WO2011135763A1 - 4-メチル-1-ペンテン系重合体からなる樹脂微粉末、およびそれを含む組成物、ならびにその製造方法 - Google Patents
4-メチル-1-ペンテン系重合体からなる樹脂微粉末、およびそれを含む組成物、ならびにその製造方法 Download PDFInfo
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- WO2011135763A1 WO2011135763A1 PCT/JP2011/000699 JP2011000699W WO2011135763A1 WO 2011135763 A1 WO2011135763 A1 WO 2011135763A1 JP 2011000699 W JP2011000699 W JP 2011000699W WO 2011135763 A1 WO2011135763 A1 WO 2011135763A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F110/00—Homopolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
- C08F110/14—Monomers containing five or more carbon atoms
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
- C04B38/06—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof by burning-out added substances by burning natural expanding materials or by sublimating or melting out added substances
- C04B38/063—Preparing or treating the raw materials individually or as batches
- C04B38/0635—Compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09D123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00793—Uses not provided for elsewhere in C04B2111/00 as filters or diaphragms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08J2323/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
Definitions
- the present invention relates to a resin fine powder comprising a 4-methyl-1-pentene polymer and a composition containing the same.
- An olefin polymer containing a structural unit derived from 4-methyl-1-pentene (hereinafter also referred to as 4-methyl-1-pentene polymer) is a catalyst comprising a transition metal compound and an organoaluminum compound, so-called Although it is generally produced using a Ziegler type catalyst (see Patent Document 2), it is also reported that it can be obtained using a metallocene catalyst (see Patent Document 1).
- 4-Methyl-1-pentene polymer is a resin with excellent heat resistance as well as transparency, gas permeability, chemical resistance, and peelability. It is used in various fields such as medical instruments, heat resistant wires, heat resistant tableware, and stripping materials. It's being used. In particular, by utilizing the low surface tension of 4-methyl-1-pentene polymer, it is used as a release film or as a release wax (see Patent Document 1).
- a bulk obtained by a polymerization reaction may be used. You may use the bulk obtained by the polymerization reaction by blending with other resin.
- the bulk obtained by the polymerization reaction or a blend thereof may be pelletized as necessary or formed into a desired shape (for example, a film shape).
- the bulk obtained by the polymerization reaction may be oligomerized by thermal decomposition. The oligomer may be blended with other resins or formed into a desired shape. Either method is preferable from the viewpoint of production cost.
- a powdery resin having a high melting point and a low surface tension is required, for example, for mixing with a sinterable powder, more specifically for a porous sintered material composition or a metallurgical composition. ing.
- a powdery resin to be added to the sinterable powder for example, an amide resin powder may be used.
- An amide resin powder or the like may generate an odor due to thermal decomposition in the sintering process.
- the present invention pays attention to the fact that a 4-methyl-1-pentene polymer has a high melting point, a low surface tension, and the generation of odor is suppressed even when thermally decomposed.
- the use of 1-pentene polymer fine powder as an additive in the form of fine powder to various compositions was investigated. As a result, it was found that the 4-methyl-1-pentene polymer can be pulverized by pulverization by performing a specific pretreatment. Further, it has been found that a relatively low molecular weight 4-methyl-1-pentene polymer can be pulverized more efficiently and pulverized than other olefin polymers.
- an object of the present invention is to provide a fine powder of 4-methyl-1-pentene polymer and to apply it as an additive for various compositions.
- effective utilization of the facet is realized by using a facet for cutting the 4-methyl-1-pentene polymer as a raw material for the fine powder of 4-methyl-1-pentene type polymer.
- the first of the present invention relates to the following resin fine powder.
- the second aspect of the present invention relates to the following composition containing resin fine powder.
- [5] (A) 0.1 to 150 parts by mass of the resin fine powder according to [1], and (B) 100 parts by mass of at least one sinterable powder selected from the group consisting of a metal and a ceramic powder;
- a composition containing [6] The composition according to [5], wherein the composition further comprises (C) 5 to 200 parts by mass of a plasticizing binder.
- a method for producing a porous sintered body comprising: a step of extruding and molding the composition according to [5] to obtain a formed body; and a step of sintering the formed body.
- the manufacturing method according to [7] wherein the porous sintered body is a honeycomb filter.
- 3rd of this invention is related with the method of manufacturing the resin fine powder shown below.
- the bulk or coarsely pulverized product is a thermal decomposition product of a 4-methyl-1-pentene polymer.
- the resin fine powder of the present invention comprises a 4-methyl-1-pentene polymer; the 4-methyl-1-pentene polymer has a high melting point, low surface tension, lubricity, lubricity, and thermal decomposition. May have a characteristic of not generating odor. Utilizing these characteristics, the resin fine powder of the present invention can be used in various applications. That is, the use as an additive of a metallurgical composition, an additive of a composition for ceramic sintered materials, an additive of a pressure-sensitive adhesive, an additive of rubber, etc. can be considered. In addition to the above properties, 4-methyl-1-pentene polymer has low density and transparency, so it is considered useful as an additive for inks and paints. There are various applications.
- FIG. 2 is an electron microscope (SEM) photograph (magnification 2000 times) of TPX fine particles obtained in Example 1.
- FIG. 4 is an electron microscope (SEM) photograph (magnification 2000 times) of TPX fine particles obtained in Example 2.
- FIG. 4 is an electron microscope (SEM) photograph (magnification 1000 times) of TPX fine particles obtained in Example 3.
- FIG. 2 is a graph showing the particle size distribution of the powder obtained in Example 1.
- the X axis shows the particle size of the powder
- the Y axis (right side) shows the number of powders corresponding to the particle size (see histogram)
- the Y axis (left side) shows the cumulative number distribution of the powder (curve) reference).
- 4 is a graph showing the particle size distribution of the powder obtained in Example 2.
- the X axis shows the particle size of the powder
- the Y axis (right side) shows the number of powders corresponding to the particle size (see histogram)
- the Y axis (left side) shows the cumulative number distribution of the powder (curve) reference).
- 6 is a graph showing the particle size distribution of the powder obtained in Example 3.
- the X axis shows the particle size of the powder
- the Y axis (right side) shows the number of powders corresponding to the particle size (see histogram)
- the Y axis (left side) shows the cumulative number distribution of the powder (curve) reference).
- 6 is a graph showing the particle size distribution of the powder obtained in Example 4.
- the X axis shows the particle size of the powder
- the Y axis (right side) shows the number of powders corresponding to the particle size (see histogram)
- the Y axis (left side) shows the cumulative number distribution of the powder (curve) reference).
- 6 is a graph showing the particle size distribution of the powder obtained in Example 5.
- the X axis shows the particle size of the powder
- the Y axis (right side) shows the number of powders corresponding to the particle size (see histogram)
- the Y axis (left side) shows the cumulative number distribution of the powder (curve) reference).
- the resin fine powder of the present invention contains a 4-methyl-1-pentene polymer.
- the 4-methyl-1-pentene polymer is a polymer in which at least a part of the structural unit is a structural unit derived from 4-methyl-1-pentene.
- the ratio of the structural unit derived from 4-methyl-1-pentene to the total structural unit of the 4-methyl-1-pentene polymer constituting the resin fine powder of the present invention is 50 to 100% by mass. It is preferably 60 to 100% by mass, more preferably 70 to 100% by mass, and particularly preferably 90 to 100% by mass.
- the structural unit other than the structural unit derived from 4-methyl-1-pentene contained in the 4-methyl-1-pentene polymer is preferably a structural unit derived from an olefin having 2 to 20 carbon atoms. .
- the total proportion of structural units derived from olefins having 2 to 20 carbon atoms other than 4-methyl-1-pentene relative to all structural units of the 4-methyl-1-pentene polymer is 0 to 50% by mass. It is preferably 0 to 40% by mass, more preferably 0 to 30% by mass, and particularly preferably 0 to 10% by mass.
- olefins having 2 to 20 carbon atoms other than 4-methyl-1-pentene contained as constituent units in 4-methyl-1-pentene polymers include linear or branched ⁇ -olefins, cyclic Olefin, aromatic vinyl compounds, conjugated dienes, non-conjugated polyenes, functionalized vinyl compounds and the like are included.
- linear or branched ⁇ -olefins contained as structural units in the 4-methyl-1-pentene polymer include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1 A linear ⁇ -olefin having 2 to 20 carbon atoms, preferably 2 to 10 carbon atoms, such as -octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene; 3 -Methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4,4-dimethyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene Preferably 5 to 20, more preferably 5 to 10 branched ⁇ -olefins such as 4-ethyl-1-hexene, 3-ethyl-1-hexene and
- cyclic olefin contained as a structural unit in the 4-methyl-1-pentene polymer include carbon atoms such as cyclopentene, cycloheptene, norbornene, 5-methyl-2-norbornene, tetracyclododecene, and vinylcyclohexane. Included are cyclic olefins of 3 to 20, preferably 5 to 15.
