WO2010103892A1 - プローブカード - Google Patents
プローブカード Download PDFInfo
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- WO2010103892A1 WO2010103892A1 PCT/JP2010/052180 JP2010052180W WO2010103892A1 WO 2010103892 A1 WO2010103892 A1 WO 2010103892A1 JP 2010052180 W JP2010052180 W JP 2010052180W WO 2010103892 A1 WO2010103892 A1 WO 2010103892A1
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- Prior art keywords
- conductive
- circuit board
- conductive layer
- contact
- probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Definitions
- the present invention relates to a probe card for inspecting electrical characteristics of an object to be inspected.
- a probe device having a probe card and a mounting table for holding the wafer.
- the probe card is usually provided with a plurality of contact members that are brought into contact with the electrode pads of the electronic circuit on the wafer, a support plate that supports the contact members on the lower surface, and an upper surface side of the support plate. It includes a circuit board that sends electrical signals. Then, the electronic circuit on the wafer is inspected by sending an electrical signal from the circuit board to each contact member in a state where each contact member is in contact with each electrode pad of the wafer.
- Patent Document 1 Japanese Laid-Open Patent Publication No. 7-94561
- the present invention has been made in view of such points, and in the inspection of the electrical characteristics of an object to be inspected such as a wafer on which a large number of electrode pads are formed, the contact between the object to be inspected and the contact member is stabilized.
- the purpose is to conduct inspections appropriately.
- the present invention is a probe card for inspecting the electrical characteristics of an object to be inspected, which is provided under the circuit board and the circuit board and contacts the object under inspection during inspection.
- a support plate that supports a plurality of contact members, a flexible plate that is provided below the circuit board and above the support plate, can be filled with gas, has flexibility, and the plurality of contact members are inspected
- An elastic member that applies a predetermined contact pressure to the plurality of contact members when contacting the body, and a conductive portion that is disposed inside the elastic member and electrically connects the circuit board and the contact member during inspection
- the conductive portion has a conductive layer including a flexible insulating layer and a wiring layer formed in the insulating layer.
- the conductive portion that electrically connects the circuit board and the contact member during inspection is provided in the elastic member provided below the circuit board and above the support plate. It is not necessary to form wirings in a narrow region at extremely narrow intervals, and the conductive portions can be arranged without difficulty at intervals similar to the intervals between the contact members. Therefore, the probe card of the present invention can be applied to an object to be inspected such as a wafer on which a large number of electrode pads are formed.
- the elastic member can press the support plate to stably contact the device under test and the contact member with a predetermined contact pressure. it can.
- each conductive layer includes a flexible insulating layer, the conductive portion can be expanded and contracted in the vertical direction. Then, in order to bring the object to be inspected and the contact member into contact with each other at a predetermined contact pressure at the time of inspection, even when the contact member is pressed and moved downward by the elastic member, the conductive portion extends in the vertical direction, and the circuit board and The electrical connection with the contact member can be reliably maintained.
- the conductive portion is provided above the support plate, the wiring length between the contact member and the circuit board is the same in each contact member. Therefore, the way of transmission of the electrical signal sent from the circuit board to the contact member is the same in each contact member.
- the probe card of the present invention is used, the electrical characteristics of the object to be inspected can be inspected appropriately.
- Another aspect of the present invention is a probe card for inspecting the electrical characteristics of an object to be inspected, which is a circuit board and a plurality of contacts provided below the circuit board and in contact with the object under inspection.
- An elastic member that is provided between a support plate that supports a member and the circuit board and the support plate, and applies a predetermined contact pressure to the plurality of contact members when the plurality of contact members contact the object to be inspected.
- a member, and a conductive portion that is provided below the circuit board and above the support plate, and electrically connects the circuit board and the contact member at the time of inspection. In the uppermost conductive layer, one end is electrically connected to the circuit board at the time of inspection, and the other end is disposed below the conductive layer.
- the conductive layer includes a flexible insulating layer and a wiring layer formed on the insulating layer.
- the present invention in the inspection of the electrical characteristics of the object to be inspected, it is possible to appropriately perform the inspection while stabilizing the contact between the object to be inspected and the contact member.
