WO2009014115A1 - Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur - Google Patents

Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur Download PDF

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Publication number
WO2009014115A1
WO2009014115A1 PCT/JP2008/063124 JP2008063124W WO2009014115A1 WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1 JP 2008063124 W JP2008063124 W JP 2008063124W WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
adhesive
support member
semiconductor device
stacking method
Prior art date
Application number
PCT/JP2008/063124
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English (en)
Japanese (ja)
Inventor
Hideaki Ishizawa
Akinobu Hayakawa
Kohei Takeda
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Priority to CN2008800252999A priority Critical patent/CN101755329B/zh
Priority to KR1020097026044A priority patent/KR101155361B1/ko
Priority to JP2008534802A priority patent/JP4339927B2/ja
Publication of WO2009014115A1 publication Critical patent/WO2009014115A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract

L'invention porte sur un adhésif pour composant électronique qui permet de connecter, parallèlement les uns aux autres, un composant électronique à un autre composant électronique ou à un élément de support tout en fournissant une distance d'espace précise. L'invention porte également sur un procédé d'empilement de puces semi-conductrices utilisant l'adhésif pour composant électronique et sur un dispositif semi-conducteur. L'adhésif pour composant électronique est utilisé pour empiler, parallèlement les uns aux autres, un composant électronique et un autre composant électronique ou un élément de support tout en fournissant une distance d'espace égale ou inférieure à 30 µm. L'adhésif pour composant électronique contient un composé durcissable, un agent de cuisson et des particules d'espaceur. Sa viscosité est égale ou inférieure à 50 Pa s telle que mesurée avec un viscomètre de type E à 10 tpm et à une température à laquelle le composant électronique est lié à l'autre composant électronique ou à l'élément de support. La valeur CV des particules d'espaceur est égale ou inférieure à 10 %. Le diamètre de particule moyen est 40 à 70 % de la distance d'espace entre le composant électronique et l'autre composant électronique ou l'élément de support.
PCT/JP2008/063124 2007-07-25 2008-07-22 Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur WO2009014115A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800252999A CN101755329B (zh) 2007-07-25 2008-07-22 电子部件用胶粘剂、半导体芯片的层叠方法及半导体装置
KR1020097026044A KR101155361B1 (ko) 2007-07-25 2008-07-22 전자 부품용 접착제, 반도체 칩의 적층 방법 및 반도체 장치
JP2008534802A JP4339927B2 (ja) 2007-07-25 2008-07-22 半導体チップの積層方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007193758 2007-07-25
JP2007-193758 2007-07-25
JP2008053249 2008-03-04
JP2008-053249 2008-03-04

Publications (1)

Publication Number Publication Date
WO2009014115A1 true WO2009014115A1 (fr) 2009-01-29

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Application Number Title Priority Date Filing Date
PCT/JP2008/063124 WO2009014115A1 (fr) 2007-07-25 2008-07-22 Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur

Country Status (5)

Country Link
JP (1) JP4339927B2 (fr)
KR (1) KR101155361B1 (fr)
CN (1) CN101755329B (fr)
TW (1) TWI411049B (fr)
WO (1) WO2009014115A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219162A (ja) * 2009-03-13 2010-09-30 Sekisui Chem Co Ltd 半導体チップ接合用接着剤
JP2011168631A (ja) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd 金属被覆粒子の製造方法
JP2011233599A (ja) * 2010-04-23 2011-11-17 Toshiba Corp 半導体装置の製造方法
JP2012142438A (ja) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd 半導体装置実装用ペ−スト
WO2017170492A1 (fr) * 2016-03-30 2017-10-05 積水化学工業株式会社 Adhésif d'inducteur et inducteur

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676954B2 (ja) * 2010-07-27 2015-02-25 京セラ株式会社 サーマルヘッドおよびこれを備えるサーマルプリンタ
WO2012121336A1 (fr) 2011-03-09 2012-09-13 積水化学工業株式会社 Adhésif pour composants électroniques, et procédé de fabrication pour montage de puce semi-conductrice
US8937380B1 (en) * 2013-08-30 2015-01-20 Infineon Technologies Austria Ag Die edge protection for pressure sensor packages
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KR101155361B1 (ko) 2012-06-19
TWI411049B (zh) 2013-10-01
TW200908166A (en) 2009-02-16

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