- aromatic vinyl compound contained as a structural unit in the 4-methyl-1-pentene polymer examples include styrene, ⁇ -methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, o , mono- or polyalkyl styrenes such as p-dimethyl styrene, o-ethyl styrene, m-ethyl styrene, p-ethyl styrene.
- conjugated dienes contained as constituent units in 4-methyl-1-pentene polymers include 1,3-butadiene, isoprene, chloroprene, 1,3-pentadiene, 2,3-dimethylbutadiene, 4-methyl- Conjugated dienes having 4 to 20 carbon atoms, preferably 4 to 10 carbon atoms, such as 1,3-pentadiene, 1,3-pentadiene, 1,3-hexadiene, and 1,3-octadiene are included.
- non-conjugated polyene contained as a structural unit in the 4-methyl-1-pentene polymer include 1,4-pentadiene, 1,4-hexadiene, 1,5-hexadiene, 1,4-octadiene, 1, 1,5-octadiene, 1,6-octadiene, 1,7-octadiene, 2-methyl-1,5-hexadiene, 6-methyl-1,5-heptadiene, 7-methyl-1,6-octadiene, 4-ethylidene -8-methyl-1,7-nonadiene, 4,8-dimethyl-1,4,8-decatriene (DMDT), dicyclopentadiene, cyclohexadiene, dicyclooctadiene, methylene norbornene, 5-vinyl norbornene, 5- Ethylidene-2-norbornene, 5-methylene-2-norbornene, 5-isopropylidene-2-
- Examples of the functionalized vinyl compound contained as a structural unit in the 4-methyl-1-pentene polymer include a hydroxyl group-containing olefin; a halogenated olefin; acrylic acid, propionic acid, 3-butenoic acid, 4-pentenoic acid, 5 Unsaturated carboxylic acids such as -hexenoic acid, 6-heptenoic acid, 7-octenoic acid, 8-nonenoic acid and 9-decenoic acid; unsaturated amines such as allylamine, 5-hexenamine and 6-heptenamine; 7-octadienyl) succinic anhydride, pentapropenyl succinic anhydride, and compounds exemplified as the above unsaturated carboxylic acids, unsaturated acid anhydrides such as compounds in which the carboxylic acid group is replaced with a carboxylic acid anhydride group; In the compounds exemplified as the unsaturated carboxylic acids, the unsatur
- Boronic acid halides 4-epoxy-1-butene, 5-epoxy-1-pentene, 6-epoxy-1-hexene, 7-epoxy-1-heptene, 8-epoxy-1-octene, 9-epoxy-1 And unsaturated epoxy compounds such as -nonene, 10-epoxy-1-decene, and 11-epoxy-1-undecene.
- the hydroxyl group-containing olefin contained in the 4-methyl-1-pentene polymer as a structural unit is not particularly limited as long as it is a hydroxyl group-containing olefin compound, and examples thereof include terminal hydroxylated olefin compounds.
- terminal hydroxylated olefin compound examples include vinyl alcohol, allyl alcohol, hydroxylated 1-butene, hydroxylated 1-pentene, hydroxylated 1-hexene, hydroxylated 1-octene, and hydroxylated 1- Decene, hydroxyl-1-dodecene, hydroxyl-1-tetradecene, hydroxyl-1-hexadecene, hydroxyl-1-octadecene, hydroxyl-1-octadecene, hydroxyl-1-eicosene, etc.
- halogenated olefins contained as a structural unit in the 4-methyl-1-pentene polymer include halogenated ⁇ -olefins having a group 17 atom of the periodic table such as chlorine, bromine and iodine, such as vinyl halide, Halogenated-1-butene, halogenated-1-pentene, halogenated-1-hexene, halogenated-1-octene, halogenated-1-decene, halogenated-1-dodecene, halogenated-1-tetradecene, halogen 1-hexadecene, halogenated-1-octadecene, halogenated-1-eicosene, etc., linear halogenated ⁇ -olefins having 2 to 20 carbon atoms, preferably 2 to 10 carbon atoms; halogenated-3- Methyl-1-butene, halogenated-4-methyl-1-pentene,
- olefins contained as a structural unit together with 4-methyl-1-pentene include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, and 3-methyl- 1-pentene, 3-ethyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3- Examples include ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene, vinylcyclohexane, styrene and the like.
- the 4-olefin-1-pentene polymer (B) may contain one olefin or a combination of two or more olefins as a constituent unit together
- the distribution (Mw / Mn) is 1.0 to 20.0, may be 1.0 to 10.0, or may be 1.0 to 5.0.
- a weight average molecular weight (Mw) and a number average molecular weight (Mn) are polystyrene conversion values measured by gel permeation chromatography (GPC), respectively.
- the GPC measurement may be performed at a temperature of 140 ° C. and the developing solvent as orthodichlorobenzene.
- the lower limit of the melting point (Tm) of the 4-methyl-1-pentene polymer measured by a differential scanning calorimeter is preferably 120 ° C, more preferably 160 ° C, and 180 ° C. Is more preferable, and 200 ° C. is particularly preferable.
- the upper limit of the melting point (Tm) is preferably 245 ° C., more preferably 240 ° C., further preferably 235 ° C., and particularly preferably 230 ° C.
- the 4-methyl-1-pentene polymer has a high melting point among polyolefin resins. This is presumably because the 4-methyl-1-pentene polymer has bulky side chains and the molecular chains are difficult to move.
- the melting point is measured using a differential scanning calorimeter (Diamond DSC, manufactured by PerkinElmer). About 5 mg of a sample is packed in an aluminum pan and heated to 280 ° C. at 10 ° C./min; 280 ° C. for 5 minutes. Hold; cooled at 10 ° C./min to 30 ° C .; held at 30 ° C. for 5 min; endothermic peak when heated to 280 ° C. at 10 ° C./min is taken as the melting point.
- a differential scanning calorimeter Diamond DSC, manufactured by PerkinElmer
- the intrinsic viscosity [ ⁇ ] (dl / g) of the 4-methyl-1-pentene polymer measured at 135 ° C. in a decalin solvent is preferably 1 ⁇ 10 ⁇ 2 to 3.0.
- the 4-methyl-1-pentene polymer may be broadly classified into two types depending on the intrinsic viscosity [ ⁇ ]. The first is a polymer having an intrinsic viscosity [ ⁇ ] in the range of 5 ⁇ 10 ⁇ 1 to 3.0, and is a relatively high molecular weight 4-methyl-1-pentene polymer. The second is a polymer having an intrinsic viscosity [ ⁇ ] in the range of 1 ⁇ 10 ⁇ 2 to 5 ⁇ 10 ⁇ 1 and a 4-methyl-1-pentene polymer having a relatively low molecular weight.
- the critical surface tension of the 4-methyl-1-pentene polymer is preferably 22 to 28 mN / m, more preferably 23 to 27.5 mN / m, still more preferably 23.5 to 27.5 mN / m, and particularly preferably Is 24.0-27.5 mN / m.
- the critical surface tension depends on the 4-methyl-1-pentene unit in the 4-methyl-1-pentene polymer.
- the content of the 4-methyl-1-pentene constituent unit is 50 to 100% by weight, preferably 60 to 100% by weight, more preferably 70 to 100% by weight, Particularly preferred is 80 to 100% by weight.
- the resin fine powder of 4-methyl-1-pentene polymer having a critical surface tension in this range can enhance the fluidity of the powder composition containing the resin fine powder.
- the 4-methyl-1-pentene polymer can be obtained by directly polymerizing olefins.
- the polymerization catalyst used for the polymerization include JP-A-57-63310, JP-A-58-83006, JP-A-3-706, JP-A-3476793, JP-A-4-218508, Magnesium-supported titanium catalysts described in JP 2003-105022 A, etc .; WO 01/53369, WO 01/27124, JP 3-19396 A, or JP 2-41303 A
- the metallocene catalysts described in the above are preferably used.
- a catalyst containing a polyether as an electron donor component is particularly preferable because a polymer having a relatively narrow molecular weight distribution tends to be obtained.
- the 4-methyl-1-pentene polymer contained in the composition of the present invention can be produced using a metallocene catalyst.
- a metallocene catalyst an olefin polymerization catalyst using a metallocene compound represented by the following general formula (1) or (2) is preferably used.
- R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 is selected from hydrogen, a hydrocarbon group, and a silicon-containing hydrocarbon group, and may be the same or different.
- R 1 to R 4 adjacent to each other may be bonded to each other to form a ring;
- R 5 to R 12 adjacent to each other may be bonded to each other to form a ring.
- a in the general formula (2) is a divalent hydrocarbon group having 2 to 20 carbon atoms which may partially contain an unsaturated bond and / or an aromatic ring.
- A may contain two or more ring structures including a ring formed with Y.
- M in the general formula (1) or (2) is a metal selected from Group 4 of the periodic table.
- Y may be carbon or silicon
- Q may be selected from halogen, hydrocarbon group, anionic ligand or neutral ligand capable of coordinating with a lone pair, in the same or different combination
- j is 1 to 4 It is an integer.
