WO2011071143A1 - Pièce électronique en céramique de type stratifié - Google Patents

Pièce électronique en céramique de type stratifié Download PDF

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Publication number
WO2011071143A1
WO2011071143A1 PCT/JP2010/072215 JP2010072215W WO2011071143A1 WO 2011071143 A1 WO2011071143 A1 WO 2011071143A1 JP 2010072215 W JP2010072215 W JP 2010072215W WO 2011071143 A1 WO2011071143 A1 WO 2011071143A1
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WIPO (PCT)
Prior art keywords
internal electrodes
ceramic
ceramic electronic
electronic component
portions
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PCT/JP2010/072215
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English (en)
Japanese (ja)
Inventor
泰治 山下
岡島　健一
田中　秀明
直人 村西
大樹 福永
長門 大森
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株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201080056002.2A priority Critical patent/CN102652343B/zh
Priority to KR1020127014582A priority patent/KR101379874B1/ko
Priority to JP2011545260A priority patent/JP5246347B2/ja
Publication of WO2011071143A1 publication Critical patent/WO2011071143A1/fr
Priority to US13/491,624 priority patent/US8773839B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/01—Form of self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals

Definitions

  • the present invention relates to a multilayer ceramic electronic component.
  • the present invention provides a multilayer ceramic comprising a rectangular ceramic sintered body and a plurality of first and second internal electrodes provided alternately inside the ceramic sintered body so as to face each other. It relates to electronic components.
  • multilayer ceramic capacitors are often used as representative examples of multilayer ceramic electronic components in electronic devices such as mobile phones and laptop computers.
  • multilayer ceramic capacitors have become smaller and larger in capacity.
  • a large capacity multilayer ceramic capacitor of 10 to 100 ⁇ F is also used in a power supply circuit or the like in which an aluminum electrolytic capacitor or a tantalum capacitor has been used.
  • the capacitance is proportional to the relative dielectric constant, the facing area of the internal electrodes, the number of stacked internal electrodes, and inversely proportional to the thickness of the dielectric layer. For this reason, various ideas have been made in order to obtain a large capacitance within a predetermined dimension.
  • Large-capacity multilayer ceramic capacitors have a dielectric layer that reaches a thickness of 1 ⁇ m or less, and dielectric materials such as barium titanate are required to have a fine particle size of 1 ⁇ m or less while maintaining high crystallinity.
  • the number of stacked internal electrodes may reach 1000 layers, and a smooth and good coverage electrode is required.
  • the ceramic layer and the internal electrode are integrally sintered in the manufacturing process to form a monolithic structure, a structure free from structural defects is required by reducing internal stress generated by expansion and contraction during sintering.
  • Patent Document 1 proposes various multilayer ceramic electronic components that can prevent defects such as cracks and delamination after firing even if the ceramic green sheets and internal electrodes are thinned and highly laminated, and a method for manufacturing the same. Has been.
  • Other methods for enhancing the functionality of a multilayer ceramic electronic component include a method of thinning a ceramic layer to increase the number of layers and increase the facing area of internal electrodes.
  • a multilayer ceramic electronic component having a thin ceramic layer, a large number of stacked layers, and a large opposing area of internal electrodes has a problem of low withstand voltage.
  • the present invention has been made in view of such a point, and an object thereof is to provide a multilayer ceramic electronic component that is small in size and has high voltage resistance.
  • the present inventors have found that the presence of a bent portion occurring at the end of the internal electrode reduces the voltage resistance, and as a result, the present invention has been achieved. That is, when a ceramic green sheet on which a conductor pattern for forming an internal electrode is formed is laminated, due to the misalignment of the green sheet and the density difference with the internal electrode, due to bleeding when forming the internal electrode, As shown in FIG. 23, a minute bent portion 2 a is formed at the end of the conductor pattern 2. When the bent portion 2a is generated, the electric field tends to concentrate on the bent portion 2a (particularly on the inner side).
  • the multilayer ceramic electronic component according to the present invention includes a rectangular parallelepiped ceramic sintered body and a plurality of first and second internal electrodes.
  • the ceramic sintered body includes a ceramic material.
  • the ceramic sintered body has first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces.
  • the first and second surfaces extend along the first direction and the second direction.
  • the second direction is perpendicular to the first direction.
  • the third and fourth surfaces extend along the third direction and the first direction.
  • the third direction is perpendicular to both the first and second directions.
  • the fifth and sixth surfaces extend along the second and third directions.
  • the plurality of first and second internal electrodes are alternately provided inside the ceramic sintered body so as to face each other.
  • the first and second internal electrodes are parallel to the first and second surfaces.
