JPS62185847A - High strength copper alloy for high thermal and electric conductivity use and its production - Google Patents
High strength copper alloy for high thermal and electric conductivity use and its productionInfo
- Publication number
- JPS62185847A JPS62185847A JP2818486A JP2818486A JPS62185847A JP S62185847 A JPS62185847 A JP S62185847A JP 2818486 A JP2818486 A JP 2818486A JP 2818486 A JP2818486 A JP 2818486A JP S62185847 A JPS62185847 A JP S62185847A
- Authority
- JP
- Japan
- Prior art keywords
- less
- alloy
- copper alloy
- strength
- strength copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 30
- 239000000956 alloy Substances 0.000 claims abstract description 30
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 8
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000005482 strain hardening Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 238000005476 soldering Methods 0.000 abstract description 4
- 229910052725 zinc Inorganic materials 0.000 abstract description 3
- 229910052748 manganese Inorganic materials 0.000 abstract description 2
- 229910001122 Mischmetal Inorganic materials 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 description 16
- 238000007747 plating Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- WUPRCGRRQUZFAB-YOAOAAAGSA-N corrin Chemical compound N1C2CC\C1=C\C(CC1)=NC1=CC(CC1)=NC1=CC1=NC2CC1 WUPRCGRRQUZFAB-YOAOAAAGSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- 229910017827 Cu—Fe Inorganic materials 0.000 description 1
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910005487 Ni2Si Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000012733 comparative method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は電気・電子機器や熱交換器に用いられる熱・電
気高伝導用高力銅合金とその製造法に関し、特に電気・
熱の高伝導性と高い機械的強度を有し、小型・高密化さ
れた半導体のリード材等に適した銅合金を提供するもの
である。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a high-strength copper alloy for high thermal and electrical conductivity used in electrical and electronic equipment and heat exchangers, and a method for producing the same.
The present invention provides a copper alloy that has high thermal conductivity and high mechanical strength, and is suitable for use as lead materials for small, high-density semiconductors.
［従来の技術］
半導体のリードの外コネクター、スイツヂリレー等の導
電ばね、各種端子には強度と熱・電気伝導性（以下伝導
性と略記）とを有する銅合金、例えばリン青銅（Ｓｎ４
〜ａｗｔ％以下、Ｐ０．６ｗｔ％以下、残部Ｃｕ）（以
下ｗｔ％を％と略記）が用いられていたが、最近機器の
小型化、高密化に伴なって発熱量の増大から放熱性の必
要か高まり、更にプリント基板等に半田付けしたり、プ
ラスデックモールドを行なうなど、半田付は性、メッキ
性、スケール密着性、耐食性が不可欠の条件となってき
た。リン青銅は５０〜Ｆ３５ＫＩ／ｒｒｖＡの強度を有
し、加工性に優れているが、導電率は１０〜２０％ｌＡ
Ｃ３と低く、高価なＳｎを４〜８％も含むもので、半田
接合強度が経時劣化を起すばかりか、応力腐食割れ感受
性も高い欠点がある。このためＣｕ−１ｅｅ合金やＣＬ
Ｊ−Ｆｅ合金が用いられるようになった。[Prior Art] Copper alloys that have strength and thermal and electrical conductivity (hereinafter abbreviated as conductivity), such as phosphor bronze (Sn4
~awt% or less, P0.6wt% or less, balance Cu) (hereinafter wt% is abbreviated as %), but recently, with the miniaturization and high density of equipment, the heat dissipation performance has increased due to the increase in calorific value. The need for soldering has increased, and properties such as soldering properties, plating properties, scale adhesion, and corrosion resistance have become indispensable for soldering to printed circuit boards, etc., and for Plus Deck molding. Phosphor bronze has a strength of 50 to F35 KI/rrvA and is excellent in workability, but its electrical conductivity is 10 to 20% lA.
It has a low C3 content and contains 4 to 8% of expensive Sn, which not only causes deterioration of solder joint strength over time but also has the disadvantage of high stress corrosion cracking susceptibility. Therefore, Cu-1ee alloy and CL
J-Fe alloys came into use.