- Preferred examples of the hydrocarbon group represented by R 1 to R 14 in the general formula (1) or (2) include an alkyl group having 1 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, An aryl group having 6 to 20 carbon atoms or an alkylaryl group having 7 to 20 carbon atoms is included, and may contain one or more ring structures. Specific examples thereof include methyl, ethyl, n-propyl, isopropyl, 2-methylpropyl, 1,1-dimethylpropyl, 2,2-dimethylpropyl, 1,1-diethylpropyl, 1-ethyl-1-methyl.
- Preferred examples of the silicon-containing hydrocarbon group represented by R 1 to R 14 in the general formula (1) or (2) include alkylsilyl groups having 1 to 4 silicon atoms and 3 to 20 carbon atoms, or An arylsilyl group is included. Specific examples thereof include trimethylsilyl, tert-butyldimethylsilyl, triphenylsilyl and the like.
- R 1 and R 3 are preferably hydrogen, and R 2 is preferably a hydrocarbon group or a silicon-containing hydrocarbon group.
- R 2 is more preferably a sterically bulky substituent, and R 2 is particularly preferably a substituent having 4 or more carbon atoms.
- the adjacent substituents may be bonded to each other to form a ring. That is, the substituted fluorenyl group in the general formula (1) or (2) may be benzofluorenyl, dibenzofluorenyl, octahydrodibenzofluorenyl, octamethyloctahydrodibenzofluorenyl, or the like.
- R 13 and R 14 in the general formula (1) are selected from hydrogen and a hydrocarbon group, and may be the same or different from each other.
- Specific examples of preferred hydrocarbon groups include the same hydrocarbon groups represented by R 1 to R 14 .
- Y in the general formula (1) is carbon or silicon, and is bonded to R 13 and R 14 to form a substituted methylene group or a substituted silylene group as a bridging portion.
- substituted methylene groups include methylene, dimethylmethylene, diisopropylmethylene, methyl tert-butylmethylene, dicyclohexylmethylene, methylcyclohexylmethylene, methylphenylmethylene, diphenylmethylene, methylnaphthylmethylene, dinaphthylmethylene;
- Specific examples of the silylene group include dimethylsilylene, diisopropylsilylene, methyl tert-butylsilylene, dicyclohexylsilylene, methylcyclohexylsilylene, methylphenylsilylene, diphenylsilylene, methylnaphthylsilylene, dinaphthylsilylene and the like.
- Y in the general formula (2) is carbon or silicon, and is bonded to a divalent hydrocarbon group A having 2 to 20 carbon atoms, which may contain an unsaturated bond and / or an aromatic ring, to form a cycloalkylidene group Alternatively, it constitutes a cyclomethylenesilylene group or the like.
- preferred cycloalkylidene groups include cyclopropylidene, cyclobutylidene, cyclopentylidene, cyclohexylidene, cycloheptylidene, bicyclo [3.3.1] nonylidene, norbornylidene, adamantylidene, tetrahydronaphthylidene
- preferred cyclomethylenesilylene groups include cyclodimethylenesilylene, cyclotrimethylenesilylene, cyclotetramethylenesilylene, cyclopentamethylenesilylene, cyclohexamethylenesilylene, cycloheptamethylenesilylene. Etc. are included.
- M in the general formulas (1) and (2) is a metal element selected from Group 4 of the periodic table, and may be titanium, zirconium, hafnium, or the like.
- Q in the general formulas (1) and (2) is the same or different from halogen, a hydrocarbon group having 1 to 20 carbon atoms, an anionic ligand, or a neutral ligand capable of coordinating with a lone pair of electrons.
- halogen include fluorine, chlorine, bromine and iodine.
- hydrocarbon group include the same hydrocarbon groups represented by R 1 to R 14 .
- anionic ligand include alkoxy groups such as methoxy, tert-butoxy and phenoxy; carboxylate groups such as acetate and benzoate; sulfonate groups such as mesylate and tosylate.
- organophosphorus compounds such as trimethylphosphine, triethylphosphine, triphenylphosphine, diphenylmethylphosphine; or tetrahydrofuran, diethyl ether, dioxane, 1,2- Ethers such as dimethoxyethane are included.
- Q may be the same or different combinations, but at least one is preferably a halogen or an alkyl group.
- the metallocene compound in the present invention include compounds exemplified in WO01 / 27124, but the scope of the present invention is not particularly limited thereby.
- the metallocene compound represented by the general formula (1) is preferable from the viewpoint of molecular weight distribution and terminal structure.
- the 4-methyl-1-pentene polymer (B) contained in the resin composition of the present invention can be produced using a metallocene catalyst.
- the catalyst composition contains the following components. It is preferable.
- the polymerization for obtaining a 4-methyl-1-pentene polymer using a metallocene catalyst may be either a liquid phase polymerization method such as a solution polymerization method or a suspension polymerization method, or a gas phase polymerization method.
- a liquid phase polymerization method such as a solution polymerization method or a suspension polymerization method
- a gas phase polymerization method in the liquid phase polymerization method.
- an inert hydrocarbon solvent include aliphatic carbonization such as propane, butane, pentane, hexane, heptane, octane, decane, dodecane, and kerosene.
- cycloaliphatic hydrocarbons such as cyclopentane, cyclohexane, and methylcyclopentane
- aromatic hydrocarbons such as benzene, toluene, and xylene
- halogenated hydrocarbons such as ethylene chloride, chlorobenzene, and dichloromethane, or mixtures thereof
- olefins containing 4-methyl-1-pentene as a polymerization monomer can be used as a solvent.
- the amount of component (i) is usually 10 ⁇ 8 to 10 ⁇ 2 mol, preferably 10 ⁇ 7 to 10 ⁇ 3 mol per liter of the polymerization reaction volume.
- the molar ratio [(ii-1) / M] of the component (ii-1) and the transition metal atom (M) in the component (i) is usually 0.01 to 5000. It is preferably 0.05 to 2000.
- the molar ratio [(ii-2) / M] of the aluminum atom of component (ii-2) to the transition metal atom (M) in component (i) is usually 10 to 5000, preferably Set to 20-2000.
- the molar ratio [(ii-3) / M] of component (ii-3) to transition metal atom (M) in component (i) is usually 1 to 10, preferably 1 to 5. To be.
- the temperature of the polymerization reaction for obtaining a 4-methyl-1-pentene polymer using a metallocene catalyst is usually in the range of ⁇ 50 to 400 ° C., preferably 10 to 300 ° C., more preferably 10 to 250 ° C. . If the polymerization temperature is too low, the polymerization activity per unit catalyst is lowered, which is not industrially preferable.
- the polymerization pressure is usually from normal pressure to 10 MPa gauge pressure, preferably from normal pressure to 5 MPa gauge pressure.
- the polymerization reaction can be carried out in any of batch, semi-continuous and continuous methods. Furthermore, the polymerization can be performed in two or more stages having different reaction conditions.
- the polymerization activity can be controlled, and the molecular weight and intrinsic viscosity [ ⁇ ] of the 4-methyl-1-pentene polymer can be adjusted.
- the amount of hydrogen gas introduced is suitably about 0.001 to 100,000 NL per kg of olefin.
- Relatively low molecular weight 4-methyl-1-pentene polymers may be obtained by direct polymerization of olefins; comparative low molecular weight 4-methyl-1-pentene polymers obtained by polymerization may be obtained. It may be obtained by thermal decomposition. The thermally decomposed 4-methyl-1-pentene polymer may be subjected to solvent fractionation (fractionation based on a difference in solubility in a solvent) or molecular distillation (fractionation based on a difference in boiling point).
- the conditions (decomposition temperature and decomposition time) for pyrolyzing the 4-methyl-1-pentene polymer before pyrolysis, which is the base, depend on the desired molecular weight and intrinsic viscosity [ ⁇ ] after pyrolysis. Set as appropriate.
- the decomposition temperature is usually in the range of 150 to 450 ° C., preferably in the range of 250 to 440 ° C., particularly preferably in the range of 350 to 430 ° C.
- the decomposition time is usually 5 to 300 minutes, preferably 10 to 240 minutes, more preferably 15 to 180 minutes.
- the average particle diameter D 50 of the resin fine powder of the present invention is preferably 50 ⁇ m or less, can be 20 ⁇ m or less, and can be 10 ⁇ m or less. More specifically, the lower limit of the average particle diameter D 50 of the resin fine powder is preferably 1.0 ⁇ 10 ⁇ 1 ⁇ m, more preferably 5.0 ⁇ 10 ⁇ 1 ⁇ m, and 7.0 It is more preferable that it is ⁇ 10 ⁇ 1 ⁇ m, and it is particularly preferable that it is 1.0 ⁇ m.
- the upper limit of the average particle diameter D 50 of the fine resin fines preferably from 5.0 ⁇ 10 [mu] m, more preferably 3.0 ⁇ 10 [mu] m, further preferably from 1.0 ⁇ 10 [mu] m, A thickness of 5.0 ⁇ m is particularly preferable.
