KR20130128383A - 프린팅된 온도 센서 - Google Patents
프린팅된 온도 센서 Download PDFInfo
- Publication number
- KR20130128383A KR20130128383A KR1020137009246A KR20137009246A KR20130128383A KR 20130128383 A KR20130128383 A KR 20130128383A KR 1020137009246 A KR1020137009246 A KR 1020137009246A KR 20137009246 A KR20137009246 A KR 20137009246A KR 20130128383 A KR20130128383 A KR 20130128383A
- Authority
- KR
- South Korea
- Prior art keywords
- silicon
- printing
- contacts
- substrate
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 85
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 82
- 239000010703 silicon Substances 0.000 claims abstract description 82
- 238000000034 method Methods 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000007639 printing Methods 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000011230 binding agent Substances 0.000 claims abstract description 13
- 239000011856 silicon-based particle Substances 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- 239000002105 nanoparticle Substances 0.000 claims description 12
- 230000001419 dependent effect Effects 0.000 claims description 10
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000010408 film Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 18
- 238000013461 design Methods 0.000 description 18
- 229910052709 silver Inorganic materials 0.000 description 18
- 239000004332 silver Substances 0.000 description 18
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
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- 238000004528 spin coating Methods 0.000 description 2
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- 239000003981 vehicle Substances 0.000 description 2
- AJBZENLMTKDAEK-UHFFFAOYSA-N 3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-1,2,3,4,5,6,7,7a,9,10,11,11b,12,13,13a,13b-hexadecahydrocyclopenta[a]chrysene-4,9-diol Chemical compound CC12CCC(O)C(C)(C)C1CCC(C1(C)CC3O)(C)C2CCC1C1C3(C)CCC1C(=C)C AJBZENLMTKDAEK-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 235000003880 Calendula Nutrition 0.000 description 1
- 240000001432 Calendula officinalis Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
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- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007787 electrohydrodynamic spraying Methods 0.000 description 1
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- 239000000194 fatty acid Substances 0.000 description 1
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- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000007647 flexography Methods 0.000 description 1
- 239000005308 flint glass Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- -1 lead sulfide Chemical class 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
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- 238000001465 metallisation Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000001042 pigment based ink Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
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- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/226—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor using microstructures, e.g. silicon spreading resistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ZA2010/06532 | 2010-09-13 | ||
| ZA201006532 | 2010-09-13 | ||
| PCT/IB2011/054001 WO2012035494A1 (en) | 2010-09-13 | 2011-09-13 | Printed temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130128383A true KR20130128383A (ko) | 2013-11-26 |
Family
ID=45831072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137009246A Ceased KR20130128383A (ko) | 2010-09-13 | 2011-09-13 | 프린팅된 온도 센서 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9029180B2 (enExample) |
| EP (1) | EP2616784B1 (enExample) |
| JP (1) | JP5806316B2 (enExample) |
| KR (1) | KR20130128383A (enExample) |
| CN (1) | CN103210290B (enExample) |
