TW200604354A - Copper alloy - Google Patents

Copper alloy

Info

Publication number
TW200604354A
TW200604354A TW094117169A TW94117169A TW200604354A TW 200604354 A TW200604354 A TW 200604354A TW 094117169 A TW094117169 A TW 094117169A TW 94117169 A TW94117169 A TW 94117169A TW 200604354 A TW200604354 A TW 200604354A
Authority
TW
Taiwan
Prior art keywords
plane
ray diffraction
copper alloy
sheet surface
diffraction intensity
Prior art date
Application number
TW094117169A
Other languages
Chinese (zh)
Other versions
TWI371499B (en
Inventor
Nobuyuki Tanaka
Tatsuhiko Eguchi
Kuniteru Mihara
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW200604354A publication Critical patent/TW200604354A/en
Application granted granted Critical
Publication of TWI371499B publication Critical patent/TWI371499B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent

Abstract

A copper alloy for electronic machinery and tools, containing Ni 2.0 to 4.5 mass%, and Si 0.3 to 1.0 mass%, with the balance being Cu and unavoidable impurities, which satisfies the following expression: |(311})× A/(|(311)+|)220)+|(200))<1.5 wherein |(311) represents an X-ray diffraction intensity from a (311) plane at a sheet surface; |(220) represents an X-ray diffraction intensity from a (220) plane at the sheet surface; |(220) represents an X-ray diffraction intensity from a (200) plane at the sheet surface; and A (μm) represents a crystalline grain size, and which has good bending property.
TW094117169A 2004-05-27 2005-05-26 Copper alloy TWI371499B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004158197 2004-05-27
JP2004158181 2004-05-27
JP2004328177A JP4809602B2 (en) 2004-05-27 2004-11-11 Copper alloy

Publications (2)

Publication Number Publication Date
TW200604354A true TW200604354A (en) 2006-02-01
TWI371499B TWI371499B (en) 2012-09-01

Family

ID=35423904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117169A TWI371499B (en) 2004-05-27 2005-05-26 Copper alloy

Country Status (8)

Country Link
US (1) US20050263218A1 (en)
JP (1) JP4809602B2 (en)
KR (1) KR100929276B1 (en)
CN (1) CN100462460C (en)
DE (1) DE112005001197B4 (en)
MY (1) MY142123A (en)
TW (1) TWI371499B (en)
WO (1) WO2005116282A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447240B (en) * 2010-12-13 2014-08-01 Jx Nippon Mining & Metals Corp Cu-Ni-Si-Co based copper alloy for electronic materials and method of manufacturing the same

