CN103014410A - Copper alloy and fabrication method thereof - Google Patents
Copper alloy and fabrication method thereof Download PDFInfo
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Abstract
The invention relates to the field of a metal alloy, in particular to a Cu-Ni-Si alloy. A fabrication method of a copper alloy comprises the steps as follows: A) casting, B) hot rolling, C) face milling and D) cold rolling and annealing. The copper alloy comprises the following chemical components by mass percent: 1.8-2.1% of nickel, 0.4-0.68% of silicon, 0-0.2% of iron, 0-0.1% of manganese, 0-0.2% of zinc, 0-0.005% of cadmium, 0-0.02% of lead, 0-0.3% of other impurities and the balance of cooper, wherein iron, manganese, zinc, cadmium and lead are all impurities; the tensile strength Rm of the copper alloy is greater than or equal to 600MPa; the broken elongation A11.3 is greater than or equal to 8%; the Vickers hardness HV is greater than or equal to 180; and the electrical conductivity is greater than or equal to 46% IACS (International Annealed Copper Standard). The ideal performance of a copper alloy material for a lead frame can be obtained by the fabrication method for the copper alloy.
Description
Technical field
The present invention relates to the metal alloy field, relate in particular to Cu-Ni-Si and be associated gold.
Background technology
High speed development along with electronic chip, more and more higher to performance requriementss such as the tensile strength of the used Cu alloy material of lead frame of chip and hardness, at present the tensile strength Rm of desirable desirable copper alloy for lead-wire frame is 〉=600MPa, elongation after fracture A11.3 〉=8%, vickers hardness hv 〉=180(vickers hardness number is without unit).
At present, domestic main raw for lead frame is that Cu-Fe-P is associated gold (C19400, C19210) and Cu-Ni-Si is associated gold (C7025).The problem that existing copper alloy for lead-wire frame exists is: 1, to be associated the tensile strength of golden product (C19400, C19210) be 420～500MPa to existing Cu-Fe-P, do not reach the technical requirements of high-grade lead frame.2, material extends lowlyer during the alloy part punching press, and plasticity is poor, easy-formation, cracking and the large risk of unrelieved stress when having punching press.3, the load that mould bears during punching press is large, fragile mould.4, to be associated gold (C7025) higher because of nickel content for existing Cu-Ni-Si, and founding hot rolling production difficulty is larger, and good article rate is lower, and material cost is too high.
Summary of the invention
Therefore, the object of the present invention is to provide copper alloy and preparation method thereof, to satisfy the characteristic demand of desirable copper alloy for lead-wire frame.
The preparation method of one Albatra metal-comprises: A) founding, B) hot rolling, C) mill face and D) cold rolling and annealing steps; Wherein,
A) founding step:
A1, the batching melting: according to the nickel of mass ratio umber interpolation 1.8～2.1% and 0.4～0.68% silicon, and the standard electrolytic copper of surplus, carrying out melting, smelting temperature is 1250～1280 ℃;
A2, chemical analysis: sampling, reverse mould moulding after fully stirring, and carry out spectroscopic analysis;
A3, casting: casting temp is 1250～1280 ℃, and employing graphite inner sleeve crystallizer carries out the cooling first time and the copper alloy secondary cooling apparatus carries out the water-cooled second time, carry out semicontinuous casting, casting speed is controlled at 3.8～4.0 m/hs, and wherein the intensity of water-cooled is 80% of ordinary copper alloy water-cooled intensity for the second time;
B) hot-rolled step:
A solid solution obtains sosoloid, and Heating temperature is 900～920 ℃, then divides multi-pass to carry out hot rolling, and the breaking down temperature is 900～920 ℃, and finishing temperature is controlled at 800～850 ℃, fast online water-cooled after last passage hot rolling, and speed of cooling is not less than 10 ℃/second;
C) mill the face step:
Surface scale is removed in milling;
D) cold rolling and annealing steps:
Cold rolling general working rate is 80%-90% for the first time, and annealing temperature is 460～500 ℃;
Cold rolling general working rate is 70%-75% for the second time, and annealing temperature is 350～400 ℃;
Cold rolling general working rate is 60%-65% for the third time, and annealing temperature is 260～300 ℃;
The 4th time cold rolling general working rate is 50%-55%, need not annealing after rolling;
Above-mentioned cold rolling general working rate is defined as the percent value of rolling front and back copper strips thickness difference and rolling front copper strips thickness.
