WO2012141094A1 - Light source module, and electronic apparatus provided with same - Google Patents

Light source module, and electronic apparatus provided with same Download PDF

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Publication number
WO2012141094A1
WO2012141094A1 PCT/JP2012/059508 JP2012059508W WO2012141094A1 WO 2012141094 A1 WO2012141094 A1 WO 2012141094A1 JP 2012059508 W JP2012059508 W JP 2012059508W WO 2012141094 A1 WO2012141094 A1 WO 2012141094A1
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WO
WIPO (PCT)
Prior art keywords
light
resin sealing
sealing portion
source module
substrate
Prior art date
Application number
PCT/JP2012/059508
Other languages
French (fr)
Japanese (ja)
Inventor
弘文 大澤
佳嗣 川東
寛樹 河邑
浩司 北村
光正 阪口
慶一 林田
哲之 竹本
一郎 梅川
秀悟 八木
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP2013509877A priority Critical patent/JPWO2012141094A1/en
Publication of WO2012141094A1 publication Critical patent/WO2012141094A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0018—Redirecting means on the surface of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
    • G02B6/0061—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to provide homogeneous light output intensity
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0038—Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light source module that can emit light toward the outside and an electronic apparatus including the same.
  • the direct type light source module has a configuration in which LEDs, which are light emitting elements, are arranged in an array immediately below the emission surface, and is distinguished from an edge light type light source module in which the LEDs are arranged on the side of the emission surface.
  • the direct light source module can be suitably used particularly as a backlight module of a liquid crystal display device, and is displayed on the liquid crystal panel by being disposed on the back side of the liquid surface panel that does not have a self-luminous function. Enables visual recognition of images.
  • references disclosing specific configurations of the direct type light source module include, for example, Japanese Patent Application Laid-Open No. 2007-149451 (Patent Document 1), Japanese Patent Application Laid-Open No. 2010-108919 (Patent Document 2), and Japanese Patent Application Laid-Open No. 2006-222413. Gazette (patent document 3) etc. are mentioned.
  • a light guide plate having an emission surface is disposed immediately above an LED having relatively high directivity, and at least a part of the light emitted from the LED is transferred to the light guide plate.
  • a device is devised so that the light emitted from the LED is evenly emitted from a larger emission surface toward a wide range.
  • the LED or a light-transmitting resin sealing portion that seals the LED and the light guide plate are used.
  • the direct type light source module disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2006-222413 has a structure in which the light-transmitting resin sealing portion and the light guide plate are fixed, so that the light-transmitting resin sealing portion There is only one interface as a lens surface between the light guide plate and the light guide plate, and the function of diffusing the light emitted from the LED and applied to the interface toward the side is low and sufficiently large.
  • the present invention has been made to solve the above-described problems, and allows light to be emitted uniformly from a larger emission surface over a wide range while improving the utilization efficiency of the light emitted from the light emitting element. It is an object of the present invention to provide a light source module that can be used and an electronic device including the same.
  • a light source module includes a light emitting element, a substrate having a mounting surface on which the light emitting element is mounted, and a light-transmitting resin seal that is provided on the mounting surface of the substrate and seals the light emitting element. And a first main surface located on the light transmissive resin sealing portion side and a second main surface located on the opposite side of the light transmissive resin sealing portion side, and the light transmissive resin seal A light guide plate disposed on the mounting surface side of the substrate so as to cover the stopper. The light guide plate diffuses the light incident from the first main surface of the portion facing the light-transmitting resin sealing portion by guiding the light inside, and emits the light outward from the second main surface. .
  • the light transmissive resin sealing portion has a convex lens surface on the surface of the portion of the light guide plate facing the first main surface.
  • the first main surface of the portion of the light guide plate facing the light transmissive resin sealing portion has a concave lens surface having a shape corresponding to the convex lens surface of the light transmissive resin sealing portion.
  • One recess is provided.
  • a second concave portion having a substantially conical concave surface is provided on the second main surface of the portion of the light guide plate facing the first concave portion.
  • a light diffusion portion for diffusing light is provided on the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion.
  • the light transmissive resin sealing portion and the light guide plate are fixed by being bonded by a light transmissive adhesive layer provided between the convex lens surface and the concave lens surface.
  • an accommodation recess for accommodating the light emitting element is provided on the mounting surface of the portion of the substrate where the light transmissive resin sealing portion is provided. preferable.
  • the surface of the housing recess is preferably covered with a metal film.
  • phosphor particles are dispersedly arranged inside the light-transmitting resin sealing portion.
  • an air layer is formed between the mounting surface of the substrate and the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion. It is preferable to be provided.
  • the light diffusion portion is a ring-shaped annular ring provided on the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion. It is preferable that it is constituted by a groove.
  • a white resist for reflecting light is provided on the mounting surface of the substrate where the light-transmitting resin sealing portion is not provided. Is preferred.
  • a reflection sheet for reflecting light is disposed on the mounting surface of the portion where the light-transmitting resin sealing portion of the substrate is not provided. It is preferable.
  • a through hole is provided in a portion of the substrate where the light emitting element is mounted, and the through hole is embedded with a metal material.
  • the main surface located on the opposite side of the mounting surface of the substrate is preferably covered with a metal film.
  • the light transmissive resin sealing portion is formed by potting.
  • a damming resist is provided on the mounting surface of the substrate so as to surround the portion where the light-transmitting resin sealing portion is provided. .
  • the light-transmitting resin sealing portion is preferably formed by injection molding.
  • An electronic device includes the light source module according to the present invention described above.
  • a light source module capable of emitting light uniformly from a larger emission surface toward a wide range while increasing the utilization efficiency of light emitted from a light emitting element, and an electronic apparatus including the same. Can be provided.
  • Embodiment 1 of this invention It is a disassembled perspective view of the liquid crystal display device in Embodiment 1 of this invention. It is sectional drawing of the backlight module in Embodiment 1 of this invention. It is a principal part expanded sectional view of the backlight module in Embodiment 1 of this invention. It is a principal part enlarged plan view of the backlight module in Embodiment 1 of this invention. It is a principal part expanded sectional view of the backlight module in Embodiment 2 of this invention. It is a principal part expanded sectional view of the backlight module in Embodiment 3 of this invention. It is a principal part expanded sectional view of the backlight module in Embodiment 4 of this invention. It is a disassembled perspective view of the liquid crystal display device in Embodiment 5 of this invention.
  • a liquid crystal display device is exemplified as an electronic device to which the present invention is applied, and a backlight module provided in the liquid crystal display device is illustrated as a light source module to which the present invention is applied. Do.
  • the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated individually.
  • FIG. 1 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention. First, the configuration of the liquid crystal display device according to the present embodiment will be described with reference to FIG.
  • the liquid crystal display device 1 ⁇ / b> A mainly includes a chassis 2, a lighting unit 10, an optical sheet group 3, a liquid crystal panel 4, a bezel 5, and a control unit 6.
  • the illumination unit 10, the optical sheet group 3, and the liquid crystal panel 4 are sandwiched and held by the chassis 2 and the bezel 5 in a state where these are laminated.
  • the chassis 2 is composed of a metal plate-like member formed by, for example, press molding or the like, and is a member that serves as a base to which each member constituting the liquid crystal display device 1A is assembled.
  • the illumination unit 10 is for irradiating light toward the liquid crystal panel 4 and is disposed immediately above the chassis 2.
  • the lighting unit 10 is configured by combining separated backlight modules 10A in an array, and LEDs 30 (see FIG. 2 and the like) as light emitting elements are incorporated in the individual backlight modules 10A. ing.
  • the ON / OFF operation of the LED 30 incorporated in the backlight module 10 ⁇ / b> A is controlled by the control unit 6. Details of the backlight module 10A will be described later.
  • the optical sheet group 3 is configured by laminating a plurality of optical sheets, and is interposed between the illumination unit 10 and the liquid crystal panel 4.
  • the optical sheet group 3 includes, for example, a diffusion sheet 3a, a pair of prism sheets 3b and 3c, and a polarizing reflection sheet 3d.
  • the diffusion sheet 3a is a member for diffusing the light emitted from the illumination unit 10 to make the irradiance distribution uniform, and is disposed immediately above the illumination unit 10.
  • a surface of a polyester film typified by a polyethylene terephthalate film or a surface obtained by roughening the surface of the polyester film using acrylic binder or the like is used.
  • the pair of prism sheets 3b and 3c is a member for condensing the light emitted from the diffusion sheet 3a, and is disposed so as to overlap two directly above the diffusion sheet 3a.
  • the pair of prism sheets 3b and 3c are overlapped so that the prism shapes provided on the main surfaces thereof are orthogonal to each other.
  • a material obtained by transferring a prism shape to a thermoplastic resin film a material obtained by transferring a prism shape using a UV curable resin to a polyester film typified by a polyethylene terephthalate film, or the like is used. .
  • the polarizing reflective sheet 3d is a member for transmitting a specific type of polarization component (p-polarization component or s-polarization component) contained in the light emitted from the prism sheet 3c and reflecting other polarization components.
  • the prism sheet 3c is disposed immediately above.
  • the reflected polarization component is reflected by a white resist 23 (see FIG. 2 and the like) described later to change the polarization state and re-irradiate the polarizing reflective sheet 3d.
  • a cholesteric liquid crystal film can be used as the polarizing reflective sheet 3d.
  • the liquid crystal panel 4 is a member including a display area for displaying an image, and is disposed immediately above the optical sheet group 3.
  • the liquid crystal panel 4 mainly includes an active matrix substrate, a color filter, a counter substrate, and a liquid crystal layer.
  • the liquid crystal layer is configured by sealing liquid crystal between an active matrix substrate and a counter substrate which are arranged to face each other.
  • a plurality of TFT (thin film transistor) elements are formed on the active matrix substrate in accordance with the pixels, and the ON / OFF operation of the plurality of TFT elements is controlled by the control unit 6.
  • the bezel 5 is composed of a frame-like member having a window portion for exposing the display area of the liquid crystal panel 4, and is disposed immediately above the display surface side of the liquid crystal panel 4.
  • the control unit 6 is a part for controlling the entire liquid crystal display device 1A, and controls, for example, driving of TFT elements provided in the liquid crystal panel 4, driving of the LEDs 30 included in the illumination unit 10, and the like.
  • FIG. 2 is a cross-sectional view of the backlight module in the present embodiment
  • FIG. 3 is an enlarged cross-sectional view of the main part of the backlight module
  • FIG. 4 is an enlarged plan view of a main part of the backlight module in the present embodiment.
  • the backlight module 10 ⁇ / b> A mainly includes a substrate 20, an LED 30, a light transmissive resin sealing portion 33, and a light guide plate 40.
  • Each of the backlight modules 10A is configured to have a flat, substantially rectangular parallelepiped outer shape as shown in FIG. 1, for example, and these are arranged in an array to constitute the illumination unit 10.
  • the board 20 is a member having a mounting surface 20a on which the LEDs 30 are mounted.
  • various wiring boards such as a printed wiring board (PWB) and a flexible wiring board (FPC) can be used. is there.
  • Metal films 21a, 21b, and 22 patterned in a predetermined shape are provided on the mounting surface 20a of the substrate 20 and the back surface that is the main surface located on the opposite side of the mounting surface 20a.
  • the metal films 21a and 21b provided on the mounting surface 20a of the substrate 20 function as wiring for electrical connection, and the metal film 22 provided on the back surface of the substrate 20 It functions as a heat sink for.
  • An insulating film 25 is further provided on the metal film 22 provided on the back side of the substrate 20.
  • the insulating film 25 is a film for preventing the metal film 22 from being exposed.
  • the LED 30 is bonded to the substrate 20 via a die bond material 31. Thereby, the LED 30 is mounted at a predetermined position on the mounting surface 20 a of the substrate 20.