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2426225B1 (en) * 2006-05-26 2015-12-02 Kabushiki Kaisha Kobe Seiko Sho Copper alloy with high strength, high electrical conductivity, and excellent bendability
JP5170864B2 (en) * 2006-09-13 2013-03-27 古河電気工業株式会社 Copper-based precipitation type alloy sheet for contact material and method for producing the same
JP5156317B2 (en) * 2006-09-27 2013-03-06 Dowaメタルテック株式会社 Copper alloy sheet and manufacturing method thereof
US9034123B2 (en) 2007-02-13 2015-05-19 Dowa Metaltech Co., Ltd. Cu—Ni—Si-based copper alloy sheet material and method of manufacturing same
JP5170881B2 (en) * 2007-03-26 2013-03-27 古河電気工業株式会社 Copper alloy material for electrical and electronic equipment and method for producing the same
RU2413021C1 (en) * 2007-09-28 2011-02-27 Джей Экс Ниппон Майнинг Энд Метлз Корпорейшн COPPER ALLOY Cu-Si-Co FOR MATERIALS OF ELECTRONIC TECHOLOGY AND PROCEDURE FOR ITS PRODUCTION
CN101842506B (en) * 2007-11-01 2012-08-22 古河电气工业株式会社 Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same
EP2221391B1 (en) * 2007-11-05 2014-04-30 The Furukawa Electric Co., Ltd. Copper alloy sheet
CN101946014A (en) * 2008-02-18 2011-01-12 古河电气工业株式会社 Copper alloy material
JP5854574B2 (en) * 2008-03-12 2016-02-09 古河電気工業株式会社 Metal materials for electrical contact parts
JP4653239B2 (en) * 2008-03-31 2011-03-16 古河電気工業株式会社 Copper alloy materials and electrical / electronic parts for electrical / electronic equipment
EP2270242B1 (en) * 2008-03-31 2014-06-04 The Furukawa Electric Co., Ltd. Copper alloy material for electric or electronic apparatuses, method for producing it and component
CN102105610B (en) 2008-06-03 2013-05-29 古河电气工业株式会社 Copper alloy sheet material and manufacturing method thereof
CN102197151B (en) 2008-10-22 2013-09-11 古河电气工业株式会社 Copper alloy material, electric and electronic parts, and copper alloy material manufacturing method
JP5261161B2 (en) * 2008-12-12 2013-08-14 Jx日鉱日石金属株式会社 Ni-Si-Co-based copper alloy and method for producing the same
JP4563495B1 (en) 2009-04-27 2010-10-13 Dowaメタルテック株式会社 Copper alloy sheet and manufacturing method thereof
JP4948678B2 (en) 2009-12-02 2012-06-06 古河電気工業株式会社 Copper alloy sheet, connector using the same, and copper alloy sheet manufacturing method for manufacturing the same
KR101747475B1 (en) 2009-12-02 2017-06-14 후루카와 덴키 고교 가부시키가이샤 Copper alloy sheet and process for producing same
EP2508635B1 (en) 2009-12-02 2017-08-23 Furukawa Electric Co., Ltd. Copper alloy sheet and process for producing same
EP2610359A4 (en) 2010-08-27 2017-08-02 Furukawa Electric Co., Ltd. Copper alloy sheet and method for producing same
KR20150143893A (en) 2010-08-31 2015-12-23 후루카와 덴키 고교 가부시키가이샤 Copper alloy sheet material
WO2012150702A1 (en) 2011-05-02 2012-11-08 古河電気工業株式会社 Copper alloy sheet material and process for producing same
WO2012160684A1 (en) * 2011-05-25 2012-11-29 三菱伸銅株式会社 Cu-ni-si copper alloy sheet with excellent deep drawability and process for producing same
JP6111028B2 (en) * 2012-03-26 2017-04-05 Jx金属株式会社 Corson alloy and manufacturing method thereof
CN103014410B (en) * 2012-12-24 2015-03-11 山西春雷铜材有限责任公司 Copper alloy and fabrication method thereof
JP6696720B2 (en) * 2013-07-11 2020-05-20 古河電気工業株式会社 Copper alloy sheet and method for producing the same
CN104032245B (en) * 2014-06-06 2016-03-30 中国科学院金属研究所 A kind of Ultra-fine Grained high-performance CuCrNiSi alloy slot wedge preparation technology
JP6440760B2 (en) * 2017-03-21 2018-12-19 Jx金属株式会社 Copper alloy strip with improved dimensional accuracy after press working
DE112018002665T5 (en) * 2017-05-25 2020-02-27 Sumitomo Electric Industries, Ltd. Inclined coil spring and connecting element
CN117512395B (en) * 2024-01-04 2024-03-29 宁波兴业盛泰集团有限公司 High-strength middle-conductive copper nickel silicon tin phosphorus alloy strip foil and preparation method thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4016010A (en) * 1976-02-06 1977-04-05 Olin Corporation Preparation of high strength copper base alloy
US4110132A (en) * 1976-09-29 1978-08-29 Olin Corporation Improved copper base alloys
JPS57206540A (en) * 1981-06-12 1982-12-17 Nippon Gakki Seizo Kk Manufacture of parts for spectacle frame
US4594221A (en) * 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
DE4115998C2 (en) * 1991-05-16 1999-02-25 Diehl Stiftung & Co Process for the production of copper alloys
JP3056394B2 (en) * 1995-05-25 2000-06-26 株式会社神戸製鋼所 Copper alloy excellent in solder adhesion and plating properties and easy to clean, and method for producing the same
JP3800269B2 (en) * 1997-07-23 2006-07-26 株式会社神戸製鋼所 High strength copper alloy with excellent stamping workability and silver plating
JP3797786B2 (en) * 1998-03-06 2006-07-19 株式会社神戸製鋼所 Copper alloy for electrical and electronic parts
JP3739214B2 (en) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 Copper alloy sheet for electronic parts
JP2000080428A (en) * 1998-08-31 2000-03-21 Kobe Steel Ltd Copper alloy sheet excellent in bendability
JP3800279B2 (en) * 1998-08-31 2006-07-26 株式会社神戸製鋼所 Copper alloy sheet with excellent press punchability
JP3520046B2 (en) * 2000-12-15 2004-04-19 古河電気工業株式会社 High strength copper alloy
JP4729680B2 (en) * 2000-12-18 2011-07-20 Dowaメタルテック株式会社 Copper-based alloy with excellent press punchability
KR100513943B1 (en) * 2001-03-27 2005-09-09 닛꼬 긴조꾸 가꼬 가부시키가이샤 Copper and copper alloy, and method for production of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447240B (en) * 2010-12-13 2014-08-01 Jx Nippon Mining & Metals Corp Cu-Ni-Si-Co based copper alloy for electronic materials and method of manufacturing the same

