WO2011083940A3 - 발광 다이오드 및 그것을 제조하는 방법 - Google Patents
발광 다이오드 및 그것을 제조하는 방법 Download PDFInfo
- Publication number
- WO2011083940A3 WO2011083940A3 PCT/KR2011/000002 KR2011000002W WO2011083940A3 WO 2011083940 A3 WO2011083940 A3 WO 2011083940A3 KR 2011000002 W KR2011000002 W KR 2011000002W WO 2011083940 A3 WO2011083940 A3 WO 2011083940A3
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- Prior art keywords
- layer
- doped
- type contact
- super
- silicon
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- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0025—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/025—Physical imperfections, e.g. particular concentration or distribution of impurities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012547950A JP5709899B2 (ja) | 2010-01-05 | 2011-01-03 | 発光ダイオード及びその製造方法 |
CN201180012486.5A CN102782883B (zh) | 2010-01-05 | 2011-01-03 | 发光二极管及其制造方法 |
EP11731878.2A EP2523228B1 (en) | 2010-01-05 | 2011-01-03 | Light emitting diode |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0000559 | 2010-01-05 | ||
KR20100000559 | 2010-01-05 | ||
KR10-2010-0052860 | 2010-06-04 | ||
KR10-2010-0052861 | 2010-06-04 | ||
KR1020100052861A KR101648948B1 (ko) | 2010-06-04 | 2010-06-04 | 신뢰성 있는 발광 다이오드 및 그것을 제조하는 방법 |
KR1020100052860A KR20110133239A (ko) | 2010-06-04 | 2010-06-04 | 신뢰성 있는 발광 다이오드 |
KR10-2010-0113666 | 2010-11-16 | ||
KR1020100113666A KR101712549B1 (ko) | 2010-01-05 | 2010-11-16 | 스페이서층을 가지는 발광 다이오드 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011083940A2 WO2011083940A2 (ko) | 2011-07-14 |
WO2011083940A3 true WO2011083940A3 (ko) | 2011-11-24 |
Family
ID=45564153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/000002 WO2011083940A2 (ko) | 2010-01-05 | 2011-01-03 | 발광 다이오드 및 그것을 제조하는 방법 |
Country Status (5)
Country | Link |
---|---|
US (4) | US8357924B2 (ko) |
EP (1) | EP2523228B1 (ko) |
JP (1) | JP5709899B2 (ko) |
CN (1) | CN102782883B (ko) |
WO (1) | WO2011083940A2 (ko) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103022282B (zh) | 2008-07-07 | 2016-02-03 | 格罗有限公司 | 纳米结构led |
DE102009060747A1 (de) * | 2009-12-30 | 2011-07-07 | OSRAM Opto Semiconductors GmbH, 93055 | Halbleiterchip |
JP5709899B2 (ja) | 2010-01-05 | 2015-04-30 | ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. | 発光ダイオード及びその製造方法 |
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WO2013049817A1 (en) * | 2011-09-30 | 2013-04-04 | The Regents Of The University Of California | Opto-electrical devices with reduced efficiency droop and forward voltage |
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US10177273B2 (en) * | 2012-03-29 | 2019-01-08 | Seoul Viosys Co., Ltd. | UV light emitting device |
US10164150B2 (en) | 2012-03-29 | 2018-12-25 | Seoul Viosys Co., Ltd. | Near UV light emitting device |
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JP5881560B2 (ja) * | 2012-08-30 | 2016-03-09 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
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US10153394B2 (en) | 2012-11-19 | 2018-12-11 | Genesis Photonics Inc. | Semiconductor structure |