Further, described A) melting of founding step is to adopt commercial frequency cored induction furnace.
Further, described A) the batching interpolation of founding step is opportunity: add nickel when smelting temperature rises to the highest temperature, come out of the stove and added silicon in front 30 minutes; The charcoal cladding thickness is controlled at 150～200mm.
Further, described B) hot rolling of hot-rolled step is that minute five passages are carried out, and the hot rolling rate is respectively: 18%, 22%, 23%, 20%, 15%; Wherein, the hot rolling rate is defined as the poor percent value with inlet thickness of every time inlet thickness and exit thickness.
Further, described B) hot rolling of hot-rolled step is to adopt two roller reversible hot milling rolls to carry out.
The milling of further, described B) milling the face step is to adopt the Double Milling turning equipment to carry out, and up and down milling gauge control is at 0.8～1.0mm.
Further, all carry out pickling after described D) every time in four cold rolling and annealing steps processed.
A kind of through the prepared copper alloy of above-mentioned preparation method, the chemical composition of described copper alloy and mass ratio umber thereof are respectively: 1.8～2.1% nickel, 0.4～0.68% silicon, 0～0.2% iron, 0～0.1% manganese, 0～0.2% zinc, 0～0.005% cadmium, 0～0.02% lead, wherein iron, manganese, zinc, cadmium and lead are impurity component, and all the other impurity of 0～0.3%, surplus is copper; The tensile strength Rm of described copper alloy is 〉=600MPa elongation after fracture A11.3 〉=8%, vickers hardness hv 〉=180, electric conductivity 〉=46%IACS.
Process for producing copper alloy of the present invention is main by reducing Ni, Si chemical composition in batching, and the reduction material cost, improve by founding, improve casting quality, reduce the defectives such as product air holes is loose, production technique adopts repeatedly annealing operation, eliminates work hardening, thereby obtains desirable copper alloy material for lead frame performance.
Embodiment
Now the present invention is further described in conjunction with embodiment.Except steps necessary, operation, also carry out additional step, operation according to the better copper alloy for lead-wire frame of manufacture among this embodiment, it is not as the necessity step process of implementing this embodiment.Simultaneously, this embodiment is with the copper alloy for lead-wire frame sheet material of a kind of dimensions of a manufacture, the related usefulness that is of a size of the distance explanation.Actual enforcement those skilled in the art can and utilize disclosed working modulus to be converted into corresponding concrete size and process according to concrete size.