- the average particle diameter D 50 of the fine resin fines is measured using a laser diffraction particle size distribution measuring apparatus. Specifically, as a measurement sample of resin fine powder dispersed in a dispersion solvent, it determined the particle size distribution based on the laser diffraction scattering method, an average particle diameter D 50 of the particle size distribution obtained.
- the average particle diameter D 50 is a particle diameter corresponding to 50% from the smallest particle diameter of the cumulative distribution curve; that is, when the powder group is divided into two groups based on a certain particle diameter, large particles
- the average particle diameter D 50 of the fine resin fines obtained by pulverizing a resin mass of 4-methyl-1-pentene polymer may tend to decrease. Further, the particle size distribution of the resin fine powder obtained by pulverizing the resin mass of 4-methyl-1-pentene polymer tends to be relatively narrow. In particular, there is a tendency for the proportion of coarse particles to be low. These tendencies are characterized in that the 4-methyl-1-pentene polymer has a relatively bulky side chain, a low packing density of atoms, and a low intermolecular force among polyolefin resins. This is probably because of this. It is also considered that 4-methyl-1-pentene polymer has characteristics such as high glass transition temperature and rigidity because its molecular chain hardly moves.
- the resin fine powder of the present invention is characterized by high fluidity despite a relatively small particle size.
- High fluidity means that, for example, “the angle of repose” is small.
- the angle of repose of the resin fine powder of the present invention is smaller than that of polyethylene powder of the same size.
- the angle of repose is measured according to JISJR 9301.
- the resin fine powder of the present invention is excellent in releasability and lubricity. Therefore, the resin fine powder of 4-methyl-1-pentene polymer exhibits high fluidity.
- the resin fine powder of the present invention is a powder obtained by pulverization and is obtained as a dry powder. That is, it is different from powdered resin particles obtained by polymerizing monomer components in a solvent, such as emulsion polymerization.
- the method for producing the resin fine powder of 4-methyl-1-pentene polymer of the present invention can be roughly classified into two.
- One is a method in which a high molecular weight 4-methyl-1-pentene polymer is optionally pretreated and jet pulverized.
- the other is a method of jet pulverizing a low molecular weight 4-methyl-1-pentene polymer.
- the high molecular weight 4-methyl-1-pentene polymer generally means a polymer having an intrinsic viscosity [ ⁇ ] of 5.0 ⁇ 10 ⁇ 1 dl / g or more and less than 3.0 dl / g.
- a pulverized 4-methyl-1-pentene polymer having an intrinsic viscosity [ ⁇ ] of 5.0 ⁇ 10 ⁇ 1 dl / g or more and less than 3.0 dl / g is less sticky and excellent in handling. .
- a high molecular weight 4-methyl-1-pentene polymer is generally difficult to pulverize, and it is particularly difficult to obtain a fine powder having a narrow particle size distribution (for example, an average particle size D50 of 50 ⁇ m or less). there were. Therefore, a high molecular weight 4-methyl-1-pentene polymer is pretreated so that it can be jet crushed.
- the pretreatment of the high molecular weight 4-methyl-1-pentene polymer should be carried out by appropriately selecting one or more treatments selected from cutter grinding, sieving treatment, solvent treatment, etc. according to the raw materials used. Is preferred.
- the high molecular weight 4-methyl-1-pentene polymer is roughly pulverized by cutter pulverization.
- the average particle diameter D 50 of the coarsely crushed product is preferably to such an extent 100 ⁇ m or less.
- high molecular weight 4-methyl-1-pentene polymer pellets are preferably pulverized by cutter and coarsely pulverized. The cutter pulverization may be performed using a cutter mill.
- the particle size distribution of high molecular weight 4-methyl-1-pentene polymer powder is sharpened.
- the mesh size of the filter used for the sieving process is preferably 1000 ⁇ m or less.
- the average particle diameter D 50 of the sieved product is preferably about 100 ⁇ m or less.
- chips (cut pieces) obtained by cutting pellets of a high molecular weight 4-methyl-1-pentene polymer include fine powders but also large powders. Therefore, it is preferable to extract only fine powder by performing a sieving treatment.
- Solvent treatment is to impregnate a 4-methyl-1-pentene polymer with a solvent; it is usually performed by immersing the polymer in a solvent.
- the solvent include aliphatic hydrocarbons such as n-hexane, methylcyclohexane, decane and tecarin: ethers such as tetrahydrofuran; halogenated hydrocarbons such as dichloromethane and chloroform.
- the immersion time in the solvent is generally 30 minutes to 24 hours, but about 3 to 4 hours is often sufficient.
- the temperature of the solvent to be immersed may be room temperature, but may be heated or cooled.
- the solvent treatment may be a pretreatment for cutter pulverization or a pretreatment for jet pulverization.
- the resin fine powder of the present invention can be obtained by jet-pulverizing the pre-treated 4-methyl-1-pentene polymer.
- the smaller the processing amount of jet pulverization (the amount of time per unit of raw material to be pulverized), the smaller the particle size of the pulverized product, but the lower the productivity.
- the larger the throughput of jet pulverization the larger the particle size of the pulverized product, but the higher the productivity.
- an ultrafine pulverizer may be used.
- NanoJet Mizer manufactured by Aisin Nano Technologies
- Jet pulverization may be performed only once, or may be repeated a plurality of times as necessary.
- a low molecular weight 4-methyl-1-pentene polymer is usually a heavy polymer having an intrinsic viscosity [ ⁇ ] of 1.0 ⁇ 10 ⁇ 2 dl / g or more and less than 5.0 ⁇ 10 ⁇ 1 dl / g. Refers to coalescence.
- a low molecular weight 4-methyl-1-pentene polymer is more easily pulverized than a high molecular weight 4-methyl-1-pentene polymer. Therefore, the low molecular weight 4-methyl-1-pentene polymer may or may not be subjected to pretreatment for jet pulverization.
- the low molecular weight 4-methyl-1-pentene polymer can be obtained by thermally decomposing a high molecular weight 4-methyl-1-pentene polymer, but can also be obtained by direct polymerization.
- the jet pulverization of the low molecular weight 4-methyl-1-pentene polymer may be performed by the same method as the jet pulverization of the high molecular weight 4-methyl-1-pentene polymer. Jet pulverization of a low molecular weight 4-methyl-1-pentene polymer is easier to pulverize than other polyolefins (polyethylene, polypropylene, etc.). This is because the 4-methyl-1-pentene polymer has a high glass transition temperature (Tg).
- Composition containing fine resin powder of 4-methyl-1-pentene polymer The fine powder of 4-methyl-1-pentene polymer of the present invention can be used for various applications.
- an additive for ink compositions and paint compositions as an additive for powder compositions for metallurgy, as an additive for powder compositions for ceramic sintering, as an additive for adhesives, as an additive for rubber, and as a toner
- a mold release agent it can be used as a mold release material.
- An example of a preferable composition of the present invention is a composition containing the fine resin powder described above and at least one sinterable powder selected from the group consisting of metal and ceramic powder.
- the content of the resin fine powder with respect to 100 parts by mass of the sinterable powder is 0.1 to 150 parts by mass, preferably 5 to 150 parts by mass, more preferably 10 to 100 parts by mass, and particularly preferably 15 to 85 parts by mass. is there. If the content of the resin fine powder is too small, it may be difficult to mold the composition due to a decrease in the lubricity of the composition, and it is difficult to release the molded body or the sintered body from the mold (the mold releasability decreases). )Sometimes. On the other hand, when the content of the resin fine powder is too large, not only the mold release property and the lubricity are saturated, but also the compressibility is lowered, and it may be difficult to obtain a desired sintered body.
- composition for porous sintered material contains the resin fine powder of the present invention, ceramic powder or metal powder, and a plasticizing binder.
- a porous sintered material can be obtained from the composition for porous sintered material of the present invention.
- the porous sintered material is, for example, a honeycomb filter.
- the honeycomb filter is used, for example, as a catalyst carrier for a catalytic converter of an automobile or a catalyst carrier for purifying diesel engine exhaust gas.
- Ceramic powder or metal powder is a material constituting the porous sintered body.
- the ceramic powder include cordierite, spinel, clay, talc, alumina, aluminum hydroxide, silica, calcium oxide, magnesium oxide, boron oxide, titanium oxide, germanium oxide, alkali, transition metal and the like.
- the metal powder include a powder mainly composed of iron, tungsten, copper, bronze, molybdenum, chromium, or nickel.
- the plasticized binder is often composed of a thermoplastic resin such as an ethylene / vinyl acetate copolymer, cellulose or a derivative thereof, a surfactant (stearic acid or oleic acid), oil, water, or the like.
- the content of the plasticizing binder in the porous sintered material composition is not particularly limited, but is preferably 5 to 200 parts by mass, and preferably 30 to 160 parts by mass with respect to 100 parts by mass of the sinterable powder. Is more preferable, and 40 to 100 parts by mass is particularly preferable.