  • the LED 30 is electrically connected to metal films 21 a and 21 b as wirings provided on the mounting surface 20 a side of the substrate 20 through bonding wires 32.
  • LED30 the thing of high brightness, long lifetime, and low power consumption is used suitably.
  • a through hole is provided so as to reach the mounting surface 20 a and the back surface, and the through hole is embedded with the metal material 26.
  • the metal material 26 filled in the through hole functions as a heat sink for heat dissipation, and is in contact with the metal film 22 provided on the back surface of the substrate 20. Thereby, the heat generated by driving the LED 30 is effectively dissipated by the metal material 26 and the metal film 22 as the heat sink.
  • a light-transmitting resin sealing portion 33 is provided on the mounting surface 20a of the substrate 20 and the portion where the LED 30 is mounted. Thus, the LED 30 is sealed by the light transmissive resin sealing portion 33.
  • the light-transmitting resin sealing portion 33 is formed to have a substantially hemispherical shape, for example, and thus has a convex lens surface on the surface of the portion facing the light guide plate 40.
  • the light-transmitting resin sealing portion 33 is formed, for example, by performing a potting process in which a liquid resin is applied to the substrate 20 after being mounted on the substrate 20 and then cured. Or after mounting LED30 on the board
  • the case where the light transmissive resin sealing portion 33 is formed by potting is illustrated, and the liquid resin wets and spreads on the substrate 20 during the potting.
  • a damming resist 24 is provided on the mounting surface 20a of the substrate 20 so as to surround the portion where the LED 30 is mounted.
  • Fluorescent particles 34 are dispersedly arranged inside the light transmissive resin sealing portion 33.
  • the phosphor particles 34 are irradiated with the light emitted from the LED 30 to change the wavelength of the light and emit the light as light of different wavelengths.
  • a blue light emitting diode is used as the LED 30, and yellow phosphor particles are used as the phosphor particles.
  • the light guide plate 40 is disposed on the mounting surface 20 a side of the substrate 20 so as to cover the light transmissive resin sealing portion 33.
  • the light guide plate 40 has a first main surface 40a located on the light transmissive resin sealing portion 33 side and a second main surface 40b located on the opposite side to the light transmissive resin sealing portion 33 side. Yes.
  • the first main surface 40a of the portion of the light guide plate 40 that faces the light-transmitting resin sealing portion 33 functions as an incident surface on which light emitted from the light-transmitting resin sealing portion 33 is incident.
  • the second main surface 40b of the light plate 40 functions as an exit surface that emits light diffused by being guided inside the light guide plate 40 toward the outside.
  • the first main surface 40 a of the portion of the light guide plate 40 facing the light transmissive resin sealing portion 33 has a concave lens surface having a shape corresponding to the convex lens surface of the light transmissive resin sealing portion 33.
  • a recess 41 is provided inside the first recess 41. Inside the first recess 41, a portion of the light transmissive resin sealing portion 33 near the light guide plate 40 is accommodated.
  • a predetermined gap is provided between the convex lens surface of the light transmissive resin sealing portion 33 and the concave lens surface of the light guide plate 40, and the light transmissive adhesive layer 35 fills the gap. Is provided.
  • the light transmissive adhesive layer 35 is for bonding and fixing the light transmissive resin sealing portion 33 and the light guide plate 40.
  • an adhesive agent used as the light-transmitting adhesive layer 35 an adhesive having a refractive index different from the refractive index of the light-transmitting resin sealing portion 33 and the light guide plate 40 is used as an adhesive agent used as the light-transmitting adhesive layer 35.
  • the second concave portion 42 having a substantially conical concave surface is provided on the second main surface 40b of the light guide plate 40 facing the first concave portion 41.
  • the second main surface 40b of the portion where the second recess 42 is provided is a part of the light incident on the inside of the light guide plate 40 via the first main surface 40a of the portion where the first recess 41 is provided.
  • it also functions as a reflective surface that reflects part of the light and guides it toward the side of the light guide plate 40.
  • the concave surface substantially conical the above-described reflection function can be enhanced, and a sufficient amount of light guided toward the side can be secured.
  • a plurality of annular grooves 43 are provided on the first main surface 40a of the portion of the light guide plate 40 that does not face the light-transmitting resin sealing portion 33 (that is, the portion where the first recess 41 is not provided).
  • the plurality of annular groove portions 43 are provided in a ring shape by being provided on concentric circles.
  • the first main surface 40a of the portion where the annular groove portion 43 is provided functions as a light diffusion portion for diffusing light, and is guided in the light guide plate 40 to reach the light diffusion portion. It is a part for radiating light from the second main surface 40b, which is an emission surface, by breaking the total reflection condition by diffusing a part of the part at the part.
  • the first main surface 40a of the portion of the light guide plate 40 that does not face the light transmissive resin sealing portion 33 that is, the first main surface 40a of the portion that functions as the light diffusion portion
  • the mounting surface 20a of the substrate 20 Is provided with an air layer 50. Further, the white resist 23 is provided on the mounting surface 20a of the substrate 20 where the light-transmitting resin sealing portion 33 is not provided.
  • the air layer 50 and the white resist 23 are used for reflecting the light emitted from the light guide plate 40 toward the substrate 20 side by being diffused by the above-described light diffusion portion and returning the light to the light guide plate 40 again.
  • a reflection sheet may be provided on the mounting surface 20a of the substrate 20.
  • the light emitted from the LED 30 passes through the light transmissive resin sealing portion 33 and reaches the light transmissive adhesive layer 35. Further, the light transmissive property is obtained. The light passes through the adhesive layer 35 and reaches the light guide plate 40. Therefore, the light emitted from the LED 30 is irradiated to the light guide plate 40 almost without any surplus, the generation of stray light is greatly reduced, and the light utilization efficiency can be greatly increased. .
  • the light transmissive resin sealing portion 33 that seals the LED 30 and the light guide plate 40 are bonded via the light transmissive adhesive layer 35. Therefore, there are two interfaces that function as lens surfaces between the light-transmitting resin sealing portion 33 and the light guide plate 40. Therefore, the light emitted from the LED is refracted at each of the two interfaces, so that the light can be greatly diffused laterally, and evenly from a sufficiently large emission surface to a wide range. Light can be emitted.
  • the backlight module 10A in the present embodiment it is possible to emit light uniformly from a larger emission surface toward a wide range while improving the utilization efficiency of the light emitted from the LED 30.
  • the liquid crystal display device 1A according to the present embodiment that includes the backlight module 10A it is possible to obtain a desired amount of light with a small number of LEDs 30, and at a low cost.
  • a liquid crystal display device that can be manufactured and has low power consumption can be obtained.
  • FIG. 5 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 2 of the present invention.
  • the configuration of the backlight module in the present embodiment will be described with reference to FIG.
  • the substrate 20 is provided with an accommodation recess 20b, and the LED 30 is mounted on the bottom surface of the accommodation recess 20b.
  • a metal film 21c is provided by extending metal films 21a and 21b, and a reflector is configured by the metal film 21c.
  • the backlight module 10B according to the present embodiment described above is used, the same effects as those described in the first embodiment of the present invention described above can be obtained. Furthermore, by using the backlight module 10B in the present embodiment, a distance can be provided between the exit surface of the LED 30 and the lens surface by the amount of the housing recess 20b in which the LED 30 is housed and disposed on the substrate 20. It becomes possible, and the light diffusibility in a lens surface can be improved. In addition, since it becomes possible to simultaneously form a reflector by covering the surface of the housing recess 20b with the metal film 21c, the use efficiency of light can be further improved.
  • FIG. 6 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 3 of the present invention.
  • the configuration of the backlight module in the present embodiment will be described with reference to FIG.
  • the accommodation recess 20 b is provided by providing the bent portion 20 c on the substrate 20, and the LED 30 is mounted on the bottom surface of the accommodation recess 20 b.
  • a metal film 21c is provided by extending metal films 21a and 21b, and a reflector is configured by the metal film 21c.
  • FIG. 7 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 4 of the present invention.
  • the configuration of the backlight module in the present embodiment will be described with reference to FIG. Note that the backlight module described in this embodiment is a case where a three-color LED type white light-emitting diode is employed as a light source.
  • three LEDs 30a to 30c including a red light emitting diode, a green light emitting diode, and a blue light emitting diode are mounted on the mounting surface 20a of the substrate 20. ing.
  • Each of the LEDs 30a to 30c is bonded to the substrate 20 via die bond materials 31a to 31c, respectively, and is disposed close to each other.
  • Each of the portions of the substrate 20 where the LEDs 30 a to 30 c are mounted is provided with through holes so as to reach the mounting surface 20 a and the back surface, and each of the through holes is embedded with a metal material 26.
  • the portion on the mounting surface 20a of the substrate 20 where the LEDs 30a to 30c are mounted is provided with a light transmitting resin sealing portion 33, whereby the LEDs 30a to 30c are provided with the light transmitting resin sealing portion 33. It is sealed by.
  • the light transmissive resin sealing portion 33 is configured not to include phosphor particles.
  • the light emitted from each of the three LEDs 30a to 30c including the red light emitting diode, the green light emitting diode, and the blue light emitting diode is mixed, so that the white light is emitted from the light transmissive resin sealing portion 33. Will be emitted.
  • FIG. 8 is an exploded perspective view of the liquid crystal display device according to Embodiment 5 of the present invention.
  • the configuration of the liquid crystal display device according to the present embodiment will be described with reference to FIG.
  • the liquid crystal display device 1B in the present embodiment is different from the liquid crystal display device 1A in the first embodiment of the present invention described above only in the configuration of the illumination unit 10.
  • the illumination unit 10 includes a backlight module 10E in which a plurality of LEDs are incorporated in an array.
  • the structure of the vicinity of each LED incorporated in the backlight module 10E is the same as that of the first embodiment of the present invention described above.
  • a liquid crystal display device is illustrated as a representative example of an electronic device
  • a backlight module provided in the liquid crystal display device is illustrated as a representative example of a light source module.
  • other electronic devices to which the present invention is applied include lighting fixtures, projectors, projectors, advertising lights, etc., and light source modules to which the present invention is applied are provided in these.
  • a light source module is provided in these.
  • 1A, 1B liquid crystal display device 2 chassis, 3 optical sheet group, 3a diffusion sheet, 3b, 3c prism sheet, 3d polarizing reflective sheet, 4 liquid crystal panel, 5 bezel, 6 control unit, 10 lighting unit, 10A to 10E back Light module, 20 substrate, 20a mounting surface, 20b receiving recess, 20c bent portion, 21a to 21c, 22 metal film, 23 white resist, 24 damming resist, 25 insulating film, 26, 26a to 26c metal material, 30, 30a-30c LED, 31, 31a-31c die bond material, 32 bonding wire, 33 light transmissive resin sealing part, 34 phosphor particles, 35 light transmissive adhesive layer, 40 light guide plate, 40a first main surface, 40b first 2 main surfaces, 41 first recess, 42 second recess, 43 ring Groove, 50 air layer.

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Abstract

A backlight module (10A) is provided with a substrate (20), an LED (30), a light-transmissive resin sealing part (33), and a light guide plate (40). The light-transmissive resin sealing part (33) seals the LED (30) mounted on the substrate (20) and has a convex lens surface. An annular groove part (43) functioning as a light diffusion part and a first concave part (41) having a concave lens surface are disposed on the first main surface (40a) of the light guide plate (40). A second concave part (42) having a roughly conically-shaped concave surface is disposed on the second main surface (40b) of the light guide plate (40) on a section facing the first concave part (41). The light-transmissive resin sealing part (33) and the light guide plate (40) are attached to one another by means of a light-transmissive adhesion layer (35) disposed between the aforementioned convex lens surface and the aforementioned concave lens surface.

