WO2012141094A1 - Module de source de lumière, et appareil électronique le comportant - Google Patents

Module de source de lumière, et appareil électronique le comportant Download PDF

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Publication number
WO2012141094A1
WO2012141094A1 PCT/JP2012/059508 JP2012059508W WO2012141094A1 WO 2012141094 A1 WO2012141094 A1 WO 2012141094A1 JP 2012059508 W JP2012059508 W JP 2012059508W WO 2012141094 A1 WO2012141094 A1 WO 2012141094A1
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WO
WIPO (PCT)
Prior art keywords
light
resin sealing
sealing portion
source module
substrate
Prior art date
Application number
PCT/JP2012/059508
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English (en)
Japanese (ja)
Inventor
弘文 大澤
佳嗣 川東
寛樹 河邑
浩司 北村
光正 阪口
慶一 林田
哲之 竹本
一郎 梅川
秀悟 八木
Original Assignee
シャープ株式会社
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Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP2013509877A priority Critical patent/JPWO2012141094A1/ja
Publication of WO2012141094A1 publication Critical patent/WO2012141094A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0018—Redirecting means on the surface of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
    • G02B6/0061—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to provide homogeneous light output intensity
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0038—Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light source module that can emit light toward the outside and an electronic apparatus including the same.
  • the direct type light source module has a configuration in which LEDs, which are light emitting elements, are arranged in an array immediately below the emission surface, and is distinguished from an edge light type light source module in which the LEDs are arranged on the side of the emission surface.
  • the direct light source module can be suitably used particularly as a backlight module of a liquid crystal display device, and is displayed on the liquid crystal panel by being disposed on the back side of the liquid surface panel that does not have a self-luminous function. Enables visual recognition of images.
  • references disclosing specific configurations of the direct type light source module include, for example, Japanese Patent Application Laid-Open No. 2007-149451 (Patent Document 1), Japanese Patent Application Laid-Open No. 2010-108919 (Patent Document 2), and Japanese Patent Application Laid-Open No. 2006-222413. Gazette (patent document 3) etc. are mentioned.
  • a light guide plate having an emission surface is disposed immediately above an LED having relatively high directivity, and at least a part of the light emitted from the LED is transferred to the light guide plate.
  • a device is devised so that the light emitted from the LED is evenly emitted from a larger emission surface toward a wide range.
  • the LED or a light-transmitting resin sealing portion that seals the LED and the light guide plate are used.
  • the direct type light source module disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2006-222413 has a structure in which the light-transmitting resin sealing portion and the light guide plate are fixed, so that the light-transmitting resin sealing portion There is only one interface as a lens surface between the light guide plate and the light guide plate, and the function of diffusing the light emitted from the LED and applied to the interface toward the side is low and sufficiently large.
  • the present invention has been made to solve the above-described problems, and allows light to be emitted uniformly from a larger emission surface over a wide range while improving the utilization efficiency of the light emitted from the light emitting element. It is an object of the present invention to provide a light source module that can be used and an electronic device including the same.
  • a light source module includes a light emitting element, a substrate having a mounting surface on which the light emitting element is mounted, and a light-transmitting resin seal that is provided on the mounting surface of the substrate and seals the light emitting element. And a first main surface located on the light transmissive resin sealing portion side and a second main surface located on the opposite side of the light transmissive resin sealing portion side, and the light transmissive resin seal A light guide plate disposed on the mounting surface side of the substrate so as to cover the stopper. The light guide plate diffuses the light incident from the first main surface of the portion facing the light-transmitting resin sealing portion by guiding the light inside, and emits the light outward from the second main surface. .
  • the light transmissive resin sealing portion has a convex lens surface on the surface of the portion of the light guide plate facing the first main surface.
  • the first main surface of the portion of the light guide plate facing the light transmissive resin sealing portion has a concave lens surface having a shape corresponding to the convex lens surface of the light transmissive resin sealing portion.
  • One recess is provided.
  • a second concave portion having a substantially conical concave surface is provided on the second main surface of the portion of the light guide plate facing the first concave portion.
  • a light diffusion portion for diffusing light is provided on the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion.