［発明が解決しようとする問題点コ
ＣＬＩ−［３ｅ合金は１００Ｎｆｆ／４以上の強度を示
すも、非常に高価なためにその使用は特殊な用途に限ら
れている。またＣｕ−Ｆｅ合金、例えばＣ−１９５合金
（１，５％Ｆｅ、（：、ｏ ０．８％、Ｓｎ０．６％、
Ｐｏ、１％、残部Ｃｕ）は比較的安価でリードフレーム
等にかなり使用され、強度は４５〜５５に’ｊ／ｍｒＡ
、導電率は５０〜６５％ｌＡＣ３の特性を示すも、多口
の１ｅｘＰやＦｅの析出物を含むため、加工性、半田接
合強度、メッキ性などが劣る。その他ＣＵ−Ｏｒ合金や
コルリン合金（Ｃｕ−Ｎｉ−Ｓｉ系合金）が知られてい
るが、Ｃｕ−Ｃｒ合金は８０％ｌＡＣ３級の高導電率を
示すも強度が不」−分であり、コルリン合金は特性が不
安定なばかりか、半田接合強度の劣化が大ぎく、Ｓｎや
５ｎ−Ｐｂ合金（半田）メッキの剥離を起し易く、電子
・電気機器等の用途では重大な障害となっている。[Problems to be Solved by the Invention] Although the 3e alloy exhibits a strength of 100 Nff/4 or more, its use is limited to special applications because it is very expensive. Also, Cu-Fe alloys, such as C-195 alloy (1.5% Fe, (:, o 0.8%, Sn 0.6%,
Po, 1%, balance Cu) is relatively cheap and is widely used for lead frames, etc., and has a strength of 45 to 55'j/mrA.
Although it exhibits a conductivity of 50 to 65% lAC3, it contains many 1exP and Fe precipitates, so it is inferior in workability, solder joint strength, plating performance, etc. In addition, CU-Or alloy and Corrin alloy (Cu-Ni-Si alloy) are known, but Cu-Cr alloy has a high conductivity of 80% lAC3 class, but its strength is poor, and Corrin alloy is Not only do alloys have unstable properties, but their solder joint strength deteriorates significantly, and Sn and 5n-Pb alloy (solder) plating tends to peel off, which is a serious problem in electronic and electrical equipment applications. There is.
このように増々顕在化しつつある高性能化合金のニーズ
に応えるための改良された合金が要求されており、この
ような合金には次の特性が要求される。Improved alloys are required to meet the ever-increasing needs for high-performance alloys, and such alloys are required to have the following properties.
（１）強度、耐熱性及び耐食性が優れていること。(1) Excellent strength, heat resistance, and corrosion resistance.
（２）加工性の均質性及び伝導性とその安定性が良いこ
と。(2) Good homogeneity of workability, conductivity, and stability.
（３）半田接合強度が高く、経時劣化が少なく、メッキ
性が良いこと。(3) High solder joint strength, little deterioration over time, and good plating properties.
（４）酸化スケールの密着性が良いこと。(4) Good adhesion of oxide scale.
問題点を解決するための手段
本発明はこれに鑑み種々検討の結果、伝導性、強度、半
田接合強度、メッキ性、酸化スケールの密着性及び耐食
性等の優れた熱・電気伝導用高力銅合金とその製造法を
開発したものである。Means for Solving the Problems In view of this, the present invention has been developed as a result of various studies, and has been developed to produce high-strength copper for thermal and electrical conduction that has excellent conductivity, strength, solder joint strength, plating properties, oxide scale adhesion, and corrosion resistance. The alloy and its manufacturing method were developed.
即ち本発明合金の一つは、Ｎｉ、Ｃｏ又はこれ等の混合
物を０．４〜４％とＳｉを０．１〜１％含み、’ｌ’−
ａ、Ｎｂ、ミツシュメタル（以下ＭＭと略記） 、Ｔｅ
、Ａｑの内何れか１種又は２種以上を合計０．０１〜１
％含み、゛残部Ｃｕと不可避的不純物からなることを特
徴とするものである。That is, one of the alloys of the present invention contains 0.4 to 4% of Ni, Co, or a mixture thereof and 0.1 to 1% of Si, and has 'l'-
a, Nb, Mitsushmetal (hereinafter abbreviated as MM), Te
, Aq, a total of 0.01 to 1 of any one or two or more of them.