Description

光源モジュールおよびこれを備えた電子機器LIGHT SOURCE MODULE AND ELECTRONIC DEVICE HAVING THE SAME
　本発明は、光を外部に向けて出射可能な光源モジュールおよびこれを備えた電子機器に関する。 The present invention relates to a light source module that can emit light toward the outside and an electronic apparatus including the same.
　近年、液晶表示装置に代表される画像表示装置のバックライトモジュールや照明器具等の電子機器に適用することが可能な光源モジュールとして、長寿命かつ低消費電力である高輝度ＬＥＤ（light-emitting　diode）を備えたものが注目されている。光源モジュールとしては、各種の構成のものが存在するが、その一つに面発光式光源モジュールとしてその使用が可能な直下型光源モジュールが知られている。 In recent years, as a light source module applicable to electronic devices such as backlight modules and lighting fixtures of image display devices typified by liquid crystal display devices, long-life and low-power high-intensity LEDs (light-emitting diodes) ) Is attracting attention. There are various types of light source modules, and one of them is a direct light source module that can be used as a surface-emitting light source module.
　直下型光源モジュールは、出射面の直下に発光素子であるＬＥＤがアレイ状に配置された構成のものであり、出射面の側方にＬＥＤが配置された構成のエッジライト型光源モジュールと区別されるものである。当該直下型光源モジュールは、特に液晶表示装置のバックライトモジュールとして好適にその利用が可能であり、自発光機能を有さない液表パネルの背面側に配置されることで液晶パネルに表示された画像の視認を可能にする。 The direct type light source module has a configuration in which LEDs, which are light emitting elements, are arranged in an array immediately below the emission surface, and is distinguished from an edge light type light source module in which the LEDs are arranged on the side of the emission surface. Is. The direct light source module can be suitably used particularly as a backlight module of a liquid crystal display device, and is displayed on the liquid crystal panel by being disposed on the back side of the liquid surface panel that does not have a self-luminous function. Enables visual recognition of images.
　この直下型光源モジュールの具体的な構成が開示された文献としては、たとえば特開２００７－１４９４５１号公報（特許文献１）や特開２０１０－１０８９１９号公報（特許文献２）、特開２００６－２２２４１３号公報（特許文献３）等が挙げられる。 References disclosing specific configurations of the direct type light source module include, for example, Japanese Patent Application Laid-Open No. 2007-149451 (Patent Document 1), Japanese Patent Application Laid-Open No. 2010-108919 (Patent Document 2), and Japanese Patent Application Laid-Open No. 2006-222413. Gazette (patent document 3) etc. are mentioned.
　これら文献に開示された直下型光源モジュールにあっては、比較的高い指向性を有するＬＥＤの直上に出射面を有する導光板を配置し、ＬＥＤから出射された光の少なくとも一部を当該導光板の内部において界面反射等させることで拡散させることより、当該ＬＥＤから出射された光をより大きい出射面から広い範囲に向けて均等に出射させるように工夫がなされている。 In the direct type light source modules disclosed in these documents, a light guide plate having an emission surface is disposed immediately above an LED having relatively high directivity, and at least a part of the light emitted from the LED is transferred to the light guide plate. By diffusing by interfacial reflection or the like in the interior of the LED, a device is devised so that the light emitted from the LED is evenly emitted from a larger emission surface toward a wide range.
特開２００７－１４９４５１号公報JP 2007-149451 A 特開２０１０－１０８９１９号公報JP 2010-108919 A 特開２００６－２２２４１３号公報JP 2006-222413 A
　しかしながら、上記特開２００７－１４９４５１号公報および特開２０１０－１０８９１９号公報に開示の直下型光源モジュールにあっては、ＬＥＤまたはこれを封止する光透過性樹脂封止部と導光板との間に空間が設けられており、ＬＥＤから出射された光が当該空間を経由して導光板に入射する構成であるため、多くの迷光が発生してしまい、光の利用効率が低い問題があった。そのため、所望の光量の光を得るためには、大きい消費電力が必要になってしまう問題があった。 However, in the direct type light source module disclosed in the above-mentioned Japanese Patent Application Laid-Open Nos. 2007-149451 and 2010-108919, the LED or a light-transmitting resin sealing portion that seals the LED and the light guide plate are used. There is a problem that light is emitted from the LED and enters the light guide plate via the space, so that a lot of stray light is generated and the light use efficiency is low. . Therefore, there has been a problem that a large amount of power is required to obtain a desired amount of light.
　これに対し、上記特開２００６－２２２４１３号公報に開示の直下型光源モジュールにあっては、ＬＥＤを封止する光透過性樹脂封止部と導光板とが固着された構造であるため、ＬＥＤから出射された光を空間等を介さずに直接的に導光板に取り込むことが可能であり、光の利用効率が高まる効果を得ることができる。 On the other hand, in the direct type light source module disclosed in JP-A-2006-222413, since the light-transmitting resin sealing portion for sealing the LED and the light guide plate are fixed, the LED The light emitted from the light can be directly taken into the light guide plate without a space or the like, and the effect of increasing the light use efficiency can be obtained.
　その反面、上記特開２００６－２２２４１３号公報に開示の直下型光源モジュールにあっては、光透過性樹脂封止部と導光板とが固着された構造であるため、光透過性樹脂封止部と導光板との間にレンズ面としての界面が１つしか存在しないことになり、ＬＥＤから出射されて当該界面に照射された光を側方に向けて拡散させる機能が低く、十分に大きい出射面から広い範囲に向けて均等に光を出射させることが困難になる問題があった。その結果、所望の光量の光を得るためには、より多くのＬＥＤが必要とって製造コストが増大するといった問題や、ＬＥＤの数が増加することにより、やはり消費電力が大きくなってしまう問題があった。 On the other hand, the direct type light source module disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2006-222413 has a structure in which the light-transmitting resin sealing portion and the light guide plate are fixed, so that the light-transmitting resin sealing portion There is only one interface as a lens surface between the light guide plate and the light guide plate, and the function of diffusing the light emitted from the LED and applied to the interface toward the side is low and sufficiently large. There has been a problem that it is difficult to emit light uniformly over a wide range from the surface. As a result, in order to obtain a desired amount of light, there is a problem that more LEDs are required and the manufacturing cost increases, and the number of LEDs increases, which also increases power consumption. there were.
　したがって、本発明は、上述した問題点を解決すべくなされたものであり、発光素子から出射された光の利用効率を高めつつ、より大きい出射面から広い範囲に向けて均等に光を出射させることが可能な光源モジュールおよびこれを備えた電子機器を提供することを目的とする。 Therefore, the present invention has been made to solve the above-described problems, and allows light to be emitted uniformly from a larger emission surface over a wide range while improving the utilization efficiency of the light emitted from the light emitting element. It is an object of the present invention to provide a light source module that can be used and an electronic device including the same.
　本発明に基づく光源モジュールは、発光素子と、上記発光素子が実装された実装面を有する基板と、上記基板の上記実装面上に設けられ、上記発光素子を封止する光透過性樹脂封止部と、上記光透過性樹脂封止部側に位置する第１主表面および上記光透過性樹脂封止部側とは反対側に位置する第２主表面を有し、上記光透過性樹脂封止部を覆うように上記基板の上記実装面側に配設された導光板とを備えている。上記導光板は、上記光透過性樹脂封止部に面する部分の上記第１主表面から入射した光を内部において導光することで拡散させて上記第２主表面から外部に向けて出射する。上記光透過性樹脂封止部は、上記導光板の上記第１主表面に面する部分の表面に凸状レンズ面を有している。上記導光板の上記光透過性樹脂封止部に面する部分の上記第１主表面には、上記光透過性樹脂封止部の上記凸状レンズ面に対応した形状の凹状レンズ面を有する第１凹部が設けられている。上記導光板の上記第１凹部に対向する部分の上記第２主表面には、略円錐状の凹面を有する第２凹部が設けられている。上記導光板の上記光透過性樹脂封止部に面しない部分の上記第１主表面には、光を拡散させるための光拡散部が設けられている。上記光透過性樹脂封止部と上記導光板とは、上記凸状レンズ面と上記凹状レンズ面との間に設けられた光透過性接着層によって接着されることで固定されている。 A light source module according to the present invention includes a light emitting element, a substrate having a mounting surface on which the light emitting element is mounted, and a light-transmitting resin seal that is provided on the mounting surface of the substrate and seals the light emitting element. And a first main surface located on the light transmissive resin sealing portion side and a second main surface located on the opposite side of the light transmissive resin sealing portion side, and the light transmissive resin seal A light guide plate disposed on the mounting surface side of the substrate so as to cover the stopper. The light guide plate diffuses the light incident from the first main surface of the portion facing the light-transmitting resin sealing portion by guiding the light inside, and emits the light outward from the second main surface. . The light transmissive resin sealing portion has a convex lens surface on the surface of the portion of the light guide plate facing the first main surface. The first main surface of the portion of the light guide plate facing the light transmissive resin sealing portion has a concave lens surface having a shape corresponding to the convex lens surface of the light transmissive resin sealing portion. One recess is provided. A second concave portion having a substantially conical concave surface is provided on the second main surface of the portion of the light guide plate facing the first concave portion. A light diffusion portion for diffusing light is provided on the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion. The light transmissive resin sealing portion and the light guide plate are fixed by being bonded by a light transmissive adhesive layer provided between the convex lens surface and the concave lens surface.
　上記本発明に基づく光源モジュールにあっては、上記基板の上記光透過性樹脂封止部が設けられた部分の上記実装面に、上記発光素子が収容される収容凹部が設けられていることが好ましい。 In the light source module according to the present invention, an accommodation recess for accommodating the light emitting element is provided on the mounting surface of the portion of the substrate where the light transmissive resin sealing portion is provided. preferable.
　上記本発明に基づく光源モジュールにあっては、上記収容凹部の表面が、金属膜によって覆われていることが好ましい。 In the light source module according to the present invention, the surface of the housing recess is preferably covered with a metal film.
　上記本発明に基づく光源モジュールにあっては、上記光透過性樹脂封止部の内部に蛍光体粒子が分散配置されていることが好ましい。 In the light source module according to the present invention, it is preferable that phosphor particles are dispersedly arranged inside the light-transmitting resin sealing portion.
　上記本発明に基づく光源モジュールにあっては、上記基板の上記実装面と、上記導光板の上記光透過性樹脂封止部に面しない部分の上記第１主表面との間に、空気層が設けられていることが好ましい。 In the light source module according to the present invention, an air layer is formed between the mounting surface of the substrate and the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion. It is preferable to be provided.
　上記本発明に基づく光源モジュールにあっては、上記光拡散部が、上記導光板の上記光透過性樹脂封止部に面しない部分の上記第１主表面に設けられた輪帯化された環状溝部にて構成されていることが好ましい。 In the light source module according to the present invention, the light diffusion portion is a ring-shaped annular ring provided on the first main surface of the light guide plate that does not face the light-transmitting resin sealing portion. It is preferable that it is constituted by a groove.
　上記本発明に基づく光源モジュールにあっては、上記基板の上記光透過性樹脂封止部が設けられていない部分の上記実装面上に、光を反射するための白色レジストが設けられていることが好ましい。 In the light source module according to the present invention, a white resist for reflecting light is provided on the mounting surface of the substrate where the light-transmitting resin sealing portion is not provided. Is preferred.
　上記本発明に基づく光源モジュールにあっては、上記基板の上記光透過性樹脂封止部が設けられていない部分の上記実装面上に、光を反射するための反射シートが配設されていることが好ましい。 In the light source module according to the present invention, a reflection sheet for reflecting light is disposed on the mounting surface of the portion where the light-transmitting resin sealing portion of the substrate is not provided. It is preferable.
