WO2009022574A1 - 接着剤及び接合体 - Google Patents

接着剤及び接合体 Download PDF

Info

Publication number
WO2009022574A1
WO2009022574A1 PCT/JP2008/064010 JP2008064010W WO2009022574A1 WO 2009022574 A1 WO2009022574 A1 WO 2009022574A1 JP 2008064010 W JP2008064010 W JP 2008064010W WO 2009022574 A1 WO2009022574 A1 WO 2009022574A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
vol
conductive
bonded body
conductive particles
Prior art date
Application number
PCT/JP2008/064010
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Akinori Yokoyama
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to CN200880025062.0A priority Critical patent/CN101755025B/zh
Priority to JP2009528082A priority patent/JP5337034B2/ja
Priority to KR1020107002026A priority patent/KR101139749B1/ko
Publication of WO2009022574A1 publication Critical patent/WO2009022574A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
PCT/JP2008/064010 2007-08-10 2008-08-05 接着剤及び接合体 WO2009022574A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880025062.0A CN101755025B (zh) 2007-08-10 2008-08-05 粘合剂和接合体
JP2009528082A JP5337034B2 (ja) 2007-08-10 2008-08-05 接着剤及び接合体
KR1020107002026A KR101139749B1 (ko) 2007-08-10 2008-08-05 접착제 및 접합체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-209320 2007-08-10
JP2007209320 2007-08-10
JP2007-209319 2007-08-10
JP2007209319 2007-08-10

Publications (1)

Publication Number Publication Date
WO2009022574A1 true WO2009022574A1 (ja) 2009-02-19

Family

ID=40350628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064010 WO2009022574A1 (ja) 2007-08-10 2008-08-05 接着剤及び接合体

Country Status (5)

Country Link
JP (1) JP5337034B2 (ko)
KR (1) KR101139749B1 (ko)
CN (1) CN101755025B (ko)
TW (1) TW200925231A (ko)
WO (1) WO2009022574A1 (ko)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011057793A (ja) * 2009-09-08 2011-03-24 Shin-Etsu Chemical Co Ltd 接着剤組成物およびそれを用いた半導体保護膜形成用シート
JP2012500878A (ja) * 2008-08-28 2012-01-12 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 温度安定性接着剤層の形成下での構成部材（Ｂａｕｔｅｉｌｅｎ）の接着法
JP2013194169A (ja) * 2012-03-21 2013-09-30 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
WO2016031551A1 (ja) * 2014-08-29 2016-03-03 古河電気工業株式会社 導電性接着フィルム
WO2016092742A1 (ja) * 2014-12-08 2016-06-16 信越化学工業株式会社 接着剤、該接着剤からなるダイボンド材、該接着剤を用いた導電接続方法、及び該方法によって得られた光半導体装置
JP2017052972A (ja) * 2016-12-01 2017-03-16 ダウ・コーニング・タイワン・インコーポレイテッドＤｏｗ Ｃｏｒｎｉｎｇ Ｔａｉｗａｎ Ｉｎｃ 感圧性接着剤シート及びこれらの製造方法
WO2019092933A1 (ja) * 2017-11-07 2019-05-16 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法
JPWO2021019932A1 (ko) * 2019-07-29 2021-02-04

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020189579A1 (ja) * 2019-03-18 2020-09-24 株式会社スリーボンド 接着剤組成物、硬化物および複合体
KR20230100416A (ko) * 2021-12-28 2023-07-05 주식회사 노피온 플렉서블 회로기판용 이방성 도전접착제

