WO2012035494A1 - Printed temperature sensor - Google Patents

Printed temperature sensor Download PDF

Info

Publication number
WO2012035494A1
WO2012035494A1 PCT/IB2011/054001 IB2011054001W WO2012035494A1 WO 2012035494 A1 WO2012035494 A1 WO 2012035494A1 IB 2011054001 W IB2011054001 W IB 2011054001W WO 2012035494 A1 WO2012035494 A1 WO 2012035494A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicon
printing
contacts
substrate
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2011/054001
Other languages
English (en)
French (fr)
Inventor
David Thomas Britton
Margit Harting
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Cape Town
Original Assignee
University of Cape Town
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Cape Town filed Critical University of Cape Town
Priority to US13/822,965 priority Critical patent/US9029180B2/en
Priority to EP11824675.0A priority patent/EP2616784B1/en
Priority to ES11824675.0T priority patent/ES2663098T3/es
Priority to KR1020137009246A priority patent/KR20130128383A/ko
Priority to RU2013116739/07A priority patent/RU2013116739A/ru
Priority to CN201180054592.XA priority patent/CN103210290B/zh
Priority to JP2013528807A priority patent/JP5806316B2/ja
Publication of WO2012035494A1 publication Critical patent/WO2012035494A1/en
Priority to ZA2013/01890A priority patent/ZA201301890B/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/226—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor using microstructures, e.g. silicon spreading resistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • the silicon layer is formed from an ink comprising silicon particles and a liquid vehicle composed of a binder and a suitable solvent.
  • the solvent may be omitted, or additional compounds commonly used in the formulation of inks, such as siccatives or stabilisers, may be added.
  • a negative temperature coefficient thermistor was produced, also according to the design shown in Figure 5.
  • Silver contacts were deposited on a substrate comprising a sheet of 80 g/m 2 wood-free paper by screen-printing using Du Pont 5000 silver conductor.
  • the diameter of the inner electrode was 5 mm, and the separation between the two electrodes was 0.5 mm.
  • a silicon layer was screen-printed over the gap between the electrodes, using silicon nanoparticles milled from 2503 grade metallurgical silicon according to the method disclosed in WO 2009/125370. These nanoparticles were mixed with a commercially available acrylic screen-printing base in a ratio of 88% silicon by weight, and the consistency of the ink was adjusted by thinning with propylene glycol.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Thermistors And Varistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
PCT/IB2011/054001 2010-09-13 2011-09-13 Printed temperature sensor Ceased WO2012035494A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US13/822,965 US9029180B2 (en) 2010-09-13 2011-09-13 Printed temperature sensor
EP11824675.0A EP2616784B1 (en) 2010-09-13 2011-09-13 Method of producing a printed temperature sensor
ES11824675.0T ES2663098T3 (es) 2010-09-13 2011-09-13 Método de producción de un sensor de temperatura impreso
KR1020137009246A KR20130128383A (ko) 2010-09-13 2011-09-13 프린팅된 온도 센서
RU2013116739/07A RU2013116739A (ru) 2010-09-13 2011-09-13 Печатный датчик температуры
CN201180054592.XA CN103210290B (zh) 2010-09-13 2011-09-13 印刷温度传感器
JP2013528807A JP5806316B2 (ja) 2010-09-13 2011-09-13 印刷された温度センサ
ZA2013/01890A ZA201301890B (en) 2010-09-13 2013-03-13 Printed temperature sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ZA2010/06532 2010-09-13
ZA201006532 2010-09-13

Publications (1)

Publication Number Publication Date
WO2012035494A1 true WO2012035494A1 (en) 2012-03-22

Family

ID=45831072

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/054001 Ceased WO2012035494A1 (en) 2010-09-13 2011-09-13 Printed temperature sensor

Country Status (9)

