた力学物性を示すと共に、絶縁性に優れ、低い誘電率を示す。更に、絶縁層(B)と導体(A)との接着がより強固なものとなる。例えば、ポリテトラフルオロエチレンを用いた場合には、充分な力学物性を示さず、導体(A)との接着強度も低い。
フッ素樹脂(II)は、1種を用いてもよいし、2種以上を併用してもよい。
上記Rf1が、-ORf2である場合、上記Rf2は炭素数が1~3のパーフルオロアルキル基であることが好ましい。
また、上記フッ素樹脂(II)を構成する上記一般式(1)で表されるパーフルオロエチレン性不飽和化合物の含有量の下限は、3モル%がより好ましく、5モル%が更に好ましい。上記フッ素樹脂(II)を構成する上記一般式(1)で表されるパーフルオロエチレン性不飽和化合物の含有量の上限は、15モル%がより好ましく、13モル%が更に好ましく、10モル%が特に好ましく、7モル%が殊更に好ましい。
上記フッ素樹脂(II)のMFRは、ASTM D3307-01に準拠し、メルトインデクサーを用いて測定する。
上記フッ素樹脂(II)の溶融粘度は、ASTM D3835に準拠して測定する。
平均分散粒子径が大きすぎると、力学物性が低下し、また導体(A)との接着強度が劣るおそれがある。下限は特に限定されないが0.01μmであってよい。
芳香族ポリエーテルケトン樹脂(I)とフッ素樹脂(II)とを充分に混練することによって、所望の分散状態を有する樹脂組成物を得ることができる。樹脂組成物の分散状態は得られる絶縁層(B)の絶縁性、絶縁層(B)と導体(A)との接着性に影響を与えるので、絶縁層(B)において所望の分散状態が得られるように、混練方法の選択は適切に行われるべきである。
ASTM D3307-01に従って、メルトインデクサー((株)東洋精機製作所製)を用いて、372℃、5000g荷重下で内径2mm、長さ8mmのノズルから10分間あたりに流出するポリマーの質量(g/10分)を求めた。
芳香族ポリエーテルケトン樹脂の溶融粘度は、60sec-1、390℃において、ASTM D3835に準拠して測定した。
フッ素樹脂の溶融粘度は、60sec-1、390℃において、ASTM D3835に準拠して測定した。
作成した絶縁電線の絶縁層を用い、ウルトラミクロトーム(ライカ社製ULTRACUT S)の試料ホルダーに固定、チャンバー内を液体窒素で-80℃まで冷却し、絶縁層の断面が観察部となるように切削し、超薄切片を得た。
得られた超薄切片を20%エタノール溶液を付着させた白金リングにて回収し、銅製シートメッシュ(応研商事(株)製200A、φ3.0mm)に付着させた。
その後、透過型電子顕微鏡((株)日立製作所製、H7100FA)を用いて、銅製シートメッシュに付着させた超薄切片の観察を行った。
顕微鏡観察により得られたネガフィルムをスキャナー(セイコーエプソン(株)製GT-9400UF)にて電子画像化し、光学解析装置((株)ニレコ製LUZEX AP)を用いて電子像の二値化処理を行い、分散相の平均分散粒子径及び最大分散粒子径を求めた。
下記の実施例または比較例の樹脂組成物またはポリエーテルエーテルケトン単独樹脂を使用して得られたフィルム(厚み25μm)を、幅2mm・長さ100mmの短冊状に切り出し、空洞共振器摂動法((株)関東電子応用開発製誘電率測定装置、アジレントテクノロジー(株)製ネットワークアナライザ)にて、1MHzにおける比誘電率を測定した。
下記の実施例または比較例の樹脂組成物またはポリエーテルエーテルケトン単独樹脂を使用して得られたフィルム(厚み25μm)を使用して、四探針法(三菱化学(株)製 Loresta HP MCP-T410装置を使用)にて体積固有抵抗率を測定した。
下記の実施例または比較例で得られた絶縁電線につき、引張試験機を使用して、180度剥離試験にて導体と絶縁層との接着力を測定した。
下記の実施例または比較例の樹脂組成物またはポリエーテルエーテルケトン単独樹脂を使用して得られたフィルム(厚み25μm)を使用して、12cm×50cm四方のフィッシュアイ個数を計測した。
○:10個未満
△:10個以上30個未満
×:30個以上
芳香族ポリエーテルケトン樹脂(1):ポリエーテルエーテルケトン(溶融粘度;1.19kNsm-2。)
芳香族ポリエーテルケトン樹脂(2):ポリエーテルエーテルケトン(溶融粘度;0.31kNsm-2。)
フッ素樹脂(1):テトラフルオロエチレン/ヘキサフルオロプロピレン共重合体(組成重量比;テトラフルオロエチレン/ヘキサフルオロプロピレン/パーフルオロ(プロピルビニルエーテル)=87.5/11.5/1.0。MFR;23g/10分。溶融粘度;0.55kNsm-2。)
フッ素樹脂(2):テトラフルオロエチレン/ヘキサフルオロプロピレン共重合体(組成重量比;テトラフルオロエチレン/ヘキサフルオロプロピレン/パーフルオロ(プロピルビニルエーテル)=87.5/11.5/1.0。MFR;60g/10分。溶融粘度;2.23kNsm-2。)
フッ素樹脂(3):ポリテトラフルオロエチレン(商品名:ルブロンL5、ダイキン工業(株)製。)
フッ素樹脂(4):エチレン/テトラフルオロエチレン共重合体(商品名:ネオフロンEP541、ダイキン工業(株)製。溶融粘度;2.27kNsm-2。)
芳香族ポリエーテルケトン樹脂(1)およびフッ素樹脂(1)を表1に示す割合(質量部)で予備混合を行い、二軸押出機(φ15mm、L/D=60)を使用して、シリンダー温度390℃、スクリュウ回転数300rpmの条件下で溶融混練し、樹脂組成物を製造した。