The preparation method's of one Albatra metal-embodiment comprises: A) founding, B) hot rolling, C) mill face and D) the cold rolling and annealing steps of four-pass.Wherein:
A) founding step:
A1, the batching melting: according to the nickel (Ni) of mass ratio umber interpolation 1.8～2.1% and 0.4～0.68% silicon (Si), and the standard electrolytic copper (copper that purity is very high) of surplus (Cu), carries out melting, and smelting temperature is 1250～1280 ℃.Preferably, we are according to main characteristic of adding element fusing point and oxidation consumption, select to adopt commercial frequency cored induction furnace to carry out melting in the type of furnace, determine simultaneously main interpolation opportunity of adding element, because of the fusing point of nickel element high, therefore add nickel when selecting smelting temperature to rise to the highest temperature, because of the characteristic of the easy oxidation consumption of element silicon, added silicon in front 30 minutes therefore come out of the stove, simultaneously the charcoal cladding thickness 150～200mm of control surface, to stop the outside diffusive evaporation of high temperature solution, can prevent that also block inwardly spreads;
A2, chemical analysis: take a sample in smelting furnace, after fully stirring, take out high temperature copper water with crucible and pour graphite mo(u)ld into cooling forming, car goes bottom oxidization layer behind the cooling forming, and carries out spectroscopic analysis by spectrum analyzer, uses standard specimen to be standard copper nickel two silicon standard specimens.Need to prove owing in the actual production, inevitably can introduce iron (Fe), manganese (Mn), zinc (Zn), cadmium (Cd) and plumbous common impurity components such as (Pb) and other impurity components, as long as meet following table ingredients listed table be qualified;
Table 1: chemical composition (quality %)
| Cu | Ni | Si | Fe | Mn | Zn | Cd | Pb | All the other impurity |
| Surplus | 1.8～2.1 | 0.4～0.68 | ≤0.2 | ≤0.1 | ≤0.2 | ≤0.005 | ≤0.02 | ≤0.3 |
A3, casting: casting temp is 1250～1280 ℃, and employing graphite inner sleeve crystallizer carries out the cooling first time and the copper alloy secondary cooling apparatus carries out the water-cooled second time, carry out semicontinuous casting, wherein the intensity of water-cooled is 80% of ordinary copper alloy water-cooled intensity for the second time, our the ingot casting specification of casting is 150 * 300 * 6000(unit among this embodiment: mm), casting speed is controlled at 3.8～4.0 m/hs, twice cooling realizes red ingot casting, reduce the ingot casting internal stress, obtained fine and close uniformly cast structure;
B) hot-rolled step:
A solid solution obtains the sosoloid of uniformity, and the Heating temperature of solid solution is 900～920 ℃, preferably adopts coal gas continuous heating furnace to carry out, and is preferred, 3 hours heating-up times, soaking time 3 hours; Then divide multi-pass to carry out hot rolling, the breaking down temperature is 900～920 ℃, and finishing temperature is controlled at 800～850 ℃, fast online water-cooled after last passage hot rolling, and speed of cooling is not less than 10 ℃/second.Here preferably adopt two roller reversible hot milling rolls, the hot rolling track is installed up and down the processing treatment that online refrigerating unit carries out this step, and after the process multi-pass carried out hot rolling, high temperature fast cooling got final product.The passage of hot rolling is decided according to concrete finish size.We are 150 * 300 * 6000(unit according to above-mentioned specification among this embodiment: the thickness of ingot casting mm) is 150mm, and minute five passages are carried out reversible rolling, and hot rolling rate (the hot rolling rate is defined as every time inlet thickness and exit thickness is poor and the percent value of inlet thickness) is respectively: 18%, 22%, 23%, 20%, 15%; Namely change according to following one-tenth-value thickness 1/10 and carry out: 150mm-110mm-60mm-32mm-19mm-16mm.The thickness of the rolling 16mm of last passage, after the copper alloy sheet material went out roll, temperature still reached 800～850 ℃ high temperature, opened the on-line cooling device, made-up belt direct-on-line water-cooled, speed of cooling is not less than the speed of cooling of 10 ℃/S, realizes the quick cooling under the high temperature.According to producing copper alloy for lead-wire frame sheet material needs, also directly carry out hollow clot after the cooling;
C) mill the face step:
Surface scale is removed in milling; Preferably, milling is to adopt the Double Milling turning equipment to carry out, and up and down milling gauge control is at 0.8～1.0mm, must not remaining oxide skin and obvious tool marks; Then the copper alloy for lead-wire frame sheet thickness after hot rolling is processed is 16mm among the embodiment, and then thickness is 14 after the milling
+ 0.5Mm;
D) four cold rolling and annealing steps:
Cold rolling general working rate (cold rolling general working rate is defined as the percent value of the poor and rolling front copper strips thickness of rolling front and back sheet thickness, and is lower same) is 80%-90% for the first time, and annealing temperature is 460～500 ℃; With 14 among the embodiment
+ 0.5It is 1.8～2.2mm that the thick copper alloy for lead-wire frame sheet material (being generally copper strips) of mm is rolling to thickness through the roughing of the first passage, best, be 2mm; Annealing conditions gets final product according to general technology, but preferred, and annealing is to heat up 3～5 hours, and the characteristic of copper alloy can be better when being incubated 6～8 hours annealing conditions.Preferably, annealed and also passed through conventional pickling, to remove zone of oxidation.
