CN101225488A - Copper alloy material for lead frame and preparation method thereof - Google Patents
Copper alloy material for lead frame and preparation method thereof Download PDFInfo
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- CN101225488A CN101225488A CNA2008100172958A CN200810017295A CN101225488A CN 101225488 A CN101225488 A CN 101225488A CN A2008100172958 A CNA2008100172958 A CN A2008100172958A CN 200810017295 A CN200810017295 A CN 200810017295A CN 101225488 A CN101225488 A CN 101225488A
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Abstract
The invention relates to a copper alloy material used for lead frame and the preparation method, belonging to the copper alloy material field; wherein nickel accounts for 0.9 to 3.5% (weight percentage), silicon accounts for 0.18 to 0.8%, phosphorus accounts for 0.02 to 0.1% and the rest is copper. The preparation method is that all the components according to the weight ratio are mixed and melted, after casting, hot forging, solid solution, multiple cold rolling, deformation and aging, the product is got. The copper alloy material used for lead frame has the advantages of tensile strength of 600 to 850MPa, conductivity of 45 to 65%IACS, elongation of 5 to 8% and softening temperature of 500 to 550 centigrade; thereby the requirements on the copper alloy material performance of the lead frame in electronic industrial field is well achieved; the copper alloy material can also be used in the copper alloy material field needing high strength and high conductive, such as contact lines in trolleys and electric locomotives, rotor bars of the high-speed turbine generator and inner liners of the large thrust rocket engines.
Description
Technical field
The present invention relates to the Cu alloy material field, particularly a kind of copper alloy material for lead frame and preparation method thereof.
Background technology
Unicircuit is the basis and the core of electronics and information industry, and blaster fuse frame material is one of main raw of unicircuit encapsulation.Along with unicircuit to extensive and ultra-large developing rapidly, the over-all properties of blaster fuse frame material is had higher requirement, each country researches and develops also pay attention to day by day to it.
Present existing copper base blaster fuse frame material mainly contains CuNiSi system, CuFe system, CuFeP system, CuCrZr system, CuAg system etc., uses more CuFeP, CuNiSi and the CuCrZr series etc. of mainly containing.The scope of the enterprise of domestic production copper alloy for lead-wire frame band is little, description is few, only limits to 3 trade mark: KFC (the Japanese trade mark, i.e. C19210), C194 and the C1220 (U.S.'s trade mark) of Cu-Fe-P alloy, and quality and precision are not high.
Both at home and abroad with regard to the blaster fuse frame material application many patents, all relate to the lead frame copper alloy as Chinese patent or patent application 03149849.3,03149851.5,200310119001.X, 200410016268.0,02148648.4 etc., but mostly be that relevant CuCrZr system and CuFeP are alloy.And the document that relates to CuNiSi series copper alloy material is less, and U.S. Pat 5846346 is to add Sn to improve its intensity on the basis of CuNiSi; Japan relates to the CuNiSi series copper alloy at the patent application 200510065789.X of China, and its characteristics are to add more than one among Zn, Mg, Sn and the In, to improve its over-all properties; Chinese patent literature CN1477220A (number of patent application is 03149851.5) also relates to the CuNiSi series copper alloy, and its characteristics are to add mishmetal, but its over-all properties is relatively low.
Summary of the invention
The CuNiSi that the objective of the invention is to provide a kind of intensity and conductivity to take into account in addition is a copper alloy material for lead frame.
Another object of the present invention is to provide the preparation method of this copper alloy material for lead frame.
In order to realize first technical purpose of the present invention, its technical scheme is: a kind of copper alloy material for lead frame, it is characterized in that containing weight percent is 0.9～3.5% nickel, 0.18～0.8% silicon, 0.02～0.1% phosphorus, and all the other are copper.
A kind of optimization component of this technical scheme is, containing weight percent is 1.0～1.3% nickel, 0.18～0.23% silicon, 0.03～0.05% phosphorus, and all the other are copper.
The another kind of this technical scheme is optimized component, and containing weight percent is 1.8～2.3% nickel, 0.35～0.4% silicon, 0.04～0.06% phosphorus, and all the other are copper.
