WO2009022574A1 - Adhésif et corps lié - Google Patents

Adhésif et corps lié Download PDF

Info

Publication number
WO2009022574A1
WO2009022574A1 PCT/JP2008/064010 JP2008064010W WO2009022574A1 WO 2009022574 A1 WO2009022574 A1 WO 2009022574A1 JP 2008064010 W JP2008064010 W JP 2008064010W WO 2009022574 A1 WO2009022574 A1 WO 2009022574A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
vol
conductive
bonded body
conductive particles
Prior art date
Application number
PCT/JP2008/064010
Other languages
English (en)
Japanese (ja)
Inventor
Akinori Yokoyama
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to CN200880025062.0A priority Critical patent/CN101755025B/zh
Priority to JP2009528082A priority patent/JP5337034B2/ja
Priority to KR1020107002026A priority patent/KR101139749B1/ko
Publication of WO2009022574A1 publication Critical patent/WO2009022574A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Abstract

L'invention vise à proposer un adhésif ayant un excellent caractère adhésif après un essai initial et des essais de fiabilité même après avoir été chauffé et durci à basse température. A cet effet, l'invention propose un adhésif contenant un composé de silicone qui présente une caractéristique adhésive, une résine époxy, une résine phénoxy et un agent de durcissement. L'adhésif peut être un adhésif conducteur de façon anisotrope par le fait qu'il contient des particules conductrices en un volume d'au moins 0,1 % en volume mais inférieur à 30 % en volume, et l'adhésif peut être un adhésif conducteur par le fait qu'il contient des particules conductrices en un volume d'au moins 30 % en volume mais inférieur à 80 % en volume. Le diamètre moyen de particule des particules conductrices est de préférence de 1 à 20 µm.
PCT/JP2008/064010 2007-08-10 2008-08-05 Adhésif et corps lié WO2009022574A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880025062.0A CN101755025B (zh) 2007-08-10 2008-08-05 粘合剂和接合体
JP2009528082A JP5337034B2 (ja) 2007-08-10 2008-08-05 接着剤及び接合体
KR1020107002026A KR101139749B1 (ko) 2007-08-10 2008-08-05 접착제 및 접합체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007209320 2007-08-10
JP2007209319 2007-08-10
JP2007-209320 2007-08-10
JP2007-209319 2007-08-10

Publications (1)

Publication Number Publication Date
WO2009022574A1 true WO2009022574A1 (fr) 2009-02-19

Family

ID=40350628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064010 WO2009022574A1 (fr) 2007-08-10 2008-08-05 Adhésif et corps lié

Country Status (5)

Country Link
JP (1) JP5337034B2 (fr)
KR (1) KR101139749B1 (fr)
CN (1) CN101755025B (fr)
TW (1) TW200925231A (fr)
WO (1) WO2009022574A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011057793A (ja) * 2009-09-08 2011-03-24 Shin-Etsu Chemical Co Ltd 接着剤組成物およびそれを用いた半導体保護膜形成用シート
JP2012500878A (ja) * 2008-08-28 2012-01-12 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 温度安定性接着剤層の形成下での構成部材（Ｂａｕｔｅｉｌｅｎ）の接着法
JP2013194169A (ja) * 2012-03-21 2013-09-30 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
WO2016031551A1 (fr) * 2014-08-29 2016-03-03 古河電気工業株式会社 Film adhésif conducteur
WO2016092742A1 (fr) * 2014-12-08 2016-06-16 信越化学工業株式会社 Adhésif, matériau de fixation de puce comprenant un adhésif, procédé de connexion conductrice faisant appel à un adhésif, et dispositif optique à semi-conducteurs obtenu à l'aide dudit procédé
JP2017052972A (ja) * 2016-12-01 2017-03-16 ダウ・コーニング・タイワン・インコーポレイテッドＤｏｗ Ｃｏｒｎｉｎｇ Ｔａｉｗａｎ Ｉｎｃ 感圧性接着剤シート及びこれらの製造方法
WO2019092933A1 (fr) * 2017-11-07 2019-05-16 古河電気工業株式会社 Adhésif pelliculaire et procédé de production d'un boîtier de semi-conducteur en utilisant un adhésif pelliculaire
JPWO2021019932A1 (fr) * 2019-07-29 2021-02-04