Cold processing ratio is 70%-75% for the second time, and annealing temperature is 350～400 ℃; Among the embodiment be the copper alloy for lead-wire frame sheet material that 1.8～2.2mm after the roughing is thick to be rolling to thickness through rerolling of the second passage be 0.6～0.8m, best, be 0.7mm; Annealing conditions gets final product according to general technology, but preferred, and annealing is to heat up 3～5 hours, and the characteristic of copper alloy can be better when being incubated 6～8 hours annealing conditions.Preferably, annealed and also passed through conventional pickling, to remove zone of oxidation.Preferably, according to producing copper alloy for lead-wire frame sheet material needs, also carry out again annealing after the cutting edge after the rerolling of the second passage.
Cold processing ratio is 60%-65% for the third time, and annealing temperature is 260～300 ℃; To be copper alloy for lead-wire frame sheet material that 0.6～0.8mm after rerolling is thick among the embodiment be rolling to thickness through the preformation of the 3rd passage is 0.18～0.23m, best, be 0.21mm; Annealing conditions gets final product according to general technology, but preferred, and annealing is to heat up 2～3 hours, and the characteristic of copper alloy can be better when being incubated 5～6 hours annealing conditions.Preferably, annealed and also passed through conventional pickling, to remove zone of oxidation.Preferably, according to producing copper alloy for lead-wire frame sheet material needs, after rolling, the preformation of the second passage also carries out annealing again after the rewinding.
The 4th time cold processing ratio is 50%-55%, need not annealing after rolling; To be the thick copper alloy for lead-wire frame sheet material of 0.18～0.23mm after preformation is rolled among the embodiment be rolling to thickness through the one-tenth of last passage is 0.10～0.15m, best, be 0.11mm, meet final copper alloy for lead-wire frame sheet thickness standard; Preferably, become to roll and also pass through conventional pickling, this time pickling is finished product acid-washing, again to remove zone of oxidation.Preferably, according to producing copper alloy for lead-wire frame sheet material needs, also carry out straightening after the finished product acid-washing with smooth copper alloy sheet material surface, at last again finished product itemize and packing are finished the whole manufacture of copper alloy for lead-wire frame sheet material.
The manufacture of copper alloy of the present invention is the theory according to solution strengthening and precipitation strength: at first optimized food ingredient, reduced Ni, Si chemical composition; Secondly, during this Cu-Ni-Si series alloy casting, adopt the secondary cooling, and cooling intensity is difficult for excessively, to avoid causing that internal stress is too large, causes ingot casting material base cracking after crackle or the casting to occur; Ni, Si element are present in the copper with the sosoloid form when high temperature, and along with the material base drop in temperature, sosoloid solubleness descends rapidly, and with Ni
2The Si compound form is separated out; Later stage takes repeatedly to anneal rolling with different working moduluses, reaches expection and improves performance requriements.
Chemical composition and the mass ratio umber thereof of the copper alloy of the above embodiment of the present invention preparation are respectively: 1.8～2.1% nickel, 0.4～0.68% silicon, 0～0.2% iron, 0～0.1% manganese, 0～0.2% zinc, 0～0.005% cadmium, 0～0.02% lead, wherein iron, manganese, zinc, cadmium and lead are impurity component, and all the other impurity of 0～0.3%, and surplus is copper (satisfying upper table 1).Through characteristic test, the tensile strength Rm of this copper alloy is 〉=600MPa, elongation after fracture A11.3 〉=8%, and vickers hardness hv 〉=180, electric conductivity 〉=46%IACS finishes the characteristic demand that can satisfy desirable desirable copper alloy for lead-wire frame.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.