- FIG. 1 is a longitudinal sectional view showing an outline of a configuration of a probe apparatus 1 having a probe card according to the present embodiment.
- the probe apparatus 1 is provided with, for example, a probe card 2 and a mounting table 3 on which a wafer W as an object to be inspected is mounted.
- the probe card 2 is disposed above the mounting table 3.
- the probe card 2 is formed, for example, in a substantially disc shape as a whole.
- the probe card 2 includes a circuit board 10 for sending an electrical signal for inspection to the wafer W mounted on the mounting table 3, and probes 11 as a plurality of contact members that contact the electrode pads U of the wafer W during inspection. And a support plate 12 supported on the lower surface.
- the circuit board 10 is formed in a substantially disk shape, for example, and is electrically connected to a tester (not shown).
- An electronic circuit (not shown) for transmitting an electrical signal for inspection between the circuit board 10 and the probe 11 is mounted inside the circuit board 10.
- An electrical signal for inspection from the tester is transmitted to and received from the probe 11 via the electronic circuit of the circuit board 10.
- the connection terminal 13 is formed as a part of the electronic circuit of the circuit board 10.
- a reinforcing member 14 that reinforces the circuit board 10 is provided on the upper surface side of the circuit board 10 in parallel with the circuit board 10.
- the reinforcing member 14 is formed in a substantially disk shape, for example.
- a holder 15 is provided on the outer periphery of the circuit board 10. The holder 15 holds the circuit board 10 and the reinforcing member 14.
- the support plate 12 is formed in a substantially disk shape, for example, and is disposed below the plurality of connection terminals 13 of the circuit board 10 so as to face the mounting table 3.
- a plurality of probes 11 supported on the lower surface of the support plate 12 are arranged corresponding to the electrode pads U of the wafer W.
- a plurality of connection terminals 16 are provided on the upper surface of the support plate 12.
- the connection terminal 16 is electrically connected to each probe 11 via a connection wiring 17.
- the probe 11 is made of a metal conductive material such as nickel cobalt.
- the support plate 12 is made of an insulating material having the same thermal expansion coefficient as that of the wafer W. For example, an insulating material such as ceramic or glass or a conductive material whose surface is coated is used.
- a support member 18 having elasticity is provided on the ring on the upper surface of the outer periphery of the support plate 12. As shown in FIG. 1, the support plate 18 is connected to the circuit board 10 and supports the support plate 12. The support member 18 may be connected to the holder 15, for example.
- a fluid chamber 20 as an elastic member is provided between the circuit board 10 and the support plate 12.
- the fluid chamber 20 is provided so as to cover almost the entire upper surface of the support plate 12.
- the fluid chamber 20 can enclose a gas, for example, compressed air, and has flexibility.
- the fluid chamber 20 is provided with an air supply pipe 21 through which compressed air flows in and out.
- the air supply pipe 21 is connected to a compressed air supply source (not shown).
- the support plate 12 can be uniformly pressed downward in the horizontal plane and moved, and the plurality of probes 11 supported by the support plate 12 also move downward. Can be made.
- the fluid chamber 20 can apply a predetermined contact pressure to the plurality of probes 11 at the time of inspection.
- the lower surface of the fluid chamber 20 may be bonded to the upper surface of the support plate 12, or a guide (not shown) may be provided around the fluid chamber 20.
- the fluid chamber 20 is formed, for example, by disposing a plurality of conductive portions 30 described later between two flexible films and then sealing the two flexible films.
- a plurality of conductive portions 30 are provided for electrically connecting the connection terminals 13 of the circuit board 10 and the probes 11 of the support plate 12 during inspection.
- the conductive portion 30 is disposed at a position corresponding to the connection terminal 13 and the probe 11, that is, disposed below the circuit board 10 and above the support plate 12.
- the plurality of conductive portions 30 are arranged in the fluid chamber 20 in the horizontal direction as shown in FIG.