Another of this technical scheme optimized component, and containing weight percent is 3.0～3.2% nickel, 0.55～0.60% silicon, 0.04～0.06% phosphorus, and all the other are copper.
For realizing another technical purpose of the present invention, its technical scheme is: the preparation method of copper alloy material for lead frame comprises the steps:
(1) takes by weighing each component according to above-mentioned weight ratio, mix the back, inject mold after the fusion, form ingot casting 1200～1350 ℃ of following meltings;
(2) to the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 65～80%, obtains the forge hot material;
(3) the forge hot material is carried out solution treatment, its temperature is 850～940 ℃, and soaking time is 1～2h, and shrend then obtains cold material;
(4) to the pre-cold rolling processing of this cold material, deflection is 30～70%, obtains pre-cold rolling material;
(5) pre-cold rolling material is carried out the interrupted aging processing first time, aging temp is 450～500 ℃, soaking time is 1～4h, carry out deflection again and be 30～50% cold-rolling treatment, carry out the interrupted aging processing second time then, aging temp is 400～450 ℃, and soaking time is 1～4h, obtains the interrupted aging material;
(6) to the final cold-rolling treatment of interrupted aging material, deflection is 60～80%.
Because at CuNiSi is to introduce trace alloying element P among the copper alloy material for lead frame preparation method, when room temperature, the solubleness of P in copper is almost nil, can reduce the specific conductivity and the thermal conductivity of copper, but its mechanical property and welding property to copper has influence preferably, can also improve the flowability of copper alloy melt simultaneously, prevents hydrogen embrittlement, and in ag(e)ing process subsequently, P is with Ni
3The form of P is separated out, and is present in mutually in the Cu alloy material with second, and the specific conductivity influence of Cu alloy material is reduced relatively.Owing in component of the present invention, taken into full account the part by weight of Ni and Si, preferably be controlled between 4.0～4.5 again, can separate out compound N i to greatest extent like this
3P reduces Si, the P influence to copper matrix electroconductibility.
Therefore, utilize the intensity and the conductivity of preparation method's gained Cu alloy material of the present invention to have both, homogeneous microstructure, precipitated phase small and dispersed, softening temperature height, the alloy price is relatively low, its tensile strength reaches that 600～850MPa, specific conductivity reach 45～65%IACS, unit elongation reaches 5～8%, 450～500 ℃ of softening temperatures can satisfy in the electronics industry lead frame preferably to the performance requriements of Cu alloy material.
The specific embodiment mode
Embodiment 1: take by weighing 1.3% nickel, 0.23% silicon, 0.03% phosphorus according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 70%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 860 ℃, and soaking time is 1h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 70%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 450 ℃, soaking time is 2h, carry out deflection again and be 40% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 420 ℃, soaking time is 3h, obtains the interrupted aging material.To the final cold-rolling treatment of interrupted aging material, deflection is 70%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 625MPa, specific conductivity reaches 450 ℃ of 64%IACS, softening temperatures.
Embodiment 2: take by weighing 2.1% nickel, 0.4% silicon, 0.06% phosphorus according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 80%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 900 ℃, and soaking time is 1h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 45%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 450 ℃, soaking time is 2h, carry out deflection again and be 35% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 410 ℃, soaking time is 4h, obtains the interrupted aging material; To the final cold-rolling treatment of interrupted aging material, deflection is 75%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 730MPa, specific conductivity reaches 470 ℃ of 59%IACS, softening temperatures.
Embodiment 3: take by weighing 1.3% nickel, 0.23% silicon, 0.03% phosphorus according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 65%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 890 ℃, and soaking time is 1h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 60%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 450 ℃, soaking time is 2h, carry out deflection again and be 40% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 410 ℃, soaking time is 4h, obtains the interrupted aging material; To the final cold-rolling treatment of interrupted aging material, deflection is 60%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 840MPa, specific conductivity reaches 500 ℃ of 52%IACS, softening temperatures.
Embodiment 4: take by weighing 1.0% nickel, 0.18% silicon, 0.05% phosphorus according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 70%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 860 ℃, and soaking time is 2h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 60%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 480 ℃, soaking time is 1h, carry out deflection again and be 45% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 450 ℃, soaking time is 1h, obtains the interrupted aging material; To the final cold-rolling treatment of interrupted aging material, deflection is 60%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 610MPa, specific conductivity reaches 450 ℃ of 67%IACS, softening temperatures.