%, with the remainder consisting of Cu and unavoidable impurities.
本発明合金の他の一つは、Ｎｉ、ｃｏ又はこれ等の混合
物を０．４〜４％とＳｉを０．１〜１％含み、Ｔａ、Ｎ
ｂ、ＭＭ、Ｔｅ、Ａｇの内何れか１種又は２種以上を合
ｉｆ０．０１〜１％含み、更にＭｎ０．５％以下、Ｚｒ
１５％以下、Ｓｎ５％以下の範囲内で何れか１種又は２
種以上を含み、残部Ｃｕと不可避的不純物からなること
を特徴とするものでおる。Another alloy of the present invention contains 0.4-4% Ni, co or a mixture thereof and 0.1-1% Si, Ta, N
b, contains one or more of MM, Te, and Ag in a total of 0.01 to 1%, and further contains Mn 0.5% or less, Zr
Any one or two within the range of 15% or less, Sn 5% or less
It is characterized by containing more than one species, with the remainder consisting of Cu and unavoidable impurities.
また本発明製造法は、Ｎｉ、Ｃｏ又はこれ等の混合物を
０．４〜４％とＳｉを０．１〜１％含み、Ｔａ、Ｎｂ、
ＭＭ、Ｔｅ、Ａｃｔの内何れか１種又は２種以上を合計
ｏ、 ｏｉ〜１％含み、又はこれニＭｎ ０．５％以下
、Ｚｎ５％以下、Ｓｎ５％以下の範囲内で何れか１種又
は２種以上を含み、残部Ｃｕと不可避的不純物からなる
合金を６５０℃以上で熱間加工し、直ちに１０’Ｃ／Ｓ
ｅｃ以上の速度で３５０℃以下まで冷却した後、７０％
以上の冷間加工を行なってから４００〜６００℃で熱処
理することを特徴とするものである。Further, the production method of the present invention contains 0.4 to 4% of Ni, Co or a mixture thereof and 0.1 to 1% of Si, Ta, Nb,
Contains one or more of MM, Te, and Act in a total of o, oi ~ 1%, or any one of these within the range of Mn 0.5% or less, Zn 5% or less, Sn 5% or less Or hot working an alloy containing two or more types, the balance consisting of Cu and unavoidable impurities at 650°C or higher, and immediately 10'C/S
After cooling to 350℃ or less at a rate of ec or higher, 70%
It is characterized by performing the above cold working and then heat treating at 400 to 600°C.
本発明は常法により上記合金組成に配合して溶解し、水
冷金型鋳造法等により鋳造したインゴットを６５０°Ｃ
以上、望ましくは７００℃以上で熱間加工し、加工後直
らに水冷又はＪ！Ｉｌ冷により冷却する。次にミーリン
グや酸洗等により表面を清浄化してから７０％以上の冷
間加工を加え、しかる後４００〜６００ ’Ｃ望ましく
は４５０〜５５０’Ｃで１分〜２４時間熱処理して仕上
げる。尚必要に応じて冷間加工と熱処理を繰返すことも
できる。In the present invention, the above alloy composition is blended and melted by a conventional method, and an ingot is cast by a water-cooled mold casting method or the like at 650°C.
The above is preferably hot worked at a temperature of 700°C or higher, and immediately after the work is water cooled or J! Cool by Il cooling. Next, the surface is cleaned by milling, pickling, etc., and then subjected to cold working of 70% or more, followed by heat treatment at 400 to 600'C, preferably 450 to 550'C, for 1 minute to 24 hours to finish. Note that cold working and heat treatment can be repeated as necessary.
