EP2508633A4 - Copper alloy sheet and process for producing same - Google Patents

Copper alloy sheet and process for producing same

Info

Publication number
EP2508633A4
EP2508633A4 EP20100834576 EP10834576A EP2508633A4 EP 2508633 A4 EP2508633 A4 EP 2508633A4 EP 20100834576 EP20100834576 EP 20100834576 EP 10834576 A EP10834576 A EP 10834576A EP 2508633 A4 EP2508633 A4 EP 2508633A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
alloy sheet
producing same
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20100834576
Other languages
German (de)
French (fr)
Other versions
EP2508633A1 (en
Inventor
Hiroshi Kaneko
Koji Sato
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2508633A1 publication Critical patent/EP2508633A1/en
Publication of EP2508633A4 publication Critical patent/EP2508633A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
EP20100834576 2009-12-02 2010-12-01 Copper alloy sheet and process for producing same Withdrawn EP2508633A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009274995 2009-12-02
PCT/JP2010/071499 WO2011068126A1 (en) 2009-12-02 2010-12-01 Copper alloy sheet and process for producing same

Publications (2)

Publication Number Publication Date
EP2508633A1 EP2508633A1 (en) 2012-10-10
EP2508633A4 true EP2508633A4 (en) 2014-07-23

Family

ID=44114972

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20100834576 Withdrawn EP2508633A4 (en) 2009-12-02 2010-12-01 Copper alloy sheet and process for producing same

Country Status (5)

Country Link
EP (1) EP2508633A4 (en)
JP (2) JP5400877B2 (en)
KR (1) KR101747475B1 (en)
CN (1) CN102666889A (en)
WO (1) WO2011068126A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2610358A4 (en) * 2010-08-27 2017-05-03 Furukawa Electric Co., Ltd. Copper alloy sheet and manufacturing method for same
JP5039863B1 (en) * 2011-10-21 2012-10-03 Ｊｘ日鉱日石金属株式会社 Corson alloy and manufacturing method thereof
WO2015034071A1 (en) * 2013-09-06 2015-03-12 古河電気工業株式会社 Copper alloy wire material and method for producing same
JP6317967B2 (en) * 2014-03-25 2018-04-25 Ｄｏｗａメタルテック株式会社 Cu-Ni-Co-Si-based copper alloy sheet, method for producing the same, and current-carrying component
JP6504868B2 (en) * 2015-03-19 2019-04-24 Ｊｘ金属株式会社 Rolled copper foil and manufacturing method thereof, copper clad laminate, flexible printed circuit board and electronic device
JP6310538B1 (en) * 2016-12-14 2018-04-11 古河電気工業株式会社 Copper alloy wire rod and method for producing the same
SG11202001066VA (en) * 2017-08-09 2020-03-30 Nippon Steel Chemical & Material Co Ltd Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
CN108315579B (en) * 2018-03-06 2019-12-06 北京科技大学 textured rare earth CuNiSiCr alloy material, preparation process and application
JP6713074B1 (en) * 2019-04-16 2020-06-24 Ｄｏｗａメタルテック株式会社 Copper alloy sheet and method for producing the same
CN112030030B (en) * 2020-08-06 2021-09-10 国网江西省电力有限公司电力科学研究院 High-strength high-conductivity copper alloy wire and preparation method thereof
CN115094258B (en) * 2022-07-13 2023-02-17 浙江惟精新材料股份有限公司 High-strength high-plasticity high-bending Cu-Ni-Si-Co alloy and preparation method and application thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283059A (en) * 2005-03-31 2006-10-19 Kobe Steel Ltd High strength copper alloy sheet with excellent bendability, and its manufacturing method
JP2007092135A (en) * 2005-09-29 2007-04-12 Nikko Kinzoku Kk Cu-Ni-Si-BASED ALLOY HAVING EXCELLENT STRENGTH AND BENDING WORKABILITY
WO2008099892A1 (en) * 2007-02-16 2008-08-21 Kabushiki Kaisha Kobe Seiko Sho Copper alloy sheet for electrical and electronic parts excelling in strength and formability
EP1967596A1 (en) * 2007-02-13 2008-09-10 Dowa Metaltech Co., Ltd. Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
EP1997920A2 (en) * 2007-05-31 2008-12-03 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
EP2248922A1 (en) * 2009-04-27 2010-11-10 Dowa Metaltech Co., Ltd. Copper alloy sheet and method for producing same
EP2298945A1 (en) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Copper alloy sheet material and manufacturing method thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62185847A (en) * 1986-02-12 1987-08-14 Furukawa Electric Co Ltd:The High strength copper alloy for high thermal and electric conductivity use and its production
JP3510469B2 (en) * 1998-01-30 2004-03-29 古河電気工業株式会社 Copper alloy for conductive spring and method for producing the same
JP3739214B2 (en) 1998-03-26 2006-01-25 株式会社神戸製鋼所 Copper alloy sheet for electronic parts
JP2000080428A (en) * 1998-08-31 2000-03-21 Kobe Steel Ltd Copper alloy sheet excellent in bendability
JP4809602B2 (en) 2004-05-27 2011-11-09 古河電気工業株式会社 Copper alloy
JP4166197B2 (en) 2004-06-30 2008-10-15 日鉱金属株式会社 Cu-Ni-Si-based copper alloy strips with excellent BadWay bending workability
JP4584692B2 (en) * 2004-11-30 2010-11-24 株式会社神戸製鋼所 High-strength copper alloy sheet excellent in bending workability and manufacturing method thereof
JP4566020B2 (en) * 2005-02-14 2010-10-20 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with low anisotropy
JP5002768B2 (en) * 2006-03-30 2012-08-15 Ｄｏｗａメタルテック株式会社 Highly conductive copper-based alloy with excellent bending workability and manufacturing method thereof
JP5028657B2 (en) 2006-07-10 2012-09-19 Ｄｏｗａメタルテック株式会社 High-strength copper alloy sheet with little anisotropy and method for producing the same
US20080190523A1 (en) 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4981748B2 (en) 2007-05-31 2012-07-25 古河電気工業株式会社 Copper alloy for electrical and electronic equipment
EP2194151B1 (en) * 2007-09-28 2014-08-13 JX Nippon Mining & Metals Corporation Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
JP4596490B2 (en) 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP4809935B2 (en) * 2009-12-02 2011-11-09 古河電気工業株式会社 Copper alloy sheet having low Young's modulus and method for producing the same
JP5476149B2 (en) * 2010-02-10 2014-04-23 株式会社神戸製鋼所 Copper alloy with low strength anisotropy and excellent bending workability