芳香族ポリエーテルケトン樹脂(1)のみを使用して、実施例1及び2と同じ条件でフィルムおよび絶縁電線を作製した。その後、実施例1及び2と同じ条件で各評価を行った。結果を表1に示す。
芳香族ポリエーテルケトン樹脂(1)、フッ素樹脂(3)またはフッ素樹脂(4)を表1に示す割合(質量部)で予備混合を行い、二軸押出機(φ15mm、L/D=60)を使用して、シリンダー温度390℃、スクリュウ回転数300rpmの条件下で溶融混練し、樹脂組成物を製造した。
次に、得られた樹脂組成物を用いたこと以外は、実施例1及び2と同じ条件でフィルムおよび絶縁電線を作製した。その後、実施例1及び2と同じ条件で各評価を行った。結果を表1に示す。
芳香族ポリエーテルケトン樹脂(2)、フッ素樹脂(2)を表1に示す割合(質量部)で予備混合を行い、二軸押出機(φ15mm、L/D=60)を使用して、シリンダー温度390℃、スクリュウ回転数300rpmの条件下で溶融混練し、樹脂組成物を製造した。
次に、得られた樹脂組成物を用いたこと以外は、実施例1及び2と同じ条件でフィルムおよび絶縁電線を作製した。その後、実施例1及び2と同じ条件で各評価を行った。結果を表1に示す。
Claims (6)
- 導体(A)と、
前記導体(A)の外周に形成される絶縁層(B)とを有する絶縁電線であって;
絶縁層(B)が、芳香族ポリエーテルケトン樹脂(I)及びフッ素樹脂(II)を含む樹脂組成物から形成され、
フッ素樹脂(II)は、テトラフルオロエチレン及び下記一般式(1):
CF2=CF-Rf1 (1)
(式中、Rf1は、-CF3または-ORf2を表す。Rf2は、炭素数1~5のパーフルオロアルキル基を表す。)で表されるパーフルオロエチレン性不飽和化合物の共重合体であり、
芳香族ポリエーテルケトン樹脂(I)とフッ素樹脂(II)との溶融粘度比(I)/(II)が0.3~5.0である
ことを特徴とする絶縁電線。 - 絶縁層(B)は、フッ素樹脂(II)が芳香族ポリエーテルケトン樹脂(I)中に粒子状に分散しており、
フッ素樹脂(II)の平均分散粒子径が0.5μm以下である請求項1記載の絶縁電線。 - 絶縁層(B)は、フッ素樹脂(II)が芳香族ポリエーテルケトン樹脂(I)中に粒子状に分散しており、フッ素樹脂(II)の最大分散粒子径が1.0μm以下である
請求項1又は2記載の絶縁電線。 - 絶縁層(B)は、芳香族ポリエーテルケトン樹脂(I)とフッ素樹脂(II)との質量比(I):(II)が95:5~50:50である請求項1、2又は3記載の絶縁電線。
- フッ素樹脂(II)は、メルトフローレートが0.1~100g/10分である請求項1、2、3又は4記載の絶縁電線。
- 芳香族ポリエーテルケトン樹脂(I)は、ポリエーテルエーテルケトンである請求項1、2、3、4又は5記載の絶縁電線。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147018991A KR20140107412A (ko) | 2011-12-14 | 2012-11-29 | 절연 전선 |
JP2013549206A JP5975042B2 (ja) | 2011-12-14 | 2012-11-29 | 絶縁電線 |
EP12858147.7A EP2767986B1 (en) | 2011-12-14 | 2012-11-29 | Insulated wire |
US14/361,788 US11024441B2 (en) | 2011-12-14 | 2012-11-29 | Insulated wire |
CN201280061853.5A CN103999167B (zh) | 2011-12-14 | 2012-11-29 | 绝缘电线 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011273424 | 2011-12-14 | ||
JP2011-273424 | 2011-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013088968A1 true WO2013088968A1 (ja) | 2013-06-20 |
Family
ID=48612423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/080931 WO2013088968A1 (ja) | 2011-12-14 | 2012-11-29 | 絶縁電線 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11024441B2 (ja) |
EP (1) | EP2767986B1 (ja) |
JP (1) | JP5975042B2 (ja) |
KR (1) | KR20140107412A (ja) |
CN (1) | CN103999167B (ja) |
WO (1) | WO2013088968A1 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014024671A1 (ja) * | 2012-08-06 | 2014-02-13 | ダイキン工業株式会社 | 樹脂組成物及び成形品 |