［作 用］
本発明において、Ｎｉ、ＣＯ又はこれ等の混合物とＳｉ
の添加は金属間化合物Ｎｉ２Ｓｉ又は／及びＣＯ２Ｓ
ｉを熱処理析出させて強度を向上させると共に導電率（
伝導性）の回復を計ったもので、Ｎｉ、ＣＯ又はこれ等
の混合物の含有量を０．４〜４％、Ｓｉ含有伍を０．１
〜１％と限定したのは、何れも含有量が下限未満では十
分な効果が得られず、上限を越えると導電率を低下させ
るばかりか、加工性を損なうためである。尚Ｎ１ｚＳｉ
及びＣＯ２Ｓ ｉの化学量論比は５．２：１であり、Ｎ
ｉ、Ｑｏ又はこれ等の混合物とＳｉの配合比を上記組成
範囲内において化学量論比に近ずけることが望ましく、
過剰のＮｉ、ｃｏ又はＳｉは導電率を低下させ、かつ加
工性や半田接続強度の低下をまねく。[Function] In the present invention, Ni, CO or a mixture thereof and Si
The addition of intermetallic compound Ni2Si or/and CO2S
i is precipitated by heat treatment to improve the strength and improve the electrical conductivity (
The content of Ni, CO, or a mixture thereof is 0.4 to 4%, and the Si content is 0.1%.
The reason why the content is limited to ~1% is because sufficient effects cannot be obtained if the content is less than the lower limit, and if it exceeds the upper limit, not only the conductivity decreases but also processability is impaired. Furthermore, N1zSi
The stoichiometric ratio of N and CO2S i is 5.2:1, and N
It is desirable that the blending ratio of i, Qo or a mixture thereof and Si be close to the stoichiometric ratio within the above composition range,
Excessive Ni, Co, or Si reduces electrical conductivity, and also causes a decrease in workability and solder connection strength.
Ｔａ、Ｎｂ、ＭＭ、Ｔｅ、ＡＣＩの内何れか１種又は２
種状の添加は、更に強度を向上させるとと共に、特性を
安定化させるためで、これ等の１種又は２種以上の合計
含有量を０．旧〜１％と限定したのは、含有量が下限未
満では十分な効果が得られず、上限を越えると導電率を
低下するばかりか、コストを上昇し、加工性を損なう等
の不都合を生ずる。即ちＮ１ｚＳｉ又は／及びＣＯ２Ｓ
ｉの析出は合金組成や熱処理条件のみでなく、加工条
件なども複刹［に関与し、実際上の特性を不安定にする
が、ｌａ、 Ｎｂ、ＭＭ、Ｔｅ、Ａｑは特性の安定化に
働く。その作用機構は明らかではないが、これ等はＳｉ
と化合し、未反応のＳｉを消費して強度向上に働くもの
と考えられる。またこれ等は結晶の微細化に鋤ぎ、製造
時に加工性を高める。待にｌｅ、ＭＭはプレス成型性を
向上し、Ａｃｔ、Ｔｅ、ＭＭは耐熱性を向上する。Any one or two of Ta, Nb, MM, Te, ACI
The purpose of adding seeds is to further improve the strength and stabilize the properties, and the total content of one or more of these is 0. The reason why the content was previously limited to ~1% is that if the content is less than the lower limit, a sufficient effect will not be obtained, and if it exceeds the upper limit, not only will the conductivity decrease, but also the cost will increase, and there will be problems such as impairing processability. . i.e. N1zSi or/and CO2S
The precipitation of i is not only affected by the alloy composition and heat treatment conditions, but also by the processing conditions, which makes the actual properties unstable, but la, Nb, MM, Te, and Aq contribute to the stabilization of the properties. work. Although the mechanism of action is not clear, these
It is thought that this increases the strength by consuming unreacted Si. These also help refine the crystals and improve workability during manufacturing. Furthermore, le and MM improve press formability, and Act, Te, and MM improve heat resistance.
またＭｎ、 Ｚｎ、Ｓｎの内何れか１種又は２種以上の
添加は、上記添加元素の作用効果を一層高め、強度を向
上して特性を一層安定化させるためであり、Ｍｎ含有量
を０．５％以下、Ｚｎ含有量を５％以下、Ｓｎ含有量を
５％以下と限定したのは、何れもこれ越えて含有せしめ
ると導電率を著しく低下するためである。更にこれ等の
添加は上記作用効果の外にＭｎは半田接合強度の向上と
熱間加工性の向上に有効であり、Ｚｎは半田接合強度の
向上に有効であり、Ｓｎは強度加工性の外耐熱性の向上
に有効である。The addition of one or more of Mn, Zn, and Sn is intended to further enhance the effects of the above-mentioned additive elements, improve strength, and further stabilize the properties. The reason why the Zn content is limited to 5% or less, and the Sn content is limited to 5% or less is that if any of the above is contained, the electrical conductivity will drop significantly. Furthermore, in addition to the above effects, Mn is effective in improving solder joint strength and hot workability, Zn is effective in improving solder joint strength, and Sn is effective in improving solder joint strength and workability. Effective in improving heat resistance.
