CN103014410B - Copper alloy and fabrication method thereof - Google Patents
Copper alloy and fabrication method thereof Download PDFInfo
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- CN103014410B CN103014410B CN201210563839.7A CN201210563839A CN103014410B CN 103014410 B CN103014410 B CN 103014410B CN 201210563839 A CN201210563839 A CN 201210563839A CN 103014410 B CN103014410 B CN 103014410B
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title abstract description 9
- 238000000137 annealing Methods 0.000 claims abstract description 32
- 238000005098 hot rolling Methods 0.000 claims abstract description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000005266 casting Methods 0.000 claims abstract description 27
- 238000005097 cold rolling Methods 0.000 claims abstract description 27
- 238000003801 milling Methods 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 31
- 238000005096 rolling process Methods 0.000 claims description 22
- 239000006104 solid solution Substances 0.000 claims description 12
- 238000003723 Smelting Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000004615 ingredient Substances 0.000 claims description 7
- 230000002441 reversible effect Effects 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 241000784732 Lycaena phlaeas Species 0.000 claims description 3
- 239000003610 charcoal Substances 0.000 claims description 3
- 238000009749 continuous casting Methods 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 3
- 230000006698 induction Effects 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 238000010183 spectrum analysis Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000005070 sampling Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-NJFSPNSNSA-N silicon-30 atom Chemical compound [30Si] XUIMIQQOPSSXEZ-NJFSPNSNSA-N 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 13
- 239000000956 alloy Substances 0.000 abstract description 11
- 239000012535 impurity Substances 0.000 abstract description 9
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 229910052793 cadmium Inorganic materials 0.000 abstract description 7
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011701 zinc Substances 0.000 abstract description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052742 iron Inorganic materials 0.000 abstract description 6
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 abstract description 6
- 229910052725 zinc Inorganic materials 0.000 abstract description 6
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 abstract description 5
- 229910001092 metal group alloy Inorganic materials 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000011572 manganese Substances 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- 229910017824 Cu—Fe—P Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000008570 general process Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229910002975 Cd Pb Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003034 coal gas Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- -1 copper-nickel-disilicon Chemical compound 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to the field of a metal alloy, in particular to a Cu-Ni-Si alloy. A fabrication method of a copper alloy comprises the steps as follows: A) casting, B) hot rolling, C) face milling and D) cold rolling and annealing. The copper alloy comprises the following chemical components by mass percent: 1.8-2.1% of nickel, 0.4-0.68% of silicon, 0-0.2% of iron, 0-0.1% of manganese, 0-0.2% of zinc, 0-0.005% of cadmium, 0-0.02% of lead, 0-0.3% of other impurities and the balance of cooper, wherein iron, manganese, zinc, cadmium and lead are all impurities; the tensile strength Rm of the copper alloy is greater than or equal to 600MPa; the broken elongation A11.3 is greater than or equal to 8%; the Vickers hardness HV is greater than or equal to 180; and the electrical conductivity is greater than or equal to 46% IACS (International Annealed Copper Standard). The ideal performance of a copper alloy material for a lead frame can be obtained by the fabrication method for the copper alloy.
Description
Technical Field
The invention relates to the field of metal alloys, in particular to a Cu-Ni-Si alloy.
Background
With the rapid development of electronic chips, the requirements on the tensile strength, hardness and other properties of copper alloy materials used for lead frames of chips are higher and higher, and the tensile strength Rm of the ideal copper alloy for lead frames expected at present is more than or equal to 600MPa, the elongation percentage A11.3 after fracture is more than or equal to 8 percent, and the Vickers hardness HV is more than or equal to 180 (Vickers hardness value, no unit).
At present, the main materials used for lead frames in China are Cu-Fe-P alloy (C19400, C19210) and Cu-Ni-Si alloy (C7025). The problems of the existing copper alloy for the lead frame are as follows: 1. the tensile strength of the existing Cu-Fe-P alloy products (C19400, C19210) is 420-500 MPa, and the technical requirements of high-grade lead frames cannot be met. 2. When part of alloy is punched, the material extension is low, the plasticity is poor, the forming is not easy, and the risk of cracking and large residual stress exists during punching. 3. The die bears a large load during stamping and is easy to damage. 4. The existing Cu-Ni-Si alloy (C7025) has higher nickel content, higher casting hot rolling production difficulty, lower yield and overhigh material cost.
Disclosure of Invention
Therefore, an object of the present invention is to provide a copper alloy and a method for preparing the same, which satisfy the requirements for characteristics of a copper alloy for lead frames.