| ES (1) | ES2663098T3 (enExample) |
| RU (1) | RU2013116739A (enExample) |
| WO (1) | WO2012035494A1 (enExample) |
| ZA (1) | ZA201301890B (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160114245A (ko) * | 2015-03-23 | 2016-10-05 | 삼성디스플레이 주식회사 | 온도 검출 소자 및 이를 이용한 온도 센서 |
| WO2019009631A1 (ko) * | 2017-07-05 | 2019-01-10 | 주식회사 이엠따블유 | 프린팅 공정을 이용한 센서의 제조방법 및 이에 의해 제조된 센서 |
| KR20190072268A (ko) * | 2017-12-15 | 2019-06-25 | (주) 텔로팜 | 최소 침습 기술을 이용한 식물의 수액 흐름 측정용 마이크로 니들 프로브 장치 |
| KR20200024567A (ko) * | 2018-08-28 | 2020-03-09 | 건국대학교 산학협력단 | 플렉시블 온도 센서를 활용한 온도 제어 시스템 |
| KR20210132262A (ko) * | 2020-04-24 | 2021-11-04 | 성균관대학교산학협력단 | 탈부착이 가능한 수유병 센싱 장치 및 상기 장치를 포함하는 수유병 모니터링 시스템 |
| US11231331B2 (en) | 2017-09-05 | 2022-01-25 | Littelfuse, Inc. | Temperature sensing tape |
| US11300458B2 (en) | 2017-09-05 | 2022-04-12 | Littelfuse, Inc. | Temperature sensing tape, assembly, and method of temperature control |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011047171A2 (en) | 2009-10-16 | 2011-04-21 | Kesumo, Llc | Foot-operated controller |
| WO2013114291A1 (en) * | 2012-01-30 | 2013-08-08 | Pst Sensors (Proprietary) Limited | Thermal imaging sensors |
| US9076419B2 (en) | 2012-03-14 | 2015-07-07 | Bebop Sensors, Inc. | Multi-touch pad controller |
| DE102012111458B4 (de) * | 2012-11-27 | 2022-12-08 | Tdk Electronics Ag | Halbleitervorrichtung |
| US20150108632A1 (en) * | 2013-10-23 | 2015-04-23 | Nano And Advanced Materials Institute Limited | Thin film with negative temperature coefficient behavior and method of making thereof |
| JP6024642B2 (ja) * | 2013-10-25 | 2016-11-16 | 株式会社デンソー | 熱電変換装置およびその製造方法 |
| WO2015096927A1 (en) * | 2013-12-27 | 2015-07-02 | Arcelik Anonim Sirketi | An induction cooker, the safe utilization of which is provided |
| US9281104B2 (en) * | 2014-03-11 | 2016-03-08 | Nano And Advanced Materials Institute Limited | Conductive thin film comprising silicon-carbon composite as printable thermistors |
| JP6574443B2 (ja) * | 2014-04-15 | 2019-09-11 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 温度測定のための低コストで磁気共鳴安全なプローブ |
| US9965076B2 (en) * | 2014-05-15 | 2018-05-08 | Bebop Sensors, Inc. | Piezoresistive sensors and applications |
| US9442614B2 (en) | 2014-05-15 | 2016-09-13 | Bebop Sensors, Inc. | Two-dimensional sensor arrays |
| US9753568B2 (en) | 2014-05-15 | 2017-09-05 | Bebop Sensors, Inc. | Flexible sensors and applications |
| US10362989B2 (en) | 2014-06-09 | 2019-07-30 | Bebop Sensors, Inc. | Sensor system integrated with a glove |
| SG10201900469PA (en) | 2014-07-22 | 2019-02-27 | Brewer Science Inc | Thin-film resistive-based sensor |
| US9931778B2 (en) | 2014-09-18 | 2018-04-03 | The Boeing Company | Extruded deposition of fiber reinforced polymers |
| US9863823B2 (en) | 2015-02-27 | 2018-01-09 | Bebop Sensors, Inc. | Sensor systems integrated with footwear |
| JP6532259B2 (ja) * | 2015-03-27 | 2019-06-19 | 東京コスモス電機株式会社 | 温度センサ |
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| KR20190072268A (ko) * | 2017-12-15 | 2019-06-25 | (주) 텔로팜 | 최소 침습 기술을 이용한 식물의 수액 흐름 측정용 마이크로 니들 프로브 장치 |
| KR20200024567A (ko) * | 2018-08-28 | 2020-03-09 | 건국대학교 산학협력단 | 플렉시블 온도 센서를 활용한 온도 제어 시스템 |
| KR20210132262A (ko) * | 2020-04-24 | 2021-11-04 | 성균관대학교산학협력단 | 탈부착이 가능한 수유병 센싱 장치 및 상기 장치를 포함하는 수유병 모니터링 시스템 |
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| ES2663098T3 (es) | 2018-04-11 |
| CN103210290A (zh) | 2013-07-17 |
| US20130203201A1 (en) | 2013-08-08 |
| JP2013538462A (ja) | 2013-10-10 |
| CN103210290B (zh) | 2015-12-09 |
| EP2616784A1 (en) | 2013-07-24 |
| WO2012035494A1 (en) | 2012-03-22 |
| RU2013116739A (ru) | 2014-10-20 |
| EP2616784B1 (en) | 2017-12-20 |
| US9029180B2 (en) | 2015-05-12 |
| EP2616784A4 (en) | 2015-09-09 |
| ZA201301890B (en) | 2014-05-28 |
| JP5806316B2 (ja) | 2015-11-10 |
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