WO2008099892A1 - 強度と成形性に優れる電気電子部品用銅合金板 - Google Patents

強度と成形性に優れる電気電子部品用銅合金板 Download PDF

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Publication number
WO2008099892A1
WO2008099892A1 PCT/JP2008/052455 JP2008052455W WO2008099892A1 WO 2008099892 A1 WO2008099892 A1 WO 2008099892A1 JP 2008052455 W JP2008052455 W JP 2008052455W WO 2008099892 A1 WO2008099892 A1 WO 2008099892A1
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WO
WIPO (PCT)
Prior art keywords
copper alloy
alloy sheet
electrical
electronic parts
excelling
Prior art date
Application number
PCT/JP2008/052455
Other languages
English (en)
French (fr)
Inventor
Akira Fugono
Hiroshi Sakamoto
Original Assignee
Kabushiki Kaisha Kobe Seiko Sho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Kobe Seiko Sho filed Critical Kabushiki Kaisha Kobe Seiko Sho
Priority to EP08711294A priority Critical patent/EP2128282B1/en
Priority to US12/523,070 priority patent/US8784580B2/en
Priority to KR1020097016823A priority patent/KR101159404B1/ko
Priority to CN2008800047301A priority patent/CN101605917B/zh
Publication of WO2008099892A1 publication Critical patent/WO2008099892A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

　本発明は、高強度と優れた曲げ加工性を両立させた電気電子部品用Ｃｕ-Ｎｉ-Ｓｉ系銅合金板を得る。Ｎｉ：１．５～４．５％（質量％、以下同じ）、Ｓｉ：０．３～１．０％を含み、必要に応じてＳｎ：０．０１～１．３％、Ｍｇ：０．００５～０．２％、Ｚｎ：０．０１～５％、Ｍｎ：０．０１～０．５％、Ｃｒ：０．００１～０．３％の１種又は２種以上を含有し、残部がＣｕ及び不可避的不純物からなる。平均結晶粒径が１０μｍ以下、結晶粒径の標準偏差σが２σ＜１０μｍ、結晶粒界上に存在する粒径３０～３００ｎｍの分散粒子の存在量が５００個／ｍｍ以上である。
PCT/JP2008/052455 2007-02-16 2008-02-14 強度と成形性に優れる電気電子部品用銅合金板 WO2008099892A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08711294A EP2128282B1 (en) 2007-02-16 2008-02-14 Copper alloy sheet for electrical and electronic parts excelling in strength and formability
US12/523,070 US8784580B2 (en) 2007-02-16 2008-02-14 Copper alloy sheet excellent in strength and formability for electrical and electronic components
KR1020097016823A KR101159404B1 (ko) 2007-02-16 2008-02-14 강도와 성형성이 우수한 전기전자 부품용 구리 합금판
CN2008800047301A CN101605917B (zh) 2007-02-16 2008-02-14 强度和成形性优异的电气电子部件用铜合金板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007035726A JP4357536B2 (ja) 2007-02-16 2007-02-16 強度と成形性に優れる電気電子部品用銅合金板
JP2007-035726 2007-02-16

Publications (1)

Publication Number Publication Date
WO2008099892A1 true WO2008099892A1 (ja) 2008-08-21

Family

ID=39690119

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052455 WO2008099892A1 (ja) 2007-02-16 2008-02-14 強度と成形性に優れる電気電子部品用銅合金板

Country Status (6)

Country Link
US (1) US8784580B2 (ja)
EP (1) EP2128282B1 (ja)
JP (1) JP4357536B2 (ja)
KR (2) KR101159404B1 (ja)
CN (1) CN101605917B (ja)
WO (1) WO2008099892A1 (ja)

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US20110017358A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
US20110017357A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
US20110100676A1 (en) * 2008-02-26 2011-05-05 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy rod or wire
EP2508633A1 (en) * 2009-12-02 2012-10-10 Furukawa Electric Co., Ltd. Copper alloy sheet and process for producing same
JP2014019889A (ja) * 2012-07-13 2014-02-03 Furukawa Electric Co Ltd:The 強度およびめっき性に優れる銅合金材およびその製造方法
JP2014019888A (ja) * 2012-07-13 2014-02-03 Furukawa Electric Co Ltd:The 高強度銅合金材およびその製造方法
US8986471B2 (en) 2007-12-21 2015-03-24 Mitsubishi Shindoh Co., Ltd. High strength and high thermal conductivity copper alloy tube and method for producing the same
US9163300B2 (en) 2008-03-28 2015-10-20 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy pipe, rod, or wire
US9455058B2 (en) 2009-01-09 2016-09-27 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
US10266917B2 (en) 2003-03-03 2019-04-23 Mitsubishi Shindoh Co., Ltd. Heat resistance copper alloy materials
US10311991B2 (en) 2009-01-09 2019-06-04 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
CN110860855A (zh) * 2019-10-30 2020-03-06 富威科技（吴江）有限公司 一种高表面短流程铜带生产工艺
CN113249613A (zh) * 2021-07-12 2021-08-13 江西萨瑞微电子技术有限公司 一种保护电路用导体引线及包含该引线的保护电路

