ES2663098T3 - Método de producción de un sensor de temperatura impreso - Google Patents
Método de producción de un sensor de temperatura impreso Download PDFInfo
- Publication number
- ES2663098T3 ES2663098T3 ES11824675.0T ES11824675T ES2663098T3 ES 2663098 T3 ES2663098 T3 ES 2663098T3 ES 11824675 T ES11824675 T ES 11824675T ES 2663098 T3 ES2663098 T3 ES 2663098T3
- Authority
- ES
- Spain
- Prior art keywords
- silicon
- contacts
- temperature
- particles
- thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 87
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 87
- 239000010703 silicon Substances 0.000 claims abstract description 87
- 238000000034 method Methods 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000007639 printing Methods 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 30
- 239000002245 particle Substances 0.000 claims abstract description 23
- 239000011856 silicon-based particle Substances 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 239000011230 binding agent Substances 0.000 claims abstract description 13
- 238000005325 percolation Methods 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 238000012546 transfer Methods 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- 230000001419 dependent effect Effects 0.000 claims description 10
- 239000002105 nanoparticle Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 229910052709 silver Inorganic materials 0.000 description 19
- 239000004332 silver Substances 0.000 description 19
- 238000013461 design Methods 0.000 description 18
- 238000007650 screen-printing Methods 0.000 description 14
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- 239000000123 paper Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 239000005543 nano-size silicon particle Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 239000002657 fibrous material Substances 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000002159 nanocrystal Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 241000894007 species Species 0.000 description 3
- 239000004753 textile Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 235000021388 linseed oil Nutrition 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 235000005881 Calendula officinalis Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 244000027321 Lychnis chalcedonica Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 240000000785 Tagetes erecta Species 0.000 description 1
- 241000219793 Trifolium Species 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000005331 crown glasses (windows) Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007787 electrohydrodynamic spraying Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000007647 flexography Methods 0.000 description 1
- 239000005308 flint glass Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- -1 lead sulphide Chemical class 0.000 description 1
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000001042 pigment based ink Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/226—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor using microstructures, e.g. silicon spreading resistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ZA201006532 | 2010-09-13 | ||
| ZA201006532 | 2010-09-13 | ||
| PCT/IB2011/054001 WO2012035494A1 (en) | 2010-09-13 | 2011-09-13 | Printed temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2663098T3 true ES2663098T3 (es) | 2018-04-11 |
Family
ID=45831072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES11824675.0T Active ES2663098T3 (es) | 2010-09-13 | 2011-09-13 | Método de producción de un sensor de temperatura impreso |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9029180B2 (enExample) |
| EP (1) | EP2616784B1 (enExample) |
| JP (1) | JP5806316B2 (enExample) |
| KR (1) | KR20130128383A (enExample) |
| CN (1) | CN103210290B (enExample) |
| ES (1) | ES2663098T3 (enExample) |
| RU (1) | RU2013116739A (enExample) |
| WO (1) | WO2012035494A1 (enExample) |
| ZA (1) | ZA201301890B (enExample) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011047171A2 (en) | 2009-10-16 | 2011-04-21 | Kesumo, Llc | Foot-operated controller |
| WO2013114291A1 (en) * | 2012-01-30 | 2013-08-08 | Pst Sensors (Proprietary) Limited | Thermal imaging sensors |
| US9076419B2 (en) | 2012-03-14 | 2015-07-07 | Bebop Sensors, Inc. | Multi-touch pad controller |
| DE102012111458B4 (de) * | 2012-11-27 | 2022-12-08 | Tdk Electronics Ag | Halbleitervorrichtung |
