WO2013022227A3 - 전류 확산 효과가 우수한 질화물 반도체 발광소자 및 그 제조 방법 - Google Patents
전류 확산 효과가 우수한 질화물 반도체 발광소자 및 그 제조 방법 Download PDFInfo
- Publication number
- WO2013022227A3 WO2013022227A3 PCT/KR2012/006178 KR2012006178W WO2013022227A3 WO 2013022227 A3 WO2013022227 A3 WO 2013022227A3 KR 2012006178 W KR2012006178 W KR 2012006178W WO 2013022227 A3 WO2013022227 A3 WO 2013022227A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- current spreading
- emitting element
- semiconductor light
- nitride semiconductor
- manufacturing same
- Prior art date
Links
- 150000004767 nitrides Chemical class 0.000 title abstract 7
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000012535 impurity Substances 0.000 abstract 3
- 230000004913 activation Effects 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
- H01L33/325—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen characterised by the doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014524919A JP2014522125A (ja) | 2011-08-08 | 2012-08-02 | 電流拡散効果に優れる窒化物半導体発光素子及びその製造方法 |
EP20120821814 EP2743996A4 (en) | 2011-08-08 | 2012-08-02 | NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT PROVIDING BETTER CURRENT INTENSITY SPREAD AND METHOD OF MANUFACTURING THE SAME |
CN201280038922.0A CN103748698A (zh) | 2011-08-08 | 2012-08-02 | 电流扩散效果优秀的氮化物半导体发光器件及其制备方法 |
US14/237,299 US9099600B2 (en) | 2011-08-08 | 2012-08-02 | Nitride semiconductor light-emitting element having superior current spreading effect and method for manufacturing same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110078778A KR101175183B1 (ko) | 2011-08-08 | 2011-08-08 | 전류 확산 효과가 우수한 질화물 반도체 발광소자 및 그 제조 방법 |
KR10-2011-0078778 | 2011-08-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013022227A2 WO2013022227A2 (ko) | 2013-02-14 |
WO2013022227A3 true WO2013022227A3 (ko) | 2013-04-11 |
Family
ID=46887462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2012/006178 WO2013022227A2 (ko) | 2011-08-08 | 2012-08-02 | 전류 확산 효과가 우수한 질화물 반도체 발광소자 및 그 제조 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9099600B2 (ko) |
EP (1) | EP2743996A4 (ko) |
JP (1) | JP2014522125A (ko) |
KR (1) | KR101175183B1 (ko) |
CN (1) | CN103748698A (ko) |
TW (1) | TWI495149B (ko) |
WO (1) | WO2013022227A2 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI597862B (zh) * | 2013-08-30 | 2017-09-01 | 晶元光電股份有限公司 | 具阻障層的光電半導體元件 |
US9923119B2 (en) | 2013-10-01 | 2018-03-20 | Opto Tech Corporation | White LED chip and white LED packaging device |
TWI509835B (zh) * | 2013-10-01 | 2015-11-21 | Opto Tech Corp | 白光二極體 |
KR102224109B1 (ko) * | 2014-07-15 | 2021-03-09 | 엘지이노텍 주식회사 | 발광소자, 발광소자 제조방법 및 조명시스템 |
US9608103B2 (en) * | 2014-10-02 | 2017-03-28 | Toshiba Corporation | High electron mobility transistor with periodically carbon doped gallium nitride |
CN104300064B (zh) * | 2014-10-10 | 2018-04-24 | 华灿光电(苏州)有限公司 | 一种GaN基发光二极管的外延片及其制备方法 |
CN104701359B (zh) * | 2015-03-10 | 2018-02-02 | 苏州能屋电子科技有限公司 | 垂直结构AlGaN/GaN HEMT器件及其制作方法 |
CN104659082B (zh) * | 2015-03-12 | 2018-02-02 | 苏州能屋电子科技有限公司 | 垂直结构AlGaN/GaN HEMT器件及其制作方法 |
CN105845788B (zh) * | 2016-04-08 | 2018-02-09 | 湘能华磊光电股份有限公司 | 一种led电流扩展层外延生长方法 |
CN105869994B (zh) * | 2016-04-14 | 2018-04-06 | 湘能华磊光电股份有限公司 | 一种超晶格层的生长方法及含此结构的led外延结构 |
CN105870282B (zh) * | 2016-04-14 | 2018-02-16 | 湘能华磊光电股份有限公司 | 一种电流扩展层的生长方法及含此结构的led外延结构 |
DE102017104719A1 (de) * | 2017-03-07 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterkörper und Halbleiterchip |