A method of making a copper alloy, comprising: A) casting, B) hot rolling, C) surface milling and D) cold rolling and annealing; wherein,
A) casting:
a1, ingredient smelting: adding 1.8-2.1% of nickel, 0.4-0.68% of silicon and the balance of standard electrolytic copper according to the mass ratio, and smelting at 1250-1280 ℃;
a2, chemical analysis: sampling, fully stirring, performing reverse mold forming, and performing spectral analysis;
a3, casting: the casting temperature is 1250-1280 ℃, a graphite inner sleeve crystallizer is used for carrying out primary cooling and a copper alloy secondary cooling device is used for carrying out secondary water cooling, semi-continuous casting is carried out, the casting speed is controlled to be 3.8-4.0 m/h, and the strength of the secondary water cooling is 80% of that of the common copper alloy;
B) hot rolling:
carrying out primary solid solution to obtain a solid solution, heating the solid solution at 900-920 ℃, then carrying out hot rolling in multiple passes, controlling the initial rolling temperature at 900-920 ℃, controlling the final rolling temperature at 800-850 ℃, carrying out rapid on-line water cooling after the last hot rolling, wherein the cooling speed is not less than 10 ℃/s;
C) a surface milling step:
milling to remove surface oxide skin;
D) cold rolling and annealing steps:
the total processing rate of the first cold rolling is 80-90%, and the annealing temperature is 460-500 ℃;
the total working rate of the second cold rolling is 70-75%, and the annealing temperature is 350-400 ℃;
the total reduction rate of the third cold rolling is 60-65%, and the annealing temperature is 260-300 ℃;
the total reduction rate of the fourth cold rolling is 50-55%, and annealing is not needed after the fourth cold rolling;
the total cold rolling processing rate is defined as the percentage value of the thickness difference of the copper strip before and after rolling and the thickness of the copper strip before rolling.
Further, the smelting in the step A) of fusion casting adopts a power frequency cored induction furnace.
Further, the adding time of the ingredients in the step A) of fusion casting is as follows: adding nickel when the melting temperature is raised to the highest temperature, and adding silicon 30 minutes before discharging; the charcoal covering thickness is controlled to be 150-200 mm.
Further, the hot rolling in the step B) is carried out in five passes, and the hot rolling processing rates are respectively as follows: 18%, 22%, 23%, 20%, 15%; wherein the hot rolling processing rate is defined as the percentage value of the difference between the inlet thickness and the outlet thickness and the inlet thickness of each pass.
Further, the hot rolling in the step B) of hot rolling is carried out by using a two-roll reversible hot rolling mill.
Further, the milling in the step B) of milling the surface is carried out by adopting double-sided milling equipment, and the vertical milling thickness is controlled to be 0.8-1.0 mm.
Further, each time of the D) four cold rolling and annealing steps is treated by acid cleaning.
The copper alloy prepared by the preparation method comprises the following chemical components in parts by mass: 1.8-2.1% of nickel, 0.4-0.68% of silicon, 0-0.2% of iron, 0-0.1% of manganese, 0-0.2% of zinc, 0-0.005% of cadmium and 0-0.02% of lead, wherein the iron, the manganese, the zinc, the cadmium and the lead are impurity components, and 0-0.3% of other impurities and the balance of copper; the tensile strength Rm of the copper alloy is more than or equal to 600MPa, the elongation A11.3 after fracture is more than or equal to 8 percent, the Vickers hardness HV is more than or equal to 180 percent, and the electric conductivity is more than or equal to 46 percent IACS.
The copper alloy preparation method of the invention mainly reduces the material cost by reducing the chemical components of Ni and Si in the ingredients, improves the casting quality by improving the casting process, reduces the defects of loose pores and the like of the product, adopts multiple annealing procedures in the production process, and eliminates the work hardening, thereby obtaining the ideal performance of the copper alloy material for the lead frame.
Detailed Description
The invention will now be further described with reference to specific embodiments. In this embodiment, in addition to the necessary steps and processes, additional steps and processes are performed according to the production of a copper alloy for a lead frame which is more preferable, and these steps and processes are not essential steps for implementing this embodiment. Meanwhile, this example is for the purpose of producing a copper alloy sheet for lead frames of a size for the purpose of illustration of the distance. Those skilled in the art who practice the present invention will be able to convert the dimensions to specific dimensions based on the specific dimensions and processing rates disclosed herein.
