WO2009014115A1 - Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur - Google Patents
Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur Download PDFInfo
- Publication number
- WO2009014115A1 WO2009014115A1 PCT/JP2008/063124 JP2008063124W WO2009014115A1 WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1 JP 2008063124 W JP2008063124 W JP 2008063124W WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- adhesive
- support member
- semiconductor device
- stacking method
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 5
- 230000001070 adhesive effect Effects 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000002245 particle Substances 0.000 abstract 3
- 125000006850 spacer group Chemical group 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008534802A JP4339927B2 (ja) | 2007-07-25 | 2008-07-22 | 半導体チップの積層方法 |
KR1020097026044A KR101155361B1 (ko) | 2007-07-25 | 2008-07-22 | 전자 부품용 접착제, 반도체 칩의 적층 방법 및 반도체 장치 |
CN2008800252999A CN101755329B (zh) | 2007-07-25 | 2008-07-22 | 电子部件用胶粘剂、半导体芯片的层叠方法及半导体装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007193758 | 2007-07-25 | ||
JP2007-193758 | 2007-07-25 | ||
JP2008-053249 | 2008-03-04 | ||
JP2008053249 | 2008-03-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009014115A1 true WO2009014115A1 (fr) | 2009-01-29 |
Family
ID=40281366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/063124 WO2009014115A1 (fr) | 2007-07-25 | 2008-07-22 | Adhésif pour composant électronique, procédé d'empilement de puces semi-conductrices et dispositif semi-conducteur |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4339927B2 (fr) |
KR (1) | KR101155361B1 (fr) |
CN (1) | CN101755329B (fr) |
TW (1) | TWI411049B (fr) |
WO (1) | WO2009014115A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010219162A (ja) * | 2009-03-13 | 2010-09-30 | Sekisui Chem Co Ltd | 半導体チップ接合用接着剤 |
JP2011168631A (ja) * | 2010-02-16 | 2011-09-01 | Nippon Shokubai Co Ltd | 金属被覆粒子の製造方法 |
JP2011233599A (ja) * | 2010-04-23 | 2011-11-17 | Toshiba Corp | 半導体装置の製造方法 |
JP2012142438A (ja) * | 2010-12-28 | 2012-07-26 | Jgc Catalysts & Chemicals Ltd | 半導体装置実装用ペ−スト |
WO2017170492A1 (fr) * | 2016-03-30 | 2017-10-05 | 積水化学工業株式会社 | Adhésif d'inducteur et inducteur |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5676954B2 (ja) * | 2010-07-27 | 2015-02-25 | 京セラ株式会社 | サーマルヘッドおよびこれを備えるサーマルプリンタ |
WO2012121336A1 (fr) | 2011-03-09 | 2012-09-13 | 積水化学工業株式会社 | Adhésif pour composants électroniques, et procédé de fabrication pour montage de puce semi-conductrice |
US8937380B1 (en) * | 2013-08-30 | 2015-01-20 | Infineon Technologies Austria Ag | Die edge protection for pressure sensor packages |
KR101651649B1 (ko) * | 2016-01-22 | 2016-08-29 | 주식회사 일렉켐스 | 전기 또는 전자 부품 접속용 도전성 접착 조성물 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005216973A (ja) * | 2004-01-27 | 2005-08-11 | Sekisui Chem Co Ltd | 半導体装置 |
JP2005244188A (ja) * | 2004-01-27 | 2005-09-08 | Sekisui Chem Co Ltd | 半導体チップ接合用ペースト状接着剤及び半導体装置 |
JP2007169448A (ja) * | 2005-12-21 | 2007-07-05 | Sekisui Chem Co Ltd | 熱硬化性樹脂組成物及び半導体装置 |
WO2008010555A1 (fr) * | 2006-07-20 | 2008-01-24 | Sekisui Chemical Co., Ltd. | Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur |
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2008
- 2008-07-22 KR KR1020097026044A patent/KR101155361B1/ko active IP Right Grant
- 2008-07-22 CN CN2008800252999A patent/CN101755329B/zh not_active Expired - Fee Related
- 2008-07-22 WO PCT/JP2008/063124 patent/WO2009014115A1/fr active Application Filing
- 2008-07-22 JP JP2008534802A patent/JP4339927B2/ja not_active Expired - Fee Related
- 2008-07-24 TW TW097128044A patent/TWI411049B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005216973A (ja) * | 2004-01-27 | 2005-08-11 | Sekisui Chem Co Ltd | 半導体装置 |
JP2005244188A (ja) * | 2004-01-27 | 2005-09-08 | Sekisui Chem Co Ltd | 半導体チップ接合用ペースト状接着剤及び半導体装置 |
JP2007169448A (ja) * | 2005-12-21 | 2007-07-05 | Sekisui Chem Co Ltd | 熱硬化性樹脂組成物及び半導体装置 |
WO2008010555A1 (fr) * | 2006-07-20 | 2008-01-24 | Sekisui Chemical Co., Ltd. | Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010219162A (ja) * | 2009-03-13 | 2010-09-30 | Sekisui Chem Co Ltd | 半導体チップ接合用接着剤 |
JP2011168631A (ja) * | 2010-02-16 | 2011-09-01 | Nippon Shokubai Co Ltd | 金属被覆粒子の製造方法 |
JP2011233599A (ja) * | 2010-04-23 | 2011-11-17 | Toshiba Corp | 半導体装置の製造方法 |
JP2012142438A (ja) * | 2010-12-28 | 2012-07-26 | Jgc Catalysts & Chemicals Ltd | 半導体装置実装用ペ−スト |
WO2017170492A1 (fr) * | 2016-03-30 | 2017-10-05 | 積水化学工業株式会社 | Adhésif d'inducteur et inducteur |
JP6232167B1 (ja) * | 2016-03-30 | 2017-11-15 | 積水化学工業株式会社 | インダクタ用接着剤及びインダクタ |
Also Published As
Publication number | Publication date |
---|---|
KR101155361B1 (ko) | 2012-06-19 |
KR20100018562A (ko) | 2010-02-17 |
JPWO2009014115A1 (ja) | 2010-10-07 |
JP4339927B2 (ja) | 2009-10-07 |
CN101755329B (zh) | 2011-09-21 |
CN101755329A (zh) | 2010-06-23 |
TWI411049B (zh) | 2013-10-01 |
TW200908166A (en) | 2009-02-16 |
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