IN2014CN03520A - - Google Patents
Info
- Publication number
- IN2014CN03520A IN2014CN03520A IN3520CHN2014A IN2014CN03520A IN 2014CN03520 A IN2014CN03520 A IN 2014CN03520A IN 3520CHN2014 A IN3520CHN2014 A IN 3520CHN2014A IN 2014CN03520 A IN2014CN03520 A IN 2014CN03520A
- Authority
- IN
- India
- Prior art keywords
- adhesive film
- encapsulating
- grooves
- sealing
- present application
- Prior art date
Links
- 239000002313 adhesive film Substances 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 238000007599 discharging Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/206—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer comprising non-adhesive protrusions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/2457—Parallel ribs and/or grooves
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20110118477 | 2011-11-14 | ||
KR1020120128959A KR101584845B1 (ko) | 2011-11-14 | 2012-11-14 | 접착 필름 |
PCT/KR2012/009621 WO2013073848A1 (fr) | 2011-11-14 | 2012-11-14 | Film adhésif |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014CN03520A true IN2014CN03520A (fr) | 2015-10-09 |
Family
ID=48663212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN3520CHN2014 IN2014CN03520A (fr) | 2011-11-14 | 2012-11-14 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9422460B2 (fr) |
EP (1) | EP2781569B1 (fr) |
JP (1) | JP5916258B2 (fr) |
KR (1) | KR101584845B1 (fr) |
CN (1) | CN103930503B (fr) |
IN (1) | IN2014CN03520A (fr) |
TW (1) | TWI557961B (fr) |
WO (1) | WO2013073848A1 (fr) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104685607B (zh) * | 2012-09-19 | 2017-09-15 | 应用材料公司 | 接合基板的方法 |
TWI543356B (zh) * | 2012-10-31 | 2016-07-21 | 財團法人工業技術研究院 | 環境敏感電子元件封裝體 |
KR102135453B1 (ko) * | 2013-05-24 | 2020-07-20 | 삼성디스플레이 주식회사 | 접착필름 및 이를 이용해 제조된 유기전계발광 표시장치 |
CN103887446A (zh) * | 2014-03-10 | 2014-06-25 | 京东方科技集团股份有限公司 | 一种oled器件的封装结构及其封装方法、发光器件 |
JP6350016B2 (ja) * | 2014-06-24 | 2018-07-04 | セイコーエプソン株式会社 | 表示装置および表示装置の製造方法 |
EP3212727A1 (fr) * | 2014-10-29 | 2017-09-06 | tesa SE | Matières adhésives à matériaux getter activables |
CN105892736A (zh) * | 2015-01-26 | 2016-08-24 | 宸鸿科技(厦门)有限公司 | 光学胶、面板以及基板贴合方法 |
EP3313948B1 (fr) * | 2015-06-25 | 2021-10-27 | Bosch Car Multimedia Portugal, S.A. | Procédé pour lier deux couches à l'aide d'un adhésif liquide et assemblage ainsi lié |
JP6940930B2 (ja) * | 2016-05-10 | 2021-09-29 | 日東電工株式会社 | 有機el表示装置用光学フィルム、有機el表示装置用偏光フィルム、有機el表示装置用粘着剤層付き偏光フィルム、及び有機el表示装置 |
KR102620139B1 (ko) * | 2016-09-28 | 2023-12-29 | 엘지디스플레이 주식회사 | 표시장치 |
TWI593778B (zh) * | 2016-11-23 | 2017-08-01 | 武漢市三選科技有限公司 | Oled封裝用膠片及其製造方法及使用其之封裝oled方法 |
KR102679539B1 (ko) | 2016-12-06 | 2024-06-28 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6869101B2 (ja) * | 2017-05-12 | 2021-05-12 | 株式会社ダイセル | 接着剤層形成装置、半導体チップ製造ライン、及び積層体の製造方法 |
KR102296725B1 (ko) * | 2017-07-14 | 2021-08-31 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
CN107742472B (zh) * | 2017-09-25 | 2021-03-26 | 昆山国显光电有限公司 | 封装掩膜板、封装方法及显示面板 |
JP2019082148A (ja) * | 2017-10-31 | 2019-05-30 | 大豊工業株式会社 | 斜板 |
TWI679123B (zh) | 2018-05-29 | 2019-12-11 | 奇鋐科技股份有限公司 | 散熱貼合結構 |
CN108531094B (zh) * | 2018-05-30 | 2021-02-05 | 奇鋐科技股份有限公司 | 贴合结构 |
CN109705757B (zh) * | 2018-10-24 | 2021-05-25 | 佛山市佳世达薄膜科技有限公司 | 一种耐腐蚀保护膜 |
CN109628000A (zh) * | 2018-12-17 | 2019-04-16 | 武汉华星光电半导体显示技术有限公司 | 一种各向异性导电胶 |
JP7423184B2 (ja) * | 2018-12-19 | 2024-01-29 | エルジー ディスプレイ カンパニー リミテッド | 表示装置および表示装置の製造方法 |
CN110136573B (zh) * | 2019-05-06 | 2021-09-17 | Oppo广东移动通信有限公司 | 显示屏及其制备方法、电子设备 |
US11226521B2 (en) * | 2019-08-28 | 2022-01-18 | Elite Optoelectronic Co., Ltd. | Liquid crystal dimming film |