- the conductive portion 30 has a plurality of, for example, four conductive layers 31, 32, 33, and 34 arranged in the vertical direction as shown in FIG. FIG. 3 shows a case where the fluid chamber 20 is expanded at the time of inspection, for example. Further, the number of conductive layers stacked is not limited to this embodiment, and may be five layers or more, or may be three layers or less.
- the conductive portion 30 extends in a zigzag shape when viewed from the side. Then, the conductive layers 31 and 31 of the conductive portions 30 and 30 adjacent in the horizontal direction are disposed so as to be convexly curved as a whole. Moreover, the conductive layers 32 and 32 are arrange
- the conductive layer 31 is, for example, FPC (Flexible Printed Circuits), and has a flexible insulating layer 40 of, for example, a resin film and a wiring layer 41 formed on the lower surface of the insulating layer 40. ing. A conductive portion 42 is formed at the end of the insulating layer 40, and the conductive portion 42 is connected to the wiring layer 41.
- FPC Flexible Printed Circuits
- a plurality of insulating layers 40 of the conductive layer 31 are formed in the horizontal direction on one insulating film 43 as shown in FIG.
- the plurality of insulating layers 40 are formed in a rectangular shape in plan view by a plurality of notches 44 provided in the insulating film 43. With this configuration, the insulating layer 40 can move up and down around the base end 45 where the notch 44 is not provided.
- a plurality of wiring layers 41 are arranged in the horizontal direction on the surface of the insulating layer 40.
- a plurality of wiring layers 41 are collectively formed at predetermined positions on the insulating film 43 by using a photolithography technique or an etching technique, and then a plurality of notches 44 are provided in the insulating film 43 to form a plurality of insulating films.
- Layer 40 is formed. Therefore, the plurality of insulating layers 40 and the plurality of wiring layers 41 can be formed at a time.
- the conductive layers 32 to 34 also have an insulating layer 40, a wiring layer 41, and a conductive portion 42. Further, the plurality of insulating layers 40 and the plurality of wiring layers 41 of the conductive layers 32 to 34 are also formed in one insulating film 43 at a time. That is, in the plurality of conductive portions 30 arranged side by side in the horizontal direction shown in FIG. 2, conductive layers positioned at the same height are collectively formed on one insulating film 43.
- the end portion of the wiring layer 41 of the conductive layer 31 and the conductive portion 42 formed at the end portion of the insulating layer 40 of the conductive layer 32 are fixedly connected by, for example, soldering. .
- the end portion of the wiring layer 41 and the end portion of the conductive portion 42 are fixedly connected by soldering, for example.
- the conductive part 32 one end connected to the upper conductive part 31 and the other end connected to the lower conductive part 33 face each other.
- the conductive part 33 one end connected to the upper conductive part 32 and the other end connected to the lower conductive part 34 face each other.
- end of the conductive layer 31 and the end of the conductive layer 32 are sealed with, for example, a resin 46.
- the end of the conductive layer 33 and the end of the conductive layer 34 are also sealed with, for example, a resin 46.
- connection part 50 has conductivity and is disposed at a position corresponding to the connection terminal 13 of the circuit board 10.
- the connection part 50 is formed by, for example, filling a through-hole formed in the fluid chamber 20 with a conductive paste and then heating the conductive paste. Then, when the connection part 50 comes into contact with the connection terminal 13, the conductive layer 31 of the conductive part 30 and the connection terminal 13 are electrically connected. That is, the connection portion 50 can electrically connect the conductive portion 30 and the connection terminal 13 while maintaining the airtightness inside the fluid chamber 20.
- the connecting part 50 may be formed by putting solder balls into the through holes of the fluid chamber 20 described above and heating and melting the solder balls.
- connection portion 51 The end of the wiring layer 41 of the lowermost conductive layer 34 is connected to a connection portion 51 as another connection portion formed in the fluid chamber 20.
- the connection part 51 has conductivity and is disposed at a position corresponding to the connection terminal 16 of the support plate 12.
- the connecting portion 51 is formed, for example, by performing so-called wire bonding in a through hole formed in the fluid chamber 20. That is, the wire 52 is inserted into the through hole of the fluid chamber 20, and the resin 53 is filled into the through hole so that the tip of the wire 52 protrudes. Then, the conductive paste 54 is filled into the through hole so as to cover the tip of the wire 52, and the connection portion 51 is formed.