添加元素の増加は導電性を低下するので特に実用上Ｍｎ
０．３％以下、Ｚｒ１２％以下、Ｓｎ２％以下が有用で
ある。Increasing the amount of added elements reduces the conductivity, so Mn is particularly useful in practical applications.
Useful values are 0.3% or less, Zr 12% or less, and Sn 2% or less.
以上の本発明合金は６５０℃以上、望ましくは７００〜
９５０℃で熱間加工し、直ちに１０’Ｃ／ｓｅｃ以上の
速度で３５０°Ｃ以下まで冷却した後、７０％以上の冷
間加工を行なってから４００〜６００℃、望ましくは４
５０〜５５０℃で熱処理覆ることにより、特性を最大限
に実現する。本発明合金を６５０’Ｃ以上で熱間加工し
、直ちに１０°Ｃ／ｓｅｃ以上の速度で３５０’Ｃ以下
まで冷却するのは、粗大な析出を抑止するためである。The above-mentioned alloy of the present invention has a temperature of 650°C or higher, preferably 700°C or higher.
After hot working at 950°C, immediately cooling to 350°C or less at a rate of 10'C/sec or more, cold working to 70% or more, and then 400 to 600°C, preferably 4
The properties are maximized by heat treatment at 50-550°C. The reason why the alloy of the present invention is hot worked at 650'C or higher and immediately cooled to 350'C or lower at a rate of 10°C/sec or higher is to suppress coarse precipitation.
次に７０％以上の冷間加工を行なってから４００〜６０
０ ’Ｃ熱処理するのは加工歪みを加えた状態で熱処理
することにより、微細な析出を均一に分散析出させるた
めで、７０％未満の冷間加工では均一な分散析出が得ら
れない。また熱処理温度が４００’Ｃ未満では析出に長
時間を要し、析出粒子も超微粒子となって、加工性や半
田接合強度が不安定になり、６００’Ｃを越えると粗大
不均一析出となるばかりか導電率などの特性が劣化する
。また熱処理後、必要に応じて冷間加工と再熱処理を繰
返すこともできる。即ち熱処理後所望サイズまで冷間加
工した後、２５０〜３５０’Ｃで熱処理することにより
加工歪の一部を解放し、伸びや成型加工性を向上する。Next, after performing cold working of 70% or more,
The reason why the 0'C heat treatment is performed is to uniformly disperse and precipitate fine precipitates by performing the heat treatment under processing strain, and cold working of less than 70% does not result in uniformly dispersed precipitates. In addition, if the heat treatment temperature is less than 400'C, precipitation will take a long time and the precipitated particles will become ultra-fine particles, making workability and solder joint strength unstable, and if the heat treatment temperature exceeds 600'C, coarse and non-uniform precipitation will occur. Not only that, but properties such as electrical conductivity deteriorate. Further, after the heat treatment, cold working and reheat treatment can be repeated as necessary. That is, after heat treatment and cold working to a desired size, heat treatment is performed at 250 to 350'C to release some of the processing strain and improve elongation and moldability.
［実施例］
第１表に示す組成の合金を溶解し、金型に鋳造して機械
切削により幅８０ａｎ、厚さ５０ｍｍ、長さ３００＃の
インボッ１〜とした。これを８７０’Ｃに加熱して熱間
圧延し、約７３０ ’Ｃで板厚５０ｍｍとし、直ちに３
５ （）’Ｃまで冷却（水冷、風冷、炉冷）してから酸
洗した。これを第１冷間圧延してから熱処理し、一部第
２冷間圧延を加えてから再熱処理した。これ等の製造条
件を第２表に示す。[Example] An alloy having the composition shown in Table 1 was melted, cast into a mold, and machined to form an ingot having a width of 80 an, a thickness of 50 mm, and a length of 300#. This was heated to 870'C and hot rolled to a thickness of 50mm at about 730'C, and immediately
After cooling (water cooling, air cooling, furnace cooling) to 5 ()'C, pickling was performed. This was first cold rolled and then heat treated, and then partially subjected to second cold rolling and then reheated. These manufacturing conditions are shown in Table 2.