- the content of the resin fine powder in the porous sintered material composition is 5 to 150 parts by mass, preferably 10 to 100 parts by mass, particularly preferably 15 to 100 parts by mass with respect to 100 parts by mass of the ceramic powder. It can be 85 parts by weight.
- the resin fine powder of the present invention acts as a pore forming material for forming pores in the sintered material in the porous sintered material composition.
- the sintering process for obtaining the porous sintered body is as follows: 1) a step of shaping the composition for porous sintered material through an extrusion die to form an unfired body, and 2) heating the unfired body to form pores. A step of removing the material, and 3) a step of firing the green body from which the pore forming material has been removed. That is, the resin fine powder of the present invention vaporizes or decomposes when the green body is heated, thereby forming pores in the obtained ceramic sintered material.
- the material composition for a porous sintered material of the present invention increases the density of spherical granules in the step of forming an unfired body, and therefore is easily caught in a kneading screw during kneading. Furthermore, the resin fine powder of the present invention also acts as a lubricant for the raw material powder (metal powder or ceramic powder). As a result, the porous sintered material composition of the present invention is uniformly kneaded in a short time.
- the resin fine powder of the present invention is a fine powder composed of a 4-methyl-1-pentene polymer, and the 4-methyl-1-pentene polymer is decomposed in comparison with polyolefins such as polyethylene.
- the temperature is low. Therefore, even if the heating temperature of the green body is low, it can be removed.
- the sintered body when removing the pore forming agent by heating the green body, if the pore forming agent melts at a low temperature, the sintered body may be deformed by its own weight. is there. Since the resin fine powder of the present invention has a high melting point, it is difficult to melt while the green body is heated. Therefore, deformation of the green body during heating is suppressed.
- the lower limit of the average particle diameter D 50 of the pore forming agent in the composition for porous sintered material is preferably 1.0 ⁇ 10 ⁇ 1 ⁇ m, more preferably 5.0 ⁇ 10 ⁇ 1 ⁇ m. Preferably, it is 7.0 ⁇ 10 ⁇ 1 ⁇ m, more preferably 1.0 ⁇ m. This is because pores may not be formed in the sintered body with a pore-forming agent having an excessively small particle size.
- the upper limit of the average particle diameter D 50 of the pore forming agent is preferably 5.0 ⁇ 10 ⁇ m, more preferably 3.0 ⁇ 10 ⁇ m, and further preferably 1.0 ⁇ 10 ⁇ m. 5.0 ⁇ m is particularly preferable. A pore forming agent having an excessively large particle diameter may not provide sufficient strength of the porous sintered body.
- the metallurgical composition of the present invention includes the resin fine powder of the present invention and a sinterable powder. From the metallurgical composition, for example, a metal member that is a sintered body can be obtained.
- the sinterable powder is a material constituting the obtained sintered body.
- Sinterable powders are typically ceramic powders or metal powders; examples of metal powders include powders based on iron, tungsten, copper, bronze, molybdenum, chromium, or nickel.
- the weight average particle size of the sinterable powder is preferably 1000 ⁇ m at the maximum, and is usually in the range of 10 to 500 ⁇ m. It is preferably 20 to 350 ⁇ m, particularly preferably 30 to 150 ⁇ m.
- the content of the sinterable powder in the metallurgical composition is preferably 85 to 99.9% by mass, more preferably 95 to 99.8% by mass, and 98 to 99.7% by mass. It is particularly preferred.
- the content of the resin fine powder in the metallurgical composition is preferably 0.1 to 15% by mass, more preferably 0.2 to 5% by mass, and 0.3 to 2% by mass. Is particularly preferred.
- the amount of resin fine powder used is insufficient, the lubricity is insufficient.
- resin fine powder of the present invention acts as a dry lubricant.
- the metallurgical composition can be obtained by adding an appropriate amount of resin fine powder to the sinterable powder and then mixing with a mixer.
- a mixer having a small shearing force applied to the mixed powder such as a container rotating type, a mechanical stirring type, a flow stirring type and a non-stirring type, is preferable.
- a container rotation type mixer a horizontal cylindrical type, an inclined cylindrical type, a V-shaped type, a double cone type and a continuous V type are preferable, and a mixer having a built-in stirring blade can also be suitably used.
- the mechanical stirring mixer a ribbon type, a screw type, a biaxial paddle type, a conical screw type and a rotating disk type are preferable.
- a fluid agitation mixer a fluid bed type, a swirl type, and a jet pump type are preferable.
- the metallurgical process is as follows: 1) a step of filling the metallurgical composition mixed by the above-described method into a sintering die and compression molding, 2) a step of releasing the compression molded product from the die, 3) Heat treating and sintering the mold release.
- any known method may be applied to the step of filling the metallurgical composition into a sintering mold and compression molding.
- filling and compressing a metallurgical composition at room temperature into a mold heated to 50 to 70 ° C. is preferable because the powder can be easily handled and the green compact density can be further improved.
- warm forming in which the metallurgical composition and the mold are both heated to 100 ° C. to 150 ° C. may be adapted.
- a known method may be adapted for sintering and heat treatment.
- the dry lubricant is required to flow the sinterable powder when the metallurgical composition is compression-molded in the mold so as to reach the entire cavity of the sintering mold. Furthermore, the dry lubricant is required to improve the releasability when the compression molded product is released from the mold. As a result, a compression-molded product having a precise shape is obtained. Since the resin fine powder of the present invention is a fine powder composed of a 4-methyl-1-pentene polymer having a high melting point and a low surface tension, the sinterable powder can be flowed from the mold. Can be easily released.
- the dry lubricant blended in the metallurgical composition has a low melting point, fluidity may be lowered in order to form a liquid bridge between the powders of the sinterable powder.
- a dry lubricant having a high melting point for example, higher fatty acid metal salts or ethylene bisamide may be added to the metallurgical composition.
- these are insufficient in improving the fluidity of the sinterable powder.
- the lower limit of the average particle diameter D 50 of the resin fine powder in the metallurgical composition is preferably 1.0 ⁇ 10 ⁇ 1 ⁇ m, more preferably 5.0 ⁇ 10 ⁇ 1 ⁇ m, and 7.0. It is more preferable that it is * 10 ⁇ -1 > micrometer, and it is especially preferable that it is 1.0 micrometer.
- the upper limit of the average particle diameter D 50 of the fine resin fines preferably from 5.0 ⁇ 10 [mu] m, more preferably 3.0 ⁇ 10 [mu] m, further preferably from 1.0 ⁇ 10 [mu] m, A thickness of 5.0 ⁇ m is particularly preferable. This is because the resin fine powder having a large particle size reduces the strength of the sintered body. On the other hand, resin fine powder having an excessively small particle size cannot sufficiently improve the fluidity of the sinterable powder in the metallurgical composition.
- the dry lubricant in the metallurgical composition must be thermally decomposed and removed when the release product is sintered.
- the resin fine powder of the present invention is a fine powder composed of a 4-methyl-1-pentene polymer, and the 4-methyl-1-pentene polymer has a lower decomposition initiation temperature than a polyolefin such as polyethylene. Therefore, it can be removed more reliably at a lower sintering temperature.
- amide waxes that are sometimes used as dry lubricants in metallurgical compositions may cause odorous substances to be generated by thermal decomposition and reduce the work efficiency, but the resin fine powder of the present invention does not contain odorous substances. Hard to generate.
- a part of the resin fine powder contained in the metallurgical composition may be a resin fine powder other than the resin fine powder of the present invention.
- resin fine powders other than the resin fine powder of the present invention include fatty acid metal salts and amide waxes; more specifically, fatty acid metal salts such as lithium stearate, calcium stearate, zinc stearate, and ethylene Bis (stearoylamide) type amide wax, stearoylamide type amide wax and the like are included.
- the ink composition and the coating composition of the present invention contain the resin fine powder of the present invention, a matrix resin, an organic solvent, and a colorant.
- the ink composition can be used for offset printing, for example.
- the matrix resin examples include natural resins such as rosin, gilsonite, and ester gum; and synthetic resins such as phenol resin, alkyd resin, petroleum resin, vinyl resin, polyamide resin, acrylic resin, nitrocellulose, and chlorinated rubber.
- organic solvents examples include aromatic hydrocarbons such as benzene, toluene and xylene; aliphatic hydrocarbons such as hexane, octane and decane; alicyclic hydrocarbons such as cyclohexane, cyclohexene, methylcyclohexane and ethylcyclohexane; trichloroethylene Halogenated hydrocarbons such as methanol, ethanol, isopropyl alcohol, butanol, pentanol, hexanol, propanediol, phenol, etc .; acetone, methyl isobutyl ketone, methyl ethyl ketone, pentanone, hexanone, isophorone, acetophenone, etc.
- aromatic hydrocarbons such as benzene, toluene and xylene
- aliphatic hydrocarbons such as hexane, octane
- Ketones such as methyl cellosolve and ethyl cellosolve; methyl acetate, ethyl acetate, butyl acetate, methyl propionate, butyl formate What esters; and the like ethers such as tetrahydrofuran.
