WO2008126611A1 - 研磨パッド - Google Patents

研磨パッド Download PDF

Info

Publication number
WO2008126611A1
WO2008126611A1 PCT/JP2008/054583 JP2008054583W WO2008126611A1 WO 2008126611 A1 WO2008126611 A1 WO 2008126611A1 JP 2008054583 W JP2008054583 W JP 2008054583W WO 2008126611 A1 WO2008126611 A1 WO 2008126611A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
polishing
disclosed
prepolymer
molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054583
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Yoshiyuki Nakai
Atsushi Kazuno
Tsuyoshi Kimura
Tetsuo Shimomura
Kazuyuki Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Tire Corp
Original Assignee
Toyo Tire and Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire and Rubber Co Ltd filed Critical Toyo Tire and Rubber Co Ltd
Priority to CN2008800089056A priority Critical patent/CN101636248B/zh
Priority to US12/593,206 priority patent/US8865785B2/en
Publication of WO2008126611A1 publication Critical patent/WO2008126611A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4833—Polyethers containing oxyethylene units
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
    • C08G18/724—Combination of aromatic polyisocyanates with (cyclo)aliphatic polyisocyanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0025—Foam properties rigid

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
PCT/JP2008/054583 2007-03-28 2008-03-13 研磨パッド Ceased WO2008126611A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800089056A CN101636248B (zh) 2007-03-28 2008-03-13 研磨垫
US12/593,206 US8865785B2 (en) 2007-03-28 2008-03-13 Polishing pad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-084785 2007-03-28
JP2007084785A JP5078000B2 (ja) 2007-03-28 2007-03-28 研磨パッド

Publications (1)

Publication Number Publication Date
WO2008126611A1 true WO2008126611A1 (ja) 2008-10-23

Family

ID=39863741

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054583 Ceased WO2008126611A1 (ja) 2007-03-28 2008-03-13 研磨パッド

Country Status (6)

Country Link
US (1) US8865785B2 (enExample)
JP (1) JP5078000B2 (enExample)
KR (1) KR101475766B1 (enExample)
CN (1) CN101636248B (enExample)
TW (1) TW200846381A (enExample)
WO (1) WO2008126611A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101134058B1 (ko) * 2005-05-17 2012-04-16 도요 고무 고교 가부시키가이샤 연마 패드
CN101724167B (zh) * 2005-07-15 2013-06-26 东洋橡胶工业株式会社 层叠片及其制造方法
JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
CN101489721B (zh) * 2006-08-28 2014-06-18 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
MY144784A (en) * 2006-09-08 2011-11-15 Toyo Tire & Rubber Co Method for manufacturing a polishing pad
MY157714A (en) 2007-01-15 2016-07-15 Rohm & Haas Elect Mat Polishing pad and a method for manufacturing the same
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
JP5393434B2 (ja) 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP5356098B2 (ja) * 2009-04-03 2013-12-04 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US8545292B2 (en) 2009-06-29 2013-10-01 Dic Corporation Two-component urethane resin composition for polishing pad, polyurethane polishing pad, and method for producing polyurethane polishing pad
KR20120112476A (ko) * 2009-12-22 2012-10-11 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 이를 이용한 화학 기계 연마 방법
JP5528169B2 (ja) * 2010-03-26 2014-06-25 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
US9079288B2 (en) 2010-10-26 2015-07-14 Toyo Tire & Rubber Co., Ltd. Polishing pad and method for producing same
MY164897A (en) * 2010-10-26 2018-01-30 Rohm & Haas Elect Materials Cmp Holdings Inc Polishing pad and method for producing same
US8865765B2 (en) 2011-01-12 2014-10-21 The William M. Yarbrough Foundation Method for treating eczema
JP5629749B2 (ja) * 2012-12-28 2014-11-26 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5661129B2 (ja) * 2013-01-29 2015-01-28 東洋ゴム工業株式会社 研磨パッド
JP2014205215A (ja) * 2013-04-12 2014-10-30 東洋ゴム工業株式会社 研磨パッドの製造方法
CN103333313B (zh) * 2013-06-09 2015-11-18 合肥宏光研磨科技有限公司 一种聚氨酯抛光材料的制造方法
KR102277418B1 (ko) * 2019-05-21 2021-07-14 에스케이씨솔믹스 주식회사 가교 밀도가 향상된 연마패드 및 이의 제조방법
US12122013B2 (en) * 2019-10-23 2024-10-22 Sk Enpulse Co., Ltd. Composition for polishing pad and polishing pad
KR102287235B1 (ko) 2019-10-30 2021-08-06 에스케이씨솔믹스 주식회사 가교도가 조절된 연마패드 및 이의 제조방법
CN113084695B (zh) * 2021-03-12 2022-05-13 安徽禾臣新材料有限公司 一种电子显示屏精抛用缓冲抛光垫及其生产方法
WO2025257213A1 (en) * 2024-06-11 2025-12-18 Soudal Nv Reactive polyurethane formulations with a low monomer content