CN111944470B (zh) * | 2020-08-20 | 2021-03-19 | 中电保力(北京)科技有限公司 | 一种双组分吸水膨胀胶泥及其应用 |
KR20220090162A (ko) * | 2020-12-22 | 2022-06-29 | 엘지디스플레이 주식회사 | 진동 장치 및 이를 포함하는 장치 |
CN113968377B (zh) * | 2021-12-07 | 2023-06-27 | Tcl华星光电技术有限公司 | 一种贴膜装置及贴膜方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW203624B (fr) | 1991-02-28 | 1993-04-11 | Sumitomo Bakelite Co | |
JP2609779B2 (ja) * | 1991-02-28 | 1997-05-14 | 住友ベークライト株式会社 | チップ型電子部品包装用カバーテープ |
US6139283A (en) | 1998-11-10 | 2000-10-31 | Visteon Global Technologies, Inc. | Variable capacity swash plate type compressor |
JP2001252505A (ja) | 2000-03-14 | 2001-09-18 | Sumitomo Heavy Ind Ltd | 脱水装置におけるマットフォーメーションプレートとドラム型フィルターとの間隔調整機構 |
US6226890B1 (en) | 2000-04-07 | 2001-05-08 | Eastman Kodak Company | Desiccation of moisture-sensitive electronic devices |
US6808828B2 (en) | 2001-08-23 | 2004-10-26 | Tohoku Pioneer Corporation | Organic electroluminescent display panel |
JP3928944B2 (ja) * | 2001-08-23 | 2007-06-13 | 東北パイオニア株式会社 | 有機el表示パネル |
US6936131B2 (en) * | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
JP2004231938A (ja) | 2002-09-13 | 2004-08-19 | Sekisui Chem Co Ltd | 有機el素子封止用光硬化性接着剤組成物、有機el素子の封止方法および有機el素子 |
JP4605499B2 (ja) * | 2004-10-28 | 2011-01-05 | 富士電機ホールディングス株式会社 | 有機elディスプレイの封止構造 |
KR100709746B1 (ko) * | 2005-01-28 | 2007-04-19 | 주식회사 엘지화학 | 다단계 공기 배출 통로가 구비된 점착 시트 |
JP2007520623A (ja) * | 2005-01-28 | 2007-07-26 | エルジー・ケム・リミテッド | 多段階空気排出通路を備えた粘着シート |
US7687119B2 (en) * | 2005-04-04 | 2010-03-30 | Henkel Ag & Co. Kgaa | Radiation-curable desiccant-filled adhesive/sealant |
ATE413443T1 (de) * | 2005-04-04 | 2008-11-15 | Nat Starch Chem Invest | Strahlenhärtbares, mit trockenmittel gefülltes klebe-/dichtmittel |
JP2007005060A (ja) * | 2005-06-22 | 2007-01-11 | Fuji Electric Holdings Co Ltd | 有機elディスプレイの製造方法 |
DE102007010171A1 (de) * | 2007-02-28 | 2008-09-04 | Tesa Ag | Hitze-aktiviert verklebendes Flächenelement |
JP5112780B2 (ja) * | 2007-08-03 | 2013-01-09 | リンテック株式会社 | 易貼付性粘着シート及びその製造方法 |
US8846169B2 (en) | 2007-12-28 | 2014-09-30 | 3M Innovative Properties Company | Flexible encapsulating film systems |
JP5228513B2 (ja) * | 2008-02-08 | 2013-07-03 | セイコーエプソン株式会社 | 有機el装置 |
DE102008031356A1 (de) * | 2008-07-04 | 2010-01-07 | Tesa Se | Doppelseitige Schaumstoffklebebänder zur Verklebung von elektronischen Bauteilen |
KR101033045B1 (ko) * | 2009-12-30 | 2011-05-09 | 제일모직주식회사 | 반도체 조립용 접착필름 조성물 및 이를 이용한 접착필름 |
-
2012
- 2012-11-14 TW TW101142461A patent/TWI557961B/zh active
- 2012-11-14 KR KR1020120128959A patent/KR101584845B1/ko active IP Right Grant
- 2012-11-14 JP JP2014540968A patent/JP5916258B2/ja active Active
- 2012-11-14 IN IN3520CHN2014 patent/IN2014CN03520A/en unknown
- 2012-11-14 WO PCT/KR2012/009621 patent/WO2013073848A1/fr active Application Filing
- 2012-11-14 EP EP12850397.6A patent/EP2781569B1/fr active Active
- 2012-11-14 CN CN201280055940.XA patent/CN103930503B/zh active Active
-
2014
- 2014-05-02 US US14/268,883 patent/US9422460B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN103930503A (zh) | 2014-07-16 |
EP2781569A1 (fr) | 2014-09-24 |
EP2781569A4 (fr) | 2015-07-01 |
WO2013073848A1 (fr) | 2013-05-23 |
US9422460B2 (en) | 2016-08-23 |
JP5916258B2 (ja) | 2016-05-11 |
US20150284595A1 (en) | 2015-10-08 |
KR101584845B1 (ko) | 2016-01-14 |
CN103930503B (zh) | 2017-12-12 |
JP2015506050A (ja) | 2015-02-26 |
TW201336131A (zh) | 2013-09-01 |
KR20130054191A (ko) | 2013-05-24 |
TWI557961B (zh) | 2016-11-11 |
EP2781569B1 (fr) | 2018-06-20 |
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