- connection portion 51 contacts the connection terminal 16 provided on the upper surface of the support plate 12, but the connection portion 51 is provided through the support plate 12 in the thickness direction. May contact a connection terminal (not shown) provided on the lower surface side of the support plate 12.
- the mounting table 3 is configured to be movable in the horizontal direction and the vertical direction, for example, and can move the mounted wafer W three-dimensionally.
- the probe apparatus 1 is configured as described above, and a method for inspecting the electrical characteristics of the electronic circuit of the wafer W performed by the probe apparatus 1 will be described.
- compressed air is not supplied into the fluid chamber 20, and the fluid chamber 20 is in a compressed state. Further, the conductive portion 30 in the fluid chamber 20 is not extended, and the conductive layers 31 to 34 of the conductive portion 30 are stacked horizontally.
- the mounting table 3 rises to a predetermined position as shown in FIG.
- compressed air is supplied from the air supply pipe 21 into the fluid chamber 20, and a predetermined amount of compressed air is sealed in the fluid chamber 20.
- the fluid chamber 20 expands in the vertical direction and presses the support plate 12 uniformly downward in a horizontal plane.
- the conductive portion 30 in the fluid chamber 20 also extends in the vertical direction as the fluid chamber 20 expands.
- the pressed support plate 12 moves downward, and the plurality of probes 11 supported by the support plate 12 also move downward. Then, each probe 11 contacts each electrode pad U of the wafer W with a predetermined contact pressure.
- connection portions 50 and 51 of the fluid chamber 20 are connected to the connection terminal 13 of the circuit board 10 and the connection terminal 16 of the support plate 12, respectively. Thereby, the circuit board 10 and the electrode pad U are electrically connected.
- an electrical signal for inspection is transmitted from the circuit board 10 to the connection portion 50, the conductive portion 30, the connection portion 51, the connection terminal 16, the connection wiring 17, and
- the probe 11 is sequentially passed to each electrode pad U on the wafer W, and the electrical characteristics of the electronic circuit on the wafer W are inspected.
- the conductive portion 30 that electrically connects the circuit board 10 and the probe 11 at the time of inspection is provided below the circuit board 10 and above the support plate 12. It is not necessary to form wirings in a narrow region at very narrow intervals, and the plurality of conductive portions 30 can be arranged without difficulty at intervals similar to the intervals between the probes 11. Therefore, the probe card 2 of the present embodiment can cope with a case where a large number of electrode pads U are formed on the wafer W.
- the fluid chamber 20 having flexibility is provided between the circuit board 10 and the support plate 12, the fluid chamber 20 is expanded by enclosing a predetermined amount of compressed air in the fluid chamber 20.
- the support plate 12 can be uniformly pressed in a horizontal plane. Therefore, the electrode pad U of the wafer W and the probe 11 can be stably contacted at a predetermined contact pressure.
- the conductive portion 30 is zigzag in the vertical direction. Can expand and contract. Then, even when a predetermined amount of compressed air is sealed in the fluid chamber 20 during inspection and the fluid chamber 20 expands in the vertical direction, the conductive portion 30 extends in the vertical direction, and the circuit board 10 and the probe 11 Electrical connection can be maintained.
- the flexibility and stretchability of the conductive portion 30 can be increased. Accordingly, even when the fluid chamber 20 has a large amount of expansion in the vertical direction, the conductive portion 30 can extend in the vertical direction, and the electrical connection between the circuit board 10 and the probe 11 can be reliably maintained. .
- the conductive portion 30 is provided extending above the support plate 12, the wiring length between the probe 11 and the circuit board 10 is the same in each probe 11. Therefore, the way in which the electric signal transmitted from the circuit board 10 to the probe 11 is transmitted is the same in each probe 11.
- the electrical characteristics of the electronic circuit on the wafer W can be improved while the electrode pad U of the wafer W and the probe 11 are stably in contact with each other with a predetermined contact pressure. Can be properly inspected.