Country Link
US (1) US9029180B2 (enExample)
EP (1) EP2616784B1 (enExample)
JP (1) JP5806316B2 (enExample)
KR (1) KR20130128383A (enExample)
CN (1) CN103210290B (enExample)
ES (1) ES2663098T3 (enExample)
RU (1) RU2013116739A (enExample)
WO (1) WO2012035494A1 (enExample)
ZA (1) ZA201301890B (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2866118A1 (en) * 2013-10-23 2015-04-29 Nano and Advanced Materials Institute Limited Thin film with negative temperature coefficient behavior and method of making thereof
WO2015096927A1 (en) * 2013-12-27 2015-07-02 Arcelik Anonim Sirketi An induction cooker, the safe utilization of which is provided
EP2919239A1 (en) * 2014-03-11 2015-09-16 Nano and Advanced Materials Institute Limited A conductive film comprising silicon-carbon composite as printable thermistors
US20150271948A1 (en) * 2012-11-27 2015-09-24 Epcos Ag Semiconductor Device
CN106370318A (zh) * 2016-11-23 2017-02-01 合肥舒实工贸有限公司 热敏电阻温度传感器
CN106556473A (zh) * 2016-11-23 2017-04-05 合肥舒实工贸有限公司 热敏电阻温度传感器
CN106556474A (zh) * 2016-11-23 2017-04-05 合肥舒实工贸有限公司 热敏电阻温度传感器
CN106644144A (zh) * 2016-11-23 2017-05-10 合肥舒实工贸有限公司 热敏电阻温度传感器
EP3373310A1 (en) * 2017-03-06 2018-09-12 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Printed temperature sensor
EP3435048A1 (de) * 2017-07-25 2019-01-30 Heraeus Sensor Technology GmbH Sensor zur erfassung eines räumlichen temperaturprofils und verfahren zur herstellung einer sensoreinheit
US10983012B2 (en) 2015-07-31 2021-04-20 Murata Manufacturing Co., Ltd. Temperature sensor
WO2022258877A1 (en) * 2021-06-08 2022-12-15 Teknologian Tutkimuskeskus Vtt Oy Improved negative temperature coefficient thermistor
TWI843803B (zh) * 2019-02-06 2024-06-01 日商日東電工股份有限公司 溫度感測膜、導電膜及其製造方法

