DE602008001515D1 - Cu-Ni-Si based copper alloy foil material and manufacturing method therefor - Google Patents

Cu-Ni-Si based copper alloy foil material and manufacturing method therefor

Info

Publication number
DE602008001515D1
DE602008001515D1 DE602008001515T DE602008001515T DE602008001515D1 DE 602008001515 D1 DE602008001515 D1 DE 602008001515D1 DE 602008001515 T DE602008001515 T DE 602008001515T DE 602008001515 T DE602008001515 T DE 602008001515T DE 602008001515 D1 DE602008001515 D1 DE 602008001515D1
Authority
DE
Germany
Prior art keywords
copper alloy
less
sheet material
manufacturing
alloy sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008001515T
Other languages
German (de)
Inventor
Weilin Gao
Hisashi Suda
Hiroto Narieda
Akira Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Metaltech Co Ltd
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Publication of DE602008001515D1 publication Critical patent/DE602008001515D1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
  • Contacts (AREA)

Abstract

This invention provides a copper alloy sheet material containing, in mass%, Ni: 0.7% - 4.2% and Si: 0.2% - 1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, and Co: 2.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I 0 {420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.
DE602008001515T 2007-02-13 2008-02-13 Cu-Ni-Si based copper alloy foil material and manufacturing method therefor Active DE602008001515D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007032623 2007-02-13
JP2007326559A JP4189435B2 (en) 2007-02-13 2007-12-18 Cu-Ni-Si-based copper alloy sheet and method for producing the same

Publications (1)

Publication Number Publication Date
DE602008001515D1 true DE602008001515D1 (en) 2010-07-29

Family

ID=38777717

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008001515T Active DE602008001515D1 (en) 2007-02-13 2008-02-13 Cu-Ni-Si based copper alloy foil material and manufacturing method therefor

Country Status (6)

Country Link
US (1) US20080190523A1 (en)
EP (1) EP1964937A1 (en)
JP (1) JP4189435B2 (en)
CN (2) CN101245422A (en)
AT (1) ATE471391T1 (en)
DE (1) DE602008001515D1 (en)