An embodiment of a method of making a copper alloy, comprising: A) casting, B) hot rolling, C) surface milling and D) four-pass cold rolling and annealing. Wherein:
A) casting:
a1, ingredient smelting: adding 1.8-2.1% of nickel (Ni), 0.4-0.68% of silicon (Si) and the balance of standard electrolytic copper (copper with high purity) (Cu) according to the mass ratio, and smelting at 1250-1280 ℃. Preferably, a power frequency cored induction furnace is adopted for smelting in furnace type selection according to the melting point and the oxidation consumption characteristics of the main additive elements, the adding time of the main additive elements is determined, nickel is added when the smelting temperature is increased to the highest temperature due to the high melting point of the nickel elements, silicon is added 30 minutes before the molten liquid is discharged due to the easy oxidation consumption characteristics of the silicon elements, and meanwhile, the covering thickness of charcoal on the surface is controlled to be 150-200 mm, so that the outward diffusion and evaporation of the high-temperature molten liquid are prevented, and the inward diffusion of oxygen is also prevented;
a2, chemical analysis: taking a sample from the smelting furnace, after fully stirring, taking out high-temperature copper water by using a crucible, pouring the high-temperature copper water into a graphite mold for cooling and forming, turning to remove a bottom oxide layer after cooling and forming, carrying out spectral analysis by a spectrum analyzer, and using the standard sample as a standard copper-nickel-disilicon standard sample. It should be noted that, in the actual production, common impurity components such as iron (Fe), manganese (Mn), zinc (Zn), cadmium (Cd), lead (Pb), and the like and other impurity components are inevitably introduced, and the qualified product is obtained as long as the composition table listed in the following table is met;
table 1: chemical composition (% by mass)
| Cu | Ni | Si | Fe | Mn | Zn | Cd | Pb | The rest impurities |
| Balance of | 1.8～2.1 | 0.4～0.68 | ≤0.2 | ≤0.1 | ≤0.2 | ≤0.005 | ≤0.02 | ≤0.3 |
a3, casting: the casting temperature is 1250-1280 ℃, a graphite inner sleeve crystallizer is used for carrying out primary cooling and a copper alloy secondary cooling device is used for carrying out secondary water cooling, semi-continuous casting is carried out, wherein the strength of the secondary water cooling is 80% of the water cooling strength of the common copper alloy, the specification of the cast ingot casted in the embodiment is 150 multiplied by 300 multiplied by 6000 (unit: mm), the casting speed is controlled to be 3.8-4.0 m/h, the red ingot casting is realized by twice cooling, the internal stress of the cast ingot is reduced, and a compact and uniform casting structure is obtained;
B) hot rolling:
carrying out primary solid solution to obtain a uniform solid solution, wherein the heating temperature of the solid solution is 900-920 ℃, a coal gas continuous heating furnace is preferably adopted, the temperature rise time is preferably 3 hours, and the heat preservation time is preferably 3 hours; and then carrying out hot rolling in multiple passes, wherein the initial rolling temperature is 900-920 ℃, the final rolling temperature is controlled at 800-850 ℃, the online water cooling is carried out quickly after the last hot rolling pass, and the cooling speed is not less than 10 ℃/s. Preferably, a two-roll reversible hot rolling mill is adopted, an online cooling device is arranged above and below the hot rolling rail to perform the processing treatment of the step, and after hot rolling is performed for multiple times, high-temperature rapid cooling is performed. The hot rolling passes are determined according to specific processing sizes. In this example, the ingot having the above-mentioned specification of 150X 300X 6000 (unit: mm) was reversibly rolled in five passes, and the hot rolling reduction (hot rolling reduction defined as the ratio of the difference between the inlet thickness and the outlet thickness to the inlet thickness per pass) was: 18%, 22%, 23%, 20%, 15%; i.e. according to the following thickness value variations: 150mm- >110mm- >60mm- >32mm- >19mm- >16 mm. And (3) rolling the copper alloy sheet with the thickness of 16mm in the last step, opening an online cooling device when the temperature of the copper alloy sheet still reaches 800-850 ℃ after the copper alloy sheet is discharged from the roller, and directly performing online water cooling on the strip blank at the cooling speed of not less than 10 ℃/S to realize rapid cooling at high temperature. According to the requirement of producing the copper alloy sheet for the lead frame, directly performing hollow rolling after cooling;
C) a surface milling step:
milling to remove surface oxide skin; preferably, milling is carried out by adopting double-sided milling equipment, the vertical milling thickness is controlled to be 0.8-1.0 mm, and residual oxide skin and obvious tool marks cannot be obtained; in the examples, the thickness of the copper alloy sheet for lead frames after hot rolling treatment was 16mm, and the thickness after milling was 14 mm＋0.5mm；
D) Four cold rolling and annealing steps:
the total cold rolling processing rate (the total cold rolling processing rate is defined as the percentage value of the thickness difference of the sheet before and after rolling and the thickness of the copper strip before rolling, the same below) of the first cold rolling is 80-90%, and the annealing temperature is 460-500 ℃; in the embodiment, 14 is＋0.5A copper alloy sheet (generally a copper strip) with the thickness of mm for a lead frame is subjected to rough rolling for the first pass and rolled to the thickness of 1.8-2.2 mm, and the optimal thickness is 2 mm; the annealing condition is carried out according to a common process, but preferably, the annealing condition is that the temperature is increased for 3-5 hours, and the heat preservation is carried out for 6-8 hours, so that the characteristics of the copper alloy are betterIt is preferred. Preferably, the annealed layer is also subjected to conventional acid cleaning to remove the oxide layer.