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US20160005919A1 (en) * | 2013-02-05 | 2016-01-07 | Tokuyama Corporation | Nitride semiconductor light emitting device |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274376A (ja) * | 2000-03-24 | 2001-10-05 | Furukawa Electric Co Ltd:The | 低抵抗GaN系緩衝層 |
JP2001298215A (ja) * | 2000-04-14 | 2001-10-26 | Nichia Chem Ind Ltd | 発光素子 |
JP2002033509A (ja) * | 2000-07-14 | 2002-01-31 | Hitachi Cable Ltd | 発光ダイオード |
KR20040029165A (ko) * | 1998-03-12 | 2004-04-03 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자 |
KR100674862B1 (ko) * | 2005-08-25 | 2007-01-29 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
KR100835116B1 (ko) * | 2007-04-16 | 2008-06-05 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
KR20080064061A (ko) * | 2007-01-03 | 2008-07-08 | 삼성전기주식회사 | 질화물 반도체 소자 |
KR20090004493A (ko) * | 2007-07-03 | 2009-01-12 | 소니 가부시끼가이샤 | 질화 갈륨계 반도체 소자 및 이것을 이용한 광학 장치와이것을 이용한 화상 표시 장치 |
KR20090034169A (ko) * | 2007-10-02 | 2009-04-07 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
KR20090095657A (ko) * | 2006-12-22 | 2009-09-09 | 필립스 루미리즈 라이팅 캄파니 엘엘씨 | 변형률을 감소시키는 템플릿 상에 성장된 ⅲ-질화물 발광 장치 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09232629A (ja) * | 1996-02-26 | 1997-09-05 | Toshiba Corp | 半導体素子 |
WO1999005728A1 (en) * | 1997-07-25 | 1999-02-04 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
US6015979A (en) * | 1997-08-29 | 2000-01-18 | Kabushiki Kaisha Toshiba | Nitride-based semiconductor element and method for manufacturing the same |
JPH11251685A (ja) * | 1998-03-05 | 1999-09-17 | Toshiba Corp | 半導体レーザ |
JP4815732B2 (ja) * | 1998-12-08 | 2011-11-16 | 日亜化学工業株式会社 | 窒化物半導体素子 |
JP3656456B2 (ja) * | 1999-04-21 | 2005-06-08 | 日亜化学工業株式会社 | 窒化物半導体素子 |
US7692182B2 (en) * | 2001-05-30 | 2010-04-06 | Cree, Inc. | Group III nitride based quantum well light emitting device structures with an indium containing capping structure |
US6958497B2 (en) * | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
JP2003289156A (ja) * | 2002-03-28 | 2003-10-10 | Stanley Electric Co Ltd | 窒化ガリウム系半導体結晶の成長方法及び化合物半導体発光素子 |
WO2003085790A1 (fr) * | 2002-04-04 | 2003-10-16 | Sharp Kabushiki Kaisha | Dispositif laser a semi-conducteur |
US6943377B2 (en) * | 2002-11-21 | 2005-09-13 | Sensor Electronic Technology, Inc. | Light emitting heterostructure |
US7120775B2 (en) | 2003-12-29 | 2006-10-10 | Intel Corporation | Inter-procedural allocation of stacked registers for a processor |
US7345297B2 (en) * | 2004-02-09 | 2008-03-18 | Nichia Corporation | Nitride semiconductor device |
KR100456063B1 (ko) | 2004-02-13 | 2004-11-10 | 에피밸리 주식회사 | Ⅲ-질화물 반도체 발광소자 |
JP2008511154A (ja) * | 2004-08-26 | 2008-04-10 | エルジー イノテック カンパニー リミテッド | 窒化物半導体発光素子及びその製造方法 |
US7920612B2 (en) * | 2004-08-31 | 2011-04-05 | Finisar Corporation | Light emitting semiconductor device having an electrical confinement barrier near the active region |
CN100369276C (zh) * | 2004-09-06 | 2008-02-13 | 璨圆光电股份有限公司 | 发光二极管的结构 |
KR100631971B1 (ko) * | 2005-02-28 | 2006-10-11 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
KR100718129B1 (ko) * | 2005-06-03 | 2007-05-14 | 삼성전자주식회사 | Ⅲ-Ⅴ족 GaN계 화합물 반도체 소자 |
JP2007115887A (ja) * | 2005-10-20 | 2007-05-10 | Rohm Co Ltd | 窒化物半導体素子およびその製法 |
RU2315135C2 (ru) * | 2006-02-06 | 2008-01-20 | Владимир Семенович Абрамов | Метод выращивания неполярных эпитаксиальных гетероструктур на основе нитридов элементов iii группы |