WO2014034493A1 (ja) * | 2012-08-31 | 2014-03-06 | ダイセル・エボニック株式会社 | 難燃性熱可塑性樹脂組成物 |
WO2015012346A1 (ja) * | 2013-07-25 | 2015-01-29 | ダイキン工業株式会社 | 熱可塑性樹脂組成物および成形品 |
JP2015086364A (ja) * | 2013-09-27 | 2015-05-07 | 旭硝子株式会社 | 成形品およびその製造方法ならびに電線およびその製造方法 |
JP5907282B2 (ja) * | 2012-11-12 | 2016-04-26 | ダイキン工業株式会社 | 樹脂組成物及び成形品 |
JP2016079391A (ja) * | 2014-10-10 | 2016-05-16 | ダイキン工業株式会社 | 樹脂組成物および成形品 |
KR20170018944A (ko) | 2014-07-18 | 2017-02-20 | 다이킨 고교 가부시키가이샤 | 필름 및 그 제조 방법 |
JP2017059323A (ja) * | 2015-09-14 | 2017-03-23 | ダイキン工業株式会社 | 絶縁電線及びその製造方法 |
KR20170078609A (ko) | 2014-09-09 | 2017-07-07 | 후루카와 덴키 고교 가부시키가이샤 | 절연 전선, 코일 및 전기·전자기기, 및 절연 전선의 제조 방법 |
JP2020098717A (ja) * | 2018-12-18 | 2020-06-25 | 信越ポリマー株式会社 | 導電素線用樹脂フィルム及びその製造方法並びに平角電線 |
JP2021042294A (ja) * | 2019-09-10 | 2021-03-18 | 信越ポリマー株式会社 | 高周波回路基板用樹脂フィルム及びその製造方法、並びに高周波回路基板 |
WO2022071142A1 (ja) | 2020-09-30 | 2022-04-07 | ダイキン工業株式会社 | 絶縁電線及び樹脂組成物 |
JP7510096B2 (ja) | 2022-08-25 | 2024-07-03 | ダイキン工業株式会社 | 絶縁電線およびその製造方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6137198B2 (ja) * | 2013-01-17 | 2017-05-31 | ダイキン工業株式会社 | 絶縁電線 |
JP6226169B2 (ja) * | 2013-06-11 | 2017-11-08 | 日立化成株式会社 | 絶縁被覆ワイヤ及びマルチワイヤ配線板 |
US10199138B2 (en) | 2014-02-05 | 2019-02-05 | Essex Group, Inc. | Insulated winding wire |
WO2015130681A1 (en) | 2014-02-25 | 2015-09-03 | Essex Group, Inc. | Insulated winding wire |
GB201501601D0 (en) | 2015-01-30 | 2015-03-18 | Victrex Mfg Ltd | Insulated conductors |
JP2019096606A (ja) | 2017-11-21 | 2019-06-20 | 三菱マテリアル株式会社 | 絶縁導体および絶縁導体の製造方法 |
JP7181465B2 (ja) * | 2019-03-27 | 2022-12-01 | ダイキン工業株式会社 | 樹脂組成物および成形品 |
FR3109848B1 (fr) | 2020-04-30 | 2022-12-16 | Arkema France | Conducteur isolé apte à être utilisé dans un bobinage, bobinage en dérivant et procédés de fabrication correspondants. |
FR3127906A1 (fr) | 2021-10-12 | 2023-04-14 | Arkema France | Procédé de thermoformage double-feuilles d’un corps creux et corps creux en dérivant |
FR3146475A1 (fr) | 2023-03-10 | 2024-09-13 | Arkema France | Composition à base de polyaryléthercétone(s) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58176242A (ja) * | 1982-04-09 | 1983-10-15 | Sumitomo Chem Co Ltd | 樹脂組成物 |
JPS60155275A (ja) * | 1984-01-24 | 1985-08-15 | Sumitomo Chem Co Ltd | 被覆用樹脂組成物 |