KR102432226B1 (ko) * | 2017-12-01 | 2022-08-12 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
CN109346566A (zh) * | 2018-08-31 | 2019-02-15 | 华灿光电(浙江)有限公司 | 一种氮化镓基发光二极管外延片及其制备方法 |
TWI839293B (zh) * | 2021-09-28 | 2024-04-11 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
TWI816186B (zh) * | 2021-09-28 | 2023-09-21 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
US20240128419A1 (en) * | 2022-09-29 | 2024-04-18 | Bolb Inc. | Current spreading structure for light-emitting diode |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674862B1 (ko) * | 2005-08-25 | 2007-01-29 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
KR20070027327A (ko) * | 2005-09-06 | 2007-03-09 | 엘지전자 주식회사 | 수직형 발광 다이오드 및 그 제조방법 |
KR100738399B1 (ko) * | 2006-04-18 | 2007-07-12 | 삼성전기주식회사 | 질화물 반도체 발광소자 |
JP2008066514A (ja) * | 2006-09-07 | 2008-03-21 | Hitachi Cable Ltd | 半導体発光素子用エピタキシャルウェハ及び半導体発光素子 |
KR100979701B1 (ko) * | 2008-08-25 | 2010-09-03 | 서울옵토디바이스주식회사 | 변조도핑층을 갖는 발광 다이오드 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5693963A (en) | 1994-09-19 | 1997-12-02 | Kabushiki Kaisha Toshiba | Compound semiconductor device with nitride |
JP3491375B2 (ja) * | 1995-03-30 | 2004-01-26 | 昭和電工株式会社 | 発光素子及びその製造方法 |
JPH0992883A (ja) * | 1995-09-28 | 1997-04-04 | Toshiba Corp | 半導体ウェハ、半導体素子、その製造方法及び半導体素子の製造に用いる成長装置 |
JP3744211B2 (ja) * | 1997-09-01 | 2006-02-08 | 日亜化学工業株式会社 | 窒化物半導体素子 |
JP3897448B2 (ja) * | 1998-04-27 | 2007-03-22 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
JP2000101133A (ja) | 1998-09-21 | 2000-04-07 | Hitachi Cable Ltd | 発光素子用エピタキシャルウェハ及びその製造方法 |
JP3063756B1 (ja) * | 1998-10-06 | 2000-07-12 | 日亜化学工業株式会社 | 窒化物半導体素子 |
US6810065B1 (en) * | 2000-11-28 | 2004-10-26 | Optical Communication Productions, Inc. | Low electrical resistance n-type mirror for optoelectronic devices |
JP2005508077A (ja) * | 2001-10-22 | 2005-03-24 | イェール ユニバーシティ | 半導体材料のハイパードーピング方法、ハイパードープされた半導体材料、および、ハイパードープされた半導体装置 |
US7812366B1 (en) * | 2005-03-18 | 2010-10-12 | The United States Of America As Represented By The Secretary Of The Army | Ultraviolet light emitting AlGaN composition, and ultraviolet light emitting device containing same |
WO2007013257A1 (ja) * | 2005-07-29 | 2007-02-01 | Matsushita Electric Industrial Co., Ltd. | 窒化物系半導体素子 |
JP5068020B2 (ja) * | 2006-02-20 | 2012-11-07 | シャープ株式会社 | 窒化物半導体発光素子の製造方法 |
KR101007086B1 (ko) | 2008-09-02 | 2011-01-10 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
JP2010232649A (ja) | 2009-03-06 | 2010-10-14 | Showa Denko Kk | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
US8536615B1 (en) * | 2009-12-16 | 2013-09-17 | Cree, Inc. | Semiconductor device structures with modulated and delta doping and related methods |
TW201126755A (en) | 2010-01-29 | 2011-08-01 | Advanced Optoelectronic Tech | Light emitting diode and method for manufacturing the same |
-
2011
- 2011-08-08 KR KR1020110078778A patent/KR101175183B1/ko not_active IP Right Cessation
-
2012
- 2012-08-02 JP JP2014524919A patent/JP2014522125A/ja active Pending
- 2012-08-02 CN CN201280038922.0A patent/CN103748698A/zh active Pending
- 2012-08-02 WO PCT/KR2012/006178 patent/WO2013022227A2/ko active Application Filing
- 2012-08-02 US US14/237,299 patent/US9099600B2/en active Active
- 2012-08-02 EP EP20120821814 patent/EP2743996A4/en not_active Withdrawn
- 2012-08-08 TW TW101128685A patent/TWI495149B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674862B1 (ko) * | 2005-08-25 | 2007-01-29 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