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004001169A (ja) * 2001-12-12 2004-01-08 Toyobo Co Ltd 半導体ウエハ研磨用研磨パッド
JP2004042250A (ja) * 2002-05-20 2004-02-12 Toyobo Co Ltd 研磨パッド
JP2004277101A (ja) * 2003-03-17 2004-10-07 Kyocera Mita Corp 用紙搬送ガイド及びこれを搭載した画像形成装置
JP2005068174A (ja) * 2003-08-21 2005-03-17 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法及び研磨パッド

Family Cites Families (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL284980A (enExample) * 1961-06-12
US4410668A (en) 1982-01-29 1983-10-18 Ppg Industries, Inc. Elastomeric coating compositions
JPH0291279A (ja) 1988-09-29 1990-03-30 Achilles Corp 合成皮革及びその製造方法
JP3137260B2 (ja) 1989-06-12 2001-02-19 凸版印刷株式会社 ラジアルラインスロットアンテナ
JP2925736B2 (ja) 1991-08-07 1999-07-28 ピーピージー インダストリーズ インコーポレーテッド 独立して架橋しうるポリウレタンを有する含浸された繊維の束
GB9216631D0 (en) 1992-08-05 1992-09-16 Ici Plc Reaction system for preparing microcellular elastomers
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JPH06220151A (ja) 1993-01-22 1994-08-09 Sanyo Chem Ind Ltd 研磨材用ポリウレタン樹脂
JPH0871378A (ja) 1994-09-09 1996-03-19 Kanegafuchi Chem Ind Co Ltd 中空糸膜ポッティング用ウレタン樹脂
US5670599A (en) 1995-03-08 1997-09-23 Air Products And Chemicals, Inc. Ultra low voc polyurethane coatings
US5614575A (en) 1995-04-24 1997-03-25 Rpg. Inc. Sprayable polyurethane compositions
US5587502A (en) 1995-06-02 1996-12-24 Minnesota Mining & Manufacturing Company Hydroxy functional alkoxysilane and alkoxysilane functional polyurethane made therefrom
EP1015176B1 (en) 1997-04-04 2003-03-12 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
JP2001513450A (ja) 1997-08-06 2001-09-04 ローデル ホールディングス インコーポレイテッド 改良研磨パッド及びこれに関連する方法
JP2000017252A (ja) 1998-06-29 2000-01-18 Dainippon Ink & Chem Inc 研磨材組成物及びその研磨材
JP3516874B2 (ja) 1998-12-15 2004-04-05 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
KR100585480B1 (ko) 1999-01-21 2006-06-02 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 개선된 연마 패드 및 기판의 연마 방법
JP2000248034A (ja) 1999-03-02 2000-09-12 Mitsubishi Chemicals Corp 研磨材用ポリウレタン系樹脂組成物及びその発泡体
JP3316756B2 (ja) 1999-06-04 2002-08-19 富士紡績株式会社 研磨パッド用ウレタン成形物の製造方法及び研磨パッド用ウレタン成形物
JP3880028B2 (ja) 1999-08-06 2007-02-14 Ｊｓｒ株式会社 研磨パッド用重合体組成物及びそれを用いた研磨パッド
JP3558273B2 (ja) 1999-09-22 2004-08-25 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
JP4296655B2 (ja) 1999-10-12 2009-07-15 東レ株式会社 半導体基板用研磨パッド
JP2001277101A (ja) 2000-03-28 2001-10-09 Rodel Nitta Co 研磨布
US6777455B2 (en) 2000-06-13 2004-08-17 Toyo Tire & Rubber Co., Ltd. Process for producing polyurethane foam
JP2003011066A (ja) 2000-07-25 2003-01-15 Ebara Corp 研磨工具及びその製造方法
US20020016139A1 (en) 2000-07-25 2002-02-07 Kazuto Hirokawa Polishing tool and manufacturing method therefor
JP2002059358A (ja) 2000-08-24 2002-02-26 Toray Ind Inc 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法
US6477926B1 (en) 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US6641471B1 (en) 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
US6679769B2 (en) 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP3826702B2 (ja) 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6706383B1 (en) 2001-11-27 2004-03-16 Psiloquest, Inc. Polishing pad support that improves polishing performance and longevity
CN1217981C (zh) 2000-12-08 2005-09-07 可乐丽股份有限公司 热塑性聚氨酯泡沫体、其制造方法和由该泡沫体制成的研磨垫料
JP2005503447A (ja) 2001-01-24 2005-02-03 ハンツマン・インターナショナル・エルエルシー 短縮した金型滞留時間及び改良された品質で調製された成形発泡物品
JP3455187B2 (ja) 2001-02-01 2003-10-14 東洋ゴム工業株式会社 研磨パッド用ポリウレタン発泡体の製造装置
JP2002239905A (ja) 2001-02-21 2002-08-28 Allied Material Corp Ｃｍｐ用パッドコンディショナー及びその製造方法
JP3359629B1 (ja) * 2001-04-09 2002-12-24 東洋紡績株式会社 ポリウレタン組成物からなる研磨パッド