  • the light transmissive resin sealing portion and the light guide plate are fixed by being bonded by a light transmissive adhesive layer provided between the convex lens surface and the concave lens surface.
  • an accommodation recess for accommodating the light emitting element is provided on the mounting surface of the portion of the substrate where the light transmissive resin sealing portion is provided. preferable.
  • the surface of the housing recess is preferably covered with a metal film.
  • phosphor particles are dispersedly arranged inside the light-transmitting resin sealing portion.
  • an air layer is formed between the mounting surface of the substrate and the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion. It is preferable to be provided.
  • the light diffusion portion is a ring-shaped annular ring provided on the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion. It is preferable that it is constituted by a groove.
  • a white resist for reflecting light is provided on the mounting surface of the substrate where the light-transmitting resin sealing portion is not provided. Is preferred.
  • a reflection sheet for reflecting light is disposed on the mounting surface of the portion where the light-transmitting resin sealing portion of the substrate is not provided. It is preferable.
  • a through hole is provided in a portion of the substrate where the light emitting element is mounted, and the through hole is embedded with a metal material.
  • the main surface located on the opposite side of the mounting surface of the substrate is preferably covered with a metal film.
  • the light transmissive resin sealing portion is formed by potting.
  • a damming resist is provided on the mounting surface of the substrate so as to surround the portion where the light-transmitting resin sealing portion is provided. .
  • the light-transmitting resin sealing portion is preferably formed by injection molding.
  • An electronic device includes the light source module according to the present invention described above.
  • a light source module capable of emitting light uniformly from a larger emission surface toward a wide range while increasing the utilization efficiency of light emitted from a light emitting element, and an electronic apparatus including the same. Can be provided.
  • Embodiment 1 of this invention It is a disassembled perspective view of the liquid crystal display device in Embodiment 1 of this invention. It is sectional drawing of the backlight module in Embodiment 1 of this invention. It is a principal part expanded sectional view of the backlight module in Embodiment 1 of this invention. It is a principal part enlarged plan view of the backlight module in Embodiment 1 of this invention. It is a principal part expanded sectional view of the backlight module in Embodiment 2 of this invention. It is a principal part expanded sectional view of the backlight module in Embodiment 3 of this invention. It is a principal part expanded sectional view of the backlight module in Embodiment 4 of this invention. It is a disassembled perspective view of the liquid crystal display device in Embodiment 5 of this invention.
  • a liquid crystal display device is exemplified as an electronic device to which the present invention is applied, and a backlight module provided in the liquid crystal display device is illustrated as a light source module to which the present invention is applied. Do.
  • the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated individually.
  • FIG. 1 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention. First, the configuration of the liquid crystal display device according to the present embodiment will be described with reference to FIG.
  • the liquid crystal display device 1 ⁇ / b> A mainly includes a chassis 2, a lighting unit 10, an optical sheet group 3, a liquid crystal panel 4, a bezel 5, and a control unit 6.
  • the illumination unit 10, the optical sheet group 3, and the liquid crystal panel 4 are sandwiched and held by the chassis 2 and the bezel 5 in a state where these are laminated.
  • the chassis 2 is composed of a metal plate-like member formed by, for example, press molding or the like, and is a member that serves as a base to which each member constituting the liquid crystal display device 1A is assembled.
  • the illumination unit 10 is for irradiating light toward the liquid crystal panel 4 and is disposed immediately above the chassis 2.
  • the lighting unit 10 is configured by combining separated backlight modules 10A in an array, and LEDs 30 (see FIG. 2 and the like) as light emitting elements are incorporated in the individual backlight modules 10A. ing.
  • the ON / OFF operation of the LED 30 incorporated in the backlight module 10 ⁇ / b> A is controlled by the control unit 6. Details of the backlight module 10A will be described later.
  • the optical sheet group 3 is configured by laminating a plurality of optical sheets, and is interposed between the illumination unit 10 and the liquid crystal panel 4.
  • the optical sheet group 3 includes, for example, a diffusion sheet 3a, a pair of prism sheets 3b and 3c, and a polarizing reflection sheet 3d.