JPH02212539A (ja) * | 1989-02-14 | 1990-08-23 | Asahi Chem Ind Co Ltd | 潤滑性樹脂組成物 |
JPH02250208A (ja) * | 1989-03-23 | 1990-10-08 | Fujikura Ltd | 絶縁電線 |
JPH05225832A (ja) | 1992-02-07 | 1993-09-03 | Furukawa Electric Co Ltd:The | 絶縁電線 |
JPH06136255A (ja) * | 1992-10-27 | 1994-05-17 | Mitsui Toatsu Chem Inc | ポリエーテル芳香族ケトン樹脂組成物 |
JPH0817258A (ja) | 1994-06-30 | 1996-01-19 | Nissei Denki Kk | ポリエーテルエーテルケトン樹脂被覆電線・ケーブル |
WO2003044093A1 (fr) * | 2001-11-21 | 2003-05-30 | Daikin Industries, Ltd. | Composition de resine et procede de fabrication de moules |
JP2006274073A (ja) | 2005-03-29 | 2006-10-12 | Mitsubishi Plastics Ind Ltd | 樹脂組成物、その樹脂成形体、及び樹脂組成物の製造方法 |
JP2010067521A (ja) | 2008-09-11 | 2010-03-25 | Sumitomo Electric Ind Ltd | 絶縁電線及びその製造方法、並びに、電気コイル及びモータ |
JP2010123389A (ja) | 2008-11-19 | 2010-06-03 | Sumitomo Electric Ind Ltd | 絶縁電線 |
CN101880436A (zh) * | 2010-07-05 | 2010-11-10 | 清华大学 | 树脂组合物及其模塑品 |
JP2011159578A (ja) | 2010-02-03 | 2011-08-18 | Sumitomo Electric Wintec Inc | 絶縁電線及びそれを用いた電機コイル、モータ |
JP2011165485A (ja) | 2010-02-10 | 2011-08-25 | Hitachi Cable Ltd | 絶縁電線 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4001351A (en) * | 1975-04-03 | 1977-01-04 | E. I. Du Pont De Nemours And Company | Process for preparing tetrafluoroethylene-hexafluoropropylene copolymer blends |
JPH083040B2 (ja) * | 1984-08-30 | 1996-01-17 | エヌティエヌ株式会社 | ポリアミドイミド系樹脂成形体組成物 |
US4897439A (en) | 1986-07-01 | 1990-01-30 | Edlon Products, Inc. | Polymer-metal bonded composite and method of producing same |
JP2870547B2 (ja) | 1989-11-16 | 1999-03-17 | 株式会社フジクラ | 絶縁電線 |
JPH06316686A (ja) | 1992-10-30 | 1994-11-15 | Nikken Toso Kogyo Kk | Pfa−peek複合塗膜 |
JP3620873B2 (ja) | 1994-08-04 | 2005-02-16 | 三井化学株式会社 | 樹脂組成物 |
JP3538823B2 (ja) | 1995-04-21 | 2004-06-14 | Nok株式会社 | 樹脂組成物 |
JPH0971704A (ja) | 1995-06-28 | 1997-03-18 | Ntn Corp | 四フッ化エチレン樹脂組成物 |
US5789508A (en) * | 1995-08-31 | 1998-08-04 | E. I. Du Pont De Nemours And Company | Polymerization process |
JPH0987517A (ja) | 1995-09-27 | 1997-03-31 | Mitsui Toatsu Chem Inc | ポリイミド系樹脂組成物 |
JPH10195302A (ja) | 1997-01-14 | 1998-07-28 | Daikin Ind Ltd | 耐熱性樹脂組成物および成形体 |
JP2007046064A (ja) | 1997-02-25 | 2007-02-22 | Ntn Corp | 摺動材用樹脂組成物および樹脂製歯車 |
US5962376A (en) | 1997-02-25 | 1999-10-05 | Ntn Corporation | Resin composition for sliding member and resin gear |