- a plurality of insulating layers 40 and a plurality of wiring layers 41 can be collectively formed on one insulating film 43, so that compared to the case where a wiring layer is formed for each probe 11. It can be formed very easily, and the manufacturing cost of the probe card 2 can be significantly reduced.
- the plurality of wiring layers 41 can be formed with high accuracy and an appropriate inspection can be performed.
- the configuration and arrangement of the conductive portion 30 are not limited to the above embodiment.
- two conductive layers 31 and 32 may be stacked in the conductive portion 30.
- a wiring layer 41 is formed on the upper surface of the insulating layer 40, and the end of the upper conductive layer 31 and the end of the lower conductive layer 32 of the wiring layer 41 are formed. May be connected directly.
- the plurality of conductive portions 30 arranged in the horizontal direction may be arranged so as not to form the space portion 35 as shown in the above embodiment. That is, you may arrange
- omitted since it is the same as that of the said embodiment about the other structure of the probe card 2, description is abbreviate
- the conductive part 30 in the conductive part 30, three conductive layers 31 to 33 may be laminated.
- the other configurations of the conductive layers 31 to 33 and the probe card 2 are the same as those in the above embodiment, and thus the description thereof is omitted.
- each of the conductive layers 31 and 32 of the conductive portion 30 may be a multilayer wiring groove structure in which a plurality of insulating layers 40 and a plurality of wiring layers 41 are alternately stacked in the vertical direction.
- the conductive portion 30 can be expanded and contracted in the vertical direction, the electrode pad U of the wafer W and the probe 11 can be stably brought into contact with each other at a predetermined contact pressure, while being on the wafer W.
- the electrical characteristics of the electronic circuit can be properly inspected.
- the fluid chamber 20 is used as the elastic member, but the invention is not limited to this as long as a predetermined contact pressure can be applied to the plurality of probes 11 at the time of inspection.
- an actuator 60 may be used as the elastic member.
- a plurality of actuators 60 may be provided between the circuit board 10 and the support plate 12, and a plurality of conductive portions 30 may be disposed between the plurality of actuators 60.
- the actuator 60 of the present embodiment generates a certain thrust in a certain direction by air, for example. Even in such a case, the support plate 12 can be pressed by allowing a predetermined amount of air to flow into the actuator 60, so that each probe 11 and each electrode pad U of the wafer W can be stably brought into contact with each other with a predetermined contact pressure. .
- the actuator 60 may be one that generates a constant thrust by electric energy.
- connection portion 50 on the circuit board 10 side may be formed with the same configuration as the connection portion 51 described above. Further, the connecting portion 51 on the support plate 12 side may be formed with the same configuration as the connecting portion 50 described above.
- the probe 11 is used as the contact member, but the present invention is not limited to this.
- various contact members such as a cantilever type probe can be used as the contact member.
- the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.
- the present invention is not limited to this example and can take various forms.
- the present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.
- FPD flat panel display
- the present invention is useful when inspecting the electrical characteristics of an object to be inspected, such as a semiconductor wafer.