Claims (8)
1. the preparation method of an Albatra metal-comprises: A) founding, B) hot rolling, C) mill face and D) cold rolling and annealing steps; Wherein,
A) founding step:
A1, the batching melting: according to the nickel of mass ratio umber interpolation 1.8～2.1% and 0.4～0.68% silicon, and the standard electrolytic copper of surplus, carrying out melting, smelting temperature is 1250～1280 ℃;
A2, chemical analysis: sampling, reverse mould moulding after fully stirring, and carry out spectroscopic analysis;
A3, casting: casting temp is 1250～1280 ℃, and employing graphite inner sleeve crystallizer carries out the cooling first time and the copper alloy secondary cooling apparatus carries out the water-cooled second time, carry out semicontinuous casting, casting speed is controlled at 3.8～4.0 m/hs, and wherein the intensity of water-cooled is 80% of ordinary copper alloy water-cooled intensity for the second time;
B) hot-rolled step:
A solid solution obtains sosoloid, and Heating temperature is 900～920 ℃, then divides multi-pass to carry out hot rolling, and the breaking down temperature is 900～920 ℃, and finishing temperature is controlled at 800～850 ℃, fast online water-cooled after last passage hot rolling, and speed of cooling is not less than 10 ℃/second;
C) mill the face step:
Surface scale is removed in milling;
D) cold rolling and annealing steps:
Cold rolling general working rate is 80%-90% for the first time, and annealing temperature is 460～500 ℃;
Cold rolling general working rate is 70%-75% for the second time, and annealing temperature is 350～400 ℃;
Cold rolling general working rate is 60%-65% for the third time, and annealing temperature is 260～300 ℃;
The 4th time cold rolling general working rate is 50%-55%, need not annealing after rolling;
Above-mentioned cold rolling general working rate is defined as the percent value of the poor and rolling front copper strips thickness of rolling front and back sheet thickness.
2. the preparation method of copper alloy according to claim 1 is characterized in that: described A) melting of founding step is to adopt commercial frequency cored induction furnace.
3. the preparation method of copper alloy according to claim 1, it is characterized in that: described A) the batching interpolation of founding step is opportunity: add nickel when smelting temperature rises to the highest temperature, come out of the stove and added silicon in front 30 minutes; The charcoal cladding thickness is controlled at 150～200mm.
4. the preparation method of copper alloy according to claim 1, it is characterized in that: described B) hot rolling of hot-rolled step is that minute five passages are carried out, and the hot rolling rate is respectively: 18%, 22%, 23%, 20%, 15%; Wherein, the hot rolling rate is defined as the poor percent value with inlet thickness of every time inlet thickness and exit thickness.
5. the preparation method of copper alloy according to claim 1 is characterized in that: described B) hot rolling of hot-rolled step is to adopt two roller reversible hot milling rolls to carry out.
6. the preparation method of copper alloy according to claim 1 is characterized in that: the milling of described B) milling the face step is to adopt the Double Milling turning equipment to carry out, and up and down milling gauge control is at 0.8～1.0mm.
7. the preparation method of copper alloy according to claim 1 is characterized in that: all carry out pickling after described D) every time in the cold rolling and annealing steps of four-pass processed.
8. one kind through the prepared copper alloy of the preparation method of the claims 1～7, it is characterized in that: the chemical composition of described copper alloy and mass ratio umber thereof are respectively: 1.8～2.1% nickel, 0.4～0.68% silicon, 0～0.2% iron, 0～0.1% manganese, 0～0.2% zinc, 0～0.005% cadmium, 0～0.02% lead, wherein iron, manganese, zinc, cadmium and lead are impurity component, and all the other impurity of 0～0.3%, surplus is copper; The tensile strength Rm of described copper alloy 〉=600MPa, elongation after fracture A11.3 〉=8%, vickers hardness hv 〉=180, electric conductivity 〉=46%IACS.