Also Published As

Publication number Publication date
DE112005001197B4 (en) 2016-11-03
TWI371499B (en) 2012-09-01
CN100462460C (en) 2009-02-18
CN1950525A (en) 2007-04-18
KR20070018092A (en) 2007-02-13
US20050263218A1 (en) 2005-12-01
JP2006009137A (en) 2006-01-12
KR100929276B1 (en) 2009-11-27
JP4809602B2 (en) 2011-11-09
DE112005001197T5 (en) 2007-04-19
WO2005116282A1 (en) 2005-12-08
MY142123A (en) 2010-09-15

Similar Documents

Publication Publication Date Title
TW200604354A (en) Copper alloy
WO2008099892A1 (en) Copper alloy sheet for electrical and electronic parts excelling in strength and formability
EP1997920A3 (en) Copper alloy for electric and electronic equipments
MY144826A (en) Copper alloy strip material for electrical or electronic part and method for manufacturing the same
WO2002008479A1 (en) Copper alloy material for electronic or electric equipment parts
EP2088214A4 (en) Copper alloy plate for electrical and electronic components
TW200602502A (en) Copper alloy
ATE491818T1 (en) COPPER ALLOY FOR ELECTRICAL AND ELECTRONIC DEVICES
DE602008001515D1 (en) Cu-Ni-Si based copper alloy foil material and manufacturing method therefor
WO2008114587A1 (en) Aluminum alloy material and aluminum alloy brazing sheet
EP2426225A3 (en) Copper alloy with high strength, high electrical conductivity, and excellent bendability
TW200611985A (en) Copper-zinc-silicon alloy, its use and its production
HK1088932A1 (en) Copper-based alloy
TW200506105A (en) Improved tin plating method
TW200706660A (en) Copper alloy having high strength and superior bending workability, and method for manufacturing copper alloy plates
EP2578707A4 (en) Copper-based alloy and structural material comprising same
MY151333A (en) Silver plating in electronics manufacture.
AR056755A1 (en) COPPER ALLOY - ZINC AND SYNCHRONIZATION RING MANUFACTURED OF SUCH ALLOY
WO2011152617A3 (en) Aluminum alloy, and aluminum alloy casting
CA2458723A1 (en) A lead-free copper alloy and its use
TW200802711A (en) Method and structure for reducing contact resistance between silicide contact and overlying metallization
TW200632114A (en) Titanium copper alloy having excellent punchability
ATE523608T1 (en) USE OF A COPPER-NICKEL-TIN ALLOY
TWI263685B (en) Copper alloy with high strength and high conductivity
WO2008105066A1 (en) Aluminum alloy material for thermal conduction