The secondary cold rolling rate is 70-75%, and the annealing temperature is 350-400 ℃; in the embodiment, a copper alloy sheet for a lead frame with the thickness of 1.8-2.2 mm after rough rolling is rolled again to the thickness of 0.6-0.8 m, preferably 0.7mm in a second pass; the annealing condition is performed according to a general process, but preferably, the annealing condition is that the temperature is raised for 3-5 hours, and the heat preservation is performed for 6-8 hours, so that the characteristics of the copper alloy are better. Preferably, the annealed layer is also subjected to conventional acid cleaning to remove the oxide layer. Preferably, the sheet for producing a lead frame is further subjected to edge cutting and annealing after the second pass of rolling, as required for producing the copper alloy sheet.
The third cold rolling reduction rate is 60-65%, and the annealing temperature is 260-300 ℃; in the embodiment, a copper alloy sheet for a lead frame with the thickness of 0.6-0.8 mm after re-rolling is pre-rolled to the thickness of 0.18-0.23 m, preferably 0.21mm in a third pass; the annealing condition is performed according to a general process, but preferably, the annealing condition is an annealing condition of raising the temperature for 2 to 3 hours and keeping the temperature for 5 to 6 hours, so that the characteristics of the copper alloy are better. Preferably, the annealed layer is also subjected to conventional acid cleaning to remove the oxide layer. Preferably, the pre-rolling of the second pass is followed by rewinding and then annealing, as required for producing the copper alloy sheet for lead frames.
The fourth cold rolling reduction rate is 50% -55%, and annealing is not needed after rolling; in the embodiment, a pre-rolled copper alloy sheet for a lead frame with the thickness of 0.18-0.23 mm is rolled to the thickness of 0.10-0.15 m, preferably 0.11mm through the final rolling of the last pass, and the thickness meets the thickness standard of the final copper alloy sheet for the lead frame; preferably, the finished roll is also subjected to a conventional pickling, this time a finished pickling to remove the oxide layer again. Preferably, according to the requirement of producing the copper alloy sheet for the lead frame, the finished product is further subjected to straightening and withdrawal after being pickled so as to level the surface of the copper alloy sheet, and finally, the finished product is subjected to slitting and packaging, so that the whole production preparation of the copper alloy sheet for the lead frame is completed.
The production and preparation of the copper alloy of the invention are based on the theory of solid solution strengthening and precipitation strengthening: firstly, the ingredient components are optimized, and the chemical components of Ni and Si are reduced; secondly, secondary cooling is adopted during casting of the Cu-Ni-Si series alloy, and the cooling strength is not easy to be too high, so that the phenomenon that the cast ingot has cracks or a blank after casting cracks due to too high internal stress is avoided; at high temperature, Ni and Si exist in copper in the form of solid solution, the solid solution solubility is rapidly reduced along with the reduction of the temperature of the blank, and Ni is used as the element2Si compound is precipitated in a form; and multiple annealing and rolling with different processing rates are adopted in the later stage, so that the expected performance improvement requirement is met.