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| CN103878551A (en) * | 2014-03-27 | 2014-06-25 | 上海理工大学 | Method for producing high-strength copper nickel silica lead frame material |
| CN104046843A (en) * | 2014-06-30 | 2014-09-17 | 中色奥博特铜铝业有限公司 | Copper-nickel-silicon alloy material containing rare-earth cerium, lead frame strip and preparation method thereof |
| CN105316520A (en) * | 2015-11-26 | 2016-02-10 | 山西春雷铜材有限责任公司 | Preparation method of Cu-Ni-Sn plate strip |
| CN105349819A (en) * | 2015-11-26 | 2016-02-24 | 山西春雷铜材有限责任公司 | Method for preparing high-strength high-conductivity copper alloy plate and strip |
| CN105886828A (en) * | 2016-04-20 | 2016-08-24 | 湖北精益高精铜板带有限公司 | Microalloy copper foil and machining method thereof |
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| CN114752810A (en) * | 2022-03-24 | 2022-07-15 | 江苏恒盈电子科技有限公司 | High-strength semiconductor lead frame for circuit board and preparation method thereof |
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| CN103878551A (en) * | 2014-03-27 | 2014-06-25 | 上海理工大学 | Method for producing high-strength copper nickel silica lead frame material |
| CN104046843A (en) * | 2014-06-30 | 2014-09-17 | 中色奥博特铜铝业有限公司 | Copper-nickel-silicon alloy material containing rare-earth cerium, lead frame strip and preparation method thereof |
| CN105316520A (en) * | 2015-11-26 | 2016-02-10 | 山西春雷铜材有限责任公司 | Preparation method of Cu-Ni-Sn plate strip |
| CN105349819A (en) * | 2015-11-26 | 2016-02-24 | 山西春雷铜材有限责任公司 | Method for preparing high-strength high-conductivity copper alloy plate and strip |
| CN105886828B (en) * | 2016-04-20 | 2017-11-07 | 湖北精益高精铜板带有限公司 | A kind of microalloy copper foil and its processing method |
| CN105886828A (en) * | 2016-04-20 | 2016-08-24 | 湖北精益高精铜板带有限公司 | Microalloy copper foil and machining method thereof |
| CN106244960A (en) * | 2016-08-09 | 2016-12-21 | 山西春雷铜材有限责任公司 | A kind of Y4 state red copper method for preparing thin strip thereof |
| CN107142393A (en) * | 2017-05-11 | 2017-09-08 | 太原晋西春雷铜业有限公司 | A kind of low stress copper chromium titanium silicon band and preparation method thereof |
| CN107443012A (en) * | 2017-06-23 | 2017-12-08 | 安徽皖宏电气设备有限公司 | A kind of transformer production oxygen-free transformer copper strip new production process |
| CN110195170A (en) * | 2019-06-25 | 2019-09-03 | 太原晋西春雷铜业有限公司 | A kind of preparation method improving Cu-Ni-Si alloy obdurability |
| CN110195170B (en) * | 2019-06-25 | 2021-04-13 | 太原晋西春雷铜业有限公司 | Preparation method for improving toughness of Cu-Ni-Si alloy |
| CN114752810A (en) * | 2022-03-24 | 2022-07-15 | 江苏恒盈电子科技有限公司 | High-strength semiconductor lead frame for circuit board and preparation method thereof |
| CN114752810B (en) * | 2022-03-24 | 2023-04-11 | 江苏恒盈电子科技有限公司 | High-strength semiconductor lead frame for circuit board and preparation method thereof |
| CN115058670A (en) * | 2022-08-18 | 2022-09-16 | 太原晋西春雷铜业有限公司 | Preparation method of C19400 copper alloy lead frame material |
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