  • the first and second internal electrodes are provided so as to be exposed on at least one of the third and fourth surfaces, but not exposed on the fifth and sixth surfaces. There are no bent portions at all the end portions of the first and second internal electrodes on the fifth and sixth surface sides. In the second direction, the positions of both ends of each of the plurality of first and second internal electrodes are aligned.
  • the ceramic sintered body includes first and second main surfaces extending along the length direction and the width direction, and the width direction and the thickness direction.
  • the third direction is the thickness direction
  • the first and second surfaces are the first and second main surfaces
  • the third and fourth surfaces are the first and second surfaces. 2 side surfaces
  • the fifth and sixth surfaces are first and second end surfaces.
  • the first direction is a length direction
  • the second direction is a thickness direction
  • the third direction is a width direction.
  • the first and second surfaces are first and second side surfaces
  • the third and fourth surfaces are first and second main surfaces
  • the fifth and sixth surfaces are first. 1 and 2 end faces.
  • the plurality of first internal electrodes are exposed on the third surface, and the end on the fourth surface side is the fourth.
  • the plurality of second internal electrodes are not exposed on the surface, are exposed on the fourth surface, and the end portions are not exposed on the third surface side.
  • the end of the fourth surface or the third surface is thicker than the remaining portion of the internal electrodes.
  • a thick saddle part is formed.
  • at least one of the plurality of saddle portions of the plurality of first internal electrodes and the plurality of saddle portions of the second internal electrode at least one of the plurality of saddle portions is a remaining saddle portion.
  • the layer thickness of the ceramic layer positioned between the first and second internal electrodes facing each other is within a range of 0.3 ⁇ m to 2 ⁇ m. is there. In this case, if there is a bent portion having a plurality of bent points, the voltage resistance is greatly reduced, so the present invention is particularly effective.
  • the layer thickness of the ceramic layer positioned between the first and second internal electrodes facing each other is the same as that of the first and second internal electrodes. It is in the range of 1 to 3 times the thickness. In this case, if there is a bent portion having a plurality of bent points, the voltage resistance is greatly reduced, so the present invention is particularly effective.
  • FIG. 1 is a schematic perspective view of a ceramic electronic component according to an embodiment of the present invention.
  • FIG. 2 is a sectional view taken along line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is a partially enlarged sectional view of a section taken along line VV in FIG.
  • FIG. 6 is a schematic plan view of a ceramic green sheet on which a conductor pattern is printed.
  • FIG. 7 is a schematic perspective view of a ceramic member.
  • FIG. 8 is a schematic perspective view showing a process of forming a ceramic layer on both side surfaces.
  • FIG. 9 is a partially enlarged front view for explaining a modified example of the multilayer ceramic electronic component of the first embodiment.
  • FIG. 10 is a diagram illustrating the number of bent portions and the breakdown voltage BDV in the multilayer ceramic electronic components of Example 1, Comparative Example 1, and Comparative Example 2.
  • FIG. 11 is a schematic perspective view of a ceramic electronic component according to another embodiment of the present invention. 12 is a schematic cross-sectional view taken along line III-III in FIG. 13 is a schematic cross-sectional view taken along line IV-IV in FIG.
  • FIG. 14 is a schematic perspective view of a ceramic green sheet on which a conductor pattern is printed.
  • FIG. 15 is a schematic front view for explaining a step of forming a laminated body.
  • FIG. 16 is a schematic perspective view of a ceramic member.
  • FIG. 17 is a schematic perspective view showing a process of forming a ceramic layer on both end faces.
  • FIG. 18 is a schematic perspective view of a ceramic sintered body.
  • FIG. 19 is a cross-sectional photograph of a multilayer ceramic electronic component produced by the method described in the embodiment.
  • FIG. 20 is a schematic cross-sectional view of a ceramic electronic component according to a first modification.
  • FIG. 21 is a schematic cross-sectional view of a ceramic electronic component according to a second modification.
  • 22 is a schematic cross-sectional view taken along line XVI-XVI in FIG.
  • FIG. 23 is a schematic enlarged view of an end portion of the internal electrode in which a bent portion is generated.
  • the ceramic electronic component of the present invention is not limited to the multilayer ceramic electronic component 1.
  • FIG. 1 is a schematic perspective view of a ceramic electronic component according to this embodiment.
  • FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG.
  • FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is a partially enlarged cross-sectional view of a portion along line VV in FIG.
  • FIG. 6 is an enlarged schematic cross-sectional view of a portion VI in FIG.
  • the multilayer ceramic electronic component 2 of the present embodiment includes a rectangular ceramic sintered body 10.