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011047171A2 (en) 2009-10-16 2011-04-21 Kesumo, Llc Foot-operated controller
WO2013114291A1 (en) * 2012-01-30 2013-08-08 Pst Sensors (Proprietary) Limited Thermal imaging sensors
US9076419B2 (en) 2012-03-14 2015-07-07 Bebop Sensors, Inc. Multi-touch pad controller
JP6024642B2 (ja) * 2013-10-25 2016-11-16 株式会社デンソー 熱電変換装置およびその製造方法
JP6574443B2 (ja) * 2014-04-15 2019-09-11 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 温度測定のための低コストで磁気共鳴安全なプローブ
US9965076B2 (en) * 2014-05-15 2018-05-08 Bebop Sensors, Inc. Piezoresistive sensors and applications
US9442614B2 (en) 2014-05-15 2016-09-13 Bebop Sensors, Inc. Two-dimensional sensor arrays
US9753568B2 (en) 2014-05-15 2017-09-05 Bebop Sensors, Inc. Flexible sensors and applications
US10362989B2 (en) 2014-06-09 2019-07-30 Bebop Sensors, Inc. Sensor system integrated with a glove
SG10201900469PA (en) 2014-07-22 2019-02-27 Brewer Science Inc Thin-film resistive-based sensor
US9931778B2 (en) 2014-09-18 2018-04-03 The Boeing Company Extruded deposition of fiber reinforced polymers
US9863823B2 (en) 2015-02-27 2018-01-09 Bebop Sensors, Inc. Sensor systems integrated with footwear
KR102381654B1 (ko) * 2015-03-23 2022-04-04 삼성디스플레이 주식회사 온도 검출 소자 및 이를 이용한 온도 센서
JP6532259B2 (ja) * 2015-03-27 2019-06-19 東京コスモス電機株式会社 温度センサ
US10082381B2 (en) 2015-04-30 2018-09-25 Bebop Sensors, Inc. Sensor systems integrated with vehicle tires
US9827996B2 (en) 2015-06-25 2017-11-28 Bebop Sensors, Inc. Sensor systems integrated with steering wheels
US10034609B2 (en) * 2015-11-05 2018-07-31 Nano And Advanced Materials Institute Limited Temperature sensor for tracking body temperature based on printable nanomaterial thermistor
EP3377867A1 (en) * 2015-11-18 2018-09-26 PST Sensors (Pty) Limited Digital sensor
US10393598B1 (en) * 2015-12-03 2019-08-27 FluxTeq LLC Heat flux gage
CN107560750A (zh) * 2016-06-30 2018-01-09 国神光电科技（上海）有限公司 一种测温电路及一种测温结构
CN106322457B (zh) * 2016-09-09 2018-10-23 深圳拓邦股份有限公司 一种电磁灶
DE102016119340A1 (de) * 2016-10-11 2018-04-12 Heraeus Sensor Technology Gmbh Verfahren zur Herstellung eines Sensors, Sensor und Verwendung eines Sensors
WO2018073826A1 (en) * 2016-10-22 2018-04-26 Lapidot Matan Mobile inspection system for the detection of defect occurrence and location
DE102017105317B3 (de) * 2017-03-14 2018-05-09 Helmholtz-Zentrum Dresden - Rossendorf E.V. Vorrichtung zum Charakterisieren des elektrischen Widerstandes eines Messobjekts
KR101923074B1 (ko) 2017-03-21 2018-11-28 부경대학교 산학협력단 저온 센서용 금 나노입자-실리콘 복합소재
CN107063492A (zh) * 2017-04-20 2017-08-18 武汉大学 一种印刷型温度传感器及应用该温度传感器的疏散标志
KR20190004974A (ko) * 2017-07-05 2019-01-15 주식회사 이엠따블유 프린팅 공정을 이용한 센서의 제조방법 및 이에 의해 제조된 센서
US11300458B2 (en) 2017-09-05 2022-04-12 Littelfuse, Inc. Temperature sensing tape, assembly, and method of temperature control
US11231331B2 (en) 2017-09-05 2022-01-25 Littelfuse, Inc. Temperature sensing tape
KR102073720B1 (ko) * 2017-12-15 2020-02-05 (주) 텔로팜 최소 침습 기술을 이용한 식물의 수액 흐름 측정용 마이크로 니들 프로브 장치
EP3521786B8 (en) 2018-01-31 2020-11-18 ABB Power Grids Switzerland AG Wound electrical component with printed electronics sensor
DE102018102471B3 (de) * 2018-02-05 2019-02-21 Leoni Kabel Gmbh Vorrichtung und Verfahren zur Messung einer Temperaturverteilung auf einer Oberfläche
JP6524567B1 (ja) * 2018-02-28 2019-06-05 株式会社Ｇｃｅインスティチュート 熱電素子、熱電装置、及び熱電素子の形成方法
KR102007446B1 (ko) * 2018-05-21 2019-10-21 해성디에스 주식회사 센서 유닛, 이를 포함하는 온도 센서, 센서 유닛의 제조방법 및 이를 이용하여 제조된 온도 센서
US10884496B2 (en) 2018-07-05 2021-01-05 Bebop Sensors, Inc. One-size-fits-all data glove
KR102131121B1 (ko) * 2018-08-28 2020-07-07 건국대학교 산학협력단 플렉시블 온도 센서를 활용한 온도 제어 시스템
US11280685B2 (en) 2018-10-01 2022-03-22 Goodrich Corporation Additive manufactured resistance temperature detector
US11085833B2 (en) * 2018-10-31 2021-08-10 Xerox Corporation Temperature sensor ink composition with metal oxide nanoparticles
US11187590B2 (en) 2018-11-13 2021-11-30 Institut National D'optique Microbolometer detectors and arrays for printed photonics applications
KR102205001B1 (ko) * 2019-01-28 2021-01-18 순천대학교 산학협력단 롤투롤 그라비아 인쇄를 이용한 온도 센서 태그 제조 방법
CN109781291B (zh) * 2019-02-02 2021-10-26 五邑大学 一种柔性温度传感器
US11480481B2 (en) 2019-03-13 2022-10-25 Bebop Sensors, Inc. Alignment mechanisms sensor systems employing piezoresistive materials
TWI728345B (zh) * 2019-04-19 2021-05-21 美宸科技股份有限公司 柔性感測器
DE102019122364A1 (de) * 2019-08-20 2021-02-25 Schreiner Group Gmbh & Co. Kg Gegenstand zur Durchführung einer elektrischen Messung an einer Messschicht
DE102019127915A1 (de) * 2019-10-16 2021-04-22 Tdk Electronics Ag Sensorelement und Verfahren zur Herstellung eines Sensorelements
DE102019127924B3 (de) 2019-10-16 2021-01-21 Tdk Electronics Ag Bauelement und Verfahren zur Herstellung eines Bauelements
WO2021214461A1 (en) * 2020-04-22 2021-10-28 Nanoco 2D Materials Limited Negative Temperature Coefficient (NTC) Thermistors Utilising Transition Metal Dichalcogenide Quantum Dots
KR102418224B1 (ko) * 2020-04-24 2022-07-08 성균관대학교산학협력단 탈부착이 가능한 수유병 센싱 장치 및 상기 장치를 포함하는 수유병 모니터링 시스템
JP7519043B2 (ja) 2020-06-12 2024-07-19 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 熱電変換素子及び熱電変換モジュール
US11688614B2 (en) * 2021-04-28 2023-06-27 Kla Corporation Mitigating thermal expansion mismatch in temperature probe construction apparatus and method
CN114980382B (zh) * 2022-05-09 2025-02-25 闽都创新实验室 一种微型加热器及其应用
CN120188011A (zh) * 2022-11-09 2025-06-20 力特保险丝公司 包括具有多个结晶点的温度传感器元件的温度感测带
TWI898800B (zh) * 2024-08-23 2025-09-21 國巨股份有限公司 電阻器及其製作方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4200970A (en) * 1977-04-14 1980-05-06 Milton Schonberger Method of adjusting resistance of a thermistor
US4415607A (en) * 1982-09-13 1983-11-15 Allen-Bradley Company Method of manufacturing printed circuit network devices
US4874924A (en) * 1987-04-21 1989-10-17 Tdk Corporation PTC heating device
US5363084A (en) * 1993-02-26 1994-11-08 Lake Shore Cryotronics, Inc. Film resistors having trimmable electrodes
US20040098216A1 (en) * 2002-11-04 2004-05-20 Jun Ye Method and apparatus for monitoring integrated circuit fabrication
WO2004068536A2 (en) 2003-01-30 2004-08-12 University Of Cape Town A thin film semiconductor device and method of manufacturing a thin film semiconductor device
US20070148416A1 (en) 2005-12-27 2007-06-28 Palo Alto Research Center Incorporated Layered structures on thin substrates

