JP5337034B2 - 接着剤及び接合体 - Google Patents

接着剤及び接合体 Download PDF

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Publication number
JP5337034B2
JP5337034B2 JP2009528082A JP2009528082A JP5337034B2 JP 5337034 B2 JP5337034 B2 JP 5337034B2 JP 2009528082 A JP2009528082 A JP 2009528082A JP 2009528082 A JP2009528082 A JP 2009528082A JP 5337034 B2 JP5337034 B2 JP 5337034B2
Authority
JP
Japan
Prior art keywords
adhesive
conductive
adhesive according
electrode
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009528082A
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English (en)
Japanese (ja)
Other versions
JPWO2009022574A1 (ja
Inventor
明典 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei E Materials Corp
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Priority to JP2009528082A priority Critical patent/JP5337034B2/ja
Publication of JPWO2009022574A1 publication Critical patent/JPWO2009022574A1/ja
Application granted granted Critical
Publication of JP5337034B2 publication Critical patent/JP5337034B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
JP2009528082A 2007-08-10 2008-08-05 接着剤及び接合体 Expired - Fee Related JP5337034B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009528082A JP5337034B2 (ja) 2007-08-10 2008-08-05 接着剤及び接合体

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007209320 2007-08-10
JP2007209319 2007-08-10
JP2007209320 2007-08-10
JP2007209319 2007-08-10
PCT/JP2008/064010 WO2009022574A1 (ja) 2007-08-10 2008-08-05 接着剤及び接合体
JP2009528082A JP5337034B2 (ja) 2007-08-10 2008-08-05 接着剤及び接合体

Publications (2)

Publication Number Publication Date
JPWO2009022574A1 JPWO2009022574A1 (ja) 2010-11-11
JP5337034B2 true JP5337034B2 (ja) 2013-11-06

Family

ID=40350628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009528082A Expired - Fee Related JP5337034B2 (ja) 2007-08-10 2008-08-05 接着剤及び接合体

Country Status (5)

Country Link
JP (1) JP5337034B2 (ko)
KR (1) KR101139749B1 (ko)
CN (1) CN101755025B (ko)
TW (1) TW200925231A (ko)
WO (1) WO2009022574A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008041657A1 (de) * 2008-08-28 2010-03-04 Robert Bosch Gmbh Verfahren zum Verkleben von Bauteilen unter Ausbildung einer temperaturbeständigen Klebstoffschicht
JP2011057793A (ja) * 2009-09-08 2011-03-24 Shin-Etsu Chemical Co Ltd 接着剤組成物およびそれを用いた半導体保護膜形成用シート
JP5651625B2 (ja) * 2012-03-21 2015-01-14 京都エレックス株式会社 加熱硬化型導電性ペースト組成物
HUE054751T2 (hu) * 2014-08-29 2021-09-28 Furukawa Electric Co Ltd Vezetõképes tapadó film
JP2016108461A (ja) * 2014-12-08 2016-06-20 信越化学工業株式会社 接着剤、該接着剤からなるダイボンド材、該接着剤を用いた導電接続方法、及び該方法によって得られた光半導体装置
JP6352374B2 (ja) * 2016-12-01 2018-07-04 ダウ・コーニング・タイワン・インコーポレイテッドＤｏｗ Ｃｏｒｎｉｎｇ Ｔａｉｗａｎ Ｉｎｃ 感圧性接着剤シート及びこれらの製造方法
JP6800129B2 (ja) * 2017-11-07 2020-12-16 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法
EP3943563A4 (en) * 2019-03-18 2022-04-20 ThreeBond Co., Ltd. ADHESIVE COMPOSITION, CURED MATERIAL AND COMPOSITE
WO2021019932A1 (ja) * 2019-07-29 2021-02-04 株式会社村田製作所 水晶振動子、電子部品及び電子装置
KR20230100416A (ko) * 2021-12-28 2023-07-05 주식회사 노피온 플렉서블 회로기판용 이방성 도전접착제

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517729A (ja) * 1991-07-11 1993-01-26 Nitto Denko Corp 粘着テープ
JPH06220413A (ja) * 1993-01-21 1994-08-09 Murata Mfg Co Ltd 導電性接着剤およびそれを用いた赤外線検出器
JP2001060601A (ja) * 1999-08-19 2001-03-06 Sony Chem Corp 接着材料及び回路接続方法
JP2001323249A (ja) * 2000-05-17 2001-11-22 Hitachi Chem Co Ltd 回路接続用接着剤
JP2003147287A (ja) * 2001-11-14 2003-05-21 Hitachi Chem Co Ltd 回路接続用接着フィルム
JP2004018720A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤
JP2004196991A (ja) * 2002-12-19 2004-07-15 Shin Etsu Polymer Co Ltd 光学表示体用透明シリコーン粘着部材及び透明積層体
JP2005029710A (ja) * 2003-07-08 2005-02-03 Nippon Kayaku Co Ltd 接着剤組成物
JP2006028521A (ja) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd 回路接続用接着剤
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW392179B (en) * 1996-02-08 2000-06-01 Asahi Chemical Ind Anisotropic conductive composition
KR100709640B1 (ko) * 2003-12-04 2007-04-24 아사히 가세이 일렉트로닉스 가부시끼가이샤 이방 도전성 접착 시트 및 접속 구조체

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517729A (ja) * 1991-07-11 1993-01-26 Nitto Denko Corp 粘着テープ
JPH06220413A (ja) * 1993-01-21 1994-08-09 Murata Mfg Co Ltd 導電性接着剤およびそれを用いた赤外線検出器
JP2001060601A (ja) * 1999-08-19 2001-03-06 Sony Chem Corp 接着材料及び回路接続方法
JP2001323249A (ja) * 2000-05-17 2001-11-22 Hitachi Chem Co Ltd 回路接続用接着剤
JP2003147287A (ja) * 2001-11-14 2003-05-21 Hitachi Chem Co Ltd 回路接続用接着フィルム
JP2004018720A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤
JP2004196991A (ja) * 2002-12-19 2004-07-15 Shin Etsu Polymer Co Ltd 光学表示体用透明シリコーン粘着部材及び透明積層体
JP2005029710A (ja) * 2003-07-08 2005-02-03 Nippon Kayaku Co Ltd 接着剤組成物
JP2006028521A (ja) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd 回路接続用接着剤
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤

Also Published As

Publication number Publication date
JPWO2009022574A1 (ja) 2010-11-11
KR101139749B1 (ko) 2012-04-26
TW200925231A (en) 2009-06-16
CN101755025A (zh) 2010-06-23
TWI374924B (ko) 2012-10-21
WO2009022574A1 (ja) 2009-02-19
CN101755025B (zh) 2014-03-12
KR20100037124A (ko) 2010-04-08

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