| US20150108632A1 (en) * | 2013-10-23 | 2015-04-23 | Nano And Advanced Materials Institute Limited | Thin film with negative temperature coefficient behavior and method of making thereof |
| JP6024642B2 (ja) * | 2013-10-25 | 2016-11-16 | 株式会社デンソー | 熱電変換装置およびその製造方法 |
| WO2015096927A1 (en) * | 2013-12-27 | 2015-07-02 | Arcelik Anonim Sirketi | An induction cooker, the safe utilization of which is provided |
| US9281104B2 (en) * | 2014-03-11 | 2016-03-08 | Nano And Advanced Materials Institute Limited | Conductive thin film comprising silicon-carbon composite as printable thermistors |
| JP6574443B2 (ja) * | 2014-04-15 | 2019-09-11 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | 温度測定のための低コストで磁気共鳴安全なプローブ |
| US9965076B2 (en) * | 2014-05-15 | 2018-05-08 | Bebop Sensors, Inc. | Piezoresistive sensors and applications |
| US9442614B2 (en) | 2014-05-15 | 2016-09-13 | Bebop Sensors, Inc. | Two-dimensional sensor arrays |
| US9753568B2 (en) | 2014-05-15 | 2017-09-05 | Bebop Sensors, Inc. | Flexible sensors and applications |
| US10362989B2 (en) | 2014-06-09 | 2019-07-30 | Bebop Sensors, Inc. | Sensor system integrated with a glove |
| SG10201900469PA (en) | 2014-07-22 | 2019-02-27 | Brewer Science Inc | Thin-film resistive-based sensor |
| US9931778B2 (en) | 2014-09-18 | 2018-04-03 | The Boeing Company | Extruded deposition of fiber reinforced polymers |
| US9863823B2 (en) | 2015-02-27 | 2018-01-09 | Bebop Sensors, Inc. | Sensor systems integrated with footwear |
| KR102381654B1 (ko) * | 2015-03-23 | 2022-04-04 | 삼성디스플레이 주식회사 | 온도 검출 소자 및 이를 이용한 온도 센서 |
| JP6532259B2 (ja) * | 2015-03-27 | 2019-06-19 | 東京コスモス電機株式会社 | 温度センサ |
| US10082381B2 (en) | 2015-04-30 | 2018-09-25 | Bebop Sensors, Inc. | Sensor systems integrated with vehicle tires |
| US9827996B2 (en) | 2015-06-25 | 2017-11-28 | Bebop Sensors, Inc. | Sensor systems integrated with steering wheels |
| WO2017022373A1 (ja) | 2015-07-31 | 2017-02-09 | 株式会社村田製作所 | 温度センサ |
| US10034609B2 (en) * | 2015-11-05 | 2018-07-31 | Nano And Advanced Materials Institute Limited | Temperature sensor for tracking body temperature based on printable nanomaterial thermistor |
| EP3377867A1 (en) * | 2015-11-18 | 2018-09-26 | PST Sensors (Pty) Limited | Digital sensor |
| US10393598B1 (en) * | 2015-12-03 | 2019-08-27 | FluxTeq LLC | Heat flux gage |
| CN107560750A (zh) * | 2016-06-30 | 2018-01-09 | 国神光电科技（上海）有限公司 | 一种测温电路及一种测温结构 |
| CN106322457B (zh) * | 2016-09-09 | 2018-10-23 | 深圳拓邦股份有限公司 | 一种电磁灶 |
| DE102016119340A1 (de) * | 2016-10-11 | 2018-04-12 | Heraeus Sensor Technology Gmbh | Verfahren zur Herstellung eines Sensors, Sensor und Verwendung eines Sensors |
| WO2018073826A1 (en) * | 2016-10-22 | 2018-04-26 | Lapidot Matan | Mobile inspection system for the detection of defect occurrence and location |
| CN106556474A (zh) * | 2016-11-23 | 2017-04-05 | 合肥舒实工贸有限公司 | 热敏电阻温度传感器 |
| CN106370318A (zh) * | 2016-11-23 | 2017-02-01 | 合肥舒实工贸有限公司 | 热敏电阻温度传感器 |
| CN106644144A (zh) * | 2016-11-23 | 2017-05-10 | 合肥舒实工贸有限公司 | 热敏电阻温度传感器 |
| CN106556473A (zh) * | 2016-11-23 | 2017-04-05 | 合肥舒实工贸有限公司 | 热敏电阻温度传感器 |
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-
2011
- 2011-09-13 CN CN201180054592.XA patent/CN103210290B/zh not_active Expired - Fee Related
- 2011-09-13 WO PCT/IB2011/054001 patent/WO2012035494A1/en not_active Ceased
- 2011-09-13 RU RU2013116739/07A patent/RU2013116739A/ru unknown
- 2011-09-13 JP JP2013528807A patent/JP5806316B2/ja not_active Expired - Fee Related
- 2011-09-13 KR KR1020137009246A patent/KR20130128383A/ko not_active Ceased
- 2011-09-13 EP EP11824675.0A patent/EP2616784B1/en not_active Not-in-force
- 2011-09-13 ES ES11824675.0T patent/ES2663098T3/es active Active
- 2011-09-13 US US13/822,965 patent/US9029180B2/en not_active Expired - Fee Related
-
2013
- 2013-03-13 ZA ZA2013/01890A patent/ZA201301890B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN103210290A (zh) | 2013-07-17 |
| KR20130128383A (ko) | 2013-11-26 |
| US20130203201A1 (en) | 2013-08-08 |
| JP2013538462A (ja) | 2013-10-10 |
| CN103210290B (zh) | 2015-12-09 |
| EP2616784A1 (en) | 2013-07-24 |
| WO2012035494A1 (en) | 2012-03-22 |
| RU2013116739A (ru) | 2014-10-20 |
| EP2616784B1 (en) | 2017-12-20 |
| US9029180B2 (en) | 2015-05-12 |
| EP2616784A4 (en) | 2015-09-09 |
| ZA201301890B (en) | 2014-05-28 |
| JP5806316B2 (ja) | 2015-11-10 |
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