WO2009005035A1 - 蛍光体、蛍光体の製造方法、蛍光体含有組成物、並びに発光装置 - Google Patents

蛍光体、蛍光体の製造方法、蛍光体含有組成物、並びに発光装置 Download PDF

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Publication number
WO2009005035A1
WO2009005035A1 PCT/JP2008/061839 JP2008061839W WO2009005035A1 WO 2009005035 A1 WO2009005035 A1 WO 2009005035A1 JP 2008061839 W JP2008061839 W JP 2008061839W WO 2009005035 A1 WO2009005035 A1 WO 2009005035A1
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WO
WIPO (PCT)
Prior art keywords
phosphor
light
emitting device
disclosed
containing composition
Prior art date
Application number
PCT/JP2008/061839
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English (en)
French (fr)
Inventor
Etsuo Shimizu
Seiko Ogiri
Hiromu Watanabe
Naoto Kijima
Naoki Sako
Noriko Endou
Hideaki Kaneda
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Mitsubishi Chemical Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corporation filed Critical Mitsubishi Chemical Corporation
Priority to EP08790752A priority Critical patent/EP2175007A4/en
Priority to US12/666,938 priority patent/US20110182072A1/en
Publication of WO2009005035A1 publication Critical patent/WO2009005035A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737—Phosphates
    • C09K11/7738—Phosphates with alkaline earth metals
    • C09K11/7739—Phosphates with alkaline earth metals with halogens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

Abstract

　近紫外領域の光を発する励起光源と共に用いても高い発光特性を有するアルカリ土類金属ハロゲン蛍光体を提供するとともに、該蛍光体を用いた蛍光体含有組成物及び発光装置と、該発光装置を用いた画像表示装置及び照明装置を提供すること。 　下記式（１）で表わされる化学組成を有し、かつ、４００ｎｍの波長の光で励起した場合に外部量子効率が７７％以上であることを特徴とする蛍光体を用いる。 　　　（Ｓｒ１０－ｘ－ｙ－ｚＭｘＥｕｙＭｎｚ）（ＰＯ４）６（Ｃｌ１－ａＱａ）２　（１） （前記式（１）において、Ｍは、Ｂａ、Ｃａ、Ｍｇ、及びＺｎからなる群より選ばれる少なくとも１種の元素を表わし、Ｑは、Ｆ、Ｂｒ、及びＩからなる群より選ばれる少なくとも１種の元素を表わし、ｘ、ｙ、ｚ、及びａは、各々、０≦ｘ＜１０、０．３≦ｙ≦１．５、０≦ｚ≦３、０≦ａ≦１、ｘ＋ｙ＋ｚ≦１０、を満たす数を表わす。）
PCT/JP2008/061839 2007-06-29 2008-06-30 蛍光体、蛍光体の製造方法、蛍光体含有組成物、並びに発光装置 WO2009005035A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08790752A EP2175007A4 (en) 2007-06-29 2008-06-30 LUMINOPHORE, METHOD FOR PRODUCING LUMINOPHORE, COMPOSITION CONTAINING LUMINOPHORE, AND LIGHT EMITTING DEVICE
US12/666,938 US20110182072A1 (en) 2007-06-29 2008-06-30 Phosphor, production method of phosphor, phosphor-containing composition, and light emitting device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007173319 2007-06-29
JP2007-173319 2007-06-29
JP2007-209521 2007-08-10
JP2007209521 2007-08-10

Publications (1)

Publication Number Publication Date
WO2009005035A1 true WO2009005035A1 (ja) 2009-01-08

Family

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PCT/JP2008/061839 WO2009005035A1 (ja) 2007-06-29 2008-06-30 蛍光体、蛍光体の製造方法、蛍光体含有組成物、並びに発光装置

Country Status (3)

Country Link
US (1) US20110182072A1 (ja)
EP (1) EP2175007A4 (ja)
WO (1) WO2009005035A1 (ja)

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JP2010270197A (ja) * 2009-05-20 2010-12-02 Citizen Electronics Co Ltd コーティング用樹脂組成物および該組成物を用いて得られる硬化体
WO2014152787A1 (en) * 2013-03-15 2014-09-25 General Electric Company Color stable red-emitting phosphors
TWI454555B (zh) * 2012-02-09 2014-10-01 Denki Kagaku Kogyo Kk 螢光體及發光裝置
US9371481B2 (en) 2014-06-12 2016-06-21 General Electric Company Color stable red-emitting phosphors
US9376615B2 (en) 2014-06-12 2016-06-28 General Electric Company Color stable red-emitting phosphors
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US9388336B2 (en) 2013-12-13 2016-07-12 General Electric Company Processes for preparing color stable manganese-doped complex fluoride phosphors
JP2016192434A (ja) * 2015-03-30 2016-11-10 大日本印刷株式会社 Ｌｅｄバックライト及びそれを用いたｌｅｄ表示装置
US9567516B2 (en) 2014-06-12 2017-02-14 General Electric Company Red-emitting phosphors and associated devices
US9580648B2 (en) 2013-03-15 2017-02-28 General Electric Company Color stable red-emitting phosphors
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US9982190B2 (en) 2015-02-20 2018-05-29 General Electric Company Color stable red-emitting phosphors
US10047286B2 (en) 2014-10-27 2018-08-14 General Electric Company Color stable red-emitting phosphors
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JP7482854B2 (ja) 2019-04-09 2024-05-14 デンカ株式会社 窒化物蛍光体及び発光装置

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