JPH115965A (ja) | 1997-06-19 | 1999-01-12 | Mitsui Chem Inc | ガラス繊維充填樹脂組成物からなるシールリング |
JP2000169697A (ja) | 1998-12-08 | 2000-06-20 | Daido Metal Co Ltd | 複層軸受 |
JP3961212B2 (ja) | 2000-11-01 | 2007-08-22 | Ntn株式会社 | ウォータポンプ用滑り軸受 |
JP4044725B2 (ja) | 2000-11-15 | 2008-02-06 | 日立電線株式会社 | 改質エンジニアリングプラスチックの製造方法 |
JP2002235011A (ja) | 2000-12-06 | 2002-08-23 | Mitsui Chemicals Inc | ポリイミド系樹脂組成物 |
JP2002323044A (ja) | 2001-04-25 | 2002-11-08 | Nok Corp | 軸受け成形材料 |
JP2003082123A (ja) | 2001-09-14 | 2003-03-19 | Du Pont Toray Co Ltd | ポリアリールケトンフィルムおよびそれを用いた可撓性印刷回路基板 |
JP2004137363A (ja) | 2002-10-17 | 2004-05-13 | Nissan Motor Co Ltd | 樹脂組成物、樹脂材料及びこれを用いた摺動部材、内燃機関用チェーンシステム、車両用シールリング |
US7245973B2 (en) * | 2003-12-23 | 2007-07-17 | Cardiac Pacemakers, Inc. | His bundle mapping, pacing, and injection lead |
JP2006226464A (ja) | 2005-02-18 | 2006-08-31 | Ge Plastics Japan Ltd | 高耐熱熱可塑性樹脂製歯車 |
JP2007120588A (ja) | 2005-10-27 | 2007-05-17 | Toyo Plastic Seiko Co Ltd | モータ用軸受け部材 |
US20100119188A1 (en) | 2007-02-05 | 2010-05-13 | Victrex Manfacturing Limited | Bearings |
JP5115382B2 (ja) | 2007-08-02 | 2013-01-09 | ダイキン工業株式会社 | 樹脂組成物 |
JP5060223B2 (ja) | 2007-09-12 | 2012-10-31 | トヨタ自動車株式会社 | 内燃機関用ピストン |
JP5474371B2 (ja) | 2009-02-20 | 2014-04-16 | オリンパス株式会社 | 熱可塑性樹脂組成物、並びに医療製品及び内視鏡操作部 |
JP5751347B2 (ja) | 2011-12-13 | 2015-07-22 | ダイキン工業株式会社 | 歯車 |
WO2013088965A1 (ja) | 2011-12-13 | 2013-06-20 | ダイキン工業株式会社 | 軸受け、及び、転がり軸受け |
KR20140105550A (ko) | 2011-12-13 | 2014-09-01 | 다이킨 고교 가부시키가이샤 | 수지 조성물 및 성형품 |
WO2013088967A1 (ja) | 2011-12-13 | 2013-06-20 | ダイキン工業株式会社 | シールリング |
JP6136255B2 (ja) * | 2012-12-27 | 2017-05-31 | 株式会社 ダイサン | プラスチック製容器 |
-
2012
- 2012-11-29 EP EP12858147.7A patent/EP2767986B1/en active Active
- 2012-11-29 KR KR1020147018991A patent/KR20140107412A/ko active Search and Examination
- 2012-11-29 WO PCT/JP2012/080931 patent/WO2013088968A1/ja active Application Filing
- 2012-11-29 JP JP2013549206A patent/JP5975042B2/ja active Active
- 2012-11-29 US US14/361,788 patent/US11024441B2/en active Active
- 2012-11-29 CN CN201280061853.5A patent/CN103999167B/zh active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58176242A (ja) * | 1982-04-09 | 1983-10-15 | Sumitomo Chem Co Ltd | 樹脂組成物 |
JPS60155275A (ja) * | 1984-01-24 | 1985-08-15 | Sumitomo Chem Co Ltd | 被覆用樹脂組成物 |
JPH02212539A (ja) * | 1989-02-14 | 1990-08-23 | Asahi Chem Ind Co Ltd | 潤滑性樹脂組成物 |