  • the diffusion sheet 3a is a member for diffusing the light emitted from the illumination unit 10 to make the irradiance distribution uniform, and is disposed immediately above the illumination unit 10.
  • a surface of a polyester film typified by a polyethylene terephthalate film or a surface obtained by roughening the surface of the polyester film using acrylic binder or the like is used.
  • the pair of prism sheets 3b and 3c is a member for condensing the light emitted from the diffusion sheet 3a, and is disposed so as to overlap two directly above the diffusion sheet 3a.
  • the pair of prism sheets 3b and 3c are overlapped so that the prism shapes provided on the main surfaces thereof are orthogonal to each other.
  • a material obtained by transferring a prism shape to a thermoplastic resin film a material obtained by transferring a prism shape using a UV curable resin to a polyester film typified by a polyethylene terephthalate film, or the like is used. .
  • the polarizing reflective sheet 3d is a member for transmitting a specific type of polarization component (p-polarization component or s-polarization component) contained in the light emitted from the prism sheet 3c and reflecting other polarization components.
  • the prism sheet 3c is disposed immediately above.
  • the reflected polarization component is reflected by a white resist 23 (see FIG. 2 and the like) described later to change the polarization state and re-irradiate the polarizing reflective sheet 3d.
  • a cholesteric liquid crystal film can be used as the polarizing reflective sheet 3d.
  • the liquid crystal panel 4 is a member including a display area for displaying an image, and is disposed immediately above the optical sheet group 3.
  • the liquid crystal panel 4 mainly includes an active matrix substrate, a color filter, a counter substrate, and a liquid crystal layer.
  • the liquid crystal layer is configured by sealing liquid crystal between an active matrix substrate and a counter substrate which are arranged to face each other.
  • a plurality of TFT (thin film transistor) elements are formed on the active matrix substrate in accordance with the pixels, and the ON / OFF operation of the plurality of TFT elements is controlled by the control unit 6.
  • the bezel 5 is composed of a frame-like member having a window portion for exposing the display area of the liquid crystal panel 4, and is disposed immediately above the display surface side of the liquid crystal panel 4.
  • the control unit 6 is a part for controlling the entire liquid crystal display device 1A, and controls, for example, driving of TFT elements provided in the liquid crystal panel 4, driving of the LEDs 30 included in the illumination unit 10, and the like.
  • FIG. 2 is a cross-sectional view of the backlight module in the present embodiment
  • FIG. 3 is an enlarged cross-sectional view of the main part of the backlight module
  • FIG. 4 is an enlarged plan view of a main part of the backlight module in the present embodiment.
  • the backlight module 10 ⁇ / b> A mainly includes a substrate 20, an LED 30, a light transmissive resin sealing portion 33, and a light guide plate 40.
  • Each of the backlight modules 10A is configured to have a flat, substantially rectangular parallelepiped outer shape as shown in FIG. 1, for example, and these are arranged in an array to constitute the illumination unit 10.
  • the board 20 is a member having a mounting surface 20a on which the LEDs 30 are mounted.
  • various wiring boards such as a printed wiring board (PWB) and a flexible wiring board (FPC) can be used. is there.
  • Metal films 21a, 21b, and 22 patterned in a predetermined shape are provided on the mounting surface 20a of the substrate 20 and the back surface that is the main surface located on the opposite side of the mounting surface 20a.
  • the metal films 21a and 21b provided on the mounting surface 20a of the substrate 20 function as wiring for electrical connection, and the metal film 22 provided on the back surface of the substrate 20 It functions as a heat sink for.
  • An insulating film 25 is further provided on the metal film 22 provided on the back side of the substrate 20.
  • the insulating film 25 is a film for preventing the metal film 22 from being exposed.
  • the LED 30 is bonded to the substrate 20 via a die bond material 31. Thereby, the LED 30 is mounted at a predetermined position on the mounting surface 20 a of the substrate 20.
  • the LED 30 is electrically connected to metal films 21 a and 21 b as wirings provided on the mounting surface 20 a side of the substrate 20 through bonding wires 32.
  • LED30 the thing of high brightness, long lifetime, and low power consumption is used suitably.