　上記本発明に基づく光源モジュールにあっては、上記基板の上記発光素子が搭載された部分に貫通孔が設けられるとともに、当該貫通孔が金属材料によって埋め込まれていることが好ましい。 In the light source module according to the present invention, it is preferable that a through hole is provided in a portion of the substrate where the light emitting element is mounted, and the through hole is embedded with a metal material.
　上記本発明に基づく光源モジュールにあっては、上記基板の上記実装面とは反対側に位置する主表面が、金属膜によって覆われていることが好ましい。 In the light source module according to the present invention, the main surface located on the opposite side of the mounting surface of the substrate is preferably covered with a metal film.
　上記本発明に基づく光源モジュールにあっては、上記光透過性樹脂封止部が、ポッティング加工によって形成されたものであることが好ましい。 In the light source module according to the present invention, it is preferable that the light transmissive resin sealing portion is formed by potting.
　上記本発明に基づく光源モジュールにあっては、上記光透過性樹脂封止部が設けられた部分を取り囲むように、上記基板の上記実装面上に堰き止め用レジストが設けられていることが好ましい。 In the light source module according to the present invention, it is preferable that a damming resist is provided on the mounting surface of the substrate so as to surround the portion where the light-transmitting resin sealing portion is provided. .
　上記本発明に基づく光源モジュールにあっては、上記光透過性樹脂封止部が、射出成形加工によって形成されたものであることが好ましい。 In the light source module according to the present invention, the light-transmitting resin sealing portion is preferably formed by injection molding.
　本発明に基づく電子機器は、上述した上記本発明に基づく光源モジュールを備えてなるものである。 An electronic device according to the present invention includes the light source module according to the present invention described above.
　本発明によれば、発光素子から出射された光の利用効率を高めつつ、より大きい出射面から広い範囲に向けて均等に光を出射させることが可能な光源モジュールおよびこれを備えた電子機器を提供することができる。 According to the present invention, there is provided a light source module capable of emitting light uniformly from a larger emission surface toward a wide range while increasing the utilization efficiency of light emitted from a light emitting element, and an electronic apparatus including the same. Can be provided.
本発明の実施の形態１における液晶表示装置の分解斜視図である。It is a disassembled perspective view of the liquid crystal display device in Embodiment 1 of this invention. 本発明の実施の形態１におけるバックライトモジュールの断面図である。It is sectional drawing of the backlight module in Embodiment 1 of this invention. 本発明の実施の形態１におけるバックライトモジュールの要部拡大断面図である。It is a principal part expanded sectional view of the backlight module in Embodiment 1 of this invention. 本発明の実施の形態１におけるバックライトモジュールの要部拡大平面図である。It is a principal part enlarged plan view of the backlight module in Embodiment 1 of this invention. 本発明の実施の形態２におけるバックライトモジュールの要部拡大断面図である。It is a principal part expanded sectional view of the backlight module in Embodiment 2 of this invention. 本発明の実施の形態３におけるバックライトモジュールの要部拡大断面図である。It is a principal part expanded sectional view of the backlight module in Embodiment 3 of this invention. 本発明の実施の形態４におけるバックライトモジュールの要部拡大断面図である。It is a principal part expanded sectional view of the backlight module in Embodiment 4 of this invention. 本発明の実施の形態５における液晶表示装置の分解斜視図である。It is a disassembled perspective view of the liquid crystal display device in Embodiment 5 of this invention.
　以下、本発明の実施の形態について、図を参照して詳細に説明する。以下に示す実施の形態においては、本発明が適用された電子機器として液晶表示装置を、本発明が適用された光源モジュールとして当該液晶表示装置に具備されるバックライトモジュールをそれぞれ例示して説明を行なう。なお、以下に示す実施の形態においては、同一のまたは共通する部分に図中同一の符号を付し、その説明は個別には繰り返さない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments described below, a liquid crystal display device is exemplified as an electronic device to which the present invention is applied, and a backlight module provided in the liquid crystal display device is illustrated as a light source module to which the present invention is applied. Do. In the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated individually.
　（実施の形態１）
　図１は、本発明の実施の形態における液晶表示装置の分解斜視図である。まず、この図１を参照して、本実施の形態における液晶表示装置の構成について説明する。 (Embodiment 1)
FIG. 1 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention. First, the configuration of the liquid crystal display device according to the present embodiment will be described with reference to FIG.
　図１に示すように、液晶表示装置１Ａは、シャーシ２と、照明ユニット１０と、光学シート群３と、液晶パネル４と、ベゼル５と、制御部６とを主として備えている。照明ユニット１０、光学シート群３および液晶パネル４は、これらが積層された状態でシャーシ２とベゼル５とによって挟み込まれて保持されている。 As shown in FIG. 1, the liquid crystal display device 1 </ b> A mainly includes a chassis 2, a lighting unit 10, an optical sheet group 3, a liquid crystal panel 4, a bezel 5, and a control unit 6. The illumination unit 10, the optical sheet group 3, and the liquid crystal panel 4 are sandwiched and held by the chassis 2 and the bezel 5 in a state where these are laminated.
　シャーシ２は、たとえばプレス成形等を行なうことによって形成された金属製の板状の部材にて構成されており、液晶表示装置１Ａを構成する各部材が組付けられるベースとなる部材である。 The chassis 2 is composed of a metal plate-like member formed by, for example, press molding or the like, and is a member that serves as a base to which each member constituting the liquid crystal display device 1A is assembled.
　照明ユニット１０は、液晶パネル４に向けて光を照射するためのものであり、シャーシ２の直上に配置される。照明ユニット１０は、固片化されたバックライトモジュール１０Ａがアレイ状に組み合わされることで構成されたものからなり、個々のバックライトモジュール１０Ａに発光素子としてのＬＥＤ３０（図２等参照）が組み込まれている。バックライトモジュール１０Ａに組み込まれたＬＥＤ３０は、制御部６によってそのＯＮ／ＯＦＦ動作が制御される。なお、バックライトモジュール１０Ａの詳細については、後述することとする。 The illumination unit 10 is for irradiating light toward the liquid crystal panel 4 and is disposed immediately above the chassis 2. The lighting unit 10 is configured by combining separated backlight modules 10A in an array, and LEDs 30 (see FIG. 2 and the like) as light emitting elements are incorporated in the individual backlight modules 10A. ing. The ON / OFF operation of the LED 30 incorporated in the backlight module 10 </ b> A is controlled by the control unit 6. Details of the backlight module 10A will be described later.
　光学シート群３は、複数の光学シートが積層されることで構成されており、照明ユニット１０と液晶パネル４との間に介装されている。光学シート群３は、たとえば、拡散シート３ａと、一対のプリズムシート３ｂ，３ｃと、偏光性反射シート３ｄとによって構成される。 The optical sheet group 3 is configured by laminating a plurality of optical sheets, and is interposed between the illumination unit 10 and the liquid crystal panel 4. The optical sheet group 3 includes, for example, a diffusion sheet 3a, a pair of prism sheets 3b and 3c, and a polarizing reflection sheet 3d.
　拡散シート３ａは、照明ユニット１０から出射された光を拡散させてその放射照度分布の均一化を図るための部材であり、照明ユニット１０の直上に配置される。拡散シート３ａとしては、ポリエチレンテレフタラートフィルムに代表されるポリエステルフィルムの表面を粗面化処理したものや、当該ポリエステルフィルムの表面にアクリルビーズをバインダを用いて付着させたもの等が用いられる。 The diffusion sheet 3a is a member for diffusing the light emitted from the illumination unit 10 to make the irradiance distribution uniform, and is disposed immediately above the illumination unit 10. As the diffusion sheet 3a, a surface of a polyester film typified by a polyethylene terephthalate film or a surface obtained by roughening the surface of the polyester film using acrylic binder or the like is used.
　一対のプリズムシート３ｂ，３ｃは、拡散シート３ａから出射された光を集光するための部材であり、拡散シート３ａの直上に２枚重ねて配置される。ここで、一対のプリズムシート３ｂ，３ｃは、そのそれぞれの主面に付与されたプリズム形状が互いに直交するように重ね合わされる。プリズムシート３ｂ，３ｃとしては、たとえば熱可塑性樹脂フィルムにプリズム形状を転写したものや、ポリエチレンテレフタラートフィルムに代表されるポリエステルフィルムに紫外線硬化型樹脂を用いてプリズム形状を転写したもの等が用いられる。 The pair of prism sheets 3b and 3c is a member for condensing the light emitted from the diffusion sheet 3a, and is disposed so as to overlap two directly above the diffusion sheet 3a. Here, the pair of prism sheets 3b and 3c are overlapped so that the prism shapes provided on the main surfaces thereof are orthogonal to each other. As the prism sheets 3b and 3c, for example, a material obtained by transferring a prism shape to a thermoplastic resin film, a material obtained by transferring a prism shape using a UV curable resin to a polyester film typified by a polyethylene terephthalate film, or the like is used. .
　偏光性反射シート３ｄは、プリズムシート３ｃから出射された光に含まれる特定の種類の偏光成分（ｐ偏光成分またはｓ偏光成分）を透過させてそれ以外の偏光成分を反射させるための部材であり、プリズムシート３ｃの直上に配置される。この偏光性反射シート３ｄを設けることにより、反射させた偏光成分を後述する白色レジスト２３（図２等参照）等で反射させることで偏光状態を変化させて偏光性反射シート３ｄに再照射することが可能になり、その結果、光の利用効率を高めることができる。偏光性反射シート３ｄとしては、たとえばコレステリック液晶フィルム等が利用できる。 The polarizing reflective sheet 3d is a member for transmitting a specific type of polarization component (p-polarization component or s-polarization component) contained in the light emitted from the prism sheet 3c and reflecting other polarization components. The prism sheet 3c is disposed immediately above. By providing the polarizing reflective sheet 3d, the reflected polarization component is reflected by a white resist 23 (see FIG. 2 and the like) described later to change the polarization state and re-irradiate the polarizing reflective sheet 3d. As a result, the light use efficiency can be increased. For example, a cholesteric liquid crystal film can be used as the polarizing reflective sheet 3d.
　液晶パネル４は、画像を表示するため表示領域を含む部材であり、光学シート群３の直上に配置される。液晶パネル４は、主としてアクティブマトリックス基板、カラーフィルタ、対向基板および液晶層を含んでいる。このうち、液晶層は、対向配置されたアクティブマトリックス基板および対向基板の間に液晶が封入されることで構成されている。アクティブマトリックス基板には、複数のＴＦＴ（thin　film　transistor）素子が画素に応じて形成されており、当該複数のＴＦＴ素子は、制御部６によってそのＯＮ／ＯＦＦ動作が制御される。 The liquid crystal panel 4 is a member including a display area for displaying an image, and is disposed immediately above the optical sheet group 3. The liquid crystal panel 4 mainly includes an active matrix substrate, a color filter, a counter substrate, and a liquid crystal layer. Among these, the liquid crystal layer is configured by sealing liquid crystal between an active matrix substrate and a counter substrate which are arranged to face each other. A plurality of TFT (thin film transistor) elements are formed on the active matrix substrate in accordance with the pixels, and the ON / OFF operation of the plurality of TFT elements is controlled by the control unit 6.
　ベゼル５は、液晶パネル４の表示領域を露出させるための窓部を有する額縁状の部材にて構成されており、液晶パネル４の表示面側の直上に配置される。 The bezel 5 is composed of a frame-like member having a window portion for exposing the display area of the liquid crystal panel 4, and is disposed immediately above the display surface side of the liquid crystal panel 4.