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220177748A1 (en) * 2019-03-18 2022-06-09 Threebond Co., Ltd. Adhesive composition, cured product, and composite
KR20230100416A (ko) * 2021-12-28 2023-07-05 주식회사 노피온 플렉서블 회로기판용 이방성 도전접착제

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323249A (ja) * 2000-05-17 2001-11-22 Hitachi Chem Co Ltd 回路接続用接着剤
JP2003147287A (ja) * 2001-11-14 2003-05-21 Hitachi Chem Co Ltd 回路接続用接着フィルム
JP2004018720A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤
JP2004196991A (ja) * 2002-12-19 2004-07-15 Shin Etsu Polymer Co Ltd 光学表示体用透明シリコーン粘着部材及び透明積層体
JP2005029710A (ja) * 2003-07-08 2005-02-03 Nippon Kayaku Co Ltd 接着剤組成物
JP2006028521A (ja) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd 回路接続用接着剤
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517729A (ja) * 1991-07-11 1993-01-26 Nitto Denko Corp 粘着テープ
JPH06220413A (ja) * 1993-01-21 1994-08-09 Murata Mfg Co Ltd 導電性接着剤およびそれを用いた赤外線検出器
TW392179B (en) * 1996-02-08 2000-06-01 Asahi Chemical Ind Anisotropic conductive composition
JP3417354B2 (ja) * 1999-08-19 2003-06-16 ソニーケミカル株式会社 接着材料及び回路接続方法
US20070175579A1 (en) * 2003-12-04 2007-08-02 Asahi Kasei Emd Corporation Anisotropic conductive adhesive sheet and connecting structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323249A (ja) * 2000-05-17 2001-11-22 Hitachi Chem Co Ltd 回路接続用接着剤
JP2003147287A (ja) * 2001-11-14 2003-05-21 Hitachi Chem Co Ltd 回路接続用接着フィルム
JP2004018720A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤
JP2004196991A (ja) * 2002-12-19 2004-07-15 Shin Etsu Polymer Co Ltd 光学表示体用透明シリコーン粘着部材及び透明積層体
JP2005029710A (ja) * 2003-07-08 2005-02-03 Nippon Kayaku Co Ltd 接着剤組成物
JP2006028521A (ja) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd 回路接続用接着剤
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012500878A (ja) * 2008-08-28 2012-01-12 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 温度安定性接着剤層の形成下での構成部材（Ｂａｕｔｅｉｌｅｎ）の接着法
US8709201B2 (en) 2008-08-28 2014-04-29 Robert Bosch Gmbh Method for gluing components, forming a temperature-resistant adhesive layer
JP2011057793A (ja) * 2009-09-08 2011-03-24 Shin-Etsu Chemical Co Ltd 接着剤組成物およびそれを用いた半導体保護膜形成用シート
JP2013194169A (ja) * 2012-03-21 2013-09-30 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
JPWO2016031551A1 (ja) * 2014-08-29 2017-04-27 古河電気工業株式会社 導電性接着フィルム
WO2016031551A1 (fr) * 2014-08-29 2016-03-03 古河電気工業株式会社 Film adhésif conducteur
WO2016092742A1 (fr) * 2014-12-08 2016-06-16 信越化学工業株式会社 Adhésif, matériau de fixation de puce comprenant un adhésif, procédé de connexion conductrice faisant appel à un adhésif, et dispositif optique à semi-conducteurs obtenu à l'aide dudit procédé
JP2017052972A (ja) * 2016-12-01 2017-03-16 ダウ・コーニング・タイワン・インコーポレイテッドＤｏｗ Ｃｏｒｎｉｎｇ Ｔａｉｗａｎ Ｉｎｃ 感圧性接着剤シート及びこれらの製造方法
WO2019092933A1 (fr) * 2017-11-07 2019-05-16 古河電気工業株式会社 Adhésif pelliculaire et procédé de production d'un boîtier de semi-conducteur en utilisant un adhésif pelliculaire
JP2019085486A (ja) * 2017-11-07 2019-06-06 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法
US20190181113A1 (en) * 2017-11-07 2019-06-13 Furukawa Electric Co., Ltd. Film-like adhesive and method for producing semiconductor package using film-like adhesive
US11139261B2 (en) 2017-11-07 2021-10-05 Furukawa Electric Co., Ltd. Film-like adhesive and method for producing semiconductor package using film-like adhesive
JPWO2021019932A1 (fr) * 2019-07-29 2021-02-04
WO2021019932A1 (fr) * 2019-07-29 2021-02-04 株式会社村田製作所 Vibreur à cristal, composant électronique, et dispositif électronique
JP7359210B2 (ja) 2019-07-29 2023-10-11 株式会社村田製作所 水晶振動子、電子部品及び電子装置