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CN101748308B (en) * 2008-11-28 2013-09-04 同和金属技术有限公司 CU-Ti system copper alloy plate and manufacture method thereof
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JP4563495B1 (en) * 2009-04-27 2010-10-13 Ｄｏｗａメタルテック株式会社 Copper alloy sheet and manufacturing method thereof
JP5466879B2 (en) * 2009-05-19 2014-04-09 Ｄｏｗａメタルテック株式会社 Copper alloy sheet and manufacturing method thereof
JP5550856B2 (en) * 2009-06-12 2014-07-16 株式会社Ｓｈカッパープロダクツ Copper alloy material and method for producing copper alloy material
JP5587593B2 (en) * 2009-11-10 2014-09-10 Ｄｏｗａメタルテック株式会社 Method for producing copper alloy
JP5643503B2 (en) * 2009-11-19 2014-12-17 株式会社Ｓｈカッパープロダクツ Cu-Si-Ni copper alloy material
KR101419149B1 (en) 2009-12-02 2014-07-11 후루카와 덴키 고교 가부시키가이샤 Copper alloy sheet
WO2011068126A1 (en) 2009-12-02 2011-06-09 古河電気工業株式会社 Copper alloy sheet and process for producing same
WO2011068135A1 (en) 2009-12-02 2011-06-09 古河電気工業株式会社 Copper alloy sheet and process for producing same
WO2011068134A1 (en) 2009-12-02 2011-06-09 古河電気工業株式会社 Copper alloy sheet material having low young's modulus and method for producing same
WO2012004868A1 (en) * 2010-07-07 2012-01-12 三菱伸銅株式会社 Cu-ni-si copper alloy plate with excellent deep-draw characteristics and production method thereof
KR101811080B1 (en) * 2010-08-27 2017-12-20 후루카와 덴키 고교 가부시키가이샤 Copper alloy sheet and method for producing same
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JP5522692B2 (en) 2011-02-16 2014-06-18 株式会社日本製鋼所 High strength copper alloy forging
JP4987155B1 (en) * 2011-03-09 2012-07-25 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si alloy and method for producing the same
JP4857395B1 (en) * 2011-03-09 2012-01-18 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si alloy and method for producing the same
JP6205105B2 (en) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 Cu-Ni-Si based alloy for electronic material, Cu-Co-Si based alloy and method for producing the same
WO2012160684A1 (en) * 2011-05-25 2012-11-29 三菱伸銅株式会社 Cu-ni-si copper alloy sheet with excellent deep drawability and process for producing same
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
WO2013018228A1 (en) * 2011-08-04 2013-02-07 株式会社神戸製鋼所 Copper alloy
JP5802150B2 (en) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 Copper alloy
US9002499B2 (en) * 2012-03-20 2015-04-07 GM Global Technology Operations LLC Methods for determining a recovery state of a metal alloy
JP5688744B2 (en) * 2012-10-04 2015-03-25 株式会社日本製鋼所 High strength and high toughness copper alloy forging
JP6039999B2 (en) * 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Cu-Ni-Co-Si based copper alloy sheet and method for producing the same
CN102925746B (en) * 2012-11-29 2014-09-17 宁波兴业鑫泰新型电子材料有限公司 High-performance Cu-Ni-Si system copper alloy, and preparation method and processing method thereof
CN102983083B (en) * 2012-12-24 2015-11-18 厦门永红科技有限公司 Lead frame and production method thereof
WO2014115307A1 (en) * 2013-01-25 2014-07-31 三菱伸銅株式会社 Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material
JP5647703B2 (en) * 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 High-strength Cu-Ni-Co-Si-based copper alloy sheet, its manufacturing method, and current-carrying parts
TWI621721B (en) * 2014-07-10 2018-04-21 Furukawa Electric Co Ltd Copper alloy sheet, connector, and method for manufacturing copper alloy sheet
KR20160117210A (en) * 2015-03-30 2016-10-10 제이엑스금속주식회사 Cu-Ni-Si BASED ROLLED COPPER ALLOY AND METHOD FOR MANUFACTURING THE SAME
CN106282654B (en) * 2015-05-26 2017-11-24 宁波金田铜业(集团)股份有限公司 A kind of high resiliency low cost Sn-P-Cu alloy band and preparation method thereof
JP6493047B2 (en) * 2015-07-13 2019-04-03 日立金属株式会社 Copper alloy material and method for producing the same
JP6166414B1 (en) * 2016-03-30 2017-07-19 株式会社神戸製鋼所 Copper or copper alloy strip for vapor chamber
JP6152212B1 (en) * 2016-03-31 2017-06-21 Ｄｏｗａメタルテック株式会社 Cu-Ni-Si copper alloy sheet
JP6385383B2 (en) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 Copper alloy sheet and method for producing copper alloy sheet
CN107541613B (en) * 2016-06-28 2019-03-08 沈阳慧坤新材料科技有限公司 One Albatra metal and its preparation method and application
JP7094151B2 (en) * 2017-06-07 2022-07-01 株式会社Ｓｈカッパープロダクツ Oxygen-free copper plate and ceramic wiring board
CN107119247B (en) * 2017-06-08 2018-10-30 西安交通大学 It is a kind of improve in high tonnage melting CuNiSiCr alloy property stability heat treatment method
CN108774700B (en) * 2018-08-22 2020-05-08 中南大学 High-performance CuNiSiTiBMg elastic copper alloy and preparation method thereof
CN109786338B (en) * 2019-01-21 2021-07-09 盘星新型合金材料(常州)有限公司 Amorphous alloy flexible substrate
KR102021442B1 (en) * 2019-07-26 2019-09-16 주식회사 풍산 A method of manufacturing a copper alloy sheet material excellent in strength and conductivity and a copper alloy sheet material produced therefrom
CN118103534A (en) * 2022-01-20 2024-05-28 古河电气工业株式会社 Copper alloy sheet material and method for producing same
CN115652134B (en) * 2022-10-26 2023-08-29 浙江惟精新材料股份有限公司 High-strength high-bending copper-nickel-silicon alloy and preparation method thereof

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JP3520046B2 (en) * 2000-12-15 2004-04-19 古河電気工業株式会社 High strength copper alloy
CN1327016C (en) * 2002-05-14 2007-07-18 同和矿业株式会社 Copper base alloy with improved punchin and impacting performance and its preparing method
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
JP4660735B2 (en) * 2004-07-01 2011-03-30 Ｄｏｗａメタルテック株式会社 Method for producing copper-based alloy sheet

Also Published As

Publication number Publication date
CN101503770B (en) 2011-03-02
JP2008223136A (en) 2008-09-25
JP4189435B2 (en) 2008-12-03
ATE471391T1 (en) 2010-07-15
CN101503770A (en) 2009-08-12
US20080190523A1 (en) 2008-08-14
EP1964937A1 (en) 2008-09-03
CN101245422A (en) 2008-08-20

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