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61160902A (ja) * 1985-01-08 1986-07-21 松下電器産業株式会社 薄膜サ−ミスタ
JPH0515750Y2 (enExample) 1987-04-21 1993-04-26
JPH0436072Y2 (enExample) 1987-11-16 1992-08-26
JP2701565B2 (ja) * 1991-03-22 1998-01-21 松下電器産業株式会社 薄膜サーミスタおよびその製造方法
US5758575A (en) 1995-06-07 1998-06-02 Bemis Company Inc. Apparatus for printing an electrical circuit component with print cells in liquid communication
CA2224236A1 (en) 1995-10-07 1997-04-17 Img Group Limited An electrical circuit component formed of a conductive liquid printed directly onto a substrate
JP2001272282A (ja) * 2000-03-24 2001-10-05 Toshiba Corp 温度検出回路及び同回路を備えたディスク記憶装置
JP2003168340A (ja) * 2001-12-03 2003-06-13 Fujikura Ltd メンブレンスイッチおよびその製造方法
US6794245B2 (en) * 2002-07-18 2004-09-21 Micron Technology, Inc. Methods of fabricating double-sided hemispherical silicon grain electrodes and capacitor modules
CN100385217C (zh) * 2004-12-22 2008-04-30 中国科学院合肥智能机械研究所 一种柔性温度传感器阵列的制备方法
CN1664523A (zh) * 2005-01-13 2005-09-07 中国电子科技集团公司第十三研究所 纳米尺度微型温度传感器的制作方法
KR101462435B1 (ko) 2005-06-30 2014-11-17 피에스티 센서스 (피티와이) 리미티드 표면이 변형된 반도체 나노입자들
JP2007027541A (ja) * 2005-07-20 2007-02-01 Tateyama Kagaku Kogyo Kk Ｎｔｃサーミスタ素子とその製造方法
CN101248222B (zh) 2005-08-23 2015-05-13 Pst传感器(私人)有限公司 粒子半导体材料的掺杂
KR101407252B1 (ko) 2005-12-22 2014-06-16 피에스티 센서스 (피티와이) 리미티드 후막 반도체성 잉크
US20070234918A1 (en) 2006-03-31 2007-10-11 Edward Hirahara System and method for making printed electronic circuits using electrophotography
JP4997933B2 (ja) * 2006-11-17 2012-08-15 パナソニック株式会社 サーミスタ
US8434704B2 (en) 2008-04-09 2013-05-07 Pst Sensors (Proprietary) Limited Method of producing stable oxygen terminated semiconducting nanoparticles
JP5186007B2 (ja) * 2008-11-17 2013-04-17 アルプス電気株式会社 サーミスタ及びその製造方法
US8895962B2 (en) * 2010-06-29 2014-11-25 Nanogram Corporation Silicon/germanium nanoparticle inks, laser pyrolysis reactors for the synthesis of nanoparticles and associated methods