- the content of the resin fine powder of the present invention in the ink composition and the coating composition is preferably 0.1 to 10% by mass.
- the resin fine powder of the present invention acts as a wax.
- the wax increases the friction resistance of the printed film.
- the coating film coated with the ink composition and the coating composition comes into contact with other members, the printing surface may be rubbed and the printing quality may be deteriorated, but the wax suppresses the deterioration of the printing quality. .
- the coating film is heated (heat set) to evaporate the solvent to obtain a printed matter.
- the heating temperature may be high, for example, 150 ° C. or higher. For this reason, the normal wax is dissolved in the heating step of the coating film, and its wear resistance characteristics may not be maintained.
- the resin fine powder of the present invention is a resin fine powder made of 4-methyl-1-pentene polymer, and 4-methyl-1-pentene polymer has a melting point as compared with polyethylene used as a wax. High (150 ° C. or higher, preferably 180 ° C. or higher, more preferably 200 ° C. or higher). Therefore, the composition ink composition containing the resin fine powder of the present invention and the coating composition have high friction resistance of the printed film, even if it is a printed film by offset printing having a high heat-set temperature, and wear resistance. Can increase.
- the 4-methyl-1-pentene polymer constituting the resin fine powder of the present invention has high transparency. Therefore, the resin fine powder of the present invention hardly affects the color tone of the printed film and has little influence on the print quality.
- the density of the 4-methyl-1-pentene polymer constituting the resin fine powder of the present invention is low. Therefore, the resin fine powder of the present invention can be unevenly distributed on the surface of the printed coating film of the ink composition and the coating composition. When the wax is unevenly distributed on the surface of the coating film, the wear resistance of the printed film is further improved.
- Example 1 Poly-4-methyl-1-pentene (manufactured by Mitsui Chemicals, trade name: TPX, brand name: DX820, melting point: 233 ° C., MFR: 180 [g / 10 min] (ASTM-D1238, 260 ° C.-5 kg load) Pellets (particle size about 3 mm) were prepared.
- the pellet was immersed in methylcyclohexane at room temperature for 4 hours and treated with a solvent.
- the solvent-treated pellets were pulverized with a cutter mill.
- the pulverized cutter was further subjected to jet pulverization treatment (six times).
- a nano jet mizer (NJ50 type: manufactured by Aisin Nano Technologies Co., Ltd.) was used.
- the pulverization conditions were set in the range of indentation pressure: 1.3 to 1.5 MPa and pulverization pressure: 1.0 to 1.35 MPa.
- the particle size of the obtained powder was measured, and the results are summarized in Table 1.
- Example 2 Poly-4-methyl-1-pentene (Mitsui Chemicals, trade name: TPX, brand name: DX810UP, melting point: 233 ° C., MFR: 5 [g / 10 min] (ASTM-D1238, 260 ° C.-5 kg load) Powder (particle size of about 300 ⁇ m) was prepared.
- the powder was immersed in methylcyclohexane at room temperature for 4 hours for solvent treatment.
- the solvent-treated powder was jet pulverized (twice).
- the jet pulverization treatment was performed in the same manner as in Example 1.
- the particle size of the obtained powder was measured, and the results are summarized in Table 1.
- Example 3 Poly-4-methyl-1-pentene (trade name: TPX, manufactured by Mitsui Chemicals, Inc., melting point: about 233 ° C., MFR: about 1 to 200 [g / 10 min] (ASTM-D1238, 260 ° C.-5 kg load) A mixture of facets and pellets (particle size of about 1 ⁇ m to 3 mm) generated in step 1 was prepared.
- a sieve treatment was performed on the mixture of the facets and pellets using an 850 micron mesh.
- the sieve passing material was subjected to jet pulverization (three times).
- the jet pulverization treatment was performed in the same manner as in Example 1.
- the particle size of the obtained powder was measured, and the results are summarized in Table 1.
- the average particle diameter D 50 of the powder in each example and comparative examples were measured in the following manner. After the powder is diffused and dispersed in an aqueous solution containing a surfactant, the particle size of the pulverized material is measured with a particle size distribution analyzer (CILAS 1064 measurement range: 0.04 to 500 ⁇ m). It was measured average particle diameter D 50. As described above, the average particle diameter D 50 is the particle diameter corresponding from the side the particle size of cumulative distribution curve is less 50%, that is, when divided into two from the particle size in the powder, larger side and the smaller side The particle diameter when the mass of the same becomes equal. Further, the particle size distribution of the powders of Examples 1 to 3 was measured by the same method, and the results are shown in FIG. 4 (Example 1), FIG. 5 (Example 2), and FIG. 6 (Example 3). It was.
- Example 1 as a pretreatment of 4-methyl-1-pentene polymer pellets, cutter pulverization was performed after the solvent treatment, and the raw material particle size after the pretreatment was 76 ⁇ m. Further, as a result of jet pulverization (six times), sand-shaped fine particles shown in FIG. 1 were obtained, and the average particle size was 4 ⁇ m. On the other hand, in Comparative Example 1, jet pulverization was performed using the same pellets as in Example 1 without performing pretreatment, but no pulverization effect was observed.
- Example 2 the 4-methyl-1-pentene polymer powder was subjected to solvent treatment, and the raw material particle size was 113 ⁇ m. Furthermore, as a result of jet pulverization (twice), sand-shaped fine particles shown in FIG. 2 were obtained, and the average particle size was 3 ⁇ m. Also in Comparative Example 2, jet pulverization was performed without carrying out the pretreatment of the powder used in Example 2, but sufficient pulverization was not possible, and the average particle size was 211 ⁇ m.
- Example 4 150 g of 4-methyl-1-pentene homopolymer having an intrinsic viscosity [ ⁇ ] of 2.9 dL / g was charged into a 500 ml branched polymerization flask, and heated to 358 ° C. using a sand bath while flowing nitrogen. After confirming that the polymer on the flask wall surface was melted, the 4-methyl-1-pentene polymer was thermally decomposed by continuing stirring for 2 hours while maintaining the temperature. Thereafter, by cooling to room temperature, an oligomer (4MP1 oligomer) having an intrinsic viscosity [ ⁇ ] of 0.20 dL / g was obtained.
- Table 2 shows the number average molecular weight Mn, weight average molecular weight Mw, molecular weight distribution Mw / Mn, melting point, critical surface tension and the like of the obtained oligomer.
- the obtained oligomer was pulverized using a single track jet mill (STJ-200 type manufactured by Seishin Enterprise Co., Ltd.) (grinding treatment amount: 2 kg / h).
- the average particle diameter D 50 of the grinding process was a 2.5 [mu] m.
- Example 5 150 g of 4-methyl-1-pentene polymer (DX820, manufactured by Mitsui Chemicals) was charged into a 500 ml branched polymerization flask, and heated to 357 ° C. using a sand bath while flowing nitrogen. After confirming that the polymer on the flask wall surface was melted, the 4-methyl-1-pentene polymer was thermally decomposed by continuing stirring for 2 hours while maintaining the temperature. Thereafter, by cooling to room temperature, an oligomer (4MP1 oligomer) having an intrinsic viscosity [ ⁇ ] of 0.23 dL / g was obtained.
- Table 2 shows the number average molecular weight Mn, weight average molecular weight Mw, molecular weight distribution Mw / Mn, melting point, critical surface tension and the like of the obtained oligomer.
- the obtained oligomer was pulverized using a single track jet mill (STJ-200 type manufactured by Seishin Enterprise Co., Ltd.) (pulverization amount: 5 kg / h). The same pulverization process was repeated twice.
- the average particle diameter D 50 of the grinding process was a 3.6 [mu] m.
- [Intrinsic viscosity [ ⁇ ]] It measured at 135 degreeC using the decalin solvent. About 20 mg of the sample was dissolved in 15 ml of decalin, and the specific viscosity ⁇ sp was measured in an oil bath at 135 ° C. The decalin solution was diluted by adding 5 ml of decalin solvent, and the specific viscosity ⁇ sp was measured in the same manner. This dilution operation was further repeated twice, and the value of ⁇ sp / C when the concentration (C) was extrapolated to 0 was determined as the intrinsic viscosity. [ ⁇ ] lim ( ⁇ sp / C) (C ⁇ 0 [molecular weight])
- the ratio (Mw / Mn) between the weight average molecular weight (Mw) and the number average molecular weight (Mn) was determined from GPC measurement. The measurement was performed under the following conditions. The weight average molecular weight and number average molecular weight were determined based on the following conversion method by preparing a calibration curve using commercially available monodisperse standard polystyrene.
- Apparatus Gel permeation chromatograph Alliance GPC2000 type (manufactured by Waters) Solvent: o-dichlorobenzene column: TSKgel column (manufactured by Tosoh Corp.) ⁇ 4 Flow rate: 1.0 ml / min Sample: 0.15 mg / mL o-dichlorobenzene Solution temperature: 140 ° C.