上記板材について引張強ざ、伸び、導電率、耐熱性、半
田接合強度、スケール密着性、メッキ性及び耐食性を試
験し、その結果を従来の７／３黄銅（Ｚｎ２９．７％、
残部Ｃｕ）、リン青銅（Ｓｎ６．１％、Ｐ ０．１５％
、残部Ｃｕ）、Ｃ１９５（Ｆｅ １．６％、Ｃｏ ０．
８％、Ｓｎ０．１３％、Ｐｏ、０５％、残部Ｃｕ）と比
較して第３表に示した。耐熱性は５００″Ｃで１分間加
熱後の硬度を測定し、半田接合強度は直径５ｍｍの半田
接合部を１５０’Ｃで３００時間加熱してからプルテス
トを行なった。スケール密着性は大気中２５０〜４００
°Ｃのホットプレート上で加熱した後、テープ剥離テス
トを行なって剥離を始めた最少膜厚を求めた。膜厚はカ
ソード還元法で測定した。メッキ性はｌ−＋２ ＳＯ＋
−１−１２０混合液により表面を厚さ約０．３μエツ
チングした後、厚さ３μのシアン銀メッキを行ない、こ
れを４７０’Ｃで５分間加熱して表面の７タレ有無を４
０倍の実体顕微鏡により試べた。耐食性はＪＩＳＣ８３
０６に基づぎ、３Ｖｏ １％のＮＨ３カス中で３０Ｋｊ
ｊ ／ ｍｍ ２の定荷重を加え、破断するまでの時間
を調べた。The above plate materials were tested for tensile strength, elongation, electrical conductivity, heat resistance, solder joint strength, scale adhesion, plating properties, and corrosion resistance, and the results were compared to conventional 7/3 brass (Zn 29.7%,
balance Cu), phosphor bronze (Sn6.1%, P 0.15%
, balance Cu), C195 (Fe 1.6%, Co 0.
8%, Sn0.13%, Po, 05%, balance Cu) as shown in Table 3. Heat resistance was determined by measuring the hardness after heating at 500'C for 1 minute, and solder joint strength was determined by heating a solder joint with a diameter of 5 mm at 150'C for 300 hours and then performing a pull test.Scale adhesion was measured at 250°C in air. ~400
After heating on a hot plate at °C, a tape peeling test was performed to determine the minimum film thickness at which peeling started. The film thickness was measured by cathodic reduction method. Plating property is l-+2 SO+
After etching the surface to a thickness of approximately 0.3 μm using the -1-120 mixed solution, perform cyan silver plating to a thickness of 3 μm, heat this at 470'C for 5 minutes, and check the presence or absence of sag on the surface.
It was tested using a stereomicroscope at 0x magnification. Corrosion resistance is JISC83
Based on 06, 30Kj in 3Vo 1% NH3 scum
A constant load of j/mm2 was applied and the time until breakage was investigated.
尚、表中耐熱性と半田接合強度の（）内は試験前の測定
値である。Note that the values in parentheses for heat resistance and solder joint strength in the table are measured values before the test.
第１表〜第３表から明らかなように、本発明法Ｎｏ、
１〜６にＪこり製造したものは従来材料Ｎｏ、 １５〜
１７と比較し、はるかに（至）れた特性を示すことが判
る。これに対し本発明合金（Ａ）であっても製造条件か
外れる比較法Ｎｏ、 １１〜１４では、特に強度と導電
率の劣化か著しく、また本発明合金の組成範囲より外れ
る比較合金（Ｇ−Ｊ）では本発明の製造条件で加工して
も、導電率の低下か茗しいことが判る。即ち本発明合金
は添加成分の効果と本発明の製造条件により引張強さ、
伸び、導電率、耐熱性、半田接合強度、スケール密省性
、耐食性等の諸性性が改善されるのに対し、同じ製造条
件でも合金組成が外れるものは、これ等の特性の内何れ
か一つ以上が劣り、本発明合金であっても製造条件が外
れるものは、上記特性の内何れか一つ以上が劣り、特に
冷却速度が不足する比較例Ｎ０１１１では第１圧延工程
で割れを起こしてしまった。As is clear from Tables 1 to 3, the present invention method No.