　制御部６は、液晶表示装置１Ａの全体を制御するための部位であり、たとえば液晶パネル４に設けられたＴＦＴ素子の駆動の制御や照明ユニット１０に含まれるＬＥＤ３０の駆動の制御等を行なう。 The control unit 6 is a part for controlling the entire liquid crystal display device 1A, and controls, for example, driving of TFT elements provided in the liquid crystal panel 4, driving of the LEDs 30 included in the illumination unit 10, and the like.
　図２は、本実施の形態におけるバックライトモジュールの断面図であり、図３は、当該バックライトモジュールの要部拡大断面図である。また、図４は、本実施の形態におけるバックライトモジュールの要部拡大平面図である。次に、これら図２ないし図４を参照して、本実施の形態におけるバックライトモジュールの構成について詳細に説明する。なお、本実施の形態において示すバックライトモジュールは、光源として、蛍光体式の擬似白色発光ダイオードを採用した場合のものである。 FIG. 2 is a cross-sectional view of the backlight module in the present embodiment, and FIG. 3 is an enlarged cross-sectional view of the main part of the backlight module. FIG. 4 is an enlarged plan view of a main part of the backlight module in the present embodiment. Next, the configuration of the backlight module in the present embodiment will be described in detail with reference to FIGS. Note that the backlight module described in this embodiment is a case where a phosphor-type pseudo white light-emitting diode is employed as a light source.
　図２ないし図４に示すように、バックライトモジュール１０Ａは、基板２０と、ＬＥＤ３０と、光透過性樹脂封止部３３と、導光板４０とを主として備えている。バックライトモジュール１０Ａの各々は、たとえば図１に示すように偏平な略直方体形状の外形を有するように構成され、これらがアレイ状に配置されることで照明ユニット１０を構成している。 2 to 4, the backlight module 10 </ b> A mainly includes a substrate 20, an LED 30, a light transmissive resin sealing portion 33, and a light guide plate 40. Each of the backlight modules 10A is configured to have a flat, substantially rectangular parallelepiped outer shape as shown in FIG. 1, for example, and these are arranged in an array to constitute the illumination unit 10.
　基板２０は、ＬＥＤ３０が実装される実装面２０ａを有する部材であり、たとえばプリント配線板（ＰＷＢ：printed　wiring　board）やフレキシブル配線基板（ＦＰＣ：Flexible　printed　circuits）等、種々の配線基板が使用可能である。基板２０の実装面２０ａおよび当該実装面２０ａとは反対側に位置する主表面である裏面には、所定の形状にパターン化された金属膜２１ａ，２１ｂ，２２が設けられている。 The board 20 is a member having a mounting surface 20a on which the LEDs 30 are mounted. For example, various wiring boards such as a printed wiring board (PWB) and a flexible wiring board (FPC) can be used. is there. Metal films 21a, 21b, and 22 patterned in a predetermined shape are provided on the mounting surface 20a of the substrate 20 and the back surface that is the main surface located on the opposite side of the mounting surface 20a.
　このうち、基板２０の実装面２０ａ上に設けられた金属膜２１ａ，２１ｂは、電気的接続のための配線として機能するものであり、基板２０の裏面上に設けられた金属膜２２は、放熱のためのヒートシンクとして機能するものである。なお、基板２０の裏面側に設けられた金属膜２２上には、さらに絶縁膜２５が設けられている。当該絶縁膜２５は、金属膜２２を露出させないための膜である。 Among these, the metal films 21a and 21b provided on the mounting surface 20a of the substrate 20 function as wiring for electrical connection, and the metal film 22 provided on the back surface of the substrate 20 It functions as a heat sink for. An insulating film 25 is further provided on the metal film 22 provided on the back side of the substrate 20. The insulating film 25 is a film for preventing the metal film 22 from being exposed.
　ＬＥＤ３０は、基板２０に対してダイボンド材３１を介して接合されている。これにより、基板２０の実装面２０ａの所定位置にＬＥＤ３０が実装されている。また、ＬＥＤ３０は、ボンディングワイヤ３２を介して基板２０の実装面２０ａ側に設けられた配線としての金属膜２１ａ，２１ｂに電気的に接続されている。ここで、ＬＥＤ３０としては、高輝度かつ高寿命で低消費電力のものが好適に使用される。 The LED 30 is bonded to the substrate 20 via a die bond material 31. Thereby, the LED 30 is mounted at a predetermined position on the mounting surface 20 a of the substrate 20. The LED 30 is electrically connected to metal films 21 a and 21 b as wirings provided on the mounting surface 20 a side of the substrate 20 through bonding wires 32. Here, as LED30, the thing of high brightness, long lifetime, and low power consumption is used suitably.
　基板２０のＬＥＤ３０が実装された部分には、実装面２０ａおよび裏面に達するように貫通孔が設けられており、当該貫通孔が金属材料２６によって埋め込まれている。当該貫通孔に充填された金属材料２６は、放熱のためのヒートシンクとして機能するものであり、基板２０の裏面に設けられた金属膜２２に接している。これにより、ＬＥＤ３０が駆動することで生じる熱が、ヒートシンクとしての金属材料２６および金属膜２２によって効果的に放熱されることになる。 In the portion of the substrate 20 where the LED 30 is mounted, a through hole is provided so as to reach the mounting surface 20 a and the back surface, and the through hole is embedded with the metal material 26. The metal material 26 filled in the through hole functions as a heat sink for heat dissipation, and is in contact with the metal film 22 provided on the back surface of the substrate 20. Thereby, the heat generated by driving the LED 30 is effectively dissipated by the metal material 26 and the metal film 22 as the heat sink.
　基板２０の実装面２０ａ上であってかつＬＥＤ３０が実装された部分には、光透過性樹脂封止部３３が設けられている。これにより、ＬＥＤ３０は、光透過性樹脂封止部３３によって封止されている。光透過性樹脂封止部３３は、たとえば略半球体形状を有するように形成されることにより、導光板４０に面する部分の表面に凸状レンズ面を有している。 A light-transmitting resin sealing portion 33 is provided on the mounting surface 20a of the substrate 20 and the portion where the LED 30 is mounted. Thus, the LED 30 is sealed by the light transmissive resin sealing portion 33. The light-transmitting resin sealing portion 33 is formed to have a substantially hemispherical shape, for example, and thus has a convex lens surface on the surface of the portion facing the light guide plate 40.
　ここで、光透過性樹脂封止部３３としては、たとえば基板２０上にＬＥＤ３０を実装した後に液状樹脂を基板２０に塗布してこれを硬化させるポッティング加工を行なうことによって形成されたものであってもよいし、基板２０上にＬＥＤ３０を実装した後にこれを金型にセットして液状樹脂を流し込んでこれを硬化させる射出成形加工を行なうことによって形成されたものであってもよい。さらには、上記方法以外にも、スクリーン印刷法を採用して光透過性樹脂封止部３３を形成することも可能である。 Here, the light-transmitting resin sealing portion 33 is formed, for example, by performing a potting process in which a liquid resin is applied to the substrate 20 after being mounted on the substrate 20 and then cured. Or after mounting LED30 on the board | substrate 20, this may be set to a metal mold | die, and it may be formed by performing the injection molding process which pours liquid resin and hardens this. Furthermore, in addition to the above method, it is also possible to form the light-transmitting resin sealing portion 33 by adopting a screen printing method.
　なお、本実施の形態においては、光透過性樹脂封止部３３がポッティング加工によって形成されたものである場合を例示しており、そのポッティング加工の際に液状樹脂が基板２０上において濡れ広がることを防止するための堰き止め用レジスト２４が、ＬＥＤ３０が実装された部分を取り囲むように基板２０の実装面２０ａ上に設けられている。光透過性樹脂封止部３３を射出成形加工によって形成する場合には、当該堰き止め用レジスト２４を設ける必要はない。 In the present embodiment, the case where the light transmissive resin sealing portion 33 is formed by potting is illustrated, and the liquid resin wets and spreads on the substrate 20 during the potting. A damming resist 24 is provided on the mounting surface 20a of the substrate 20 so as to surround the portion where the LED 30 is mounted. When the light-transmitting resin sealing portion 33 is formed by injection molding, it is not necessary to provide the damming resist 24.
　光透過性樹脂封止部３３の内部には、蛍光体粒子３４が分散配置されている。蛍光体粒子３４は、ＬＥＤ３０から発せられた光が照射されることでこれを波長変換して異なる波長の光としてこれを出射するものである。 Fluorescent particles 34 are dispersedly arranged inside the light transmissive resin sealing portion 33. The phosphor particles 34 are irradiated with the light emitted from the LED 30 to change the wavelength of the light and emit the light as light of different wavelengths.
　本実施の形態においては、ＬＥＤ３０として青色発光ダイオードが使用され、蛍光体粒子として黄色蛍光体粒子が用いられる。これにより、本実施の形態においては、青色発光ダイオードであるＬＥＤ３０から発せられた光の一部が黄色蛍光体粒子である蛍光体粒子３４に照射されることになり、ＬＥＤ３０から発せられた光と、蛍光体粒子３４にて波長変換されて発せられた光とが混色されることにより、光透過性樹脂封止部３３から白色光が出射されることになる。 In this embodiment, a blue light emitting diode is used as the LED 30, and yellow phosphor particles are used as the phosphor particles. Thereby, in this Embodiment, a part of light emitted from LED30 which is a blue light emitting diode will be irradiated to the fluorescent substance particle 34 which is yellow fluorescent substance particle, and the light emitted from LED30 and The white light is emitted from the light-transmitting resin sealing portion 33 by being mixed with the light emitted from the phosphor particles 34 after wavelength conversion.
　導光板４０は、光透過性樹脂封止部３３を覆うように基板２０の実装面２０ａ側に配設されている。導光板４０は、光透過性樹脂封止部３３側に位置する第１主表面４０ａと、光透過性樹脂封止部３３側とは反対側に位置する第２主表面４０ｂとを有している。このうち、導光板４０の光透過性樹脂封止部３３に面する部分の第１主表面４０ａは、光透過性樹脂封止部３３から出射された光が入射する入射面として機能し、導光板４０の第２主表面４０ｂは、導光板４０の内部において導光されることで拡散された光を外部に向けて出射する出射面として機能する。 The light guide plate 40 is disposed on the mounting surface 20 a side of the substrate 20 so as to cover the light transmissive resin sealing portion 33. The light guide plate 40 has a first main surface 40a located on the light transmissive resin sealing portion 33 side and a second main surface 40b located on the opposite side to the light transmissive resin sealing portion 33 side. Yes. Of these, the first main surface 40a of the portion of the light guide plate 40 that faces the light-transmitting resin sealing portion 33 functions as an incident surface on which light emitted from the light-transmitting resin sealing portion 33 is incident. The second main surface 40b of the light plate 40 functions as an exit surface that emits light diffused by being guided inside the light guide plate 40 toward the outside.
　導光板４０の光透過性樹脂封止部３３に面する部分の第１主表面４０ａには、光透過性樹脂封止部３３の凸状レンズ面に対応した形状の凹状レンズ面を有する第１凹部４１が設けられている。当該第１凹部４１の内部には、光透過性樹脂封止部３３の導光板４０寄りの部分が収容配置されている。 The first main surface 40 a of the portion of the light guide plate 40 facing the light transmissive resin sealing portion 33 has a concave lens surface having a shape corresponding to the convex lens surface of the light transmissive resin sealing portion 33. A recess 41 is provided. Inside the first recess 41, a portion of the light transmissive resin sealing portion 33 near the light guide plate 40 is accommodated.