  • the ceramic sintered body 10 includes first and second main surfaces 10a and 10b (first and second surfaces), first and second side surfaces 10c and 10d (third and fourth surfaces), 1st and 2nd end surface 10e, 10f (5th and 6th surface) are provided.
  • the first and second main surfaces 10a and 10b (first and second surfaces) extend along the length direction L (first direction) and the width direction W (second direction).
  • the first and second side surfaces 10c and 10d third and fourth surfaces extend along the length direction L (first direction) and the thickness direction T (third direction).
  • the first and second end faces 10e, 10f (fifth and sixth faces) extend along the width direction W (second direction) and the thickness direction T (third direction).
  • the ceramic sintered body 10 includes a ceramic material.
  • the ceramic sintered body 10 includes a sintering aid such as Si or a glass component in addition to the ceramic material.
  • a sintering aid such as Si or a glass component in addition to the ceramic material.
  • the glass component as the firing aid include silicate glass, borate glass, borosilicate glass, and phosphate glass containing an alkali metal component and an alkaline earth metal component.
  • the type of ceramic material can be appropriately selected according to the function required for the multilayer ceramic electronic component 2.
  • the ceramic sintered body 10 can be formed from a dielectric ceramic.
  • the dielectric ceramic include BaTiO 3 , CaTiO 3 , SrTiO 3 , and CaZrO 3 .
  • subcomponents such as a Mn compound, an Fe compound, a Cr compound, a Co compound, and a Ni compound may be appropriately added to the dielectric ceramic.
  • the ceramic sintered body 10 can be formed of piezoelectric ceramic.
  • the piezoelectric ceramic include a PZT (lead zirconate titanate) ceramic.
  • the ceramic sintered body 10 can be formed of a semiconductor ceramic.
  • the semiconductor ceramic include spinel ceramics.
  • the ceramic sintered body 10 can be formed of a magnetic ceramic.
  • the magnetic ceramic include a ferrite ceramic.
  • a plurality of first and second internal electrodes 11 and 12 are provided inside the ceramic sintered body 10.
  • Each of the first and second internal electrodes 11 and 12 is provided in parallel to the first and second main surfaces 10a and 10b.
  • the planar shape of each of the first and second internal electrodes 11 and 12 is a rectangle.
  • the plurality of first and second internal electrodes 11 and 12 are alternately arranged so as to face each other in the thickness direction T. In other words, the first and second internal electrodes 11, 12 are arranged in the thickness direction T so as to face each other through the ceramic layers 15 provided on the ceramic sintered body 10.
  • the layer thickness of the ceramic layer 15 is preferably in the range of 0.3 ⁇ m to 2 ⁇ m, for example.
  • the thickness of the first and second internal electrodes 11 and 12 is preferably in the range of 0.2 ⁇ m to 1 ⁇ m, for example.
  • the layer thickness of the ceramic layer 15 is preferably in the range of 1 to 3 times the thickness of the first and second internal electrodes 11 and 12.
  • the first inner electrode 11 is exposed at the first end face 10e, while the second end face 10f, the first and second main faces 10a, 10b, and the first and second side faces 10c, 10d Not exposed.
  • the second internal electrode 12 is exposed at the second end face 10f, while the first end face 10e, the first and second main faces 10a and 10b, and the first and second side faces 10c and 10d. Is not exposed.
  • the first external electrode 13 is provided on the first end face 10e.
  • the first external electrode 13 is connected to the first internal electrode 11.
  • a second external electrode 14 is provided on the second end face 10f.
  • the second external electrode 14 is connected to the second internal electrode 12.
  • the material for forming the first and second internal electrodes 11 and 12 and the first and second external electrodes 13 and 14 is not particularly limited as long as it is a conductive material.
  • the first and second inner electrodes 11 and 12 and the first and second outer electrodes 13 and 14 are made of, for example, metals such as Ag, Au, Pt, Pd, Ni, Cr, Al, and Cu, and their metals. It can form with the alloy containing 1 or more of these.
  • the first and second internal electrodes 11 and 12 and the first and second external electrodes 13 and 14 may be formed of a laminate of a plurality of conductive films.
  • the ceramic sintered body 10 includes first and second outer layer portions 10A and 10B, first and second side gap portions 10C and 10D, and an inner layer portion 10E. Is provided.
  • the inner layer portion 10E is a portion excluding the first and second outer layer portions 10A and 10B and the first and second side gap portions 10C and 10D of the ceramic sintered body 10. Specifically, in this embodiment, the ceramic sintered body 10 is provided in a region excluding both ends in the thickness direction T and both ends in the width direction W.