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323249A (ja) * 2000-05-17 2001-11-22 Hitachi Chem Co Ltd 回路接続用接着剤
JP2003147287A (ja) * 2001-11-14 2003-05-21 Hitachi Chem Co Ltd 回路接続用接着フィルム
JP2004018720A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤
JP2004196991A (ja) * 2002-12-19 2004-07-15 Shin Etsu Polymer Co Ltd 光学表示体用透明シリコーン粘着部材及び透明積層体
JP2005029710A (ja) * 2003-07-08 2005-02-03 Nippon Kayaku Co Ltd 接着剤組成物
JP2006028521A (ja) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd 回路接続用接着剤
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517729A (ja) * 1991-07-11 1993-01-26 Nitto Denko Corp 粘着テープ
JPH06220413A (ja) * 1993-01-21 1994-08-09 Murata Mfg Co Ltd 導電性接着剤およびそれを用いた赤外線検出器
TW392179B (en) * 1996-02-08 2000-06-01 Asahi Chemical Ind Anisotropic conductive composition
JP3417354B2 (ja) * 1999-08-19 2003-06-16 ソニーケミカル株式会社 接着材料及び回路接続方法
JP4822322B2 (ja) * 2003-12-04 2011-11-24 旭化成イーマテリアルズ株式会社 異方導電性接着シートの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323249A (ja) * 2000-05-17 2001-11-22 Hitachi Chem Co Ltd 回路接続用接着剤
JP2003147287A (ja) * 2001-11-14 2003-05-21 Hitachi Chem Co Ltd 回路接続用接着フィルム
JP2004018720A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤
JP2004196991A (ja) * 2002-12-19 2004-07-15 Shin Etsu Polymer Co Ltd 光学表示体用透明シリコーン粘着部材及び透明積層体
JP2005029710A (ja) * 2003-07-08 2005-02-03 Nippon Kayaku Co Ltd 接着剤組成物
JP2006028521A (ja) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd 回路接続用接着剤
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012500878A (ja) * 2008-08-28 2012-01-12 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 温度安定性接着剤層の形成下での構成部材（Ｂａｕｔｅｉｌｅｎ）の接着法
US8709201B2 (en) 2008-08-28 2014-04-29 Robert Bosch Gmbh Method for gluing components, forming a temperature-resistant adhesive layer
JP2011057793A (ja) * 2009-09-08 2011-03-24 Shin-Etsu Chemical Co Ltd 接着剤組成物およびそれを用いた半導体保護膜形成用シート
JP2013194169A (ja) * 2012-03-21 2013-09-30 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
JPWO2016031551A1 (ja) * 2014-08-29 2017-04-27 古河電気工業株式会社 導電性接着フィルム
WO2016031551A1 (ja) * 2014-08-29 2016-03-03 古河電気工業株式会社 導電性接着フィルム
WO2016092742A1 (ja) * 2014-12-08 2016-06-16 信越化学工業株式会社 接着剤、該接着剤からなるダイボンド材、該接着剤を用いた導電接続方法、及び該方法によって得られた光半導体装置
JP2017052972A (ja) * 2016-12-01 2017-03-16 ダウ・コーニング・タイワン・インコーポレイテッドＤｏｗ Ｃｏｒｎｉｎｇ Ｔａｉｗａｎ Ｉｎｃ 感圧性接着剤シート及びこれらの製造方法
WO2019092933A1 (ja) * 2017-11-07 2019-05-16 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法
JP2019085486A (ja) * 2017-11-07 2019-06-06 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法
US20190181113A1 (en) * 2017-11-07 2019-06-13 Furukawa Electric Co., Ltd. Film-like adhesive and method for producing semiconductor package using film-like adhesive
US11139261B2 (en) 2017-11-07 2021-10-05 Furukawa Electric Co., Ltd. Film-like adhesive and method for producing semiconductor package using film-like adhesive
JPWO2021019932A1 (ko) * 2019-07-29 2021-02-04
WO2021019932A1 (ja) * 2019-07-29 2021-02-04 株式会社村田製作所 水晶振動子、電子部品及び電子装置
JP7359210B2 (ja) 2019-07-29 2023-10-11 株式会社村田製作所 水晶振動子、電子部品及び電子装置

Also Published As

Publication number Publication date
JPWO2009022574A1 (ja) 2010-11-11
CN101755025A (zh) 2010-06-23
TW200925231A (en) 2009-06-16
JP5337034B2 (ja) 2013-11-06
TWI374924B (ko) 2012-10-21
KR20100037124A (ko) 2010-04-08
KR101139749B1 (ko) 2012-04-26
CN101755025B (zh) 2014-03-12

Similar Documents

Publication Publication Date Title
WO2009022574A1 (ja) 接着剤及び接合体
WO2008133253A1 (ja) 異方導電性フィルム及び接続構造体
TW200719359A (en) Anisotropic conductive adhesive
ATE524533T1 (de) Anisotrope leitfähige klebstoffe
WO2009005130A1 (ja) 接着剤組成物、接着剤組成物を用いた接着部材、半導体搭載用支持部材、半導体装置とそれらの製造方法
WO2009044732A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
WO2009001771A1 (ja) 接着フィルム、接続方法及び接合体
JP2010539293A5 (ko)
WO2008129590A1 (ja) 半導体用接着フィルム及びこれを用いた半導体装置
MY150038A (en) Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
WO2007097835A3 (en) Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
ATE496980T1 (de) Haftklebemittel mit aziridinylsilanen
TW200640978A (en) Latent hardener for epoxy resin and epoxy resin composition
WO2008051242A3 (en) Silicone resin film, method of preparing same, and nanomaterial-filled silicone compositon
MX2014009171A (es) Adhesivo sensible a la presion.
WO2008084843A1 (ja) 電子部品用接着剤
MY148111A (en) Curable silicone composition and electronic component
WO2009069783A1 (ja) 回路部材接続用接着剤及び半導体装置
CN105007704A (zh) 复合散热吸波膜
WO2009014115A1 (ja) 電子部品用接着剤、半導体チップの積層方法及び半導体装置
ATE440125T1 (de) Oberflächenmodifiziertes corund sowie harzzusammensetzung
EP2537905A3 (en) Conductive thermosetting adhesive tape
WO2010076990A3 (ko) 이방 전도성 필름 조성물 및 이를 이용한 이방 전도성 필름
CN103468199B (zh) 一种经环氧树脂改性的硅橡胶组合物及其用途
CN205616836U (zh) 一种石墨烯散热胶带

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880025062.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08827363

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009528082

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20107002026

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08827363

Country of ref document: EP

Kind code of ref document: A1