　光透過性樹脂封止部３３の凸状レンズ面と導光板４０の凹状レンズ面との間には、所定の隙間が設けられており、当該隙間を充填するように光透過性接着層３５が設けられている。当該光透過性接着層３５は、光透過性樹脂封止部３３と導光板４０とを接着固定するためのものである。なお、光透過性接着層３５となる接着剤としては、光透過性樹脂封止部３３の屈折率および導光板４０の屈折率と異なる屈折率を有するものが使用される。 A predetermined gap is provided between the convex lens surface of the light transmissive resin sealing portion 33 and the concave lens surface of the light guide plate 40, and the light transmissive adhesive layer 35 fills the gap. Is provided. The light transmissive adhesive layer 35 is for bonding and fixing the light transmissive resin sealing portion 33 and the light guide plate 40. In addition, as an adhesive agent used as the light-transmitting adhesive layer 35, an adhesive having a refractive index different from the refractive index of the light-transmitting resin sealing portion 33 and the light guide plate 40 is used.
　導光板４０の第１凹部４１に対向する部分の第２主表面４０ｂには、略円錐状の凹面を有する第２凹部４２が設けられている。当該第２凹部４２が設けられた部分の第２主表面４０ｂは、第１凹部４１が設けられた部分の第１主表面４０ａを介して導光板４０の内部に入射された光の一部を透過して出射する出射面として機能するとともに、当該光の一部を反射して導光板４０の側方に向けて導光する反射面としても機能する。ここで、当該凹面を略円錐状とすることにより、上述した反射機能を高めることが可能になり、側方に向けて導光される光の光量を十分に確保することが可能になる。 The second concave portion 42 having a substantially conical concave surface is provided on the second main surface 40b of the light guide plate 40 facing the first concave portion 41. The second main surface 40b of the portion where the second recess 42 is provided is a part of the light incident on the inside of the light guide plate 40 via the first main surface 40a of the portion where the first recess 41 is provided. In addition to functioning as an exit surface that transmits and exits, it also functions as a reflective surface that reflects part of the light and guides it toward the side of the light guide plate 40. Here, by making the concave surface substantially conical, the above-described reflection function can be enhanced, and a sufficient amount of light guided toward the side can be secured.
　導光板４０の光透過性樹脂封止部３３に面しない部分（すなわち、第１凹部４１が設けられていない部分）の第１主表面４０ａには、環状溝部４３が複数設けられている。これら複数の環状溝部４３は、同心円上に設けられることによって輪帯化して設けられている。 A plurality of annular grooves 43 are provided on the first main surface 40a of the portion of the light guide plate 40 that does not face the light-transmitting resin sealing portion 33 (that is, the portion where the first recess 41 is not provided). The plurality of annular groove portions 43 are provided in a ring shape by being provided on concentric circles.
　当該環状溝部４３が設けられた部分の第１主表面４０ａは、光を拡散させるための光拡散部としての機能し、導光板４０の内部において導光されて当該光拡散部に達した光のうちの一部を当該部位において拡散させることで全反射条件を破り、これにより出射面である第２主表面４０ｂから光を出射させるための部位である。 The first main surface 40a of the portion where the annular groove portion 43 is provided functions as a light diffusion portion for diffusing light, and is guided in the light guide plate 40 to reach the light diffusion portion. It is a part for radiating light from the second main surface 40b, which is an emission surface, by breaking the total reflection condition by diffusing a part of the part at the part.
　導光板４０の光透過性樹脂封止部３３に面しない部分の第１主表面４０ａ（すなわち、光拡散部として機能する部分の第１主表面４０ａ）と、基板２０の実装面２０ａとの間には、空気層５０が設けられている。また、基板２０の光透過性樹脂封止部３３が設けられていない部分の実装面２０ａ上には、白色レジスト２３が設けられている。 Between the first main surface 40a of the portion of the light guide plate 40 that does not face the light transmissive resin sealing portion 33 (that is, the first main surface 40a of the portion that functions as the light diffusion portion) and the mounting surface 20a of the substrate 20 Is provided with an air layer 50. Further, the white resist 23 is provided on the mounting surface 20a of the substrate 20 where the light-transmitting resin sealing portion 33 is not provided.
　これら空気層５０および白色レジスト２３は、上述した光拡散部によって拡散されることで導光板４０から基板２０側に向けて出射された光を反射して再び導光板４０に戻すためのものである。なお、白色レジスト２３に代えて、反射シートを基板２０の実装面２０ａ上に配設することとしてもよい。 The air layer 50 and the white resist 23 are used for reflecting the light emitted from the light guide plate 40 toward the substrate 20 side by being diffused by the above-described light diffusion portion and returning the light to the light guide plate 40 again. . Instead of the white resist 23, a reflection sheet may be provided on the mounting surface 20a of the substrate 20.
　以上において説明した本実施の形態におけるバックライトモジュール１０Ａにあっては、ＬＥＤ３０から発せられた光が光透過性樹脂封止部３３を透過して光透過性接着層３５に達し、さらに光透過性接着層３５を透過して導光板４０に達することになる。したがって、ＬＥＤ３０から発せられた光がほぼ余すところなく導光板４０に照射されることになり、迷光の発生が大幅に低減されることになり、光の利用効率を大幅に高めることが可能になる。 In the backlight module 10A according to the present embodiment described above, the light emitted from the LED 30 passes through the light transmissive resin sealing portion 33 and reaches the light transmissive adhesive layer 35. Further, the light transmissive property is obtained. The light passes through the adhesive layer 35 and reaches the light guide plate 40. Therefore, the light emitted from the LED 30 is irradiated to the light guide plate 40 almost without any surplus, the generation of stray light is greatly reduced, and the light utilization efficiency can be greatly increased. .
　また、以上において説明した本実施の形態におけるバックライトモジュール１０Ａにあっては、ＬＥＤ３０を封止する光透過性樹脂封止部３３と導光板４０とが光透過性接着層３５を介して接着された構成であるため、光透過性樹脂封止部３３と導光板４０との間に、レンズ面として機能する界面が２つ存在することになる。したがって、ＬＥＤから出射された光が当該２つの界面のそれぞれにおいて屈折されることで光を側方に向けて大きく拡散させることが可能になり、十分に大きい出射面から広い範囲に向けて均等に光を出射させることが可能になる。 In the backlight module 10 </ b> A according to the present embodiment described above, the light transmissive resin sealing portion 33 that seals the LED 30 and the light guide plate 40 are bonded via the light transmissive adhesive layer 35. Therefore, there are two interfaces that function as lens surfaces between the light-transmitting resin sealing portion 33 and the light guide plate 40. Therefore, the light emitted from the LED is refracted at each of the two interfaces, so that the light can be greatly diffused laterally, and evenly from a sufficiently large emission surface to a wide range. Light can be emitted.
　したがって、本実施の形態におけるバックライトモジュール１０Ａとすることにより、ＬＥＤ３０から出射された光の利用効率を高めつつ、より大きい出射面から広い範囲に向けて均等に光を出射させることが可能なバックライトモジュールとすることができ、当該バックライトモジュール１０Ａを備えた本実施の形態における液晶表示装置１Ａとすることにより、所望の光量の光を少ない数のＬＥＤ３０で得ることが可能になり、安価に製造が可能でかつ低消費電力の液晶表示装置とすることができる。 Therefore, by using the backlight module 10A in the present embodiment, it is possible to emit light uniformly from a larger emission surface toward a wide range while improving the utilization efficiency of the light emitted from the LED 30. By using the liquid crystal display device 1A according to the present embodiment that includes the backlight module 10A, it is possible to obtain a desired amount of light with a small number of LEDs 30, and at a low cost. A liquid crystal display device that can be manufactured and has low power consumption can be obtained.
　（実施の形態２）
　図５は、本発明の実施の形態２におけるバックライトモジュールの要部拡大断面図である。以下においては、この図５を参照して、本実施の形態におけるバックライトモジュールの構成について説明する。 (Embodiment 2)
FIG. 5 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 2 of the present invention. Hereinafter, the configuration of the backlight module in the present embodiment will be described with reference to FIG.
　図５に示すように、本実施の形態におけるバックライトモジュール１０Ｂにあっては、基板２０に収容凹部２０ｂが設けられており、当該収容凹部２０ｂの底面にＬＥＤ３０が実装されている。また、収容凹部２０ｂを規定する基板２０の周側面上には、金属膜２１ａ，２１ｂが延設されることで金属膜２１ｃが設けられており、当該金属膜２１ｃによってリフレクタが構成されている。 As shown in FIG. 5, in the backlight module 10B according to the present embodiment, the substrate 20 is provided with an accommodation recess 20b, and the LED 30 is mounted on the bottom surface of the accommodation recess 20b. On the peripheral side surface of the substrate 20 that defines the accommodating recess 20b, a metal film 21c is provided by extending metal films 21a and 21b, and a reflector is configured by the metal film 21c.
　以上において説明した本実施の形態におけるバックライトモジュール１０Ｂとした場合にも、上述した本発明の本実施の形態１において説明した効果と同様の効果を得ることができる。さらには、本実施の形態におけるバックライトモジュール１０Ｂとすることにより、基板２０にＬＥＤ３０が収容配置される収容凹部２０ｂを設けた分だけＬＥＤ３０の出射面とレンズ面との間に距離をもたせることが可能になり、レンズ面における光拡散性を高めることができる。加えて、当該収容凹部２０ｂの表面を金属膜２１ｃにて覆うことで同時にリフレクタを形成することも可能になるため、さらなる光の利用効率の向上が図られることにもなる。 Even when the backlight module 10B according to the present embodiment described above is used, the same effects as those described in the first embodiment of the present invention described above can be obtained. Furthermore, by using the backlight module 10B in the present embodiment, a distance can be provided between the exit surface of the LED 30 and the lens surface by the amount of the housing recess 20b in which the LED 30 is housed and disposed on the substrate 20. It becomes possible, and the light diffusibility in a lens surface can be improved. In addition, since it becomes possible to simultaneously form a reflector by covering the surface of the housing recess 20b with the metal film 21c, the use efficiency of light can be further improved.
　（実施の形態３）
　図６は、本発明の実施の形態３におけるバックライトモジュールの要部拡大断面図である。以下においては、この図６を参照して、本実施の形態におけるバックライトモジュールの構成について説明する。 (Embodiment 3)
FIG. 6 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 3 of the present invention. Hereinafter, the configuration of the backlight module in the present embodiment will be described with reference to FIG.
　図６に示すように、本実施の形態におけるバックライトモジュール１０Ｃにあっては、基板２０に屈曲部２０ｃを設けることで収容凹部２０ｂが設けられており、当該収容凹部２０ｂの底面にＬＥＤ３０が実装されている。また、収容凹部２０ｂを規定する基板２０の周側面上には、金属膜２１ａ，２１ｂが延設されることで金属膜２１ｃが設けられており、当該金属膜２１ｃによってリフレクタが構成されている。 As shown in FIG. 6, in the backlight module 10 </ b> C according to the present embodiment, the accommodation recess 20 b is provided by providing the bent portion 20 c on the substrate 20, and the LED 30 is mounted on the bottom surface of the accommodation recess 20 b. Has been. On the peripheral side surface of the substrate 20 that defines the accommodating recess 20b, a metal film 21c is provided by extending metal films 21a and 21b, and a reflector is configured by the metal film 21c.
　以上において説明した本実施の形態におけるバックライトモジュール１０Ｃとした場合にも、上述した本発明の本実施の形態２において説明した効果と同様の効果を得ることができる。 Even when the backlight module 10C in the present embodiment described above is used, the same effects as those described in the second embodiment of the present invention described above can be obtained.
　（実施の形態４）
　図７は、本発明の実施の形態４におけるバックライトモジュールの要部拡大断面図である。以下においては、この図７を参照して、本実施の形態におけるバックライトモジュールの構成について説明する。なお、本実施の形態において示すバックライトモジュールは、光源として、三色ＬＥＤ式の白色発光ダイオードを採用した場合のものである。 (Embodiment 4)
FIG. 7 is an enlarged cross-sectional view of a main part of the backlight module according to Embodiment 4 of the present invention. Hereinafter, the configuration of the backlight module in the present embodiment will be described with reference to FIG. Note that the backlight module described in this embodiment is a case where a three-color LED type white light-emitting diode is employed as a light source.