Also Published As

Publication number Publication date
JPWO2009022574A1 (ja) 2010-11-11
TW200925231A (en) 2009-06-16
KR20100037124A (ko) 2010-04-08
KR101139749B1 (ko) 2012-04-26
CN101755025A (zh) 2010-06-23
CN101755025B (zh) 2014-03-12
TWI374924B (fr) 2012-10-21
JP5337034B2 (ja) 2013-11-06

Similar Documents

Publication Publication Date Title
WO2009022574A1 (fr) Adhésif et corps lié
WO2008133253A1 (fr) Film conducteur anisotrope et structure de connexion
TW200719359A (en) Anisotropic conductive adhesive
ATE524533T1 (de) Anisotrope leitfähige klebstoffe
WO2009044732A1 (fr) Composition adhésive, matière de connexion de circuit l'utilisant, procédé de connexion d'éléments de circuit et structure de connexion de circuit
PH12014502374A1 (en) Composition for film adhesives, method for producing same, film adhesive, semiconductor package using film adhesive and method for manufacturing semiconductor package using film adhesive
WO2009001771A1 (fr) Film adhésif, procédé de connexion et assemblage
JP2010539293A5 (fr)
MY150038A (en) Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
WO2014145482A3 (fr) Adhésif de liaison et systèmes de couverture collés préparés à l'aide de celui-ci
WO2007097835A3 (fr) Film de resine de silicone, son procede de preparation et composition de silicone remplie de nanomateriaux
WO2009020005A1 (fr) Composition adhésive, adhésif de type film et structure de connexion pour un élément de circuit
ATE496980T1 (de) Haftklebemittel mit aziridinylsilanen
TW200640978A (en) Latent hardener for epoxy resin and epoxy resin composition
WO2008051242A3 (fr) Film de résine de silicone, son procédé de préparation, et composition de silicone chargée d'un nanomatériau
MX2014009171A (es) Adhesivo sensible a la presion.
WO2008084843A1 (fr) Adhésif pour composants électroniques
EP2559717A4 (fr) Composition de résine durcissable, pâte de résine époxy adhésive, agent de fixation des puces, pâte non conductrice, film de résine époxy adhésif, film de résine époxy non-conducteur, pâte conductrice anisotrope et film conducteur anisotrope
WO2009069783A1 (fr) Adhésif connectant des éléments de circuit et dispositif semi-conducteur
CN105007704A (zh) 复合散热吸波膜
WO2009014115A1 (fr) Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur
WO2008143253A1 (fr) Composition adhésive et film adhésif utilisant celle-ci
WO2008136351A1 (fr) Composition de résine thermodurcissable et élément optique utilisant un produit durci de la composition de résine thermodurcissable
EP2537905A3 (fr) Bande adhésive thermodurcissable conductive
WO2010076990A3 (fr) Compositions pour un film conducteur anisotrope, et film conducteur anisotrope les utilisant

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880025062.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08827363

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009528082

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20107002026

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08827363

Country of ref document: EP

Kind code of ref document: A1