  • a through hole is provided so as to reach the mounting surface 20 a and the back surface, and the through hole is embedded with the metal material 26.
  • the metal material 26 filled in the through hole functions as a heat sink for heat dissipation, and is in contact with the metal film 22 provided on the back surface of the substrate 20. Thereby, the heat generated by driving the LED 30 is effectively dissipated by the metal material 26 and the metal film 22 as the heat sink.
  • a light-transmitting resin sealing portion 33 is provided on the mounting surface 20a of the substrate 20 and the portion where the LED 30 is mounted. Thus, the LED 30 is sealed by the light transmissive resin sealing portion 33.
  • the light-transmitting resin sealing portion 33 is formed to have a substantially hemispherical shape, for example, and thus has a convex lens surface on the surface of the portion facing the light guide plate 40.
  • the light-transmitting resin sealing portion 33 is formed, for example, by performing a potting process in which a liquid resin is applied to the substrate 20 after being mounted on the substrate 20 and then cured. Or after mounting LED30 on the board
  • the case where the light transmissive resin sealing portion 33 is formed by potting is illustrated, and the liquid resin wets and spreads on the substrate 20 during the potting.
  • a damming resist 24 is provided on the mounting surface 20a of the substrate 20 so as to surround the portion where the LED 30 is mounted.
  • Fluorescent particles 34 are dispersedly arranged inside the light transmissive resin sealing portion 33.
  • the phosphor particles 34 are irradiated with the light emitted from the LED 30 to change the wavelength of the light and emit the light as light of different wavelengths.
  • a blue light emitting diode is used as the LED 30, and yellow phosphor particles are used as the phosphor particles.
  • the light guide plate 40 is disposed on the mounting surface 20 a side of the substrate 20 so as to cover the light transmissive resin sealing portion 33.
  • the light guide plate 40 has a first main surface 40a located on the light transmissive resin sealing portion 33 side and a second main surface 40b located on the opposite side to the light transmissive resin sealing portion 33 side. Yes.
  • the first main surface 40a of the portion of the light guide plate 40 that faces the light-transmitting resin sealing portion 33 functions as an incident surface on which light emitted from the light-transmitting resin sealing portion 33 is incident.
  • the second main surface 40b of the light plate 40 functions as an exit surface that emits light diffused by being guided inside the light guide plate 40 toward the outside.
  • the first main surface 40 a of the portion of the light guide plate 40 facing the light transmissive resin sealing portion 33 has a concave lens surface having a shape corresponding to the convex lens surface of the light transmissive resin sealing portion 33.
  • a recess 41 is provided inside the first recess 41. Inside the first recess 41, a portion of the light transmissive resin sealing portion 33 near the light guide plate 40 is accommodated.
  • a predetermined gap is provided between the convex lens surface of the light transmissive resin sealing portion 33 and the concave lens surface of the light guide plate 40, and the light transmissive adhesive layer 35 fills the gap. Is provided.
  • the light transmissive adhesive layer 35 is for bonding and fixing the light transmissive resin sealing portion 33 and the light guide plate 40.
  • an adhesive agent used as the light-transmitting adhesive layer 35 an adhesive having a refractive index different from the refractive index of the light-transmitting resin sealing portion 33 and the light guide plate 40 is used as an adhesive agent used as the light-transmitting adhesive layer 35.
  • the second concave portion 42 having a substantially conical concave surface is provided on the second main surface 40b of the light guide plate 40 facing the first concave portion 41.
  • the second main surface 40b of the portion where the second recess 42 is provided is a part of the light incident on the inside of the light guide plate 40 via the first main surface 40a of the portion where the first recess 41 is provided.
  • it also functions as a reflective surface that reflects part of the light and guides it toward the side of the light guide plate 40.
  • the concave surface substantially conical the above-described reflection function can be enhanced, and a sufficient amount of light guided toward the side can be secured.
  • a plurality of annular grooves 43 are provided on the first main surface 40a of the portion of the light guide plate 40 that does not face the light-transmitting resin sealing portion 33 (that is, the portion where the first recess 41 is not provided).