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283059A (en) * 2005-03-31 2006-10-19 Kobe Steel Ltd High strength copper alloy sheet with excellent bendability, and its manufacturing method
JP2007092135A (en) * 2005-09-29 2007-04-12 Nikko Kinzoku Kk Cu-Ni-Si-BASED ALLOY HAVING EXCELLENT STRENGTH AND BENDING WORKABILITY
EP1967596A1 (en) * 2007-02-13 2008-09-10 Dowa Metaltech Co., Ltd. Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
WO2008099892A1 (en) * 2007-02-16 2008-08-21 Kabushiki Kaisha Kobe Seiko Sho Copper alloy sheet for electrical and electronic parts excelling in strength and formability
EP1997920A2 (en) * 2007-05-31 2008-12-03 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
EP2298945A1 (en) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Copper alloy sheet material and manufacturing method thereof
EP2248922A1 (en) * 2009-04-27 2010-11-10 Dowa Metaltech Co., Ltd. Copper alloy sheet and method for producing same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011068126A1 *

Also Published As

Publication number Publication date
JP5503791B2 (en) 2014-05-28
WO2011068126A1 (en) 2011-06-09
JP5400877B2 (en) 2014-01-29
KR101747475B1 (en) 2017-06-14
JPWO2011068126A1 (en) 2013-04-18
CN102666889A (en) 2012-09-12
JP2014029031A (en) 2014-02-13
KR20120087985A (en) 2012-08-07
EP2508633A1 (en) 2012-10-10

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