Embodiment 5: take by weighing 2.3% nickel, 0.35% silicon, 0.04% phosphorus according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 80%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 900 ℃, and soaking time is 2h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 40%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 460 ℃, soaking time is 3h, carrying out deflection is 45% cold-rolling treatment, carries out second time interrupted aging then and handles, and aging temp is 420 ℃, soaking time is 3h, obtains the interrupted aging material; To the final cold-rolling treatment of interrupted aging material, deflection is 70%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 750MPa, specific conductivity reaches 470 ℃ of 57%IACS, softening temperatures.
Embodiment 6: take by weighing 3.0% nickel, 0.55% silicon, 0.04% phosphorus according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 75%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 930 ℃, and soaking time is 2h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 45%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 480 ℃, soaking time is 2h, carry out deflection again and be 45% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 450 ℃, soaking time is 2h, obtains the interrupted aging material; To the final cold-rolling treatment of interrupted aging material, deflection is 60%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 840MPa, specific conductivity reaches 500 ℃ of 52%IACS, softening temperatures.
Cu alloy material technology of the present invention is simple, with low cost, and performance satisfies unicircuit encapsulation blaster fuse frame material.But protection scope of the present invention is not limited to the circuit lead frame field that is applied to, and rotor bar, high-thrust rocket liner that also can be used for osculatory, the large high-speed turbo-generator of electric car and electric locomotive etc. needs the Cu alloy material field of high-strength high conductivity.
Claims (6)
1. a copper alloy material for lead frame is characterized in that, containing weight percent is 0.9～3.5% nickel, 0.18～0.8% silicon, 0.02～0.1% phosphorus, and all the other are copper.
2. a kind of copper alloy material for lead frame according to claim 1 is characterized in that, containing weight percent is 1.0～1.3% nickel, 0.18～0.23% silicon, 0.03～0.05% phosphorus, and all the other are copper.
3. a kind of copper alloy material for lead frame according to claim 1 is characterized in that, containing weight percent is 1.9～2.2% nickel, 0.35～0.39% silicon, 0.04～0.06% phosphorus, and all the other are copper.
4. a kind of copper alloy material for lead frame according to claim 1 is characterized in that, containing weight percent is 3.0～3.2% nickel, 0.55～0.60% silicon, 0.04～0.06wt% phosphorus, and all the other are copper.
5. according to the preparation method of the arbitrary described copper alloy material for lead frame of claim 1～4, it is characterized in that, comprise the steps:
(1) takes by weighing each component according to above-mentioned weight ratio, mix the back, inject mold after the fusion, form ingot casting 1200～1350 ℃ of following meltings;
(2) to the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 65～80%, obtains the forge hot material;
(3) the forge hot material is carried out solution treatment, its temperature is 850～940 ℃, and soaking time is 1～2h, and shrend then obtains cold material;
(4) to the pre-cold rolling processing of this cold material, deflection is 30～70%, obtains pre-cold rolling material;
(5) pre-cold rolling material is carried out the interrupted aging processing first time, aging temp is 450～500 ℃, soaking time is 1～4h, carry out deflection again and be 30～50% cold-rolling treatment, carry out the interrupted aging processing second time then, aging temp is 400～450 ℃, and soaking time is 1～4h, obtains the interrupted aging material;
(6) to the final cold-rolling treatment of interrupted aging material, deflection is 60～80%.
6. the copper alloy material for lead frame that obtains of the preparation method of copper alloy material for lead frame according to claim 5, it is characterized in that its tensile strength is that 600～850MPa, specific conductivity are that 45～65%IACS, softening temperature are 450 ℃～500 ℃.