  • the plurality of annular groove portions 43 are provided in a ring shape by being provided on concentric circles.
  • the first main surface 40a of the portion where the annular groove portion 43 is provided functions as a light diffusion portion for diffusing light, and is guided in the light guide plate 40 to reach the light diffusion portion. It is a part for radiating light from the second main surface 40b, which is an emission surface, by breaking the total reflection condition by diffusing a part of the part at the part.
  • the first main surface 40a of the portion of the light guide plate 40 that does not face the light transmissive resin sealing portion 33 that is, the first main surface 40a of the portion that functions as the light diffusion portion
  • the mounting surface 20a of the substrate 20 Is provided with an air layer 50. Further, the white resist 23 is provided on the mounting surface 20a of the substrate 20 where the light-transmitting resin sealing portion 33 is not provided.
  • the air layer 50 and the white resist 23 are used for reflecting the light emitted from the light guide plate 40 toward the substrate 20 side by being diffused by the above-described light diffusion portion and returning the light to the light guide plate 40 again.
  • a reflection sheet may be provided on the mounting surface 20a of the substrate 20.
  • the light emitted from the LED 30 passes through the light transmissive resin sealing portion 33 and reaches the light transmissive adhesive layer 35. Further, the light transmissive property is obtained. The light passes through the adhesive layer 35 and reaches the light guide plate 40. Therefore, the light emitted from the LED 30 is irradiated to the light guide plate 40 almost without any surplus, the generation of stray light is greatly reduced, and the light utilization efficiency can be greatly increased. .
  • the light transmissive resin sealing portion 33 that seals the LED 30 and the light guide plate 40 are bonded via the light transmissive adhesive layer 35. Therefore, there are two interfaces that function as lens surfaces between the light-transmitting resin sealing portion 33 and the light guide plate 40. Therefore, the light emitted from the LED is refracted at each of the two interfaces, so that the light can be greatly diffused laterally, and evenly from a sufficiently large emission surface to a wide range. Light can be emitted.
  • the backlight module 10A in the present embodiment it is possible to emit light uniformly from a larger emission surface toward a wide range while improving the utilization efficiency of the light emitted from the LED 30.
  • the liquid crystal display device 1A according to the present embodiment that includes the backlight module 10A it is possible to obtain a desired amount of light with a small number of LEDs 30, and at a low cost.
  • a liquid crystal display device that can be manufactured and has low power consumption can be obtained.
  • FIG. 5 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 2 of the present invention.
  • the configuration of the backlight module in the present embodiment will be described with reference to FIG.
  • the substrate 20 is provided with an accommodation recess 20b, and the LED 30 is mounted on the bottom surface of the accommodation recess 20b.
  • a metal film 21c is provided by extending metal films 21a and 21b, and a reflector is configured by the metal film 21c.
  • the backlight module 10B according to the present embodiment described above is used, the same effects as those described in the first embodiment of the present invention described above can be obtained. Furthermore, by using the backlight module 10B in the present embodiment, a distance can be provided between the exit surface of the LED 30 and the lens surface by the amount of the housing recess 20b in which the LED 30 is housed and disposed on the substrate 20. It becomes possible, and the light diffusibility in a lens surface can be improved. In addition, since it becomes possible to simultaneously form a reflector by covering the surface of the housing recess 20b with the metal film 21c, the use efficiency of light can be further improved.
  • FIG. 6 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 3 of the present invention.
  • the configuration of the backlight module in the present embodiment will be described with reference to FIG.
  • the accommodation recess 20 b is provided by providing the bent portion 20 c on the substrate 20, and the LED 30 is mounted on the bottom surface of the accommodation recess 20 b.
  • a metal film 21c is provided by extending metal films 21a and 21b, and a reflector is configured by the metal film 21c.
  • FIG. 7 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 4 of the present invention.
  • the configuration of the backlight module in the present embodiment will be described with reference to FIG. Note that the backlight module described in this embodiment is a case where a three-color LED type white light-emitting diode is employed as a light source.
  • three LEDs 30a to 30c including a red light emitting diode, a green light emitting diode, and a blue light emitting diode are mounted on the mounting surface 20a of the substrate 20. ing.