KR20070027327A (ko) * | 2005-09-06 | 2007-03-09 | 엘지전자 주식회사 | 수직형 발광 다이오드 및 그 제조방법 |
KR100738399B1 (ko) * | 2006-04-18 | 2007-07-12 | 삼성전기주식회사 | 질화물 반도체 발광소자 |
JP2008066514A (ja) * | 2006-09-07 | 2008-03-21 | Hitachi Cable Ltd | 半導体発光素子用エピタキシャルウェハ及び半導体発光素子 |
KR100979701B1 (ko) * | 2008-08-25 | 2010-09-03 | 서울옵토디바이스주식회사 | 변조도핑층을 갖는 발광 다이오드 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2743996A4 * |
Also Published As
Publication number | Publication date |
---|---|
US9099600B2 (en) | 2015-08-04 |
EP2743996A4 (en) | 2015-04-08 |
TWI495149B (zh) | 2015-08-01 |
EP2743996A2 (en) | 2014-06-18 |
TW201308659A (zh) | 2013-02-16 |
CN103748698A (zh) | 2014-04-23 |
US20140191193A1 (en) | 2014-07-10 |
KR101175183B1 (ko) | 2012-08-17 |
JP2014522125A (ja) | 2014-08-28 |
WO2013022227A2 (ko) | 2013-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2013022227A3 (ko) | 전류 확산 효과가 우수한 질화물 반도체 발광소자 및 그 제조 방법 | |
WO2012040080A3 (en) | Microelectronic transistor having an epitaxial graphene channel layer | |
WO2012057517A3 (ko) | 화합물 반도체 장치 및 화합물 반도체 제조방법 | |
WO2009120011A3 (ko) | 발광소자 및 그 제조방법 | |
GB2515874A9 (en) | Light emitting diode package and method for manufacturing same | |
EP2731151A4 (en) | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR ELECTROLUMINESCENT ELEMENT, WAFER, AND NITRIDE SEMICONDUCTOR ELECTROLUMINESCENT ELEMENT | |
WO2013032304A3 (ko) | 유기전자소자 및 그 제조방법 | |
WO2013051875A3 (ko) | 유기 발광 소자 및 이의 제조방법 | |
WO2009108173A3 (en) | Methods for formation of substrate elements | |
WO2013022228A3 (ko) | 누설전류 차단 효과가 우수한 질화물 반도체 발광소자 및 그 제조 방법 | |
WO2012138172A3 (ko) | 신규 유기금속 화합물 및 이를 이용한 유기 발광 소자 | |
WO2012047042A3 (ko) | 미세 패턴 형성 방법 및 이를 이용한 미세 채널 트랜지스터 및 미세 채널 발광트랜지스터의 형성방법 | |
EP2587556A4 (en) | SAPPHIRE SUBSTRATE, PROCESS FOR PRODUCTION THEREOF, AND NITRIDE SEMICONDUCTOR LUMESCENT ELEMENT | |
WO2013002509A3 (ko) | 새로운 화합물 및 이를 이용한 유기 발광 소자 | |
WO2011019163A3 (ko) | 전자장치 | |
WO2012140050A3 (de) | Verfahren zur herstellung eines licht emittierenden halbleiterbauelements und licht emittierendes halbleiterbauelement | |
EP2600394A4 (en) | EPITACTIVE SUBSTRATE FOR A SEMICONDUCTOR COMPONENT, SEMICONDUCTOR COMPONENT, PN TRANSMISSION DIODE AND METHOD FOR PRODUCING AN EPITACTIC SUBSTRATE FOR A SEMICONDUCTOR COMPONENT | |
EP2518840A4 (en) | GROUP III NITRIDE SEMICONDUCTOR LASER ELEMENT, METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR LASER ELEMENT, AND EPITAXIAL SUBSTRATE | |
WO2012146892A3 (en) | Improved limit collar | |
WO2012160604A8 (ja) | 発光素子チップ及びその製造方法 | |
EP2477234A4 (en) | Group iii-v compound semiconductor light receiving element, method for manufacturing group iii-v compound semiconductor light receiving element, light receiving element, and epitaxial wafer | |
EP2624318A4 (en) | GROUP III ELEMENT NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME | |
IN2014DN09305A (ko) | ||
WO2009002129A3 (en) | Semiconductor light emitting device and method of manufacturing the same | |
TW200723564A (en) | Semiconductor element and manufacturing method of the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12821814 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14237299 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 2014524919 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2012821814 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2012821814 Country of ref document: EP |