  • the inner layer portion 10E includes only a portion where the first and second internal electrodes 11, 12 face each other in the thickness direction T, and the first or second internal electrodes 11, 12 when viewed from the thickness direction T. And a provided part.
  • the first and second side surfaces 10c and 10d (third and fourth sides) of the first and second internal electrodes 11 and 12, respectively.
  • There is no bent portion (see FIG. 23) having a plurality of bending points at the end on the (surface) side. That is, as shown in a partially enlarged cross-sectional view in FIG. 5, at the end portions on the first and second side surfaces 10c and 10d side of the plurality of first internal electrodes 11 and the plurality of second internal electrodes 12, respectively. Does not have the bent portion.
  • the ceramic green sheet 20 shown in FIG. 6 is formed.
  • the method for forming the ceramic green sheet 20 is not particularly limited.
  • the ceramic green sheet 20 can be formed by, for example, a die coater, a gravure coater, a micro gravure coater, or the like.
  • a conductor pattern 21 is formed on the ceramic green sheet 20.
  • This conductor pattern 21 is for forming the first and second internal electrodes 11, 12.
  • the method for forming the conductor pattern 21 is not particularly limited.
  • the conductor pattern 21 can be formed by, for example, a screen printing method, an ink jet method, a gravure printing method, or the like.
  • a laminate is formed by laminating a plurality of ceramic green sheets 20 on which the conductor pattern 21 is formed. Specifically, first, after laminating a plurality of ceramic green sheets 20 on which the conductor pattern 21 is not formed, the ceramic green sheet 20 on which the conductor pattern 21 is formed is placed on one side in the x direction. A plurality of sheets are stacked alternately shifted to the other side. Further, a plurality of ceramic green sheets 20 on which the conductor pattern 21 is not formed are laminated thereon to complete the laminate.
  • the ceramic green sheet 20 which is laminated at the beginning and at the end and on which the conductor pattern 21 is not formed is for forming the first and second outer layer portions 10A and 10B.
  • a plurality of rectangular parallelepiped ceramic members 23 shown in FIG. 7 are formed by cutting the laminate along a virtual cut line L shown in FIG. Note that the laminated body can be cut by dicing or pressing. Moreover, you may cut
  • ceramic layers 24 and 25 are formed on the side surfaces 23e and 23f of the ceramic member 23 so as to cover the side surfaces 23e and 23f.
  • the ceramic layers 24 and 25 are for forming the first and second side gap portions 10C and 10D.
  • the formation method of the ceramic layers 24 and 25 is not particularly limited, and can be performed by a printing method such as a screen printing method, a coating method such as an inkjet method or a gravure coating method, a spraying method, or the like.
  • the ceramic member 23 on which the ceramic layers 24 and 25 are formed is sintered. Thereby, the ceramic sintered body 10 is completed.
  • the multilayer ceramic electronic component 2 is completed by forming the first and second external electrodes 13 and 14.
  • the formation method of the 1st and 2nd external electrodes 13 and 14 is not specifically limited.
  • the first and second external electrodes 13 and 14 may be formed, for example, by baking after applying a conductive paste. In that case, a conductive paste may be applied before firing the ceramic member 23, and the first and second external electrodes 13, 14 may be formed simultaneously with firing.
  • the multilayer ceramic electronic component 2 of the above embodiment was specifically produced and evaluated.
  • a multilayer ceramic electronic component a multilayer ceramic capacitor was produced under the following conditions.
  • the dimension of the end gap portion refers to the tip of the internal electrode, that is, the tip of the internal electrodes 11 and 12 along the length direction L, and the first or second end face 10e or 10f where the tip is not exposed. Dimension between.
  • the thickness of the ceramic layer sandwiched between the first and second internal electrodes 11 and 12 1.1 ⁇ m.
  • the thickness of the outer ceramic layer 0.05 mm.
  • Example 1 a multilayer ceramic electronic component 2 in which a side gap portion was formed later by forming a ceramic layer according to the above embodiment was prepared.
  • a rubber press method was used in which an elastic body was disposed between the mold and the laminate.
  • the side gap portion is not formed by post-processing, and after the mother ceramic laminated body is cut according to the conventional method, the internal electrode pattern is not exposed on the side surface, so that each laminated ceramic electronic
  • the laminated body of the component unit was obtained.
  • Others were the same as in Example 1.
  • a rubber press method was used as in Example 1.
  • Comparative Example 2 A raw laminate was obtained in the same manner as Comparative Example 1. However, when pressing the raw laminate, a rigid press method in which the mold and the laminate were in close contact with each other was used. Others were the same as in Comparative Example 1.