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Abstract
Description
2 プローブカード
3 載置台
10 回路基板
11 プローブ
12 支持板
13 接続端子
14 補強部材
15 ホルダ
16 接続端子
17 接続配線
18 支持部材
20 流体チャンバ
21 給気管
30 導電部
31~34 導電層
35 空間部
40 絶縁層
41 配線層
42 導通部
43 絶縁膜
44 切り込み
45 基端部
46 樹脂
50、51 接続部
52 ワイヤ
53 樹脂
54 導電性ペースト
60 アクチュエータ
U 電極パッド
W ウェハ
Claims (12)
- 被検査体の電気的特性を検査するためのプローブカードであって、
回路基板と、
前記回路基板の下方に設けられ、検査時に被検査体に接触する複数の接触部材を支持する支持板と、
前記回路基板の下方且つ前記支持板の上方に設けられ、内部に気体を封入可能で可撓性を有し、且つ前記複数の接触部材が被検査体に接触する際に当該複数の接触部材に所定の接触圧力を付与する弾性部材と、
前記弾性部材の内部に配置され、検査時に前記回路基板と前記接触部材とを電気的に接続する導電部と、を有し、
前記導電部は、柔軟性を有する絶縁層と、当該絶縁層に形成された配線層とを備えた導電層を有する。 - 請求項1に記載のプローブカードにおいて、
前記弾性部材において、前記導電層の一の端部に対応する位置には、前記導電部と前記回路基板とを電気的に接続するための接続部が形成され、
前記弾性部材において、前記導電層の他の端部に対応する位置には、前記導電部と前記接触部材とを電気的に接続するための他の接続部が形成され、
前記接続部と前記他の接続部は、前記弾性部材の内部の気密性を保持している。 - 被検査体の電気的特性を検査するためのプローブカードにおいて、
回路基板と、
前記回路基板の下方に設けられ、検査時に被検査体に接触する複数の接触部材を支持する支持板と、
前記回路基板と前記支持板との間に設けられ、前記複数の接触部材が被検査体に接触する際に当該複数の接触部材に所定の接触圧力を付与する弾性部材と、
前記回路基板の下方且つ前記支持板の上方に設けられ、検査時に前記回路基板と前記接触部材とを電気的に接続する導電部と、を有し、
前記導電部は、上下方向に配置された複数の導電層を有し、
最上層の前記導電層において、一の端部は検査時に前記回路基板と電気的に接続され、他の端部は当該導電層の下側に配置された導電層の端部と固定され且つ電気的に接続され、
最下層の前記導電層において、一の端部は検査時に前記接触部材と電気的に接続され、他の端部は当該導電層の上側に配置された導電層の端部と固定され且つ電気的に接続され、
前記最上層の導電層と前記最下層の導電層の間に中間層の前記導電層が配置されている場合には、当該中間層の導電層の一の端部は当該導電層の上側に配置された導電層の端部と固定され且つ電気的に接続され、他の端部は当該導電層の下側に配置された導電層の端部と固定され且つ電気的に接続され、
前記導電層は、柔軟性を有する絶縁層と、当該絶縁層に形成された配線層とを有する。 - 請求項3に記載のプローブカードにおいて
前記導電部は、側面視において、検査時にジグザグ形状に伸長している。 - 請求項3に記載のプローブカードにおいて、
前記導電層は、平面視において四角形状を有し、
前記一の端部と前記他の端部は対向している。 - 請求項3に記載のプローブカードにおいて、
前記弾性部材は、内部に気体が封入され、可撓性を有する流体チャンバである。 - 請求項6に記載のプローブカードにおいて、
前記導電部は、前記弾性部材の内部に配置されている。 - 請求項7に記載のプローブカードにおいて、
前記弾性部材において、前記最上層の導電層の一の端部に対応する位置には、前記導電部と前記回路基板とを電気的に接続するための接続部が形成され、
前記弾性部材において、前記最下層の導電層の一の端部に対応する位置には、前記導電部と前記接触部材とを電気的に接続するための他の接続部が形成され、
前記接続部と前記他の接続部は、前記弾性部材の内部の気密性を保持している。 - 請求項3に記載のプローブカードにおいて、
前記弾性部材は、前記回路基板と前記支持板との間に複数設けられ、
前記導電部は、前記複数の弾性部材間に設けられている。 - 請求項1に記載のプローブカードにおいて、
一の前記絶縁層には、複数の前記配線層が水平方向に並べて形成されている。 - 請求項1に記載のプローブカードにおいて、
前記導電部を複数有し、当該複数の導電部において、同じ高さに位置する前記複数の絶縁層は、一の絶縁膜に水平方向に並べて形成されている。 - 請求項1に記載のプローブカードにおいて、
前記導電層は、前記絶縁層と前記配線層をそれぞれ複数有する。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/255,412 US20110316576A1 (en) | 2009-03-12 | 2010-02-15 | Probe Card |
KR1020117017567A KR101267145B1 (ko) | 2009-03-12 | 2010-02-15 | 프로브 카드 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-060274 | 2009-03-12 | ||
JP2009060274A JP5396112B2 (ja) | 2009-03-12 | 2009-03-12 | プローブカード |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010103892A1 true WO2010103892A1 (ja) | 2010-09-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/052180 WO2010103892A1 (ja) | 2009-03-12 | 2010-02-15 | プローブカード |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110316576A1 (ja) |