The copper alloy prepared by the embodiment of the invention comprises the following chemical components in parts by mass: 1.8-2.1% of nickel, 0.4-0.68% of silicon, 0-0.2% of iron, 0-0.1% of manganese, 0-0.2% of zinc, 0-0.005% of cadmium and 0-0.02% of lead, wherein the iron, the manganese, the zinc, the cadmium and the lead are impurity components, 0-0.3% of other impurities and the balance of copper (meeting the requirement of the above table 1). Through characteristic tests, the tensile strength Rm of the copper alloy is more than or equal to 600MPa, the elongation percentage A11.3 after fracture is more than or equal to 8 percent, the Vickers hardness HV is more than or equal to 180, and the electric conductivity is more than or equal to 46 percent IACS, so that the expected ideal characteristic requirements of the copper alloy for the lead frame can be met.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A method of making a copper alloy, comprising: A) casting, B) hot rolling, C) surface milling and D) cold rolling and annealing; wherein,
A) casting:
a1, ingredient smelting: adding 1.8-2.1% of nickel, 0.4-0.68% of silicon and the balance of standard electrolytic copper according to the mass ratio, and smelting at 1250-1280 ℃;
a2, chemical analysis: sampling, fully stirring, performing reverse mold forming, and performing spectral analysis;
a3, casting: the casting temperature is 1250-1280 ℃, a graphite inner sleeve crystallizer is used for carrying out primary cooling and a copper alloy secondary cooling device is used for carrying out secondary water cooling, semi-continuous casting is carried out, the casting speed is controlled to be 3.8-4.0 m/h, and the strength of the secondary water cooling is 80% of that of the common copper alloy;
B) hot rolling:
carrying out primary solid solution to obtain a solid solution, heating the solid solution at 900-920 ℃, then carrying out hot rolling in multiple passes, controlling the initial rolling temperature at 900-920 ℃, controlling the final rolling temperature at 800-850 ℃, carrying out rapid on-line water cooling after the last hot rolling, wherein the cooling speed is not less than 10 ℃/s;
C) a surface milling step:
milling to remove surface oxide skin;
D) cold rolling and annealing steps:
the total processing rate of the first cold rolling is 80-90%, and the annealing temperature is 460-500 ℃;
the total working rate of the second cold rolling is 70-75%, and the annealing temperature is 350-400 ℃;
the total reduction rate of the third cold rolling is 60-65%, and the annealing temperature is 260-300 ℃;
the total reduction rate of the fourth cold rolling is 50-55%, and annealing is not needed after the fourth cold rolling;
the total cold rolling reduction ratio is defined as the percentage value of the thickness difference of the sheet before and after rolling and the thickness of the copper strip before rolling.
2. The method for producing a copper alloy according to claim 1, characterized in that: the smelting in the step A) of fusion casting is to adopt a power frequency cored induction furnace.
3. The method for producing a copper alloy according to claim 1, characterized in that: the adding time of the ingredients in the step A) of casting is as follows: adding nickel when the melting temperature is raised to the highest temperature, and adding silicon 30 minutes before discharging; the charcoal covering thickness is controlled to be 150-200 mm.
4. The method for producing a copper alloy according to claim 1, characterized in that: the hot rolling in the step B) is carried out in five passes, and the hot rolling processing rates are respectively as follows: 18%, 22%, 23%, 20%, 15%; wherein the hot rolling processing rate is defined as the percentage value of the difference between the inlet thickness and the outlet thickness and the inlet thickness of each pass.
5. The method for producing a copper alloy according to claim 1, characterized in that: the hot rolling in the step B) is carried out by adopting a two-roller reversible hot rolling mill.
6. The method for producing a copper alloy according to claim 1, characterized in that: and C) milling in the surface milling step is carried out by adopting double-sided milling equipment, and the vertical milling thickness is controlled to be 0.8-1.0 mm.
7. The method for producing a copper alloy according to claim 1, characterized in that: and D) pickling is carried out after each pass of treatment in the cold rolling and annealing steps.
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| CN114752810B (en) * | 2022-03-24 | 2023-04-11 | 江苏恒盈电子科技有限公司 | High-strength semiconductor lead frame for circuit board and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1540013A (en) * | 2003-04-18 | 2004-10-27 | 日矿金属加工株式会社 | Cu-Ni-Si alloy and its mfg. method |
| CN1950525A (en) * | 2004-05-27 | 2007-04-18 | 古河电气工业株式会社 | Copper alloy |
| CN101225488A (en) * | 2008-01-15 | 2008-07-23 | 上海理工大学 | Copper alloy material for lead frame and preparation method thereof |
-
2012
- 2012-12-24 CN CN201210563839.7A patent/CN103014410B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1540013A (en) * | 2003-04-18 | 2004-10-27 | 日矿金属加工株式会社 | Cu-Ni-Si alloy and its mfg. method |
| CN1950525A (en) * | 2004-05-27 | 2007-04-18 | 古河电气工业株式会社 | Copper alloy |
| CN101225488A (en) * | 2008-01-15 | 2008-07-23 | 上海理工大学 | Copper alloy material for lead frame and preparation method thereof |
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