WO2008102718A1 - 半導体記憶装置 - Google Patents

半導体記憶装置 Download PDF

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Publication number
WO2008102718A1
WO2008102718A1 PCT/JP2008/052614 JP2008052614W WO2008102718A1 WO 2008102718 A1 WO2008102718 A1 WO 2008102718A1 JP 2008052614 W JP2008052614 W JP 2008052614W WO 2008102718 A1 WO2008102718 A1 WO 2008102718A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
electrode
current passage
resistance
memory device
Prior art date
Application number
PCT/JP2008/052614
Other languages
English (en)
French (fr)
Inventor
Kimihiko Ito
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009500167A priority Critical patent/JP5353692B2/ja
Priority to US12/527,681 priority patent/US8049204B2/en
Publication of WO2008102718A1 publication Critical patent/WO2008102718A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/101—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/041—Modification of switching materials after formation, e.g. doping
    • H10N70/046—Modification of switching materials after formation, e.g. doping by diffusion, e.g. photo-dissolution
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/828—Current flow limiting means within the switching material region, e.g. constrictions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/883—Oxides or nitrides
    • H10N70/8833—Binary metal oxides, e.g. TaOx

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)

Abstract

　第１の電極と、この第１の電極に接して設けられた電流経路用領域と、この電流経路用領域に接して設けられた第２の電極とを有する抵抗変化素子を備えた半導体記憶装置であって、前記電流経路用領域は、第１の金属元素を含有し、電圧の印加により抵抗率が変化する抵抗変化材料からなる第１の領域と、前記抵抗変化材料に第２の金属元素が添加され、第１の領域より抵抗率が高く、且つ第１の領域の抵抗を変化させる電圧の印加では抵抗率が変化しない第２の領域とからなり、第１の領域は、第１の電極と第２の電極との間に電流経路が形成されるように、これら両電極に接し且つ一方の電極側から他方の電極側にわたって設けられ、第２の領域は、一方の電極側から他方の電極側にわたる電流経路用領域の少なくとも一部分において第１の領域の外側に設けられている。
PCT/JP2008/052614 2007-02-19 2008-02-18 半導体記憶装置 WO2008102718A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009500167A JP5353692B2 (ja) 2007-02-19 2008-02-18 半導体記憶装置
US12/527,681 US8049204B2 (en) 2007-02-19 2008-02-18 Semiconductor memory device having variable resistance element and method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-037897 2007-02-19
JP2007037897 2007-02-19

Publications (1)

Publication Number Publication Date
WO2008102718A1 true WO2008102718A1 (ja) 2008-08-28

Family

ID=39709995

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052614 WO2008102718A1 (ja) 2007-02-19 2008-02-18 半導体記憶装置

Country Status (3)

Country Link
US (1) US8049204B2 (ja)
JP (1) JP5353692B2 (ja)
WO (1) WO2008102718A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306005A (ja) * 2007-06-07 2008-12-18 Fujitsu Ltd 半導体装置及びその製造方法
WO2010125780A1 (ja) * 2009-04-30 2010-11-04 パナソニック株式会社 不揮発性記憶素子及び不揮発性記憶装置
WO2012063495A1 (ja) * 2010-11-12 2012-05-18 パナソニック株式会社 不揮発性半導体記憶素子の製造方法
WO2012127735A1 (ja) * 2011-03-18 2012-09-27 日本電気株式会社 抵抗変化素子及び半導体記憶装置
JP2013541204A (ja) * 2010-09-16 2013-11-07 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． ナノスケールスイッチングデバイス
US9159917B2 (en) 2012-09-14 2015-10-13 Panasonic Intellectual Property Management Co., Ltd. Nonvolatile memory element and method of manufacturing nonvolatile memory element