  • the ceramic sintered body 10 was polished from the other end face 10f side, and the polishing was stopped when the first and second internal electrodes 11, 12 began to be seen. And it was confirmed with the optical microscope whether the bending part exists in the width direction both ends of an internal electrode.
  • MEASURESCOPE MM-10 magnification 500 times, accuracy ⁇ 0.1 ⁇ m manufactured by Nikon Corporation was used.
  • the total number of bent portions observed by three methods was determined. In other words, since the number of laminated internal electrodes is 220, if there are bent portions at both ends in the width direction of all the internal electrodes, there are 440 bent portions.
  • Example 1 Comparative Example 1 and Comparative Example 2 were prepared and subjected to a BDV (Dielectric Breakdown Voltage) test. That is, a DC voltage was applied to the multilayer ceramic electronic component under the condition of 100 V / second, and BDV was measured.
  • BDV Dielectric Breakdown Voltage
  • FIG. 10 shows the number of bent portions obtained as described above and the results of the BDV test.
  • Example 1 the BDV was as high as about 120 V, and the number of bent portions was almost 0 per 440 pieces. On the other hand, in Comparative Example 1, the number of bent portions was about 40, and BDV was about 80V. Further, in Comparative Example 2, the average number of bent portions was as large as about 220 per 440, and the BDV was as low as about 50V.
  • Example 1 in which there are almost no bent portions, the withstand voltage is significantly improved by the absence of the bent portions.
  • FIG. 9 is a partially enlarged front view for explaining a modified example of the multilayer ceramic electronic component 1 of the first embodiment.
  • saddle portions 11 a are formed at the tips of the plurality of first internal electrodes 11. Such a saddle portion 11a is generated at the edge portion of the internal electrode when the internal electrode is formed by printing the conductive paste.
  • the saddle portion 11 a is thicker than the remaining portion 11 b of the internal electrode 11.
  • the saddle portion 11a exists at a position where it overlaps in the thickness direction, when the raw laminate is pressed in the thickness direction before firing, the adhesion between the ceramic layers on both sides of the saddle portion 11a, that is, the ceramic green sheets is improved. May decrease. Further, the force applied by the pressurization is greatly different between a portion where the saddle portions 11a overlap each other and a portion where the saddle portion 11a does not exist. Therefore, delamination may occur in the sintered ceramic body after firing.
  • BDV falls and MTTF becomes short when a bending part exists
  • a thin part is locally formed in the ceramic layer located between a bending part and an internal electrode adjacent to a bending part, and the part This is because the electric field concentrates on the surface.
  • the saddle portion 11a1 of at least one internal electrode 11 is arranged so as not to overlap with the other saddle portion 11a in the thickness direction.
  • at least one saddle portion 11a1 is shifted from the other saddle portion 11a in the third direction of the present invention.
  • This shift amount is preferably not less than 1 ⁇ 2 of the longitudinal dimension S of the saddle portion 11a, where P is the distance between the saddle portion 11a1 and both points of the saddle portion 11a. More preferably, P is greater than or equal to dimension S.
  • all of the plurality of saddle portions 11a of the plurality of first internal electrodes 11 are arranged so as not to overlap in the thickness direction.
  • the dimension S is preferably 100 to 200 ⁇ m.
  • the dimension P is preferably 20 to 40 ⁇ m.
  • the thickness of the portion of the saddle portion 11a1 protruding from the internal electrode 11 is preferably 10% or more with respect to the thickness of the internal electrode 11 (portion where there is no saddle).
  • the plurality of first internal electrodes 11 have been described.
  • at least one saddle portion among the plurality of saddle portions is arranged in the length direction. It is preferable to shift from the remaining saddle portion. Thereby, similarly, delamination of the ceramic sintered body can be suppressed on the tip side of the second internal electrode.
  • At least one saddle portion does not overlap the remaining saddle portion in the thickness direction as described above. What is necessary is just to be arranged.
  • FIG. 11 is a schematic perspective view of the ceramic electronic component of the present embodiment.
  • 12 is a schematic cross-sectional view taken along line III-III in FIG.
  • FIG. 13 is a schematic cross-sectional view taken along line IV-IV in FIG.
  • the multilayer ceramic electronic component 1 of the present embodiment includes a rectangular parallelepiped ceramic sintered body 10.
  • the ceramic sintered body 10 includes first and second main surfaces 10a and 10b, first and second side surfaces 10c and 10d, and first and second end surfaces 10e and 10f.
  • the first and second main surfaces 10a and 10b extend along the length direction L and the width direction W.
  • the first and second side surfaces 10c and 10d extend along the length direction L and the thickness direction T.
