DE60327926D1 - Lichtemittierendes bauelement und zugehörige beleuchtungseinrichtung - Google Patents

Lichtemittierendes bauelement und zugehörige beleuchtungseinrichtung

Info

Publication number
DE60327926D1
DE60327926D1 DE60327926T DE60327926T DE60327926D1 DE 60327926 D1 DE60327926 D1 DE 60327926D1 DE 60327926 T DE60327926 T DE 60327926T DE 60327926 T DE60327926 T DE 60327926T DE 60327926 D1 DE60327926 D1 DE 60327926D1
Authority
DE
Germany
Prior art keywords
light
lighting device
emitting component
associated lighting
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60327926T
Other languages
English (en)
Inventor
Takatoshi Seto
Naoto Kijima
Akira Ohno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002214992A external-priority patent/JP4380118B2/ja
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Application granted granted Critical
Publication of DE60327926D1 publication Critical patent/DE60327926D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734Aluminates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342Silicates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737Phosphates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737Phosphates
    • C09K11/7738Phosphates with alkaline earth metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737Phosphates
    • C09K11/7738Phosphates with alkaline earth metals
    • C09K11/7739Phosphates with alkaline earth metals with halogens
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
DE60327926T 2002-02-15 2003-02-13 Lichtemittierendes bauelement und zugehörige beleuchtungseinrichtung Expired - Lifetime DE60327926D1 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2002038705 2002-02-15
JP2002050938 2002-02-27
JP2002129143 2002-04-30
JP2002214992A JP4380118B2 (ja) 2002-07-24 2002-07-24 発光装置及びそれを用いた照明装置
JP2002348200 2002-11-29
JP2003004521 2003-01-10
PCT/JP2003/001506 WO2003069686A1 (fr) 2002-02-15 2003-02-13 Dispositif electroluminescent et dispositif d'eclairage faisant appel a ce dernier

Publications (1)

Publication Number Publication Date
DE60327926D1 true DE60327926D1 (de) 2009-07-23

Family

ID=27739483

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60332676T Expired - Lifetime DE60332676D1 (de) 2002-02-15 2003-02-13 Lichtemittierendes Element und zughörige Beleuchtungsvorrichtung
DE60327926T Expired - Lifetime DE60327926D1 (de) 2002-02-15 2003-02-13 Lichtemittierendes bauelement und zugehörige beleuchtungseinrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60332676T Expired - Lifetime DE60332676D1 (de) 2002-02-15 2003-02-13 Lichtemittierendes Element und zughörige Beleuchtungsvorrichtung

Country Status (6)

Country Link
US (1) US7357882B2 (de)
EP (4) EP1942531B1 (de)
CN (2) CN100468789C (de)
AU (1) AU2003211509A1 (de)
DE (2) DE60332676D1 (de)
WO (1) WO2003069686A1 (de)

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JP3754701B2 (ja) * 2004-06-18 2006-03-15 大電株式会社 蛍光体及びそれを使用した発光素子
JP2006019409A (ja) 2004-06-30 2006-01-19 Mitsubishi Chemicals Corp 発光装置並びにそれを用いた照明、ディスプレイ用バックライト及びディスプレイ
WO2006008935A1 (ja) 2004-06-30 2006-01-26 Mitsubishi Chemical Corporation 蛍光体、及び、それを用いた発光素子、並びに、画像表示装置、照明装置
JP5226929B2 (ja) * 2004-06-30 2013-07-03 三菱化学株式会社 発光素子並びにそれを用いた照明装置、画像表示装置
EP1780592A4 (de) * 2004-06-30 2014-07-09 Mitsubishi Chem Corp Lichtemittierendes bauelement, rücklichteinheit zur beleuchtung, display-einheit und display-einheit
JP4890017B2 (ja) * 2005-01-26 2012-03-07 株式会社小糸製作所 青色発光蛍光体およびそれを用いた発光モジュール
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JP5284006B2 (ja) * 2008-08-25 2013-09-11 シチズン電子株式会社 発光装置
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CN102134486B (zh) * 2010-01-26 2014-01-29 海洋王照明科技股份有限公司 一种真空紫外光激发的绿色荧光粉及其制备方法
EP2557137A4 (de) * 2010-04-09 2014-12-03 Hitachi Chemical Co Ltd Kugelförmiges phosphor, dichtungsmaterial für eine wellenlängenumwandelnde solarbatterie, solarbatteriemodul und herstellungsverfahren dafür
WO2014167762A1 (ja) * 2013-04-09 2014-10-16 パナソニック株式会社 蛍光体および発光装置
CN103382390B (zh) * 2013-07-11 2017-07-18 中国科学院福建物质结构研究所 一种白光led用磷酸盐荧光粉及其制备
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CN111925683B (zh) * 2020-08-27 2022-12-06 兰州大学 基于bam em的荧光增白汽车涂漆及其制备方法

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Also Published As

Publication number Publication date
EP1942531A3 (de) 2008-08-20
EP2204859A2 (de) 2010-07-07
EP1942531B1 (de) 2010-05-19
CN1647286A (zh) 2005-07-27
CN101420004B (zh) 2012-07-04
DE60332676D1 (de) 2010-07-01
CN101420004A (zh) 2009-04-29
EP2204858A3 (de) 2010-10-27
WO2003069686A1 (fr) 2003-08-21
US20050145854A1 (en) 2005-07-07
EP1484803A1 (de) 2004-12-08
EP2204859A3 (de) 2010-10-27
EP1484803A4 (de) 2007-05-09
EP1484803B1 (de) 2009-06-10
AU2003211509A1 (en) 2003-09-04
CN100468789C (zh) 2009-03-11
EP1942531A2 (de) 2008-07-09
EP2204858A2 (de) 2010-07-07
US7357882B2 (en) 2008-04-15

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