- Molecular weight conversion PS conversion / general-purpose calibration method The coefficient of Mark-Houwink viscosity equation shown below was used for calculation of general-purpose calibration.
- a test sample for measuring critical surface tension was prepared by casting a 4-methyl-1-pentene polymer on a SUS plate. For casting, a 4-methyl-1-pentene polymer was heated and melted on a SUS plate under a nitrogen atmosphere at 250 ° C. for 5 minutes, and then returned to room temperature and solidified. The critical surface tension of the surface of this test sample was measured.
- Example 4 and Example 5 The average particle diameter D 50 and the particle size distribution in Example 4 and Example 5 were determined by diffusing and dispersing the powder in an aqueous solution containing a surfactant, and then using a laser diffraction / scattering particle size distribution measuring apparatus (LMS manufactured by Seishin Enterprise Co., Ltd.). ⁇ 30, measurement range: 0.1 to 1000 ⁇ m). Moreover, the particle size distribution of the powder of Example 4 and Example 5 was shown in FIG. 7 (Example 4) and FIG. 8 (Example 5).
- LMS laser diffraction / scattering particle size distribution measuring apparatus
- the average particle size D 50 in Comparative Example 3 an aqueous solution containing a surfactant, a powder after being diffused dispersed, a laser diffraction and diffusion particle size distribution measuring device (manufactured by Nikkiso Co., Ltd. Microtrac HRA, measuring range: 0. 1 to 700 ⁇ m).
- the oligomers of the 4-methyl-1-pentene-1 polymer of Examples 4 and 5 were obtained by jet milling with an average particle size D 50 of 2.5 ⁇ m and no pretreatment. The particles became 3.6 ⁇ m.
- the oligomers of 4-methyl-1-pentene-1-based polymers of Example 4 and Example 5 have a small angle of repose compared to an ethylenebisstearylamide of the same size. . That is, the resin fine powder of the present invention is characterized by high fluidity despite a relatively small particle size.
- the resin fine powder of the present invention can be used as an additive to various compositions by utilizing the characteristics of 4-methyl-1-pentene polymer.
- 4-methyl-1-pentene polymer is used as a lubricant because it has a low surface tension; it has a higher melting point than other polyolefins, so it is used as a wax for an ink composition having a high heat setting temperature.
- 4-methyl-1-pentene polymer is used as a lubricant because it has a low surface tension; it has a higher melting point than other polyolefins, so it is used as a wax for an ink composition having a high heat setting temperature.
Abstract
Description
[1] デカリン溶媒中135℃で測定した極限粘度[η]が、1.0×10-2dl/g以上3.0dl/g未満である4-メチル-1-ペンテン系重合体からなり、平均粒径D50が1.0×10-1~5.0×10μmである樹脂微粉末。
[2] 前記平均粒径D50が、1.0×10-1~1.0×10μmである、[1]に記載の樹脂微粉末。
[3] 前記極限粘度[η]が、1.0×10-2dl/g以上5.0×10-1dl/g未満である、[1]に記載の樹脂微粉末。
[4] 前記極限粘度[η]が、5.0×10-1dl/g以上3.0dl/g未満である、[1]に記載の樹脂微粉末。
[5] (A)前記[1]に記載の樹脂微粉末0.1~150質量部と、(B)金属およびセラミック粉末からなる群から選ばれる少なくとも1種の焼結性粉末100質量部と、を含有する組成物。
[6] 前記組成物は、(C)可塑化バインダー5~200質量部をさらに含有する、[5]に記載の組成物。
[7] 前記[5]に記載の組成物を押し出し成形して成形体を得る工程と、前記成形体を焼結する工程と、を含む多孔質焼結体の製造方法。
[8] 前記多孔質焼結体はハニカムフィルタである、[7]に記載の製造方法。
[9] 前記[1]に記載の樹脂微粉末を含有する塗料。
[10] 前記[1]に記載の樹脂微粉末を含有するインキ。
[11] 4-メチル-1-ペンテン系重合体のバルクまたは粗粉砕物を、ジェット粉砕処理する工程を含む、[1]に記載の樹脂微粉末を製造する方法。
[12] 前記粗粉砕物は、有機溶媒を染み込ませた4-メチル-1-ペンテン系重合体を粉砕して得る、[11]に記載の製造方法。
[13] 前記バルクまたは粗粉砕物は、4-メチル-1-ペンテン系重合体の熱分解物である、[11]に記載の製造方法。
本発明の樹脂微粉末は、4-メチル-1-ペンテン系重合体を含む。4-メチル-1-ペンテン系重合体とは、構成単位の少なくとも一部が4-メチル-1-ペンテン由来の構成単位である重合体である。
成分(i):上記一般式(1)または(2)で表されるメタロセン化合物
成分(ii):(ii-1)有機金属化合物、(ii-2)有機アルミニウムオキシ化合物、および(ii-3)メタロセン化合物(i)と反応してイオン対を形成する化合物、から選ばれる少なくとも1種の化合物
成分(iii):微粒子状担体(必須成分ではないが必要に応じて含まれる)
本発明の4-メチル-1-ペンテン系重合体の樹脂微粉末の製法は、大きく2つに分類されうる。1つは、高分子量の4-メチル-1-ペンテン系重合体を任意に前処理して、ジェット粉砕する方法である。他の1つは、低分子量の4-メチル-1-ペンテン系重合体を、ジェット粉砕する方法である。
本発明の4-メチル-1-ペンテン系重合体の樹脂微粉末は、種々の用途に用いられうる。例えば、インキ組成物や塗料組成物の添加剤として、冶金用粉末組成物の添加剤として、セラミック焼結用粉末組成物の添加剤として、粘着剤の添加剤として、ゴムの添加剤として、トナーの離型剤として、金型離型材などとして用いられうる。
本発明の多孔質焼結材用組成物は、本発明の樹脂微粉末と、セラミック粉末または金属粉末と、可塑化バインダーと、を含有する。本発明の多孔質焼結材用組成物からは、多孔質性の焼結材を得ることができる。多孔質性の焼結材とは、例えばハニカムフィルタである。ハニカムフィルタは、例えば自動車の触媒コンバータの触媒担体や、ディーゼルエンジン排ガスの浄化用触媒担体に用いられる。
本発明の冶金用組成物は、本発明の樹脂微粉末と、焼結性粉末とを含む。冶金用組成物からは、例えば、焼結体である金属部材などを得ることができる。
本発明のインキ組成物および塗料組成物は、本発明の樹脂微粉末と、マトリックス樹脂と、有機溶媒と、着色剤とを含有する。インキ組成物は、例えばオフセット印刷などに用いられうる。
ポリ-4-メチル-1-ペンテン(三井化学株式会社製、商標名:TPX、銘柄名:DX820、融点:233℃、MFR:180[g/10min](ASTM-D1238、260℃‐5kg荷重)のペレット(粒径約3mm)を用意した。
ポリ-4-メチル-1-ペンテン(三井化学株式会社製、商標名:TPX、銘柄名:DX810UP、融点:233℃、MFR:5[g/10min](ASTM-D1238、260℃‐5kg荷重)のパウダー(粒径約300μm)を用意した。
ポリ-4-メチル-1-ペンテン(三井化学株式会社製、商標名:TPX、融点約233℃、MFR 約1~200[g/10min](ASTM-D1238、260℃‐5kg荷重)の製造工程で発生した、切子やペレットの混合物(粒径約1μm~3mm)を用意した。
実施例1で用意したペレット(粒径:D50=3mm)に、前処理(溶媒処理およびカッター粉砕)を実施することなく、ジェット粉砕(1回)処理を行った。その粉体の粒径を測定した結果を表1にまとめた。
実施例2で用意したパウダー(粒径:D50=300μm)に、前処理(溶媒処理)を実施することなく、ジェット粉砕(3回)処理を行った。その粉体の粒径を測定した結果を表1にまとめた。