  • the first and second end faces 10e, 10f extend along the width direction W and the thickness direction T.
  • the first and second side surfaces 10c and 10d correspond to the first and second surfaces.
  • the first and second main surfaces 10a and 10b correspond to the third and fourth surfaces.
  • the first and second end faces 10e and 10f correspond to the fifth and sixth faces.
  • the length direction L corresponds to the first direction.
  • the thickness direction T corresponds to the second direction.
  • the width direction W corresponds to the third direction.
  • the ceramic sintered body 10 is made of the same material as the ceramic sintered body 10 of the first embodiment.
  • a plurality of first and second internal electrodes 11, 12 are provided inside the ceramic sintered body 10.
  • the plurality of first and second internal electrodes 11, 12 are alternately arranged in the width direction W so as to face each other via the ceramic layer 15.
  • Each of the first and second internal electrodes 11 and 12 is provided in parallel to the first and second side surfaces 10c and 10d.
  • the planar shape of each of the first and second internal electrodes 11 and 12 is a rectangle.
  • the layer thickness of the ceramic layer 15 is preferably in the range of 0.3 ⁇ m to 2 ⁇ m, for example.
  • the thickness of the first and second internal electrodes 11 and 12 is preferably in the range of 0.2 ⁇ m to 1 ⁇ m, for example.
  • the layer thickness of the ceramic layer 15 is preferably in the range of 1 to 3 times the thickness of the first and second internal electrodes 11 and 12.
  • the first internal electrode 11 is exposed on the first main surface 10a (third surface), while the second main surface 10b (fourth surface), the first and second side surfaces 10c, 10d. (First and second surfaces) and the first and second end surfaces 10e and 10f (fifth and sixth surfaces) are not exposed.
  • the second internal electrode 12 is exposed to the second main surface 10b (fourth surface), while the first main surface 10a (third surface), the first and second side surfaces 10c. 10d (first and second surfaces) and the first and second end surfaces 10e and 10f (fifth and sixth surfaces) are not exposed.
  • the first external electrode 13 is provided on the first main surface 10a.
  • the first external electrode 13 is connected to the first internal electrode 11.
  • a second external electrode 14 is provided on the second main surface 10b.
  • the second external electrode 14 is connected to the second internal electrode 12.
  • the first and second internal electrodes 11 and 12 and the first and second external electrodes 13 and 14 can be formed of the same material as in the first embodiment.
  • the ceramic sintered body 10 includes first and second outer layer portions 10A and 10B, first and second side gap portions 10C and 10D, and an inner layer portion 10E. Is provided.
  • the inner layer portion 10E is a portion excluding the first and second outer layer portions 10A and 10B and the first and second side gap portions 10C and 10D of the ceramic sintered body 10.
  • the ceramic sintered body 10 is provided in a region excluding both end portions in the length direction L and both end portions in the width direction W.
  • the inner layer portion 10E only a portion where the first and second internal electrodes 11 and 12 face each other in the width direction W and only the first or second internal electrodes 11 and 12 when viewed from the width direction W are provided. Are provided.
  • a high breakdown voltage (BDV), A long mean failure life (MTTF) can be achieved. Therefore, it is possible to achieve both compactness and high performance, and high voltage resistance and reliability.
  • BDV falls and MTTF becomes short when a bending part exists, A thin part is locally formed in the ceramic layer located between a bending part and an internal electrode adjacent to a bending part, and the part This is because the electric field concentrates on the surface.
  • the ceramic green sheet 20 shown in FIG. 14 is formed.
  • the method for forming the ceramic green sheet 20 is not particularly limited.
  • the ceramic green sheet 20 can be formed by, for example, a die coater, a gravure coater, a micro gravure coater, or the like.
  • the conductor pattern 21 is for forming the first and second internal electrodes 11 and 12.
  • the method for forming the conductor pattern 21 is not particularly limited.
  • the conductor pattern 21 can be formed by, for example, a screen printing method, an ink jet method, a gravure printing method, or the like.
  • a laminate 22 is formed. Specifically, first, after stacking a plurality of ceramic green sheets 20 on which the conductor pattern 21 is not formed, the ceramic green sheet 20 on which the conductor pattern 21 is formed is moved in the first direction x. A plurality of sheets are stacked while being alternately shifted to one side y1 and the other side y2 in the second direction y orthogonal to the direction y. Further, a plurality of ceramic green sheets 20 on which the conductor pattern 21 is not formed are laminated thereon to complete the laminate 22.
  • the obtained laminate 22 is pressed in the stacking direction z by an isostatic pressing method or the like.