JPH02250208A (ja) * | 1989-03-23 | 1990-10-08 | Fujikura Ltd | 絶縁電線 |
JPH05225832A (ja) | 1992-02-07 | 1993-09-03 | Furukawa Electric Co Ltd:The | 絶縁電線 |
JPH06136255A (ja) * | 1992-10-27 | 1994-05-17 | Mitsui Toatsu Chem Inc | ポリエーテル芳香族ケトン樹脂組成物 |
JPH0817258A (ja) | 1994-06-30 | 1996-01-19 | Nissei Denki Kk | ポリエーテルエーテルケトン樹脂被覆電線・ケーブル |
WO2003044093A1 (fr) * | 2001-11-21 | 2003-05-30 | Daikin Industries, Ltd. | Composition de resine et procede de fabrication de moules |
JP2006274073A (ja) | 2005-03-29 | 2006-10-12 | Mitsubishi Plastics Ind Ltd | 樹脂組成物、その樹脂成形体、及び樹脂組成物の製造方法 |
JP2010067521A (ja) | 2008-09-11 | 2010-03-25 | Sumitomo Electric Ind Ltd | 絶縁電線及びその製造方法、並びに、電気コイル及びモータ |
JP2010123389A (ja) | 2008-11-19 | 2010-06-03 | Sumitomo Electric Ind Ltd | 絶縁電線 |
JP2011159578A (ja) | 2010-02-03 | 2011-08-18 | Sumitomo Electric Wintec Inc | 絶縁電線及びそれを用いた電機コイル、モータ |
JP2011165485A (ja) | 2010-02-10 | 2011-08-25 | Hitachi Cable Ltd | 絶縁電線 |
CN101880436A (zh) * | 2010-07-05 | 2010-11-10 | 清华大学 | 树脂组合物及其模塑品 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2767986A1 |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10294362B2 (en) | 2012-08-06 | 2019-05-21 | Daikin Industries, Ltd. | Resin composition and molded article |
EP2881430A4 (en) * | 2012-08-06 | 2015-08-05 | Daikin Ind Ltd | RESIN COMPOSITION AND ARTICLES |
WO2014024671A1 (ja) * | 2012-08-06 | 2014-02-13 | ダイキン工業株式会社 | 樹脂組成物及び成形品 |
WO2014034493A1 (ja) * | 2012-08-31 | 2014-03-06 | ダイセル・エボニック株式会社 | 難燃性熱可塑性樹脂組成物 |
US9382414B2 (en) | 2012-08-31 | 2016-07-05 | Daicel-Evonik Ltd. | Flame retardant thermoplastic resin composition |
JP5907282B2 (ja) * | 2012-11-12 | 2016-04-26 | ダイキン工業株式会社 | 樹脂組成物及び成形品 |
JP2015042740A (ja) * | 2013-07-25 | 2015-03-05 | ダイキン工業株式会社 | 熱可塑性樹脂組成物および成形品 |
CN105408422A (zh) * | 2013-07-25 | 2016-03-16 | 大金工业株式会社 | 热塑性树脂组合物和成型品 |
US10964444B2 (en) | 2013-07-25 | 2021-03-30 | Daikin Industries, Ltd. | Thermoplastic resin composition, and molded article thereof |
WO2015012346A1 (ja) * | 2013-07-25 | 2015-01-29 | ダイキン工業株式会社 | 熱可塑性樹脂組成物および成形品 |
JP2015086364A (ja) * | 2013-09-27 | 2015-05-07 | 旭硝子株式会社 | 成形品およびその製造方法ならびに電線およびその製造方法 |
US10113041B2 (en) | 2014-07-18 | 2018-10-30 | Daikin Industries, Ltd. | Film and method for producing same |
KR20170018944A (ko) | 2014-07-18 | 2017-02-20 | 다이킨 고교 가부시키가이샤 | 필름 및 그 제조 방법 |