KR100790427B1 (ko) 2001-04-09 2008-01-02 도요 고무 고교 가부시키가이샤 폴리우레탄 조성물 및 연마 패드
JP2003062748A (ja) 2001-08-24 2003-03-05 Inoac Corp 研磨用パッド
JP2003089051A (ja) 2001-09-17 2003-03-25 Tokyo Seimitsu Co Ltd 研磨装置
JP3851135B2 (ja) 2001-10-17 2006-11-29 ニッタ・ハース株式会社 研磨パッド
JP3455208B2 (ja) 2001-11-13 2003-10-14 東洋紡績株式会社 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック
KR100877383B1 (ko) 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
JP3325562B1 (ja) 2001-12-07 2002-09-17 東洋ゴム工業株式会社 発泡ポリウレタン研磨パッドの製造方法
JP2003145414A (ja) 2001-11-13 2003-05-20 Toyobo Co Ltd 研磨パッド及びその製造方法
JP2003224094A (ja) 2002-01-29 2003-08-08 Ebara Corp 研磨工具
US6866565B2 (en) 2002-01-29 2005-03-15 Ebara Corporation Polishing tool and polishing apparatus
KR100467765B1 (ko) 2002-02-04 2005-01-24 에스케이씨 주식회사 고경도 및 우수한 내마모성을 갖는 폴리우레탄 탄성체제조용 조성물
JP2004167680A (ja) 2002-05-20 2004-06-17 Toyobo Co Ltd 研磨パッド
US6824854B2 (en) 2002-07-29 2004-11-30 E. I. Du Pont De Nemours And Company Carpets treated for soil resistance
JP4101584B2 (ja) 2002-08-09 2008-06-18 東洋ゴム工業株式会社 研磨シート用ポリウレタン発泡体及びその製造方法、研磨パッド用研磨シート、並びに研磨パッド
CN1684799A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的抛光垫片
US7094811B2 (en) 2002-10-03 2006-08-22 Bayer Corporation Energy absorbing flexible foams produced in part with a double metal cyanide catalyzed polyol
WO2004049417A1 (ja) 2002-11-27 2004-06-10 Toyo Tire & Rubber Co., Ltd. 研磨パッド及び半導体デバイスの製造方法
JP4078643B2 (ja) 2002-12-10 2008-04-23 東洋ゴム工業株式会社 研磨パッドの製造方法、研磨パッド、及び半導体デバイスの製造方法
JP4233319B2 (ja) 2002-12-12 2009-03-04 東洋ゴム工業株式会社 研磨パッドの製造方法及び研磨パッド
TWI313693B (en) 2002-12-17 2009-08-21 Dainippon Ink & Chemicals Two-component curable polyol composition for foamed grindstone, two-component curable composition for foamed grindstone, foamed grindstone, and method for producing foamed grindstone
JP2004235446A (ja) 2003-01-30 2004-08-19 Toyobo Co Ltd 研磨パッド
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
JP4324785B2 (ja) 2003-04-15 2009-09-02 Ｊｓｒ株式会社 研磨パッドの製造方法
JP2005052907A (ja) 2003-08-07 2005-03-03 Diatex Co Ltd 研磨パッド用下地材
JP4189963B2 (ja) 2003-08-21 2008-12-03 東洋ゴム工業株式会社 研磨パッド
JP4265366B2 (ja) 2003-10-17 2009-05-20 日本ポリウレタン工業株式会社 軟質ポリウレタンフォームの製造方法
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
KR100817233B1 (ko) 2004-03-11 2008-03-27 도요 고무 고교 가부시키가이샤 연마 패드 및 반도체 디바이스의 제조 방법
JP4627149B2 (ja) 2004-05-10 2011-02-09 東洋ゴム工業株式会社 研磨パッド及び半導体デバイスの製造方法
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
EP1647588A3 (en) 2004-10-13 2006-11-02 Rohm and Haas Company Surface promoted Michael Cure Compositions
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
KR101172324B1 (ko) 2004-12-10 2012-08-14 도요 고무 고교 가부시키가이샤 연마 패드 및 연마 패드의 제조 방법
JP2006190826A (ja) 2005-01-06 2006-07-20 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
JP2006231429A (ja) 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
KR100909605B1 (ko) 2005-03-08 2009-07-27 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
KR101134058B1 (ko) 2005-05-17 2012-04-16 도요 고무 고교 가부시키가이샤 연마 패드
JP4884726B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
KR101290490B1 (ko) 2005-09-22 2013-07-26 가부시키가이샤 구라레 고분자 재료, 그것으로부터 얻어지는 발포체 및 이들을사용한 연마 패드
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
CN101489721B (zh) 2006-08-28 2014-06-18 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004001169A (ja) * 2001-12-12 2004-01-08 Toyobo Co Ltd 半導体ウエハ研磨用研磨パッド
JP2004042250A (ja) * 2002-05-20 2004-02-12 Toyobo Co Ltd 研磨パッド
JP2004277101A (ja) * 2003-03-17 2004-10-07 Kyocera Mita Corp 用紙搬送ガイド及びこれを搭載した画像形成装置
JP2005068174A (ja) * 2003-08-21 2005-03-17 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法及び研磨パッド