  • the laminate 22 can be cut by dicing or pressing. Moreover, you may cut
  • ceramic layers 24 and 25 are formed on the end faces 23e and 23f of the ceramic member 23 so as to cover the end faces 23e and 23f.
  • the ceramic layers 24 and 25 are for forming the first and second side gap portions 10C and 10D.
  • the formation method of the ceramic layers 24 and 25 is not particularly limited, and can be performed by a printing method such as a screen printing method, a coating method such as an inkjet method or a gravure coating method, a spraying method, or the like.
  • the ceramic member 23 on which the ceramic layers 24 and 25 are formed is sintered. Thereby, the ceramic sintered body 10 shown in FIG. 18 is completed.
  • first and second external electrodes 13 and 14 are formed to complete the multilayer ceramic electronic component 1 shown in FIGS.
  • the formation method of the 1st and 2nd external electrodes 13 and 14 is not specifically limited.
  • the first and second external electrodes 13 and 14 may be formed, for example, by baking after applying a conductive paste. In that case, a conductive paste may be applied before firing the ceramic member 23, and the first and second external electrodes 13, 14 may be formed simultaneously with firing.
  • the conductor pattern 21 is formed in a stripe shape, and when the laminate 22 is cut, both ends of the first and second inner electrodes 11 and 12 in the thickness direction T are cut by cutting the conductor pattern 21. Part is formed. Accordingly, as shown in FIG. 19, bent portions having a plurality of bending points do not occur at both end portions in the thickness direction T of the first and second internal electrodes 11, 12.
  • FIG. 19 is a cross-sectional photograph of a part of the multilayer ceramic electronic component 1 manufactured by the above manufacturing method. The photograph shown in FIG. 19 shows a plurality of internal electrodes extending in the horizontal direction in FIG.
  • the end portion on the second external electrode 14 side in the thickness direction T of the first internal electrode 11 (see FIG. 12) and the end portion on the first external electrode 13 side in the thickness direction T of the second internal electrode 12. Is not formed by cutting. However, for example, even if the stacking position shift of the ceramic green sheets 20 in the y direction shown in FIG. 15 occurs in the stacking process of the ceramic green sheets 20, the ceramics having substantially the same thickness above and below as long as no significant shift occurs.
  • the green sheet 20 and the conductor pattern 21 are located. Accordingly, the end portion on the second external electrode 14 side in the thickness direction T of the first internal electrode 11 (see FIG. 12) or the end portion on the first external electrode 13 side in the thickness direction T of the second internal electrode 12. Therefore, a bent portion having a plurality of bending points is unlikely to occur.
  • the method for preventing the bent portion from being generated is not particularly limited to the above-described manufacturing method.
  • the generation of a bent portion can also be suppressed by laminating the ceramic green sheets 20 with very high positional accuracy.
  • the conductor pattern 21 when the conductor pattern 21 is printed on the ceramic green sheet 20 as in the above manufacturing method, for example, as described in Japanese Patent Application Laid-Open No. 2006-335045, the end portion of the conductor pattern 21 is more than the other part. Also, a so-called saddle portion having a large thickness may be formed. For this reason, for example, when the saddle portion of the conductor pattern overlaps in the stacking direction, a large stress is applied to the region where the saddle portion overlaps during pressing or the like. For this reason, the conductor pattern 21 may be deformed during pressing or the like, and the internal electrodes 11 and 12 having desired shapes may not be formed. Also, cracks may occur during firing.
  • the end portions in the length direction L of the first and second internal electrodes 11, 12 overlapping in the width direction W are formed by cutting the conductor pattern 21. For this reason, no saddle portion is formed at the end portions in the length direction L of the first and second internal electrodes 11, 12. Therefore, the generation of cracks during firing can be effectively suppressed. Moreover, it is easy to obtain the first and second internal electrodes 11 and 12 having desired shapes and dimensions.
  • a saddle portion may be formed at the end portions in the thickness direction T of the first and second internal electrodes 11 and 12.
  • the end in the thickness direction T of the first internal electrode 11 and the end in the thickness direction T of the second internal electrode 12 do not overlap in the width direction W (stacking direction). Therefore, even if a saddle portion is formed at the end in the thickness direction T of the first and second internal electrodes 11, 12, cracks are unlikely to occur during firing. Moreover, it is easy to obtain the first and second internal electrodes 11 and 12 having a desired shape and size.
  • a saddle portion 11a formed at an end in a direction T perpendicular to the stacking direction of the first or second internal electrodes 11 and 12 that are close to each other in the stacking direction (width direction W). , 12a are more preferably different in the direction T.