　図７に示すように、本実施の形態におけるバックライトモジュール１０Ｃにあっては、赤色発光ダイオード、緑色発光ダイオードおよび青色発光ダイオードからなる３つのＬＥＤ３０ａ～３０ｃが基板２０の実装面２０ａ上に実装されている。各々のＬＥＤ３０ａ～３０ｃは、それぞれ基板２０に対してダイボンド材３１ａ～３１ｃを介して接合されており、相互に近接して配置されている。また、基板２０のＬＥＤ３０ａ～３０ｃが実装された部分のそれぞれには、実装面２０ａおよび裏面に達するように貫通孔が設けられており、当該貫通孔のそれぞれが金属材料２６によって埋め込まれている。 As shown in FIG. 7, in the backlight module 10C according to the present embodiment, three LEDs 30a to 30c including a red light emitting diode, a green light emitting diode, and a blue light emitting diode are mounted on the mounting surface 20a of the substrate 20. ing. Each of the LEDs 30a to 30c is bonded to the substrate 20 via die bond materials 31a to 31c, respectively, and is disposed close to each other. Each of the portions of the substrate 20 where the LEDs 30 a to 30 c are mounted is provided with through holes so as to reach the mounting surface 20 a and the back surface, and each of the through holes is embedded with a metal material 26.
　基板２０の実装面２０ａ上であってかつＬＥＤ３０ａ～３０ｃが実装された部分には、光透過性樹脂封止部３３が設けられており、これによりＬＥＤ３０ａ～３０ｃが光透過性樹脂封止部３３によって封止されている。光透過性樹脂封止部３３は、蛍光体粒子を含まない構成とされている。 The portion on the mounting surface 20a of the substrate 20 where the LEDs 30a to 30c are mounted is provided with a light transmitting resin sealing portion 33, whereby the LEDs 30a to 30c are provided with the light transmitting resin sealing portion 33. It is sealed by. The light transmissive resin sealing portion 33 is configured not to include phosphor particles.
　本実施の形態においては、赤色発光ダイオード、緑色発光ダイオードおよび青色発光ダイオードからなる３つのＬＥＤ３０ａ～３０ｃのそれぞれから発せられた光が混色されることにより、光透過性樹脂封止部３３から白色光が出射されることになる。 In the present embodiment, the light emitted from each of the three LEDs 30a to 30c including the red light emitting diode, the green light emitting diode, and the blue light emitting diode is mixed, so that the white light is emitted from the light transmissive resin sealing portion 33. Will be emitted.
　以上において説明した本実施の形態におけるバックライトモジュール１０Ｄとした場合にも、上述した本発明の本実施の形態１において説明した効果と同様の効果を得ることができる。 Even in the case of the backlight module 10D in the present embodiment described above, the same effects as those described in the first embodiment of the present invention described above can be obtained.
　（実施の形態５）
　図８は、本発明の実施の形態５における液晶表示装置の分解斜視図である。以下においては、この図８を参照して、本実施の形態における液晶表示装置の構成について説明する。 (Embodiment 5)
FIG. 8 is an exploded perspective view of the liquid crystal display device according to Embodiment 5 of the present invention. Hereinafter, the configuration of the liquid crystal display device according to the present embodiment will be described with reference to FIG.
　図８に示すように、本実施の形態における液晶表示装置１Ｂは、上述した本発明の実施の形態１における液晶表示装置１Ａと比較して、照明ユニット１０の構成においてのみ相違している。本実施の形態における液晶表示装置１Ｂにあっては、照明ユニット１０が、複数のＬＥＤがアレイ状に組み込まれてなるバックライトモジュール１０Ｅにて構成されている。ここで、その詳細な説明は省略するが、当該バックライトモジュール１０Ｅに組み込まれた個々のＬＥＤの近傍部分の構造は、上述した本発明の実施の形態１と同様である。 As shown in FIG. 8, the liquid crystal display device 1B in the present embodiment is different from the liquid crystal display device 1A in the first embodiment of the present invention described above only in the configuration of the illumination unit 10. In the liquid crystal display device 1B according to the present embodiment, the illumination unit 10 includes a backlight module 10E in which a plurality of LEDs are incorporated in an array. Here, although detailed description thereof is omitted, the structure of the vicinity of each LED incorporated in the backlight module 10E is the same as that of the first embodiment of the present invention described above.
　以上において説明した本実施の形態における液晶表示装置１Ｂとした場合にも、上述した本発明の本実施の形態１において説明した効果と同様の効果を得ることができる。 Even when the liquid crystal display device 1B according to the present embodiment described above is used, the same effects as those described in the first embodiment of the present invention described above can be obtained.
　なお、上述した本発明の実施の形態１ないし５において示した特徴的な構成は、当然に相互に組み合わせることが可能である。 It should be noted that the characteristic configurations shown in the first to fifth embodiments of the present invention described above can naturally be combined with each other.
　また、上述した本発明の実施の形態１ないし５においては、電子機器の代表例として液晶表示装置を、光源モジュールの代表例として当該液晶表示装置に具備されるバックライトモジュールをそれぞれ例示して説明を行なったが、この他にも、本発明が適用される電子機器としては、照明器具や投光器、プロジェクタ、広告灯等が挙げられ、本発明が適用される光源モジュールとしては、これらに具備される光源モジュールが挙げられる。 In the first to fifth embodiments of the present invention described above, a liquid crystal display device is illustrated as a representative example of an electronic device, and a backlight module provided in the liquid crystal display device is illustrated as a representative example of a light source module. In addition to this, other electronic devices to which the present invention is applied include lighting fixtures, projectors, projectors, advertising lights, etc., and light source modules to which the present invention is applied are provided in these. A light source module.
　このように、今回開示した上記各実施の形態はすべての点で例示であって、制限的なものではない。本発明の技術的範囲は請求の範囲によって画定され、また請求の範囲の記載と均等の意味および範囲内でのすべての変更を含むものである。 Thus, the above-described embodiments disclosed herein are illustrative in all respects and are not restrictive. The technical scope of the present invention is defined by the scope of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　１Ａ，１Ｂ　液晶表示装置、２　シャーシ、３　光学シート群、３ａ　拡散シート、３ｂ，３ｃ　プリズムシート、３ｄ　偏光性反射シート、４　液晶パネル、５　ベゼル、６　制御部、１０　照明ユニット、１０Ａ～１０Ｅ　バックライトモジュール、２０　基板、２０ａ　実装面、２０ｂ　収容凹部、２０ｃ　屈曲部、２１ａ～２１ｃ，２２　金属膜、２３　白色レジスト、２４　堰き止め用レジスト、２５　絶縁膜、２６，２６ａ～２６ｃ　金属材料、３０，３０ａ～３０ｃ　ＬＥＤ、３１，３１ａ～３１ｃ　ダイボンド材、３２　ボンディングワイヤ、３３　光透過性樹脂封止部、３４　蛍光体粒子、３５　光透過性接着層、４０　導光板、４０ａ　第１主表面、４０ｂ　第２主表面、４１　第１凹部、４２　第２凹部、４３　環状溝部、５０　空気層。 1A, 1B liquid crystal display device, 2 chassis, 3 optical sheet group, 3a diffusion sheet, 3b, 3c prism sheet, 3d polarizing reflective sheet, 4 liquid crystal panel, 5 bezel, 6 control unit, 10 lighting unit, 10A to 10E back Light module, 20 substrate, 20a mounting surface, 20b receiving recess, 20c bent portion, 21a to 21c, 22 metal film, 23 white resist, 24 damming resist, 25 insulating film, 26, 26a to 26c metal material, 30, 30a-30c LED, 31, 31a-31c die bond material, 32 bonding wire, 33 light transmissive resin sealing part, 34 phosphor particles, 35 light transmissive adhesive layer, 40 light guide plate, 40a first main surface, 40b first 2 main surfaces, 41 first recess, 42 second recess, 43 ring Groove, 50 air layer.

Claims (14)

  1. 　発光素子（３０）と、
    　前記発光素子（３０）が実装された実装面（２０ａ）を有する基板（２０）と、
    　前記基板（２０）の前記実装面（２０ａ）上に設けられ、前記発光素子（３０）を封止する光透過性樹脂封止部（３３）と、
    　前記光透過性樹脂封止部（３３）側に位置する第１主表面（４０ａ）および前記光透過性樹脂封止部（３３）側とは反対側に位置する第２主表面（４０ｂ）を有し、前記光透過性樹脂封止部（３３）を覆うように前記基板（２０）の前記実装面（２０ａ）側に配設され、前記光透過性樹脂封止部（３３）に面する部分の前記第１主表面（４０ａ）から入射した光を内部において導光することで拡散させて前記第２主表面（４０ｂ）から外部に向けて出射する導光板（４０）とを備え、
    　前記光透過性樹脂封止部（３３）は、前記導光板（４０）の前記第１主表面（４０ａ）に面する部分の表面に凸状レンズ面を有し、
    　前記導光板（４０）の前記光透過性樹脂封止部（３３）に面する部分の前記第１主表面（４０ａ）には、前記光透過性樹脂封止部（３３）の前記凸状レンズ面に対応した形状の凹状レンズ面を有する第１凹部（４１）が設けられ、
    　前記導光板（４０）の前記第１凹部（４１）に対向する部分の前記第２主表面（４０ｂ）には、略円錐状の凹面を有する第２凹部（４２）が設けられ、
    　前記導光板（４０）の前記光透過性樹脂封止部（３３）に面しない部分の前記第１主表面（４０ａ）には、光を拡散させるための光拡散部が設けられ、
    　前記光透過性樹脂封止部（３３）と前記導光板（４０）とが、前記凸状レンズ面と前記凹状レンズ面との間に設けられた光透過性接着層（３５）によって接着されることで固定されている、光源モジュール。     A light emitting element (30);
    A substrate (20) having a mounting surface (20a) on which the light emitting element (30) is mounted;
    A light transmissive resin sealing portion (33) provided on the mounting surface (20a) of the substrate (20) and sealing the light emitting element (30);
    A first main surface (40a) positioned on the light transmissive resin sealing portion (33) side and a second main surface (40b) positioned on the opposite side to the light transmissive resin sealing portion (33) side. And is disposed on the mounting surface (20a) side of the substrate (20) so as to cover the light transmissive resin sealing portion (33) and faces the light transmissive resin sealing portion (33). A light guide plate (40) that diffuses the light incident from the first main surface (40a) of the portion by guiding the light inside and emits the light outward from the second main surface (40b);
    The light transmissive resin sealing portion (33) has a convex lens surface on the surface of the light guide plate (40) facing the first main surface (40a),
    The convex lens of the light transmissive resin sealing portion (33) is formed on the first main surface (40a) of the light guide plate (40) facing the light transmissive resin sealing portion (33). A first recess (41) having a concave lens surface of a shape corresponding to the surface is provided,
    The second main surface (40b) of the portion facing the first recess (41) of the light guide plate (40) is provided with a second recess (42) having a substantially conical concave surface,
    A light diffusion part for diffusing light is provided on the first main surface (40a) of the light guide plate (40) that does not face the light transmissive resin sealing part (33).
    The light transmissive resin sealing portion (33) and the light guide plate (40) are bonded together by a light transmissive adhesive layer (35) provided between the convex lens surface and the concave lens surface. A light source module that is fixed by that.