Those manufactured with J stiffness in 1 to 6 are conventional material No. 15 to 6.
It can be seen that compared to No. 17, it exhibits far superior characteristics. On the other hand, in Comparative Method Nos. 11 to 14, in which even the present invention alloy (A) is out of the manufacturing conditions, the strength and conductivity are significantly deteriorated, and the comparative alloy (G- In J), even when processed under the manufacturing conditions of the present invention, it can be seen that the conductivity decreases or is slow. That is, the alloy of the present invention has a high tensile strength due to the effects of the additive components and the manufacturing conditions of the present invention.
While various properties such as elongation, electrical conductivity, heat resistance, solder joint strength, scale density reduction, and corrosion resistance are improved, if the alloy composition deviates even under the same manufacturing conditions, then one of these properties may be improved. Even if the alloy is of the present invention, it is inferior in one or more of the above characteristics, and if the manufacturing conditions are not met, it is inferior in one or more of the above characteristics.In particular, Comparative Example No. It happened.
［発明の効果］
このように本発明合金は、強度・伝導率を始め電気・電
子機器や熱交換器に要求される各種特性を満足りるもの
で、半導体を初め、各種電気・電子機器に用い、該機器
の小型化、高密度化を可能にする等工業上顕著な効果を
奏するものである。[Effects of the Invention] As described above, the alloy of the present invention satisfies various properties required for electrical/electronic equipment and heat exchangers, including strength and conductivity, and can be used in various electrical/electronic equipment including semiconductors. This has significant industrial effects, such as making it possible to miniaturize and increase the density of the equipment.
Claims (3)
％とＳｉを０．１〜１ｗｔ％を含み、Ｔａ、Ｎｂ、メッ
シュメタル、Ｔｅ、Ａｇの内何れか１種又は２種以上を
合計０．０１〜１ｗｔ％含み、残部Ｃｕと不可避的不純
物からなる熱・電気高伝導用高力銅合金。(1) 0.4 to 4 wt of Ni, Co or a mixture thereof
% and Si, and a total of 0.01 to 1 wt% of any one or more of Ta, Nb, mesh metal, Te, and Ag, and the balance is Cu and unavoidable impurities. A high-strength copper alloy for high thermal and electrical conductivity.
％とＳｉを０．１〜１ｗｔ％を含み、Ｔａ、Ｎｂ、メッ
シュメタル、Ｔｅ、Ａｇの内何れか１種又は２種以上を
合計０．０１〜１ｗｔ％含み、更にＭｎ０．５ｗｔ％以
下、Ｚｎ５ｗｔ％以下、Ｓｎ５ｗｔ％以下の範囲内で何
れか１種又は２種以上を含み、残部Ｃｕと不可避的不純
物からなる熱・電気高伝導用高力銅合金。(2) 0.4 to 4 wt of Ni, Co or a mixture thereof
% and Si, a total of 0.01 to 1 wt% of any one or more of Ta, Nb, mesh metal, Te, and Ag, and further Mn of 0.5 wt% or less, A high-strength copper alloy for high thermal and electrical conductivity, containing one or more of Zn at 5wt% or less and Sn at 5wt% or less, with the remainder being Cu and inevitable impurities.