KR20170078609A (ko) | 2014-09-09 | 2017-07-07 | 후루카와 덴키 고교 가부시키가이샤 | 절연 전선, 코일 및 전기·전자기기, 및 절연 전선의 제조 방법 |
US10037833B2 (en) | 2014-09-09 | 2018-07-31 | Furukawa Electric Co., Ltd. | Insulated wire, coil, and electrical or electronic equipment, and method of producing the insulated wire |
JP2016079391A (ja) * | 2014-10-10 | 2016-05-16 | ダイキン工業株式会社 | 樹脂組成物および成形品 |
JP2017059323A (ja) * | 2015-09-14 | 2017-03-23 | ダイキン工業株式会社 | 絶縁電線及びその製造方法 |
JP2020098717A (ja) * | 2018-12-18 | 2020-06-25 | 信越ポリマー株式会社 | 導電素線用樹脂フィルム及びその製造方法並びに平角電線 |
JP2021042294A (ja) * | 2019-09-10 | 2021-03-18 | 信越ポリマー株式会社 | 高周波回路基板用樹脂フィルム及びその製造方法、並びに高周波回路基板 |
JP7320412B2 (ja) | 2019-09-10 | 2023-08-03 | 信越ポリマー株式会社 | 高周波回路基板用樹脂フィルム及びその製造方法、並びに高周波回路基板 |
WO2022071142A1 (ja) | 2020-09-30 | 2022-04-07 | ダイキン工業株式会社 | 絶縁電線及び樹脂組成物 |
KR20230066420A (ko) | 2020-09-30 | 2023-05-15 | 다이킨 고교 가부시키가이샤 | 절연 전선 및 수지 조성물 |
JP7510096B2 (ja) | 2022-08-25 | 2024-07-03 | ダイキン工業株式会社 | 絶縁電線およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2013088968A1 (ja) | 2015-04-27 |
EP2767986A1 (en) | 2014-08-20 |
EP2767986A4 (en) | 2015-06-24 |
KR20140107412A (ko) | 2014-09-04 |
US11024441B2 (en) | 2021-06-01 |
JP5975042B2 (ja) | 2016-08-23 |
EP2767986B1 (en) | 2019-11-13 |
US20140329087A1 (en) | 2014-11-06 |
CN103999167A (zh) | 2014-08-20 |
CN103999167B (zh) | 2019-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5975042B2 (ja) | 絶縁電線 | |
EP2937870B1 (en) | Insulated wire | |
JP5757358B2 (ja) | 熱可塑性樹脂組成物および成形品 | |
JP5854146B2 (ja) | 樹脂組成物及び成形品 | |
KR102590075B1 (ko) | 절연 도체 및 절연 도체의 제조 방법 | |
US20170236618A1 (en) | Insulated wire and rotating electrical machine | |
JP5737464B2 (ja) | 組成物及び絶縁電線 | |
JP2010123389A (ja) | 絶縁電線 | |
JP6508406B1 (ja) | 絶縁導体および絶縁導体の製造方法 | |
JP6015846B2 (ja) | 電気絶縁部品 | |
JP6604104B2 (ja) | 絶縁電線及びその製造方法 | |
KR20230004822A (ko) | 권선에 사용하기 위한 절연 도체, 그로부터 유래된 권선 및 상응하는 제조 방법 | |
JP5907282B2 (ja) | 樹脂組成物及び成形品 | |
JP2017068971A (ja) | 絶縁電線 | |
JP3414788B2 (ja) | フッ素樹脂絶縁電線 | |
JP2022084533A (ja) | 絶縁電線 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12858147 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013549206 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2012858147 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20147018991 Country of ref document: KR Kind code of ref document: A |