  • the end portions in the direction T of the saddles 11a and 12a have a shape in which the width in the width direction W becomes narrower toward the outside. For this reason, for example, compared with the case where the cross-sectional shape of the edge part along the direction T of the saddles 11a and 12a is a rectangular shape, the effect that peeling of the ceramic layer 15 does not arise easily is also acquired.
  • the saddle portions 11a and 12a do not necessarily need to be completely overlapped when viewed from the direction T.
  • the saddle portions 11a and 12a may be provided so that the position of the thickest portion is different when viewed from the direction T.
  • the first and second inner electrodes 11, 12 are parallel to the first and second side surfaces 10c, 10d, and the first inner electrode 11 is drawn out to the first main surface 10a.
  • the example in which the second internal electrode 12 is drawn out to the second main surface 10b has been described.
  • the arrangement of the first and second internal electrodes is not limited to the above arrangement.
  • first and second internal electrodes may be formed in parallel to the first and second main surfaces or the first and second end surfaces.
  • FIG. 21 is a schematic cross-sectional view of a ceramic electronic component according to a second modification.
  • 22 is a schematic cross-sectional view taken along line XVI-XVI in FIG. 21 of a ceramic electronic component according to a second modification.
  • the first and second internal electrodes 11 and 12 are formed in parallel to the first and second main surfaces 10a and 10b.
  • the first internal electrode 11 is drawn out to the first end face 10e and connected to the first external electrode 13 formed on the first end face 10e.
  • the second internal electrode 12 is drawn out to the second end face 10f and connected to the second external electrode 14 formed on the second end face 10f.
  • the side gap portions 10C and 10D are located at the end portions of the ceramic sintered body 10 on the first and second side surfaces 10c and 10d side.
  • Multilayer ceramic electronic component 10 ... Ceramic sintered body 10A, 10B ... Outer layer part 10C, 10D ... Side gap part 10E ... Inner layer part 10a ... First main surface 10b ... Second main surface 10c ... First Side surface 10d ... 2nd side surface 10e ... 1st end surface 10f ... 2nd end surface 11 ... 1st internal electrode 11a, 11a1 ... Saddle part 12 ... 2nd internal electrode 12a ... Saddle part 13 ... 1st exterior Electrode 14 ... Second external electrode 15 ... Ceramic layer 20 ... Ceramic green sheet 21 ... Conductor pattern 22 ... Laminate 23 ... Ceramic member 23e, 23f ... End surface 24, 25 ... Ceramic layer

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'invention concerne une pièce électronique en céramique de type stratifié de petites dimensions et de résistance diélectrique élevée, et moins sujette à la déstratification entre les couches céramiques. La pièce en céramique de type stratifié comprend un élément compact fritté en céramique cuboïde (10) et une pluralité de premières et secondes électrodes internes (11, 12). Les premières et secondes électrodes internes (11, 12) sont placées en alternance de manière opposée les unes aux autres à l'intérieur de l'élément compact fritté en céramique (10). Les premières et secondes électrodes internes (11, 12) sont parallèles à des première et seconde faces (10a). Les premières et secondes électrodes internes (11, 12) sont disposées de manière à être exposées à la cinquième et/ou à la sixième face, mais à ne pas être exposées aux troisième et quatrième faces (10c, 10d). Les premières et secondes électrodes internes (11, 12) n'ont respectivement pas de parties coudées à l'une quelconque de leurs parties d'extrémité du côté des troisième et quatrième faces (10c, 10d).
PCT/JP2010/072215 2009-12-11 2010-12-10 Pièce électronique en céramique de type stratifié WO2011071143A1 (fr)

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CN201080056002.2A CN102652343B (zh) 2009-12-11 2010-12-10 层叠型陶瓷电子部件
KR1020127014582A KR101379874B1 (ko) 2009-12-11 2010-12-10 적층형 세라믹 전자부품
JP2011545260A JP5246347B2 (ja) 2009-12-11 2010-12-10 積層型セラミック電子部品
US13/491,624 US8773839B2 (en) 2009-12-11 2012-06-08 Multilayer ceramic electronic component

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JP2009281681 2009-12-11
JP2009-281681 2009-12-11

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JP2016015461A (ja) * 2014-07-03 2016-01-28 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミックキャパシタ及び積層セラミックキャパシタの実装基板
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KR101379874B1 (ko) 2014-04-01
US8773839B2 (en) 2014-07-08
JP5246347B2 (ja) 2013-07-24
KR20120080652A (ko) 2012-07-17
CN102652343A (zh) 2012-08-29
CN102652343B (zh) 2014-07-23
US20120250220A1 (en) 2012-10-04

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