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8300448B2 (en) * 2008-03-25 2012-10-30 Nec Corporation Semiconductor storage device, memory cell array, and a fabrication method and drive method of a semiconductor storage device
US20110057161A1 (en) * 2009-09-10 2011-03-10 Gurtej Sandhu Thermally shielded resistive memory element for low programming current
KR20140028437A (ko) * 2012-08-29 2014-03-10 에스케이하이닉스 주식회사 가변 저항 메모리 장치 및 그 제조방법
CN103117359B (zh) * 2013-02-07 2015-04-15 北京大学 一种高可靠性非挥发存储器及其制备方法
US20160043312A1 (en) * 2013-03-13 2016-02-11 Hewlett-Packard Development Company, L.P. Memristors with dopant-compensated switching
US20170317142A1 (en) * 2016-04-29 2017-11-02 Western Digital Technologies, Inc. Sidewall insulated resistive memory devices
CN114583047A (zh) * 2020-12-01 2022-06-03 联华电子股份有限公司 存储器器件及其制造方法

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JP2006261677A (ja) * 2005-03-17 2006-09-28 Samsung Electronics Co Ltd メモリ素子およびメモリ素子の製造方法
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WO2007105284A1 (ja) * 2006-03-13 2007-09-20 Fujitsu Limited 抵抗変化型記憶素子および抵抗変化型記憶素子の製造方法

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JP4608875B2 (ja) 2003-12-03 2011-01-12 ソニー株式会社 記憶装置
JP2006080259A (ja) 2004-09-09 2006-03-23 Matsushita Electric Ind Co Ltd 抵抗変化素子およびそれを用いた不揮発性メモリ、ならびにこれらの製造方法
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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2006261677A (ja) * 2005-03-17 2006-09-28 Samsung Electronics Co Ltd メモリ素子およびメモリ素子の製造方法
JP2007027537A (ja) * 2005-07-20 2007-02-01 Sharp Corp 可変抵抗素子を備えた半導体記憶装置
JP2007036256A (ja) * 2005-07-28 2007-02-08 Qimonda Ag 金属酸化物ナノ粒子に基づく不揮発性抵抗メモリセル、その製造方法、およびそのメモリセル配置
WO2007102483A1 (ja) * 2006-03-08 2007-09-13 Matsushita Electric Industrial Co., Ltd. 不揮発性記憶素子、不揮発記憶装置、及びそれらの製造方法
WO2007105284A1 (ja) * 2006-03-13 2007-09-20 Fujitsu Limited 抵抗変化型記憶素子および抵抗変化型記憶素子の製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306005A (ja) * 2007-06-07 2008-12-18 Fujitsu Ltd 半導体装置及びその製造方法
US8508976B2 (en) 2009-04-30 2013-08-13 Panasonic Corporation Nonvolatile memory element and nonvolatile memory device
WO2010125780A1 (ja) * 2009-04-30 2010-11-04 パナソニック株式会社 不揮発性記憶素子及び不揮発性記憶装置
JP4628500B2 (ja) * 2009-04-30 2011-02-09 パナソニック株式会社 不揮発性記憶素子及び不揮発性記憶装置
CN102047423A (zh) * 2009-04-30 2011-05-04 松下电器产业株式会社 非易失性存储元件及非易失性存储装置
JP2013541204A (ja) * 2010-09-16 2013-11-07 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． ナノスケールスイッチングデバイス
US9040948B2 (en) 2010-09-16 2015-05-26 Hewlett-Packard Development Company, L.P. Nanoscale switching device
JP5006481B2 (ja) * 2010-11-12 2012-08-22 パナソニック株式会社 不揮発性半導体記憶素子の製造方法
US8574957B2 (en) 2010-11-12 2013-11-05 Panasonic Corporation Method for manufacturing nonvolatile semiconductor memory element
WO2012063495A1 (ja) * 2010-11-12 2012-05-18 パナソニック株式会社 不揮発性半導体記憶素子の製造方法
WO2012127735A1 (ja) * 2011-03-18 2012-09-27 日本電気株式会社 抵抗変化素子及び半導体記憶装置
US9070876B2 (en) 2011-03-18 2015-06-30 Nec Corporation Variable resistance element and semiconductor storage device
US9159917B2 (en) 2012-09-14 2015-10-13 Panasonic Intellectual Property Management Co., Ltd. Nonvolatile memory element and method of manufacturing nonvolatile memory element

Also Published As

Publication number Publication date
US8049204B2 (en) 2011-11-01
US20100078615A1 (en) 2010-04-01
JPWO2008102718A1 (ja) 2010-05-27
JP5353692B2 (ja) 2013-11-27

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