  2. 　前記基板（２０）の前記光透過性樹脂封止部（３３）が設けられた部分の前記実装面（２０ａ）に、前記発光素子（３０）が収容される収容凹部（２０ｂ）が設けられている、請求項１に記載の光源モジュール。 An accommodation recess (20b) in which the light emitting element (30) is accommodated is provided on the mounting surface (20a) of the portion of the substrate (20) where the light transmissive resin sealing portion (33) is provided. The light source module according to claim 1.
  3. 　前記収容凹部（２０ｂ）の表面が、金属膜（２１ｃ）によって覆われている、請求項２に記載の光源モジュール。 The light source module according to claim 2, wherein a surface of the housing recess (20b) is covered with a metal film (21c).
  4. 　前記光透過性樹脂封止部（３３）の内部に蛍光体粒子（３４）が分散配置されている、請求項１から３のいずれかに記載の光源モジュール。 The light source module according to any one of claims 1 to 3, wherein phosphor particles (34) are dispersedly arranged inside the light transmissive resin sealing portion (33).
  5. 　前記基板（２０）の前記実装面（２０ａ）と、前記導光板（４０）の前記光透過性樹脂封止部（３３）に面しない部分の前記第１主表面（４０ａ）との間に、空気層（５０）が設けられている、請求項１から４のいずれかに記載の光源モジュール。 Between the mounting surface (20a) of the substrate (20) and the first main surface (40a) of the portion of the light guide plate (40) that does not face the light-transmitting resin sealing portion (33), The light source module according to claim 1, wherein an air layer (50) is provided.
  6. 　前記光拡散部が、前記導光板（４０）の前記光透過性樹脂封止部（３３）に面しない部分の前記第１主表面（４０ａ）に設けられた輪帯化された環状溝部（４３）にて構成されている、請求項１から５のいずれかに記載の光源モジュール。 The light diffusion part is a ring-shaped annular groove part (43) provided on the first main surface (40a) of the light guide plate (40) not facing the light-transmitting resin sealing part (33). The light source module according to any one of claims 1 to 5, wherein
  7. 　前記基板（２０）の前記光透過性樹脂封止部（３３）が設けられていない部分の前記実装面（２０ａ）上に、光を反射するための白色レジスト（２３）が設けられている、請求項１から６のいずれかに記載の光源モジュール。 A white resist (23) for reflecting light is provided on the mounting surface (20a) of a portion of the substrate (20) where the light-transmitting resin sealing portion (33) is not provided. The light source module according to claim 1.
  8. 　前記基板（２０）の前記光透過性樹脂封止部（３３）が設けられていない部分の前記実装面（２０ａ）上に、光を反射するための反射シートが配設されている、請求項１から６のいずれかに記載の光源モジュール。 The reflective sheet for reflecting light is arrange | positioned on the said mounting surface (20a) of the part in which the said transparent resin sealing part (33) of the said board | substrate (20) is not provided. The light source module according to any one of 1 to 6.
  9. 　前記基板（２０）の前記発光素子（３０）が搭載された部分に貫通孔が設けられるとともに、当該貫通孔が金属材料（２６）によって埋め込まれている、請求項１から８のいずれかに記載の光源モジュール。 The through hole is provided in a portion of the substrate (20) where the light emitting element (30) is mounted, and the through hole is embedded with a metal material (26). Light source module.
  10. 　前記基板（２０）の前記実装面（２０ａ）とは反対側に位置する主表面が、金属膜（２２）によって覆われている、請求項９に記載の光源モジュール。 The light source module according to claim 9, wherein a main surface located on the opposite side of the mounting surface (20a) of the substrate (20) is covered with a metal film (22).
  11. 　前記光透過性樹脂封止部（３３）が、ポッティング加工によって形成されたものである、請求項１から１０のいずれかに記載の光源モジュール。 The light source module according to any one of claims 1 to 10, wherein the light transmissive resin sealing portion (33) is formed by potting.
  12. 　前記光透過性樹脂封止部（３３）が設けられた部分を取り囲むように、前記基板（２０）の前記実装面（２０ａ）上に堰き止め用レジスト（２４）が設けられている、請求項１１に記載の光源モジュール。 A damming resist (24) is provided on the mounting surface (20a) of the substrate (20) so as to surround a portion where the light transmissive resin sealing portion (33) is provided. The light source module according to 11.
  13. 　前記光透過性樹脂封止部（３３）が、射出成形加工によって形成されたものである、請求項１から１０のいずれかに記載の光源モジュール。 The light source module according to any one of claims 1 to 10, wherein the light transmissive resin sealing portion (33) is formed by an injection molding process.
  14. 　請求項１から１３のいずれかに記載の光源モジュールを備えた、電子機器。 An electronic device comprising the light source module according to any one of claims 1 to 13.
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Cited By (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104110596A (en) * 2014-06-17 2014-10-22 章驰 Lamp
WO2015068072A1 (en) * 2013-11-07 2015-05-14 Koninklijke Philips N.V. Substrate for led with total-internal reflection layer surrounding led
CN106016188A (en) * 2016-06-20 2016-10-12 保定威控光电科技有限公司 LED light source
CN108105644A (en) * 2017-12-19 2018-06-01 深圳市利科达光电有限公司 A kind of lens arrangement for LED television backlight
CN108459436A (en) * 2018-01-24 2018-08-28 惠州市华星光电技术有限公司 A kind of straight-down negative reflector plate structure and backlight module
CN108459437A (en) * 2017-02-17 2018-08-28 日亚化学工业株式会社 The manufacturing method and light emitting module of light emitting module
CN109212814A (en) * 2017-06-30 2019-01-15 日亚化学工业株式会社 The manufacturing method and light emitting module of light emitting module
JP2019012681A (en) * 2017-06-30 2019-01-24 日亜化学工業株式会社 Method for manufacturing light-emitting module and light-emitting module
WO2019119710A1 (en) * 2017-12-19 2019-06-27 深圳市利科达光电有限公司 Lens structure for led television backlight source
EP3547378A1 (en) * 2018-03-26 2019-10-02 Nichia Corporation Light emitting module
KR20190112674A (en) * 2018-03-26 2019-10-07 니치아 카가쿠 고교 가부시키가이샤 Light emitting module
JP2019175892A (en) * 2018-03-26 2019-10-10 日亜化学工業株式会社 Light-emitting module and manufacturing method therefor
WO2019221304A1 (en) * 2018-05-18 2019-11-21 富士フイルム株式会社 Planar illumination device and liquid crystal display device
CN110554535A (en) * 2018-06-04 2019-12-10 日亚化学工业株式会社 Light emitting device and surface light source
JP2019212662A (en) * 2018-05-31 2019-12-12 日亜化学工業株式会社 Light-emitting module and surface light source
JP2020021695A (en) * 2018-08-03 2020-02-06 日亜化学工業株式会社 Light-emitting module and manufacturing method thereof
JP2020021910A (en) * 2018-08-03 2020-02-06 日亜化学工業株式会社 Method of manufacturing light-emitting module and light-emitting module
JP2020031108A (en) * 2018-08-21 2020-02-27 日亜化学工業株式会社 Light-emitting device
JP2020057748A (en) * 2018-09-28 2020-04-09 日亜化学工業株式会社 Manufacturing method of light-emitting module
JP2020072269A (en) * 2018-10-31 2020-05-07 日亜化学工業株式会社 Light emitting device, light emitting module, and method for manufacturing light emitting device and light emitting module
CN111129259A (en) * 2018-10-31 2020-05-08 日亚化学工业株式会社 Light emitting device, light emitting module, light emitting device, and method for manufacturing light emitting module
JP2020107584A (en) * 2018-12-28 2020-07-09 日亜化学工業株式会社 Light-emitting module
JP2020109718A (en) * 2018-12-28 2020-07-16 日亜化学工業株式会社 Light emitting module
CN111474768A (en) * 2020-04-21 2020-07-31 Tcl华星光电技术有限公司 Backlight module, preparation method thereof and display device
JP2020161849A (en) * 2020-06-30 2020-10-01 日亜化学工業株式会社 Light-emitting device
US10802194B2 (en) 2018-01-24 2020-10-13 Huizhou China Star Optoelectronics Technology Co., Ltd. Direct type reflective sheet structure and backlight module
JP2020188028A (en) * 2020-08-20 2020-11-19 日亜化学工業株式会社 Light-emitting module
JP2020194787A (en) * 2020-08-04 2020-12-03 日亜化学工業株式会社 Light-emitting module and manufacturing method thereof
JP2021009857A (en) * 2020-10-28 2021-01-28 日亜化学工業株式会社 Manufacturing method of light emitting module and light emitting module
JP2021026886A (en) * 2019-08-05 2021-02-22 日亜化学工業株式会社 Light-emitting module
US10928583B2 (en) 2016-04-13 2021-02-23 Tactotek Oy Illuminated multilayer structure with embedded light sources
CN112558213A (en) * 2019-09-26 2021-03-26 夏普株式会社 Illumination device and display device
US10971657B2 (en) 2018-08-03 2021-04-06 Nichia Corporation Light emitting module and method of manufacturing the same
US11056615B2 (en) 2018-09-28 2021-07-06 Nichia Corporation Method for manufacturing light emitting module with concave surface light guide plate
JP2021103762A (en) * 2019-12-25 2021-07-15 日亜化学工業株式会社 Light emitting module and method for manufacturing light emitting module
JP2021166133A (en) * 2020-04-06 2021-10-14 日亜化学工業株式会社 Planar light source and planar light source manufacturing method
JP2022022569A (en) * 2020-06-26 2022-02-07 日亜化学工業株式会社 Display device and light diffusion sheet laminated body
US11320574B2 (en) * 2017-09-19 2022-05-03 Beijing Boe Display Technology Co., Ltd. Light guide plate, backlight module and display device
US11353645B2 (en) * 2020-03-02 2022-06-07 Nichia Corporation Light-emitting module including first hole portion
US11579486B2 (en) 2020-11-20 2023-02-14 Lextar Electronics Corporation Light emitting device, backlight, and display panel with reflective layer
US11709310B2 (en) 2020-09-29 2023-07-25 Nichia Corporation Surface-emitting light source and method of manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218691A (en) * 2007-03-05 2008-09-18 Oki Data Corp Led backlight device and liquid crystal display device
JP2009175702A (en) * 2007-11-19 2009-08-06 Honeywell Internatl Inc Backlight system for liquid crystal display
JP2010045029A (en) * 2008-08-09 2010-02-25 Qinghua Univ Light guide plates, and backlight module
JP2010192347A (en) * 2009-02-20 2010-09-02 Hitachi Ltd Light source module, and lighting device using the same, liquid crystal display device, and image display device
WO2010134408A1 (en) * 2009-05-22 2010-11-25 シャープ株式会社 Light source device, illuminating device, backlight device, liquid crystal display device, and display device
JP2010287871A (en) * 2009-05-14 2010-12-24 Sharp Corp Light emitting device
JP2011009143A (en) * 2009-06-29 2011-01-13 Sony Corp Lighting device and backlight

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218691A (en) * 2007-03-05 2008-09-18 Oki Data Corp Led backlight device and liquid crystal display device
JP2009175702A (en) * 2007-11-19 2009-08-06 Honeywell Internatl Inc Backlight system for liquid crystal display
JP2010045029A (en) * 2008-08-09 2010-02-25 Qinghua Univ Light guide plates, and backlight module
JP2010192347A (en) * 2009-02-20 2010-09-02 Hitachi Ltd Light source module, and lighting device using the same, liquid crystal display device, and image display device
JP2010287871A (en) * 2009-05-14 2010-12-24 Sharp Corp Light emitting device
WO2010134408A1 (en) * 2009-05-22 2010-11-25 シャープ株式会社 Light source device, illuminating device, backlight device, liquid crystal display device, and display device
JP2011009143A (en) * 2009-06-29 2011-01-13 Sony Corp Lighting device and backlight

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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