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4200970A (en) * 1977-04-14 1980-05-06 Milton Schonberger Method of adjusting resistance of a thermistor
US4415607A (en) * 1982-09-13 1983-11-15 Allen-Bradley Company Method of manufacturing printed circuit network devices
US4874924A (en) * 1987-04-21 1989-10-17 Tdk Corporation PTC heating device
US5363084A (en) * 1993-02-26 1994-11-08 Lake Shore Cryotronics, Inc. Film resistors having trimmable electrodes
US20040098216A1 (en) * 2002-11-04 2004-05-20 Jun Ye Method and apparatus for monitoring integrated circuit fabrication
WO2004068536A2 (en) 2003-01-30 2004-08-12 University Of Cape Town A thin film semiconductor device and method of manufacturing a thin film semiconductor device
US20060199313A1 (en) * 2003-01-30 2006-09-07 University Of Cape Town Thin film semiconductor device and method of manufacturing a thin film semiconductor device
US20070148416A1 (en) 2005-12-27 2007-06-28 Palo Alto Research Center Incorporated Layered structures on thin substrates

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
HÄRTING M ET AL.: "Applied Physics Letters", vol. 94, 15 May 2009, AMERICAN INSTITUTE OF PHYSICS, article "Fully printed silicon field effect transistors", pages: 193509 - 193509
SAPOFF, M.: "Thermistor Thermometers", THE MEASUREMENT, INSTRUMENTATION AND SENSORS HANDBOOK,CRC PRESS (1999), EDITOR IN CHIEF JOHN G. WEBSTER, 1999, pages 32-25 - 32-26, XP008169854 *
See also references of EP2616784A4

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WO2015096927A1 (en) * 2013-12-27 2015-07-02 Arcelik Anonim Sirketi An induction cooker, the safe utilization of which is provided
US9281104B2 (en) 2014-03-11 2016-03-08 Nano And Advanced Materials Institute Limited Conductive thin film comprising silicon-carbon composite as printable thermistors
CN104916379A (zh) * 2014-03-11 2015-09-16 纳米及先进材料研发院有限公司 作为可印刷热敏电阻的含有硅-碳复合物的导电薄膜
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EP3435048A1 (de) * 2017-07-25 2019-01-30 Heraeus Sensor Technology GmbH Sensor zur erfassung eines räumlichen temperaturprofils und verfahren zur herstellung einer sensoreinheit
WO2019020220A1 (de) * 2017-07-25 2019-01-31 Heraeus Sensor Technology Gmbh Sensor zur erfassung eines räumlichen temperaturprofils und verfahren zur herstellung einer sensoreinheit
US11268864B2 (en) 2017-07-25 2022-03-08 Heraeus Nexensos Gmbh Sensor unit for detecting a spatial temperature profile and method for producing a sensor unit
TWI843803B (zh) * 2019-02-06 2024-06-01 日商日東電工股份有限公司 溫度感測膜、導電膜及其製造方法
WO2022258877A1 (en) * 2021-06-08 2022-12-15 Teknologian Tutkimuskeskus Vtt Oy Improved negative temperature coefficient thermistor

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CN103210290A (zh) 2013-07-17
KR20130128383A (ko) 2013-11-26
US20130203201A1 (en) 2013-08-08
JP2013538462A (ja) 2013-10-10
CN103210290B (zh) 2015-12-09
EP2616784A1 (en) 2013-07-24
RU2013116739A (ru) 2014-10-20
EP2616784B1 (en) 2017-12-20
US9029180B2 (en) 2015-05-12
EP2616784A4 (en) 2015-09-09
ZA201301890B (en) 2014-05-28
JP5806316B2 (ja) 2015-11-10

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