JP (1) | JP5396112B2 (ja) |
KR (1) | KR101267145B1 (ja) |
TW (1) | TWI421501B (ja) |
WO (1) | WO2010103892A1 (ja) |
Families Citing this family (19)
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JP2013130459A (ja) | 2011-12-21 | 2013-07-04 | Micronics Japan Co Ltd | 板状部材の位置決め方法及び電気的接続装置の製造方法 |
JP2013172137A (ja) * | 2012-02-23 | 2013-09-02 | Kyocer Slc Technologies Corp | 配線基板およびそれを用いたプローブカード |
WO2014002078A1 (en) * | 2012-06-29 | 2014-01-03 | Hydrovision Asia Pte Ltd | An improved suspended sediment meter |
JP6374642B2 (ja) | 2012-11-28 | 2018-08-15 | 株式会社日本マイクロニクス | プローブカード及び検査装置 |
JP6042761B2 (ja) * | 2013-03-28 | 2016-12-14 | 東京エレクトロン株式会社 | プローブ装置 |
KR102016427B1 (ko) * | 2013-09-10 | 2019-09-02 | 삼성전자주식회사 | 포고 핀 및 이를 포함하는 프로브 카드 |
US9805891B2 (en) | 2014-10-25 | 2017-10-31 | ComponentZee, LLC | Multiplexing, switching and testing devices and methods using fluid pressure |
US10003149B2 (en) | 2014-10-25 | 2018-06-19 | ComponentZee, LLC | Fluid pressure activated electrical contact devices and methods |
US9577358B2 (en) * | 2014-10-25 | 2017-02-21 | ComponentZee, LLC | Fluid pressure activated electrical contact devices and methods |
CN106405167B (zh) * | 2016-08-23 | 2018-11-02 | 南安市弈诚机械科技有限公司 | 一种用于测试集成电路的探针卡 |
US11079406B2 (en) * | 2016-08-31 | 2021-08-03 | International Business Machines Corporation | Semiconductor micro probe array having compliance |
KR101962644B1 (ko) | 2017-08-23 | 2019-03-28 | 리노공업주식회사 | 검사프로브 및 이를 사용한 검사장치 |
CN110716071B (zh) * | 2018-07-13 | 2021-09-24 | 中华精测科技股份有限公司 | 高频探针卡装置及其压接模块与支撑件 |
CN110716122B (zh) * | 2018-07-13 | 2021-09-28 | 中华精测科技股份有限公司 | 高频探针卡装置及其信号传输模块 |
TWI669511B (zh) * | 2018-09-19 | 2019-08-21 | 中華精測科技股份有限公司 | 探針卡測試裝置及測試裝置 |
CN110927416B (zh) * | 2018-09-19 | 2022-01-28 | 台湾中华精测科技股份有限公司 | 探针卡测试装置及测试装置 |
TWI831844B (zh) * | 2018-10-05 | 2024-02-11 | 美商色拉頓系統公司 | 高電壓探針卡系統 |
JP2021028603A (ja) * | 2019-08-09 | 2021-02-25 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
KR102614928B1 (ko) * | 2021-11-24 | 2023-12-19 | (주)티에스이 | 프로브 카드 |
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- 2010-02-15 US US13/255,412 patent/US20110316576A1/en not_active Abandoned
- 2010-02-15 KR KR1020117017567A patent/KR101267145B1/ko not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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KR20110112824A (ko) | 2011-10-13 |
JP5396112B2 (ja) | 2014-01-22 |
US20110316576A1 (en) | 2011-12-29 |
KR101267145B1 (ko) | 2013-05-24 |
TW201107758A (en) | 2011-03-01 |
JP2010210600A (ja) | 2010-09-24 |
TWI421501B (zh) | 2014-01-01 |
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