％とＳｉを０．１〜１ｗｔ％を含み、Ｔａ、Ｎｂ、メッ
シュメタル、Ｔｅ、Ａｇの内何れか１種又は２種以上を
合計０．０１〜１ｗｔ％含み、又はこれにＭｎ０．５ｗ
ｔ％以下、Ｚｎ５ｗｔ％以下、Ｓｎ５ｗｔ％以下の範囲
内で何れか１種又は２種以上を含み、残部Ｃｕと不可避
的不純物からなる合金を６５０℃以上で熱間加工し、直
ちに１０℃／ｓｅｃ以上の速度で３５０℃以下まで冷却
した後、７０％以上の冷間加工を行なってから４００〜
６００℃で熱処理することを特徴とする熱・電気高伝導
用高力銅合金の製造法。(3) 0.4 to 4 wt of Ni, Co or a mixture thereof
% and Si, and a total of 0.01 to 1 wt% of any one or more of Ta, Nb, mesh metal, Te, and Ag, or 0.5 w of Mn.
t% or less, Zn5wt% or less, Sn 5wt% or less, and the balance is Cu and unavoidable impurities.The alloy is hot worked at 650°C or higher, and immediately heated at 10°C/sec. After cooling to 350℃ or less at the above rate, cold working by 70% or more,
A method for producing a high-strength copper alloy for high thermal and electrical conductivity, which is characterized by heat treatment at 600°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2818486A JPS62185847A (en) | 1986-02-12 | 1986-02-12 | High strength copper alloy for high thermal and electric conductivity use and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2818486A JPS62185847A (en) | 1986-02-12 | 1986-02-12 | High strength copper alloy for high thermal and electric conductivity use and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62185847A true JPS62185847A (en) | 1987-08-14 |
| JPH0356294B2 JPH0356294B2 (en) | 1991-08-27 |
Family
ID=12241616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2818486A Granted JPS62185847A (en) | 1986-02-12 | 1986-02-12 | High strength copper alloy for high thermal and electric conductivity use and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62185847A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833920A (en) * | 1996-02-20 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Copper alloy for electronic parts, lead-frame, semiconductor device and connector |
| KR100644510B1 (en) * | 2005-03-17 | 2006-11-10 | 한국기계연구원 | High strength lead-frame material Cu-Ni-Mn-Si-Sn-Ms alloy with good hot-workability and good anti-softening and it's manufacturing method |
| WO2009096546A1 (en) * | 2008-01-31 | 2009-08-06 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric/electronic component and method for manufacturing the copper alloy material |
| JP5144814B2 (en) * | 2009-08-10 | 2013-02-13 | 古河電気工業株式会社 | Copper alloy material for electrical and electronic parts |
| JP5400877B2 (en) * | 2009-12-02 | 2014-01-29 | 古河電気工業株式会社 | Copper alloy sheet and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5570494A (en) * | 1978-11-18 | 1980-05-27 | Futoshi Matsumura | Wire rod for copper welding excelling in electric conductivity, thermal conductivity and welding performance |
| JPS6274037A (en) * | 1985-09-26 | 1987-04-04 | Furukawa Electric Co Ltd:The | High strength copper alloy having high electric conductivity |
-
1986
- 1986-02-12 JP JP2818486A patent/JPS62185847A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5570494A (en) * | 1978-11-18 | 1980-05-27 | Futoshi Matsumura | Wire rod for copper welding excelling in electric conductivity, thermal conductivity and welding performance |
| JPS6274037A (en) * | 1985-09-26 | 1987-04-04 | Furukawa Electric Co Ltd:The | High strength copper alloy having high electric conductivity |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833920A (en) * | 1996-02-20 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Copper alloy for electronic parts, lead-frame, semiconductor device and connector |
| KR100644510B1 (en) * | 2005-03-17 | 2006-11-10 | 한국기계연구원 | High strength lead-frame material Cu-Ni-Mn-Si-Sn-Ms alloy with good hot-workability and good anti-softening and it's manufacturing method |
| WO2009096546A1 (en) * | 2008-01-31 | 2009-08-06 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric/electronic component and method for manufacturing the copper alloy material |
| JP5144814B2 (en) * | 2009-08-10 | 2013-02-13 | 古河電気工業株式会社 | Copper alloy material for electrical and electronic parts |
| JP5400877B2 (en) * | 2009-12-02 | 2014-01-29 | 古河電気工業株式会社 | Copper alloy sheet and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356294B2 (en) | 1991-08-27 |
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| LAPS | Cancellation because of no payment of annual fees |