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| CN102021359A (en) * | 2010-11-03 | 2011-04-20 | 西安理工大学 | Cu-Ni-Si alloy with high Ni and Si content and preparation method thereof |
| CN103014410A (en) * | 2012-12-24 | 2013-04-03 | 山西春雷铜材有限责任公司 | Copper alloy and fabrication method thereof |
| CN103667774A (en) * | 2013-11-27 | 2014-03-26 | 余姚市士森铜材厂 | Preparation method of copper alloy semiconductor lead frame |
| CN103878551A (en) * | 2014-03-27 | 2014-06-25 | 上海理工大学 | Method for producing high-strength copper nickel silica lead frame material |
| CN105088008A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Microalloyed copper alloy frame strip and manufacturing method thereof |
| CN105088009A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Copper alloy frame strip and making method thereof |
| CN106166591A (en) * | 2016-06-30 | 2016-11-30 | 安徽省瑞杰锻造有限责任公司 | Chrome zirconium copper alloy Forging Technology |
| CN106399748A (en) * | 2016-10-05 | 2017-02-15 | 宁波兴业盛泰集团有限公司 | Novel copper-nickel-silicon system alloy material for lead frame and preparation method of novel copper-nickel-silicon system alloy material |
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| CN102021359A (en) * | 2010-11-03 | 2011-04-20 | 西安理工大学 | Cu-Ni-Si alloy with high Ni and Si content and preparation method thereof |
| CN103014410A (en) * | 2012-12-24 | 2013-04-03 | 山西春雷铜材有限责任公司 | Copper alloy and fabrication method thereof |
| CN103014410B (en) * | 2012-12-24 | 2015-03-11 | 山西春雷铜材有限责任公司 | Copper alloy and fabrication method thereof |
| CN103667774A (en) * | 2013-11-27 | 2014-03-26 | 余姚市士森铜材厂 | Preparation method of copper alloy semiconductor lead frame |
| CN103667774B (en) * | 2013-11-27 | 2016-08-17 | 余姚市士森铜材厂 | A kind of preparation method of Copper alloy semiconductor lead frame |
| CN103878551A (en) * | 2014-03-27 | 2014-06-25 | 上海理工大学 | Method for producing high-strength copper nickel silica lead frame material |
| CN105088008A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Microalloyed copper alloy frame strip and manufacturing method thereof |
| CN105088009A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Copper alloy frame strip and making method thereof |
| CN106166591A (en) * | 2016-06-30 | 2016-11-30 | 安徽省瑞杰锻造有限责任公司 | Chrome zirconium copper alloy Forging Technology |
| CN106399748A (en) * | 2016-10-05 | 2017-02-15 | 宁波兴业盛泰集团有限公司 | Novel copper-nickel-silicon system alloy material for lead frame and preparation method of novel copper-nickel-silicon system alloy material |
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| CN109735740A (en) * | 2019-01-31 | 2019-05-10 | 河南科技大学 | A kind of multiphase enhanced type electronic package material and preparation method thereof added with rare earth |
| CN109735740B (en) * | 2019-01-31 | 2020-07-17 | 河南科技大学 | Multiphase reinforced electronic packaging material added with rare earth and preparation method thereof |
| CN109735741B (en) * | 2019-01-31 | 2020-09-22 | 河南科技大学 | Multiphase reinforced copper alloy for electronic packaging and preparation method thereof |
| CN111440964A (en) * | 2020-06-01 | 2020-07-24 | 中南大学 | High-strength high-conductivity Cu-Fe alloy short-process preparation method |
| CN111440964B (en) * | 2020-06-01 | 2021-07-27 | 中南大学 | High-strength high-conductivity Cu-Fe alloy short-process preparation method |
| CN111778427A (en) * | 2020-06-16 | 2020-10-16 | 陕西斯瑞新材料股份有限公司 | Preparation method of CuNiSi alloy wire for electric connector |
| CN113373342A (en) * | 2021-05-28 | 2021-09-10 | 上海理工大学 | Preparation method of high-superelasticity CuAlMn shape memory alloy wire |
| CN113373342B (en) * | 2021-05-28 | 2022-07-22 | 上海理工大学 | Preparation method of high-superelasticity CuAlMn shape memory alloy wire |
| CN113969364A (en) * | 2021-09-10 | 2022-01-25 | 中南大学 | High-strength high-conductivity copper-niobium alloy and preparation method thereof |
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| CN115029581A (en) * | 2022-06-10 | 2022-09-09 | 中铁建电气化局集团轨道交通器材有限公司 | Silicon bronze forging and non-internal stress integrated forging and heat treatment method thereof |
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