Also Published As

Publication number Publication date
KR101475766B1 (ko) 2014-12-23
TWI364430B (enExample) 2012-05-21
KR20090123852A (ko) 2009-12-02
JP5078000B2 (ja) 2012-11-21
CN101636248B (zh) 2013-01-16
JP2008238361A (ja) 2008-10-09
CN101636248A (zh) 2010-01-27
US8865785B2 (en) 2014-10-21
TW200846381A (en) 2008-12-01
US20100048102A1 (en) 2010-02-25

Similar Documents

Publication Publication Date Title
WO2008126611A1 (ja) 研磨パッド
WO2008087797A1 (ja) 研磨パッド及びその製造方法
CN109867764A (zh) 得自含胺引发的多元醇的固化剂的高去除速率化学机械抛光垫
MY146806A (en) Polishing pad and manufacturing method thereof
TWI382046B (zh) 聚胺基甲酸酯發泡球之改良製法
MXPA05008585A (es) Polimeros hidrofilicos de poliuretano derivados de un prepolimero terminado en isocianato basado en mdi.
KR101825757B1 (ko) 옥외 시설물의 포장면 제조 방법
WO2010072582A3 (en) Flexible polyurethane foam
PL1619215T3 (pl) Prepolimery poliuretanowe o małej lepkości na bazie 2,4’-MDI
WO2008136179A1 (ja) 軟質ポリウレタンフォーム用ポリイソシアネート組成物及び該組成物を用いた軟質ポリウレタンフォームの製造方法
TW200709896A (en) Polishing pad
JP2004526852A5 (enExample)
SI2205654T1 (sl) Poliuretanska laminacijska smola laminat vsebujoč poliuretansko laminacijsko smolo in smuči ali snežne deske ki vsebujejo laminat
JP2016069658A (ja) ポリウレタンフォーム
CN110003423A (zh) 改性异氰酸酯预聚体、聚氨酯组合料及其制备方法和应用
ATE287422T1 (de) Polyurethanharz aus hydrophilen-polyol komponenten
JP2008222769A5 (enExample)
MXPA03005042A (es) Elastomeros rim de alto rendimiento y un procedimiento para su produccion.
JP2015513361A5 (enExample)
JP2019137980A (ja) 弾性材の製造方法、および、弾性材
WO2005113073A3 (en) Golf balls formed using compositions containing copolymers derived from polytrimethylene ether glycol
DK1496071T3 (da) Polyurethanharpiks til trykfarve
JP2007125099A (ja) マットレスクッション材及びその製造方法
KR101895981B1 (ko) 자운스 범퍼용 초미세 발포 폴리우레탄 탄성체 및 이의 제조방법
KR20150130716A (ko) 친환경 소재를 적용한 폴리우레탄 트랙 및 이의 시공방법

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880008905.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08721987

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020097012467

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12593206

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08721987

Country of ref document: EP

Kind code of ref document: A1