各実施例および比較例における粉体の平均粒径D50は、以下の手法で測定した。界面活性剤を含む水溶液に、粉体を拡散分散させた後に、粒度分布測定機(CILAS社製・1064型 測定範囲:0.04~500μm)にて、原料粉砕物の粒径サイズを測定し、平均粒径D50を測定した。前述の通り、平均粒径D50とは、積算分布曲線の粒径が小さい方から50%に相当する粒子径、すなわち粉体をある粒子径から2つに分けたとき、大きい側と小さい側の質量が等量となる際の粒径をいう。また、実施例1~3の粉体について、同様の方法で粒度分布を測定し、結果を図4(実施例1)、図5(実施例2)、および図6(実施例3)に示した。
ジェット粉砕処理後の粉体の形状を、走査型電子顕微鏡(日本電子(株):JSM6380)にて観察した。実施例1~3で得られた粉体の顕微鏡写真を、それぞれ図1~図3に示す。
極限粘度[η]が2.9dL/gの4-メチル-1-ペンテンホモポリマー150gを500mlの枝付重合フラスコに仕込み、窒素を流通させながら、サンドバスを用い358℃に加熱した。フラスコ壁面の重合体が融解したことを確認した後、温度を保ったまま2時間撹拌を続けることにより、4-メチル-1-ペンテン系ポリマーを熱分解した。その後、常温まで冷却することにより、極限粘度[η]が0.20dL/gのオリゴマー(4MP1系オリゴマー)を得た。得られたオリゴマーの数平均分子量Mn、重量平均分子量Mw、分子量分布Mw/Mn、融点、臨界表面張力などを、表2に示した。
4-メチル-1-ペンテン系ポリマー(三井化学社製DX820)150gを500mlの枝付重合フラスコに仕込み、窒素を流通させながら、サンドバスを用い357℃に加熱した。フラスコ壁面の重合体が融解したことを確認した後、温度を保ったまま2時間撹拌を続けることにより、4-メチル-1-ペンテン系ポリマーを熱分解した。その後、常温まで冷却することにより、極限粘度[η]が0.23dL/gのオリゴマー(4MP1系オリゴマー)を得た。得られたオリゴマーの数平均分子量Mn、重量平均分子量Mw、分子量分布Mw/Mn、融点、臨界表面張力などを、表2に示した。
微粉のエチレンビスステアリルアミド(日本化成社製スリパックスEK)を用意した。融点と平均粒径D50を表2に示した。
13C-NMRスペクトルの解析により求めた。
デカリン溶媒を用いて、135℃で測定した。サンプル約20mgを、デカリン15mlに溶解し、135℃のオイルバス中で比粘度ηspを測定した。このデカリン溶液に、デカリン溶媒を5ml追加して希釈した後に、同様にして比粘度ηspを測定した。この希釈操作をさらに2回繰り返し、濃度(C)を0に外挿した時のηsp/Cの値を極限粘度として求めた。
[η]= lim(ηsp/C) (C→0[分子量])
重量平均分子量(Mw)と数平均分子量(Mn)との比(Mw/Mn)を、GPC測定から求めた。測定は以下の条件で行った。また、重量平均分子量と数平均分子量は、市販の単分散標準ポリスチレンを用いて検量線を作成し、下記の換算法に基づいて求めた。装置 : ゲル浸透クロマトグラフAlliance GPC2000型(Waters社製)溶剤 : o-ジクロロベンゼンカラム: TSKgelカラム(東ソー社製)×4流速 : 1.0 ml/分試料 : 0.15mg/mL o-ジクロロベンゼン溶液温度 : 140℃分子量換算 : PS換算/汎用較正法
なお、汎用較正の計算には、以下に示すMark-Houwink粘度式の係数を用いた。ポリスチレン(PS)の係数:KPS=1.38×10-4,aPS=0.70
示差走査型熱量計(DSC)を用いて、試料約5mgをアルミパンに詰めて280℃まで昇温し、280℃で5分間保持した後、10℃/分で30℃まで冷却し、30℃で5分間保持した後、10℃/分で昇温する際の吸熱ピークを融点とした。
画像処理式・固液界面解析システム(協和界面科学社製Dropmaster500)を用いて、23℃、50%RHの雰囲気下で、試験サンプル表面に表面張力の判明している4種類のぬれ張力試験用混合液(エチレングリコールモノエチルエーテル/ホルムアミド、表面張力各31、34、37、40mN/m)を滴下し、接触角を測定した。
実施例4および実施例5における平均粒径D50および粒度分布は、界面活性剤を含む水溶液に、粉体を拡散分散させた後に、レーザ回折・散乱式粒度分布測定装置(セイシン企業社製LMS-30、測定範囲:0.1~1000μm)を用いて測定した。また、実施例4および実施例5の粉体の粒度分布を、図7(実施例4)および図8(実施例5)に示した。
安息角は、JIS R 9301に準じて測定された。
Claims (13)
- デカリン溶媒中135℃で測定した極限粘度[η]が、1.0×10-2dl/g以上3.0dl/g未満である4-メチル-1-ペンテン系重合体からなり、平均粒径D50が1.0×10-1~5.0×10μmである樹脂微粉末。
- 前記平均粒径D50が、1.0×10-1~1.0×10μmである、請求項1に記載の樹脂微粉末。
- 前記極限粘度[η]が、1.0×10-2dl/g以上5.0×10-1dl/g未満である、請求項1に記載の樹脂微粉末。
- 前記極限粘度[η]が、5.0×10-1dl/g以上3.0dl/g未満である、請求項1に記載の樹脂微粉末。
- (A)請求項1に記載の樹脂微粉末0.1~150質量部と、
(B)金属およびセラミック粉末からなる群から選ばれる少なくとも1種の焼結性粉末100質量部と、を含有する組成物。 - 前記組成物は、(C)可塑化バインダー5~200質量部をさらに含有する、請求項5に記載の組成物。
- 請求項5に記載の組成物を押し出し成形して成形体を得る工程と、
前記成形体を焼結する工程と、を含む多孔質焼結体の製造方法。 - 前記多孔質焼結体はハニカムフィルタである、請求項7に記載の製造方法。
- 請求項1に記載の樹脂微粉末を含有する塗料。
- 請求項1に記載の樹脂微粉末を含有するインキ。
- 4-メチル-1-ペンテン系重合体のバルクまたは粗粉砕物を、ジェット粉砕処理する工程を含む、請求項1に記載の樹脂微粉末を製造する方法。
- 前記粗粉砕物は、有機溶媒を染み込ませた4-メチル-1-ペンテン系重合体を粉砕して得る、請求項11に記載の製造方法。
- 前記バルクまたは粗粉砕物は、4-メチル-1-ペンテン系重合体の熱分解物である、請求項11に記載の製造方法。
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CN201180021016.5A CN102869687B (zh) | 2010-04-28 | 2011-02-08 | 由4-甲基-1-戊烯系聚合物构成的树脂细粉末、含有其的组合物、以及其制造方法 |
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JP2013539479A (ja) * | 2010-07-28 | 2013-10-24 | スティーブンスン,マイケル,ジェイ | 印刷インキ、転写、およびポリオレフィン製品の装飾の方法 |
US9296243B2 (en) | 2010-07-28 | 2016-03-29 | Michael Stevenson & Kathleen Stevenson | Printing ink, transfers, and methods of decorating polyolefin articles |
JP2017071806A (ja) * | 2015-10-05 | 2017-04-13 | Ntn株式会社 | 多孔質金属部品の製造方法 |
KR101771677B1 (ko) * | 2016-12-06 | 2017-08-25 | 신화진 | 음이온 및 원적외선을 발산하는 벽난로용 내화벽돌 |
JPWO2022034834A1 (ja) * | 2020-08-12 | 2022-02-17 |
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US11162050B2 (en) | 2016-12-27 | 2021-11-02 | Mitsui Chemicals, Inc. | Lubricating oil composition, viscosity modifier for lubricating oil, and additive composition for lubricating oil |
JP7223862B2 (ja) | 2019-08-29 | 2023-02-16 | 三井化学株式会社 | 潤滑油組成物 |
KR102465239B1 (ko) * | 2021-11-04 | 2022-11-09 | 주식회사 은진공업 | 내마모성이 우수한 융착식 노면표지용 도료 조성물 및 이의 제조 방법 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013539479A (ja) * | 2010-07-28 | 2013-10-24 | スティーブンスン,マイケル,ジェイ | 印刷インキ、転写、およびポリオレフィン製品の装飾の方法 |
US9296243B2 (en) | 2010-07-28 | 2016-03-29 | Michael Stevenson & Kathleen Stevenson | Printing ink, transfers, and methods of decorating polyolefin articles |
JP2017071806A (ja) * | 2015-10-05 | 2017-04-13 | Ntn株式会社 | 多孔質金属部品の製造方法 |
KR101771677B1 (ko) * | 2016-12-06 | 2017-08-25 | 신화진 | 음이온 및 원적외선을 발산하는 벽난로용 내화벽돌 |
JPWO2022034834A1 (ja) * | 2020-08-12 | 2022-02-17 | ||
WO2022034834A1 (ja) * | 2020-08-12 | 2022-02-17 | 住友ベークライト株式会社 | 離型フィルムおよび成型品の製造方法 |
JP7283639B2 (ja) | 2020-08-12 | 2023-05-30 | 住友ベークライト株式会社 | 離型フィルムおよび成型品の製造方法 |
Also Published As
Publication number | Publication date |
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JPWO2011135763A1 (ja) | 2013-07-18 |
CN102869687A (zh) | 2013-01-09 |
EP2565210A4 (en) | 2015-05-27 |
JP5798113B2 (ja) | 2015-10-21 |
US20130052464A1 (en) | 2013-02-28 |
CN102869687B (zh) | 2015-03-18 |
US9260549B2 (en) | 2016-02-16 |
EP2565210B1 (en) | 2019-11-06 |
EP2565210A1 (en) | 2013-03-06 |
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