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US7820303B2 (en) 2004-09-10 2010-10-26 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Conductive material for connecting part and method for manufacturing the conductive material
JP5170881B2 (ja) * 2007-03-26 2013-03-27 古河電気工業株式会社 電気・電子機器用銅合金材およびその製造方法
JP2011021225A (ja) * 2009-07-15 2011-02-03 Hitachi Cable Ltd 端子・コネクタ用銅合金材及びその製造方法
US9845521B2 (en) * 2010-12-13 2017-12-19 Kobe Steel, Ltd. Copper alloy
JP5690169B2 (ja) * 2011-02-25 2015-03-25 株式会社神戸製鋼所 銅合金
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JP5309272B1 (ja) * 2011-09-16 2013-10-09 三菱伸銅株式会社 銅合金板及び銅合金板の製造方法
EP2757167B1 (en) 2011-09-16 2018-05-30 Mitsubishi Shindoh Co., Ltd. Copper alloy sheet and production method for copper alloy sheet
JP6246454B2 (ja) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
CN102418004A (zh) * 2011-11-24 2012-04-18 中铝洛阳铜业有限公司 一种镍铬硅青铜合金材料
JP6029296B2 (ja) * 2012-03-08 2016-11-24 Ｊｘ金属株式会社 電気電子機器用Ｃｕ−Ｚｎ−Ｓｎ−Ｃａ合金
JP5773929B2 (ja) 2012-03-28 2015-09-02 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
JP5988745B2 (ja) * 2012-07-18 2016-09-07 三菱伸銅株式会社 Ｓｎめっき付Ｃｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法
WO2014016934A1 (ja) * 2012-07-26 2014-01-30 三菱電機株式会社 銅合金及びその製造方法
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WO2014115307A1 (ja) 2013-01-25 2014-07-31 三菱伸銅株式会社 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法
DE102013005158A1 (de) * 2013-03-26 2014-10-02 Kme Germany Gmbh & Co. Kg Kupferlegierung
JP6210887B2 (ja) * 2014-01-18 2017-10-11 株式会社神戸製鋼所 強度、耐熱性及び曲げ加工性に優れたＦｅ−Ｐ系銅合金板
JP6173943B2 (ja) 2014-02-20 2017-08-02 株式会社神戸製鋼所 耐熱性に優れる表面被覆層付き銅合金板条
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US10266917B2 (en) 2003-03-03 2019-04-23 Mitsubishi Shindoh Co., Ltd. Heat resistance copper alloy materials
US8986471B2 (en) 2007-12-21 2015-03-24 Mitsubishi Shindoh Co., Ltd. High strength and high thermal conductivity copper alloy tube and method for producing the same
US20110100676A1 (en) * 2008-02-26 2011-05-05 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy rod or wire
US10163539B2 (en) 2008-02-26 2018-12-25 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy rod or wire
US9512506B2 (en) 2008-02-26 2016-12-06 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy rod or wire
US9163300B2 (en) 2008-03-28 2015-10-20 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy pipe, rod, or wire
US20110017358A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
US20110017357A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
US9455058B2 (en) 2009-01-09 2016-09-27 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
US10311991B2 (en) 2009-01-09 2019-06-04 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
EP2508633A4 (en) * 2009-12-02 2014-07-23 Furukawa Electric Co Ltd COPPER ALLOY FILM AND MANUFACTURING METHOD THEREFOR
EP2508633A1 (en) * 2009-12-02 2012-10-10 Furukawa Electric Co., Ltd. Copper alloy sheet and process for producing same
JP2014019888A (ja) * 2012-07-13 2014-02-03 Furukawa Electric Co Ltd:The 高強度銅合金材およびその製造方法
JP2014019889A (ja) * 2012-07-13 2014-02-03 Furukawa Electric Co Ltd:The 強度およびめっき性に優れる銅合金材およびその製造方法
CN110860855A (zh) * 2019-10-30 2020-03-06 富威科技（吴江）有限公司 一种高表面短流程铜带生产工艺
CN113249613A (zh) * 2021-07-12 2021-08-13 江西萨瑞微电子技术有限公司 一种保护电路用导体引线及包含该引线的保护电路

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EP2128282A4 (en) 2011-06-29
EP2128282A1 (en) 2009-12-02
KR101159404B1 (ko) 2012-06-28
KR20090102849A (ko) 2009-09-30
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JP2008196042A (ja) 2008-08-28
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