  • Each of the LEDs 30a to 30c is bonded to the substrate 20 via die bond materials 31a to 31c, respectively, and is disposed close to each other.
  • Each of the portions of the substrate 20 where the LEDs 30 a to 30 c are mounted is provided with through holes so as to reach the mounting surface 20 a and the back surface, and each of the through holes is embedded with a metal material 26.
  • the portion on the mounting surface 20a of the substrate 20 where the LEDs 30a to 30c are mounted is provided with a light transmitting resin sealing portion 33, whereby the LEDs 30a to 30c are provided with the light transmitting resin sealing portion 33. It is sealed by.
  • the light transmissive resin sealing portion 33 is configured not to include phosphor particles.
  • the light emitted from each of the three LEDs 30a to 30c including the red light emitting diode, the green light emitting diode, and the blue light emitting diode is mixed, so that the white light is emitted from the light transmissive resin sealing portion 33. Will be emitted.
  • FIG. 8 is an exploded perspective view of the liquid crystal display device according to Embodiment 5 of the present invention.
  • the configuration of the liquid crystal display device according to the present embodiment will be described with reference to FIG.
  • the liquid crystal display device 1B in the present embodiment is different from the liquid crystal display device 1A in the first embodiment of the present invention described above only in the configuration of the illumination unit 10.
  • the illumination unit 10 includes a backlight module 10E in which a plurality of LEDs are incorporated in an array.
  • the structure of the vicinity of each LED incorporated in the backlight module 10E is the same as that of the first embodiment of the present invention described above.
  • a liquid crystal display device is illustrated as a representative example of an electronic device
  • a backlight module provided in the liquid crystal display device is illustrated as a representative example of a light source module.
  • other electronic devices to which the present invention is applied include lighting fixtures, projectors, projectors, advertising lights, etc., and light source modules to which the present invention is applied are provided in these.
  • a light source module is provided in these.
  • 1A, 1B liquid crystal display device 2 chassis, 3 optical sheet group, 3a diffusion sheet, 3b, 3c prism sheet, 3d polarizing reflective sheet, 4 liquid crystal panel, 5 bezel, 6 control unit, 10 lighting unit, 10A to 10E back Light module, 20 substrate, 20a mounting surface, 20b receiving recess, 20c bent portion, 21a to 21c, 22 metal film, 23 white resist, 24 damming resist, 25 insulating film, 26, 26a to 26c metal material, 30, 30a-30c LED, 31, 31a-31c die bond material, 32 bonding wire, 33 light transmissive resin sealing part, 34 phosphor particles, 35 light transmissive adhesive layer, 40 light guide plate, 40a first main surface, 40b first 2 main surfaces, 41 first recess, 42 second recess, 43 ring Groove, 50 air layer.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention porte sur un module de rétroéclairage (10A), lequel module comporte un substrat (20), une diode électroluminescente (30), une partie de scellement hermétique en résine transmettant la lumière (33) et une plaque de guidage de lumière (40). La partie de scellement hermétique en résine transmettant la lumière (33) scelle hermétiquement la diode électroluminescente (30) montée sur le substrat (20), et a une surface de lentille convexe. Une partie de rainure annulaire (43) jouant le rôle de partie de diffusion de la lumière et une première partie concave (41) ayant une surface de lentille concave sont disposées sur la première surface principale (40a) de la plaque de guidage de lumière (40). Une seconde partie concave (42) ayant une surface concave de forme grossièrement conique est disposée sur la seconde surface principale (40b) de la plaque de guidage de lumière (40) sur une section faisant face à la première partie concave (41). La partie de scellement hermétique en résine transmettant la lumière (33) et la plaque de guidage de lumière (40) sont fixées l'une à l'autre à l'aide d'une couche d'adhérence transmettant la lumière (35) disposée entre la surface de lentille convexe précédemment mentionnée et la surface de lentille concave précédemment mentionnée.
PCT/JP2012/059508 2011-04-13 2012-04-06 Module de source de lumière, et appareil électronique le comportant WO2012141094A1 (fr)

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