JP2008297191A (ja) * | 2007-05-02 | 2008-12-11 | Sumitomo Electric Ind Ltd | 窒化ガリウム基板及び窒化ガリウム層の形成方法 |
JP2008288532A (ja) * | 2007-05-21 | 2008-11-27 | Rohm Co Ltd | 窒化物系半導体装置 |
JP5272390B2 (ja) * | 2007-11-29 | 2013-08-28 | 豊田合成株式会社 | Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ |
DE102007057674A1 (de) * | 2007-11-30 | 2009-06-04 | Osram Opto Semiconductors Gmbh | LED mit Stromaufweitungsschicht |
EP2273536B1 (en) * | 2008-03-13 | 2013-10-30 | Toyoda Gosei Co., Ltd. | Group iii nitride semiconductor device and method for manufacturing the same, group iii nitride semiconductor light-emitting device and method for manufacturing the same, and lamp |
US8541817B2 (en) * | 2009-11-06 | 2013-09-24 | Nitek, Inc. | Multilayer barrier III-nitride transistor for high voltage electronics |
DE102009060747A1 (de) * | 2009-12-30 | 2011-07-07 | OSRAM Opto Semiconductors GmbH, 93055 | Halbleiterchip |
JP5709899B2 (ja) * | 2010-01-05 | 2015-04-30 | ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. | 発光ダイオード及びその製造方法 |
-
2011
- 2011-01-03 JP JP2012547950A patent/JP5709899B2/ja active Active
- 2011-01-03 CN CN201180012486.5A patent/CN102782883B/zh active Active
- 2011-01-03 WO PCT/KR2011/000002 patent/WO2011083940A2/ko active Application Filing
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-
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- 2015-04-17 US US14/690,036 patent/US9716210B2/en active Active
-
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- 2017-07-06 US US15/643,403 patent/US10418514B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040029165A (ko) * | 1998-03-12 | 2004-04-03 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자 |
JP2001274376A (ja) * | 2000-03-24 | 2001-10-05 | Furukawa Electric Co Ltd:The | 低抵抗GaN系緩衝層 |
JP2001298215A (ja) * | 2000-04-14 | 2001-10-26 | Nichia Chem Ind Ltd | 発光素子 |
JP2002033509A (ja) * | 2000-07-14 | 2002-01-31 | Hitachi Cable Ltd | 発光ダイオード |
KR100674862B1 (ko) * | 2005-08-25 | 2007-01-29 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
KR20090095657A (ko) * | 2006-12-22 | 2009-09-09 | 필립스 루미리즈 라이팅 캄파니 엘엘씨 | 변형률을 감소시키는 템플릿 상에 성장된 ⅲ-질화물 발광 장치 |
KR20080064061A (ko) * | 2007-01-03 | 2008-07-08 | 삼성전기주식회사 | 질화물 반도체 소자 |
KR100835116B1 (ko) * | 2007-04-16 | 2008-06-05 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
KR20090004493A (ko) * | 2007-07-03 | 2009-01-12 | 소니 가부시끼가이샤 | 질화 갈륨계 반도체 소자 및 이것을 이용한 광학 장치와이것을 이용한 화상 표시 장치 |
KR20090034169A (ko) * | 2007-10-02 | 2009-04-07 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
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US9136427B2 (en) | 2015-09-15 |
JP2013516781A (ja) | 2013-05-13 |
US10418514B2 (en) | 2019-09-17 |
US20170309775A1 (en) | 2017-10-26 |
US9716210B2 (en) | 2017-07-25 |
US20150221822A1 (en) | 2015-08-06 |
US8357924B2 (en) | 2013-01-22 |
WO2011083940A2 (ko) | 2011-07-14 |
JP5709899B2 (ja) | 2015-04-30 |
US20130099201A1 (en) | 2013-04-25 |
US20120037881A1 (en) | 2012-02-16 |
CN102782883A (zh) | 2012-11-14 |
CN102782883B (zh) | 2015-07-29 |
EP2523228B1 (en) | 2017-04-26 |
EP2523228A4 (en) | 2014-07-02 |
EP2523228A2 (en) | 2012-11-14 |
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